JP2002343833A - Semiconductor mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor mounting apparatus which can apply a desired heat and a load at a good time so as to eliminate a problem in which optimum heat and load cannot be applied due to a thickness intersection of a semiconductor when a plurality of semiconductors are press bonded at one time on the same substrate in a semiconductor mounting using a thermosetting resin. SOLUTION: The semiconductor mounting apparatus mounts a plurality of semiconductor elements 1 on a printed board 3 formed of a thermosetting resin 2, and press bonds the plurality of the elements 1 on the board 3 by applying the load and the heat at one time to the plurality of the elements 1 by using tools 5 and 6 from the plurality of the elements 1 side. In this case, a pressurizing tool 5 and a heating tool 6 are independently provided, can separately pressurize and heat and hence can apply the desired load and heat at the good time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting device for pressing a plurality of semiconductor elements onto a printed circuit board via a thermosetting resin.

[0002]

2. Description of the Related Art Up to now, with the rapid progress of small portable devices, devices using semiconductors have been widely used. Accordingly, there has been a demand for a method for mounting a semiconductor element which is advantageous at low cost and for mass production. As a mounting method for realizing the demand, a method of bonding a semiconductor element onto a printed circuit board via a thermosetting resin is being put to practical use.

[0003] As shown in FIG.
(A) A thermosetting resin layer is formed on a wiring board, (b) a semiconductor element 1 is positioned and mounted on a pattern of a printed circuit board 3, and (c) a pressing and heating tool 11 is mounted from the semiconductor element 1 side. And applying a load and heat. This method can be said to be a low-cost and advantageous production method for mass production because the steps of electrical connection between the semiconductor element and the printed circuit board and resin sealing for improving reliability can be performed at once.

On the other hand, in order to meet the recent demand for multifunctional devices, it has become necessary to mount a plurality of semiconductor elements on the same substrate. In the above mounting method, the timing of pressurization and heating, and the amount thereof greatly affect reliability.
Conventionally, when a plurality of semiconductor elements are mounted on the same substrate by the above-described method, in order to stably apply a desired load and heat to a plurality of semiconductor elements having slightly different thicknesses, one semiconductor element is conventionally used. One was implemented separately.

[0005]

However, in the above method, when a load and heat are applied to one semiconductor element, the load and heat are not applied to adjacent semiconductor elements by mistake. It was necessary to prepare a dedicated pressurizing and heating tool according to the shape, and to devise to keep the semiconductor element as close as possible. However, this caused a problem of an increase in cost and an increase in size of the device.

As a countermeasure for this, there is a method of pressing a plurality of semiconductor elements at once. However, if a plurality of semiconductor elements are pressed at once, the thinner element becomes thicker before being pressed. Heat is applied from the printed circuit board and the atmosphere by the heat applied to the element, and the thermosetting resin starts to cure before the connection between the semiconductor element and the printed circuit board is obtained. There is a problem that imbalance of the load occurs.

SUMMARY OF THE INVENTION The present invention provides a semiconductor mounting apparatus capable of applying a desired load and heat with good timing when a plurality of semiconductor elements are to be pressed.

[0008]

In order to solve this problem, a semiconductor mounting apparatus according to the present invention mounts a plurality of semiconductor elements on a printed circuit board on which a thermosetting resin is formed. An apparatus for crimping the plurality of semiconductor elements and the printed circuit board by applying a load and heat to the plurality of semiconductor elements at once using a tool, wherein a pressurizing tool and a heating tool are provided independently. It is characterized by that. By using the semiconductor mounting device of the present invention, heat can be applied to the thinner element after pressing, and the thermosetting resin starts to harden before the connection between the semiconductor element and the printed circuit board is obtained. Is gone.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is to mount a plurality of semiconductor elements on a printed circuit board on which a thermosetting resin is formed, and to use a tool from the plurality of semiconductor elements side. An apparatus for applying pressure and heat to the plurality of semiconductor elements at once to press the plurality of semiconductor elements and the printed circuit board, wherein a pressing tool and a heating tool are provided independently. As a result, pressurization and heating can be performed separately, and a desired load and heat can be applied with good timing.

According to a second aspect of the present invention, there is provided the semiconductor mounting apparatus according to the first aspect, wherein the pressure tool is provided with a tilt correcting mechanism, and the object to be bonded is warped or uneven. Following this, a uniform load is applied to the entire surface of the semiconductor element, and a highly reliable semiconductor device can be realized.

According to a third aspect of the present invention, there is provided the semiconductor mounting apparatus according to the first aspect, wherein an inclination correcting mechanism is provided on a stage on which the printed circuit board is placed, and warpage of the adherend is provided. A load is evenly applied to the entire surface of the semiconductor element following irregularities and irregularities, so that a highly reliable semiconductor device can be realized.

According to a fourth aspect of the present invention, in a semiconductor device in which a plurality of semiconductor elements are pressure-bonded to a printed board via a thermosetting resin, the thicknesses of the plurality of semiconductor elements are classified. It is characterized by performing mounting and crimping in order from the thinnest, and conventionally, it has been difficult to crimp a plurality of semiconductor elements having extremely different thicknesses on the same substrate using a thermosetting resin. This method can be easily realized.

According to a fifth aspect of the present invention, a copper foil is formed on all of the layers except for the wiring pattern of the inner layer, and a multilayer printed circuit board having improved thermal conductivity is formed on a multilayer printed circuit board via a thermosetting resin. It is characterized in that a plurality of semiconductor elements are pressed at the same time, and when trying to press-bond a plurality of semiconductor elements at once, air bubbles generated in the thermosetting resin, which are particularly problematic, are reduced and reliability is improved. be able to.

According to a sixth aspect of the present invention, there is provided a semiconductor device in which a plurality of semiconductor elements having different numbers of bumps and chip sizes are pressure-bonded on a printed circuit board at a time via a thermosetting resin. The characteristic is that the hardness of the thermosetting resin used for each semiconductor element is adjusted so that the load applied to the bump of each semiconductor element is the same, and the load applied to each bump falls within the optimum range. As a result, the reliability can be improved.

Hereinafter, embodiments of the present invention will be described with reference to FIGS.
5 will be described.

(Embodiment 1) FIG. 1 shows Embodiment 1 of the present invention.
FIG. 4 is a schematic diagram showing a mounting process using a semiconductor mounting device in FIG. In FIG. 1, 1 is a semiconductor element, 2 is a thermosetting resin, 3 is a printed board, 4 is a chip mounter, 5 is a pressing tool, and 6 is a heating tool.

As shown in FIG. 1, in the mounting process using the semiconductor mounting apparatus according to the present embodiment, (a) a plurality of semiconductors having bumps formed on a printed board 3 on which a thermosetting resin 2 is formed. Position and mount element 1
(B) The plurality of semiconductor elements 1 are pressed at once from the semiconductor element 1 side by using the pressing tool 5, and then (c) the semiconductor element 1 is heated by the heating tool 6 to remove the thermosetting resin 2. Let it cure. The pressurizing tool 5 is made of a material having good thermal conductivity, and is brought into contact with the heating tool 6 to
Heat can be transmitted to the semiconductor element 1. In the case of this device, heat can be applied after pressing to the thinner element, so that the thermosetting resin does not start to cure before the connection between the semiconductor element and the printed circuit board, and the desired load and Heat can be applied with good timing, and the connection between the semiconductor element and the printed circuit board can be reliably obtained.

In the present embodiment, the thermosetting resin is shown as one layer, but the same effect can be obtained by forming the same in each semiconductor element.

(Embodiment 2) FIG. 2 shows Embodiment 2 of the present invention.
FIG. 2 is a schematic diagram showing the semiconductor mounting device in FIG. In FIG. 2, 6a denotes a heating tool, and 7 denotes an elastic body.

As shown in FIG. 2, in the semiconductor mounting apparatus according to the present embodiment, similarly to the first embodiment,
And the heating tool 6a are provided independently, but the pressing tool 5 is supported by the semiconductor mounting device body by an elastic body 7 made of rubber or the like, and the heating tool 6a has a spherical surface with a convex end. The semiconductor device has a shape, and a load is evenly applied to the entire surface of the semiconductor element in accordance with the warpage or unevenness of the object to be bonded, so that a highly reliable semiconductor device can be realized. Also,
Since the pressing tool 5 is supported by the elastic body 7,
There is a possibility that an accurate load may not be given to the adherend. Then, a more accurate semiconductor mounting device can be obtained.

(Embodiment 3) FIG. 3 shows Embodiment 3 of the present invention.
FIG. 2 is a schematic diagram showing the semiconductor mounting device in FIG. In FIG. 3, reference numeral 7a denotes an elastic body, and 8 denotes a pressure bonding stage.

As shown in FIG. 3, in the semiconductor mounting apparatus according to the present embodiment, an elastic body 7a made of rubber or the like is provided on a compression stage 8 on which an object to be bonded is placed. With the elastic member 7a, a load is evenly applied to the entire surface of the semiconductor element by following the warpage and the unevenness of the adherend, and a highly reliable semiconductor device can be realized.

(Embodiment 4) FIG. 4 shows Embodiment 4 of the present invention.
FIG. 4 is a schematic view showing a method for manufacturing a semiconductor device in FIG. In FIG. 4, 1a to 1n indicate semiconductor elements.

As shown in FIG. 4, the mounting process using the semiconductor mounting apparatus according to the present embodiment is as follows. (A) A plurality of semiconductor elements 1a to 1n to be mounted are ranked according to their thickness, and first, (b) The semiconductor element 1a having the thinnest rank is positioned and mounted on the printed circuit board 3 on which the thermosetting resin 2 is formed, and (c) the semiconductor element 1 is
A load and heat are applied from the side a. Further, (d) the semiconductor element 1b having the next thinner rank is positioned and mounted. (e) The load and heat are applied from the side of the semiconductor element 1b using the pressing tool 5. , Repeating this process, and finally,
(F) positioning and mounting the semiconductor element 1n of the thickest rank, and (g) applying a load and heat from the semiconductor element 1n side using the pressing tool 5. Until now,
Multiple semiconductor elements with extremely different thicknesses on the same substrate,
When trying to press-bond one semiconductor element using thermosetting resin, in order to prevent the load and heat from being applied to the adjacent semiconductor elements by mistake, a special Although it was necessary to prepare a heating / pressing tool of the type described above and to devise such a method that the semiconductor elements were not brought close to each other as much as possible, in this embodiment, when one semiconductor element is crimped, Since it is thin, there is no need to apply a load or heat, and it is not necessary to prepare a dedicated heating / pressing tool or devise to keep the semiconductor element as close as possible.

(Embodiment 5) FIG. 5 shows Embodiment 5 of the present invention.
FIG. 2 is a cross-sectional view illustrating the semiconductor device in FIG. In FIG. 5, 9
Indicates a wiring pattern, and 10 indicates a solid copper foil.

The semiconductor device of the present embodiment is formed by pressing a plurality of semiconductor elements on the same substrate at once through a thermosetting resin, and is used there as shown in FIG. The printed board 3 is formed of a multilayer board, and is formed by forming a solid copper foil 10 on all of the layers except the wiring pattern 9 in the inner layer. When a plurality of semiconductor elements are pressed at the same time on the same substrate via a thermosetting resin, a sufficient load is applied to a thin semiconductor element, so that the pressure load tends to increase. On the other hand, when the pressure load increases, the amount of air bubbles generated in the thermosetting resin which deteriorates the mounting reliability tends to increase, and a means for reducing this is required. The generation of bubbles tends to occur due to a rapid rise in temperature of the thermosetting resin during heating, and as a means for preventing this, a method of increasing the thermal conductivity of the printed circuit board can be considered. By forming a copper foil having good thermal conductivity in the inner layer as in the present embodiment, the above-described effects can be obtained, and the reliability can be improved.

(Embodiment 6) In this embodiment, a plurality of semiconductor elements are formed on the same substrate via a thermosetting resin.
In a semiconductor device which is pressed at once, the hardness of the thermosetting resin is changed according to each semiconductor element. If multiple semiconductor elements with different numbers of bumps and chip sizes are to be pressed at once using thermosetting resin of the same hardness, the load applied to the bumps of each semiconductor element will inevitably differ. Although there is an optimum load range to be applied to the semiconductor device, the use of a thermosetting resin having a different hardness according to each semiconductor element allows the semiconductor device to fall within the optimum load range and improve reliability.

[0028]

As described above, in the semiconductor mounting apparatus according to the present invention, a plurality of semiconductor elements are provided on the same substrate via a thermosetting resin by independently providing a pressing tool and a heating tool. In the case of pressing all at once, heat can be applied after pressing to the thinner element, and before the connection between the semiconductor element and the printed circuit board is obtained, the thermosetting resin does not start to be cured, And the heat can be applied in a timely manner, and the connection between the semiconductor element and the printed circuit board can be reliably obtained.

[Brief description of the drawings]

FIG. 1 is a schematic process cross-sectional view showing a mounting process using a semiconductor mounting device according to a first embodiment.

FIG. 2 is a schematic sectional view showing a semiconductor mounting device according to a second embodiment.

FIG. 3 is a schematic sectional view showing a semiconductor mounting device according to a third embodiment;

FIG. 4 is a schematic process cross-sectional view illustrating a method for manufacturing a semiconductor device in Embodiment 4.

FIG. 5 is a schematic cross-sectional view illustrating a semiconductor device in Embodiment 5.

FIG. 6 is a schematic process sectional view showing a manufacturing process of a semiconductor device using a conventional semiconductor mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Thermosetting resin 3 Printed circuit board 4 Chip mounter 5 Pressure tool 6 Heating tool 7 Elastic body 8 Compression stage

Claims (6)

[Claims] 1. A method of mounting a plurality of semiconductor elements on a printed circuit board on which a thermosetting resin is formed, and applying a load and heat to the plurality of semiconductor elements at once using a tool from the plurality of semiconductor elements. A pressurizing tool and a heating tool are provided independently of each other, wherein the pressurizing tool and the heating tool are independently provided. 2. The semiconductor mounting apparatus according to claim 1, wherein an inclination correcting mechanism is provided on the pressing tool. 3. The semiconductor mounting apparatus according to claim 1, wherein an inclination correcting mechanism is provided on a stage on which the printed circuit board is placed. 4. A semiconductor device comprising a plurality of semiconductor elements pressed on a printed circuit board via a thermosetting resin,
A semiconductor mounting device wherein the thicknesses of the plurality of semiconductor elements are ranked, and mounting and crimping are performed in order from a thinner one. 5. A multilayer printed circuit board having a copper foil formed on all parts other than the wiring pattern of the inner layer and having improved thermal conductivity,
A semiconductor mounting device, wherein a plurality of semiconductor elements are simultaneously compression-bonded via a thermosetting resin. 6. In a semiconductor device in which a plurality of semiconductor elements having different numbers of bumps and chip sizes are pressure-bonded on a printed circuit board at a time via a thermosetting resin, a load applied to the bumps of each semiconductor element is reduced. A semiconductor mounting apparatus characterized in that the hardness of a thermosetting resin used for each of the semiconductor elements is adjusted to be the same.