JP2003045219A - Mercury lamp, illumination device and exposure device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the installation work of the lamp safe and operate the device stably without breaking the lamp at lamp replacement and lighting, by restricting the installation direction of the lamp so that the conduction wire may not give an unnecessary force on the mercury by lamp. SOLUTION: In the mercury lamp device, the mercury lamp 1 comprises conduction wire 20 that comes from one of the base 16 and has a fixing means for fixing the direction of the wire 20 in a prescribed direction to the lamp fitting hand 3, and the concentric protrusion 18 of the other base 17 is engaged in the receiving hole 22 of the lamp fitting hand 3. The above fixing means makes prescribed positioning by engagement of one of the positioning pin 2 by which the base 17 and the lamp fitting hand 3 are mutually engaged, and the groove 23 of the other side that receives this pin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mercury lamp, an illuminator equipped with the mercury lamp and used in a semiconductor exposure apparatus, and an exposure apparatus which can use the same.

[0002]

2. Description of the Related Art Conventionally, a mercury lamp has been attached regardless of the direction of a conducting wire. for that reason,
It was feared that the lamp would be damaged by pulling on it.

[0003]

In the above-mentioned conventional example, the conducting wire may apply a pulling force to the mercury lamp, which may damage the mercury lamp. Further, the pressure inside the bulb of a conventional mercury lamp is about the same as the atmospheric pressure, and even if a force is applied to the mercury lamp to break it, the fragments are not scattered far and the probability of affecting the device is relatively low. However, in recent years, the pressure inside the bulb of the mercury lamp has become higher than atmospheric pressure due to high illuminance, and there is a high probability that the apparatus will be seriously affected when the mercury lamp is damaged.

It is an object of the present invention to provide a lighting device which does not apply unnecessary power to a mercury lamp, thereby restraining the mounting direction of the lamp so that the wire does not apply unnecessary power to the lamp. This is to ensure that the mercury lamp can be installed safely and the device can be operated stably so that the lamp will not be damaged during replacement and during lighting.

[0005]

In order to achieve the above object, a mercury lamp according to the present invention is provided with a conducting wire extending from a base so that the direction of the wire is a predetermined direction with respect to a lamp mounting member. It has a direction fixing means for determining and fixing the direction. It is desirable that the direction fixing means determines a predetermined direction by a fitting relationship between one of the projecting portions where the base and the lamp mounting member engage with each other and the other receiving portion that receives the projecting portion. A predetermined direction may be determined by mutually opposing flat surfaces provided on the base and the lamp mounting member, and the positions of alignment marks provided on the base and the lamp mounting member may be aligned with each other. Alternatively, the predetermined direction may be determined.

The illumination device according to the present invention may be characterized by including any one of the mercury lamps described above, and the mounting direction of the mercury lamp is determined only by fixing the mercury lamp, which is the light source, to the mounting member. It may be a feature. As the direction fixing means, it is preferable to have a means for fixing the mercury lamp mounting side cap and the lamp mounting member with a pin and a notch on the other side for rotational restraint, and aligning and fixing to the lamp mounting member.

In the above arrangement, the direction fixing means for fixing the mercury lamp so that the mercury lamp is mounted in a fixed direction prevents unnecessary mercury from being applied to the mercury lamp, and thus has the effect of eliminating accidental damage to the lamp.

Further, the present invention includes the steps of installing a manufacturing apparatus group for various processes including the exposure apparatus in a semiconductor manufacturing factory, and a step of manufacturing a semiconductor device by a plurality of processes using the manufacturing apparatus group. It can also be applied to a semiconductor device manufacturing method of the present invention. The method further includes the steps of connecting the manufacturing apparatus group with a local area network, and performing data communication between the local area network and an external network outside the semiconductor manufacturing factory for information regarding at least one of the manufacturing apparatus group. It is desirable to have. A database provided by a vendor or a user of the exposure apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or between the semiconductor manufacturing factory and a semiconductor manufacturing factory different from the semiconductor manufacturing factory. It is preferable to perform production management by data communication via an external network.

Further, according to the present invention, manufacturing apparatus groups for various processes including the exposure apparatus, a local area network connecting the manufacturing apparatus groups, and an external network outside the factory can be accessed from the local area network. The present invention is also applied to a semiconductor manufacturing factory having a gateway and capable of performing data communication of information regarding at least one of the manufacturing apparatus group.

Further, the present invention is a method of maintaining an exposure apparatus according to claim 8, which is installed in a semiconductor manufacturing factory, wherein a vendor or a user of the exposure apparatus is connected to an external network of the semiconductor manufacturing factory. A step of providing a maintenance database; a step of permitting access to the maintenance database from within the semiconductor manufacturing factory via the external network; and a step of manufacturing maintenance information accumulated in the maintenance database via the external network. It may be characterized by having a step of transmitting to the factory side.

The present invention also provides the above-mentioned exposure apparatus,
It may be characterized in that it further has a display, a network interface, and a computer that executes software for the network, and enables data communication of maintenance information of the exposure apparatus via a computer network. The network software is connected to an external network of a factory in which the exposure apparatus is installed and provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus. It is preferable to be able to obtain information from the database via.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 is a schematic perspective view of an essential part of a lighting device according to a first embodiment of the present invention. In the figure, 1 is a mercury lamp having a high-luminance light emitting portion. Reference numeral 2 is a positioning pin formed on the base portion 16 of the mercury lamp 1, 3 is a lamp mounting hand as a mounting member for fixing the mercury lamp 1, and 4 is a lamp mounting screw screwed into a screw hole provided in the lamp mounting hand 3. Is.

The mercury lamp 1 has a substantially spherical light emitting portion 15.
And the base parts 16, 1 attached to both ends on the common axis
7 is provided with a conducting wire 20 extending from one of the mouthpiece portions 16, and a concentric convex portion 18 having a circular cross section is provided at the tip of the other mouthpiece portion 17 in a protruding manner. Other base part 1
7 has a positioning pin 2 projecting in the same direction as the concentric convex portion 18 and located at an eccentric position.

The lamp mounting hand 3 has, as a receiving portion, a circular receiving hole 22 into which the concentric convex portion 18 of the mercury lamp 1 is fitted, and a receiving groove portion 23 following the receiving hole 22. The receiving hole 22 is located in the center of the lamp mounting hand 3 in the width direction and near the tip. The receiving groove 23 extends straight to the tip of the lamp mounting hand 3, and the positioning pin 2 of the base 17 is inserted therein.

When the mercury lamp 1 is fixed to the lamp mounting hand 3, the concentric convex portion 18 is received in the receiving hole 22,
The positioning pin 2 cannot be mounted unless it is fitted into the receiving groove 23 of the lamp mounting hand 3. Therefore, when the mercury lamp 1 is mounted on the lamp mounting hand 3, the lamp 1 is automatically oriented in a fixed direction. When the lamp 1 is fixed in a fixed direction in this manner, the mercury lamp 1 is fixed to the lamp mounting hand 3 by rotating the lamp mounting screw 4 to reduce the diameter of the receiving hole 22 and the width of the receiving groove 23. Done by.

(Second Embodiment) FIG. 2 is a schematic perspective view of a main part of an illumination device according to a second embodiment of the present invention. 1 in the figure
Is a mercury lamp having a high-luminance light emitting portion 15.
Reference numeral 5 denotes a notch portion having a flat surface provided on the side surface of the base portion 17 of the mercury lamp 1, 6 a lamp mounting hand as a mounting member for fixing the mercury lamp 1, and 7 a concentric convex portion 18 of the base portion 17. It is a nut as a lamp mounting screw that is screwed into the male screw provided on the.

When the mercury lamp 1 is fixed to the lamp mounting hand 6, the flat surface of the notch portion 5 of the cap portion 17 faces the guide portion 26 having the flat lateral surface of the lamp mounting hand 6 substantially in parallel. It is a mechanism that you can not install unless you let it match. Therefore, in this embodiment, when the mercury lamp 1 is mounted on the lamp mounting hand 6, the lamp orientation is automatically determined to be a fixed direction. In this state where the lamp 1 is oriented in a fixed direction, the mercury lamp 1 is fixed to the lamp mounting hand 3 by turning and tightening the lamp mounting screw 7 screwed onto the male screw of the concentric convex portion 18.

(Third Embodiment) FIG. 3 is a schematic perspective view of a main part of an illumination device according to a third embodiment of the present invention. 1 in the figure
Is a mercury lamp having a high-luminance light emitting portion 15.
Reference numeral 8 is a key provided on the convex portion 18 of the base 17 of the mercury lamp 1, 9 is a key groove forming a receiving portion provided on the lamp mounting hand 3 as a mounting member for fixing the mercury lamp 1, and 4 is a lamp. It is a mounting screw.

When the mercury lamp 1 is fixed to the lamp mounting hand 3, the key 8 of the base 17 must be aligned with the key groove 9 of the lamp mounting hand 3 for attachment. Therefore, when the mercury lamp 1 is attached to the lamp attaching hand 3, the direction of the lamp is automatically determined to be a fixed direction. The mercury lamp 1 is fixed to the lamp mounting hand 3 by turning the lamp mounting screw 4 as in the first embodiment.

(Fourth Embodiment) FIG. 4 is a schematic perspective view of a main part of an illuminating device according to a fourth embodiment of the present invention. In the figure, reference numeral 1 denotes a mercury lamp having a high-luminance light emitting portion 15. Reference numeral 10 is a notch portion as a receiving portion provided in a groove shape by notching the base portion 17 of the mercury lamp 1 over the end surface and the side surface thereof. Reference numeral 11 is a pin provided on the lamp mounting hand 3 as a mounting member for fixing the mercury lamp 1 so as to project therefrom, and 4 is a lamp mounting screw.

When the mercury lamp 1 is fixed to the lamp mounting hand 3, the notch portion 10 of the base portion 17 must be aligned with the pin 11 of the lamp mounting hand 3 so that the mercury lamp 1 cannot be mounted. Therefore, when the mercury lamp 1 is mounted on the lamp mounting hand 3, the direction of the lamp 1 is automatically determined to be a fixed direction. The mercury lamp 1 is fixed to the lamp mounting hand 3 as in the first embodiment.
This is done by turning the lamp mounting screw 4.

(Fifth Embodiment) FIG. 5 is a schematic perspective view of an essential part of an illumination device according to a fifth embodiment of the present invention. In the figure, reference numeral 1 denotes a mercury lamp having a high-luminance light emitting portion 15. Reference numeral 12 is a positioning mark (eg marking line) provided on the base 17 of the mercury lamp 1, 13 is a positioning mark provided on the lamp mounting hand 3 for fixing the mercury lamp 1, and 4 is a lamp mounting screw. .

When the mercury lamp 1 is fixed to the lamp mounting hand 3, the positioning mark 12 of the base 17 is mounted on the mounting hand 3.
Adjust to 3. Alignment marks 12 and 13
The direction of the lamp 1 is determined to be the optimum direction by matching.
The mercury lamp 1 is fixed to the lamp mounting hand 3 by turning the lamp mounting screw 4 as in the first embodiment.

(Sixth Embodiment) FIG. 6 is an elevational view showing the overall structure of a semiconductor exposure apparatus according to the sixth embodiment of the present invention. This semiconductor exposure apparatus is a projection exposure apparatus that projects and exposes a pattern on a reticle 31 as an original onto a wafer 32 as a photosensitive substrate via an optical means such as a lens.

In the figure, 1 is a mercury lamp which is a light source, 31 is a reticle which is a first object having a circuit pattern which is exposed and transferred to form a semiconductor element, and 32 is a reticle 3.
A wafer which is a second object on which the circuit pattern 1 is transferred by exposure, 33 is a projection lens which projects the pattern of the reticle 31 onto the wafer 32 at a predetermined reduction magnification, and 35 is the mercury lamp 1.
An illumination optical system for converting the light from the light into a light flux having a uniform illuminance and a predetermined size, 36 is a wafer stage for positioning the wafer 32 with high accuracy, 37 is a reticle library for storing several kinds of reticles 31, and 38 is a reticle. A reticle stage for holding and positioning the reticle 31 when the pattern 31 is transferred onto the wafer 32 by exposure, and 39 is taken out from a desired reticle library 37 and supplied onto the reticle stage 38. Further, it is unnecessary on the reticle stage 38. It is a reticle transport system that is stored in the reticle library 37. Reference numeral 40 denotes a wafer cassette for storing a plurality of wafers 32, 41 denotes an unexposed wafer 32 taken out from the wafer cassette 40 and supplied onto the wafer stage 36, and conversely, an exposed wafer 32 is collected from the wafer stage 36. It is a wafer transfer system which is housed in the wafer cassette 40. 42 is an alignment scope for measuring the positional deviation between the reticle 31 and the wafer 32, 43 is a vibration isolation device, 44
Is an accelerometer for seismic detection, 45 is a control operation unit for operating and controlling the exposure apparatus, and 46 is a display for display which constitutes a part of the control operation unit 45.

Next, in this structure, when an earthquake having a relatively large shaking with a seismic intensity of about 2 to 4 occurs during the operation of the exposure apparatus, the exposure apparatus does not make a defective product,
The function of preventing the device itself from being damaged and restarting the operation of the device early will be sequentially described.

First, the production prevention of defective products will be described.
What is most likely to be affected by the earthquake vibration is
It is a positional relationship between the main body and a separate placement part that is a part of the main body but is separately placed on the floor. In the case of the present embodiment, the main body means the entire portion mounted and supported on the mount (anti-vibration device) 43. On the other hand, the separate part is
Here, the lamp house 51, the wafer cassette 40, and the wafer transfer system 41. That is, it is a portion that is not placed on the mount 43 but is placed on the floor by itself. Since the vibration of the main body is absorbed by the vibration damping mechanism of the mount 43, the main body is unlikely to be damaged or destroyed due to displacement or shock due to external vibration caused by the earthquake. Further, the mass of the device itself is as large as 2 to 3 ton, and thus the displacement due to the shaking of the earthquake is slight.

However, the separate part does not displace from the main body in a normal use condition, that is, in a floor vibration condition shown in the installation standard of the apparatus, but its vibration isolation mechanism is similar to that of the main body. However, if vibration exceeding normal use is applied due to a medium-scale earthquake, the positional relationship between the main unit and the separate placement unit is not always guaranteed. The installation standard guarantees up to about 1 gal at 2 Hz, for example, but an earthquake of seismic intensity 4 may apply acceleration of about 80 gal.
In this embodiment, the lamp house 51, which is a separate part,
In other cases, the wafer cassette 40 and the wafer transfer system 41 are not necessarily separated from the main body. However, for example, in the lamp house 51, in consideration of safety, in order to make the temperature constant and to create an environment without dust, in order to effectively use the space of a room (clean room) that requires a large amount of maintenance cost, In many cases, it is installed separately from the main body. Nevertheless, in order to meet the recent demand for miniaturization of circuit patterns, it is required to more strictly manage the positional relationship between the lamp house 51 and the illumination optical system 35 on the main body. For example, in the illumination by the light emitted from the illumination optical system 35, the illuminance difference at each position is required to be ± 1 to 2% in the effective range, and in order to realize it, it is placed separately from the main body. The positional deviation of the parts is about 0.5 mm or less.

However, it is not appropriate to provide a dedicated anti-vibration mechanism only for an earthquake that rarely occurs, or to increase the rigidity by increasing the size, which leads to an increase in cost. Therefore,
Accelerometer 44 for detecting earthquakes on the device body or separately installed part
When an acceleration greater than a value determined by referring to the installation environment of the separate part is detected, the operation of the apparatus is temporarily stopped and the exposure apparatus produces an abnormal chip to improve productivity. It prevents the decline. Then, the operation of the device is not restarted until the check of each inspection item, that is, the check of the positional deviation between the lamp house 51 and the main body portion is completed here. Again, an ideal device is one that does not distort the positional relationship between the device body and the separate part, no matter how big an earthquake, but there are only a few earthquakes that cause such a large shaking that the position is distorted. If the device structure is adapted to the above situation, it leads to an increase in size and cost of the device. Therefore, in the present invention, in the event of an earthquake accompanied by a large shaking that cannot be ignored but is not frequent, production of defective products is prevented by temporarily stopping it, but by shortening the time until recovery (described later), it is cheaper. It is possible to take measures against earthquakes in various ways.

Conventionally, the lamp house 51, which is a place for accommodating the lamp, is integrated with the illumination optical system 35, and is not separately placed. However, as the performance of the exposure apparatus is required to be improved, the influence of the heat from the lamp house 51 emitted from the mercury lamp 1 on the temperature environment of the exposure apparatus cannot be ignored, and the lamp house 51 is separately installed as in the present embodiment. The case is coming out.

As an example of a separate part other than the light source, a wafer cassette 40 and a wafer transfer system 41 are shown in FIG. In this case as well, the wafer transfer system 41 and the like are not necessarily separately installed. However, if the wafer transfer system 41 is installed separately, the wafer transfer may be stopped due to the position shift of the wafer transfer system 41. Although this does not lead to the production of defective chips, it is a serious problem that directly affects the productivity of the device. Therefore, when there is an earthquake, it is desirable to check whether there is any problem as well as performance problems. Even when the wafer cassette 40 is formed in the main body, the automatic carrier robot often carries the wafer carrier along with the automation of the production line in recent years. The same applies to the positional relationship.

Another cause of the possibility of manufacturing defective products is the deterioration of the alignment accuracy between the reticle 31 and the wafer 32. In the apparatus of FIG. 6, the wafer 32 is positioned by confirming the position of the wafer 32 by the alignment scope 42 and sending it to a predetermined position by the wafer stage 36. On the other hand, the reticle 31 is similarly operated by the reticle stage 38 and an alignment scope (not shown). By the way, with recent miniaturization of semiconductor elements, positioning at the level of 0.1 μm is required. On the other hand, mount 4 which is an anti-vibration device
3 shows that in the case of an earthquake with a seismic intensity of 4 or 2 Hz, 4
A shake of about mm may remain. These values are obviously not negligible, so when an earthquake is detected, positioning and exposure are immediately stopped and the machine is in a standby state.

The location where the accelerometer 44 is attached is preferably below the mount 43 of the main body where the vibration of the floor is directly transmitted, or a separate place.

Next, a method for preventing damage to the apparatus itself will be described. The most conceivable possibility that the shaking due to an earthquake damages the device itself is that the transported article falls and the fragments cause trouble to the device. In the case of the apparatus shown in FIG. 6, when exposing, the wafer 32 is transferred from the wafer cassette 40 containing the wafer 32 before being exposed by the exposure apparatus.
The wafer stage 36 for positioning the wafer 32 with high accuracy after the wafer 32 is taken out by the hand of the wafer transfer system 41 and is roughly positioned by a positioning mechanism (not shown).
Pass to. The position of the wafer 32 transferred onto the wafer stage 36 is confirmed by the alignment scope 42, and then the wafer 32 is carried to a predetermined position for exposure. After that, the wafer is again stored in the wafer cassette 40 by the wafer transfer system 41.

Here, the wafer 32 is usually sucked by the vacuum suction method via the vacuum suction groove and held by the hand. When passing the wafer 32 from the hand to the wafer stage 36 or when passing the wafer 32 from hand to hand,
After the vacuum suction of the hand on the receiving side is confirmed, the vacuum suction of the hand on the passing side is released. As long as this vacuum suction works normally, the hand does not drop the wafer 32. However, performing such transfer in the shaking due to the earthquake obviously increases the risk of dropping the wafer 32. The possibility that the wafer 32 will fall under such conditions is certainly low, but in consideration of the time and cost required for repairing when the wafer 32 falls onto the wafer stage 36, which is a high precision product, the wafer 32 is likely to fall. Fall is an item that must be avoided. Therefore, when the seismic detection accelerometer 44 detects an acceleration equal to or more than the set amount, the delivery of the wafer 32 is immediately stopped and the wafer 32 is held until it is held more reliably.

The same applies to the reticle 31. The movement of the reticle 31 is almost the same as that of the wafer 32, and the reticle library 3 containing a plurality of reticles is stored.
The reticle transport system 39 takes out a predetermined reticle 31 from the device 7, and supplies the reticle 31 to the reticle stage 38 that holds and positions the reticle 31. Reticle stage 3
The reticle 31 supplied to the laser 8 is positioned and then exposed by the illumination optical system 35. After the exposure is completed, the reticle 31 on the reticle stage 38 is moved again to the reticle transport system 39.
Are stored in the reticle library 37. The holding method of the reticle 31 is also performed almost in the same manner as in the case of the wafer 32 by the hand of the reticle transport system 39 sucking the back surface of the reticle 31. However, reticle library 3
7 is stored in a case (not shown) that can store the entire reticle to prevent dust from adhering to the reticle 31. The risk of dropping the reticle 31 during transportation is high because the wafer 32 is
As in the case of (1), it is the time of handing over from hand to hand or from hand to reticle stage 38. The possibility of the reticle falling is not so high as in the case of the wafer 32, but the damage to the reticle stage 38 and the like due to the reticle falling is as great as in the case of the wafer 32, and therefore the possibility of the reticle falling due to an earthquake is high. If there is even a small amount, immediately stop the transportation and delivery of the reticle and wait in a safe state.

As described above, if the accelerometer 44 detects an earthquake in order to minimize damage to the high precision products such as the wafer stage 36 and the reticle stage 38 due to the drop damage of the conveyed objects such as the reticle 31 and the wafer 32, , Immediately stop delivery and transfer of dangerous goods, and enter the standby state.

Next, the prevention of damage to the movable part will be described. The case of the wafer stage 36 that requires the highest accuracy among the movable parts will be described. Wafer stage 36
Is basically a high-precision stage having an XYZ three-axis structure, and the position in the XY directions is controlled with high precision by a laser interferometer. The control by the laser interferometer has followability up to a vibration of about 10 Hz, and assuming that a general earthquake is about 2 Hz, the wafer stage 36 stops immediately after detecting an earthquake and activates position control. It's good to stay there. By doing so, it is possible to prevent the wafer stage 36 from being hit and moved by the vibration force due to an earthquake and colliding and being damaged at the end portions. Wafer stage 36
Is a high-precision air levitation stage, and if the position control by the laser interferometer becomes impossible, the air should be kept as it is and stand by. This is because air acts as a buffer. In the Z direction, the drive mechanism often uses a piezo (piezoelectric element) or a gear train, and the structure is relatively strong against external vibration, and the stroke in the Z direction is small. You don't have to call.

Finally, the operation for restarting the early operation will be described. As mentioned above, when an earthquake occurs, the operation of the equipment is stopped to prevent the production of defective products, and the equipment is stopped until the check of predetermined inspection items is completed, so how quickly can the operation be restarted? Is an important point.
Whether or not the time can be shortened depends on how quickly each confirmation item can be checked. In the present embodiment, it is assumed that each check item is not automatically performed by the user of the apparatus, and thus the control operation unit 45 allows the user of the apparatus to immediately know what to check and how. The check items are sequentially displayed on the display 46. Because the device is rarely stopped due to an earthquake, and is an operation that is rarely used, unlike the operation that the user usually performs, so what should be done to restart the operation of the device? This is because it is considered that it is not clear whether it is good or not. Even if it is written in the instruction manual, its existence is easy to forget if you have not experienced it. In other words, we think that earthquake countermeasures here are rare cases. Therefore, on the display 46, the fact that the device is on standby is displayed and notified (a sound may be emitted), and the work required to restart the operation is instructed in an easy-to-understand manner. The display 46 may of course be the same as the display used for normal device operation, and no new one need be provided. For example, "Check the misalignment with the light source."Here's how: Press the confirmation button when finished. , "Next, check the position of the wafer transfer system. Here's how: Press the confirmation button when finished. , Etc. will be displayed sequentially.

In each confirmation and adjustment, the mechanism used when installing the apparatus or adjusting the factory may be used as it is, and it is not necessary to provide a new one.

Further, as a function for restarting the operation, the state of the wafer 32 and the reticle 31 at the start of standby is controlled by the control operation unit 4.
It is stored in the memory in 5, and the operation restart has a function to be performed from the state at the time of interruption. Therefore, useless replacement of the reticle 31 is unnecessary, and the wafer 32 is not wasted. However, since the wafer 32 and the reticle 31 have just been subjected to the shaking due to the earthquake, the alignment is performed again and the operation is restarted.

Further, the earthquake countermeasure function of this embodiment can be stopped by a command input from the control operation unit 45. Further, the accelerometer 44 may not be a dedicated accelerometer but may be an accelerometer for another purpose in the apparatus. However, in that case, it is necessary to previously obtain the relationship between the vibration of the floor and the acceleration detected by the accelerometer serving as the shared sensor. Furthermore, in the above description, the user of the device himself checks each item, but the device itself is equipped with a mechanism such as the automatic alignment of the main body part and the separate placement part, and the device itself automatically detects the influence of the earthquake. You may make it possible to confirm all or a part and further correct.

In the semiconductor exposure apparatus according to the present embodiment, since the accelerometer is provided as a seismic detection sensor for controlling the operation of the apparatus, when the seismic sensor detects an earthquake, the operation is temporarily stopped and a safe condition is established. Even if an earthquake with a moderate seismic intensity of 2-4 occurs due to waiting at
It is possible to prevent production of defective products and protect the safety of the device itself. Further, for that purpose, it is not necessary to take large-scale anti-vibration measures.

(Embodiment of Semiconductor Production System) Next,
An example of a production system of semiconductor devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin film magnetic heads, micromachines, etc.) using an illuminating device and an exposure device equipped with the mercury lamp according to the present invention will be described. This is to perform maintenance services such as troubleshooting of a manufacturing apparatus installed in a semiconductor manufacturing factory, periodic maintenance, or software provision using a computer network outside the manufacturing factory.

FIG. 7 shows the entire system cut out from a certain angle. In the figure, 101 is a business office of a vendor (apparatus supplier) that provides a semiconductor device manufacturing apparatus. As an example of the manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film forming equipment,
Flattening equipment, etc.) and post-process equipment (assembling equipment, inspection equipment, etc.) are assumed. In the business office 101, a host management system 10 that provides a maintenance database for manufacturing equipment is provided.
8, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. Host management system 1
08 is provided with a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.

On the other hand, 102 to 104 are manufacturing factories of semiconductor manufacturers as users of manufacturing equipment. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or may be factories belonging to the same manufacturer (for example, a factory for pre-process, a factory for post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them to construct an intranet, and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
02-104 host management system 107
Is provided with a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, it becomes possible to access the host management system 108 on the side of the business office 101 of the vendor from the LAN 111 of each factory via the Internet 105, and the security function of the host management system 108 allows access to only a limited number of users. . Specifically, each manufacturing apparatus 1 is connected via the Internet 105.
In addition to notifying status information indicating the operating status of 06 (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) from the factory side to the vendor side, response information corresponding to the notification (for example, information instructing a troubleshooting method, You can receive maintenance information such as software (data and data for handling), the latest software, and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each of the factories 102 to 104 and the vendor's office 101 and data communication via the LAN 111 in each factory. . In addition,
Instead of using the Internet as an external network outside the factory, it is possible to use a leased line network (ISDN or the like) having high security without being accessed by a third party. Further, the host management system is not limited to one provided by a vendor, and a user may construct a database and place it on an external network to permit access from a plurality of factories of the user to the database.

Now, FIG. 8 is a conceptual diagram showing the entire system of this embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected by an external network, and production management of each factory or at least one unit is performed via the external network. The information of the manufacturing apparatus was data-communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors and a management system of each vendor of the plurality of manufacturing equipments are connected by an external network outside the factory, and maintenance information of each manufacturing equipment is displayed. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturing maker), and a manufacturing apparatus for performing various processes is installed on a manufacturing line of the factory.
The film forming processing device 204 is introduced. Although only one manufacturing factory 201 is shown in FIG. 8, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by LAN 206 to form an intranet,
The host management system 205 manages the operation of the manufacturing line.

On the other hand, each business office of the vendor (apparatus supply manufacturer) such as the exposure apparatus maker 210, the resist processing apparatus maker 220, the film forming apparatus maker 230, etc., has a host management system 21 for remote maintenance of the supplied apparatus.
1, 221, 231, which are provided with the maintenance database and the gateway of the external network as described above. A host management system 205 that manages each device in the user's manufacturing plant, and a vendor management system 2 for each device
11, 221, and 231 are connected to each other via the external network 200 such as the Internet or a dedicated line network. In this system, when trouble occurs in any of the series of production equipment on the production line,
Although the operation of the manufacturing line is suspended, it is possible to quickly respond by receiving remote maintenance via the Internet 200 from the vendor of the device in which the trouble has occurred, and the suspension of the manufacturing line can be minimized. .

Each manufacturing apparatus installed in the semiconductor manufacturing factory is provided with a display, a network interface, and a computer for executing the network access software and the apparatus operating software stored in the storage device. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides a user interface with a screen as shown in FIG. 9 on the display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 401, serial number 402, and subject 40 of the trouble.
3. Input information such as date of occurrence 404, urgency 405, symptom 406, coping method 407, and progress 408 in input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the appropriate maintenance information as a result is returned from the maintenance database and presented on the display. In addition, the user interface provided by the web browser further has hyperlink functions 410 to 4 as shown in the figure.
12 enables operators to access more detailed information on each item, pull out the latest version of software used for manufacturing equipment from the software library provided by the vendor, and use the operation guide (help Information) can be withdrawn. Here, the maintenance information provided by the maintenance database includes the information about the present invention described above, and the software library also provides the latest software for implementing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 10 shows a flow of the whole manufacturing process of the semiconductor device.
In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a mask having the designed circuit pattern is manufactured. On the other hand, step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer manufactured in step 4, and includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. Including steps. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes and shipped (step 7). The front-end process and the back-end process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. Information for production management and device maintenance is also data-communicated between the front-end factory and the back-end factory via the Internet or the leased line network.

FIG. 11 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented in advance, and even if troubles occur, quick recovery is possible, and semiconductor devices can be compared to conventional devices. Productivity can be improved.

[0052]

As described above, according to the present invention, it is possible to prevent unnecessary external force from being applied to the lamp.
It has the effect of eliminating accidental damage to the lamp. Therefore, it is possible to safely perform the lamp replacement work, and it is possible to stably operate the device by reducing the accidental damage to the lamp during the operation of the device.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining an example of a lighting device according to a first embodiment of the present invention.

FIG. 2 is a perspective view for explaining an example of a lighting device according to a second embodiment of the present invention.

FIG. 3 is a perspective view for explaining an example of a lighting device according to a third embodiment of the invention.

FIG. 4 is a perspective view for explaining an example of a lighting device according to a fourth embodiment of the invention.

FIG. 5 is a perspective view for explaining an example of a lighting device according to a fifth embodiment of the present invention.

FIG. 6 is an overall configuration diagram showing an example of a semiconductor exposure apparatus according to an embodiment of the present invention.

FIG. 7 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention viewed from an angle.

FIG. 8 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention as viewed from another angle.

FIG. 9 is a specific example of a user interface.

FIG. 10 is a diagram illustrating a flow of a device manufacturing process.

FIG. 11 is a diagram illustrating a wafer process.

[Explanation of symbols]

1: Mercury lamp, 2: Positioning pin, 3: Lamp mounting hand, 4: Lamp mounting screw, 5: Notch part,
6: Lamp mounting hand (mounting member), 7: Lamp mounting screw, 8: Key, 9: Key groove, 10: Notch, 11: Pin, 12: Alignment mark, 13: Alignment mark, 15: Light emission Part, 16, 17: base part,
Reference numeral 18: concentric convex portion, 20: conducting wire, 22: receiving hole, 23: receiving groove portion, 26: guide portion, 31: reticle, 32: wafer, 33: projection lens, 35: illumination optical system, 36: wafer stage , 37: reticle library, 38: reticle stage, 39: reticle transport system,
40: Wafer cassette, 41: Wafer transfer system, 42: Alignment scope, 43: Mount, 44: Accelerometer, 45: Control operation unit, 46: Display, 51: Lamp house, 101: Vendor office, 102, 10
3, 104: Manufacturing plant, 105: Internet, 10
6: Manufacturing equipment, 107: Factory host management system, 1
08: Vendor side host management system, 109: Vendor side local area network (LAN), 110:
Operation terminal computer, 111: Factory local area network (LAN), 200: External network,
Reference numeral 201: manufacturing apparatus user manufacturing factory, 202: exposure apparatus, 203: resist processing apparatus, 204: film processing apparatus, 205: factory host management system, 206: factory local area network (LAN), 210: exposure apparatus Maker, 211: Host management system at business office of exposure apparatus maker, 220: Resist processing apparatus maker, 2
21: Host management system at business office of resist processing equipment manufacturer, 230: Film management equipment manufacturer, 231: Host management system at business office of film deposition equipment manufacturer, 401: Model of manufacturing equipment, 402: Serial number, 403: Trouble Subject, 404: date of occurrence, 405: urgency, 406: symptom, 407: remedy, 408: progress, 410, 411,
412: Hyperlink function.

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/30 502G F term (reference) 3K013 AA01 AA03 BA01 CA02 DA09 EA01 5C035 HH03 HH17 5C235 HH03 HH17 5F046 AA23 AA28 CA02 CB22 DB14 DC14 DC14 DC14 DD06

Claims (15)

[Claims] 1. A conducting wire is provided from a base,
A mercury lamp characterized in that it has orientation fixing means for orienting and fixing the wire so that the wire is oriented in a predetermined direction with respect to the lamp mounting member. 2. The direction determining and fixing means determines a predetermined direction according to a fitting relationship between one projecting portion where the base and the lamp mounting member engage with each other and the other receiving portion which receives the projecting portion. The mercury lamp according to claim 1, wherein the mercury lamp is present. 3. The directional fixing means means for deciding a predetermined direction by mutually opposing flat surfaces provided on the base and the lamp mounting member. Mercury lamp. 4. The direction determining and fixing means determines a predetermined direction by aligning positions of alignment marks provided on the base and the lamp mounting member. Mercury lamp. 5. A lighting device comprising the mercury lamp according to any one of claims 1 to 4. 6. An illuminating device comprising a fixing means for fixing the mercury lamp so that the conducting wire extending from the base of the mercury lamp has a fixed direction. 7. The means for fixing and fixing a mercury lamp mounting side base and a lamp mounting member with a pin for one side and a notch on the other side for rotational restraint as the direction determining and fixing means and aligning the position with the lamp mounting member. The lighting device according to claim 6, further comprising: 8. An exposure apparatus, which exposes a predetermined pattern on a substrate with the illumination device according to claim 5. 9. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 8 in a semiconductor manufacturing factory, and a step of manufacturing a semiconductor device by a plurality of processes using the manufacturing apparatus group. A method of manufacturing a semiconductor device, comprising: 10. A process of connecting the manufacturing device group with a local area network, and data communication of information about at least one of the manufacturing device group between the local area network and an external network outside the semiconductor manufacturing factory. The method for manufacturing a semiconductor device according to claim 9, further comprising: 11. A database provided by a vendor or a user of the exposure apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory. 11. The production management is performed by performing data communication with the external network via the external network.
A method for manufacturing a semiconductor device according to. 12. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 8, a local area network connecting the manufacturing apparatus group, and an external network outside the factory accessible from the local area network. A semiconductor manufacturing plant having a gateway for enabling data communication of information relating to at least one of the manufacturing apparatus group. 13. The semiconductor device manufacturing plant according to claim 8, wherein the semiconductor manufacturing plant is installed.
The exposure apparatus maintenance method according to claim 1, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing factory, and from within the semiconductor manufacturing factory via the external network. And permitting access to the maintenance database, and transmitting the maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via the external network. . 14. The exposure apparatus according to claim 8, wherein
An exposure apparatus further comprising a display, a network interface, and a computer that executes network software, and enables maintenance apparatus information to be data-communicated via a computer network. 15. The network software comprises:
A user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus, which is connected to an external network of a factory in which the exposure apparatus is installed, is provided on the display, and from the database via the external network. The exposure apparatus according to claim 14, which makes it possible to obtain information.