JP2002241473A - Thermosetting epoxy resin composition and its molding and multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition satisfying heat resistance, electrical insulating characteristic, and at the same time adhesion strength of a conductive layer on a built-up multilayer printed wiring board, and also excellent in storage stability, its molding, and a build-up multilayer printed wiring board made therefrom and capable of complying to high density. SOLUTION: This thermosetting epoxy resin composition contains (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a curing agent having a phenolic hydroxyl group, and (C) an imidazole compound having a hydroxyl group as a curing accelerator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a heat-resistant or electrical insulating property, particularly for a build-up multilayer printed wiring board.
The present invention also relates to a thermosetting epoxy resin composition and a molded product thereof that can simultaneously satisfy the adhesive strength of a conductor layer, and a build-up multilayer printed wiring board that can be manufactured at a high density by using the same.

[0002]

2. Description of the Related Art Conventionally, as a multilayer printed wiring board for electronic equipment, a prepreg obtained by impregnating a base material such as a glass cloth with an epoxy resin and dicyandiamide and drying the substrate is used.
A copper-clad laminate is used in which a predetermined number of sheets are laminated, and if necessary, a metal foil such as a copper foil is laminated on one or both sides thereof and vacuum-pressed at a high temperature (about 180 ° C.) for several hours to produce. .

[0003] Certainly, a copper-clad laminate using a prepreg impregnated with a thermosetting composition comprising such an epoxy resin and dicyandiamide is required to provide printed wiring having heat resistance, moisture resistance, crack resistance, workability and the like. Has the required characteristics required for the board. However, in recent years, multilayer printed wiring boards require high-density mounting, high integration, high-density electrical wiring, lightness, and shortness, and it is difficult for copper-clad laminates to respond to such demands. It is.

On the other hand, recently, a build-up type multilayer printed wiring board in which conductive circuit layers and interlayer insulating layers are alternately stacked has attracted attention. This build-up multilayer printed wiring board uses, as an interlayer insulating layer, a resin composition in which a curing agent or a filler is mixed with epoxy resin instead of prepreg. A printing method, a roll coating method, a lamination method using a resin film, and the like can be given. More recently, a multilayer printed wiring board has been adopted in which a resin is applied in advance on a copper foil to make a semi-cured state and the resin is used to build up the copper foil. However, such a build-up multilayer printed wiring board cannot be used with a thermosetting composition composed of an epoxy resin and dicyandiamide because it cannot be vacuum-pressed at a high temperature (around 180 ° C.) due to the manufacturing process. .

On the other hand, there has been proposed a composition using a low-temperature and fast-curing curing agent system comprising dicyandiamide and an imidazole compound as an epoxy resin. However, in such a curing agent system, the imidazole compound decomposes dicyandiamide and rapidly reacts with the epoxy resin. For this reason, there is a problem that the surface roughness of the interlayer insulating resin is not stable, the peel strength with the conductor is not secured, and peeling or the like occurs in a heat resistance test. Further, such a curing agent-based composition having a high curing rate at a low temperature has poor storage stability. Therefore, a resin composition used in a use form such as a film or a copper foil with a resin also requires storage stability in one solution, which is a problem in that respect.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and its main purpose is to provide a heat-resistant and electric-power-resistant multi-layer printed wiring board. A thermosetting epoxy resin composition and its molded product that simultaneously satisfy the insulation properties and adhesive strength of the conductor layer and have excellent storage stability, and a build-up multilayer print that can be used for high-density production using these materials. It is to provide a wiring board.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, have completed the invention having the following features. That is, the thermosetting epoxy resin composition of the present invention comprises (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a curing agent having a phenolic hydroxyl group, and (C) a curing accelerator. As an imidazole compound having a hydroxyl group.

[0008] According to a preferred embodiment, the resin composition of the present invention is characterized in that the epoxy resin (A) is previously prepared by adding 10- to an epoxy resin having one or more epoxy groups in one molecule.
(2,5-dihydroxyphenyl) -10H-oxa-
It preferably contains a phosphorus-containing epoxy resin obtained by reacting phosphenanthrene = 10-oxide, and more preferably the phosphorus content is 1 to 5% by weight.

According to another preferred embodiment, the resin composition according to the present invention is characterized in that the curing agent (B) is 10- (2,5-dihydroxyphenyl) -10H-oxa-phosphenanthrene = 10- Preferably, it contains an oxide.

According to still another preferred embodiment, the resin composition of the present invention preferably contains an inorganic or organic filler having an average particle diameter of 5 μm or less, and its content is determined by the solid content of the composition. On the other hand, the inner frame amount is more preferably 40% by weight or less.

Such a thermosetting epoxy resin composition can be made into one liquid, and the molded article of the present invention using this resin composition is obtained by coating the above-mentioned thermosetting epoxy resin composition on a support film. It is dried and formed into a film, or the above-mentioned thermosetting epoxy resin composition is coated on a supporting copper foil and dried to obtain a resin-coated copper foil. Further, the multilayer printed wiring board of the present invention is produced using the above-mentioned thermosetting epoxy resin composition or molded article.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The thermosetting epoxy resin composition of the present invention is characterized in that it contains a compound having a phenolic hydroxyl group as a curing agent and an imidazole compound having a hydroxyl group as a curing accelerator. Thus, the generation of stress can be prevented without the curing reaction of the epoxy resin proceeding rapidly, so that a stable interlayer insulating layer with little variation in various characteristics can be formed. Moreover, the surface of the cured interlayer insulating layer can be uniformly roughened in a short time, a stable peel strength with the conductor can be secured, and peeling does not occur even in a heat resistance test.

In the manufacture of a wiring board, an annealing process is usually performed to alleviate internal stress. At that time, in a low-temperature and fast-curing curing agent system composed of dicyandiamide and an imidazole compound, over-curing due to annealing lowers the adhesion strength. In this regard, according to the curing agent system of the present invention, there is no decrease in adhesion strength due to annealing, which is effective in improving adhesion. Furthermore, according to the curing agent system of the present invention,
Since the curing reaction of the epoxy resin does not proceed rapidly,
The thermosetting epoxy resin composition can be made into one liquid and has excellent storage stability, and even in the form of a film or a copper foil with a resin, sets stable production conditions for a wiring board without any reaction during storage. be able to.

Hereinafter, each component of the thermosetting epoxy resin composition of the present invention will be described in detail. First, an epoxy resin (A) having two or more epoxy groups in one molecule
As a bisphenol A type epoxy resin (for example,
Epicoat 828 manufactured by Japan Epoxy Resin Co., Ltd., Epicron 1050 manufactured by Dainippon Ink and Chemicals, Inc., bisphenol A type novolak epoxy resin, bisphenol F type epoxy resin (for example, Dainippon Ink and Chemicals, Inc.)
Epicron 830, manufactured by Toto Kasei Co., Ltd. YDF-200
1), bisphenol S type epoxy resin (for example, Epicron EXA-1514 manufactured by Dainippon Ink and Chemicals, Inc.),
Phenol novolak type epoxy resin (for example, Epicoat 152, 15 manufactured by Japan Epoxy Resin Co., Ltd.)
4), cresol novolak type epoxy resin (for example,
Epicron N-660, N- manufactured by Dainippon Ink and Chemicals, Inc.
673, N-695), biphenyl type epoxy resin (for example, Epicoat YX manufactured by Japan Epoxy Resin Co., Ltd.)
-4000) naphthalene type epoxy resin (for example, HP-4032 manufactured by Dainippon Ink and Chemicals, Inc.), dicyclopentadiene type epoxy resin (for example, HP-7200 manufactured by Dainippon Ink and Chemicals, Inc.), N-glycidyl type epoxy Resin, epoxy resin such as alicyclic epoxy resin, triglycidyl isocyanurate, urethane-modified epoxy resin,
Rubber-modified epoxy resin (eg, Nippon Soda Co., Ltd. BF
-1000, Idemitsu Petrochemical Co., Ltd. Poly bdR-
45EPI, Toto Kasei Co., Ltd. YR-450, Daicel Chemical Industries, Ltd. Eporide PB-3600, PB-47
00), known epoxy resins such as those obtained by adding a bromine or phosphorus compound to the epoxy resin can be used, but the present invention is not limited thereto, and several types may be used at the same time.

A curing agent having a phenolic hydroxyl group (B)
Examples thereof include a phenol novolak resin (for example, Meiwa Kasei H-1), an aralkylphenol resin (for example, Mitsui Chemicals XL225), and a terpene phenol resin (for example, Japan Epoxy Resin Co., Ltd. Epure MP40)
2), naphthol-modified phenolic resin (for example, Nippon Kayaku Co., Ltd. Kayacure NHN), dicyclopentadiene-modified phenolic resin (for example, Nippon Petrochemical Industries, Ltd.)
Known phenolic resins such as DDP-M), bisphenol A type novolak phenolic resin (for example, Meiwa Kasei Co., Ltd. BPA-D), and aminotriazine novolak resin (for example, ATN resin of Dainippon Ink and Chemicals, Inc.) are used. It is possible, but not limited to these. Examples of the phenolic hydroxyl group-containing cyclic phosphorus-containing compound include 10- (2,5-dihydroxyphenyl) -10H-
Oxa-phosphenanthrene = 10-oxide (for example, HCA-HQ manufactured by Sanko Corporation) can be used. Several kinds of these phenolic hydroxyl group-containing curing agents may be used at the same time.

The amount of the curing agent (B) used is (A)
It is desirable that the hydroxyl group of the phenolic resin is in the range of 0.2 to 1.3 mol per 1.0 mol of the epoxy group in the epoxy resin used as the component. The reason for this is that if the amount added is less than 0.2 mol, there are many unreacted epoxy groups and the heat resistance is reduced. If the amount added is more than 1.3 mol, many unreacted hydroxyl groups remain and the insulation properties are reduced. Inviting is not preferred.

Specific examples of the imidazole compound (C) having a hydroxyl group as a curing accelerator include 2-phenyl-
4,5-dihydroxy-methylimidazole (eg, Shikoku Chemicals 2PHZ), 2-phenyl-4-methyl 5-
Hydroxy-methylimidazole (eg, Shikoku Chemicals
2P4MHZ), 2-methyl-4,5-dihydroxy-
Methyl imidazole (eg, Shikoku Chemicals 2MHZ),
2-ethyl-4,5-dihydroxy-methylimidazole (eg, Shikoku Chemicals 2EHZ), 2-isopropyl-4,5-dihydroxy-methylimidazole (eg, Shikoku Chemicals 2IHZ), 2-n-butyl-4, 5-dihydroxy-methylimidazole (eg, Shikoku Chemicals
2BuHZ), 2-undecyl-4,5-dihydroxy-methylimidazole (Example: Shikoku Chemical Industry C11H
Z) and the like. Among them, 2-phenyl-4,
5-dihydroxy-methylimidazole (eg, Shikoku Chemicals 2PHZ), 2-phenyl-4-methyl 5-hydroxy-methylimidazole (eg, Shikoku Chemicals 2P4)
MHZ) is preferred. These curing accelerators can be used alone or in combination of two or more.

The amount of the curing accelerator (C) added is
(A) 0.5 to 1 with respect to the epoxy resin constituting the component
It is preferred to be in the range of 0% by weight. The reason for this is
If the amount is less than 0.5% by weight, the epoxy resin is insufficiently cured, while if it exceeds 10% by weight, the epoxy resin is excessively cured and becomes brittle.

If necessary, the thermosetting epoxy resin composition of the present invention may contain an inorganic or organic filler having an average particle diameter of 5 μm or less, and the content thereof is 40% by weight. Or less, more preferably 30% by weight or less. By adding this filler, a thermosetting epoxy resin composition having excellent laser drilling properties and a molded article thereof can be obtained. If the average particle diameter of the inorganic or organic filler exceeds 5 μm, the roughened shape is not stable, and if the content exceeds 40% by weight in the resin composition, CO
_{(2) The} shape of the small-diameter via of the laser is deteriorated, the throwing power of the plating is poor, and there is a problem in connection reliability. In addition, it is not preferable from the viewpoint of productivity such as lowering the laser processing speed.

Examples of the inorganic filler include barium sulfate, calcium carbonate, magnesium carbonate, magnesium oxide, aluminum hydroxide, magnesium hydroxide, barium titanate, silicon oxide powder, spherical silica, amorphous silica, talc, clay, Mica powder or the like can be used. Examples of the organic filler include, for example, silicon powder, nylon powder, fluorine powder, urethane powder, precured epoxy resin powder, crosslinked acrylic polymer fine particles, melamine resin, guanamine resin, urea resin, and these amino resins. Heat-cured and then finely pulverized. The inorganic or organic filler is not limited to these, and several kinds may be used at the same time.

Further, in the resin composition of the present invention, if necessary, a flame retardant aid such as red phosphorus, antimony trioxide and antimony pentoxide, a thickener such as orben or benton, a silicone-based or fluorine-based, Additives such as molecular defoaming agents and / or leveling agents, and adhesion-imparting agents such as imidazole, thiazole, triazole and silane coupling agents can be used. Further, if necessary, phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, titanium oxide,
Known and commonly used coloring agents such as carbon black and dyes can be used. In addition, even in such an additive, the average particle diameter of the solid-state additive is 5% for the reason described above.
It is desirable that the thickness be not more than μm.

Further, the resin composition of the present invention can be diluted with an organic solvent in accordance with various coating steps. Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone and cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, acetic acid esters such as propylene glycol monomethyl ether acetate and carbitol acetate, cellosolves such as cellosolve and butyl cellosolve, and carbitol. And carbitols such as butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like can be used alone or in combination of two or more.

Next, a multilayer printed wiring board using the thermosetting epoxy resin composition of the present invention or a molded article thereof will be described. (1) Formation of Interlayer Insulating Layer from Thermosetting Epoxy Resin Composition First, the thermosetting epoxy resin composition of the present invention is screen-printed, curtain-coated, roll-coated on an insulating substrate on which an inner conductor circuit is formed, It is applied using a known method such as spray coating, and dried. The drying conditions at this time vary depending on the solvent used, but are selected in the range of 60 to 150 ° C. for 5 to 60 minutes. Next, after drying, thermal curing is performed as needed to form an interlayer insulating layer. The thermosetting condition at this time is selected from 130 ° C. to 200 ° C. in the range of 15 to 90 minutes.

(2) Formation of Interlayer Insulating Layer from Molded Thermosetting Epoxy Resin Composition Preparation of Molded Body The resin composition constituting the molded body has a composition as a component for improving mechanical strength and flexibility. In addition to the component (A) constituting the resin composition of the present invention, a phenoxy resin, a polyacryl resin, a polyimide resin, a polyamideimide resin, a polycyanate resin, a polyester resin, a polyphenylene ether resin, and the like can be blended. These resins can be used in combination of two or more.

Such a thermosetting epoxy resin composition of the present invention is diluted with a predetermined organic solvent, applied on a supporting film or a supporting metal foil with a film coater or the like, and dried to obtain a film-shaped molded product or resin. A coated copper foil is produced. Here, examples of the support film include polyethylene, polypropylene, polyester such as polyethylene terephthalate, and polycarbonate. Examples of the supporting metal stay include copper foil. In addition, such a support may be subjected to various pretreatments (mud, corona treatment), and the thickness of the support is generally 5 to 100 μm. Further, it is desirable that the molded article is adhered and protected by a protective film or the like, and stored in a sheet or a roll.

Formation of Interlayer Insulating Layer from Film Formed Body First, the film formed body prepared as described above is
By laminating and laminating the insulating substrate on which the inner conductor circuit is formed under heating and reduced pressure, and further applying pressure, more excellent smoothness of the substrate can be obtained. The laminating conditions are as follows: temperature 70 to 150 ° C., pressure pressure 0.1 to 1 MPa
Is common. Next, after lamination, heat curing is performed as necessary to form an interlayer insulating layer. The thermosetting condition at this time is selected from 130 ° C. to 200 ° C. in the range of 15 to 90 minutes. A method for manufacturing a wiring board using a copper foil with resin will be described later.

(3) Manufacture of build-up wiring board First, through holes and via holes are drilled at predetermined positions of the interlayer insulating layer formed as described above by a drill or a laser. Is treated with a roughening agent to form fine irregularities. At this time, if necessary, physical polishing with a buff may be performed before the roughening agent treatment to stabilize the adhesiveness. The surface of the insulating layer can be roughened by immersing the substrate on which the insulating layer is formed in a solution of an oxidizing agent or the like, or by spraying a solution of the oxidizing agent or the like. Further, it can be carried out by various plasma treatments. These processes may be used in combination. Specific examples of the roughening agent include oxidizing agents such as dichromate, permanganate, ozone, hydrogen peroxide / sulfuric acid, and nitric acid, N-methyl-2-pyrrolidone,
Organic solvents such as N, N-dimethylformamide and methoxypropanol, alkaline aqueous solutions such as sodium hydroxide and potassium hydroxide, and acidic aqueous solutions such as sulfuric acid and hydrochloric acid can be used.

Next, a conductor layer is formed by dry plating such as vapor deposition, sputtering, or ion plating, or wet plating such as electroless or electrolytic plating, and a conductor circuit is formed by pattern etching. The substrate on which the conductor circuit is formed in this manner is subjected to an annealing treatment as necessary, whereby the curing of the thermosetting resin proceeds, and the peel strength of the conductor layer can be further improved. Then, if necessary, these steps are repeated several times to obtain a desired multilayer printed wiring board.

(3 ') Production of Build-up Wiring Board Using Copper Foil with Resin First, the copper foil with a resin prepared in the above (2) is laminated on a substrate on which an inner layer circuit is formed by a vacuum press. Drilling or laser drilling is performed on the through hole and the via hole, and the inside of the through hole and the via hole is desmeared to form fine irregularities. The method of forming the irregularities is the same as the method of roughening the interlayer insulating layer described above.

Next, a conductor layer is formed by dry plating such as vapor deposition, sputtering, or ion plating, or wet plating such as electroless or electrolytic plating, and a conductor circuit is formed by pattern etching. The substrate on which the conductor circuit is formed in this manner is subjected to an annealing treatment as necessary, whereby the curing of the thermosetting resin proceeds, and the peel strength of the conductor layer can be further improved. Then, if necessary, these steps are repeated several times to obtain a desired multilayer printed wiring board.

[0031]

EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but it is needless to say that the present invention is not limited to the following examples. (Synthesis Example 1) In a 1 L flask, 10- (2,5-dihydroxyphenyl) -10H-oxa-phosphenanthrene = oxide-10 (manufactured by Sanko Co., Ltd .;
A-HQ. " ), 200 g of carbitol acetate, and 5 parts of DEN431 (manufactured by Dow Chemical Japan).
25 g, 380 g of Epicoat 828 (manufactured by Japan Epoxy Resin) and 1 g of triphenylphosphine were added, and reacted at 150 ° C. for 100 minutes. The epoxy equivalent of the produced phosphorus-containing epoxy resin was 415 g / eq, and the phosphorus content was 2.5% by mass. This resin is referred to as phosphorus-containing resin A.

(Examples 1 to 8 and Comparative Examples 1 to 3) First, the thermosetting epoxy resin composition of each example was prepared by dissolving each component and a solvent in a component composition (parts by mass) shown in Table 1. , And uniformly dispersed in a three-roll mill, and then the viscosity was adjusted with a diluting solvent to produce the mixture. Next, the thus prepared thermosetting epoxy resin composition was applied to the FR-4 inner layer (core thickness 0.5 mm, copper foil thickness 18
μm) applied on the substrate by screen printing,
After drying at 20 ° C. for 20 minutes, it was cured at 150 ° C. for 30 minutes to form an interlayer insulating layer. Then, a hole is drilled at a predetermined position of the interlayer insulating layer by a drill or a laser, swelled with a mixture of an alkaline aqueous solution and a solvent, and then treated with an alkaline permanganate aqueous solution, followed by a reducing agent, and a roughening agent. Processing was performed. Thereafter, a conductor layer having a copper thickness of 35 μm was formed by electroless copper plating and electrolytic copper plating.
Annealing was performed at 60 ° C. for 60 minutes to produce a multilayer printed wiring board. The multilayer printed wiring board thus manufactured was evaluated, and the results are shown in Table 2.

(Examples 9 and 10) First, the thermosetting epoxy resin compositions of the respective examples were mixed with a dissolver in a component composition (parts by mass) shown in Table 1 using a dissolver. After uniformly dispersing with this roll mill, the viscosity was adjusted with a diluting solvent to prepare the product. Next, the thermosetting epoxy resin composition thus prepared was applied to a support film, dried and formed into a film. The molded body was formed into an FR-4 inner layer (0.5 mm in core thickness, 18 μm in copper foil thickness) in which an inner layer circuit was formed. ) Laminate both sides simultaneously on the substrate by vacuum laminator, 150
C. for 30 minutes to form an interlayer insulating layer. The lamination conditions at this time were as follows: temperature 80 ° C., pressure 1 MPa, 25
Press for 2 seconds. Then, a hole is drilled at a predetermined position of the interlayer insulating layer by a drill or a laser, swelled with a mixture of an alkaline aqueous solution and a solvent, and then treated with an alkaline permanganate aqueous solution, followed by a reducing agent, and a roughening agent. Processing was performed. Thereafter, a conductor layer having a copper thickness of 35 μm was formed by electroless copper plating and electrolytic copper plating.
Annealing was performed at 0 ° C. for 60 minutes to produce a multilayer printed wiring board. The multilayer printed wiring board thus manufactured was evaluated, and the results are shown in Table 2.

(Examples 11 and 12) First, the thermosetting epoxy resin composition of each example was prepared by mixing each component and a solvent with a dissolver according to the component compositions (parts by mass) shown in Table 1.
After uniformly dispersing with a three-roll mill, the viscosity was adjusted with a diluting solvent to prepare a product. Next, the thermosetting epoxy resin composition thus prepared was applied on a supporting copper foil and dried, and the molded article obtained was coated with an FR-4 inner layer (core thickness 0.5 mm, copper foil, The thickness is 18 μm) The resin layer is laminated on both sides of the substrate such that the resin layer is on the substrate side, and the pressure is 2.5M.
Hot pressing was performed for 1 hour at Pa and a temperature of 170 ° C. to form a resin-coated copper foil layer. Then, a hole was drilled at a predetermined position of the resin-coated copper foil layer with a drill or laser, desmearing was performed, and then copper plating was performed to form a conductor layer having a copper thickness of 35 μm, thereby producing a multilayer printed wiring board. The multilayer printed wiring board thus manufactured was evaluated, and the results are shown in Table 2.

[0035]

[Table 1]

[0036]

[Table 2]

[0037]

As described above, according to the present invention, in a build-up multilayer printed wiring board, heat resistance, electrical insulation properties, and adhesive strength of a conductor layer are simultaneously satisfied,
In addition, it is possible to provide a thermosetting epoxy resin composition having excellent storage stability, a molded article thereof, and a build-up multilayer printed wiring board which can be manufactured at a high density produced by using the same.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court ゛ (Reference) // C08L 63:00 C08L 63:00 (72) Inventor Naoki Yoneda 388 Okura Oaza, Arashiyama-cho, Hiki-gun, Saitama (72) Inventor Naoko Ota, 388 Ookura, Oaza, Arashiyama-cho, Hiki-gun, Saitama F-term (reference) 4F071 AA42 AC11 AE02 AE17 AH13 BB02 BC01 4J036 AB17 AD07 AD08 AD21 AE07 AF05 AF06 AF08 AF19 CC02 DC41 DD07 FA03 FA04 FA05 FB02 FB03 FB06 FB07 FB08 FB09 FB10 FB13 FB16 JA08 5E346 CC09 CC13 CC32 DD03 DD16 DD17 DD22 DD32 EE18 EE33 EE35 GG15 GG27 HH11H18

Claims (11)

[Claims] 1. A composition comprising (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a curing agent having a phenolic hydroxyl group, and (C) an imidazole compound having a hydroxyl group as a curing accelerator. The thermosetting epoxy resin composition characterized by the above-mentioned. 2. The epoxy resin (A) is prepared by previously adding an epoxy resin having one or more epoxy groups in one molecule.
The thermosetting epoxy resin composition according to claim 1, comprising a phosphorus-containing epoxy resin obtained by reacting-(2,5-dihydroxyphenyl) -10H-oxa-phosphenanthrene = 10-oxide. object. 3. The thermosetting epoxy resin composition according to claim 2, wherein the phosphorus-containing epoxy resin has a phosphorus content of 1 to 5% by weight. 4. The thermosetting epoxy resin composition according to claim 1, wherein the curing agent (B) has two or more phenolic hydroxyl groups. 5. The method according to claim 1, wherein the curing agent (B) is 10- (2,5-
The thermosetting epoxy resin composition according to any one of claims 1 to 4, further comprising (dihydroxyphenyl) -10H-oxa-phosphenanthrene = 10-oxide. 6. The thermosetting epoxy resin composition according to claim 1, further comprising an inorganic or organic filler having an average particle size of 5 μm or less. 7. The content of the inorganic or organic filler is:
7. The thermosetting epoxy resin composition according to claim 6, wherein the content of the composition is 40% by weight or less based on the solid content of the composition. 8. The thermosetting epoxy resin composition according to claim 1, wherein the thermosetting epoxy resin composition is a one-part liquid. 9. A molded article formed by applying the thermosetting epoxy resin composition according to any one of claims 1 to 8 on a support film and drying to form a film. 10. A molded article which becomes a resin-coated copper foil by applying and drying the thermosetting epoxy resin composition according to claim 1 on a supporting copper foil. 11. A multilayer printed wiring board produced by using the thermosetting epoxy resin composition or the molded article according to claim 1. Description: