JP2002259933A - Card and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a card and a manufacturing method thereof capable of improving concealing efficiency for preventing transparency of a plastic card and using a transparent over sheet in a same thickness with an ordinary plastic card even when an IC module is provided in a card base, and capable of preventing the color of the IC module to be seen through the transparent over sheet in appearance. SOLUTION: A metallic powder containing concealing layer and a white concealing layer are formed in this order on the surface of a first opaque core sheet. After printing a design on the white concealing layer, the transparent over coat is adhered on the white concealing layer to have the printed design between them. After printing a design on a surface of a second opaque core sheet, the transparent over sheet is adhered onto the second opaque core sheet to have the printed design between them. After fitting the surface of the first opaque core sheet to the surface of the second opaque core sheet, heat and pressure is applied vertically to integrally adhere to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card with improved concealment for preventing see-through in the thickness direction of the card, and a method of manufacturing the card.

Conventionally, plastic cards used for credit cards, cash cards and the like have a transparent base material on both sides of two white core sheets made of a material such as PVC, PET-G, ABS, polycarbonate or the like. A four-layer card base material provided with a sheet is generally used. In general, these cards are often magnetic cards provided with a magnetic stripe, and particularly when a magnetic stripe is provided, it is necessary to thermally transfer the magnetic stripe to the transparent oversheet surface. It is essential to provide a transparent oversheet layer.

[0003] The thickness of the transparent oversheet slightly varies depending on the card manufacturer, but it is generally about 100 µm. If the thickness is smaller than this, handling of the sheet becomes difficult when producing by an automatic machine. This leads to a decrease in production capacity.

On the other hand, in the case of an IC card, the laminated structure of the card base is almost the same as that of the magnetic card, except that a recess is formed in the card base and the IC module is embedded in the recess. The remaining thickness of the card base in the part that has become thinner, when viewed from the back side of the card base,
Since the color of the IC module is seen through the card base material, there is a problem that the appearance is impaired, the commercial value of the card is reduced, and the appearance is poor.

[0005] Normally, an IC module is molded with an epoxy resin. However, in order to avoid the influence of visible light and ultraviolet rays on the IC chip and to prevent a circuit pattern analysis from being seen, a black or brown type is used. It is customary to add pigments, which are black or brown in color, and these colors are visible through the card substrate. Therefore, the watermark is prevented by increasing the thickness of the white core sheet as much as possible and reducing the thickness of the transparent oversheet to about 50 μm or less.

As described above, the thickness of the transparent oversheet needs to be changed between a plastic card such as a general magnetic card and the like and an IC card. However, there is a problem that material management and delivery date management become complicated.

Further, when manufacturing an IC card in the manufacture of a card, a thin transparent oversheet, which is difficult to handle in a manufacturing facility, is used, so that the yield and the production capacity are reduced, and furthermore, the magnetic capacity is reduced. There is a problem that extra time is required for switching equipment for manufacturing a general plastic card such as a card, and the production efficiency is reduced.

[0008] In addition, research and development on improving the concealability of the core sheet by increasing the content of the white additive, reducing the thickness and thickness of the IC module, and whitening the module resin have been conducted. There is a possibility that the quality may be adversely affected such as an increase in cost and a decrease in physical strength due to use, and no effective improved product has been found.

The above-mentioned problem is not limited to the IC card, and there is a risk that a similar problem may occur in a card of a specification in which various parts are embedded in a card base or internalized. An effective countermeasure is desired.

[0010]

SUMMARY OF THE INVENTION The present invention improves the concealing property of a plastic card for preventing see-through, and also allows an I.D.
Even when a C module or the like is provided, a transparent oversheet having the same thickness as that of a general plastic card such as a magnetic card can be used. Provided are a card and a method for manufacturing the card, wherein the color and the like of the IC module are not visible.

[0011]

In order to solve the above-mentioned problems, a card according to the present invention comprises a card base comprising a core sheet and a transparent oversheet adhered on both sides of the core sheet. Wherein a metallic luster concealing layer and a white opaque layer are sequentially laminated on at least one surface of the core sheet.

Further, a printing layer is provided on the white hiding layer. Furthermore, a concave portion is formed on the surface of the card substrate on the side where the metallic luster concealing layer is not laminated on the core sheet, and an IC module is embedded in the concave portion. And the core sheet,
It is characterized in that a plurality of core sheets are configured in a stacked state.

[0013] The method for manufacturing a card of the present invention comprises the following steps:
A metallic glossy concealing layer and a white concealing layer are sequentially formed on one side of the core sheet, and a pattern is printed on the white concealing layer, and a pattern is printed on one side of the second core sheet. After that, the exposed surfaces of the first core sheet and the second core sheet are overlapped with each other, and the first core sheet and the second core sheet are further sandwiched between two transparent overcoats. It is characterized in that it is superposed and bonded by applying heat and pressure from above and below.

A recess is formed on the surface of the transparent overcoat on the side on which the metallic luster concealing layer is not formed, and then an IC module is embedded in the recess. And

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the card and the method of manufacturing the card according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a cross-sectional view of an embodiment of the card of the present invention, FIG. 2 is a cross-sectional view showing the order of lamination on one core sheet in manufacturing the card of the embodiment of the present invention, and FIG. FIG. 4 is a cross-sectional view showing the order of lamination on the other core sheet when manufacturing the card of the embodiment of the present invention. FIG. 4 is a cross-sectional view of the embodiment of the card of the present invention in a state before an IC module is provided. FIG. 5 shows that a concave portion is formed in the card base material,
FIG. 6 is a cross-sectional view of the card according to the embodiment of the present invention showing a state where the IC module is provided. FIG. 6 is a cross-sectional view of the card according to the embodiment of the present invention after the IC module is provided.

As shown in FIG. 1, a card 1 according to an embodiment of the present invention has two white core sheets 2a and 2b, and a transparent oversheet 3a adhered on both front and back surfaces of the core sheets 2a and 2b. , 3b, and a metallic gloss hiding layer 4 and a white hiding layer 5 are sequentially laminated on at least one of the core sheets 2a. A printing layer 6 is provided between the white concealing layer 5 and the transparent oversheet 3a to display desired characters, pictures, marks, and the like.

The metallic luster hiding layer 4 is made of, for example, aluminum,
A layer containing silver or gold-based metal powder having high reflectivity such as copper or gold, and is printed, heat-transferred, stamped, sprayed, vapor-deposited thin film on core sheet 2a with ink or adhesive containing metal powder. It may be formed by a seal or the like, and may be formed on the entire surface of the card, or may be formed only on a part of the back surface of the IC embedded portion. Further, the white hiding layer 5 formed on the metallic luster hiding layer 4 is also formed by printing, heat transfer, stamping, spraying, vapor deposition thin film, sealing using white ink, and may be formed on the entire surface of the card. It may be formed only on a part of the back surface of the IC embedded portion.

On the other side of the card base material, a printed layer 7 is also provided between the core sheet 2b and the transparent oversheet 3b to display desired characters, patterns, marks, and the like. Further, a recess 8 having a predetermined shape is formed from the surface side of the transparent oversheet 3b on the side of the base sheet where the metallic gloss hiding layer is not laminated on the core sheet, and the IC module 9 is placed in the recess 8. It is buried.

As the core sheets 2a and 2b, substances such as milky white vinyl chloride, PET, PET-G, ABS, polycarbonate, cellulose acetate butyrate (CAB), and cellulose acetate propionate (CAP) can be used. May be about 180 to 320 μm.
The transparent oversheets 3a and 3b are respectively composed of the printing layers 6,
7 is protected, and by providing the transparent oversheets 3a, 3b on both sides of the core sheets 2a, 2b, the card base material has a more multilayered structure, so that warpage does not occur during hot pressing. These transparent oversheets 3a, 3b
Is transparent vinyl chloride, transparent PET, transparent PET-G,
It is made of a material such as transparent ABS, transparent CAB, and transparent CAP.

The core sheet 2 constituting the card base material
a and 2b are not limited to two layers as shown in the above embodiment,
A core sheet composed of one layer may be used, or three or more core sheets may be laminated.

Next, a method for manufacturing a card according to the present invention will be described with reference to FIGS. First, a 300 μm thick white core sheet 2 a shown in FIG. 2 (a) is printed on a surface side of a white core sheet 2 a by silk printing with a silver ink containing aluminum powder as shown in FIG. 2 (b) to obtain a 5 μm thick metal. The gloss layer 4 is formed on the surface of the white core sheet 2a. Furthermore,
As shown in FIG. 2C, printing is performed on the metallic gloss layer 4 by silk printing using white ink, and a white hiding layer 5 having a thickness of 5 μm is formed on the metallic gloss layer 4.

Subsequently, as shown in FIG. 2D, a desired pattern or the like is printed on the white hiding layer 5 by offset printing. Then, as shown in FIG. 2E, a transparent overcoat 3a having a thickness of 100 μm is overlaid on the uppermost portion.

On the other hand, as shown in FIGS.
On a surface side of another white core sheet 2b having a thickness of 300 μm, printing 7 of a desired pattern or the like is performed by offset printing, and a transparent overcoat 3b having a thickness of 100 μm is overlaid thereon. Then, as shown in FIG. 4, after the back surfaces of the respective white core sheets 2a and 2b are overlaid on each other, they are placed on a hot press device and hot-pressed from above and below, thereby obtaining a card base material. The whole of is bonded and integrated.

Next, the step of embedding the IC module will be described. Here, the IC module 9 is a known module in which electric elements including an IC chip and a wiring circuit are integrated. As shown in FIG. 5, after the card base material is bonded and integrated, the IC module 9 is embedded in a predetermined region from the surface side of the transparent overcoat 3b on which the metallic luster concealing layer 4 is not formed by end milling. A recess 8 suitable for removal is formed.

Then, after applying an adhesive in the concave portion 8, the IC module 9 is fitted and the two are adhered to produce an IC card as shown in FIG. The structure of the IC module 9 and a specific method of burying the IC module 9 in a card base material are conventionally known. The thickness of the card thus created is generally equal to the thickness of a credit card or the like and is 0.68 to 0.84 mm.

As the adhesive for adhering and fixing the IC module 9 to the concave portion 8 of the card base material, any adhesive such as urethane, epoxy, acrylic, and vinyl can be used. Any of a mold, a room temperature curing type, and a moisture curing type may be used. For coloring, pigments, dyes, and metallic additives are used. In the case of a pigment system, the hiding power and the adhesive strength are appropriately selected by adjusting the P / V ratio. Specifically, in the case of white color, titanium white or the like may be mixed with the adhesive.

The card manufactured as described above has a 5 μm thick metallic glossy layer 4 and a white concealing layer 5 that prevent the watermark from being seen, so that the card can be viewed from the card side where the IC module 9 is not embedded. However, the portion where the IC module 9 was embedded could not be confirmed.

[0028]

EXAMPLES For a card in which only a white ink layer was provided on a white core sheet and a card of the present invention, cards having the following conditions were prepared and the degree of see-through was compared.
As the numerical index of the degree of transparency, the transmission density of the thinnest portion of a counterbored card for embedding an IC module can be used. The conditions under which a very common IC module having a black mold part cannot be seen from the back surface are as follows. I have confirmed.

As a very common layer constitution, a thickness of 300 μm
m white PVC cores, and two transparent PVC oversheets having a thickness of 100 μm sandwiched between the two white PVC cores, a white PVC core having only a 5 μm thick white ink The reflection density was compared between the case where printing was performed and the case where printing was not performed.
As a result, compared to about 0.5 without white ink,
Although improved to about 0.7 with white ink,
The effect of preventing see-through was low. Further, even when the layer thickness of the white ink was increased to about 20 μm, the improvement was only up to about 0.8.

On the other hand, on the white PVC core, a thickness of 5
When a 5 μm thick white ink is printed on a metallic gloss layer having a thickness of 4 μm, the reflection density is 4.0 to 4.0.
It was confirmed that the improvement was as large as about 5 and a sufficient see-through preventing effect was obtained visually. In addition, it was confirmed that the whiteness of the surface of the surface was hardly changed as compared with a normal card, and there was no restriction on the print design, and normal printing was possible.

[0031]

As described above, the card of the present invention can prevent see-through of a plastic card as compared with a conventional card, and in particular, an IC module or the like is provided in a card base such as an IC card. Even if
Since the IC module and the like are not visible from the outside through the card base material, the appearance is good. In addition, the card manufacturing method of the present invention has a thickness similar to that of a general plastic card such as a magnetic card even when an IC module or the like is provided in a card base such as an IC card. Even if a transparent oversheet is used, since the IC module and the like cannot be seen from the outside through the card base from the outside, a transparent oversheet of the same thickness can be commonly used during card production, and Materials can be shared, and material procurement costs can be reduced by increasing production lots.Furthermore, equipment does not change, so switching is not required and handling is easy.
There are effects such as improvement in yield and production efficiency.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an embodiment of the card of the present invention.

FIG. 2 is a cross-sectional view showing the order of lamination on one core sheet in manufacturing the card of the embodiment of the present invention.

FIG. 3 is a cross-sectional view showing the order of lamination on the other core sheet when manufacturing the card of the embodiment of the present invention.

FIG. 4 is a cross-sectional view of an embodiment of the card of the present invention in a state before an IC module is provided.

FIG. 5 is a cross-sectional view of a card according to an embodiment of the present invention showing a state in which a concave portion is formed in a card base material and an IC module is provided.

FIG. 6 is a sectional view of the card according to the embodiment of the present invention in a state after an IC module is provided.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Card of this invention 2a, 2b Core sheet 3a, 3b Transparent oversheet 4 Metallic gloss hiding layer 5 White hiding layer 6, 7 Printing layer 8 Depression 9 IC module

Continued on the front page F term (reference) 2C005 HA06 HA17 KA02 KA09 KA10 KA40 MA12 MA19 PA03 PA20 RA12 RA15 5B035 AA00 BA05 BB09 BC00 CA01

Claims (6)

[Claims] 1. A card base comprising: a core sheet; and a transparent oversheet adhered to both front and back surfaces of the core sheet. A metallic gloss hiding layer is provided on at least one surface of the core sheet. And a white hiding layer are sequentially laminated. 2. The card according to claim 1, wherein a printing layer is provided on the white hiding layer. 3. A concave portion is formed on a surface of the card substrate on a side where the metallic luster concealing layer is not laminated on the core sheet, and an IC module is embedded in the concave portion. The card according to 1. 4. The card according to claim 1, wherein the core sheet is configured in a state where a plurality of core sheets are stacked. 5. A metallic glossy concealing layer and a white concealing layer are sequentially formed on one surface of a first core sheet, and a pattern is printed on the white concealing layer. After performing image printing on the surface of the first core sheet and the exposed surface of the second core sheet, the first core sheet and the second core sheet are overlapped with each other, and the first core sheet and the second core sheet are further interposed between two transparent overcoats. 2. A method for manufacturing a card, comprising: stacking two core sheets on top of each other and applying heat and pressure from above and below to bond and integrate them. 6. A method according to claim 1, wherein a recess is formed on the surface of the transparent overcoat on the side where the metallic glossy concealing layer is not formed, and then an IC module is embedded in the recess. The method for manufacturing a card according to claim 5, wherein