JP2003085501A - Non-contact ic tag - Google Patents
Non-contact ic tagInfo
- Publication number
- JP2003085501A JP2003085501A JP2001271249A JP2001271249A JP2003085501A JP 2003085501 A JP2003085501 A JP 2003085501A JP 2001271249 A JP2001271249 A JP 2001271249A JP 2001271249 A JP2001271249 A JP 2001271249A JP 2003085501 A JP2003085501 A JP 2003085501A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- contact
- tag
- antenna
- external device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、外部機器と非接触
で交信可能で、商品管理等に広く使用することができる
非接触ＩＣタグに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC tag which can communicate with an external device in a non-contact manner and can be widely used for product management and the like.
【０００２】[0002]
【従来の技術】従来より、個体の識別が可能な情報を保
持し、その情報を非接触で読み取ることができるＲＦＩ
Ｄ（Ｒａｄｉｏ Ｆｒｅｑｕｅｎｃｙ Ｉｄｅｎｔｉｆ
ｉｃａｔｉｏｎ）と呼ばれる非接触ＩＣタグが知られて
おり、商品管理などに広く用いられている。この非接触
ＩＣタグは、図５に示すように、アンテナコイル７１内
を非接触リーダライタからの磁束７２が通過すると、電
磁結合方式で交信して、識別情報の読み出しと電力供給
とを行う。2. Description of the Related Art Conventionally, RFI is capable of holding information capable of identifying an individual and reading the information in a contactless manner.
D (Radio Frequency Identity)
A non-contact IC tag called “ication” is known and is widely used for product management and the like. As shown in FIG. 5, when the magnetic flux 72 from the non-contact reader / writer passes through the antenna coil 71, the non-contact IC tag communicates by an electromagnetic coupling method to read identification information and supply power.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前述した従来
の非接触ＩＣタグは、金属面に貼付されると、磁束７２
がアンテナコイル７１内を通過することができないの
で、非接触リーダライタと交信することができない。However, when the above-mentioned conventional non-contact IC tag is attached to a metal surface, the magnetic flux 72
Cannot pass through the antenna coil 71, and therefore cannot communicate with the non-contact reader / writer.
【０００４】本発明の課題は、金属などの導電体に貼付
しても、外部機器（リーダライタ）と交信可能な非接触
ＩＣタグを提供することである。An object of the present invention is to provide a non-contact IC tag which can be communicated with an external device (reader / writer) even when attached to a conductor such as metal.
【０００５】[0005]
【課題を解決するための手段】本発明は、以下のような
解決手段により、前記課題を解決する。なお、理解を容
易にするために、本発明の実施形態に対応する符号を付
して説明するが、これに限定されるものではない。前記
課題を解決するために、請求項１の発明は、静電結合方
式によって、２つのアンテナ間に電位差を生じさせて、
外部機器と非接触で交信可能な非接触ＩＣタグであっ
て、導電体（４０）に貼付可能であって、その導電体
（４０）との導通を防止する絶縁層（１１）と、前記絶
縁層（１１）に形成された導電層（１２）と、ＩＣチッ
プ（１３Ｄ）を実装し、一部分を前記導電層（１２）に
形成し、他の部分を前記導電体（４０）に貼付するＩＣ
チップ実装部（１３）とを備え、前記導電層（１２）を
第１のアンテナとし、前記導電体（４０）を第２のアン
テナにすることを特徴とする非接触ＩＣタグである。The present invention solves the above-mentioned problems by the following means for solving the problems. It should be noted that, for ease of understanding, reference numerals corresponding to the embodiments of the present invention will be given and described, but the present invention is not limited thereto. In order to solve the above problems, the invention of claim 1 uses an electrostatic coupling method to generate a potential difference between two antennas,
A non-contact IC tag capable of communicating with an external device in a non-contact manner, the insulating layer (11) being capable of being attached to a conductor (40) and preventing conduction with the conductor (40); An IC in which a conductive layer (12) formed on the layer (11) and an IC chip (13D) are mounted, a part is formed on the conductive layer (12), and the other part is attached to the conductor (40).
A non-contact IC tag comprising a chip mounting part (13), wherein the conductive layer (12) serves as a first antenna and the conductor (40) serves as a second antenna.
【０００６】請求項２の発明は、請求項１に記載の非接
触ＩＣタグにおいて、前記導電層（１２）は、その大き
さが、外部機器のアンテナ（６０）の大きさよりも大き
いことを特徴とする非接触ＩＣタグである。According to a second aspect of the present invention, in the non-contact IC tag according to the first aspect, the conductive layer (12) is larger in size than the antenna (60) of the external device. This is a non-contact IC tag.
【０００７】請求項３の発明は、静電結合方式によっ
て、２つのアンテナ間に電位差を生じさせて、外部機器
と非接触で交信可能な非接触ＩＣタグであって、導電体
（４０）に貼付可能であって、その導電体（４０）との
導通を防止する絶縁層（１１）と、前記絶縁層（１１）
に形成された第１の導電層（１２）と、前記導電体（４
０）に貼付可能な第２の導電層（２２）と、ＩＣチップ
（１３Ｄ）を実装し、前記第１の導電層（１２）及び前
記第２の導電層（２２）に形成されるＩＣチップ実装部
（１３）とを備え、前記第１の導電層（１２）を第１の
アンテナとし、前記第２の導電層（２２）を第２のアン
テナにすることを特徴とする非接触ＩＣタグである。According to a third aspect of the present invention, there is provided a non-contact IC tag capable of communicating with an external device in a non-contact manner by causing a potential difference between the two antennas by an electrostatic coupling system, and the non-contact IC tag being attached to a conductor (40). An insulating layer (11) which can be attached and prevents conduction with the conductor (40), and the insulating layer (11)
The first conductive layer (12) formed on the
No. 0), the second conductive layer (22) that can be attached and the IC chip (13D) are mounted, and the IC chip is formed on the first conductive layer (12) and the second conductive layer (22). A non-contact IC tag comprising a mounting portion (13), wherein the first conductive layer (12) serves as a first antenna and the second conductive layer (22) serves as a second antenna. Is.
【０００８】請求項４の発明は、請求項３に記載の非接
触ＩＣタグにおいて、前記第１の導電層（１２）は、そ
の大きさが、外部機器のアンテナ（６０）の大きさより
も大きいことを特徴とする非接触ＩＣタグである。According to a fourth aspect of the present invention, in the contactless IC tag according to the third aspect, the size of the first conductive layer (12) is larger than the size of the antenna (60) of the external device. It is a non-contact IC tag characterized by the following.
【０００９】請求項５の発明は、請求項１から請求項４
までのいずれか１項に記載の非接触ＩＣタグにおいて、
前記絶縁層（１１）は、マグネットシートであることを
特徴とする非接触ＩＣタグである。The invention of claim 5 is from claim 1 to claim 4.
In the non-contact IC tag described in any one of 1 to
The insulating layer (11) is a non-contact IC tag, which is a magnet sheet.
【００１０】[0010]
【発明の実施の形態】以下、図面等を参照して、本発明
の実施の形態について、さらに詳しく説明する。
（第１実施形態）図１は、本発明による非接触ＩＣタグ
の第１実施形態を示す図であり、図１（Ａ）は斜視図、
図１（Ｂ）は断面図である。非接触ＩＣタグ１０は、絶
縁層１１と、導電層１２と、インターポーザ１３とを備
え、金属４０に貼付して使用する。非接触ＩＣタグ１０
は、交信方式（エアーインターフェース）が静電結合方
式（容量プレートを対向配置させ、静電誘導によって交
信する方式）のものであり、例えば、モトローラ社の
「ＢｉＳｔａｔｉｘ」（商標名）を使用することができ
る。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. (First Embodiment) FIG. 1 is a view showing a first embodiment of a non-contact IC tag according to the present invention. FIG. 1 (A) is a perspective view,
FIG. 1B is a cross-sectional view. The non-contact IC tag 10 includes an insulating layer 11, a conductive layer 12, and an interposer 13, and is used by being attached to a metal 40. Non-contact IC tag 10
Is a communication system (air interface) of an electrostatic coupling system (a system in which capacitance plates are arranged to face each other and communicates by electrostatic induction). For example, use of "BiStatix" (trademark) of Motorola. You can
【００１１】絶縁層１１は、金属４０と導電層１２との
導通を防止する層である。絶縁層１１は、例えば、マグ
ネットシートや紙などを好適に使用することができる。
マグネットシートとは、プラスチック樹脂にフェライト
粉末又は希土類系マグネット粉末等を練り込み、シート
状に成型したものであり、磁力の作用によって、鉄に貼
付することができる。したがって、被着体である金属が
鉄である場合に、特に、好適である。また、絶縁層１１
が紙製のときは、金属４０に貼付可能にするために、粘
着加工を施しておくとよい。The insulating layer 11 is a layer for preventing electrical conduction between the metal 40 and the conductive layer 12. For the insulating layer 11, for example, a magnet sheet or paper can be preferably used.
The magnet sheet is obtained by kneading ferrite powder or rare earth magnet powder or the like into a plastic resin and molding it into a sheet, which can be attached to iron by the action of magnetic force. Therefore, it is particularly suitable when the adherend metal is iron. In addition, the insulating layer 11
When the paper is made of paper, it is advisable to apply an adhesive to it so that it can be attached to the metal 40.
【００１２】導電層１２は、外部機器（ＩＣタグリーダ
ライタ）と交信するための第１のアンテナとして機能す
る部分である。なお、具体的な原理については、後述す
る。導電層１２は、絶縁層１１に形成されている。導電
層１２は、導電性インキで、オフセット印刷、グラビア
印刷、シルクスクリーン印刷等することで形成する。導
電性インキには、カーボン、黒鉛、銀粉もしくはアルミ
粉又はそれらの混合体をビヒクルに分散したインキを使
用する。導電層１２は、後述の通り、その一部が、イン
ターポーザ１３の導電部１３Ｂに接着されている。導電
層１２は、その形状について、特に、限定されないが、
後述の通り、ＩＣタグリーダライタのアンテナ６０より
も大きいことが望ましい。The conductive layer 12 is a portion that functions as a first antenna for communicating with an external device (IC tag reader / writer). The specific principle will be described later. The conductive layer 12 is formed on the insulating layer 11. The conductive layer 12 is formed of a conductive ink by offset printing, gravure printing, silk screen printing, or the like. An ink in which carbon, graphite, silver powder, aluminum powder or a mixture thereof is dispersed in a vehicle is used as the conductive ink. As described later, the conductive layer 12 is partially bonded to the conductive portion 13B of the interposer 13. The shape of the conductive layer 12 is not particularly limited, but
As described later, it is desirable that the antenna is larger than the antenna 60 of the IC tag reader / writer.
【００１３】インターポーザ１３は、インターポーザベ
ース１３Ａに、導電部１３Ｂ，１３Ｃを介してＩＣチッ
プ１３Ｄを実装しているＩＣ実装ラベルである。インタ
ーポーザ１３の下面には、異方導電性接着剤が塗布され
ており、被着体に貼付可能となっている。導電部１３Ｂ
は、導電層１２に接着されており、通電可能である。こ
れによって、導電層１２を前述のように第１のアンテナ
として機能させる。一方、導電部１３Ｃは、金属４０に
貼付されており、通電可能である。これによって、金属
４０を第２のアンテナとして機能させる。The interposer 13 is an IC mounting label in which an IC chip 13D is mounted on an interposer base 13A via conductive parts 13B and 13C. An anisotropic conductive adhesive is applied to the lower surface of the interposer 13 so that it can be attached to an adherend. Conductive part 13B
Is adhered to the conductive layer 12 and can be energized. This causes the conductive layer 12 to function as the first antenna as described above. On the other hand, the conductive portion 13C is attached to the metal 40 and can be energized. This causes the metal 40 to function as the second antenna.
【００１４】図２は、本発明による非接触ＩＣタグを被
着体に貼付して使用する場合の交信原理を説明する図で
ある。非接触ＩＣタグ１０は、上述の通り、静電結合方
式によりＩＣタグリーダライタと交信する。ここに、静
電結合方式とは、静電誘導作用を応用してタグとの通信
を行う方式である。FIG. 2 is a diagram for explaining the communication principle when the non-contact IC tag according to the present invention is attached to an adherend for use. As described above, the non-contact IC tag 10 communicates with the IC tag reader / writer by the electrostatic coupling method. Here, the electrostatic coupling method is a method of communicating with a tag by applying an electrostatic induction effect.
【００１５】（１）接地されている金属の表面（例え
ば、自動車のボディなど）に貼付する場合
図２（Ａ）に示すように、プラスの電荷を帯びたＩＣタ
グリーダライタのアンテナ６０を、導電層１２に接近さ
せる。すると、導電層１２には、静電誘導作用によっ
て、マイナスの電荷が誘導される。そして、導電層１２
（第１アンテナ部）と、金属面４０（第２アンテナ部）
との間に電位差が生じて電流が流れる。これによって、
ＩＣチップが作動し、ＩＣタグリーダライタと交信す
る。(1) When affixed to a grounded metal surface (for example, a car body) As shown in FIG. 2A, the antenna 60 of the IC tag reader / writer having a positive charge is electrically conductive. Approach layer 12. Then, a negative charge is induced in the conductive layer 12 by the electrostatic induction effect. Then, the conductive layer 12
(1st antenna part) and metal surface 40 (2nd antenna part)
A potential difference is generated between the current and the current flowing. by this,
The IC chip operates and communicates with the IC tag reader / writer.
【００１６】（２）接地されていない金属製品（例え
ば、その製品が、プラスチック製の棚に載置されている
場合など）に貼付する場合
この場合は、図２（Ｂ）に示すように、プラスの電荷を
帯びたＩＣタグリーダライタのアンテナ６０を、金属面
４０に接近させる。すると、金属面４０には、静電誘導
作用によって、マイナスの電荷が誘導される。人が、導
電層１２に触ると、その導電層１２が接地され、導電層
１２（第１アンテナ部）と、金属面４０（第２アンテナ
部）との間に電位差が生じて電流が流れる。これによっ
て、ＩＣチップが作動し、ＩＣタグリーダライタと交信
する。(2) When affixed to a metal product which is not grounded (for example, when the product is placed on a plastic shelf) In this case, as shown in FIG. 2 (B), The antenna 60 of the IC tag reader / writer having a positive charge is brought close to the metal surface 40. Then, a negative charge is induced on the metal surface 40 by the electrostatic induction effect. When a person touches the conductive layer 12, the conductive layer 12 is grounded, a potential difference is generated between the conductive layer 12 (first antenna portion) and the metal surface 40 (second antenna portion), and current flows. This activates the IC chip to communicate with the IC tag reader / writer.
【００１７】図３は、導電層とリーダライタのアンテナ
との大きさの関係を示す図である。アンテナ６０を導電
層１２に接近させるときは（図２（Ａ）参照）、図３
（Ａ）に示す通り、導電層１２が、ＩＣタグリーダライ
タのアンテナ６０よりも大きいことが望ましい。アンテ
ナ６０が、導電層１２からハミ出すと、そのハミ出した
部分と金属４０との結合がよいことから、導電層１２と
アンテナ６０との間で静電誘導作用が生じず、交信でき
なくなるおそれがあるからである。なお、アンテナ６０
を金属面４０に接近させるときは（図２（Ｂ）参照）、
図３（Ｂ）のように、アンテナ６０が、導電層１２に、
かかっていてもよい。導電層１２よりも金属４０の方
が、結合がよいので、影響が少ないからである。FIG. 3 is a diagram showing a size relationship between the conductive layer and the antenna of the reader / writer. When the antenna 60 is brought close to the conductive layer 12 (see FIG. 2A),
As shown in (A), the conductive layer 12 is preferably larger than the antenna 60 of the IC tag reader / writer. When the antenna 60 is extruded from the conductive layer 12, since the extruded portion and the metal 40 are well coupled to each other, the electrostatic induction action does not occur between the conductive layer 12 and the antenna 60, and communication may not be possible. Because there is. The antenna 60
When approaching the metal surface 40 (see FIG. 2B),
As shown in FIG. 3B, the antenna 60 is formed on the conductive layer 12.
It may depend. This is because the metal 40 has better bonding than the conductive layer 12 and thus has less influence.
【００１８】本実施形態によれば、静電結合方式によっ
て、金属等の導電体に貼付しても、外部機器と交信可能
である。また、金属面に貼付し、その金属面をアンテナ
として機能させるので、導電層の形成面積が少なくて済
む。このため、製造コストが安価である。さらに、金属
面は、広いので、アンテナ面積が大きくなる。これによ
って、交信距離を長くすることができる。さらにまた、
絶縁層１１にマグネットシートを使用すれば、自動車や
ボンベ等の鉄の表面に簡単に貼付することができる。According to this embodiment, it is possible to communicate with an external device even if it is attached to a conductor such as metal by the electrostatic coupling method. In addition, since it is attached to a metal surface and the metal surface is made to function as an antenna, the formation area of the conductive layer can be reduced. Therefore, the manufacturing cost is low. In addition, the metal surface is large, which increases the antenna area. As a result, the communication distance can be increased. Furthermore,
If a magnetic sheet is used for the insulating layer 11, it can be easily attached to the surface of iron such as automobiles and cylinders.
【００１９】（第２実施形態）図４は、本発明による非
接触ＩＣタグの第２実施形態を示す図であり、図４
（Ａ）は斜視図、図１（Ｂ）は断面図である。なお、前
述した第１実施形態と同様の機能を果たす部分には、同
一の符号を付して、重複する説明を適宜省略する。本実
施形態の非接触ＩＣタグ１０は、第２導電層２２を有し
ている。この第２導電層２２は、前述の導電層１２と同
様の印刷によって形成することができる。この第２導電
層２２には、インターポーザ１３の導電部１３Ｃに接着
されており、この第２導電層２２が、第２のアンテナと
して機能する。なお、第２導電層２２の下面には、絶縁
層は、設けられていない。したがって、金属面に貼付す
れば、その金属と導通し、金属面全体が大きなアンテナ
として機能する。一方、紙やプラスチックのような絶縁
体に貼付しても、第２導電層２２がアンテナとして機能
するので、外部機器と交信可能である。(Second Embodiment) FIG. 4 is a view showing a second embodiment of the non-contact IC tag according to the present invention.
1A is a perspective view, and FIG. 1B is a sectional view. It should be noted that parts that perform the same functions as those in the above-described first embodiment will be assigned the same reference numerals and redundant description will be omitted as appropriate. The non-contact IC tag 10 of the present embodiment has the second conductive layer 22. The second conductive layer 22 can be formed by the same printing as the conductive layer 12 described above. The second conductive layer 22 is adhered to the conductive portion 13C of the interposer 13, and the second conductive layer 22 functions as a second antenna. An insulating layer is not provided on the lower surface of the second conductive layer 22. Therefore, if it is attached to a metal surface, it conducts with the metal and the entire metal surface functions as a large antenna. On the other hand, even if it is attached to an insulator such as paper or plastic, the second conductive layer 22 functions as an antenna, and thus it is possible to communicate with an external device.
【００２０】本実施形態によれば、第２導電層２２を備
えるので、被着体が、導電体であっても、絶縁体であっ
ても、外部機器と交信することができる。また、第２導
電層２２の下面には絶縁層が設けられていないので、金
属等の導電体に貼付すれば、その金属面全体をアンテナ
として使用できる。したがって、アンテナ面積が広く、
交信距離が長い。According to this embodiment, since the second conductive layer 22 is provided, it is possible to communicate with an external device regardless of whether the adherend is a conductor or an insulator. Further, since the lower surface of the second conductive layer 22 is not provided with an insulating layer, if it is attached to a conductor such as metal, the entire metal surface can be used as an antenna. Therefore, the antenna area is large,
The communication distance is long.
【００２１】（変形形態）以上説明した実施形態に限定
されることなく、種々の変形や変更が可能であって、そ
れらも本発明の均等の範囲内である。例えば、第１実施
形態において、金属に貼付する場合を例に挙げて説明し
たが、金属に限られず、導電体であれば、同様に使用す
ることができる。また、導電層１２，２２の形状は、任
意である。(Modifications) The present invention is not limited to the above-described embodiments, and various modifications and changes can be made, which are also within the scope of the present invention. For example, in the first embodiment, the case of attaching to a metal has been described as an example, but the present invention is not limited to a metal, and any conductor may be used as well. The shapes of the conductive layers 12 and 22 are arbitrary.
【００２２】[0022]
【発明の効果】以上詳しく説明したように、請求項１の
発明によれば、導電体を第２のアンテナにするので、製
造コストが安価である。As described in detail above, according to the first aspect of the invention, since the conductor is the second antenna, the manufacturing cost is low.
【００２３】請求項２の発明によれば、導電層は、その
大きさが、外部機器のアンテナの大きさよりも大きいの
で、確実に、交信させることができる。According to the second aspect of the invention, since the size of the conductive layer is larger than the size of the antenna of the external device, reliable communication can be achieved.
【００２４】請求項３の発明によれば、導電体に貼付可
能な第２の導電層を備えるので、被着体が、導電体であ
っても、絶縁体であっても、使用することができる。According to the invention of claim 3, since the second conductive layer which can be attached to the conductor is provided, the adherend can be used regardless of whether it is a conductor or an insulator. it can.
【００２５】請求項４の発明によれば、第１の導電層
は、その大きさが、外部機器のアンテナの大きさよりも
大きいので、確実に、交信させることができる。According to the invention of claim 4, since the size of the first conductive layer is larger than the size of the antenna of the external device, it is possible to surely communicate.
【００２６】請求項５の発明によれば、絶縁層がマグネ
ットシートであるので、自動車やボンベ等の鉄の表面に
簡単に貼付することができる。According to the invention of claim 5, since the insulating layer is a magnet sheet, it can be easily attached to the surface of iron such as automobiles and cylinders.
【図１】本発明による非接触ＩＣタグの第１実施形態を
示す図である。FIG. 1 is a diagram showing a first embodiment of a non-contact IC tag according to the present invention.
【図２】本発明による非接触ＩＣタグを被着体に貼付し
て使用する場合の交信原理を説明する図である。FIG. 2 is a diagram illustrating a communication principle when the non-contact IC tag according to the present invention is used by being attached to an adherend.
【図３】導電層とリーダライタのアンテナとの大きさの
関係を示す図である。FIG. 3 is a diagram showing a size relationship between a conductive layer and an antenna of a reader / writer.
【図４】本発明による非接触ＩＣタグの第２実施形態を
示す図である。FIG. 4 is a diagram showing a second embodiment of a non-contact IC tag according to the present invention.
【図５】従来の非接触ＩＣタグの課題を説明する図であ
る。FIG. 5 is a diagram illustrating a problem of a conventional non-contact IC tag.
１０ 非接触ＩＣタグ １１ 絶縁層 １２ 導電層 １３ インターポーザ １３Ａ インターポーザベース １３Ｂ，１３Ｃ 導電部 １３Ｄ ＩＣチップ ２２ 第２導電層 ４０ 金属 ６０ 外部機器のアンテナ 10 Non-contact IC tag 11 insulating layer 12 Conductive layer 13 Interposer 13A interposer base 13B, 13C conductive part 13D IC chip 22 Second conductive layer 40 metal 60 External device antenna
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2C005 MA31 NA10 5B035 BA03 BB09 CA01 CA23 5J046 AA04 AA09 AA19 AB13 PA07 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 2C005 MA31 NA10 5B035 BA03 BB09 CA01 CA23 5J046 AA04 AA09 AA19 AB13 PA07
Claims (5)
間に電位差を生じさせて、外部機器と非接触で交信可能
な非接触ＩＣタグであって、 導電体に貼付可能であって、その導電体との導通を防止
する絶縁層と、 前記絶縁層に形成された導電層と、 ＩＣチップを実装し、一部分を前記導電層に形成し、他
の部分を前記導電体に貼付するＩＣチップ実装部とを備
え、 前記導電層を第１のアンテナとし、 前記導電体を第２のアンテナにすることを特徴とする非
接触ＩＣタグ。1. A non-contact IC tag capable of communicating with an external device in a non-contact manner by causing a potential difference between two antennas by an electrostatic coupling method, the non-contact IC tag being attachable to an electric conductor, An insulating layer for preventing conduction to the body, a conductive layer formed on the insulating layer, an IC chip is mounted, a part of the conductive layer is formed on the conductive layer, and the other part is attached to the conductive body. A non-contact IC tag, wherein the conductive layer serves as a first antenna and the conductor serves as a second antenna.
て、 前記導電層は、その大きさが、外部機器のアンテナの大
きさよりも大きいことを特徴とする非接触ＩＣタグ。2. The non-contact IC tag according to claim 1, wherein the conductive layer has a size larger than that of an antenna of an external device.
間に電位差を生じさせて、外部機器と非接触で交信可能
な非接触ＩＣタグであって、 導電体に貼付可能であって、その導電体との導通を防止
する絶縁層と、 前記絶縁層に形成された第１の導電層と、 前記導電体に貼付可能な第２の導電層と、 ＩＣチップを実装し、前記第１の導電層及び前記第２の
導電層に形成されるＩＣチップ実装部とを備え、 前記第１の導電層を第１のアンテナとし、 前記第２の導電層を第２のアンテナにすることを特徴と
する非接触ＩＣタグ。3. A non-contact IC tag capable of communicating with an external device in a non-contact manner by causing a potential difference between two antennas by an electrostatic coupling method, the non-contact IC tag being attachable to an electric conductor, An insulating layer for preventing electrical continuity with the body; a first conductive layer formed on the insulating layer; a second conductive layer attachable to the conductor; an IC chip mounted on the first conductive layer; A layer and an IC chip mounting portion formed on the second conductive layer, wherein the first conductive layer serves as a first antenna and the second conductive layer serves as a second antenna. Non-contact IC tag that does.
て、 前記第１の導電層は、その大きさが、外部機器のアンテ
ナの大きさよりも大きいことを特徴とする非接触ＩＣタ
グ。4. The contactless IC tag according to claim 3, wherein the size of the first conductive layer is larger than the size of the antenna of the external device.
項に記載の非接触ＩＣタグにおいて、 前記絶縁層は、マグネットシートであることを特徴とす
る非接触ＩＣタグ。5. Any one of claims 1 to 4
The non-contact IC tag according to the item 1, wherein the insulating layer is a magnet sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001271249A JP4747467B2 (en) | 2001-09-07 | 2001-09-07 | Non-contact IC tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001271249A JP4747467B2 (en) | 2001-09-07 | 2001-09-07 | Non-contact IC tag |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003085501A true JP2003085501A (en) | 2003-03-20 |
| JP4747467B2 JP4747467B2 (en) | 2011-08-17 |
Family
ID=19096779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001271249A Expired - Fee Related JP4747467B2 (en) | 2001-09-07 | 2001-09-07 | Non-contact IC tag |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4747467B2 (en) |
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