JP2002340516A - Sensor apparatus for detecting fine shape object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain high adjustment accuracy to the characteristics of a sensor circuit, without increasing the manufacturing costs. SOLUTION: In the sensor apparatus for detecting a fine shape, objects the amount of electricity that changes according to a fine shape object to be detected is detected by a detection element 1, and sensor cells 11 for outputting a signal, in response to the amount of electricity from a sensor circuit 2, are arranged two-dimensionally for detecting the irregularities of the fine shape object. In the sensor apparatus, an offset circuit 8 for adjusting the detection sensitivity in the sensor circuit 2 is provided for each sensor circuit 2 of each sensor cell, and detection sensitivity is adjusted across the board for each sensor circuit 2, based on an offset control signal 8A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine shape detecting sensor device, and more particularly to a fine shape detecting sensor device for detecting fine irregularities such as a human fingerprint and an animal nose pattern.

[0002]

2. Description of the Related Art Many fingerprint sensors for detecting a fingerprint pattern have been proposed as applications of a fine shape detecting sensor device for detecting a fine shape of a detection target. For example, "ISSC
C DIGEST OF TECHNICAL PAPERS '' FEBRUARY 1998 pp.28
4-285. In this method, a sensor electrode is provided inside a two-dimensionally arranged cell (hereinafter, referred to as a sensor cell) on an LSI chip, and is formed between the sensor electrode and the skin of a finger touched via an insulating film. It detects the capacitance and detects the concave / convex pattern of the fingerprint. Since the value of the capacitance formed by the unevenness of the fingerprint is different, the unevenness of the fingerprint can be sensed by detecting the difference in the capacitance.

Further, there has been proposed a fine shape detection sensor device having means for individually adjusting the detection sensitivities of a plurality of sensor circuits (for example, see Japanese Patent Application No. 2000-171932). FIG. 8 shows a block diagram of a conventional fine shape detection sensor device. The sensor cell 11 includes a detection element 1, a sensor circuit 2, a calibration circuit 3, and a selection circuit 9.
It is composed of

[0004] The detecting element 1 is an element for converting a fine shape into an electric quantity. The sensor circuit 2 is a circuit that measures the amount of electricity of the detection element that changes according to the minute shape, converts it into an output signal 2A corresponding to the amount of electricity, and outputs the output signal 2A. The calibration circuit 3 is a circuit for individually adjusting (sensitivity adjustment) the detection sensitivity of the sensor circuit 2 of the sensor cell 11 for each sensor cell. The selection circuit 9 is a circuit that activates the sensor cell 11 based on the selection signal 9A.

When the detection sensitivity of the sensor circuit 2 of each sensor cell 11 is adjusted (hereinafter referred to as calibration), a reference sample having no unevenness is detected by the sensor as an object to be measured, or nothing is placed on the sensor surface. By performing the detection without detecting, the same measurement value is detected in each sensor cell. The output signal 2A from the sensor cell 11 is the data line D
The signal is input to the A / D conversion circuit 4 via L and output as a digital output signal 4A. The digital output signal 4A output from the A / D conversion circuit 4 is input to the signal processing circuit. The signal processing circuit compares the digital signal output from the A / D conversion circuit with the digital signal that should be output, and outputs a control signal 5A for adjusting the detection sensitivity of the sensor circuit 2.

The sensor cell 11 controls the calibration circuit 3 based on the control signal 5A input via the control line CL. Data line DL and control line CL
Is shared by a plurality of sensor cells 11, the sensor cells 11 are sequentially selected by a cell selection line WL, and the output signal 2A of the sensor cell 11 is sequentially input to the A / D conversion circuit 4, and the signal processing circuit 5 The calibration circuit 3 in the sensor cell is controlled.

This operation is repeated once or plural times for each sensor cell 11, thereby adjusting the detection sensitivity of each sensor circuit 2 and making the performance of each sensor cell uniform.
The calibration circuit 3 includes a load circuit 31 and a memory circuit 32. A control signal (adjustment parameter) 5A obtained by the signal processing circuit 5 is written and held in the memory circuit 32, and the data written in the memory circuit 32 controls the load circuit 31.

FIG. 9 shows a specific configuration example of a conventional sensor cell. Detection element 1 uses a capacitance C _f, which is formed between the finger surface 14 and the sensor electrode 1B is implemented by a sensor electrode 1B covered with a passivation film 15 is formed on the insulating layer 16, as an electrical quantity. The sensor circuit 2 is a PchM
It comprises an OSFET Q ₁ , Nch MOSFETs Q ₂ and Q ₃ , a constant current source I and a resistor R. C _p0 is a parasitic capacitance.

FIG. 10 shows an operation timing chart.
Before time T1, the sensor circuit control signal / PRE (PR
E bar) is the power supply voltage V _DDControlled by Q₁Is off and
When the sensor circuit control signal RE is controlled to a voltage of 0 V and Q_TwoBut
And node N₁Is 0V. At time T1,
PRE is controlled to 0V and Q₁Turns on, and node N₁Is V_DD
To rise. At time T2, the signals / PRE and
No. RE is V_DDIs controlled to Q ₁Turns off and Q_TwoBut
Turn on. Thereby, the capacitance C_fCharge stored in
Is discharged.

Therefore, the potential of the node N ₁ gradually decreases at a speed dependent on the capacitance C _f , and the time T
When a signal from the 2 to the time T3 has elapsed a predetermined time Delta] t RE is controlled to 0V to turn off the Q _2, is maintained potential V _DD - [Delta] V corresponding to the node N ₁ in the electrostatic capacitance C _f, from which Q ₃ Is output. Thus, the output signal 2A showing a voltage corresponding to the value of the capacitance C _f is output from the sensor circuit 2, by measuring the magnitude of the voltage signal, it is apparent irregularities of the skin surface.

The load circuit 31 of the calibration circuit 3
, N load elements (Z _{1 to} Z _n ) are individually connected to the sensor circuit 2 via switches. The memory circuit 32 is an n-bit memory circuit, and controls the conduction state of each switch of the load circuit 31 based on the written data. For the memory circuit 32, an SRAM or DRAM
Alternatively, it can be realized by a writable nonvolatile memory.

The switch can be realized by a MOSFET as shown in FIG. Here, NchMOS
Although the FET is shown, a PchMOSFET may be used, or both may be used. Examples of the load element include a capacitance element and a resistance element as shown in FIG. The capacitor can be realized by a PIP or MIM capacitor or a MOS capacitor as shown on the right side of FIG. The resistive element is a polysilicon resistor or FIG.
(B) It can be realized by a MOS resistor as shown on the right. Here, the NchMOSFET is shown, but the PchMOSFET
May be.

FIG. 13 shows a specific configuration example of another sensor cell of the conventional example. Here, a load element that can be controlled between an active state and an inactive state is used as the load circuit 31. FIG. 14 shows an example of a load element that can be controlled between an active state and an inactive state. By providing the calibration circuit 3 for each sensor circuit 2 as described above, even if the characteristics of the sensor circuit 2, that is, the detection sensitivity differs for each sensor cell due to process variation, the detection performance of each sensor cell can be made uniform. can do.

[0014]

However, in such a conventional fine shape detection sensor device, it is necessary to increase the number of load elements in order to improve the accuracy of adjusting the characteristics of the sensor circuit. Therefore, the scale of the memory circuit that controls the load element also increases. On the other hand, when trying to detect a fingerprint by the fine shape detection sensor device, the size of the sensor cell needs to be as small as about 50 μm square. For this reason, there is a limit in incorporating a large-scale memory circuit in a small sensor cell. The use of fine processing technology enables high integration, but increases the manufacturing cost. In addition, when the circuit scale in the sensor cell is large, the manufacturing yield decreases, and as a result, the manufacturing cost increases.

Therefore, as described above, the conventional fine shape detection sensor device has a problem that there is a limit in improving the adjustment accuracy of the characteristics of the sensor circuit while suppressing an increase in manufacturing cost. Further, when the number of circuits for adjusting the characteristics of the sensor circuit increases, the manufacturing yield decreases, and as a result, the manufacturing cost increases.
The present invention is to solve such a problem,
It is an object of the present invention to provide a fine shape detection sensor device having high adjustment accuracy for the characteristics of a sensor circuit without increasing the manufacturing cost.

[0016]

In order to achieve such an object, a fine shape detecting sensor device according to the present invention is provided.
It has a detection element that detects an electric quantity that changes according to the minute shape of the detection target, and a sensor circuit that measures the electric quantity detected by the detection element, converts it to an output signal corresponding to the electric quantity, and outputs the output signal. A fine shape detection sensor device that has a plurality of sensor cells and detects unevenness of a fine shape based on outputs of the two-dimensionally arranged sensor cells, wherein an offset circuit is provided for each sensor circuit of the sensor cells, and the offset circuit The detection sensitivity of the sensor circuit is uniformly adjusted by each sensor circuit.

For each offset circuit, the sensitivity may be adjusted based on the same offset control signal. A specific configuration of each offset circuit may include a load circuit having a load element whose connection to the sensor circuit is controlled based on the offset control signal. In addition, a plurality of bits are used as the offset control signal, and each offset circuit is constituted by a load circuit having a plurality of load elements whose connection to the sensor circuit is individually controlled based on the plurality of bits of the offset control signal. You may.

As for the offset control signal, a setting holding circuit may be provided to hold the offset control signal and supply it to each offset circuit. As a specific example of the load circuit, a switch for connecting the load element to the sensor circuit may be provided, and this switch may be controlled based on a control signal. Further, as the load element, an element that is controlled to be switched between an active state and an inactive state based on a control signal may be used.

[0019]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a use state of the fine shape detection sensor device according to the present invention. As shown in FIG. 1, the fine shape detection sensor device 10 is configured by a large number of sensor cells adjacent to each other.
It is composed of a large number of sensor cells 11 arranged two-dimensionally (in an array or grid). By bringing a detection target such as a finger 13 into contact with the sensor surface 12 of the fine shape detection sensor device 10, the detection target surface (here, the fingerprint 14
Are detected individually by the respective sensor cells 11, and two-dimensional data indicating a fine shape to be detected is output.

FIG. 2 is a block diagram showing a fine shape detecting sensor device according to one embodiment of the present invention. In this fine shape detection sensor device 10, each sensor cell 11 is arranged in a p × q (p, q) is an integer of 2 or more) lattice. The decoder DC outputs a selection signal to any of the cell selection lines WL1 to WLq based on the address signal AD. The cell selection lines WL1 to WLq are commonly connected to q sensor cells 11 arranged in the row among the sensor cells 11, and a selection signal is output from the decoder DC to the cell selection line WL. As a result, the q number of sensor cells 11 arranged in the row are simultaneously selected and brought into an operating state.

An A / D conversion circuit 4 and a signal processing circuit 5 are provided for each of the p sensor cells 11 arranged in the column direction, and the p sensor cells 11 arranged in each column are provided. Are the data lines DL1 to DL, respectively.
q are commonly connected. The A / D conversion circuit 4
The output signal output from the sensor cell 11 as an analog signal via the data line DL is subjected to A / D conversion, and a digital output signal 4A is output. The signal processing circuit 5 controls the control signal 5A for adjusting the detection sensitivity of the sensor cell 11 (sensitivity adjustment) based on the output signal of each sensor cell 11.
Is output. Here, a predetermined control signal 5 based on the digital output signal 4A output from the A / D conversion circuit 4 is used.
A is output.

In the fine shape detecting sensor device 10 having such a configuration, at the time of sensing operation for detecting a fine shape, each data line D is selected by a selection signal from the decoder DC.
One sensor cell 11 is simultaneously selected for each of L1 to DLq, and output signals from the q sensor cells 11 are input to the A / D conversion circuit 4 in parallel via the data lines DL1 to DLq, respectively, and Output signal 4
Output as A. Therefore, by sequentially changing the address signal AD, q sensor cells 11 are selected for each row, and the output signals of these sensor cells 11 are sequentially output from each A / D conversion circuit 4 as digital output signals 4A in row units. As a result, two-dimensional data indicating a fine shape is obtained.

In a calibration operation for adjusting the detection sensitivity of the sensor cells 11, q sensor cells 11 are simultaneously selected in row units in the same manner as in the above-described sensing operation. Then, based on the control signal 5A from the signal processing circuit 5, the respective detection sensitivities are individually adjusted. Therefore, by sequentially changing the address signal AD, adjustment is performed individually for each of the q sensor cells 11 selected for each row, and sequentially in parallel in row units.

On the other hand, the offset control line OL is commonly connected to all the sensor cells 11. Therefore, at the time of the offset operation for adjusting the detection sensitivity of the sensor circuit 2 of each sensor cell 11 collectively, the offset control signal 8A indicating the offset is simultaneously supplied to all the sensor cells 11 via the offset control line OL. , The detection sensitivity of all the sensor cells 11 is adjusted collectively.

Next, a first embodiment according to the present invention will be described with reference to FIG. FIG. 3 is a block diagram showing a fine shape detection sensor device according to the second embodiment. Each sensor cell 11 has the same configuration, and includes a detection element 1, a sensor circuit 2, a calibration circuit 3, an offset circuit 8, and a selection circuit 9. The detection element 1 is an element for converting a fine shape into an electric quantity 1A. The sensor circuit 2 is a circuit that measures an electric quantity 1A of a detection element that changes according to a minute shape, converts the measured electric quantity into an output signal 2A corresponding to the electric quantity (magnitude), and outputs the output signal 2A. The calibration circuit 3 is a circuit for individually adjusting the detection sensitivity of the sensor circuit 2.

The offset circuit 8 is a circuit that adjusts the detection sensitivity of all the sensor cells 1 in the sensor circuits 2 by a uniform correction amount (or correction rate) in each sensor circuit 2. The offset circuit 8 is provided with a load circuit 81 including one load element. The selection circuit 9 outputs a selection signal 9
This is a circuit for setting the sensor cell 11 into an operating state based on A.

When adjusting the detection sensitivity in the sensor circuit 2 of each sensor cell 11, that is, when performing calibration, first, a reference sample having no unevenness is detected by the sensor cell 11 as an object to be measured, or detection is performed without placing anything on the sensor cell. This causes each sensor cell 11 to detect the same measurement value. At this time, a signal output from the sensor cell 11 is input to the A / D conversion circuit 4 via the data line DL and output as a digital output signal 4A.

The digital output signal 4A output from the A / D conversion circuit 4 is also input to the signal processing circuit 5. The signal processing circuit 5 adjusts the detection sensitivity of the sensor circuit 2 by comparing the digital output signal 4A output from the A / D conversion circuit 4 with a digital output signal to be output originally (hereinafter, referred to as an expected value). Control signal (adjustment parameter) for
Get. Then, based on the control signal, the calibration circuit 3 of each sensor cell 11 is controlled using the control line CL.

The data line DL and the control line CL are shared by the sensor cells 11, and the sensor cells 11 are sequentially selected, and the output signal 2A of the sensor cell 11 is sequentially set to A.
The signal is input to the / D conversion circuit 4 and the signal processing circuit 5 controls the calibration circuit 3 in the sensor cell 11. By performing this operation once or a plurality of times for each sensor cell 11, the detection sensitivity of each sensor circuit 2 is adjusted, and the performance of each sensor cell 11 is made uniform.

In this case, the signal processing circuit 5 includes a comparison circuit 6 and a calibration reference signal generation circuit 7. The signal processing circuit 5 takes in the output signal 2A of the sensor circuit 2 of the selected sensor cell 11 and supplies it to one of the inputs of the comparison circuit 6. The comparison circuit 6 compares the output 2A of the sensor circuit 2 with the calibration reference value (expected value) output from the calibration reference signal generation circuit 7, and adjusts the control signal so as to eliminate the difference between the two. Output 5A.

The control signal 5A is input to and held in the memory circuit 32 of the sensor circuit 2, and is output to the load circuit 31. As a result, an arbitrary load element provided in the load circuit 31 is selected and connected to the sensor circuit 2, and the detection sensitivity of the sensor circuit 2 is increased by adjusting the input signal of the sensor circuit 2 or controlling the gain of the sensor circuit 2. Adjusted. The signal processing circuit 5 and the calibration circuit 3 have a function of suppressing a variation in the output of each sensor cell 11, and various known structures having such a function can be applied.

In this embodiment, the digital output signal 4A from the A / D conversion circuit 4 is used as an input signal to the signal processing circuit 5, and when a digital signal is input to the comparison circuit 6 as described above, A known digital comparison circuit is used as a comparison circuit, and a circuit that outputs a calibration reference value as a digital signal is used as the calibration reference signal generation circuit 7. Note that an analog comparison circuit may be used as the comparison circuit 6, in which case,
As an input signal to the signal processing circuit 5, an output signal 2A from the sensor cell 11 or a signal obtained by D / A conversion of a digital output signal 4A is used. As a calibration reference signal generation circuit 7, a calibration reference value is an analog signal. Is used.

When the detection sensitivity of each sensor cell 11 is adjusted, that is, calibration is performed, each sensor cell 1
The detection sensitivity of the sensor circuit 2 is uniformly adjusted in all the sensor cells 11 by using the offset circuit 8 provided in the device 1. The offset circuit 8 is provided with a load circuit 81 having a load element similarly to the calibration circuit 3, and is connected to the sensor circuit 2 in parallel with the calibration circuit 3.

Generally, the adjustment amount of the detection sensitivity using the offset circuit 8, that is, the offset amount is set to be larger than the minimum adjustment amount by the calibration circuit. Then, an offset operation is performed prior to the calibration operation. In the offset operation, first, an offset control signal 8A is supplied to each sensor cell 11 in parallel via an offset control line OL. As a result, the load element of the load circuit 81 is connected to the sensor circuit 2, and the detection sensitivity is uniformly adjusted by the offset amount. Accordingly, even when the detection sensitivity of the sensor circuit 2 of the sensor cell 11 is entirely deviated, the adjustment can be performed to some extent by using the offset amount, and the adjustment range of the calibration circuit 3 can be used effectively.

FIG. 4 shows a specific configuration example of the sensor cell.
The offset circuit 8 of the sensor cell includes a load element Z _O
A switch and the load circuit 81 is provided composed of, loading of the load elements Z _O is uniformly set in each sensor cell. Load elements Z _O is connected to the node N ₁ of the sensor circuit 2 through a switch, connected in parallel to the respective load elements Z ₁ to Z _n provided in the load circuit 31 of the calibration circuit 3 You.

In this case, the switches of the load circuit 81 are directly controlled to be turned on / off by the offset control signal 8A, so that the size of the memory circuit 32 in the calibration circuit 3 can be increased without increasing the load element. Can be increased. Therefore, without increasing the scale of the memory circuit, the detection sensitivity of the sensor circuit 2 can be adjusted by the addition of Z _O, that is, by the offset amount. If _one of Z _{1 to} Z _n inside the calibration circuit is deleted instead of adding Z _O , the memory inside the calibration circuit is maintained while maintaining the same accuracy of the detection sensitivity adjustment of the sensor circuit. The circuit scale can be reduced by one bit, which also has the effect of improving the yield of the fine shape detection sensor device.

Next, a second embodiment according to the present invention will be described with reference to FIG. FIG. 5 is a block diagram showing a fine shape detection sensor device according to the second embodiment. In the first embodiment (see FIG. 3), the case where the load element is turned on / off by the 1-bit offset control signal 8A has been described. However, in this embodiment, m bits (m is an integer of 2 or more) are used. ), A plurality of load elements are arbitrarily turned on / off using the offset control signal 8B, and the other configuration is the same as that of the first embodiment.

FIG. 6 shows a specific configuration example of the sensor cell.
The offset circuit 8 of the sensor cell includes a load circuit 82 including m load elements Z _{O1 to} Z _Om and switches provided for each of the load elements.
The load elements Z _{O1 to} Z _Om are connected to a sensor circuit 2 via a switch.
Of which is connected to the node N _1, it is parallel connected to each load element provided in the load circuit 31 of the calibration circuit 3.

In this case, each switch of the load circuit 82
On / off control is performed directly and individually by the offset control signal 8B, so that the number of load elements can be increased without increasing the scale of the memory circuit 32 inside the calibration circuit 3. Therefore, without increasing the scale of the memory circuit, the detection sensitivity of the sensor circuit 2 can be adjusted by an amount corresponding to the addition of Z _{O1 to} Z _Om, that is, the offset amount. Further, the offset amount can be selected stepwise as compared with the first embodiment, and the sensor circuit 2
, Flexible detection sensitivity adjustment can be realized.

Next, a third embodiment according to the present invention will be described with reference to FIG. FIG. 7 is a block diagram showing a fine shape detection sensor device according to the third embodiment. In the first embodiment (see FIG. 3), the case where the load element is turned on / off by the 1-bit offset control signal 8A has been described. However, in the present embodiment, the setting holding circuit 8C is provided and the offset setting is performed. The offset control signal 8A is held and output according to the signal 8D, and the other configuration is the same as that of the first embodiment.

As described above, the fine shape detection sensor device 10
Is provided with the setting holding circuit 8C, it is not necessary to hold the offset control signal 8A outside the fine shape detection sensor device 10, and the fine shape detection sensor device 1
Peripheral circuits required for 0 can be reduced. Note that the third embodiment can be applied not only to the first embodiment but also to the second embodiment, and the same operation and effect as described above can be obtained.

In the above, the case where the sensor cells 11 arranged in a lattice are selected in units of rows and operated in parallel has been described as an example, but the present invention is not limited to this. For example, the above embodiments can be applied to a case where the sensing operation and the calibration operation are performed by individually selecting the sensor cells 11 sequentially, or a case where the calibration operation is individually performed in each sensor cell. The same operation and effect can be obtained.

[0043]

As described above, the present invention measures the amount of electricity detected by the detecting element that detects the amount of electricity that changes according to the minute shape of the object to be detected, and outputs an output signal corresponding to the amount of electricity. An offset circuit is provided for each sensor circuit that converts and outputs the data. The offset circuit adjusts the detection sensitivity of the sensor circuit by a uniform correction amount in each sensor circuit. The accuracy of adjusting the characteristics of the circuit can be improved. When a calibration circuit for individually adjusting the sensitivity of the sensor circuit is provided in each sensor cell, the same number of load elements as the load elements in the offset circuit are controlled by the memory circuits in the calibration circuit. And the memory circuit scale can be reduced while maintaining the same adjustment accuracy.

Therefore, when the sensor device of the present invention is applied to the fine shape detecting sensor device, the characteristic of the sensor circuit can be reduced to about 50 μm square even without high integration using the fine processing technology. Can be increased to increase the number of load elements. Therefore, there is an effect that the adjustment accuracy of the characteristics of the sensor circuit can be improved while suppressing an increase in manufacturing cost due to the use of the fine processing technology. Further, when the number of load elements for adjusting the characteristics of the sensor circuit is the same, the memory circuit scale can be reduced, so that the production yield is improved and the production cost can be reduced.

[Brief description of the drawings]

FIG. 1 is an external view showing a fine shape detection sensor device according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a fine shape detection sensor device according to one embodiment of the present invention.

FIG. 3 is a block diagram showing a fine shape detection sensor device according to the first embodiment of the present invention.

FIG. 4 is a configuration example of a sensor cell according to the first embodiment of the present invention.

FIG. 5 is a block diagram showing a fine shape detection sensor device according to a second embodiment of the present invention.

FIG. 6 is a configuration example of a sensor cell according to a second embodiment of the present invention.

FIG. 7 is a block diagram showing a fine shape detection sensor device according to a third embodiment of the present invention.

FIG. 8 is a block diagram showing a conventional fine shape detection sensor device.

FIG. 9 is a configuration example of a conventional sensor cell.

FIG. 10 is a timing chart showing the operation of a sensor cell.

FIG. 11 is a configuration example of a switch.

FIG. 12 is a configuration example of a load element.

FIG. 13 is a configuration example of another conventional sensor cell.

FIG. 14 is another configuration example of the load element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Detection element, 1A ... Electric quantity, 1B ... Sensor electrode, 2 ...
Sensor circuit, 2A ... output signal, 3 ... calibration
Circuit, 31: load circuit, 32: memory circuit, 4: A / D
Conversion circuit, 4A: digital output signal, 5: signal processing cycle
Road, 5A: control signal, 6: comparison circuit, 7: reference signal generation
Circuit, 8 ... Offset circuit, 81, 82 ... Load circuit, 8
A, 8B: offset control signal, 8C: setting holding circuit,
8D: offset setting signal, 9: selection circuit, 9A: selection
Signal, 10: fine shape detection sensor device, 11: sensor cell
, 12 ... sensor surface, 13 ... finger, 14 ... finger surface, 15 ...
Passivation film, 16 ... insulating layer, WL, WL1 to WL
p: cell selection line, DL, DL1 to DLq: data line, C
L: control line, AD: address signal, Z₁~ Z_N... Load element
(For calibration), Z_O, Z_O1~ Z_Om… Load element
Child (for offset), V_DD... Power supply voltage, C_f… Detection volume
Quantity, C_p0... parasitic capacitance, R_a... resistance, I ... current source, Q ₁… P
chMOSFET, Q_Two, Q_Three... Nch MOSFET, R
E, / PRE: sensor circuit control signal, N₁…node.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Katsuyuki Machida, Inventor 2-3-1 Otemachi, Chiyoda-ku, Tokyo Inside Nippon Telegraph and Telephone Corporation (72) Inventor Bura Kuraki 2-chome, Otemachi 2-chome, Chiyoda-ku, Tokyo No. 1 Inside Nippon Telegraph and Telephone Corporation (72) Inventor Toshishige Shimamura 2-3-1 Otemachi, Chiyoda-ku, Tokyo F-term within Nippon Telegraph and Telephone Corporation (reference) 2F063 AA43 BA29 DA02 DA05 DD07 HA04 4C038 FF00 FG00 VB13 5B047 AA25 AB02 BB04 DA01

Claims (7)

[Claims] 1. A detecting element for detecting an electric quantity that changes according to a fine shape of a detection target, and an electric quantity detected by the detecting element is measured, converted into an output signal corresponding to the electric quantity, and output. A fine shape detection sensor device that has a plurality of sensor cells having a sensor circuit and detects the fine shape irregularities based on the outputs of the two-dimensionally arranged sensor cells, and is provided for each sensor circuit of the sensor cell. And an offset circuit for uniformly adjusting the detection sensitivity of the sensor circuit in each sensor circuit. 2. The fine shape detection sensor device according to claim 1, wherein each of the offset circuits adjusts the sensitivity based on the same offset control signal. 3. The fine shape detection sensor device according to claim 2, wherein each of the offset circuits comprises a load circuit having a load element whose connection to the sensor circuit is controlled based on the offset control signal. And a fine shape detection sensor device. 4. The fine shape detection sensor device according to claim 2, wherein the offset control signal comprises a signal of a plurality of bits, and each of the offset circuits sends a signal to the sensor circuit based on the offset control signal of the plurality of bits. A fine shape detection sensor device characterized by comprising a load circuit having a plurality of load elements each of which connection is individually controlled. 5. The fine shape detection sensor device according to claim 2, further comprising a setting holding circuit that holds the offset control signal and supplies the offset control signal to each of the offset circuits. . 6. The fine shape detection sensor device according to claim 3, wherein the load circuit has a switch for connecting the load element to the sensor circuit, and the switch is controlled based on the control signal. A fine shape detection sensor device, characterized in that: 7. The fine shape detection sensor device according to claim 3, wherein the load element is an element that is controlled to be switched between an active state and an inactive state based on the control signal. Fine shape detection sensor device.