JP2002344097A - Mounting substrate and display device having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable to perform notation, such as a manufacturer's secret serial number or a product, without specifically providing a location for forming the manufacturer's secret number or the product number. SOLUTION: A notation 2, such as a character, a mark or a symbol, is provided on an electrode terminal 4 on a mounting substrate L1, on which an electronic element such as a semiconductor element IC or a circuit substrate F is mounted. Any of the electrodes 4, on which the semiconductor element, the circuit substrate or other electronic elements (electronic components), may be used as the part to be provided with the mark and an electrode terminal for conduction checking may be alternatively used. Furthermore, the notation 2, such as a manufacturer's secret serial number or product may be formed across a plurality of electrode terminals 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for display devices such as a liquid crystal display device and a plasma display device.
The present invention relates to a mounting board on which electronic elements such as a semiconductor element and a circuit board are mounted.

[0002]

2. Description of the Related Art Semiconductor elements such as semiconductor elements (ICs and LSIs) are roughly classified into those having bumps which are protruding electrodes and those having no bumps. Since it is advantageous for downsizing of a mounting substrate and thinning of a module, it is widely used in various electronic devices such as computers and liquid crystal panels. There are various methods for mounting such a semiconductor element on a substrate face-down. However, due to the spread of small and thin liquid crystal panels, so-called solder bumps have been replaced by anisotropic conductive films (ACF). By interposing between the connection terminals, high-density mounting has been enabled (fine pitch).

On the other hand, in the manufacture of a liquid crystal display device, in a modularization process following a so-called cell process for holding a liquid crystal, a semiconductor element for driving the liquid crystal panel is mounted on the liquid crystal panel, and a liquid crystal panel is mounted. A circuit board for supplying a transmission signal or power to a semiconductor element is mounted on an outer peripheral portion of the semiconductor device. In mounting a semiconductor element in a liquid crystal display device, there is COG (chip on glass) mounting in which a semiconductor element is directly connected to an electrode terminal on a glass substrate. A plastic flexible substrate may be used instead of a glass substrate (this is called COF (chip on film),
It may be called P (chip on plastic). In COG mounting, it is usual to mount a semiconductor element having a bump having the above shape using the anisotropic conductive film. Further, the circuit board is often mounted using an anisotropic conductive film. In COG mounting, after mounting the semiconductor element or the circuit board, a continuity test of the driving state of the semiconductor element is performed, and also for the circuit board, signals and power to the semiconductor element are supplied to the liquid crystal panel via the board. A continuity test, such as whether or not it is performed, is performed. Note that an inspection electrode terminal for this continuity inspection is formed on a glass substrate.

[0004] In general, in the above-mentioned circuit boards and in display devices such as liquid crystal display devices, notations (manufacturing secret numbers and product numbers) such as characters, alphanumeric characters and mark symbols for identifying these circuit boards and display devices are used. It is usually formed. The production serial number and the product number are useful for manufacturing history management and quality control by repair / replacement of parts, confirmation of the date of production, and tracking survey of distribution channels. For example, FIGS. 6A and 6B and FIG.
Is a typical example of a liquid crystal display device as a conventional display device. In a liquid crystal display device, a driving circuit for displaying a liquid crystal panel is connected to a non-display area 3B on a glass substrate constituting the liquid crystal panel. In addition to the electrode terminals 4 to be manufactured,
1 is formed. The location 1 where the production density number 2 is applied is formed by a so-called solid pattern 1 such as pattern etching, like the electrode terminal 4. The location 1 where the production secret number 2 is applied is a pixel electrode (not shown) of the liquid crystal panel.
It is usual to form a rectangular shape using wiring that supplies signals to the pixel electrodes (also called “wiring in the liquid crystal panel”), and then engrave predetermined symbols and characters using laser light, No. 2 is formed. Further, as another method of forming the manufacturing dense number 2, there is a method of forming the manufacturing dense number pattern by photolithography at the same time as forming the wiring pattern and the electrode terminal 4. Whichever method is used, the production density number 2 is formed in the non-display area 3B of the liquid crystal panel. In the liquid crystal panel, a glass substrate (also referred to as a first substrate or an array substrate) L1 and a counter substrate (a second substrate) L2 are bonded together with a resin spacer for securing a cell gap using a sealing material S,
Although it is sealed in the cell gap, the inside L of the sealing material S is used as a reference line R, the inside of this reference line R is called a display area 3A, and the outside of the reference line R is used as a non-display area 3.
B (see FIG. 6B).

[0005]

In recent years, as the market for liquid crystal display panels, as typified by COG mounting, it is essential to reduce the size of the glass substrate, and the non-display area 3B occupies the screen size. While the ratio is large and the non-display area 3B tends to be reduced, the number of electrode terminals 4 to be connected increases, and the area occupied by the electrode terminals 4 for connecting the drive circuits in the non-display area 3B has increased. . For this reason, it is becoming difficult to secure the formation area of the solid pattern 1 that forms the production dense number 2 separately from the electrode terminals 4, and as a result, there is a problem that the production history management and the quality control are hindered. is there.

[0006] In order to perform manufacturing history management and the like, formation of a fine encrypted mark such as a two-dimensional bar code has been devised. However, this method has the same problems that a dedicated reading device is required and that this method also needs to secure an area necessary for forming notations such as marks. The above is an example of a liquid crystal display device typified by COG mounting. However, another display device such as a plasma display device has the same configuration and has the same problem as described above.

Accordingly, an object of the present invention is to enable notation of a production secret number or the like without providing a part for forming a notation of a production secret number, a product number, or the like. An object of the present invention is to provide a mounting substrate which can be easily performed and a display device having the substrate.

[0008]

In order to solve the above-mentioned problems, a mounting board according to the present invention is provided with an electrode terminal of a mounting board on which an electronic element such as a semiconductor element or a circuit board is mounted. , Characters, marks, symbols, and the like. Here, the electrode terminal may be any of an electrode terminal on which a semiconductor element, a circuit board, and other electronic elements (electronic components) are mounted, or may be an inspection electrode terminal used for continuity inspection. good. Further, the notation such as the production secret number and the product number may be formed over a plurality of electrode terminals.

According to the present invention, characters, marks, symbols, and the like are provided on the electrode terminals of the mounting substrate on which electronic elements such as semiconductor elements and circuit boards are mounted. Even if there is no place to form notations such as numbers,
Manufacturing history management and quality control can be performed.

According to a second aspect of the present invention, there is provided a display device having a mounting substrate, wherein the mounting substrate is a substrate constituting a display device such as a liquid crystal display device, and the electrode terminals constitute the display device. It is arranged in a non-display area other than the display area on the substrate.

According to the present invention, manufacturing history management and quality control of a display device such as a liquid crystal display device or a plasma display device can be performed. However, the electrode terminals are located outside a display area on a substrate constituting the display device. Are arranged in the non-display area, it is possible to cope with the recent tendency to make the non-display area narrower.

According to a third aspect of the present invention, there is provided a display device having the mounting substrate, wherein the mounting substrate is a transparent substrate constituting a display device such as a liquid crystal display device, and wherein the electrode terminals are two or more.
A thin film having at least one layer is formed by lamination, and characters, marks, symbols, and the like are provided on the uppermost layer or the lowermost layer of the electrode terminal.

According to the present invention, when characters, marks, symbols, and the like are provided on the uppermost layer of the laminated structure, manufacturing history management and quality control can be performed from the notations.
When characters, marks, symbols, and the like are provided on the lowermost layer of the laminated structure, manufacturing history management and quality control can be performed from behind the transparent substrate via the transparent substrate.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

(First Embodiment) In this embodiment, a COG in which a semiconductor element is mounted on a semiconductor mounting substrate which is one substrate of a liquid crystal panel in which liquid crystal is held between a pair of substrates.
This is an example in which the present invention is applied to mounting.

As shown in FIGS. 6 (a) and 6 (b), the liquid crystal panel has a semiconductor element (driving driver (Driver
IC, called Driver LSI)
A circuit board F for supplying a transmission signal or power to the semiconductor element IC is disposed on an outer peripheral edge of the board L1. The liquid crystal panel includes a pair of substrates L opposed to each other with the liquid crystal layer interposed therebetween.
And a pair of upper and lower substrates L1 and L2, each of which has a strip shape, and is formed by sealing a liquid crystal between a lower first substrate L1 and an upper second substrate L2. . A semiconductor element IC is mounted on an outer periphery of the first substrate L1 via an anisotropic conductive film (ACF) 6, and a circuit board is provided on an outer peripheral edge via an anisotropic conductive film (ACF) 6. F is implemented. The semiconductor element IC to be mounted may or may not have the bump which is the protruding electrode.

The first substrate L1 is a glass substrate,
In addition, a transparent substrate made of a transparent synthetic resin is used.
The first substrate L1 is formed larger than the second substrate L2. For this reason, when the two substrates L1 and L2 are overlapped, the first substrate L1 becomes the first substrate L1.
Semiconductor device IC partially protruding on the outer peripheral edge of the substrate L1
Are formed. In the mounting area, as shown in FIG. 7, a wiring 5 for semiconductor mounting is formed in a pattern. The wiring 5 is a semiconductor element IC (drive driver)
A group of wiring (bus wiring) for supplying a signal to and supplying power to a substrate.
After a film is formed to a thickness of 1 to 0.2 μm, the film is patterned by photolithography. In the mounting area where the wiring 5 is formed, a plurality of semiconductor element ICs are disposed via a paste-like or film-like anisotropic conductive film 6.

On the semiconductor element side surface (mounting surface) of the first substrate L1, electrode terminals 4 made of aluminum (AL) or the like are provided. One electrode terminal 4 (the left side in FIG. 6B) is an input electrode, and the other electrode terminal 4 (FIG.
(The right side in (b)) is an output electrode, which respectively corresponds to the input and output bumps. The liquid crystal panel is a glass substrate (also referred to as a first substrate or an array substrate) L1
And a counter substrate (second substrate) L2 are bonded together with a resin spacer for securing a cell gap using a sealing material S and sealed in the cell gap.
Of the reference line R is referred to as a display area 3A, and the outside of the reference line R is referred to as a non-display area 3B.

The anisotropic conductive film 6 has conductive particles 6a dispersed in an adhesive 6b having an insulating property, has conductivity in a thickness direction (connection direction), and has an insulating property in a plane direction (lateral direction). Having conductive particles 6a and an adhesive 6b.
The connection is basically thermocompression bonding, in which the conductive particles 6a are in charge of the means for electrical connection, and the adhesive 6b is in charge of means for maintaining the pressed state. As the adhesive 6b of the anisotropic conductive film 6, a thermoplastic resin or a thermosetting resin is used. The conductive particles 6a have a surface coated with a thermoreversible insulative thin film resin. The conductive particles 6a are broken by a pressing force in the connection direction, and the underlying metal thin film and the electrode are brought into contact with each other, and are not broken in the lateral direction. Even if 6a are in contact with each other, insulation is maintained. Some of the conductive particles 6a are obtained by plating a metal thin film on the surface of a polymer sphere. It is also possible to use conductive particles without an insulating thin film resin here.

Before being attached to the liquid crystal panel, the anisotropic conductive film 6 is usually supplied in a configuration such as a double-sided tape. When the semiconductor element IC is bonded to the first substrate L1, the adhesive layer side is attached to the position where the semiconductor element IC is provided on the first substrate L1, and then the separator is peeled off to expose the adhesive layer. Let it. Then, the anisotropic conductive film 6 and the semiconductor element IC are aligned by a mounting machine including a pressure bonding stage and a heat pressure bonding tool so that the electrode terminals 4 and the bumps B overlap each other. Element IC
Is applied while heating the conductive particles 6a, the conductive particles 6a are sandwiched between the bump B and the electrode terminal 4 at a predetermined pressure,
The adhesive is cured by applying heat.

In the present embodiment, as shown in FIG. 1, a non-display area 3B on a first substrate L1 constituting a liquid crystal display device is provided.
In addition, an electrode terminal 4 for connecting a driving semiconductor element IC for displaying a liquid crystal panel is formed, and a wiring 5 for supplying a signal to a pixel electrode is formed. The production secret number 2 for identifying the liquid crystal display device is directly formed on the terminal 4. In the production secret number 2, a portion of the electrode terminal 4 is subjected to photolithography and pattern etching, and predetermined symbols and characters are engraved to form notations such as characters, alphanumeric characters, marks, and symbols. As a method of forming the production secret number 2 which is one of the notations, a predetermined symbol or character may be stamped by using a laser beam to form the production secret number 2. The pattern width of the electrode terminal 4 of the present embodiment is 20
About 0μm ~ 250μm, size per character is 200
μm or less.

According to the configuration of the present embodiment, the surface of the electrode terminal 4 disposed in the non-display area 3B is processed and subjected to the production dense number 2, so that the electrode terminal 4 is different from the conventional one. The manufacturing history can be easily managed without specially providing an area for forming characters and the like for board identification, and the non-display area 3B of the liquid crystal display device can be reduced.

The electrode terminals 4 cannot be actually formed by the photolithography forming method under this tendency because the fine pitch and the miniaturization are rapidly advanced as typified by the COG mounting. In some cases.
That is, the inspection (continuity inspection) of whether or not the display is turned on before the drive circuit of the liquid crystal panel is connected needs to have a size capable of directly inputting a signal to the electrode terminal 4 with a probe (probe) or the like. In such a case, the following several application examples are applicable.

As a first application example, as shown in FIG. 2, the electrode terminals 4 are formed in a rectangular pattern, and one side (upper side in FIG. 2) of the rectangular electrode terminals 4 is Wiring 5 is connected. The production dense number 2 is formed on the side opposite to the side where the wiring 5 to the electrode terminal 4 is connected, that is, on the outer peripheral edge 1a side of the first substrate L1 by the above-described forming method. . Therefore, when forming a production secret number 2 by engraving characters with a laser beam, the conductive layer may melt and affect the connection of the semiconductor element IC. Since the production density number 2 is formed at a position on the side opposite to the side to which the element 5 is connected, there is no influence on the connection of the semiconductor element IC.

As a second application example, as shown in FIG. 3, the display device is connected to a non-display area 3B on a glass substrate L1 constituting a liquid crystal panel before a semiconductor element IC for driving the liquid crystal panel is connected. And a wiring 8 for image inspection (a wiring for inspection for continuity inspection) for forming an image display terminal (electrode terminal for inspection for continuity inspection) for lighting and displaying the LED. The secret number 2 may be formed. The size of the image inspection terminal 7 of the second application example is
A 1 mm ^2, the image inspection terminal 7, a predetermined symbol with a laser beam, engraved with letters, to form a manufacturing dense No.2. In this case, the size per character was about 500 μm ² .

(Second Embodiment) As shown in FIGS. 4 and 5 (a) and 5 (b),
The electrode terminal 4 is formed by laminating a plurality of thin films, and characters, alphanumeric characters, marks, symbols, and the like for identifying a display device or a substrate are formed on the uppermost layer 4a or the lowermost layer 4b of the two or more thin films of the electrode terminal 4. This is a liquid crystal display device on which a manufacturing dense number 2 is formed. In the present embodiment, the lower layer 4b is made of Ti and the upper layer 4a is made of two layers of ITO (Indium Tin Oxide). However, the present invention is not limited to this. Lower layer 4b is formed of conductive layer (Ti)
Photolithography and pattern etching are performed on one of the conductive layer (ITO) and the upper layer 4a, and a predetermined symbol,
The letters are engraved to form the production secret number 2. As a method of forming the production secret number 2 which is one of the notation of characters, alphanumeric characters, marks, symbols, and the like, a predetermined symbol or character may be stamped using a laser beam to form the production secret number 2. . Although each of the electrode terminals 4 (4a, 4b) of the present embodiment is a laminated film of a conductive thin film, the present embodiment can also be used for a laminated film of a conductive layer and an insulating layer. is there.

When the production secret number 2 is stamped on the electrode terminal 4 having such a laminated structure by using the laser light, the layer on which the production secret number 2 is formed (either the upper layer 4a or the lower layer 4b) may be formed. Although it melts, according to the present embodiment, the production secret number 2
(Connection resistance)
Can be eliminated. In addition, when characters, marks, symbols, and the like are provided on the lowermost layer 4b of the laminated structure, manufacturing history management and quality control are performed from the back side of the transparent first substrate L1 via the transparent first substrate L1. Can manage. When the lowermost layer is engraved with a notation such as production secret number 2 using a laser beam, the notation is made from symmetrical characters in order to be recognized from the back side of the transparent first substrate L1. It is preferable that all the characters of the production secret number 2 are stamped so as to be symmetrical.

Further, the thin film of the uppermost layer 4a is intentionally used as an insulating film, the next layer is used as a conductive layer, and the thin film of the uppermost layer 4a is melted by a laser beam, so that the next conductive layer is widely exposed and the conductive state is obtained. It is also possible to achieve the following.
In the second embodiment as well, as in the application example of the first embodiment, a notation such as a production number 2 may be formed on the image inspection terminal 7 or the image inspection wiring 8.

According to the present embodiment, the electrode terminals 4 are formed in a laminated structure, and the notation such as the production secret number 2 is formed.
A high-quality liquid crystal display device that is not affected by the connection of electronic elements such as the semiconductor element IC and the circuit board F can be provided.

In the above embodiments, the case of a liquid crystal display device has been described. However, similar effects can be obtained in the case of a display device other than a liquid crystal display device such as a plasma display. In each of the above embodiments, the case of the liquid crystal display device has been described. However, it is needless to say that the present invention can be applied to a mounting board (circuit board) in general for identifying the board and the like.

[0031]

According to the mounting board of the present invention, characters, marks, symbols, and the like are provided on the electrode terminals of the mounting board on which electronic elements such as semiconductor element ICs and circuit boards are mounted. Therefore, it is possible to perform manufacturing history management and quality control without providing a portion for forming a notation such as a production secret number.

According to the display device having the mounting substrate of the present invention, an electrode terminal for connecting a semiconductor element for driving the display device is arranged in a non-display area on the substrate constituting the display device. Since the notation such as characters and alphanumeric characters are formed on the electrode terminals, it is possible to form notations such as the production secret number even in the display device in which the non-display area is reduced, and the production history management and quality control can be easily performed. An inexpensive display device can be provided.

[0033]

[Brief description of the drawings]

FIG. 1 is a partially enlarged view of a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged view of a first application example of the first embodiment.

FIG. 3 is a partially enlarged view of a second application example of the first embodiment.

FIG. 4 is a partially enlarged view of a liquid crystal display device according to a second embodiment of the present invention.

FIGS. 5A and 5B are diagrams of a laminated film of an electrode terminal according to the second embodiment, in which FIG. 5A is a diagram in which a production dense number is formed on the uppermost layer of the laminated film, and FIG. Diagram showing production secret number in lower layer

FIG. 6 illustrates a structure of a liquid crystal display device.

FIG. 7 is a partially enlarged view of a conventional liquid crystal display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solid pattern 2 Manufacturing dense number (notation) 3A Display area 3B Non-display area 4 Electrode terminal 4a Top layer 4b Bottom layer 5 Wiring 7 Image inspection terminal 8 Image inspection wiring

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA40 GA42 GA48 GA50 GA60 MA12 MA32 NA25 PA01 5C094 AA15 AA43 AA48 BA43 DA13 DB03 EA10 FB12 5E338 AA01 AA11 AA13 BB65 CC01 CC04 CD13 DD12 DD22 DD32 EE23 EE44

Claims (3)

[Claims] 1. A mounting substrate, wherein characters, marks, symbols, and the like are provided on electrode terminals of the mounting substrate on which electronic elements such as semiconductor elements and circuit boards are mounted. 2. The mounting substrate is a substrate constituting a display device such as a liquid crystal display device, and the electrode terminals are arranged in a non-display region other than a display region on the substrate constituting the display device. A display device having a mounting substrate. 3. The mounting substrate is a transparent substrate constituting a display device such as a liquid crystal display device, and the electrode terminals are
3. The mounting substrate according to claim 2, wherein a thin film of at least one layer is formed by lamination, and characters, marks, symbols, and the like are provided on an uppermost layer or a lowermost layer of the electrode terminal. Display device.