JP2002232009A - Light emitting diode array, and light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting diode which can enhance versatility. SOLUTION: Terminals 20 for connection of light emitting diodes are arranged at equal intervals and besides rectilinearly on the surface side of a flexible board 10, and surface mounting type light emitting diodes 11 are connected to them, on the surface side of the flexible board 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a light emitting diode array and a light source device with improved versatility.

[0002]

2. Description of the Related Art In recent years, as a light source device, instead of a light source such as a light bulb, a light source device in which a light emitting diode array in which a plurality of light emitting diodes are arranged on a substrate is housed in a light source device body has been widely used in various fields. ing. For example, as a light source device such as a high-mount stop lamp or a tail lamp for a vehicle, a light source device in which a light emitting diode array is disposed in a light source device main body has been put to practical use. Such a light emitting diode array and a light source device have advantages such as low power consumption, low heat generation, and a long life as compared with those using a light bulb or the like as a light source.

Incidentally, a light emitting diode array of this type is generally composed of a plurality of so-called bullet-shaped light emitting diodes arranged on a hard substrate such as a glass epoxy substrate. In this case, in the shell-type light emitting diode, a lead wire is inserted from the front side into a through hole portion formed on the substrate, and the inserted lead wire is soldered to a conductive pattern or the like disposed on the back surface of the substrate. By being attached, it is fixed to the substrate and electrically connected.

[0004]

However, when the light emitting diode array is formed by using a hard substrate such as a glass epoxy substrate as described above, it is difficult to apply the light emitting device effectively depending on the shape of the light source device body. There are cases. That is, for example, when disposing the light emitting diode array in the light source device main body having a curved inner shape, it is difficult to efficiently arrange the light emitting diodes along the curved shape of the light source device main body. As a result, there is a possibility that the light amount of the entire light source device becomes insufficient. Dealing with this,
It is conceivable that the substrate of the light emitting diode array itself is curved in accordance with the shape of the light source device main body.However, arranging the light emitting diodes on the curved substrate causes a reduction in workability and the like. A light-emitting diode array that is formed in a curved shape is difficult to be used for other light source devices or the like, and thus has poor versatility.

[0005] Further, as described above, when a joint (solder joint) with each light emitting diode is provided on the back side of the substrate,
Since the back side of the substrate has a complicated uneven shape, it is difficult to provide a heat dissipation member or the like in close contact with the back side of the light emitting diode array. In this case, since the light emitting diode generally has a characteristic that the luminous intensity decreases as the temperature rises, the use conditions of the light emitting diode and the light source device to which the light emitting diode is applied are limited.

Accordingly, it is an object of the present invention to provide a light emitting diode array which can improve versatility, and a light source device using the light emitting diode array.

[0007]

According to a first aspect of the present invention, there is provided a light emitting diode array, comprising: a flexible substrate having at least a portion of a conductive pattern exposed on a surface side; And a plurality of light emitting diodes whose lead portions are surface-connected to the conductive pattern exposed on the front surface side and whose bottom surface is close to the front surface side of the flexible substrate.

According to the first aspect of the present invention, the flexible substrate includes one or more flexible insulating layers, and a conductive pattern is disposed on at least one of the insulating layers. What was done. Further, the thickness of the flexible substrate is not particularly limited,
It is desirable that it is about 50 (μm) to 500 (μm). The light emitting diode is a so-called surface mount type light emitting diode, which is a light emitting diode having a lead portion that can be surface-connected to a conductive pattern exposed on the surface side of the flexible substrate, and the bottom surface of the light emitting diode is in close contact with the flexible substrate. Approximately 5 (mm).
In this case, specifically, the distance from the bottom surface of the light-emitting diode to the flexible substrate is, for example, within the above-described distance range, and the distance at which no crack or the like occurs in the flexible substrate when the light-emitting diode array is curved. Is set to The light-emitting diode array has a configuration in which a plurality of so-called surface-mounted light-emitting diodes are joined to the front surface of the flexible substrate via a conductive pattern exposed on the front surface of the flexible substrate, so that the back surface of the flexible substrate is The formation of a complicated uneven shape is prevented. Further, since the flexible substrate has flexibility, it can be used in a state where the light-emitting diode array is curved, and the versatility is improved.

According to a second aspect of the present invention, in the light emitting diode array according to the first aspect, at least a part of the conductive pattern is disposed immediately below a portion where the light emitting diode is disposed. It is characterized by the following.

According to the second aspect of the present invention, the heat generated by each light emitting diode is radiated through the conductive pattern disposed immediately below the light emitting diode.

According to a third aspect of the present invention, in the light emitting diode array according to the first or second aspect, the light emitting diode arrays can be connected to each other in parallel via connector terminals. And

According to the third aspect of the invention, by connecting the light emitting diode arrays in parallel with each other via the connector terminal, a light emitting diode array having a size suitable for the purpose of use can be constructed, and the versatility is improved. .

According to a fourth aspect of the present invention, in the light emitting diode array according to the third aspect, the connector terminal is provided on at least the flexible substrate so that the light emitting diode arrays can be connected to each other in four directions in parallel. It is characterized by being provided in four places.

According to the fourth aspect of the present invention, by providing the connector terminals at at least four positions on the flexible substrate, variations in connecting the light emitting diode arrays in parallel with each other are improved, and versatility is improved.

According to a fifth aspect of the present invention, in the light emitting diode array according to any one of the first to fourth aspects, the light emitting diodes are linearly and equidistantly arranged on the flexible substrate. It is characterized by being arranged.

According to the fifth aspect of the present invention, by arranging the respective light emitting diodes linearly and at equal intervals on a flexible substrate, the light quantity and directivity of the entire light emitting diode array are prescribed. . in this case,
The interval between the arranged light emitting diodes is set according to the amount of light and the like required for the light emitting diode array. However, considering the ease of bending when using the light emitting diode array in a curved manner, it is 10 (mm). It is desirable to separate them as described above.

According to a sixth aspect of the present invention, in the light emitting diode array according to any one of the first to fifth aspects, a current limiting resistor is provided on a surface side of the flexible substrate, and Are connected in series to the respective light emitting diodes via the conductive pattern exposed on the surface side of the flexible substrate.

In the present invention, the current flowing through the light emitting diode array is rated by connecting a current limiting resistor to each light emitting diode in series. Further, by connecting the resistor to the front surface of the flexible substrate via the electrode pattern exposed on the surface of the flexible substrate, the back surface of the flexible substrate is prevented from having a complicated uneven shape. In this case, it is desirable to set the resistance value of the resistor to be used according to the power supply or power supply circuit used.

According to a seventh aspect of the present invention, in the light emitting diode array according to any one of the first to sixth aspects, at least each of the light emitting diodes is disposed on the back side of the flexible substrate. The reinforcing member is provided at a position corresponding to the position where the user has moved.

According to the seventh aspect of the present invention, the reinforcing member is provided at a position corresponding to at least the position where each of the light emitting diodes is provided on the back surface side of the flexible substrate, so that the light emitting diode is attached to the flexible substrate. Strength is improved.

According to an eighth aspect of the present invention, in the light emitting diode array according to the seventh aspect, the reinforcing member has a heat radiation function.

According to the eighth aspect of the present invention, by providing the reinforcing member with a heat radiating function, the heat generated by the light emitting diode is radiated through the reinforcing member.

According to a ninth aspect of the present invention, in the light emitting diode array according to the seventh or eighth aspect, the reinforcing member is formed at least larger than a bottom area of each of the light emitting diodes. I do.

According to the ninth aspect of the present invention, by forming the reinforcing member larger than the bottom area of each light emitting diode, the mounting strength of the light emitting diode to the flexible substrate is further improved. In this case, a plurality of reinforcing members may be provided corresponding to each light emitting diode, or a reinforcing member corresponding to each light emitting diode may be integrally formed. When the reinforcing members corresponding to the respective light emitting diodes are formed integrally, it is desirable that the reinforcing members have flexibility, and more specifically, the reinforcing members are made of silicon rubber having good heat conductivity. Is desirable.

According to a tenth aspect of the present invention, in the light emitting diode array according to any one of the seventh to ninth aspects, the flexible substrate is provided with a hole directly below each of the arranged light emitting diodes. And the hole is filled with a heat conductive member, and the light emitting diodes and the reinforcing member are joined via the heat conductive member.

According to the tenth aspect of the present invention, a flexible board is formed having a hole immediately below each light emitting diode, and the hole is filled with a heat conductive member, and each light emitting diode is filled through the heat conductive member. By joining the and the reinforcing member, the heat generated by the light emitting diode is transmitted to the reinforcing member and is radiated through the reinforcing member. In this case, the heat conducting member may be a plate having good heat conductivity along the hole, but is preferably a resin adhesive having good heat conductivity.

The light source device according to the eleventh aspect of the present invention
A light source device main body; and the light emitting diode array according to any one of claims 1 to 10 housed in the light source device main body.

According to the eleventh aspect of the invention, the light emitting diode array according to any one of the first to tenth aspects is housed in the light source device main body, so that the light source device corresponding to various uses can be easily realized. Can be configured. The use of the light source device is not particularly limited, but is particularly suitable for, for example, a tail lamp or a high-mount stop lamp of a vehicle.

[0029]

Embodiments of the present invention will be described below with reference to the drawings. The drawings relate to the first embodiment of the present invention. FIG. 1 is a rear view showing a main part of a vehicle body, FIG. 2 is a plan view of a light emitting diode array, FIG. 3 is a plan view of a flexible substrate, and FIG. FIG. 5 is a plan view showing a conductive pattern provided on the front side, FIG. 5 is a plan view showing a conductive pattern provided on the back side of the insulating layer together with a solder resist, and FIG.
7 is a circuit configuration diagram of a light emitting diode array, FIG. 7 is a plan view of a reinforcing member, FIG. 8 is a side view of the reinforcing member, and FIG. 9 is an explanatory diagram showing an example in which a plurality of light emitting diode arrays are connected.

In FIG. 1, reference numeral 1 denotes a vehicle such as an automobile, and a light source device 2 (for example, a tail lamp) of the vehicle 1
Includes a light source device main body 5 (for example, a tail lamp housing), a plurality of (for example, four) light emitting diode arrays 6 housed in the light source device main body 5, and a lamp cover 7.

As shown in FIG. 2, the light-emitting diode array 6 includes a flexible substrate 10 and a plurality (for example, 5) linearly arranged on the surface of the flexible substrate 10 at equal intervals of, for example, 20 mm. So-called surface-mounted light-emitting diodes (hereinafter simply referred to as light-emitting diodes)
11, a resistor 12 disposed on the front surface side of the flexible substrate 10, and a reinforcing member 13 fixed on the rear surface side of the flexible substrate.

The flexible substrate 10 has a first solder resist layer 15 made of, for example, a flexible resin member, an insulating layer 16 and a second solder resist layer 17 laminated in this order from the front side, and the essential parts are formed. It is configured.

As shown in FIG. 3, the flexible substrate 10
On the surface side of the, linearly and at equal intervals along the longitudinal direction,
Five light emitting diode connection terminals 20 are provided so as to be exposed from the first solder resist layer 15. Each light-emitting diode connection terminal 20 has one anode-side terminal 20a and three cathode-side terminals 20b, and these are arranged at positions forming the vertices of a quadrilateral.

As shown in FIG. 2, the light emitting diodes 11 are connected to the respective light emitting diode connecting terminals 20. That is, the light emitting diode 11 is formed of a flat light emitting diode having a rectangular planar shape, and each terminal 20a, 2 is connected to a lead frame provided along the side.
0b, one anode-side lead portion 11a;
Three cathode-side lead portions 11b extend.
And each lead part 11a, 11b is connected to each terminal 20a,
20b to the flexible substrate 10 by soldering or the like.
Are electrically connected on the surface side of the. At this time, although not shown, each light emitting diode 11 is mounted with its bottom surface in close contact with the surface of the flexible substrate 10.

As shown in FIG. 3, the positive terminal 21a and the negative terminal 2
1b is provided so as to be exposed from the first solder resist layer 15. FIG.
As shown in the figure, the resistor 12 for current limiting is connected to the resistor connection terminal 21. In other words, the resistor 12 is formed of a flat flat rectangular resistor, and the lead portions 12a are provided at both ends. And each lead portion 12a
Are electrically connected to the terminals 21a and 21b on the front surface side of the flexible substrate 10 by soldering or the like.

As shown in FIG. 3, both ends of the flexible substrate 10 in the longitudinal direction are partially extended, respectively.
On the surface side of these parts, connector terminals 25 capable of connecting the light emitting diode array 6 to each other along the longitudinal direction are provided in a state of being exposed from the first solder resist layer 15. Further, a pair of connector terminals 26 capable of connecting the light emitting diode array 6 to each other along the lateral direction are provided in the middle of the front surface side of the flexible substrate 10.
Is provided so as to be exposed from the solder resist layer 15. These connector terminals 25 and 26 are respectively
Positive terminal 25a, 26a and negative terminal 25b, 26
b.

More specifically, the flexible substrate 10 will be described with reference to FIGS.
A plurality of conductive patterns 30 and 31 are provided on the front side and the back side (the inner side of the second solder resist layer 17), respectively, and are joined to the insulating layer 16 via an adhesive (not shown). A part of the conductive pattern 30 disposed on the surface side of the insulating layer 16 is exposed from the first solder resist layer 15 so that the terminals 20a, 20b, 21
a, 21b, 25a and 25b are formed.

In this case, the first and second solder resist layers 15 and 17 have a thickness of, for example, about 5 (μm), and the insulating layer 16 has a thickness of, for example, about 25 (μm). Have been. Also, the first and second conductive patterns 30 and 3
1 has a thickness of, for example, about 35 (μm), and assuming that the thickness of the adhesive for joining each of the conductive patterns 30 and 31 to the insulating layer 16 is, for example, 30 (μm), a flexible material is formed when these are laminated. The overall thickness of the substrate 10 is 165 (μ
m).

Here, as shown in FIG. 4, the conductive patterns 30 are arranged so that at least a part thereof is located immediately below each light emitting diode 11.

Further, the conductive pattern 30 provided on the front side of the insulating layer 16 and the conductive pattern 31 provided on the back side of the insulating layer 16 are partially connected to each other, as shown in FIG.
The circuit shown in FIG.

That is, the anode terminal 20a and the cathode terminal 20b of the adjacent light emitting diode connection terminals 20 are electrically connected to each other, whereby the light emitting diodes 11 are connected in series.

The anode terminal 20a of the light emitting diode connecting terminal 20 located at one end of the flexible substrate 10 is connected to the negative electrode side terminal 21b of the resistor connecting terminal 21. Resistance 1
2 are connected in series.

The positive terminals 25a and 26a of the connector terminals 25 and 26 are connected to each other, and the positive terminal 21a of the resistance connection terminal 21 is connected to these terminals.

Further, the negative terminals 25b and 26b of the connector terminals 25 and 26 are connected to each other, and the cathode terminals 20b of the light emitting diode connecting terminals 20 located at the other end of the flexible substrate 10 are connected to these terminals. ing.

Here, the resistance value of the resistor 12 is such that when a predetermined DC power supply (for example, a DC power supply of 13 (V)) is connected, the current flowing through each light emitting diode 11 is rated to a predetermined value. ing.

The reinforcing member 13 is made of, for example, a silicone resin having flexibility and good thermal conductivity, and is formed in a rectangular plane substantially along the flexible substrate 10 as shown in FIGS. The top surface is tightly joined to the back surface of the flexible substrate 10. A plurality of heat dissipating fins 13a are formed on the back surface of the reinforcing member 13. That is, the reinforcing member 13 has a function of improving the mounting strength of the light emitting diode 11 and a function of radiating heat generated by the light emitting diode 11 and quickly radiating the heat transmitted to the rear surface side of the flexible substrate 10.

In the light emitting diode array 6 configured as described above, each light emitting diode 11 is turned on in FIG.
As shown in (1), for example, this is realized by connecting a DC power supply 30 such as an in-vehicle battery to either the connector terminal 25 or the connector terminal 26.

As shown in FIGS. 6 and 9, the light-emitting diode array 6 has a plurality of light-emitting diode arrays 6 arranged in a longitudinal direction and a short-side direction, and each light-emitting diode 11 can be turned on simultaneously. These lightings can be realized by connecting the connector terminals 25, 25 adjacent to each other / connector terminals 26, 26 via the connector member 31, as shown in FIG.

According to such an embodiment, the light emitting diode connecting terminal 20 is exposed on the front surface side of the flexible substrate 10 and the light emitting diode 11 of the surface connection type is connected and fixed on the front surface side of the flexible substrate 10. Therefore, the light emitting diode array 6 can be configured without making the back surface of the flexible substrate 10 a complicated uneven shape. Therefore, mounting on the light source device 2 becomes easy.

Further, by forming the substrate on which the light emitting diodes 11 are mounted by the flexible substrate 10, the light emitting diode array 6 can be used even in a curved state, and the versatility can be improved.

Further, by arranging at least a part of the conductive pattern 30 provided on the second insulating layer 16 of the flexible substrate 10 immediately below the portion where the light emitting diode 11 is provided, heat is generated by the light emitting diode 11. The heat generated can be dissipated through the conductive pattern 30 having good thermal conductivity, a change in light emission characteristics due to heat generation of the light emitting diode 11 can be reduced, and a good use state can be indicated.

In addition, since the plurality of light emitting diode arrays 6 can be connected in parallel to each other via the connector terminals 25 and 26, a light emitting diode array having a size suitable for the purpose of use can be easily formed. The versatility can be improved.

The connector terminals 25 and 26 are provided at four locations on the flexible substrate 10 so that the plurality of light emitting diode arrays 6 can be connected in any of the four directions, thereby providing a plurality of light emitting diodes. Variations in using the diode 6 in combination can be improved, and versatility can be further improved.

Further, by making the light emitting diodes 11 disposed on the flexible substrate 10 linear and at equal intervals, the light quantity, directivity and the like of the entire light emitting diode array 6 can be prescribed. In this case, in particular,
It is possible to prevent light emission unevenness when a plurality of light emitting diode arrays 6 are used in combination.

Further, by connecting a current limiting resistor 12 in series with each light emitting diode 11 and rating the value of the current flowing through each light emitting diode 11, the handling of the light emitting diode array 6 can be improved. .

At this time, by arranging the resistor connection terminals 21 so as to be exposed on the surface side of the flexible substrate 10,
Even when the resistor 12 is mounted, the shape of the back surface of the flexible substrate is not complicated.

Further, by providing the reinforcing member 13 on the back side of the flexible substrate 10, each light emitting diode 11
Can be improved in mounting strength. In this case, since there is no complicated unevenness on the back surface side of the flexible substrate 10, the reinforcing member 13 can be easily brought into close contact with the flexible substrate 10, and the workability is easy.

Further, since the reinforcing member 13 is made of silicon resin or the like having good thermal conductivity, the reinforcing member 13 can have a heat radiation function.
Can be maintained in a good state. In this case, since the reinforcing member 13 is in close contact with the flexible substrate 10, the heat dissipation is good.

The flexibility of the silicone resin forming the reinforcing member 13 is not impaired.

When the light source device 2 is configured by using the light emitting diode array 6 configured as described above, the light emitting diode array 6 has flexibility and a plurality of light emitting diode arrays 6 can be connected in parallel to each other. In addition, the light emitting diode array 6 can be arranged according to the shape of the light source device body 5 and the like.

Next, FIGS. 10 and 11 relate to a second embodiment of the present invention, and FIG. 10 is a plan view of a flexible substrate.
FIG. 11 is a longitudinal sectional view of the light emitting diode array. Here, the present embodiment is different from the above-described first embodiment in that the reinforcing member 13 is closely attached to each light emitting diode 11. In addition, the same components as those in the above-described first embodiment are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIGS. 10 and 11, a hole 35 is formed in the flexible substrate 10 immediately below each light-emitting diode 11.
Are drilled respectively.

Further, as shown in FIG.
The top surface of the heat conduction member 13 is located at a position corresponding to the hole 35.
b are integrally formed so as to protrude, and these heat conductive members 13 b are closely bonded to the bottom surface of the light emitting diode 11.

According to this embodiment, in addition to the effects obtained in the first embodiment, the reinforcing member 13
A heat conducting member 13b is integrally formed with the heat conducting member 13b.
By bringing b into close contact with the light emitting diode 11, heat dissipation can be improved, and more stable light emitting characteristics of the light emitting diode array 6 can be obtained.

Next, FIG. 12 relates to a third embodiment of the present invention, and FIG. 12 is a longitudinal sectional view of a light emitting diode array. Here, in the present embodiment, the integrated reinforcing member 13 is used.
Instead of the reinforcing member 40 corresponding to each light emitting diode 11.
And the heat conducting member 41 is divided into the holes 3.
5 is different from the above-described second embodiment. In addition, the same components as those in the above-described second embodiment are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIG. 12, the flexible substrate 1
On the rear surface side of 0, reinforcing members 40 made of, for example, a silicone resin having good thermal conductivity are arranged at positions corresponding to the respective light emitting diodes 11. Here, each reinforcing member 40 is formed to be larger than the bottom area of the light emitting diode 11.

The hole 41 formed in the flexible substrate 10 is filled with a heat conductive member 41 made of, for example, a resin adhesive, and the light emitting diode 11 and the reinforcing member 40 are connected through the heat conductive member 41. Are joined.

According to such an embodiment, in addition to the effects obtained in the above-described first and second embodiments, by arranging the reinforcing members 40 correspondingly to the respective light emitting diodes 11, the light emission can be achieved. The flexibility of the diode array 6 can be further improved.

Also in such a case, by forming each reinforcing member 40 larger than the bottom area of the light emitting diode 11, the mounting strength of the light emitting diode 11 to the flexible substrate 10 is not impaired.

Further, by forming the heat conducting member 41 with a resin adhesive or the like, the shape of the reinforcing member 40 can be simplified, and the manufacture of the light emitting diode array 6 can be facilitated.

[0071]

According to the first aspect of the present invention, a plurality of light emitting diode arrays are provided on the surface of the flexible substrate via the conductive pattern exposed on the surface of the flexible substrate. Can prevent the back surface side of the flexible substrate from having a complicated uneven shape. In addition, since the flexible substrate has flexibility, it can be used in a state where the light emitting diode array is curved or the like, and versatility can be improved.

According to the second aspect of the present invention, the heat generated by each light emitting diode can be radiated to the outside through the conductive pattern disposed immediately below the light emitting diode.

According to the third aspect of the present invention, by connecting the light emitting diode arrays in parallel with each other via the connector terminal, a light emitting diode array having a size suitable for the purpose of use can be constructed, and the versatility is improved. be able to.

According to the fourth aspect of the present invention, by providing connector terminals at at least four locations on the flexible substrate, variations in connecting the light emitting diode arrays in parallel with each other are improved, and versatility is improved. it can.

According to the fifth aspect of the present invention, by arranging the respective light emitting diodes linearly and at equal intervals on the flexible substrate, the light quantity and directivity of the entire light emitting diode array are prescribed. be able to.

According to the sixth aspect of the present invention, the current flowing through the light emitting diode array can be rated by connecting a current limiting resistor to each light emitting diode in series.

According to the seventh aspect of the present invention, the reinforcing member is provided on the back surface side of the flexible substrate and at least at the position corresponding to the position where each light emitting diode is disposed, so that the light emitting diode can be mounted on the flexible substrate. The mounting strength can be improved.

According to the eighth aspect of the invention, the heat generated by the light emitting diode can be radiated through the reinforcing member by providing the reinforcing member with a heat radiating function.

According to the ninth aspect of the present invention, by forming the reinforcing member larger than the bottom area of each light emitting diode, the mounting strength of the light emitting diode to the flexible substrate can be further improved.

According to the tenth aspect of the present invention, a flexible board is formed having a hole directly below each light emitting diode, and the hole is filled with a heat conductive member, and each light emitting diode is filled through the heat conductive member. By connecting the diode and the reinforcing member, the heat generated by the light emitting diode can be efficiently transmitted to the reinforcing member.

According to the eleventh aspect, according to the first aspect,
By housing the light-emitting diode array according to any one of claims 10 to 10 in a light source device main body, a light source device corresponding to various uses can be easily configured.

[Brief description of the drawings]

FIG. 1 is a rear view showing a main part of a vehicle body according to a first embodiment of the present invention;

FIG. 2 is a plan view of a light-emitting diode array according to the first embodiment;

FIG. 3 is a plan view of a flexible substrate according to the first embodiment;

FIG. 4 is a plan view showing a conductive pattern provided on the front surface side of the insulating layer;

FIG. 5 is a plan view showing a conductive pattern provided on the back surface side of an insulating layer together with a solder resist;

FIG. 6 is a circuit diagram of a light emitting diode array according to the first embodiment;

FIG. 7 is a plan view of the reinforcing member;

FIG. 8 is a side view of the reinforcing member.

FIG. 9 is an explanatory diagram showing an example in which a plurality of light-emitting diode arrays are connected.

FIG. 10 is a plan view of a flexible substrate according to a second embodiment of the present invention.

FIG. 11 is a longitudinal sectional view of a light-emitting diode array according to the third embodiment.

FIG. 12 is a longitudinal sectional view of a light-emitting diode array according to a third embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 2 light source device 5 light source device main body 6 light emitting diode array 10 flexible substrate 11 surface mounted light emitting diode 12 resistor 13 reinforcing member 13b heat conductive member 15 first solder resist layer 16 insulating layer 17 second solder resist layer 20 light emitting diode Connection terminal 21 Resistance connection terminal 25 Connector terminal 26 Connector terminal 30 Conductive pattern 31 Conductive pattern 35 Hole 40 Reinforcing member 41 Thermal conductive member

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/02 H05K 1/18 G 1/18 F21W 101: 14 // F21W 101: 14 F21Y 101: 02 F21Y 101: 02 F21Q 1/00 N (72) Inventor Yuji Gazuma 5-2-1 Asahicho, Imabari City, Ehime Prefecture Harrison Toshiba Lighting Co., Ltd. F term (reference) 3K013 AA01 AA02 AA07 BA01 CA05 CA16 DA09 EA00 3K080 AA01 AB15 AB17 BA07 BB20 BE07 CA00 CC06 5E336 AA04 AA11 BB01 BB02 BB12 BB15 BC01 BC15 BC34 CC02 CC08 CC57 EE01 GG03 GG16 GG25 5E338 AA01 AA02 AA12 AA16 BB05 BB13 BB25 BB72 BB75 DC03 DC03 DC03 DC03 DC02

Claims (11)

[Claims] A flexible substrate having at least a portion of a conductive pattern exposed on a front surface side; a lead portion disposed on the front surface side of the flexible substrate, and a lead portion being surface-connected to the conductive pattern exposed on the front surface side. And a plurality of light emitting diodes having a bottom surface close to the front surface side of the flexible substrate. 2. The light-emitting diode array according to claim 1, wherein at least a part of the conductive pattern is disposed immediately below a portion where the light-emitting diode is disposed. 3. The light emitting diode array according to claim 1, wherein said light emitting diode arrays can be connected to each other in parallel via a connector terminal. 4. The light emitting device according to claim 3, wherein said connector terminals are provided at at least four positions on said flexible substrate so that said light emitting diode arrays can be connected in parallel to each other in four directions. Diode array. 5. The light-emitting diode array according to claim 1, wherein the light-emitting diodes are linearly and equidistantly arranged on the flexible substrate. 6. A current limiting resistor is provided on the front side of the flexible board, and the resistor is connected in series to each of the light emitting diodes via the conductive pattern exposed on the front side of the flexible board. The light emitting diode array according to any one of claims 1 to 5, wherein 7. A reinforcing member is provided at a position corresponding to at least a position where each of the light emitting diodes is disposed on a back surface side of the flexible substrate. A light emitting diode array according to claim 1. 8. The light emitting diode array according to claim 7, wherein said reinforcing member has a heat radiation function. 9. The light emitting diode array according to claim 7, wherein said reinforcing member is formed at least larger than a bottom area of each of said light emitting diodes. 10. The flexible substrate has a hole directly below each of the light emitting diodes provided therein, and the hole is filled with a heat conductive member, and each of the light emitting diodes is filled through the heat conductive member. The light emitting diode array according to any one of claims 7 to 10, wherein the light emitting diode array and the reinforcing member are joined. 11. A light source device comprising: a light source device main body; and the light-emitting diode array according to claim 1 housed in the light source device main body. .