JP2002248626A - Transfer mold and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer mold suitable for use in the production of a printed wiring board and a method for manufacturing the same. SOLUTION: The transfer mold is equipped with a substrate 1 made of steel of which the grinding properties due to sand blasting are relatively low (bad) and a film 2 which is formed on the layer of the substrate 1 and comprises a ceramic of which the grinding properties due to sand blasting are higher (better) than steel and has a predetermined opening pattern 2a with a predetermined depth.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer mold and a method of manufacturing the same, and more particularly, to a transfer mold suitable for use in manufacturing a printed wiring board and a method of manufacturing the same.

[0002]

2. Description of the Related Art Generally, a transfer mold is used to transfer and mold an uneven pattern onto a film-like or plate-like member by a method such as hot pressing, and is formed by plating or chemical etching. In addition to the method, a method of processing and creating by sandblasting is known.
The processing method by sandblasting has an advantage that it can be formed at a relatively high processing speed by a dry method without using a chemical agent. FIGS. 5 and 6 show a conventional transfer mold made by such sandblasting and a method of manufacturing the same.
Then, a photoresist resin layer 22 is formed (FIG. 5B).
When exposed and developed through a predetermined mask pattern, FIG.
As shown in C, openings 22a of the same pattern are formed in the photoresist resin layer 22. Next, as shown in FIG. 5D, scanning is performed in a predetermined direction while blowing sandblast S from the sandblast nozzle 24. Thus, the ceramic plate 20 exposed at the opening 22a is ground. A reciprocating scan is performed as indicated by an arrow to grind to a desired depth. An object to be ground as shown in FIG. 6A is obtained. Although the remaining photoresist resin layer 22 is not ground by sandblasting S, it is removed with a chemical, resulting in an object to be ground K ′ in FIG. 6B. That is, it becomes a transfer mold. As shown in FIG.
As shown in the figure, the depth h 'of the grinding hole 20a' is larger in the former 22a 'than in the opening 22a "having a smaller width.
Further, the grinding hole 20a ″ in the opening 22a ″ having a small width.
(Part shown by an elliptical mark Q ′ in FIG. 6B)
7, the grinding hole 20a ″ is formed in a mortar shape. The grinding hole 2a at the opening 22a ′ having a large width is formed.
Although 0a 'is not as large as in FIG. 7, it is slightly shaped like a mortar. The transfer mold K ′ obtained in this manner is replaced with a thin plate P ′ made of, for example, a thermoplastic resin for a printed wiring board.
When a pattern is formed by hot pressing the transfer target W ′ shown in FIG. It is desired to form a predetermined conductive pattern by filling this with a conductive paste, but a highly accurate pattern cannot be obtained. On the other hand, JP-A-10-68846
In the “Waveguide-type optical transmission module and method for manufacturing the same” described in Japanese Patent Application Laid-Open Publication No. H11-207, the hermetic cap is manufactured by this, but as shown in FIG. 9A, an ethylene-based copolymer resin which is a thermoplastic resin Is melted in a solvent xylene, applied to a glass flat plate 11, and dried to form a thermoplastic resin film 12. A metal plate having a plurality of punched holes is closely adhered thereon as a mask material 13, and then, FIG.
As shown in B, hard sand particles are sprayed from above the mask material 13 to perform sandblasting. By this processing, the unmasked portion is dug. Next, FIG.
As shown in C, the mask material 13 is removed to obtain a glass plate 14 with a thermoplastic resin having a plurality of concave portions. As shown in FIG. 10, the glass plate 14 with the thermoplastic resin having the plurality of recesses formed in this way is
To obtain a hermetic cap with thermoplastic ". However, as shown in FIGS. 9A and 9B, the width of the three openings formed in the mask plate 13 is the same, and this is the same width in view of the processing method shown in FIG. Clearly there is. As described above, if the width changes, the depth of the digging into the ceramic plate or the glass plate changes. Although not described in this publication, in the case where openings having various widths are formed in the mask plate 13,
As shown in FIG. 6 and FIG. 7, the depth of the hole is also various, and it is conceivable that the hole becomes a mortar type.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide, for example, a transfer mold capable of forming a desired conductive pattern on a thermoplastic resin with high accuracy, and a method of manufacturing the same. Make it an issue.

[0004]

An object of the present invention is to provide a first layer made of a first material and a second layer formed on the first layer, which has a higher grinding property by blasting than the first material. And a second layer having a predetermined depth and a predetermined opening pattern.
Solved by Or, on the first layer made of the first material having a relatively low grinding property by blasting, the second layer made of the second material having the grinding property by blasting higher than the first material. Forming, forming a mask layer on the second layer, forming a predetermined opening pattern in the mask layer, blasting the predetermined opening pattern, the second The method of manufacturing a transfer mold according to claim 1, wherein an opening having a predetermined depth corresponding to the predetermined opening pattern is formed in the layer. As the first material, a material having a required mechanical strength and a relatively low processing speed by blasting is preferably selected.
As the second material, a material having a relatively high processing speed by blasting while preferably having mechanical strength, hardness, abrasion resistance and the like as a mold is selected.

[0005] The transfer mold of claim 1 enables a desired accurate concavo-convex pattern or opening pattern to be formed on a transfer object. Further, a highly accurate transfer mold can be produced by the manufacturing method of claim 5 described above. In the specification of the present application, “layer” includes the concept of a plate, a thin film, and the like.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A transfer mold and a method for manufacturing the same according to an embodiment of the present invention will be described below with reference to the drawings. In FIG. 1A, steel (S) as a first layer having relatively low (bad) grindability by sandblasting is shown.
On a substrate 1 made of US), a ceramic thin film 2 (having a thickness of about 50 μm) is formed as a second layer having high (good) grindability by sandblasting. This is easily formed, for example, by a known enamel technique. Moreover, you may select what is marketed as an industrial product. Figure 1
As shown by B, a masking 3 which is a photoresist layer is applied thereon. Then, as shown in FIG.
A predetermined opening pattern 3a is formed in the upper masking 3. This can be formed by coating the masking 3 with a mask plate having a predetermined pattern, exposing, and then developing as in the conventional case. According to the embodiment of the present invention, the opening 3a comprises a wide opening 3a 'and a small opening 3a ". The conventional sandblasting nozzle 24 is brought close to the masking 3 and the thin film 2. 1, the thin film 2 exposed in the opening 3a is ground by the sprayed sand S. The grinding is performed by the moving speed of the sandblasting nozzle 24, the quality and grain size of the sand, the blowing pressure, and the like. The speed changes, but under certain sandblasting conditions where these are constant, FIG.
When moving from the left end to the right end in D, the hole 2a 'in the wide opening 3a' is ground to a depth of about 5 µm. That is, the grinding speed is about 5 μm / shot. However, the hole 2a ″ at the small opening 3a ″ is about 3 μm
/ Shot. Next, when sandblasting is performed under the same conditions from the right end to the left end in FIG. 1D, a large opening 3a 'is obtained.
The hole 2a 'has a grinding depth of about 10 μm. That is, it is proportional to the number of times of SHOT. Thus, 10SH
OT brass results in a grinding depth of about 50 μm. That is, when the 10 SHOT blast is performed, the grinding depth of the hole 2a ′ is about 50 μm of the ceramic thickness in the present embodiment.
Reach However, as described above, since the grinding speed of the hole 2a ″ in the narrow opening 3a ″ drops to about 3 μm / shot, it reaches only 30 μm even in 10 SHOT. Therefore, the hole 2a ″ at the narrow opening 3a ″ also reaches the stainless steel plate 1 by further overlapping 7SHOT. However, at this stage, it has a mortar shape as shown in FIG. On the other hand, in the hole 2a 'in the wide opening 3a', the SUS plate or the stainless plate 1 is dug by 3.5 μm at this time. Further, by overlapping 5 SHOTs, as shown in FIG.
The cross-sectional shape of the hole 2a ″ at a ″ is closer to a rectangle than the hole 2a ″ in FIG. 7. The depth of the hole 2a ′ at the wide opening 3a ′ is large. In this case, the hole 2a "in the narrow opening portion 3a" is about 51 [mu] m, and the difference is as small as 5 [mu] m. Even in the opening 3a ', the cross-sectional shape of the hole 2a' is made closer to a rectangle by digging the stainless steel plate 1 by 6µm beyond the thickness of the thin film 2 exceeding 50µm. 2B is obtained as a finished product as shown in Fig. 2B.The thus-produced transfer mold K is hot-pressed on a thermoplastic thin plate P for a printed wiring board, as shown in Fig. 4. The transferred object W is obtained. By embedding the conductive paste in the turn R, a predetermined high-precision conductive pattern can be obtained.As described above, according to the embodiment of the present invention, the transfer mold having the concavo-convex pattern of various sizes. However, as described above, in the prior art method, even if a concavo-convex pattern having the same width is formed on a ceramic plate, a sandblast nozzle is required to obtain a desired depth. The grinding depth must be detected while adjusting the moving speed of the sandblast S and the ejection pressure of the sandblast S to be ejected.
However, according to the embodiment of the present invention, since the hole depth can be determined without any adjustment by the thickness of the ceramic which is the brittle material as the second layer, the depth can be controlled. Is not required at all, and the processing cost can be greatly reduced. Furthermore, since steel is used as the first layer, the transfer mold of the present embodiment is strong, and handling of the entire transfer mold formed as described above is greatly simplified as compared with the related art. The durability is high and there is almost no risk of damage. Further, when an industrial product is selected by enamel technology, the production cost can be further reduced. Also, regardless of the density of the pattern and the size of the width,
An almost constant working depth can be obtained. In addition, since the cross-sectional shape of the narrow opening hole can also be made to be a shape close to a rectangle, the transfer accuracy with respect to the object to be transferred can be greatly increased as compared with the related art.

Although the embodiments of the present invention have been described above, the present invention is, of course, not limited thereto, and various modifications can be made based on the technical concept of the present invention.

For example, in the above embodiment of the present invention, the transfer mold is used for manufacturing a printed wiring board, but it can be used for other purposes. For example, it can be used for prints and letterpress printing. Further, the present invention is applicable not only to a case where a predetermined concavo-convex pattern is formed on an object to be transferred, but also to a case where a predetermined opening pattern is formed. Similarly, an opening pattern may be formed on a printed wiring board and filled with a conductive paste. Although ceramic is used as the brittle material in the above embodiment, glass or another brittle material may be used instead.
In addition, although steel was used as a material having relatively low grindability,
Other metal materials may be used. Although ceramic is used as a material having relatively high grindability, another metal or material can be used as the material of the second layer as long as the material has relatively high grindability by blasting. The abrasive used for blasting is silica sand, river sand,
Cast iron grit, cast steel grit, cut wire, alumina grit, silicon carbide grit, slag grit, and the like can be used. This may be appropriately selected depending on the material and thickness used for the first layer and / or the second layer.

[0009]

According to the transfer mold of the first aspect of the present invention,
An accurate concavo-convex pattern or an opening pattern can be formed on the transfer object. In addition, the first layer reinforces, so to speak, the handling is simplified. Further, according to the method of manufacturing a transfer mold of the invention of claim 5, such a transfer mold can be manufactured accurately and reliably. Further, processing of holes (openings) having a constant depth becomes easy only by determining the thickness of the second layer.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a manufacturing process of a transfer mold according to an embodiment of the present invention, in which A to D show respective steps in order.

FIG. 2 is a sectional view showing a step following FIG. 1 in the order of A and B;

FIG. 3 is an enlarged sectional view of an elliptical mark Q in FIG. 2B.

FIG. 4 is an enlarged sectional view of an object to be transferred by the transfer mold of FIG. 2B.

FIG. 5 is a cross-sectional view showing a manufacturing process of a transfer mold according to a conventional example, in which A to D show respective steps in order.

FIG. 6 is a sectional view showing a step following FIG. 5 in the order of A and B;

FIG. 7 is an enlarged sectional view of an elliptical mark Q of FIG. 6B.

FIG. 8 is an enlarged sectional view of an object to be transferred by the transfer mold of FIG. 6B.

FIG. 9 is an enlarged cross-sectional view showing a manufacturing process of an airtight cap in a conventional waveguide type optical transmission module in the order of A to C.

FIG. 10 is an enlarged perspective view showing a method for manufacturing the airtight cap.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... board | substrate, 2 ... ceramic film, 3 ... photoresist film, 3a ... opening pattern, 3a '... wide opening, 3a "... small opening, 24 ... sandblast nozzle .

Claims (8)

[Claims] 1. A first layer made of a first material, and a second material having a predetermined depth on the first layer, the second material having a higher grindability by blasting than the first material. And a second layer having a predetermined opening pattern. 2. The method according to claim 1, wherein the first material is a metal material, and the second material is a brittle material.
3. The transfer mold described in 1. above. 3. The transfer mold according to claim 2, wherein the brittle material is glass or ceramic, and the metal material is steel. 4. The transfer mold according to claim 1, wherein the blasting is sand blasting. 5. A second layer comprising a second material having a higher blasting grindability than a second material having a higher blasting grindability on a first layer made of a first material having a relatively low grinding property by blasting. Forming a layer of: a step of forming a mask layer on the second layer; a step of forming a predetermined opening pattern in the mask layer; and blasting the predetermined opening pattern. A method of manufacturing a transfer mold, wherein an opening having a predetermined depth corresponding to the predetermined opening pattern is formed in the second layer. 6. The method according to claim 5, wherein the first material having a relatively low grindability is a metal material, and the second material is a brittle material. . 7. The method according to claim 6, wherein the brittle material is glass or ceramic, and the metal material is steel. 8. The method according to claim 5, wherein the blasting is sand blasting.