JP2002303878A - Liquid crystal display device and information processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device and an information processing device permitting to reduce the size and weight by downsizing the area of a picture frame part. SOLUTION: In the liquid crystal display device having a liquid crystal display panel PNL wherein 1st and 2nd insulating substrates are superimposed with a predetermined gap in-between so that the surfaces provided respectively with a transparent pixel electrodes and an oriented film are faced to each other; both substrates are stuck together with a sealing material provided in a frame form in the rim part between both substrates and also a liquid crystal is sealed inside of the sealing material between both substrates; and each terminal of a plurality of scanning signal lines and video signal lines formed on the counter surface of the 1st insulating substrate is arranged outside of the sealing material, the terminals of the video signal lines are led only on one side of the liquid crystal display panel PNL, and a circuit board PCB1 for driving video signals to be connected with the terminals of the video signal lines is arranged only on one side of the long side of the display panel PNL.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display panel in which liquid crystal is sealed between two superposed insulating substrates, a light guide plate disposed under the liquid crystal display panel, and a fluorescent light disposed near the side surface thereof. A liquid crystal display device having a backlight comprising: a tube;
And an information processing apparatus incorporating the liquid crystal display device as a display unit.

[0002]

2. Description of the Related Art An active matrix type liquid crystal display device is provided with a non-linear element (switching element) corresponding to each of a plurality of pixel electrodes arranged in a matrix. Since the liquid crystal in each pixel is theoretically always driven (duty ratio 1.0), the active method has better contrast than the so-called simple matrix method that employs the time-division driving method. Then it is becoming an indispensable technology. A typical switching element is a thin film transistor (TFT).

In a liquid crystal display device, for example, two transparent glass substrates are overlapped with a predetermined gap therebetween so that a display pixel electrode made of a transparent conductive film and an alignment film or the like are respectively opposed to each other. The two substrates are bonded together with a sealing material provided in a frame shape on the edge between the two substrates, and liquid crystal is sealed and sealed inside the sealing material between the two substrates from the liquid crystal filling port provided in a part of the sealing material. And a liquid crystal display panel (liquid crystal display element) in which a polarizing plate is provided or attached to the outside of both substrates; and a circuit board disposed outside the outer periphery of the liquid crystal display panel and having a liquid crystal driving circuit formed thereon. An intermediate frame that is a molded product holding these members, a metal shield case that houses these members and has a liquid crystal display window opened, and a liquid crystal display panel that is disposed below the liquid crystal display panel. Light on It is configured to include a backlight or the like for feeding.

Incidentally, an active matrix type liquid crystal display device using thin film transistors is disclosed in, for example, Japanese Patent Application Laid-Open No. 63-309921 or "1.
2.5-inch active matrix color liquid crystal display ", Nikkei Electronics, pp. 193-210, December 1986
March 15, published by Nikkei McGraw-Hill, Inc.

[0005]

In a conventional liquid crystal display device, a liquid crystal display panel formed by sealing a liquid crystal between two superposed transparent glass substrates is fixed in the device. Both of the transparent glass substrates were held down by a rubber cushion. As a result, the two transparent glass substrates are strongly pressed, and the gap of the liquid crystal between the two transparent glass substrates is partially changed, resulting in a problem that display unevenness occurs. Therefore, the liquid crystal display panel could not be held down too strongly, and sufficient mechanical strength could not be secured.

Further, in the conventional liquid crystal display device, video signal lines are alternately drawn to two long sides of the liquid crystal display panel facing each other, and a video signal line driving circuit board is arranged outside each of the long sides. Therefore, the area of the so-called frame around the display unit cannot be reduced, and the liquid crystal display device and a personal computer that incorporates the liquid crystal display device as a display unit.
There has been a problem that the external dimensions of an information processing apparatus such as a word processor become large and the weight becomes heavy.

Further, in a conventional liquid crystal display device having a backlight including a fluorescent tube and a light guide plate, the location of the fluorescent tube and the like is not sufficiently taken into consideration. Not enough yet. In recent years, with the progress of the information society, information processing devices such as personal computers and word processors are also desired to be portable, such as notebook-sized computers.・ The liquid crystal display, which determines the size and weight, is also small.
Light weight is desired.

A first object of the present invention is to provide a liquid crystal display device which can strongly press a liquid crystal display panel and has high mechanical strength.

A second object of the present invention is to provide a liquid crystal display device and an information processing device which can be reduced in size and weight by reducing the area of a frame portion.

A third object of the present invention is to provide a small and lightweight liquid crystal display device which efficiently stores a fluorescent tube of a backlight.

[0011]

In order to solve the above-mentioned first problem, a liquid crystal display device of the present invention provides a liquid crystal display panel in which liquid crystal is sealed between two superposed insulating substrates. A single plate portion is provided, and the liquid crystal display panel is pressed down on at least one of an upper surface and a lower surface of the single plate portion via an elastic body, and is fixed in the device.

A liquid crystal display panel in which liquid crystal is sealed between two superposed transparent glass substrates, a circuit board disposed on an outer peripheral portion of the liquid crystal display panel, and a liquid crystal display panel below the liquid crystal display panel. In a liquid crystal display device having a backlight disposed therein, a metal shield case for housing the liquid crystal display panel and the circuit board, and a molded case formed by integral molding for housing the backlight are provided respectively. The liquid crystal display panel is pressed down via an elastic body to a single plate portion provided on the liquid crystal display panel, and fixed in the device by fitting the fitting portion together. .

Further, the elastic body is interposed between the one plate portion of the liquid crystal display panel and a backlight.

A liquid crystal display panel in which liquid crystal is sealed between two superposed transparent glass substrates, and a circuit disposed on two, three or four sides of the outer periphery of the liquid star display panel A substrate, a light guide plate of a backlight disposed below the liquid crystal display panel, a metal shield case for housing the liquid crystal display panel and the circuit board, and a mold formed by integral molding for housing the backlight. A liquid crystal display device having a case, wherein the metal shield case and the mold case are provided with fitting portions provided respectively and integrated with each other.
A single plate portion is provided, and the liquid crystal display panel and the light guide plate are pressed between the single plate portion and the light guide plate via an elastic body, and are fixed in the device.

Further, a double-sided pressure-sensitive adhesive sheet is interposed between the liquid crystal display panel and the metal shield case, and is adhered.

Further, the single plate portion is provided on three sides or the entire periphery of the liquid crystal display panel, although it is originally unnecessary to arrange terminal electrodes.

In order to solve the second problem,
In the liquid crystal display device of the present invention, the terminal of the video signal line is drawn out only on one side of the liquid crystal display panel, and the video signal line driving circuit board connected to the terminal is arranged only on one side of the display panel. It is characterized by.

Also, the first and second insulating substrates are overlapped with a predetermined gap therebetween so that the surfaces on which the transparent pixel electrodes and the alignment films are provided face each other, and a frame-like shape is formed at the edge between the two substrates. The two substrates are stuck together and a liquid crystal is sealed inside the sealing material between the two substrates, and a plurality of the substrates are arranged on the facing surface of the first insulating substrate. In a liquid crystal display device having a liquid crystal display panel in which each terminal of a scanning signal line and a video signal line is provided outside the sealing material, the terminal of the video signal line is drawn out to only one side of the liquid crystal display panel, and the video signal is The video signal line driving circuit board connected to the terminal of the line is arranged only on one side of the long side of the display panel.

A plurality of scanning signal lines extending in the horizontal direction and arranged in the vertical direction, a plurality of video signal lines extending in the vertical direction and arranged in the horizontal direction, and two adjacent scanning signal lines are arranged. A first insulating substrate provided with a first pixel electrode and a switching element within an intersection between the scanning signal line and two adjacent video signal lines; and a first insulating substrate facing the first pixel electrode. A liquid crystal display device having a liquid crystal display panel in which a second insulating substrate provided with a second pixel electrode is overlapped with a predetermined gap therebetween and a liquid crystal is sealed between the two substrates. The terminal of the line is drawn out to only one side of the liquid crystal display panel, and the video signal line driving circuit board connected to the terminal of the video signal line is disposed only on one long side of the display panel. I do.

Further, no circuit board is disposed on the other side of the side of the display panel on which the video signal line driving circuit board is disposed.

Further, a scanning signal line driving circuit board is arranged on one of two sides perpendicular to the side of the display panel on which the video signal line driving circuit board is arranged, and a power supply circuit and a conversion circuit are arranged on the other side. And a circuit board having the same.

Further, when the liquid crystal display device is incorporated in a predetermined information processing device as a display unit, the video signal line driving circuit board is disposed above a screen of the display unit. .

In order to solve the third problem,
The present invention is characterized in that a fluorescent tube of a backlight is arranged below a plurality of tape carrier packages arranged on an outer peripheral portion of a liquid crystal display panel.

Also, a liquid crystal display panel, a light guide plate disposed below the liquid crystal display panel, a fluorescent tube disposed at least in the vicinity of at least one side of the light guide plate, and a plurality of fluorescent tubes disposed on the outer peripheral portion of the liquid crystal display panel. In a liquid crystal display device having a tape carrier package, the fluorescent tube is arranged below a plurality of the tape carrier packages.

Further, one of the long sides of the liquid crystal display panel is
A plurality of the tape carrier packages are arranged only on one outer peripheral portion of the short side of the liquid crystal display panel, and the fluorescent tube is provided below the plurality of tape carrier packages arranged on the long side or the short side of the liquid crystal display panel. Are arranged.

[0026]

According to the liquid crystal display device of the present invention, one of the two insulating substrates constituting the liquid crystal display panel is protruded to provide a single plate portion, and only one of the insulating substrates is placed on the single plate portion. Since the pressing is performed through the body, even if the pressing is performed strongly, the gap between the two substrates does not change, and display unevenness does not occur. Therefore, the pressing force of the liquid crystal display panel can be increased, so that the mechanical strength is improved and the reliability can be improved.

Also, in the liquid crystal display device of the present invention, the terminal of the video signal line is drawn out only on one side of the liquid crystal display panel, and the video signal line driving circuit board connected to the terminal is connected to the side of the display panel, usually long. Since it was placed only on one side of the side,
Since the area of the frame around the display portion can be reduced, the size and weight of the liquid crystal display device and the information processing device incorporating the same can be reduced. Further, when the liquid crystal display device is mounted on an information processing device such as a personal computer or a word processor as a display unit, the side on which the video signal line driving circuit board is disposed is a position disposed on the upper side of the screen. As a result, notebook-type personal computers and word processors with the display unit attached to the keyboard by hinges,
A space for providing a hinge at the bottom of the screen can be easily taken, and the vertical position of the screen can be made appropriate.

Further, in the liquid crystal display device according to the present invention, in the device, an elongated fluorescent tube is arranged in a space below a plurality of tape carrier packages mounted on the outer peripheral portion of the liquid crystal display panel, thereby using up space. The fluorescent tube can be efficiently stored. Therefore, the external dimensions of the device can be reduced, and the device can be reduced in size and weight.

[0029]

BRIEF DESCRIPTION OF THE DRAWINGS The invention, further objects of the invention and further features of the invention will become apparent from the following description with reference to the drawings, in which: FIG.

<< Active matrix liquid crystal display device >>
Hereinafter, an embodiment in which the present invention is applied to an active matrix type color liquid crystal display device will be described. In the drawings described below, components having the same function are denoted by the same reference numerals, and repeated description thereof will be omitted.

<< Outline of Matrix Unit >> FIG. 2 is a plan view showing one pixel of an active matrix type color liquid crystal display device to which the present invention is applied and its periphery, and FIG.
FIG. 4 is a cross-sectional view taken along line -3 of FIG. 2, and FIG.
It is sectional drawing in a cutting line. FIG. 5 is a plan view when a plurality of pixels shown in FIG. 2 are arranged.

As shown in FIG. 2, each pixel has two adjacent scanning signal lines (gate signal lines or horizontal signal lines) GL.
And two adjacent video signal lines (drain signal lines or vertical signal lines) DL (in a region surrounded by four signal lines). Each pixel includes a thin film transistor TFT, a transparent pixel electrode ITO1, and a storage capacitor Cadd. The scanning signal lines GL extend in the column direction, and a plurality of the scanning signal lines GL are arranged in the row direction. The video signal lines DL extend in the row direction, and a plurality of video signal lines DL are arranged in the column direction.

As shown in FIG. 3, a thin film transistor TFT is provided on the lower transparent glass substrate SUB1 side with respect to the liquid crystal LC.
In addition, a transparent pixel electrode ITO1 is formed, and a color filter FIL and a light shielding black matrix pattern BM are formed on the upper transparent glass substrate SUB2 side. The lower transparent glass substrate SUB1 has a thickness of, for example, about 1.1 mm. Also, the transparent glass substrates SUB1, S
A silicon oxide film SIO formed by dipping or the like is provided on both surfaces of UB2. For this reason, even if there are sharp scratches on the surfaces of the transparent glass substrates SUB1 and SUB2, the sharp scratches can be covered with the silicon oxide film SIO, so that the scanning signal lines G deposited on them can be covered.
L, the film quality of the light shielding film BM and the like can be kept uniform.

On the inner surface of the upper transparent glass substrate SUB2 (on the liquid crystal LC side), a light shielding film BM and a color filter FI are provided.
L, protective film PSV2, common transparent pixel electrode ITO2 (CO
M) and an upper alignment film ORI2 are sequentially laminated.

<< Outline of Matrix Peripheral >> FIG. 17 shows a display panel PNL including upper and lower glass substrates SUB1 and SUB2.
18 is a plan view of a main part around the matrix (AR), FIG. 18 is a plane in which the periphery is further exaggerated, and FIG. 19 is a plan view of FIGS.
8 is an enlarged plan view showing the vicinity of a seal portion SL corresponding to the upper left corner of the panel 8; FIG. 20 is a diagram showing a cross section taken along the line 19a-19a in FIG. 19 on the left side and a cross section near the external connection terminal DTM to which the video signal drive circuit is to be connected on the right side, with the cross section of FIG. is there. FIG. 2
1 is an external connection terminal G to which a scanning circuit is to be connected on the left side.
It is a figure showing a section near TM, and a section near a seal part where there is no external connection terminal on the right side.

[0036] Any For this panel In the manufacture of, if small size divided from simultaneously processing a plurality fraction of the device in one glass substrate for increased throughput, manufacturing facilities if large size shared A glass substrate of a standardized size is processed even in a variety, and the size is reduced to a size suitable for each type. In each case, the glass is cut after passing through one process. FIGS. 17 to 19 show the latter example. Both FIGS. 17 and 18 show the upper and lower substrates SUB.
19 shows the state before cutting of SUB2, and FIG. 19 shows the state before cutting. LN indicates the edge of both substrates before cutting, and CT1 and CT2 indicate the positions where the substrates SUB1 and SUB2 are to be cut, respectively. In any case, in the completed state, the external connection terminal group T
g, Td (subscripts omitted) (upper and lower sides and left side in the figure)
In the portions, the size of the upper substrate SUB2 is limited to the inside of the lower substrate SUB1 so as to expose them. The terminal groups Tg and Td are respectively provided with a scanning circuit connection terminal GTM and a video signal circuit connection terminal DTM and their lead-out wiring portions of a tape carrier package TCP (FIGS. 22 and 23) on which an integrated circuit chip CHI is mounted. The unit is named plurally. The lead wiring from the matrix section of each group to the external connection terminal section is inclined as approaching both ends. This is because the terminals DTM and GTM of the display panel PNL are matched with the arrangement pitch of the package TCP and the connection terminal pitch of each package TCP.

Between the transparent glass substrates SUB1 and SUB2, along the edge thereof, except for the liquid crystal filling opening INJ, the liquid crystal LC
Is formed to seal the sealing pattern SL. The sealing material is made of, for example, an epoxy resin. At least one common transparent pixel electrode ITO2 on the upper transparent glass substrate SUB2 side is connected to the lead-out wiring INT formed on the lower transparent glass substrate SUB1 side by a silver paste material AGP at four corners of the panel in this embodiment. ing. The lead wiring INT is formed in the same manufacturing process as the later-described gate terminal GTM and drain terminal DTM.

Each layer of the alignment films ORI1, ORI2, the transparent pixel electrode ITO1, and the common transparent pixel electrode ITO2 is formed inside the seal pattern SL. Polarizing plate P
OL1 and POL2 are each a lower transparent glass substrate SUB
1. Formed on the outer surface of the upper transparent glass substrate SUB2. The liquid crystal LC is sealed in a region partitioned by the seal pattern SL between the lower alignment film ORI1 and the upper alignment film ORI2 for setting the direction of the liquid crystal molecules. The lower alignment film ORI1 is a protective film P on the lower transparent glass substrate SUB1 side.
It is formed above the SV1.

In this liquid crystal display device, various layers are separately stacked on the lower transparent glass substrate SUB1 side and the upper transparent glass substrate SUB2 side, and a seal pattern SL is formed on the substrate SUB2.
Side, the lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2 are overlapped, liquid crystal LC is injected from the opening INJ of the sealing material SL, the injection port INJ is sealed with epoxy resin or the like, and the upper and lower substrates are sealed. Assembled by cutting.

<< Thin Film Transistor TFT >> The thin film transistor TFT operates so that the channel resistance between the source and the drain decreases when a positive bias is applied to the gate electrode GT, and the channel resistance increases when the bias is set to zero.

The thin film transistor TFT of each pixel is divided into two (a plurality) in the pixel, and is constituted by thin film transistors (divided thin film transistors) TFT1 and TFT2. Each of the thin film transistors TFT1 and TFT2 has substantially the same size (channel length and channel width are the same). Each of the divided thin film transistors TFT1 and TFT2 is a gate electrode GT, a gate insulating film GI, and an i-type semiconductor made of i-type (intrinsic, intrinsic, not doped with a conductivity type determining impurity) amorphous silicon (Si). It has a layer AS, a pair of source electrodes SD1, and a drain electrode SD2. It should be understood that the source and the drain are originally determined by the bias polarity between them, and in the circuit of this liquid crystal display device, the polarity is inverted during the operation, so that the source and the drain are interchanged during the operation. However, in the following description, one is fixed and the other is fixed as a drain for convenience.

<< Gate Electrode GT >> The gate electrode GT is shown in FIG.
As shown in FIG. 2 (a plan view depicting only the second conductive film g2 and the i-type semiconductor layer AS in FIG. 2), the projection is configured to protrude vertically (upward in FIGS. 2 and 6) from the scanning signal line GL. (Branched into a T-shape). The gate electrode GT protrudes beyond the respective active areas of the thin film transistors TFT1 and TFT2. The respective gate electrodes G of the thin film transistors TFT1 and TFT2
T is integrally formed (as a common gate electrode) and is formed continuously with the scanning signal line GL. In this example, the gate electrode GT is formed of a single-layer second conductive film g2. As the second conductive film g2, for example, an aluminum (Al) film formed by sputtering is used,
It is formed with a thickness of about 0 °. An anodic oxide film AOF of Al is provided on the gate electrode GT.

As shown in FIGS. 2, 3 and 6, this gate electrode GT is formed larger than it so as to completely cover the i-type semiconductor layer AS (as viewed from below).
Therefore, when a backlight BL such as a fluorescent tube is attached below the lower transparent glass substrate SUB1, the gate electrode GT made of opaque Al becomes a shadow, and the backlight light impinges on the i-type semiconductor layer AS. In addition, the conductive phenomenon due to light irradiation, that is, the deterioration of the off characteristic of the thin film transistor TFT is less likely to occur. Note that the original size of the gate electrode GT is the minimum necessary to extend between the source electrode SD1 and the drain electrode SD2 (including the margin for positioning between the gate electrode GT, the source electrode SD1, and the drain electrode SD2). ) Has a width, and the depth length that determines the channel width W is determined by the ratio of the distance (channel length) L between the source electrode SD1 and the drain electrode SD2, that is, the factor W / L that determines the transconductance gm. It depends on what you do. The gate electrode G in this liquid crystal display device
The size of T is, of course, made larger than the original size described above.

<< Scanning Signal Line GL >> The scanning signal line GL is
It is composed of a conductive film g2. The second conductive film g2 of the scanning signal line GL is formed in the same manufacturing process as the second conductive film g2 of the gate electrode GT, and is integrally formed. An anodic oxide film AOF of Al is also provided on the scanning signal line GL.

<< Insulating Film GI >> The insulating film GI is used as each gate insulating film of the thin film transistors TFT1 and TFT2. The insulating film GI is formed above the gate electrode GT and the scanning signal line GL. The insulating film GI is formed using a silicon nitride film formed by, for example, plasma CVD and having a thickness of 1200 to 2700 ° (about 2000 ° in this liquid crystal display device). As shown in FIG. 19, the gate insulating film GI is formed so as to surround the entire matrix portion AR, and the peripheral portion is formed with external connection terminals DTM and G.
Removed to expose TM.

<< i-type semiconductor layer AS >> i-type semiconductor layer AS
Is used as a channel forming region of each of the thin-film transistors TFT1 and TFT2 divided as shown in FIG. The i-type semiconductor layer AS is formed of an amorphous silicon film or a polycrystalline silicon film.
Å (in this liquid crystal display device, about 2000 膜厚).

The i-type semiconductor layer AS is formed by the same plasma CVD method by changing the composition of the supply gas and forming an insulating film GI used as a gate insulating film made of Si ₃ N _4.
It is formed by an apparatus and without being exposed to the outside from the plasma CVD apparatus. An N ⁺ type semiconductor layer d doped with 2.5% of phosphorus (P) for ohmic contact
0 (FIG. 3) is similarly formed continuously with a film thickness of 200 to 500 ° (about 300 ° in this liquid crystal display device). Then, the lower transparent glass substrate SUB1 is CV
The N ⁺ -type semiconductor layer d0 and the i-type semiconductor layer AS are taken out of the device D and are patterned into independent islands as shown in FIGS. 2, 3, and 6 by a photoprocessing technique.

As shown in FIGS. 2 and 6, the i-type semiconductor layer AS is also provided between both intersections (crossover portions) between the scanning signal lines GL and the video signal lines DL. The i-type semiconductor layer AS at the intersection reduces a short circuit between the scanning signal line GL and the video signal line DL at the intersection.

<< Transparent Pixel Electrode ITO1 >> Transparent Pixel Electrode I
TO1 constitutes one of the pixel electrodes of the liquid crystal display section.

The transparent pixel electrode ITO1 is connected to the source electrode SD1 of the thin film transistor TFT1 and the thin film transistor T1.
It is connected to both source electrodes SD1 of FT2. Therefore, even if a defect occurs in one of the thin film transistors TFT1 and TFT2, if the defect causes a side effect, an appropriate portion is cut off by a laser beam or the like, otherwise, the other thin film transistor operates normally. You can leave it. It is rare that defects occur simultaneously in the two thin film transistors TFT1 and TFT2, and the probability of a point defect or a line defect can be extremely reduced by such a redundant system. Transparent pixel electrode ITO
Reference numeral 1 denotes a first conductive film d1.
The conductive film d1 is made of a transparent conductive film (Indium-Tin-Oxide ITO: Nesa film) formed by sputtering.
A film thickness of 100 to 2000 ° (14 in this liquid crystal display device).
(Thickness of about 00 °).

<< Source electrode SD1, Drain electrode SD
2 >> Thin-film transistors TFT1, TF divided into a plurality
Source electrode SD1 and drain electrode SD of T2
2 is provided separately on the i-type semiconductor layer AS as shown in FIGS. 2, 3 and 7 (a plan view showing only the first to third conductive films d1 to d3 in FIG. 2). Have been.

Each of the source electrode SD1 and the drain electrode SD2 is formed by sequentially stacking a second conductive film d2 and a third conductive film d3 from the lower layer side in contact with the N ⁺ type semiconductor layer d0. Second conductive film d2 of source electrode SD1
The third conductive film d3 is formed in the same manufacturing process as the second conductive film d2 and the third conductive film d3 of the drain electrode SD2.

The second conductive film d2 is formed using a chromium (Cr) film formed by sputtering and having a thickness of 500 to 1000 〜 (about 600 膜厚 in this liquid crystal display device).
Since the stress increases when the Cr film is formed to have a large thickness, the Cr film is formed within a range not exceeding about 2000 °.
The Cr film has good contact with the N ⁺ type semiconductor layer d0. C
The r film forms a so-called barrier layer that prevents Al of a third conductive film d3 described later from diffusing into the N ⁺ type semiconductor layer d0. As the second conductive film d2, a refractory metal (Mo, Ti, Ta, W) film or a refractory metal silicide (MoSi ₂ , TiSi ₂ , TaSi ₂ , WSi ₂ ) film may be used in addition to the Cr film.

The third conductive film d3 is formed to a thickness of 3000 to 5000 ° by sputtering of Al (in this liquid crystal display device,
(A film thickness of about 4000 °). The Al film has a smaller stress than the Cr film and can be formed with a large thickness, and is configured to reduce the resistance values of the source electrode SD1, the drain electrode SD2, and the video signal line DL. As the third conductive film d3, an Al film containing silicon or copper (Cu) as an additive may be used in addition to the pure Al film.

After patterning the second conductive film d2 and the third conductive film d3 with the same mask pattern, using the same mask or using the second conductive film d2 and the third conductive film d3 as a mask, an N ⁺ type semiconductor layer is formed. d0 is removed. That is, i
In the N ⁺ type semiconductor layer d0 remaining on the type semiconductor layer AS, portions other than the second conductive film d2 and the third conductive film d3 are removed by self-alignment. At this time, since the N ⁺ type semiconductor layer d0 is etched so as to remove the entire thickness thereof,
The surface of the i-type semiconductor layer AS is also slightly etched, but the extent may be controlled by the etching time.

The source electrode SD1 is a transparent pixel electrode ITO1.
It is connected to the. The source electrode SD1 has an i-type semiconductor layer AS step (the thickness of the second conductive film g2, the thickness of the anodic oxide film AOF, the thickness of the i-type semiconductor layer AS, and the N ⁺ type semiconductor layer d.
(A step corresponding to a film thickness obtained by adding a film thickness of 0). Specifically, the source electrode SD1 is formed of a second conductive film d2 formed along a step of the i-type semiconductor layer AS.
And a third conductive film d formed on the second conductive film d2.
3 is comprised. Since the third conductive film d3 of the source electrode SD1 cannot form a thick Cr film of the second conductive film d2 due to an increase in stress and cannot cross the step shape of the i-type semiconductor layer AS, the third conductive film d3 crosses over the i-type semiconductor layer AS. Is configured for. That is, the step coverage is improved by forming the third conductive film d3 to be thick. Since the third conductive film d3 can be formed to be thick, it greatly contributes to the reduction of the resistance value of the source electrode SD1 (the same applies to the drain electrode SD2 and the video signal line DL).

<< Protective Film PSV1 >> Thin Film Transistor TF
A protective film PSV1 is provided on T and the transparent pixel electrode ITO1. The protective film PSV1 is mainly formed to protect the thin film transistor TFT from moisture and the like.
Use a material with high transparency and good moisture resistance. The protective film PSV1 is formed of, for example, a silicon oxide film or a silicon nitride film formed by a plasma CVD device, and has a thickness of 1 μm.
It is formed with a film thickness of about m.

As shown in FIG. 19, the protective film PSV1 is formed so as to surround the entire matrix portion AR, and the peripheral portion is removed so as to expose the external connection terminals DTM and GTM.
Further, the common electrode COM of the upper substrate SUB2 is connected to the lower substrate SU.
The portion connected to the external connection terminal connection lead-out wiring INT of B1 with the silver paste AGP is also removed. Protective film PSV
Regarding the thickness relationship between 1 and the gate insulating film GI, the former is made thicker in consideration of the protective effect, and the latter is made thinner in the transconductance gm of the transistor. Therefore, as shown in FIG. 19, the protective film PSV1 having a high protective effect is formed larger than the gate insulating film GI so as to protect the peripheral portion as much as possible.

<< Light shielding film BM >> Upper transparent glass substrate SUB
On the second side, a light shielding film BM is provided so that external light (light from above in FIG. 3) does not enter the i-type semiconductor layer AS used as a channel formation region.
The pattern shown in FIG. FIG. 8 shows the first conductive film d made of the ITO film in FIG.
FIG. 1 is a plan view illustrating only a color filter FIL and a light shielding film BM. The light-shielding film BM is formed of, for example, an aluminum film or a chromium film having a high light-shielding property. In this liquid crystal display device, the chromium film is formed to a thickness of about 1300 ° by sputtering.

Therefore, the thin film transistors TFT1, TF
The i-type semiconductor layer AS of T2 is sandwiched between the upper and lower light shielding films BM and the large gate electrode GT,
That portion is not exposed to external natural light or backlight light. The light-shielding film BM is formed around the pixel as shown by the hatched portion in FIG. 8, that is, the light-shielding film BM is formed in a grid (black matrix), and the grid partitions the effective display area of one pixel. . Therefore, the outline of each pixel is made clear by the light shielding film BM, and the contrast is improved. That is, the light-shielding film BM has two functions of light-shielding for the i-type semiconductor layer AS and black matrix.

A portion facing the edge portion of the transparent pixel electrode ITO1 on the root side in the rubbing direction (lower right portion in FIG. 2).
Are shielded from light by the light-shielding film BM, so that even if a domain is generated in the above-mentioned portion, the domain is not visible, so that the display characteristics do not deteriorate.

The backlight can be attached to the upper transparent glass substrate SUB2 side, and the lower transparent glass substrate SUB1 can be used as the observation side (external exposure side).

The light-shielding film BM is also formed in a peripheral portion in a frame-shaped pattern as shown in FIG. 18, and the pattern is formed continuously with the pattern of the matrix portion shown in FIG. Have been. The light-shielding film BM in the peripheral portion is extended outside the seal portion SL as shown in FIG. 18 to FIG. 21 to prevent leakage light such as reflected light due to a mounting machine such as a personal computer from entering the matrix portion. . On the other hand, the light shielding film BM is about 0.3 to 1..
The substrate SUB2 is formed so as to be kept inside by about 0 mm so as to avoid the cutting region of the substrate SUB2.

<< Color Filter FIL >> The color filter FIL is formed by coloring a dye on a dye base made of a resin material such as an acrylic resin. Color filter F
IL is formed in a stripe shape at a position facing the pixel (FIG. 9) and is dyed separately (FIG. 9 illustrates only the first conductive film d1, the light shielding film BM, and the color filter FIL in FIG. 5). B, R, G color filters FI
L is 45 °, 135 ° and cross hatched, respectively). The color filter FIL is formed large so as to cover all of the transparent pixel electrode ITO1 as shown in FIGS. 8 and 9, and the light shielding film BM of the transparent pixel electrode ITO1 is overlapped with the edge portion of the color filter FIL and the transparent pixel electrode ITO1. It is formed inside the periphery.

The color filter FIL can be formed as follows. First, a dyed base material is formed on the surface of the upper transparent glass substrate SUB2, and the dyed base material other than the red filter forming region is removed by photolithography. Thereafter, the dyed substrate is dyed with a red dye and subjected to a fixing treatment to form a red filter R. Next, a green filter G and a blue filter B are sequentially formed by performing a similar process.

<< Protective Film PSV2 >> The protective film PSV2 is composed of a liquid crystal L made of a dye obtained by dyeing a color filter FIL into different colors.
It is provided to prevent leakage to C. The protective film PSV2 is formed of, for example, a transparent resin material such as an acrylic resin or an epoxy resin.

<< Common Transparent Pixel Electrode ITO2 >> The common transparent pixel electrode ITO2 faces the transparent pixel electrode ITO1 provided for each pixel on the lower transparent glass substrate SUB1 side, and the optical state of the liquid crystal LC is determined by the pixel electrode ITO1. In response to a potential difference (electric field) between the pixel electrode and the common transparent pixel electrode ITO2. The common transparent pixel electrode ITO2 is configured to apply a common voltage Vcom. In this embodiment, the common voltage Vcom is a low-level drive voltage Vdmin and a high-level drive voltage Vd applied to the video signal line DL.
Although it is set to an intermediate potential with dmax, if it is desired to reduce the power supply voltage of the integrated circuit used in the video signal drive circuit to about half, an AC voltage may be applied. The plan shape of the common transparent pixel electrode ITO2 should be referred to FIGS.

<< Gate Terminal Portion >> FIG. 10 is a diagram showing a connection structure from the scanning signal line GL of the display matrix to its external connection terminal GTM, where (A) is a plane and (B) is B in (A). 4 shows a cross section taken along section line -B. This figure corresponds to the vicinity of the lower part of FIG. 19, and the oblique wiring portion is represented by a straight line for convenience.

AO is a mask pattern for photo processing, in other words, a photoresist pattern of selective anodic oxidation. Therefore, this photoresist is removed after anodization,
The pattern AO shown in the figure does not remain as a finished product, but the locus remains because the oxide film AOF is selectively formed on the gate wiring GL as shown in the cross-sectional view. In the plan view, the left side is a region which is covered with the resist and is not anodized, and the right side is a region which is exposed from the resist and is anodized with reference to the boundary line AO of the photoresist. Anodized A
L layer g2 conductive portion of the lower formed its oxide the Al ₂ O ₃ film AOF on the surface volume decreases. Of course, anodic oxidation is performed by setting an appropriate time, voltage and the like so that the conductive portion remains. The mask pattern AO does not intersect the scanning line GL with a single straight line, but intersects by bending in a crank shape.

In the figure, the AL layer g2 is hatched for easy understanding, but the region not anodized is patterned in a comb shape. This is because, when the width of the Al layer is large, whiskers are generated on the surface. Therefore, the width of each one is narrowed, and a plurality of these are bundled in parallel to prevent the generation of whiskers and disconnect the wires. The aim is to minimize the probability and conductivity sacrifice. Therefore, in this example, the portion corresponding to the root of the comb is also shifted along the mask AO.

The gate terminal GTM is composed of a Cr layer g1 having good adhesion to the silicon oxide SIO layer and having higher contact resistance than Al or the like;
Further, it is composed of a transparent conductive layer d1 having the same level (same layer, simultaneous formation) as the pixel electrode ITO1 for protecting the surface thereof.
Note that the conductive layers d2 and d3 formed on the gate insulating film GI and on the side surfaces thereof are formed in such regions that the conductive layers g2 and g1 are not etched together due to a pinhole or the like when the conductive layers d3 and d2 are etched. It remains as a result of being covered with photoresist. In addition, the ITO layer d1 extending rightward beyond the gate insulating film GI is a thorough countermeasure.

In the plan view, the gate insulating film GI is formed on the right side of the boundary line, and the protective film PSV1 is formed on the right side of the boundary line.
Are exposed from them so that they can make electrical contact with external circuits. In the figure, only one pair of the gate line GL and the gate terminal is shown. However, in practice, a plurality of such pairs are vertically arranged as shown in FIG.
(FIGS. 18 and 19), and the left end of the gate terminal is
In the manufacturing process, the wiring is extended beyond the cutting region CT1 of the substrate and short-circuited by the wiring SHg. In the manufacturing process, such a short-circuit line SHg is used to supply power during anodization and to provide the alignment film OR.
It is useful for preventing electrostatic breakdown at the time of rubbing of I1.

<< Drain Terminal DTM >> FIGS. 11A and 11B show the connection from the video signal line DL to the external connection terminal DTM. FIG. 11A shows the plane, and FIG.
4 shows a cross section taken along section line -B. 19 corresponds to the vicinity of the upper right of FIG. 19, and the direction of the drawing is changed for convenience, but the right end corresponds to the upper end (or lower end) of the substrate SUB1.

TSTd is an inspection terminal to which an external circuit is not connected, but is wider than a wiring portion so that a probe needle or the like can be contacted. Similarly, the drain terminal D
The TM is also wider than the wiring part so that it can be connected to an external circuit. The inspection terminals TSTd and the external connection drain terminals DTM are alternately arranged in a staggered manner in the vertical direction. The inspection terminals TSTd are terminated without reaching the end of the substrate SUB1 as shown in the figure.
Constitutes a terminal group Td (subscript omitted) as shown in FIG. 19, and is further extended beyond a cutting line CT1 of the substrate SUB1.
During the manufacturing process, all of them are short-circuited to each other by the wiring SHd to prevent electrostatic breakdown. A drain connection terminal is connected to the opposite side of the matrix of the video signal line DL where the inspection terminal TSTd exists, and the drain connection terminal DTM is conversely connected.
An inspection terminal is connected to the opposite side of the matrix of the video signal line DL in which is present.

The drain connection terminal DTM is made of the Cr layer g1 and the ITO layer d1 for the same reason as the gate terminal GTM described above.
And is connected to the video signal line DL at a portion where the gate insulating film GI is removed. The semiconductor layer AS formed on the end of the gate insulating film GI is for etching the edge of the gate insulating film GI in a tapered shape. On the terminal DTM, the protective film PSV1 is removed as a matter of course for connection with an external circuit. AO is the anodic oxidation mask described above, and its boundary line is formed so as to largely surround the entire matrix. In the figure, the left side from the boundary line is covered with the mask. This pattern is not directly relevant since it does not exist.

The lead-out wiring from the matrix portion to the drain terminal portion DTM is as shown in FIG.
The structure is such that the layers d2 and d3 of the same level as the video signal line DL are stacked up to the middle of the seal pattern SL immediately above the layers d1 and g1 of the same level as the drain terminal portion DTM. Is minimized, and the Al layer d3 that is easily touched is protected as much as possible by the protective film PSV1 and the seal pattern SL.

<< Structure of Storage Capacitor Cadd >> The transparent pixel electrode ITO1 is formed so as to overlap the adjacent scanning signal line GL at the end opposite to the end connected to the thin film transistor TFT. This superposition is shown in FIG.
As is clear from FIG. 4, a storage capacitance element (capacitance element) Cadd having the transparent pixel electrode ITO1 as one electrode PL2 and the adjacent scanning signal line GL as the other electrode PL1 is formed. The dielectric film of the storage capacitor Cadd is composed of an insulating film GI used as a gate insulating film of the thin film transistor TFT and an anodic oxide film AOF.

As is apparent from FIG. 6, the storage capacitance element Cadd is formed in a portion of the scanning signal line GL where the width of the second conductive film g2 is increased. Note that the portion of the second conductive film g2 that intersects with the video signal line DL is thinned in order to reduce the probability of a short circuit with the video signal line DL.

Even if the transparent pixel electrode ITO1 is disconnected at the step of the electrode PL1 of the storage capacitor element Cadd, the second conductive film d2 and the third conductive layer d2 are formed so as to extend over the step.
The defect is compensated for by the island region constituted by the conductive film d3.

<< Equivalent Circuit of Entire Display Device >> FIG. 12 shows a connection diagram of an equivalent circuit of the display matrix portion and its peripheral circuits.
Although the figure is a circuit diagram, it is drawn corresponding to an actual geometric arrangement. AR is a matrix array in which a plurality of pixels are two-dimensionally arranged.

In the figure, X indicates a video signal line DL, and suffixes G, B and R are added corresponding to green, blue and red pixels, respectively. Y indicates the scanning signal line GL, and the suffixes 1, 2, 3,..., End are added according to the order of the scanning timing.

The video signal line X (subscript omitted) is connected to the upper video signal drive circuit He. That is, like the scanning signal line Y, the video signal line X is connected to the liquid crystal display panel PNL.
The terminal is drawn out only on one side.

The scanning signal line Y (subscript omitted) is connected to the vertical scanning circuit V.

The SUP uses a TFT liquid crystal display device to transmit information for a CRT (cathode ray tube) from a power supply circuit or a host (upper processing unit) for obtaining a plurality of divided and stabilized voltage sources from one voltage source. This is a circuit that includes a circuit that exchanges information for use.

<< Equivalent Circuit of Storage Capacitor Cadd and Its Operation >> FIG. 13 shows an equivalent circuit of the pixel shown in FIG. In FIG. 13, Cgs is a parasitic capacitance formed between the gate electrode GT and the source electrode SD1 of the thin film transistor TFT. The dielectric film of the parasitic capacitance Cgs is the insulating film GI and the anodic oxide film AOF. Cpix is a transparent pixel electrode ITO
1 (PIX) and a liquid crystal capacitance formed between the common transparent pixel electrode ITO2 (COM). The dielectric film of the liquid crystal capacitor Cpix is a liquid crystal LC, a protective film PSV1, and an alignment film ORI.
1, ORI2. Vlc is a midpoint potential.

The storage capacitance element Cadd works to reduce the influence of the gate potential change ΔVg on the midpoint potential (pixel electrode potential) Vlc when the thin film transistor TFT switches. This situation is expressed by the following equation.

ΔVlc = {Cgs / (Cgs + Cadd + Cpix)} × ΔVg Here, ΔVlc represents a change in the midpoint potential due to ΔVg. The change ΔVlc causes a DC component applied to the liquid crystal LC, but the value can be reduced as the storage capacitance Cadd is increased. Further, the holding capacitance element C
The add function has a function of prolonging the discharge time, and stores video information after the thin film transistor TFT is turned off for a long time. The reduction of the DC component applied to the liquid crystal LC improves the life of the liquid crystal LC, and can reduce so-called burn-in in which a previous image remains when the liquid crystal display screen is switched.

As described above, since the gate electrode GT is made large so as to completely cover the i-type semiconductor layer AS, the overlap area with the source electrode SD1 and the drain electrode SD2 increases, and therefore the parasitic capacitance Cgs increases. The midpoint potential Vlc has an adverse effect of being easily affected by the gate (scan) signal Vg. However, this disadvantage can be eliminated by providing the storage capacitor Cadd.

The storage capacitance of the storage capacitor Cadd is 4 to 8 times (4 · C) the liquid crystal capacitance Cpix due to the writing characteristics of the pixel.
pix <Cadd <8 · Cpix), 8 to 3 for the parasitic capacitance Cgs
The value is set to about twice (8 · Cgs <Cadd <32 · Cgs).

<< Connection Method of Storage Capacitor Cadd Electrode Line >>
The first-stage scanning signal line GL (Y ₀ ) used only as the storage capacitor electrode line is set to the same potential as the common transparent pixel electrode ITO2 (Vcom), as shown in FIG. In the example of FIG. 19, the first-stage scanning signal line is short-circuited to the common electrode COM through the terminal GT0, the lead line INT, the terminal DT0, and the external wiring. Alternatively, the first-stage storage capacitor electrode line Y ₀ is connected to the last-stage scanning signal line Yend, connected to a DC potential point (AC ground point) other than Vcom, or one extra scanning pulse Y ₀ from the vertical scanning circuit V. May be connected to receive the same.

<< Connection Structure with External Circuit >> FIG. 22 shows an integrated circuit chip CHI constituting the scanning signal driving circuit V and the video signal driving circuits He and Ho mounted on a flexible wiring substrate (TAB, Tape Automated Bonding). FIG. 23 is a cross-sectional view of a main part of a liquid crystal display panel, in this example, connected to a video signal circuit terminal DTM, of a liquid crystal display panel.

In the figure, TB is an input terminal / wiring portion of the integrated circuit CHI, TM is an output terminal / wiring portion of the integrated circuit CHI, and is made of, for example, Cu. ) Is the integrated circuit CHI
Bonding pads PAD are connected by a so-called face-down bonding method. The outer ends (commonly called outer leads) of the terminals TB and TM correspond to the input and output of the semiconductor integrated circuit chip CHI, respectively, and are connected to a CRT / TFT conversion circuit / power supply circuit SUP by soldering or the like.
It is connected to the liquid crystal display panel PNL by the anisotropic conductive film ACF. The tip of the package TCP is a panel P
The external connection terminal DTM (GTM) is connected to the protection film PSV1 or the package TC so as to cover the protection film PSV1 exposing the connection terminal DTM on the NL side.
Since at least one of P is covered, it is strong against electric contact.

BF1 is a base film made of polyimide or the like, and SRS is a solder resist film for masking so that solder does not stick to unnecessary portions during soldering. The gap between the upper and lower glass substrates outside the seal pattern SL is washed and protected by an epoxy resin EPX or the like, and the space between the package TCP and the upper substrate SUB2 is further filled with a silicone resin SIL to multiplex protection.

<< Manufacturing Method >> Next, a method of manufacturing the liquid crystal display device on the substrate SUB1 side will be described with reference to FIGS.
This will be described with reference to FIG. In the same figure, the characters in the center are the abbreviations of the process names, and the left side shows the flow of processing as viewed from the cross-sectional shape near the gate terminal shown in FIG. Except for the process D, the processes A to I are classified according to the respective photographic processes, and any cross-sectional view of each process shows a stage where the processing after the photographic process is completed and the photoresist is removed. In the present description, photographic processing refers to a series of operations from application of a photoresist to selective exposure using a mask to development thereof, and a repeated description will be omitted. A description will be given below according to the divided steps.

Step A, FIG. 14 After a silicon oxide film SIO is provided on both surfaces of a lower transparent glass substrate SUB1 made of 7059 glass (trade name) by dipping, baking is performed at 500 ° C. for 60 minutes. The film thickness is 1100Å on the lower transparent glass substrate SUB1.
The first conductive film g1 made of chromium is provided by sputtering, and after the photographic processing, the first conductive film g1 is selectively etched with a ceric ammonium nitrate solution as an etchant. Thereby, an anodized bus line SHg connecting the gate terminal GTM, the drain terminal DTM, the gate terminal GTM, a bus line SHd short-circuiting the drain terminal DTM, and an anodized pad (not shown) connected to the anodized bus line SHg. To form

Step B, FIG. 14 Al-Pd, Al-Si, Al-S having a thickness of 2800 °
Second conductive film g2 made of i-Ti, Al-Si-Cu, or the like
Is provided by sputtering. After the photographic processing, the second conductive film g2 is selectively etched with a mixed acid solution of phosphoric acid, nitric acid, and glacial acetic acid.

Step C, FIG. 14 After photographic processing (after forming the above-described anodic oxidation mask AO), 3
% Tartaric acid was adjusted to pH 6.25 ± 0.05 with ammonia, and the substrate SUB1 was immersed in an anodic oxidizing solution consisting of a solution obtained by diluting 1: 9 with an ethylene glycol solution, and the formation current density was 0.5 mA / cm. ² (constant current formation). Next, anodic oxidation is performed until the formation voltage 125 V necessary for obtaining a predetermined Al ₂ O ₃ film thickness is reached. Thereafter, it is desirable to hold this state for several tens of minutes (constant voltage formation). This is important for obtaining a uniform Al ₂ O ₃ film. Thereby, the conductive film g2 is anodized, and the scanning signal line GL, the gate electrode GT, and the electrode P
Anodized film AOF having a thickness of 1800 ° is formed on L1 Step D, FIG. 15 An ammonia gas, a silane gas and a nitrogen gas are introduced into a plasma CVD apparatus to provide a 2000 nm thick Si nitride film, and a plasma CVD method is performed. A silane gas and a hydrogen gas are introduced into the apparatus to form an i-type amorphous Si film having a thickness of 2000 °, and then a hydrogen gas and a phosphine gas are introduced into a plasma CVD apparatus to form an N ⁺ type film having a thickness of 300 ° ^. An amorphous Si film is provided.

Step E, FIG. 15 After photographic processing, SF ₆ and CC are used as dry etching gases.
Use l ₄ N ⁺ -type amorphous Si film, by selectively etching the i-type amorphous Si film, i-type semiconductor layer A
The island of S is formed.

Step F, FIG. 15 After the photographic processing, the Si nitride film is selectively etched using SF ₆ as a dry etching gas.

Step G, FIG. 16 A first conductive film d1 made of an ITO film having a thickness of 1400 ° is provided by sputtering. After the photographic processing, the first conductive film d1 is selectively etched with a mixed acid solution of hydrochloric acid and nitric acid as an etchant, thereby forming the uppermost layer of the gate terminal GTM and the drain terminal DTM and the transparent pixel electrode ITO1.
To form

Step H, FIG. 16 A second conductive film d2 made of Cr having a thickness of 600 .ANG. Is provided by sputtering, and a second conductive film d2 having a thickness of 4000 .ANG.
Pd, Al-Si, Al-Si-Ti, Al-Si-C
A third conductive film d3 made of u or the like is provided by sputtering. After the photographic processing, the third conductive film d3 is etched with the same liquid as in the step B, and the second conductive film d2 is etched with the same liquid as in the step A to form the video signal line DL, the source electrode SD1, and the drain electrode SD2. I do. Next, CCl ₄ and SF ₆ are introduced into a dry etching apparatus, and N ⁺ type amorphous S
By etching the i film, the N ⁺ type semiconductor layer d0 between the source and the drain is selectively removed.

Step I, FIG. 16 An ammonia gas, a silane gas, and a nitrogen gas are introduced into a plasma CVD apparatus to form a 1 μm-thick Si nitride film. After the photo processing, the protective film PSV1 is formed by selectively etching the Si nitride film by a photo etching technique using SF ₆ as a dry etching gas.

<< Overall Configuration of Liquid Crystal Display Module >> FIG.
Is an exploded perspective view of the liquid crystal display module MDL, and a specific configuration of each component is shown in FIGS.

SHD is a shield case (also called a metal frame) made of a metal plate, WD is a display window, INS1
To 3 are insulating sheets, PCB1 to 3 are circuit boards (PCB1
Is a drain side circuit board, PCB2 is a gate side circuit board,
PCB3 is an interface circuit board), JN is a joiner for electrically connecting the circuit boards PCB1 to PCB3, T
CP1 and TCP2 are tape carrier packages, PNL
Is a liquid crystal display panel, GC is a rubber cushion, ILS is a light shielding spacer, PRS is a prism sheet, SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflection sheet, and MCA is a lower case (mold case) formed by integral molding. , LP is a fluorescent tube, LPC is a lamp cable, and GB is a rubber bush that supports the fluorescent tube LP. The respective members are stacked in an up-down arrangement as shown in the figure to assemble the liquid crystal display module MDL.

The module MDL includes a lower case MCA,
It has two kinds of storage and holding members for the shield case SHD. Insulating sheets INS1-3, circuit boards PCB1-3,
The module MDL is formed by combining a metal shield case SHD containing and fixing the liquid crystal display panel PNL and a lower case MCA containing a backlight BL including a fluorescent tube LP, a light guide plate GLB, a prism sheet PRS, and the like. Assembled.

Hereinafter, each member will be described in detail.

<< Metal Shield Case SHD >> FIG.
FIG. 3 is a view showing the upper surface, the front side surface, the rear side surface, the right side surface, and the left side surface of the shield case SHD. FIG. 1 is a perspective view of the shield case SHD viewed from obliquely above.

Shield case (metal frame) SHD
Is manufactured by punching and bending a single metal plate by a press working technique. WD is the display panel PN
An opening that exposes L to the field of view is shown, and is hereinafter referred to as a display window.

Reference numeral NL denotes fixing claws (12 in total) between the shield case SHD and the lower case MCA, and HK denotes fixing hooks (4 in total) similarly.
It is provided integrally with the HD. The fixing claws NL shown in FIG. 1 and FIG.
After being stored in the shield case SHD, each of them is bent inward and inserted into a square fixing recess NR (see each side view in FIG. 37) provided in the lower case MCA. The fixing hooks HK are respectively fitted to fixing protrusions HP (see the side view in FIG. 37) provided on the lower case MCA. Thereby, the liquid crystal display panel PNL and the circuit board P
Shield case SHD for holding and storing CB1-3
And the lower case MCA for holding and storing the light guide plate GLB, the fluorescent tube LP and the like are firmly fixed. A thin and long rectangular rubber cushion GC (also referred to as a rubber spacer; see FIGS. 1 and 43) is provided around four edges that do not affect the display on the lower surface of the display panel PNL. The rubber cushion GC is interposed between the display panel PNL and the light guide plate GLB. By using the elasticity of the rubber cushion GC to push the shield case SHD toward the inside of the device, the fixing hook HK is hooked on the fixing projection HP, and the fixing claw NL is bent and inserted into the fixing recess NR. Therefore, each fixing member functions as a stopper, the shield case SHD and the lower case MCA are fixed, the entire module is integrally and firmly held, and other fixing members are unnecessary. Therefore, assembly is easy and manufacturing cost can be reduced. In addition, the mechanical strength is large, the vibration and shock resistance is high, and the reliability of the device can be improved. Further, since the fixing claw NL and the fixing hook HK can be easily removed (just extend the bending of the fixing claw NL and remove the fixing hook HK), disassembly and assembly of the two members are easy, so that repair is easy. , Fluorescent tube LP of backlight BL
It is also easy to replace. Further, in this embodiment, as shown in FIG. 25, one side is mainly fixed by the fixing hook HK,
Since the opposite side is fixed by the fixing claws NL, it is possible to disassemble only by removing some fixing claws NL without removing all the fixing claws NL. Therefore, repair and replacement of the backlight are easy.

CH is a common through hole provided in the same plane position as the circuit boards PCB1 to PCB3. Pins which are fixed at the time of manufacture are fixed to the shield case SHD and the circuit board PCB.
By mounting the common through holes CH in the order of 1 to 3, the relative positions of the two are accurately set. When the module MDL is mounted on an application product such as a personal computer, the common through hole CH can be used as a reference for positioning.

FGN is a total of 12 frame ground claws formed integrally with the metal shield case SHD.
The shield case SHD is formed by an elongated U-shaped opening formed in the side surface of the shield case SHD, in other words, an elongated projection extending into a square opening. This elongated projection, that is, the nail FG
N are bent at the roots in the direction toward the inside of the device, and the frame ground pads FG connected to the ground wiring (not shown) of the circuit boards PCB1 to PCB3.
P (see FIGS. 24 and 27) is connected by soldering. Since the claws FGN are provided on the side surfaces of the shield case SHD, the work of bending the claws FGN into the inside of the device and soldering them to the frame ground pads FGP requires the circuit boards PCB1 to PCB3 integrated with the liquid crystal display panel PNL. After storing in the shield case SHD and fixing it, the inner surface (lower surface) of the shield case SHD
Can be performed with the user facing upward, and the workability is good.
Also, when the nail FGN is bent, the workability of bending is good because the nail FGN does not hit the circuit boards PCB1 to PCB3. In the soldering operation, a soldering iron can be applied from the inner surface side of the opened shield case SHD, so that the workability of the soldering is good. Therefore, the nail FGN
And the connection reliability between the frame ground pad FGP and the frame ground pad FGP can be improved.

SH1 to SH4 are four mounting holes provided in the shield case SHD for mounting the module MDL as a display unit on an information processing device such as a personal computer or a word processor. The lower case MCA also has a shield case SH
Mounting holes MH1 to MH4 corresponding to the mounting holes SH1 to SH4 of D are formed (see FIGS. 37 and 38), and both of the mounting holes are fixed and mounted on the information processing apparatus through screws or the like. By the way, when the mounting hole is provided at the corner of the metal shield case SHD, a drawing portion of the mounting hole (a plane parallel to the metal plate constituting the metal shield case SHD and having a different height from the metal plate) is used. (A portion formed by drawing processing to be formed) can be made into a quarter circular shape. However, due to the arrangement of the mounting components of the circuit board PCB3 and the circuit board P3
Due to the electrical connection between CB1 and PCB2, if the mounting hole SH is not required to be provided at the corner but is required to be provided at an intermediate portion at a predetermined distance from the corner, the drawing portion D of the mounting hole SHD is required.
The shape of R cannot be made into a quarter circular shape due to the drawing process, but becomes a half circular shape, and the area required as a mounting hole becomes large. Therefore, as shown in FIG. 25, the distance between the drawn portion DR and the metal plate adjacent to the drawn portion DR is reduced.
By providing the notch L at the circular radius of / 4,
Drawing work becomes easy, drawing part DR of mounting hole SH1
Can be made into a quarter circle, and the area required for the mounting hole can be reduced. Therefore, the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced. In other words, the module MDL
The mounting hole SH is mounted on the module MDL while realizing the miniaturization of
Can be provided at an intermediate portion separated from the corner by a predetermined distance.

<< Circuit Boards PCB1 to PCB3 >> FIG. 26 is a bottom view and sectional views showing a state where the circuit boards PCB1 to PCB3 are mounted on the outer peripheral portion of the display panel PNL, and FIG. 24 is a view showing the display panel PNL and the circuit board PCB1. 3 to 3 are shield cases SH
A bottom view and each cross-sectional view showing a state housed and mounted in D,
FIG. 27 is a bottom view of the circuit boards PCB1 to PCB3 (a state where no TCP is mounted on the PCB1 and PCB2, and PCB3 is shown in more detail than FIGS. 24 and 26), and FIG. Bottom view of the circuit board PCB3 in a state where it is not mounted,
FIG. 31B is a bottom view showing a state where electronic components are mounted, and FIG.
FIG. 32 is a bottom view of the circuit board PCB1 (showing a state where TCP is not mounted), and FIG.
This indicates a state in which the CP is not mounted).

CHI1 and CHI2 are driving IC (integrated circuit) chips for driving the display panel PNL (the lower five driving IC chips in FIG. 26 are driving IC chips on the vertical scanning circuit side, and the lower ten driving IC chips are 10).
Are driving IC chips on the video signal driving circuit side). T
As described with reference to FIGS. 22 and 23, CP1 and TCP2 are tape carrier packages in which the driving IC chip CHI is mounted by the tape automated bonding method (TAB), and PCB1 and PCB2 are mounted with TCP and capacitor CDS, respectively. PCB (printed
Circuit board). FGP
Is a frame ground pad, JN3 is a joiner for electrically connecting the drain side circuit board PCB1 and the gate side circuit board PCB2, and JN1 and JN2 are joiners for electrically connecting the drain side circuit board PCB1 and the interface circuit board PCB3. is there. Joiner J shown in FIG.
N1 to N3 are formed by sandwiching and supporting a plurality of lead wires (phosphor bronze material plated with Sn) with a striped polyethylene layer and a polyvinyl alcohol layer. In addition, JN1-3 can also be comprised using FPC (flexible printed circuit).

That is, the circuit boards PCB1 to PCB3 of the display panel PNL are arranged in a U-shape on the three outer peripheral portions of the display panel PNL. Display panel PNL 1
The display panel P is provided on the outer periphery of the two long sides (the left side in FIG. 24).
A drain-side circuit board PCB1 on which a plurality of tape carrier packages TCP1 each mounting a drive IC chip (driver) CHI1 for providing a drive signal to an NL video signal line (drain signal line) is arranged. A plurality of tape carriers each having a driving IC chip CHI2 for supplying a driving signal to a scanning signal line (gate signal line) of the display panel PNL are provided on an outer peripheral portion of a short side (lower side in FIG. 24) of the display panel PNL. A gate-side circuit board PCB2 on which the package TCP2 is mounted is arranged. An interface circuit board (also referred to as a control circuit board or a converter circuit board) PCB3 is provided on the outer peripheral portion of the other short side (upper side in FIG. 24) of the display panel PNL.
Is arranged.

Since the circuit boards PCB1 to PCB3 are divided into three substantially rectangular shapes, a difference in the coefficient of thermal expansion between the display panel PNL and the circuit boards PCB1 to PCB3 causes the circuit board PCB1 to change.
The stress (stress) generated in the long axis direction of ~ 3 is joiner J
The output leads (TTM in FIGS. 22 and 23) of the tape carrier package TCP which are absorbed at the locations N1 to N3 and have low connection strength and the external connection terminals of the liquid crystal display panel PNL (FIG. 2)
2, peeling of DTM (GTM) in FIG. 23 can be prevented,
Further, it also contributes to the relaxation of the stress of the input lead of the tape carrier package TCP, and the reliability of the module against heat can be improved. Such a substrate dividing method further includes
Compared to a single U-shaped substrate, each of them has a simple rectangular shape, so that a large number of substrates PCB1 to PCB3 can be obtained from one substrate material, and the utilization rate of printed circuit board materials increases. In addition, there is an effect that the cost of parts and materials can be reduced (in the case of this embodiment, it can be reduced to about 50%). The circuit boards PCB1 to PCB3 are made of glass epoxy resin or the like.
If a flexible FPC (flexible printed circuit) is used instead of B (printed circuit board), the FPC bends, so that the effect of preventing lead peeling can be further enhanced. It is also possible to use an integrated "U" -shaped PCB that is not divided. In this case, it is possible to reduce man-hours, simplify the manufacturing process management by reducing the number of parts, and improve reliability by eliminating the joiner between circuit boards. effective.

As shown in FIG. 27, five, four and three frame ground pads FGP connected to the respective ground wirings of the three circuit boards PCB1 to PCB3 are provided, for a total of twelve. . When the circuit board is divided into a plurality of parts, no electrical problem occurs if at least one portion of the drive circuit board is connected to the frame ground in terms of direct current, but if there are few such portions in the high frequency region, In addition, the generation potential of unnecessary radiated radio waves causing EMI (electromagnetic interference) increases due to the reflection of electric signals, the fluctuation of the potential of the ground wiring, and the like due to the difference in the characteristic impedance of each drive circuit board. In particular, in an active matrix type module MDL using thin film transistors, a high-speed clock is used, so that EMI countermeasures are difficult. In order to prevent this, at least one ground wiring (AC ground potential) is connected to a common frame having a sufficiently low impedance (that is, a shield case SHD) in each of the plurality of divided circuit boards. As a result, the ground wiring in the high frequency region is strengthened.
In comparison with the case where only the shielded case is connected to the shield case SHD, the electric field intensity of
An improvement of more than dB was observed.

As described above, the frame ground claws FGN of the shield case SHD are formed of elongated metal protrusions, and can be easily bent by bending the circuit boards PCB1 to PCB1.
3 can be connected to the frame ground pad FGP, and no special wire (lead wire) for connection is required. Also, nail F
Shield case SHD and circuit board PCB1 via GN
3 can also be mechanically connected to the circuit board PCB1.
The mechanical strengths of No. to No. 3 can also be improved.

Conventionally, in order to suppress the generation of unnecessary radiated radio waves that cause EMI, a plurality of resistors and capacitors for blunting the signal waveform are provided near the signal source integrated circuit.
Or, they are distributed and arranged in the middle of a signal transmission path. Therefore, several spaces are required for providing the resistors and capacitors near the signal source integrated circuit and between the tape carrier packages, so that the dead space is increased and the electronic components can be mounted at a high density. Did not. In the present embodiment, as shown in FIG.
The signal source integrated circuit TC provided on the interface circuit board PCB3 includes a plurality of capacitors / resistors CR for countermeasures I.
Signal flow of a plurality of drive IC chips CHI1 far from ON (which will be described in detail later) and further further than drive IC chip CHI1 of drain side circuit board PCB1 which receives a signal from signal source integrated circuit TCON. It is arranged intensively at the end of the drain side circuit board PCB1 on the downstream side in the direction. Therefore, the dead space can be reduced and the electronic components can be mounted at a high density, as compared with the case where the components are distributed. Therefore, the size and weight of the module MD can be reduced, and the manufacturing cost can be reduced.

<< Drain-side circuit board PCB1 >> As shown in FIG. 24, only one drain-side circuit board PCB1 is disposed on only one long side (the left side in FIG. 24) of the long side of the display panel PNL. That is, similarly to the scanning signal line GL, the video signal line DL has a terminal extending to only one side of the liquid crystal display panel PNL. Therefore, as compared with a configuration in which video signal lines are alternately drawn to two long sides facing each other of the display panel PNL, and a drain-side circuit board is arranged outside each long side, a so-called frame portion around the display section is provided. Since the area can be reduced, the external dimensions of the liquid crystal display module MDL and an information processing device (see FIG. 47) such as a personal computer or a word processor incorporating the liquid crystal display module MDL as a display unit can be reduced, and thus the weight can be reduced. be able to. As a result, the number of materials can be reduced, so that the manufacturing cost can be reduced. The side where the drain-side circuit board PCB1 is disposed is a position where the module MDL is disposed on the upper side of the screen when the module MDL is mounted on a personal computer, a word processor or the like, as shown in FIG. For this reason, notebook-type personal computers and word processors usually require a space at the bottom of the screen to provide a hinge for attaching the display unit to the keyboard, so the drain-side circuit board is placed at the top of the screen. By doing so, the vertical position of the screen becomes appropriate. Note that FIG.
In JP1, JP11 is a pad to which the joiner JN1 is connected, JP12 is a pad to which the joiner JN2 is connected,
JP13 is a pad to which the joiner JN3 is connected.

In a conventional module in which video signal lines are alternately drawn out above and below a liquid crystal display panel and two drain-side circuit boards are arranged on both upper and lower sides of an outer peripheral portion of the liquid crystal display panel, a conventional personal computer or the like is used. Since the electronic components are arranged along the flow of signals that enter and flow in the module, a connector for connecting to a personal computer or the like and a signal source integrated circuit TC are provided at the center of the interface circuit board.
ON was arranged. When the drain-side circuit board PCB1 is arranged on one side of the liquid crystal display panel PNL as in the present embodiment, if the electronic components are arranged in accordance with the signal flow as in the conventional method, the drain-side circuit board PCB3 may be arranged. The connector CT is disposed at an end remote from the substrate PCB1, that is, at the end closest to the corner of the shield case SHD (see FIG. 24. In this embodiment, the connector CT is not disposed at the corner of the shield case SHD. Next, the layout is such that the signal source integrated circuit TCON is disposed next to the direction away from the corner. Here, if the connector CT is to be arranged at the extreme end of the circuit board PCB3, that is, at the corner of the shield case SHD, since the connector CT is connected to a personal computer or the like, it cannot be covered by the lower case MCA. The notch MLC of the lower case MCA shown in FIG. 37 is located above the connector CT), and the corners of the shield case SHD having the mounting holes SH4 are aligned with the corresponding mounting holes MH4.
Can not be covered with the lower case MCA having
The mechanical strength decreases. Therefore, in this embodiment,
As shown in FIG. 24, a low-profile signal source integrated circuit TCO
N is disposed on the extreme end of the circuit board PCB3, that is, on the circuit board PCB3 near the corner of the shield case SHD, so that the vicinity of the corner can be covered with the lower case MCA, and next to the direction away from the corner. The connector CT is arranged. That is, since the vicinity of the corner of the shield case SHD provided with the mounting hole SH4 is covered by the lower case MCA provided with the matching mounting hole MH4, when the module MDL is mounted on an information processing device such as a personal computer, the shielding of the module MDL is performed. The corners of the case SHD and the lower case MCA are both mounting holes SH4.
Further, since it is firmly pressed and fixed by screws or the like via the mounting hole MH4, the mechanical strength is improved, and the reliability of the product is improved. As shown in FIG. 47, a signal coming from a personal computer or the like first goes from the connector CT to the signal source integrated circuit TCON, and then flows toward the drive IC chip CHI1 of the drain-side circuit board PCB1. Therefore, since the flow of the signal is regular, the flow of the useless signal can be eliminated, so that the useless wiring can be reduced and the area of the circuit board can be reduced.

In the embodiment shown in FIG. 24, the signal source integrated circuit TCON and the connector CT are connected on the interface circuit board PCB3 to the side opposite to the side connected to the drain side circuit board PCB1 (the side having the joiners JN1 and JN2). It is provided in. Therefore, as shown in FIG.
The liquid crystal display module MDL is connected to its drain side circuit board P
By mounting on a personal computer, word processor, or the like with the side without the CB1 facing the hinge, the connection cable with the host can be shortened. As a result, it is possible to reduce noise entering from the connection cable between the host and the liquid crystal display module MDL. Further, since the connection between the host and the signal source integrated circuit TCON can be minimized, the resistance to noise intrusion can be further increased. Furthermore, it is strong against a rounding delay of a waveform.

<< Gate-side circuit board PCB2 >> FIG.
FIG. 3 is a plan (lower) view of a circuit board PCB2. JP23 is a pad to which the joiner JN3 is connected.

<< Tape Carrier Package TCP >> FIG.
FIG. 3 is a plan view (lower surface) of the tape carrier package TCP on which the integrated circuit chip CHI is mounted.

Regarding the structure of the tape carrier package TCP and the connection structure with the liquid crystal display panel PNL,
<Connection Structure with External Circuit> As already described with reference to FIGS. 22 and 23 which are cross-sectional views.

FIG. 33 shows the planar shape of the package TCP. The smaller outer width of the terminal portions TM and TB corresponds to a narrower terminal pitch. That is, the display panel PNL
The dimensions of the output terminal section TM connected to the input terminal section TB connected to the circuit board PCB1 or PCB2 are adjusted to the dimensions of the input terminal section TB connected to the circuit board PCB1 or PCB2. The pitch is adjusted to the pitch of the output terminals of the substrate PCB1 or PCB2.

Note that the width of either the output terminal portion TM or the input terminal portion TB may be smaller than the outermost width.

FIG. 34 is a plan (lower) view and a side view showing a state in which a plurality of tape carrier packages TCP are mounted on the circuit boards PCB1 and PCB2.

<< Interface Circuit Board PCB3 >> FIG. 29 (A) is a top view of the interface circuit board PCB3 (with the connector CT and the hybrid integrated circuit HI mounted), and FIG. 29 (B) is a signal source integrated circuit TCON, IC, capacitor, FIG. 4 is a top view in which components such as a resistor are mounted (a connector CT and a hybrid integrated circuit HI are mounted in dotted lines). The interface circuit board PCB3 includes an IC,
In addition to electronic components such as capacitors and resistors, a power supply circuit for obtaining a plurality of divided and stabilized voltage sources from one voltage source, and a CRT (cathode ray tube) from a host (upper processing unit) A circuit for converting information into information for a TFT liquid crystal display device is mounted (see FIG. 12). CT is a connector connected to an information processing device such as a personal computer on which the module MD is mounted, and TCON is a signal source integrated circuit, which processes image information sent from a host to convert the image information into a liquid crystal driving signal. , A timing pulse is generated, and the gate side circuit board PCB2 and the drain side circuit board PC
B1 is drive-controlled to display data on the liquid crystal display device.
JP31 is a connection part to which the joiner JN1 is connected, JP3
Reference numeral 2 denotes a connection portion to which the joiner JN2 is connected.

<< Electrical Connection Between Circuit Boards PCB1 to PCB >> FIG. 36 shows a state in which joiners JN1 and JN2 for electrically connecting the drain side circuit board PCB1 and the interface circuit board PCB3 are mounted in a two-tiered configuration. It is a top view and a side view.

In recent years, the number of video signal lines for designating red, green, and blue gradations has increased and the number of gradation voltages has increased with the progress of multi-color display of color liquid crystal display devices. As a result, a part having an interface function between the set side of a personal computer or the like in which the module is incorporated and the module is complicated, and it is particularly difficult to electrically connect the drain side circuit board and the interface circuit board. In addition to the increase in the number of video signal lines associated with the rapid increase in the number of colors of the liquid crystal display device, the number of connection lines is extremely large because the gradation voltage, clock, and power supply voltage, which increase in proportion to the number of colors, are also connected. To many.

As shown in FIG. 24, at the corner of the shield case SHD where the two drain side circuit boards PCB1 and the interface circuit board PCB3 are adjacent to each other,
Each connection line is drawn out at each adjacent end of the circuit boards PCB1 and PCB3, and a large number of terminals arranged in four rows of two rows are stacked in two stages in the thickness direction of the circuit board. The two connected joiners JN1 and JN2 are electrically connected. In order to connect circuit boards in this way, the space in the thickness direction of the module MDL is effectively used, and by using a multi-stage joiner, connection can be made in a small space even when the number of connection line terminals is large. The module MDL can be reduced in size and weight, and the manufacturing cost can be reduced. FIG.
In J6, JT1 is a terminal of the joiner JN1, JT2 is a terminal of the joiner JN2, PT1 is a connection terminal of the circuit board PCB1, and PT3 is a connection terminal of the circuit board PCB3.

The arrangement of the joiners in multiple stages is not limited to two, but may be three or more. Also, the electrical connection between the drain-side circuit board PCB1 and the gate-side circuit board PCB2 uses a single joiner JN3 (see FIG. 1), which is also connected by a plurality of joiners provided in a multi-stage manner. May be.

The mounting holes of the module MDL are usually arranged at the corners of the module MDL. But,
When an electrical connection between the circuit boards PCB1 and PCB3 is to be made using the joiner JN, as shown in FIG. 46, the shape of one of the circuit boards PCB3 is not a square shape but a special shape having a protruding portion. With such a shape, the efficiency of removing the circuit board is poor, and the material cost of the circuit board is improved. For this reason, in this embodiment, as shown in FIG. 24, the mounting holes SH1 and SH2 of the shield case SHD (and the mounting holes MH1 and MH of the corresponding lower case MCA).
2) Replace the module MDL, that is, the shield case SHD
, The space for connecting the joiner JN is increased by the circuit boards PCB1, PCB2,
Since the PCB 3 can be secured in a substantially square shape (a cutout for the mounting hole SH1 is formed in the circuit board PCB3), the circuit board is efficiently removed, and the material cost of the circuit board is reduced. Can be reduced.

<< Hybrid Integrated Circuit HI and Electronic Components EP Mounted on Interface Circuit Board PCB3 in Two Floors >> FIG. 30 is a lateral side view and a front side view of the hybrid integrated circuit HI mounted on the interface circuit board PCB3. .

A hybrid integrated circuit HI shown in FIG.
Is configured by hybridizing a part of the circuit and mounting a plurality of integrated circuits and electronic components on the upper and lower surfaces of a small circuit board.
One is mounted above. As shown in FIG. 30, the leads HL of the hybrid integrated circuit HI are formed long, and a plurality of electronic components EP are also mounted on the circuit board PCB3 between the circuit board PCB3 and the hybrid integrated circuit HI. Conventionally, when the number of components is large, the circuit boards on which the components are mounted are stacked in multiple stages, and the circuit boards are connected to each other using a joiner. By reducing the number of electronic components, the number of electronic components can be reduced, and a separate circuit board and a joiner are not required (the leads HL of the hybrid integrated circuit HI correspond to the joiner), so that the material cost can be reduced. In addition, the number of working steps can be reduced. Therefore, the manufacturing cost can be reduced, and the reliability of the product can be improved.

<< Insulating Sheet INS >> Insulating sheets INS1 to INS3 shown in FIG. 28 are arranged between the metal shield case SHD and the circuit boards PCB1 to PCB3 to insulate them. LT is a double-sided adhesive tape for bonding the insulating sheets INS1 to 3 and the liquid crystal display panel PNL, and ST is a double-sided adhesive tape for bonding the insulating sheets INS1 to 3 and the shield case SHD.

<< Lower Case MCA >> FIG. 37 is a top view, upper side view, rear side view, right side view, left side view, and FIG. 38 is a bottom view of the lower case MCA. .

Lower case M formed by molding
CA stands for fluorescent tube LP, lamp cable LPC, light guide plate G
It is a holding member such as LB, that is, a backlight storage case, and is made by integrally molding a single mold with a synthetic resin. For the lower case MCA, see “Shield case SH
As described in detail in "D", since the metal shield case SHD is firmly united with the fixing member and the elastic body by the action of the elastic body, the vibration and shock resistance and the thermal shock resistance of the module MDL can be improved, and the reliability can be improved. Can be improved.

On the bottom surface of the lower case MCA, a large opening MO occupying more than half the area of the surface is formed at the center except for the surrounding frame. Thereby, after assembling the module MDL, the liquid crystal display panel PNL and
Due to the repulsive force of the rubber cushion GC (see FIG. 42) between the light guide plates GLB, a force is applied to the bottom surface of the lower case MCA in a vertical direction from the upper surface to the lower surface, so that the lower case M
The bottom surface of the CA can be prevented from bulging, and the maximum thickness can be suppressed. Therefore, to reduce swelling,
Since the thickness of the lower case does not need to be increased and the thickness of the lower case can be reduced, the module MDL can be reduced in thickness and weight.

MLC is an interface circuit board PC
A heat-generating component B3, in this embodiment, a notch provided in a lower case MCA corresponding to a mounting portion of a power supply circuit (DC-DC converter) formed as a hybrid IC (for connecting a connector CT shown in FIG. 27) Notch). As described above, the heat generating portion on the circuit board PCB3 is connected to the lower case MC.
By providing the notch without being covered with A, the heat radiation of the heat generating portion of the interface circuit board PCB3 can be improved. That is, at present, the thin film transistor TF
In order to improve the performance of a liquid crystal display device using T and to improve the ease of use, it is required to increase the number of gradations and use a single power supply. The circuit to achieve this consumes large power,
If the circuit means is to be compactly mounted, high-density mounting is required, and heat generation becomes a problem. Therefore, by providing the cutout MLC corresponding to the heat generating portion in the lower case MCA, it is possible to improve the high-density mountability and compactness of the circuit. In addition, the signal source integrated circuit TCO
N is considered to be a heat-generating component, and the lower case MCA above this may be cut out.

MH1 to MH4 are four mounting holes for mounting the module MD to an application device such as a personal computer. Lower case MC for metal shield case SHD
Mounting holes SH1 to 4 corresponding to the mounting holes MH1 to MH4 of A are formed, and are fixed and mounted on the applied product using screws or the like.

<< Backlight BL >> FIG. 40A shows a fluorescent lamp LP and a lamp cable LPC1 of the backlight BL.
LPC2, main part top view of rubber bush GB1, GB2,
(B) is a sectional view taken along the line BB of (A).

The backlight BL for supplying light to the display panel PNL includes one cold cathode fluorescent tube LP, lamp cables LPC1 and LPC2 of the fluorescent tube LP, rubber bushes GB1 and G for holding the fluorescent tube LP and the lamp cable LPC.
B2, the light guide plate GLB, the diffusion sheet SPS disposed in contact with the entire upper surface of the light guide plate GLB, the reflection sheet RFS disposed in the entire lower surface of the light guide plate GLB, and the prism sheet disposed in contact with the entire upper surface of the diffusion sheet SPS It is composed of PRS.

In the module MDL, the elongated fluorescent tube LP is arranged in a space below the drain-side circuit board PCB1 and the tape carrier package TCP1 mounted on one of the long sides of the liquid crystal display panel PNL.
As a result, the external dimensions of the module MDL can be reduced, so that the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced.

[0146] The rubber bushes GB1 and GB2 hold both one cold cathode fluorescent tube LP and the lamp cables LPC1 and LPC2. That is, the fluorescent tube LP is provided with a hole (a substantially keyhole shape as shown in FIG. 40B in which a hole having a large inner diameter is connected to a hole having a small inner diameter) formed in the rubber bushes GB1 and GB2. _L, which is inserted and held in the lamp tube L, and connected to one end of the fluorescent tube LP.
PC1 is inserted and held in a groove GBD provided in a rubber bush GB2.
Lamp cable LPC2 pulled out in the same direction as 1.
It is inserted into the inner diameter of smaller hole H _S of the hole GBH rubber bushing GB2 cable pulling out side is held. Although the main portion of the hole GBH does not penetrate the rubber bushes GB1 and GB2, at least the rubber bush GB2 on the cable lead-out side has a small hole H _S of the hole GBH for pulling out the lamp cable LPC2 from the rubber bush GB2.
And a through hole having a small inner diameter is formed. With such a configuration, when the two lamp cables are pulled out in one direction, in the related art, the lamp cable protrudes from the module because there is no space for passing the lamp cable and the lamp cable does not pass through the rubber bush. In the present embodiment, since the lamp cable LPC1 does not protrude from the lower case MCA, the module MDL can be saved in space, the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced. Can be. Further, since both the fluorescent tube LP and the lamp cable LPC are held by the rubber bushes GB1 and GB2, the holding force of the lamp cable LPC causes the fluorescent tube L to be held.
Since the rubber bushes GB1 and GB2 holding P are held, the holding properties of the fluorescent tube LP can be improved. The rubber bush GB1 holds the fluorescent tube LP and one lamp cable LPC1, and the rubber bush GB2 holds the fluorescent tube LP and two lamp cables LPC1, LPC2.
However, in order to reduce the number of parts, the rubber bush GB1 shares the same shape as the rubber bush GB2.

The fluorescent tube LP and the lamp cable LPC
The shape of the holes or grooves provided in the rubber bushes GB1 and GB2 for holding is not limited to those shown in the drawings. For example, the holes or grooves for holding the fluorescent tube LP and the two lamp cables LPC may be provided independently, or the holes or grooves for the fluorescent tube LP and one or two lamp cables LPC may be appropriately shared. Is also good. The rubber bush GB1 is composed of a fluorescent lamp LP and one lamp cable LPC1.
Rubber bush GB2 is provided with a fluorescent tube LP and two lamp cables LPC1, LPC2.
The rubber bush GB1 and the rubber bush GB2 may have different shapes, such as having a hole or a groove for holding the hole.

<< Storing of Fluorescent Tube LP, Lamp Cable LPC, Rubber Bush GB in Lower Case MCA >> FIG.
(A) shows a backlight BL (fluorescent tube LP, lamp cable LPC, rubber bush GB,
Top view showing a state where the light guide plate GLB) is housed and mounted;
(B) is a sectional view taken along the line BB of (A), (C)
FIG. 4 is a cross-sectional view taken along the line CC of FIG.

In FIG. 37 showing the inner surface (upper surface) of the lower case MCA, MB is a holder for the light guide plate GLB, ML is a holder for the fluorescent tube LP, MG is a holder for the rubber bush GB,
MC1 is a storage section for the lamp cable LPC1, and MC2 is a storage section for the lamp cable LPC2.

The back light BL is shown in FIGS.
As shown in (C), it is stored in a lower case MCA which is a backlight storage case. That is, the fluorescent tube LP
Bush GB holding lamp and lamp cable LPC
1 and GB2 are fitted into a storage portion MG shown in FIG. 37 formed so that the rubber bushes GB1 and GB2 fit tightly, and the fluorescent tube LP is stored in the storage portion ML without contacting the lower case MCA. Lamp cable LPC1, LC
2 is housed in housing sections MC1 and MC2 formed of grooves formed in the lower case MCA so as to almost follow the shape of the lamp cables LPC1 and LPC2. Close to the tip connected to inverter IV, ie, rubber bush GB
Lamp cable LPC1 and lamp cable L after 2
PC2 is the circuit board P2 from the long axis direction of the circuit board PCB2.
The direction is changed almost perpendicularly to the long axis direction of CB2 (see FIGS. 1 and 3).
9), mounting hole MH3 (see FIG. 37) and circuit board PC.
It is stored in the space between B2. Lamp cable L
An inverter IV is connected to the distal ends of the PC1 and LP2, and the inverter IV is housed in an inverter housing MI provided beside the circuit board PCB2, as shown in FIG. As described above, when the module MD is incorporated in an application product such as a personal computer, the lamp cable LPC does not pass through the outer side of the module, and the inverter IV does not protrude outside the module MD. The lamp cable LPC, the rubber bush GB, and the inverter IV can be compactly stored and mounted, and the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced.

Although one fluorescent tube LP is provided in this embodiment, two or more fluorescent tubes LP may be provided, and the fluorescent tube LP may be provided on the short side of the light guide plate GLB.

<< Storing of Light Guide Plate GLB in Lower Case MCA >> FIG. 41 is a sectional view of a main part of the lower case MCA, the light guide plate GLB, the fluorescent tube LP, the lamp cable LPC and the like.

Although the conventional light guide plate has many useless areas for holding in the module and is much larger than the size of the effective light emitting portion, the light guide plate GLB of this embodiment is shown in FIG. The light guide plate G has a square shape (rectangular shape) as shown in FIG.
The overall dimensions of the LB are made as close as possible to the dimensions of the light emitting section. The three sides of the light guide plate GLB are held by the inner wall of the light guide plate storage portion of the lower case MCA formed so as to fit almost exactly, and the remaining one side of the light guide plate GLB on the fluorescent tube LP side.
The side is the lower case M between the light guide plate GLB and the fluorescent tube LP.
Near the rubber bush GB on the inner surface (upper surface) of CA,
It is held by two small projections (claws) PJ formed integrally with the lower case MCA. The projection PJ prevents the light guide plate GLB from moving toward the fluorescent tube LP, and
LB is prevented from hitting the fluorescent tube LP and damaging the fluorescent tube LP. Note that the lamp reflection sheet LS has a rectangular shape before attachment, and after the attachment, the end of the long side of the lamp reflection sheet LS is adhered to the lower surface end of the reflection sheet RFS, and extends along the entire length of the fluorescent tube LP. And the other long side end is placed and held on the top end of the prism sheet PRS. The lamp reflection sheet LS has a U-shaped cross section and is formed to have a length such that it is disposed inside the projection PJ. The projection PJ is formed as small as possible in order not to reduce the light use efficiency as much as possible.

As described above, by making the size of the light guide plate GLB as close as possible to the size of the effective light emitting portion and making it as small as possible, electronic components can be mounted in the space occupied by the conventional light guide plate, and By holding the light guide plate GLB by the projection PJ provided integrally with the lower case MCA, the light guide plate GLB can be held in a small space, so that the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced. Can be reduced. In other words, the luminous efficiency of the light guide plate GLB can be improved while realizing the miniaturization of the module MDL.

Note that the projection PJ is not necessarily provided in the lower case M
The projection may not be provided integrally with the CA, and a projection formed of a separate member such as a metal may be attached to the lower case MCA.

<< Diffusion Sheet SPS >> Diffusion Sheet SPS
Is placed on the light guide plate BLB, diffuses light emitted from the upper surface of the light guide plate GLB, and uniformly irradiates the liquid crystal display panel PNL with light.

<< Prism Sheet PRS >> The prism sheet PRS is placed on the diffusion sheet SPS, and the lower surface is a smooth surface and the upper surface is a prism surface. The prism surface includes, for example, a plurality of V-shaped grooves arranged in a straight line parallel to each other. Prism sheet PRS
Can collect the light diffused from the diffusion sheet SPS over a wide angle range in the normal direction of the prism sheet PRS, thereby improving the brightness of the backlight BL. Therefore, the power consumption of the backlight BL can be reduced, and as a result, the size and weight of the module MDL can be reduced, and the manufacturing cost can be reduced.

<< Reflective Sheet RFS >> Reflective Sheet RFS
Is disposed below the light guide plate GLB, and reflects light emitted from the lower surface of the light guide plate GLB toward the liquid crystal display panel PNL.

<< Light Guide Plate GLB and Liquid Crystal Display Panel PN
Structure for Holding L >> FIG. 42 is a cross-sectional view of a main part of the module MDL showing a structure for holding the light guide plate GLB and the liquid crystal display panel PNL.

As shown in FIG. 42, the prism sheet PR
S and the size of the diffusion sheet SPS are larger than the size of the light guide plate GLB, the ends of the prism sheet PRS and the diffusion sheet SPS protrude from the ends of the light guide plate GLB (overhang), and the side walls of the lower case MCA Rests on top.
A rubber cushion GC and a light shielding spacer ILS made of rubber are arranged on the overhang portion of the prism sheet PRS and the diffusion sheet SPS and on the side wall of the lower case MCA, and the upper transparent glass substrate SUB of the liquid crystal display panel PNL is disposed.
2 is pressed and held (see “Pressing structure of liquid crystal display panel PNL” described later and FIG. 44). As a result, both the prism sheet PRS and the diffusion sheet SPS or the diffusion sheet SPS enter the gap between the light guide plate GLB and the lower case MCA, and the light guide plate GLB is prevented from shaking, and the light guide plate GLB is connected to the module MDL. Is firmly held within. With the structure shown in FIG. 42, the pressure of the rubber cushion GC and the light shielding spacer ILS is applied to the lower case MCA via the prism sheet PRS and the diffusion sheet SPS, and the liquid crystal display panel PNL is securely held in the module MDL, The holding power of the GLB, the liquid crystal display panel PNL, and the like is improved, and the reliability of the product can be improved.

Here, both the prism sheet PRS and the diffusion sheet SPS are overhanged from the light guide plate GLB, but either one may be overhanged.
In this case, the light guide plate GLB is overhanged all around the four sides. However, it is not always necessary to overhang the light guide plate GLB all around the periphery.

<< Pressing Structure of Liquid Crystal Display Panel PNL >> FIG. 45 is a cross-sectional view of a main portion showing a pressing structure of the liquid crystal display panel PNL in the conventional liquid crystal display module MDL. FIG. 44 is a cross-sectional view of a main part showing a structure for holding down the liquid crystal display panel PNL in the liquid crystal display module MDL of one embodiment of the present invention.

In the conventional liquid crystal display module MDL, as shown in FIG. 45, when the liquid crystal display panel PNL is fixed in the module MDL, the liquid crystal display panel PNL is fixed.
Were pressed down via the rubber cushion GC. That is, as described in detail in <Shield Case SHD>, by using the elasticity of the rubber cushion GC to push the shield case SHD toward the inside of the device, the shield case SHD is pressed.
The fixing hook HK is hooked on the fixing projection HP, and the fixing claw NL is bent inward and inserted into the fixing recess NR. . Therefore, conventionally, 2
Since the two transparent glass substrates are strongly pressed through the rubber cushion GC, the gap of the liquid crystal between the two transparent glass substrates of the liquid crystal display panel PNL partially changes, and display unevenness occurs. Therefore, the liquid crystal display panel PNL could not be pressed too strongly, and sufficient mechanical strength could not be secured. On the other hand, in the present invention, as shown in FIG. 44, the dimensions of the two transparent glass substrates constituting the liquid crystal display panel PNL are changed, that is, the side where the terminals are not disposed (the side of the interface circuit board PCB3 side). As for the (side), the transparent glass substrate is projected from the other transparent glass substrate, and one glass plate portion is provided over three sides of the liquid crystal display panel PNL, and only one transparent glass substrate is attached to the one glass plate portion. Since the pressing is performed via the rubber cushion GC placed thereon, the gap between the two transparent glass substrates does not change even if the pressing is performed strongly, and display unevenness does not occur. Therefore, the pressing force of the liquid crystal display panel PNL can be increased, so that the mechanical strength is improved and the reliability can be improved. Further, a double-sided adhesive tape BAT is interposed between the upper surface of the single glass plate portion of the liquid crystal display panel PNL and the lower surface (inner surface) of the metal shield case SHD, and both are fixed. FIG. 44 is a view schematically showing a holding structure of the liquid crystal display panel PNL. Actually, a light guide plate GLB is disposed between the rubber cushion GC and the lower case MCA.

In the embodiment shown in FIG. 44, the prism sheet PRS is not limited to overhanging the above-described prism sheet PRS.
Is not overhanged on the light guide plate GLB.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and it is needless to say that various modifications can be made without departing from the scope of the invention. .

[0166]

As described above, according to the liquid crystal display device of the present invention, display unevenness can be prevented, display quality can be improved, and the pressing force of the liquid crystal display panel in the device can be increased. Therefore, the mechanical strength is improved, and the reliability can be improved. In addition, by disposing the video signal line driving circuit board only on one side of the display panel, the area of the frame around the screen can be reduced. The device can be reduced in size and weight. Furthermore, since the space can be efficiently used for storing the fluorescent tubes, the external dimensions of the liquid crystal display device can be reduced, the device can be reduced in size and weight, and the manufacturing cost can be reduced. .

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a liquid crystal display module of an active matrix type color liquid crystal display device to which the present invention is applied.

FIG. 2 is a plan view of a principal part showing one pixel of a liquid crystal display unit and its periphery.

FIG. 3 is a cross-sectional view showing one pixel and its surroundings taken along section line 3-3 in FIG. 2;

FIG. 4 is a sectional view of the additional capacitance Cadd taken along section line 4-4 in FIG. 2;

FIG. 5 is a plan view of a main part of a liquid crystal display unit in which a plurality of pixels shown in FIG. 2 are arranged.

FIG. 6 is a plan view illustrating only a pixel layer g2 and an AS shown in FIG. 2;

FIG. 7 is a plan view illustrating only layers d1, d2, and d3 of the pixel illustrated in FIG. 2;

8 is a plan view illustrating only a pixel electrode layer ITO1, a light shielding film BM, and a color filter layer FIL of the pixel illustrated in FIG.

FIG. 9 is a plan view of a main part, depicting only a pixel electrode layer, a light shielding film, and a color filter layer of the pixel array shown in FIG.

FIG. 10 is a plan view and a cross-sectional view showing the vicinity of a connection portion between a gate terminal GTM and a gate wiring GL.

FIG. 11 is a plan view and a sectional view showing the vicinity of a connection portion between a drain terminal DTM and a video signal line DL.

FIG. 12 is an equivalent circuit diagram showing a liquid crystal display section of an active matrix type color liquid crystal display device.

FIG. 13 is an equivalent circuit diagram of the pixel shown in FIG.

FIG. 14 is a flowchart of a cross-sectional view of a pixel portion and a gate terminal portion showing a manufacturing process of processes A to C on the substrate SUB1 side.

FIG. 15 is a flowchart of a cross-sectional view of a pixel portion and a gate terminal portion showing manufacturing processes of processes D to F on the substrate SUB1 side.

FIG. 16 is a flowchart of a cross-sectional view of a pixel portion and a gate terminal portion showing a manufacturing process of processes GI on the substrate SUB1 side.

FIG. 17 is a plan view for explaining a configuration of a matrix peripheral portion of a display panel.

FIG. 18 is a panel plan view for explaining a more specific example by slightly exaggerating the peripheral portion of FIG. 17;

FIG. 19 is an enlarged plan view of a corner portion of the display panel including an electrical connection portion of the upper and lower substrates.

FIG. 20 is a cross-sectional view showing the vicinity of a panel corner and the vicinity of a video signal terminal on both sides with a pixel portion of a matrix at the center.

FIG. 21 is a cross-sectional view showing a panel edge portion without a scanning signal terminal on the left side and no external connection terminal on the right side.

FIG. 22 is a diagram showing a cross-sectional structure of a tape carrier package TCP in which an integrated circuit chip CHI constituting a drive circuit is mounted on a flexible wiring board.

FIG. 23 is a fragmentary cross-sectional view showing a state where the tape carrier package TCP is connected to the video signal circuit terminal DTM of the display panel PNL.

FIG. 24 shows a liquid crystal display panel P in a shield case SHD.
Bottom view in which NL and circuit boards PCB1 to PCB3 are incorporated, A
FIG. 3 is a cross-sectional view taken along a line A-A, a cross-sectional view taken along a line AA, a cross-sectional view taken along a line BB, a cross-sectional view taken along a line CC, and a cross-sectional view taken along a line DD.

FIG. 25 is a top view, a front side view, and a front view of the shield case SHD.
It is a rear side view, a right side view, and a left side view.

FIG. 26 is a bottom view of the liquid crystal display panel PNL and the circuit boards PCB1 to 3 on which the tape carrier package TCP is mounted, a sectional view taken along the line AA, a sectional view taken along the line BB, and a sectional view taken along the line CC. It is sectional drawing and sectional drawing in the DD cutting line.

FIG. 27 is a detailed bottom view of the circuit boards PCB1 to PCB3 on which the tape carrier package TCP is not mounted.

FIG. 28 is a top view of the insulating sheets INS1 to INS3, a sectional view taken along line AA, a sectional view taken along line BB, and C.
It is sectional drawing in the -C cutting line.

FIG. 29A is an interface circuit board PCB3.
(B) is a bottom view.

FIG. 30 is a lateral side view and a front side view of the hybrid integrated circuit HI mounted on the interface circuit board PCB3.

FIG. 31 is a bottom view of the gate-side circuit board PCB1.

FIG. 32 is a bottom view of the gate-side circuit board PCB2.

FIG. 33 is a plan (lower) view of the tape carrier package TCP.

FIG. 34 is a plan (lower) view and a side view of a plurality of mounted TCPs.

FIGS. 35A, 35B and 35C are plan views of joiners JN1 to JN1 to JN3, respectively.

FIG. 36 is a plan view of the mounted joiners JN1 and JN2.
It is a side view.

FIG. 37 is a top view, a front side view, a rear side view, a right side view, and a left side view of the lower case MCA.

FIG. 38 is a bottom view of the lower case MCA.

FIG. 39A is a top view of a light guide plate GLB, a fluorescent tube LP, a rubber bush GB, and the like housed in a lower case MCA;
(B) is a cross-sectional view taken along line BB, and (C) is CC.
It is sectional drawing in a cutting line.

FIG. 40A is a top view of a main part of a backlight BL (fluorescent tube LP, lamp cable LPC, rubber bush GB), and FIG. 40B is a cross-sectional view taken along line AA.

FIG. 41 is a cross-sectional view of a main part of a backlight BL (light guide plate GLB, fluorescent tube LP, etc.) housed in a lower case MCA.

FIG. 42 is a cross-sectional view of a main part of the liquid crystal display module MD showing a structure for holding the light guide plate GLB and the liquid crystal display panel PNL.

FIG. 43 is a bottom view of the liquid crystal display panel PNL, the circuit boards PCB1 to PCB3 on which the tape carrier package TCP is mounted, and the rubber cushion GC.

FIG. 44: Shield case SHD, liquid crystal display panel PN
FIG. 6 is a cross-sectional view of main parts showing a mounting state of L, a rubber cushion GC, and a lower case MCA.

FIG. 45: Shield case SHD, liquid crystal display panel PN
FIG. 13 is a cross-sectional view of main parts showing a conventional mounting state of L, a rubber cushion GC, and a lower case MCA.

FIG. 46 shows a mounting hole S of a conventional liquid crystal display module MDL.
FIG.

FIG. 47 is a perspective view of a notebook personal computer or a word processor on which a liquid crystal display module MDL is mounted.

[Explanation of symbols]

GLB: light guide plate, PNL: liquid crystal display panel, SUB2:
Upper transparent glass substrate, SPS: diffusion sheet, PRS: prism sheet, SHD: metal shield case, MCA
… Lower case, GC… Rubber cushion, LP… Fluorescent tube,
LPC1, LPC2 ... Lamp cable, GB1, GB2
... rubber bush, GBH ... hole, GBD ... groove, BL ... backlight, GLB ... light guide plate, PJ ... projection, MCA ... lower case, GC ... rubber cushion, MO ... opening, IV ... inverter, MI ... inverter storage .

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshio Toriyama 3681 Hayano Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd. (72) Inventor Naoto Kobayashi 3681 Hayano Mobara-shi Chiba Prefecture Hitachi Device Engineering Co., Ltd. (72) Inventor Katsuhiko Yarita 3300 Hayano, Mobara-shi, Chiba Pref.Electronic Device Division, Hitachi, Ltd. (72) Inventor Hironori Kondo 3300, Hayano, Mobara-shi, Chiba Pref.Electronic Device Division, Hitachi, Ltd. 3300 Hayano, Mobara-shi, Japan F-term (Reference) in Hitachi, Ltd.Electronic Devices Division

Claims (6)

[Claims] 1. A video signal line terminal is drawn out only on one side of a liquid crystal display panel, and a video signal line driving circuit board connected to the terminal is arranged on only one side of the display panel. Liquid crystal display device. 2. A method according to claim 1, wherein the first and second insulating substrates are overlapped with a predetermined gap therebetween so that the surfaces on which the transparent pixel electrodes and the alignment film are provided face each other. And the liquid crystal is sealed inside the sealing material between the two substrates by the sealing material provided in the first insulating substrate, and a plurality of the liquid crystals are arranged on the facing surface of the first insulating substrate. In a liquid crystal display device having a liquid crystal display panel in which each terminal of a signal line and a video signal line is provided outside the sealing material, the terminal of the video signal line is drawn out to only one side of the liquid crystal display panel, and the video signal line A liquid crystal display device, wherein a circuit board for video signal line disturbance connected to the terminal is disposed only on one long side of the display panel. 3. A plurality of scanning signal lines extending in the horizontal direction and arranged in the vertical direction, a plurality of video signal lines extending in the vertical direction and arranged in the horizontal direction, and two adjacent scanning signal lines. A first insulating substrate provided with a first pixel electrode and a switching element in an intersection region between the scanning signal line and two adjacent video signal lines, and a first insulating substrate facing the first pixel electrode; In a liquid crystal display device having a liquid crystal display panel in which a second insulating substrate provided with a second pixel electrode is overlapped with a predetermined gap therebetween and a liquid crystal is sealed between the two substrates, the video signal line The liquid crystal display panel, and a video signal line driving circuit board connected to the terminal of the video signal line is disposed only on one long side of the display panel. Display device. 4. The liquid crystal display according to claim 1, wherein no circuit board is arranged on the other side of the display panel on which the circuit board for video signal line disturbance is arranged. apparatus. 5. A scanning signal line driving circuit board is disposed on one of two sides perpendicular to a side of the display panel on which the video signal line driving circuit board is disposed, and a power supply circuit and a conversion circuit are disposed on the other side. 5. The liquid crystal display device according to claim 1, wherein a circuit board having the same is arranged. 6. When the liquid crystal display device according to claim 1, 2, 3, 4, or 5 is incorporated in a predetermined information processing device as a display unit, the circuit board for driving the video signal line is provided with the display unit. An information processing device, which is arranged above a screen.