JP2002324109A - Enhancing system for operating rate of equipment, monitor, supply apparatus for component, enhancing method for the rate, recording medium and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an enhancing system for operating rate, monitor, supply apparatus for component, enhancing method for the rate, recording medium and program capable of enhancing operating rates of manufacturing facilities of semiconductor equipment 10 and the like without reducing the rates and also performing such as maintenance and repairs. SOLUTION: In the system, semiconductor equipment 10 can monitor signs of failures or failures of the equipment 10 by bringing an attendant system 20 into management of the equipment 10. Accordingly, the maintenance can be performed in advance in a failure predicted state in which perfect suspension has not occurred yet and it is still possible to manufacture any number of the other equipment 10 is spite of the fact that the signs of failures of the equipment 10 have started to appear. Even in the event of failure, prompt repair can be performed. Moreover, by concentrating data of the equipment 10 to a database 16, the maintenance can be performed without increasing traffic of a host network 40 in amount unnecessarily.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus operation rate improving system, a monitor, a component supply apparatus, an apparatus operation rate improving method, a recording medium, and a program, and more particularly, to an apparatus operation for improving the operation rate of at least one apparatus. The present invention relates to a rate improvement system, a monitor apparatus for monitoring the operation rate of the apparatus, a component supply apparatus for supplying parts of the apparatus arranged from a factory system for managing the operation of the apparatus, an apparatus operation rate improvement method, a recording medium, and a program.

[0002]

2. Description of the Related Art Heretofore, in an apparatus which is continuously operated, for example, in a semiconductor manufacturing apparatus, the management of the apparatus has been performed manually. The manual management of the device includes maintenance performed before the device fails and repair performed after the device fails. The maintenance includes daily inspection of the equipment and adjustment of equipment setting parameters to manage the condition of the equipment.The repair includes assistance in the event that the equipment does not operate due to a minor failure. is there. In each case, maintenance or repair is performed by a human being through a controller or the like attached to the device while making judgments one by one.

FIG. 12 shows an outline of a conventional apparatus management method using a semiconductor manufacturing apparatus as an example. In FIG.
Reference numeral 0 denotes a semiconductor manufacturing apparatus to be managed, 90 denotes a factory system that mainly performs production progress management and the like, 40 denotes a host network connecting the semiconductor manufacturing apparatus 10 and the factory system 90, and 71 denotes a host network. The operator terminal used to operate the semiconductor manufacturing apparatus 10, 70 is an operator who operates the operator terminal 71, 81 is connected to the semiconductor manufacturing apparatus 10,
An administrator terminal used to manage the semiconductor manufacturing apparatus 10; 80, an administrator operating the administrator terminal 81;
Reference numeral 0 denotes a parts supplier (hereinafter, referred to as a “supplier”) that supplies parts of the apparatus requested by the administrator 80 by telephone or FAX. Reference numeral 14 denotes a PIO terminal for inputting / outputting a parallel signal for exchanging a workpiece for transporting the work of the semiconductor manufacturing apparatus 10, and 12 denotes an operation terminal for displaying an apparatus state of the semiconductor apparatus 10 by voice or image to an operator. Station Co., Ltd.
ntroller: STC). The factory system 90 includes a database DB30 for accumulating information related to product manufacturing and results, and a manufacturing and execution system (manufa) for managing the progress of product production.
cturing Execution System (MES) 32, a material control system (Ma) that issues product delivery instructions
terial Control System (MCS) 34, Advanced Process Control (APC) 36 for managing product production conditions, and Carrier Manageme
nt System: CMS) 38.

As shown in FIG. 12, a manager 80 manages a semiconductor manufacturing apparatus 10 by using a manager terminal 81. The maintenance of the semiconductor manufacturing apparatus 10 is performed by scheduled maintenance in which maintenance is periodically performed, and the interval of the scheduled maintenance is artificially determined, for example, 30 days. When performing maintenance, the operation of the semiconductor manufacturing apparatus 10 has been stopped.

[0005] On the other hand, when a failure occurs, it is usual to first identify the cause of the failure, take measures such as repair based on the identified cause of the failure, and confirm the result of the taken measure. Is the way. The cause of the failure of the semiconductor manufacturing apparatus 10 was manually identified by the administrator 80 or the like after the failure occurred. Thereafter, the administrator 80 issues an instruction necessary for the countermeasure to the operator 7 via the host network 40.
0 or ordering necessary parts from the supplier 50 through the dedicated line 13 for ordering.

[0006] All data of the apparatus 10 has been sent to the factory system 90 via the host network 40. However, among the transmitted data, the actual data required on the factory system 90 side is extremely small.

[0007]

As described above, since the planned maintenance is conventionally used, the operation of the semiconductor manufacturing apparatus 10 must be stopped even if the semiconductor manufacturing apparatus 10 is not out of order. As a result, there is a problem that the operation rate of the semiconductor manufacturing apparatus 10 is reduced.

[0008] When the semiconductor manufacturing apparatus 10 breaks down, the cause of the failure has conventionally been manually identified, so that it was not possible to efficiently access various kinds of information, and much time was required until the cause of the failure was identified. Further, since the semiconductor manufacturing apparatus 10 ordered necessary parts after the failure,
For example, parts that are often not in stock on the supplier 50 side, such as expensive parts, took a long time from order placement to delivery. Since the operation of the semiconductor manufacturing apparatus 10 must be stopped until such components are delivered, there is a problem that the operation rate of the semiconductor manufacturing apparatus 10 is reduced.

Since a large amount of practically unnecessary data is sent from the device 10 to the factory system 90, there is a problem that the traffic volume of the host network 40 is unnecessarily increased.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-mentioned problem, and to perform maintenance and repair for further improving the operation rate of the manufacturing equipment such as the semiconductor manufacturing apparatus 10 without lowering the operation rate. It is an object of the present invention to provide an apparatus operation rate improvement system, a monitor device, a component supply apparatus, an apparatus operation rate improvement method, a recording medium, and a program that can perform the above.

A further object of the present invention is to provide a system for improving the operation rate of a device, a monitor device, a component supply device, a method for improving the operation ratio of a device, a recording medium and a program which can prevent the traffic volume of the host network 40 from being unnecessarily increased. To provide.

[0012]

According to an aspect of the present invention, there is provided an apparatus operating rate improving system comprising: a monitoring apparatus for monitoring an operating rate of at least one apparatus; and a database for recording data transmitted from the apparatus. A rate improving system, wherein the monitor device collects data from the device and records the data in a database; primary diagnostic means for diagnosing the status of the device based on the data recorded in the database; and the primary diagnostic device. If an abnormality is detected by the means,
Secondary diagnosis means for diagnosing the cause of the abnormality and proposing a coping method candidate; and component allocation policy proposing means for proposing a component allocation policy based on the coping method proposed by the secondary diagnosis means. It is characterized by.

[0013] In the apparatus utilization rate improving system of the present invention, the operation of the apparatus is managed based on the data recorded in the database, and based on the component allocation policy proposed by the component allocation policy proposing means. A factory system for arranging parts can be further provided.

Here, in the apparatus operating rate improving system according to the present invention, it is possible to further comprise a parts supply apparatus for supplying parts arranged from the factory system according to a coping method.

Here, in the apparatus operating rate improving system of the present invention, the primary diagnostic means detects an abnormality of the apparatus when data recorded in the database changes in a time series having a predetermined value. be able to.

Here, in the apparatus operating rate improving system according to the present invention, when the data recorded in the database indicates a fluctuation of a predetermined apparatus among a plurality of apparatuses, the primary diagnostic means determines an abnormality of the predetermined apparatus. Can be detected.

Here, in the apparatus operating rate improving system of the present invention, when the abnormality detected by the primary diagnosis section is a sign of a failure of the apparatus, the secondary diagnosis means prevents the failure of the apparatus from occurring. A method can be determined.

Here, in the apparatus operating rate improving system according to the present invention, when the abnormality detected by the primary diagnostic section is a failure of the device, the secondary diagnostic means determines a coping method for repairing the failure of the device. can do.

A monitor device according to the present invention is a monitor device in an apparatus operation rate improvement system for improving the operation rate of at least one apparatus, wherein a collection means for recording data collected from the apparatus in a database, and Primary diagnostic means for diagnosing the status of the device based on the recorded data, and secondary diagnostic means for diagnosing the cause of the abnormality and proposing a candidate for a coping method when an abnormality is detected by the primary diagnostic means, And a component allocation policy proposing means for proposing a component allocation policy based on the coping method proposed by the secondary diagnosis means.

Here, in the monitor device of the present invention,
The primary diagnostic means can detect an abnormality of the apparatus when data recorded in the database fluctuates in a time series having a predetermined value.

Here, in the monitor device of the present invention,
The primary diagnostic means can detect an abnormality of the predetermined device when the record data indicates a fluctuation of the predetermined device among the plurality of devices in the database.

Here, in the monitor device of the present invention,
When the abnormality detected by the primary diagnosis unit is a sign of a device failure, the secondary diagnosis unit can determine a countermeasure for preventing the device failure before it occurs.

Here, in the monitor device of the present invention,
When the abnormality detected by the primary diagnostic unit is a device failure, the secondary diagnostic unit can determine a countermeasure for repairing the device failure.

According to the present invention, at least one
A part proposed and arranged according to a predetermined part allocation policy is supplied from an apparatus operating rate improving system for improving the operating rate of one apparatus.

An apparatus operating rate improving method according to the present invention is an apparatus operating rate improving method for improving the operating rate of at least one apparatus, comprising: a collecting step of collecting data from the apparatus and recording the data in a database; A primary diagnosis step of diagnosing the state of the device based on the data, and a secondary diagnosis step of diagnosing the cause of the abnormality and proposing a candidate for a coping method when an abnormality is detected by the primary diagnosis step, A component allocation policy proposing step of proposing a component allocation policy based on the coping method proposed by the secondary diagnosis step.

A recording medium according to the present invention is a computer-readable recording medium on which a program for causing a computer to execute an apparatus availability improvement method for improving the availability of at least one apparatus is recorded. The rate improving method includes a collecting step of collecting data from the apparatus and recording the data in a database, a primary diagnosis step of diagnosing the state of the apparatus based on the data recorded in the database, and an abnormality detected by the primary diagnosis step. In the case, there is provided a secondary diagnosis step of diagnosing the cause of the abnormality and proposing a candidate for a coping method, and a component allocation policy proposing step of proposing a component allocation policy based on the coping method proposed by the secondary diagnosis step. It is characterized by having.

[0027] A program according to the present invention is a program for causing a computer to execute an apparatus availability improvement method for improving the availability of at least one apparatus, and the apparatus availability improvement method collects data from the apparatus. A collecting step of recording the data in the database, a primary diagnostic step of diagnosing the status of the apparatus based on the data recorded in the database, and, when an abnormality is detected in the primary diagnostic step, diagnosing a cause of the abnormality and taking a countermeasure. The method is characterized by comprising a secondary diagnosis step of proposing a method candidate, and a component allocation policy proposing step of proposing a component allocation policy based on the coping method proposed by the secondary diagnosis step.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings.

Embodiment 1 FIG. 1 shows an example of the configuration of the system for improving the operation rate of an apparatus according to Embodiment 1 of the present invention. In FIG. 1, reference numeral 10 denotes a semiconductor manufacturing apparatus to be managed, reference numeral 14 denotes a PIO terminal for performing parallel signal input / output for exchanging work for carrying the work of the semiconductor manufacturing apparatus 10, and reference numeral 12 denotes an apparatus state of the semiconductor apparatus 10. Controller as an operation terminal for displaying voices and images to the operator
STC). In the following, for convenience of explanation, it is assumed that the number of semiconductor manufacturing apparatuses 10 is one. However, it is needless to say that the system availability improvement system and the like of the present invention can be applied to the case where there are a plurality of semiconductor manufacturing apparatuses 10. It is.

In FIG. 1, reference numeral 20 denotes an auxiliary system (EES or monitor) connected to the semiconductor manufacturing apparatus 10 for managing the semiconductor manufacturing apparatus 10, and 16 denotes an auxiliary system connected to the auxiliary system 20.
A database 22 in which data such as 0 is intensively recorded. Reference numeral 22 denotes an advanced equipment control connected to the auxiliary system 20.
: AEC), 24 is connected to the incidental system 20, and analyzes a data sent from the semiconductor manufacturing apparatus 10 via the incidental system 20.
tection System: FDC), 26 is a substrate tracking system (Substrate Tr) connected to the auxiliary system 20.
acking System: STS). The FDC 24 can be connected between the semiconductor manufacturing apparatus 10 and the auxiliary system 20. In this case, the FDC 24 is
Can be directly read, and the result of the fault analysis can be sent to the auxiliary system 20.

Numeral 90 is a factory system for mainly managing the progress of production, etc., 40 is a host network connecting the semiconductor manufacturing apparatus 10 and the factory system 90, 71 is connected to the host network 40, and
0, an operator terminal used to operate 0
Is an operator who operates the operator terminal 71.
The factory system 90 includes a database DB30, MES32, M
It is composed of CS34, APC36 and CMS38. Reference numeral 42 denotes an EES network that connects the auxiliary system 20 to the factory system 90 via the bridge 45.

As described above, the device 1 is stored in the database 16.
0 can be centrally recorded, so that a large amount of virtually unnecessary data is not sent from the device 10 to the factory system 90, and the traffic volume of the host network 40 is not unnecessarily increased. Can be completed. Further, by using the bridge 45, the factory system 90 can refer to necessary data from the database 16, so that various operations on the factory system 90 side can be efficiently promoted. For example, when there is a period during which the apparatus 10 is not operating, the number of days behind the consumption of the amount of the material to be used can be obtained from the database 16. Therefore, the operation of quantitative maintenance on the factory system 90 side can be easily performed. Through the bridge 45 as described above, the cooperation between the EES network 42 and the factory system 90 can be advanced.

The EES network 42 is connected to the supplier 50 via the firewall 28 and the Internet 44.
Is connected to On the supplier 50 side, there is a component supply device 100 that performs processes such as receiving or supplying components.

Next, the function of the device operating rate improving system according to the first embodiment of the present invention will be described. FIG. 2 and FIG. 3 are flowcharts of the maintenance support function among the management functions performed by the device availability improvement system according to the first embodiment of the present invention. 2 and FIG. 3 have the same reference numerals as in FIG. 2 and 3 are a series of flowcharts, which are divided into two for the convenience of the drawings. In the following description, "maintenance"
This means that the semiconductor manufacturing apparatus 10 is regularly maintained in a state in which no failure has occurred, and signs of failure have begun to appear, but a few more can be manufactured in a failure expected state before a complete stoppage. Shall be included. “Failure” refers to a state in which the semiconductor manufacturing apparatus 10 has completely stopped.

As shown in FIG.
Collecting means collects detailed data from the semiconductor manufacturing apparatus 10 and records it in the database 16 (step S10,
S14). Here, detailed data recorded in the database 16 includes information on various sensors (not shown) connected to the semiconductor manufacturing apparatus 10, and includes a vacuum gauge lead of a vacuum device (not shown) constituting the semiconductor manufacturing apparatus 10. Out, gas partial pressure readout, thermocouple readout of furnace (not shown), integrated power readout of sputter device (not shown),
Exposure meter readout of exposure device (not shown), liquid source weighing scale readout of diffusion furnace (not shown), RF output readout of high frequency device (not shown), pure water resistivity lead of cleaning device (not shown) Out, a flood gun current value readout of an ion implanter (not shown), and other ON / OFF information of limit switches. In addition to the above-described sensor information, detailed data includes recorded data of the trace sampling frequency itself for data collection. Conventionally, the above-mentioned data has been all transmitted from the semiconductor manufacturing apparatus 10 to the factory system 90 side. In the embodiment of the present invention, these data can be collected in the database 16 and intensively recorded, and various diagnosis results can be transmitted to the factory system 90 as described later. For this reason, tasks can be appropriately shared in the entire factory including the factory system 90 and the auxiliary system 20.

Further, the collecting means collects inspection data from the factory system 90 (step S12). The inspection data includes process evaluation data (macro data) from the MES32 system, film thickness, etch rate, specific resistance value of conductive film, fail bit map information, information on particles, and data on set values of various devices. .

Next, the primary diagnosis means of the auxiliary system 20 performs a primary diagnosis for diagnosing the condition of the semiconductor manufacturing apparatus 10 based on the above detailed data input from the semiconductor manufacturing apparatus 10 (step S24). For the primary diagnosis, information in the device sent in real time from the semiconductor manufacturing device 10 can also be used (step S20). The primary diagnostic means performs a process of detecting an abnormality of the data when the data input from the semiconductor manufacturing apparatus 10 changes in a time series having a predetermined value. For example, assuming that the sensor information is output when the fluctuation data becomes equal to or more than a predetermined threshold value, if the time series interval of the output fluctuates differently than normal, an abnormality occurs in the semiconductor manufacturing apparatus 10. The occurrence can be detected. In this case, an abnormality can be found by recording the time series of the stationary temporal change and comparing the time series of the input data with the temporal series of the stationary temporal change. For the comparison of the time series, various pattern matching algorithms can be used.
The time series of the change over time can be expressed as a character string to perform pattern matching, or can be expressed as a two-dimensional figure to perform matching in an image space. Since the data of the semiconductor manufacturing apparatus 10 can be centrally recorded in the database 16 with a large amount, a wide range, and a high time resolution, detailed data such as a result of performing a complicated process such as the above-described pattern matching can be obtained. The result of the primary diagnosis can be obtained.

When an abnormality is detected by the primary diagnostic means, a warning is issued (step S26).
The secondary diagnosis unit performs a secondary diagnosis for diagnosing the cause of the abnormality and determining a coping method (step S30). Embodiment 1
In order to handle the maintenance function, it is assumed that the abnormality detected by the primary diagnosis indicates a sign of a failure of the apparatus, and the countermeasure is to prevent the failure of the semiconductor manufacturing apparatus 10 before it occurs. The secondary diagnosis determines whether the abnormality is known or unknown. In order to make this determination, information on past cases can be obtained from the database 16. Past cases are recorded according to the case where the signs of abnormality are chronological and the case where the signs are due to the device.
For example, in the case of time-series data, time-series pattern data and possible abnormalities can be recorded in pairs in a table format or the like. By comparing the time series pattern data indicating the sign of the abnormality obtained in the primary diagnosis with past cases, it is possible to determine whether the sign of the abnormality is known or unknown.

Further, it is determined whether the abnormality is a planned one or a sudden one that is expected to occur in the past case. To make this determination, the database 1
6 can obtain history data and the like. The history data is also recorded according to the case where the sign of the abnormality is chronological and the case where the sign is due to the device. For example, in the case of a time-series pattern, time-series pattern data can be recorded. By performing, for example, a time series analysis from the time series pattern data, it is possible to determine whether or not the sign of the abnormality is predictable.

After making the above determination, the secondary diagnosis means proposes a maintenance item candidate. The maintenance items are prepared in the form of a table in advance in accordance with the above-mentioned known or unknown, planned, or sudden abnormality signs. By using this table, it is possible to propose maintenance item candidates according to the signs of abnormality. The maintenance items include, for example, parts to be replaced. The symptoms of the abnormality and the corresponding maintenance items can be stored in a rule-based format, and a candidate for the maintenance items can be proposed by using an appropriate inference engine. In the above description, the secondary diagnosis means proposes a maintenance item candidate. However, when there is only one candidate, it can be regarded that the maintenance item is substantially determined.

After the secondary diagnosis, the component allocation policy proposing means proposes a component allocation policy based on the maintenance item candidates proposed by the secondary diagnosis (step S42). At this stage, if necessary, it is possible to request the factory operator 70 for part allocation support (step S40). When the part allocation policy is determined, the auxiliary system 20 requests the factory system 90 for maintenance scheduling and ordering of parts.
The factory system 90 requests an accounting system (not shown) in the factory system 90 to order a desired part in accordance with the progress management of the lot or the like (step S52). This accounting system actually orders parts from an external supplier 50. At this stage, it is also possible to request the factory operator 70 for maintenance scheduling support as needed (step S).
50). As described above, the factory system 90 can obtain data and the like necessary for maintenance scheduling from the auxiliary system 20 at an early stage (a stage of a failure expected state). That is, maintenance can be performed while cooperating between the factory system 90 and the auxiliary system 20. As a scheduling method, for example, PERT (Program Evaluati
on and Review Technique) can be used.

Thereafter, the auxiliary system 20 checks the parts delivered from the external supplier 50 (step S6).
2) Inform the operator 70.

As shown in FIG. 3, a maintenance procedure guide is sent from the external supplier 50 to the auxiliary system 20 and the operator 70 (step S70). Operator 7
0 performs a repair including a post-check (step S7).
2). The ancillary system 20 registers a maintenance history, for example, information on the details of the maintenance, used components, and the like as past cases in the database 16 (step S80). Finally, the factory system 90 also registers a maintenance history including an overview of maintenance and inspection results (step S90).

Collection of detailed data described above (step S
A specific example ranging from 14) to the proposal of the component allocation policy (step S42) will be described. The data collected in the detailed data collection (step S14) includes output data of various sensors necessary for controlling itself while the semiconductor manufacturing apparatus 10 is operating. Alternatively, there are a control input value for moving each actuator (not shown) and an execution program for processing a work. In the primary diagnosis (step S24), these data are constantly monitored, and if there is a change, the change is detected. It is determined whether the semiconductor manufacturing apparatus 10 is abnormal with reference to the past history from the detected fluctuation. In the secondary diagnosis (step S30), the primary diagnosis (step S24)
When it is determined that the response is abnormal, the response method is determined with reference to the past history and the database of the response method. In the proposal of the component allocation policy (step S42), when it is determined in the secondary diagnosis (step S30) that component replacement or the like is necessary, which component should be purchased from which vendor (supplier 50), etc. Make a judgment.

In the above description, it is assumed for convenience that the number of semiconductor manufacturing apparatuses 10 is one. However, the system for improving the operation rate of the apparatus of the present invention is similarly applied to the case where there are a plurality of semiconductor manufacturing apparatuses 10. be able to. Hereinafter, a brief description will be given of a case where there are a plurality of semiconductor manufacturing apparatuses 10. FIGS. 4 and 5 show a flowchart of the maintenance function among the management functions performed by the apparatus availability improvement system when a plurality of semiconductor manufacturing apparatuses exist in the first embodiment of the present invention. 4 and FIG. 5 have the same reference numerals as in FIG. 2 and FIG. FIG.
5 and FIG. 5, reference numerals 10a and 10b indicate a plurality of semiconductor manufacturing apparatuses. Although only two semiconductor manufacturing apparatuses 10a and 10b are shown in FIGS. 4 and 5, this is for convenience of explanation, and the number is not limited to two.

As shown in FIG. 4 and FIG. 5, the collecting means of the auxiliary system 20 includes the semiconductor manufacturing apparatuses 10a and 10b.
Detailed data is collected from the data and the like and recorded in the database 16 (steps S10a, S10b, S14). Further, the collecting means collects inspection data from the factory system 90 (Step S12). Next, the primary diagnosis means of the auxiliary system 20 performs a primary diagnosis for diagnosing the situation of the semiconductor manufacturing apparatuses 10a, 10b, etc., based on the above detailed data input from the semiconductor manufacturing apparatuses 10a, 10b, etc. (step S24). ). In this primary diagnosis, the semiconductor manufacturing apparatus 1
0a, 10b, etc., information in the device transmitted in real time can also be used (steps S20a, S20).
b). The primary diagnostic means includes semiconductor manufacturing apparatuses 10a, 10b
If the data input from the device fluctuates in a time series in which it takes a predetermined value, a process for detecting an abnormality of the device is performed. As another example of the primary diagnosis, a plurality of semiconductor manufacturing apparatuses 10a,
10b, etc., when the data input to the auxiliary system 20 indicates a fluctuation of a predetermined semiconductor manufacturing apparatus 10a in a series of a plurality of semiconductor manufacturing apparatuses 10a, 10b, etc., the predetermined semiconductor manufacturing apparatus 10a, etc. Can be detected. In this case, the same type of semiconductor manufacturing apparatus 10
Normal data is recorded for a and the like, and an abnormality can be found by comparing the input data with the normal data.

When an abnormality is detected by the primary diagnostic means, a warning is issued (step S26).
The secondary diagnosis unit performs a secondary diagnosis for diagnosing the cause of the abnormality and determining a coping method (step S30). This countermeasure is to prevent a failure of the semiconductor manufacturing apparatuses 10a, 10b and the like. Next, the secondary diagnosis unit proposes a candidate for the maintenance item. After the secondary diagnosis, the component allocation policy proposal unit proposes a component allocation policy based on the maintenance item candidates proposed by the secondary diagnosis (step S42). Hereinafter, since it is the same as that in the case of one semiconductor manufacturing apparatus, description is omitted.

As described above, according to the first embodiment, by causing the auxiliary system 20 to manage the semiconductor manufacturing apparatus 10, it is possible to monitor a sign of a failure of the semiconductor manufacturing apparatus 10. For this reason, signs of failure have begun to appear in the semiconductor manufacturing apparatus 10, but it is possible to set up maintenance scheduling in advance in a failure expectation state before a complete stoppage in which a few more can be manufactured. Parts can be ordered. For this reason, the semiconductor manufacturing apparatus 10
Maintenance that does not reduce the operation rate of the vehicle without reducing the operation rate. Similarly, even when there are a plurality of semiconductor manufacturing apparatuses 10, maintenance can be performed to maintain and improve the operation rate of the semiconductor manufacturing apparatuses 10a and 10b without decreasing the operation rate.

Embodiment 2 FIG. 6 and FIG. 7 are flowcharts of the maintenance support function in the management function performed by the device availability improvement system according to the second embodiment of the present invention.
The second embodiment is different from the first embodiment in that the component supply device 100 of the supplier 50 exists. Therefore, in the following description, only the parts related to the component supply device 100 will be described. Other configurations are the same as those in the first embodiment, and thus description thereof is omitted. 6 and 7, the same reference numerals as in FIGS. 2 and 3 denote the same elements, and a description thereof will not be repeated. FIG. 6 and FIG. 7 are a series of flowcharts, which are divided into two for the convenience of the drawings.

In FIG. 6 and FIG.
0, the semiconductor manufacturing apparatus 10, the auxiliary system 20, and the factory system 90 show the user 52 side to which parts are supplied,
The right side of the supplier 50 supplies components to the component supply device 100. The user 52 side and the supplier 50 side are separated by a broken line, and the portion of the broken line is the EES network 42 and the firewall 28 shown in FIG.
And the Internet 44.

As shown in FIG.
The primary diagnosis means performs a primary diagnosis for diagnosing the status of the semiconductor manufacturing apparatus 10 based on the detailed data (see Embodiment 1) input from the semiconductor manufacturing apparatus 10 (Step S24). The data sent from the component supply device 100 on the supplier 50 side can also be used for this primary diagnosis.

If an abnormality is detected by the primary diagnosis means, a warning is issued (step S26).
The secondary diagnosis unit performs a secondary diagnosis for diagnosing the cause of the abnormality and determining a coping method (step S30). The secondary diagnosis determines whether the abnormality is known or unknown. In order to make this determination, information on past cases can also be obtained from the component supply device 100 (step S32).

Further, the secondary diagnostic means determines whether the abnormality is a planned one or a sudden one which is expected to occur in the past case. To make this decision,
History data and the like can also be obtained from the component supply device 100 (step S36).

After making the above determination, the secondary diagnostic means proposes a candidate for a maintenance item. This proposal is based on the parts feeder 10
0 is sent as a warning (step S34). In order to support the secondary diagnosis, for example, if the sign of the abnormality is unknown, the component supply apparatus 100 investigates the cause (step S39).

After the secondary diagnosis, real-time data indicating a sign of abnormality is sent to the component supply device 100 (step S38). The component allocation policy proposal means proposes a component allocation policy based on the maintenance item candidates proposed by the secondary diagnosis,
The component supply device 100 is made to arrange components (step S42). Specifically, the inventory is checked with the component supply device 100 (step S46), and the answer of the inventory / delivery date is obtained (step S48). When a desired policy is determined from the proposed component allocation policy, the auxiliary system 20
Notifies the factory system 90 of the maintenance scheduling and the order of the parts (step S52). Factory system 9
0 requests the desired component from the component supply device 100 (step S54). Thereafter, the component is sent out from the component supply device 100 at an appropriate timing (step S60) and delivered (step S61). The auxiliary system 20 checks the delivered parts (step S62), and the operator 70
Tell

As shown in FIG. 7, the component supply device 10
From 0, a maintenance procedure guide is sent to the operator 70 (step S70). The operator 70 performs repair including post-check (step S72). The ancillary system 20 registers a maintenance history, for example, information on the details of the maintenance, used components, and the like (step S80). This information is stored in the parts supply device 1
00 may be registered. As a result, in the above-described step S32 or S36, the component supply device 1
00 can provide desired past data to the auxiliary system 20. Finally, the factory system 90 also registers a maintenance history including a summary of maintenance and inspection results (step S).
90).

As described above, according to the second embodiment, by providing the component supply device 100 in addition to the first embodiment, a desired component ordered from the factory system 90 can be quickly supplied. Maintenance without lowering the operation rate of the manufacturing apparatus 10 can be performed.

Embodiment 3 FIG. FIGS. 8 and 9 show a flowchart of a failure handling function among the management functions performed by the device availability improvement system according to the third embodiment of the present invention.
The difference between the failure handling function according to the third embodiment and the maintenance handling function according to the first embodiment is that the abnormality detected by the primary diagnosis means is a complete failure of the device, and a countermeasure for repairing the failure of the device is determined. On the point. Since FIG. 8 and FIG. 9 are flowcharts similar to FIG. 2 and FIG. 3 in the first embodiment, the description of the same parts as in the first embodiment will be omitted.

As shown in FIG. 8, the procedure up to the primary diagnosis (step S24) is performed in the same manner as in the first embodiment. In the third embodiment, after the primary diagnosis, the primary diagnosis unit sends an alarm instead of a warning (step S26) (step S126). This alarm is also sent to the operator 70 side (step S100), and the operator 70 checks the situation (step S114). The operator 70 inputs data relating to the failure, and this data is sent to the factory system 90 side. The secondary diagnostic unit proposes a repair item candidate instead of a maintenance item (step S130). When the secondary diagnosis is completed, the proposed repair item candidates are also sent to the operator 70 (step S144). Further, the standard repair required time is sent from the auxiliary system 20 to the operator 70 (step S120), and the operator 7
In step S122, final diagnosis including prediction of repair contents and recovery time is performed (step S122). This final diagnosis is supplementary system 2.
0 (step S123), the incidental system 20
The component allocation policy proposing means proposes a component allocation policy (step S42). The expected return time is reported from the operator 70 to the factory system 90 (step S12).
4). Other processes are the same as in the first embodiment. As described above, an efficient repair schedule can be set.

As described above, according to the third embodiment, by causing the auxiliary system 20 to manage the semiconductor manufacturing apparatus 10, when the semiconductor manufacturing apparatus 10 fails, the cause of the failure is diagnosed and an appropriate repair item is determined. To the operator 70. Therefore, the operator 70 can quickly and easily perform an appropriate final diagnosis, and can perform repair without lowering the operation rate of the semiconductor manufacturing apparatus 10. Further, since an efficient repair schedule can be set in advance, the overall operation rate including the factory system 90 can be maintained and improved without lowering.

Embodiment 4 FIGS. 10 and 11 show a flowchart of the maintenance support function among the management functions performed by the device availability improvement system according to the fourth embodiment of the present invention. The fourth embodiment is different from the third embodiment in that the component supply device 100 of the supplier 50 exists. Therefore, in the following description, the component supply device 100
Only the parts related to are explained. Other configurations are the same as those of the third embodiment, and thus description thereof is omitted. FIG. 10 and FIG.
1 and the same reference numerals as those in FIG. 8 and FIG. FIGS. 10 and 11 are a series of flowcharts, which are divided into two for the convenience of the drawings.

10 and 11, the operator 52, the semiconductor manufacturing apparatus 10, the auxiliary system 20, and the factory system 90 on the left side show the user 52 to which parts are supplied, and the part supply apparatus 100 on the right side supplies parts. 2 shows the supplier 50 side. The user 52 and the supplier 50 are separated by a broken line.
The EES network 42, the firewall 28 and the Internet 44 shown in FIG.

As shown in FIG. 10, the supplementary system 2
0 primary diagnosis is performed by the supplier 50
The data sent from the component supply device 100 on the side can also be used (step S24).

The secondary diagnostic means sends an alarm from the auxiliary system 20 to the component supply device 100 (step S11).
0). The secondary diagnosis unit can also obtain information on past cases from the component supply device 100 to determine whether the failure is a known one or an unknown one (step S3).
2).

Further, the secondary diagnosis means determines whether the failure is a planned one or a sudden one which is expected to occur in the past case. To make this decision,
History data and the like can also be obtained from the component supply device 100 (step S36). In order to support the secondary diagnosis, for example, if the sign of the abnormality is unknown, the component supply device 100 investigates the cause (step S3).
9). The secondary diagnostic means proposes a repair item candidate. After the secondary diagnosis, real-time data indicating a failure is sent to the component supply device 100 (step S38).

The component allocation policy proposing means proposes a component allocation policy based on the repair item candidates proposed by the secondary diagnosis, and causes the component supply device 100 to arrange components (step S42). Specifically, the component supply device 100
The stock is checked for (step S46).
The answer of the delivery date is obtained (step S48). When a desired policy is determined from the proposed component allocation policy, the auxiliary system 20 notifies the factory system 90 of repair scheduling and part ordering (step S52). The factory system 90 requests a desired component from the component supply device 100 (step S54). After that, the parts are sent from the parts supply device 100 at an appropriate timing (step S6).
0) and delivered (step S61). Ancillary system 2
0 confirms the delivered parts (step S62) and notifies the operator 70.

As shown in FIG. 11, the component supply device 1
From 00, a repair procedure guide is sent to the operator 70 (step S71). The operator 70 performs repair including post-check (step S72). Ancillary system 20
Registers a repair history, for example, details of repair, used parts, and the like (step S80). This information may also be registered on the component supply device 100 side. As a result,
In the above step S32 or S36, the component supply device 100 can provide desired past data to the auxiliary system 20. Finally, the factory system 90 also registers a repair history including a repair summary and an inspection result (step S90).

As described above, according to the fourth embodiment, by providing the component supply device 100 in addition to the third embodiment, the desired components ordered from the factory system 90 can be quickly supplied. Repairs that do not lower the operation rate of the manufacturing apparatus 10 can be performed.

Embodiment 5 A recording medium on which a computer program for realizing the functions of each of the above-described embodiments is recorded is supplied to the auxiliary system 20 of the present invention via a recording medium input / output unit (not shown). It goes without saying that the object of the present invention is also achieved by reading and executing a computer program stored in a medium. In this case, the computer program itself read from the recording medium implements the new function of the supplementary system 20 of the present invention, and the recording medium on which the computer program is recorded constitutes the present invention. As a recording medium on which a computer program is recorded, for example, a CD-
A ROM, FD, hard disk, ROM, memory card, optical disk, or the like can be used.

As described above, according to the fifth embodiment, a recording medium storing a computer program for realizing the functions of the above-described embodiments is supplied to the supplementary system 20 of the present invention, and the computer of the supplementary system 20 is provided. The object of the present invention can also be achieved by reading and executing a computer program stored in a recording medium.

In the above embodiment, the auxiliary system 20
The semiconductor manufacturing apparatus 10 has been described as an example of an apparatus to be managed. However, the devices to which the device availability improvement system and the like of the present invention are applied are not limited to semiconductor manufacturing devices. Needless to say, another apparatus such as a liquid crystal manufacturing apparatus, a magnetic disk manufacturing apparatus, a rolling apparatus, or the like may be used as long as the apparatus performs continuous operation.

[0072]

As described above, according to the apparatus operating rate improving system, the monitor apparatus and the apparatus operating rate improving method of the present invention,
An apparatus operation rate improvement system and a monitor apparatus that can perform maintenance and repairs to further improve the operation rate of the manufacturing equipment such as the semiconductor manufacturing apparatus 10 by lowering the operation rate of the semiconductor manufacturing apparatus 10 and the like by causing the auxiliary system 20 to manage the semiconductor manufacturing apparatus 10. , A component supply device, a device availability improvement method, a recording medium, and a program.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an example of a configuration of an apparatus operation rate improvement system according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating a maintenance support function among management functions performed by the device availability improvement system according to the first embodiment of the present invention.

FIG. 3 is a flowchart illustrating a maintenance support function among management functions performed by the device availability improvement system according to the first embodiment of the present invention.

FIG. 4 is a flowchart showing a maintenance support function among management functions performed by the apparatus availability improvement system when a plurality of semiconductor manufacturing apparatuses exist in the first embodiment of the present invention.

FIG. 5 is a flowchart showing a maintenance support function among management functions performed by the system availability improvement system when a plurality of semiconductor manufacturing apparatuses exist in the first embodiment of the present invention.

FIG. 6 is a flowchart illustrating a maintenance support function among management functions performed by the device operation rate improvement system according to the second embodiment of the present invention.

FIG. 7 is a flowchart showing a maintenance support function among management functions performed by the device availability improvement system according to the second embodiment of the present invention.

FIG. 8 is a flowchart illustrating a failure handling function among management functions performed by the device availability improvement system according to the third embodiment of the present invention.

FIG. 9 is a flowchart showing a failure handling function among management functions performed by the device availability improvement system according to the third embodiment of the present invention.

FIG. 10 is a flowchart illustrating a failure handling function among management functions performed by the device availability improvement system according to the fourth embodiment of the present invention.

FIG. 11 is a flowchart illustrating a failure handling function among management functions performed by the device availability improvement system according to the fourth embodiment of the present invention.

FIG. 12 is a diagram illustrating an outline of a conventional apparatus management method using a semiconductor manufacturing apparatus as an example.

[Explanation of symbols]

10, 10a, 10b Semiconductor manufacturing equipment, 12 ST
C, 14 PIO terminal, 16 database, 2
0 Auxiliary system, 22 AEC, 24 FDC,
26 STS, 28 Firewall, 30 Database DB, 32 MES, 34 MCS, 36
APC, 38 CMS, 40 Host Network, 42 EES Network, 44 Internet, 50 Supplier, 71 Operator Terminal,
70 operator, 80 administrator, 81 terminal for administrator, 90 factory system, 100 parts supply device.

Claims (16)

[Claims] 1. An apparatus operation rate improving system comprising: a monitor apparatus for monitoring an operation rate of at least one apparatus; and a database for recording data transmitted from the apparatus, wherein the monitor apparatus comprises: Collecting means for collecting data and recording the data in a database; primary diagnostic means for diagnosing the condition of the apparatus based on the data recorded in the database; and diagnosing the cause of the abnormality when the primary diagnostic means detects an abnormality. And a component allocation policy proposing unit for proposing a component allocation policy based on the coping method proposed by the secondary diagnosis unit. Operation rate improvement system. 2. The system according to claim 1, wherein the operation of the apparatus is managed based on data recorded in the database, and based on a component allocation policy proposed by the component allocation policy proposing unit. A system for improving the equipment operation rate, further comprising a factory system for arranging parts. 3. The system according to claim 2, further comprising: a component supply device that supplies a component arranged from the factory system according to a coping method. 4. The apparatus operating rate improving system according to claim 1, wherein said primary diagnostic means comprises:
When the data recorded in the database fluctuates in a time series having a predetermined value, an abnormality of the apparatus is detected, and the apparatus operation rate improving system is characterized in that the apparatus is operated. 5. The apparatus operating rate improving system according to claim 1, wherein said primary diagnostic means comprises:
When the data recorded in the database indicates a change in a predetermined device among a plurality of devices, an abnormality of the predetermined device is detected, and the device operation rate improvement system is characterized in that the system detects an abnormality in the predetermined device. 6. The apparatus operation rate improving system according to claim 1, wherein said secondary diagnostic means comprises:
When the abnormality detected by the primary diagnostic means is a sign of a device failure, a measure for preventing the device failure is determined beforehand. 7. The apparatus operating rate improvement system according to claim 1, wherein said secondary diagnostic means comprises:
When the abnormality detected by the primary diagnostic means is a device failure, a coping method for repairing the device failure is determined. 8. A monitor device in an apparatus operation rate improvement system for improving an operation rate of at least one apparatus, comprising: a collection unit for recording data collected from the apparatus in a database; Primary diagnostic means for diagnosing the status of the device based on the secondary diagnostic means; when an abnormality is detected by the primary diagnostic means, diagnosing the cause of the abnormality and proposing a candidate for a coping method; A component allocation policy proposing means for proposing a component allocation policy based on the coping method proposed by the means. 9. The monitor device according to claim 8, wherein the primary diagnostic means detects an abnormality of the device when data recorded in the database changes in a time series having a predetermined value. Characteristic monitor device. 10. The monitor device according to claim 8, wherein
The monitor device, wherein the primary diagnostic means detects an abnormality of the predetermined device when the data recorded in the database indicates a fluctuation of the predetermined device among a plurality of devices. 11. The monitor device according to claim 8, wherein the secondary diagnostic unit determines that the device has failed if the abnormality detected by the primary diagnostic unit is a sign of a device failure. A monitoring device characterized in that a countermeasure for preventing the problem is determined. 12. The monitor device according to claim 8, wherein the secondary diagnostic unit repairs the device failure when the abnormality detected by the primary diagnostic unit is a device failure. A monitor device for determining a coping method. 13. A component supply device, wherein a component proposed and arranged according to a predetermined component allocation policy is supplied from a device availability improvement system that improves the availability of at least one device. 14. An apparatus operation rate improving method for improving the operation rate of at least one apparatus, comprising: a collection step of collecting data from an apparatus and recording the data in a database; and the apparatus based on the data recorded in the database. A primary diagnosis step of diagnosing the situation, and, if an abnormality is detected by the primary diagnosis step, a secondary diagnosis step of diagnosing the cause of the abnormality and proposing a candidate for a coping method; and A component allocation policy proposal step of proposing a component allocation policy based on the coping method. 15. A computer-readable recording medium having recorded thereon a program for causing a computer to execute an apparatus operation rate improving method for improving the operation rate of at least one apparatus, wherein the computer collects data from the apparatus, A primary diagnosis step of diagnosing the status of the device based on data recorded in a database; and, if an abnormality is detected by the primary diagnosis step, diagnosing a cause of the abnormality and taking a countermeasure. A computer-readable program storing a program for executing a secondary diagnosis step of proposing a candidate, and a component allocation policy proposal step of proposing a component allocation policy based on the coping method proposed by the secondary diagnosis step. recoding media. 16. A program for causing a computer to execute an apparatus operation rate improvement method for improving an operation rate of at least one apparatus, comprising: a collection step of collecting data from the apparatus and recording the data in a database; A primary diagnosis step of diagnosing the status of the device based on the recorded data; and, if an abnormality is detected by the primary diagnosis step, a secondary diagnosis step of diagnosing the cause of the abnormality and proposing a candidate for a coping method. A component allocation policy proposing step of proposing a component allocation policy based on the coping method proposed by the secondary diagnosis step.