JP2002214550A - Optical modulator and its manufacturing method, optical information processor equipped with the optical modulator, image forming apparatus equipped with the optical modulator, and image projection/display unit equipped with the optical modulator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low cost optical modulator having a simple structure of conducting optical modulation by changing reflection direction of the incident light, high responsiveness and few manufacturing processes in which wavelength of incident light to be used is not restricted, and whose operation is stable and whose reliability is high, and a manufacturing method of the optical modulator. SOLUTION: The optical modulator consists of both end supported beam 2 that is formed with the thin film which combines and constitutes the light reflection film 1 in one surface, and both ends of which are fixed, and which is deformed by the electrostatic force, a substrate electrode 3 which applies the driving voltage oppositely to the beam 2 through the gap G formed in the other surface of the beam 2, a facing surface 3a in which the electrode 3 opposes to the beam 2 which conducts optical modulation of the incident light of a reflection means 1 by regulating deformation of the beam 2 due to an application of the driving voltage of the electrode 3 by contact, and a base board 4 which forms the electrode 3 consisting of the facing surface 3a in recessed part 4a and holds a part to be held 2a of the beam 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light modulator, a method of manufacturing the light modulator, an optical information processing device having the light modulator, an image forming apparatus having the light modulator, and the light modulator. More specifically, the present invention relates to an image projection display device including: a light modulation device that modulates light by changing the reflection direction of incident light; a method of manufacturing the light modulation device; and changing the reflection direction of incident light including the light modulation device. Information processing apparatus for processing optical information using a light modulation device that performs light modulation, an image forming apparatus that forms an image by performing light writing in an electrophotographic process including the light modulation device, and the light modulation thereof The present invention relates to an image projection display device that projects and displays an image including the device.

[0002]

2. Description of the Related Art An optical modulator that modulates light by changing the direction of reflection of incident light of an optical switch device using electrostatic force,
It is used for an optical information processing device that processes optical information, an image forming device that forms an image by performing light writing in an electrophotographic process, and an image projection display device that projects and displays an image. In an optical modulator that modulates light by changing the reflection direction of incident light of an optical switch device using electrostatic force,
Devices for switching the direction of reflection of incident light by bending a cantilever with electrostatic force and a light modulation system using the same are already known. The cantilever oscillates when the electrostatic force is released and the deflection of the beam is restored. This is because free vibration of the beam occurs because only one end of the beam is fixed. When the beam is formed of a thin film, residual stress is generated. In the case of a cantilever, the beam is deformed due to residual stress. In addition, since the residual stress is reduced over time, the deformation state of the cantilever changes with time. For these reasons, cantilevers have poor stability. In the case of a cantilever, signal responsiveness deteriorates due to free vibration. Therefore, it is difficult to secure the stability of the cantilever, and the natural frequency of the cantilever is low, so that the response speed cannot be increased. Devices that hold a mirror with a thin torsion bar, change the direction of the mirror by electrostatic force, and switch by changing the direction of light reflection are already known, but the structure is complicated and it is difficult to increase the yield. Not only
Since the mirror was held by a thin torsion bar, its life could not be extended. A device for optically driving a diffraction grating by driving it with an electrostatic force is also known (Japanese Patent No. 29).
No. 41952, Patent No. 3016871, Tokuheihei 10-
See, for example, Japanese Patent Publication No. 510374. However, such a device that optically switches a diffraction grating by driving it with electrostatic force has a drawback that the wavelength of incident light to be used is limited. There is also known a device in which a beam is bent by electrostatic force, the reflected light is focused, and the light is switched by passing through a slit (see Japanese Patent Application Laid-Open No. 2000-2842). However, such a device in which the beam is curved by electrostatic force, the reflected light is focused, and the optical switch is switched by passing through the slit, the degree of curvature of the beam is likely to be unstable, and the reliability is reduced. Was supposed to. Therefore, a conventional light modulation device that modulates light by changing the reflection direction of incident light, an optical information processing device including the light modulation device, an image forming device including the light modulation device, and the light modulation device are provided. The image projection display device has a complex structure that modulates the light by changing the reflection direction of the incident light, has a slow response, limits the wavelength of the incident light to be used, and has a problem that the operation is unstable and the reliability is reduced. I was

[0003]

SUMMARY OF THE INVENTION A conventional light modulation device for performing light modulation by changing the reflection direction of an incident light beam, an optical information processing device having the light modulation device, an image forming apparatus having the light modulation device, and The image projection display device equipped with the light modulation device has a complicated structure that modulates the light by changing the reflection direction of the incident light beam, has a slow response, limits the wavelength of the incident light to be used, is unstable in operation, and has a high reliability. Had a problem that it also decreased. Therefore, an object of the present invention is to solve such a problem. In other words, the structure for performing light modulation by changing the direction of reflection of incident light is simple and quick in response, the wavelength of the incident light to be used is not limited, the operation is stable and highly reliable, the number of manufacturing steps is small, and the cost is low. MODULATION DEVICE, METHOD OF MANUFACTURING THE LIGHT MODULATION DEVICE, OPTICAL INFORMATION PROCESSOR HAVING THE LIGHT MODULATION DEVICE, IMAGE FORMING DEVICE HAVING THE LIGHT MODULATION DEVICE, AND IMAGE PROJECTION DISPLAY DEVICE HAVING THE LIGHT MODULATION DEVICE The purpose is to.

[0004]

In order to achieve the above object, the present invention is directed to a substrate having a concave portion formed therein, a substrate electrode formed on an inner surface of the concave portion, and a gap formed in the concave portion through a gap in the concave portion. A thin-film doubly supported beam provided at a position facing the electrode and having both ends fixed, and a light reflecting film and a beam electrode formed on the upper surface of the doubly supported beam, and are driven by the substrate electrode and the beam electrode. The concave portion is formed such that the doubly-supported beam deformed by applying a voltage abuts on the inner surface of the concave portion to restrict the deformation of the doubly-supported beam. That is, in order to achieve the above object, according to the present invention, there is provided a light modulation device for performing light modulation by changing a reflection direction of incident light, wherein a light reflection film for regularly reflecting incident light; A doubly-supported beam that is formed of a thin film that is combined with one surface and is fixed at both ends and deformed by electrostatic force, and faces the doubly-supported beam via a gap formed on the other surface of the doubly-supported beam. A substrate electrode for applying a drive voltage by applying a drive voltage to the substrate electrode, and applying a drive voltage to the substrate electrode to regulate the deformation of the doubly supported beam by abutting to modulate the light incident on the light reflecting film. The most main feature is that the optical modulator is a light modulating device comprising an opposing surface on which the substrate electrode opposes, and a substrate holding the held portion of the doubly supported beam by forming the substrate electrode formed of the opposing surface in a concave portion. I do. Claim 2
The present invention is characterized in that, in the light modulation device according to the first aspect, the light reflection film is a light modulation device formed of a metal thin film. A third aspect of the present invention is characterized in that, in the optical modulator according to the first aspect, the doubly supported beam is an optical modulator formed of a low-resistance material. According to a fourth aspect of the present invention, in the optical modulation device according to the third aspect, the low-resistance material of the doubly supported beam is an optical modulation device formed by reducing the resistance of silicon with an impurity. And According to a fifth aspect of the present invention, in the optical modulation device according to the first, second, third or fourth aspect, the main feature is that the doubly supported beam is an optical modulation device formed of a single crystal silicon thin film. I do.

According to a sixth aspect of the present invention, there is provided an optical modulator according to the first, second, third or fourth aspect, wherein the optical modulator is formed of a doubly supported beam and a polycrystalline silicon thin film. Features. The present invention of claim 7 is the invention according to claim 1 or 2
The main feature of the light modulator according to (1) is that the doubly supported beam is a light modulator formed of a silicon nitride thin film. Claim 8 of the present invention provides Claims 1, 2, 3,
The optical modulator according to 4, 5, 6, or 7, is characterized in that the held portion of the doubly supported beam is an optical modulator in which two opposite ends are fixed to a substrate. According to a ninth aspect of the present invention, in the optical modulator according to the first, second, third, fourth, fifth, sixth, seventh, or eighth aspects, two sides at opposite ends of the doubly supported beam held by the substrate. The main characteristic is that the distance between one side and the other side is a light modulator fixed so as to be equal to or longer than the length of the one side or the other side of the two sides. And According to a tenth aspect of the present invention, in the light modulation device according to the first, second, third, fourth, fifth, sixth, seventh, eighth, or ninth aspect, the substrate includes a plurality of light reflecting films, a doubly supported beam, and a substrate electrode. Is a light modulator in which is arranged in a one-dimensional array shape. According to an eleventh aspect of the present invention, in the optical modulator according to the first, second, third, fourth, fifth, sixth, seventh, eighth or ninth aspect, the substrate includes a plurality of light reflecting films, a doubly supported beam, and a substrate electrode. Is a light modulation device in which is arranged in a two-dimensional array shape. The present invention of claim 12 is based on claims 1, 2, 3, 4, 5, 6, 7, 8, 9,
The main feature of the light modulation device according to 10 or 11 is that the opposing surface of the substrate electrode is a light modulation device including a parallel opposing surface opposing a surface parallel to the doubly supported beam. The present invention of claim 13 is the invention of claim 1, 2, 3, 4,
In the optical modulator according to 5, 6, 7, 8, 9, 10 or 11, the opposing surface of the substrate electrode is a non-parallel opposing surface partially opposing the doubly supported beam in a non-parallel surface. The main feature of the present invention is that the optical modulator is composed of

[0006] The present invention of claim 14 is based on claims 1, 2,
In the optical modulator according to 3, 4, 5, 6, 7, 8, 9, 10 or 11, a plurality of non-parallel opposing surfaces of the substrate electrode oppose the doubly supported beam at a plurality of non-parallel surfaces. The main feature is that it is a light modulation device comprising a surface. The present invention according to claim 15 is the invention according to claims 1, 2, 3, 4, 5, 6, 7,
12. The light modulation device according to 8, 9, 10 or 11, wherein the opposing surface of the substrate electrode is a light non-parallel opposing surface which is entirely non-parallel to the doubly supported beam. Is the main feature. The present invention according to claim 16 is based on claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11,
16. The light modulation device according to 12, 13, 14, or 15, wherein the substrate is made of a light-transmitting glass material. The invention according to claim 17 is based on claims 1, 2, 3, 4, 5, 6,
The light modulator according to 7, 8, 9, 10, 11, 12, 13, 14, 15, or 16 is characterized in that the substrate is a light modulator made of a single crystal silicon material. According to an eighteenth aspect of the present invention, in the optical modulation device according to the seventeenth aspect, the optical modulation device is configured such that a part or all of a driving circuit is formed in a single-crystal silicon material of a substrate. Features. The present invention of claim 19 is the invention according to claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 1
In the optical modulator according to any one of 3, 14, 15, 16, 17 and 18, a gap formed between a doubly held beam held on the substrate and a substrate electrode formed on a concave portion of the substrate facing the gap is The main feature of the present invention is that it is a light modulation device having non-parallel inclined surfaces. The present invention of claim 20 is the invention according to claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 1
In the optical modulator according to any one of 3, 14, 15, 16, 17, 18, and 19, the gap formed between the doubly supported beam and the opposing substrate electrode is a gap between the doubly supported beam held by the substrate. The main feature of the optical modulator is that the optical modulator has a non-parallel inclined surface between two sides at both ends.

The present invention of claim 21 is the invention of claim 19 or 2
0, the gap formed by the non-parallel inclined surface formed between the doubly supported beam and the opposing substrate electrode is the largest at the center of the doubly supported beam held by the substrate. The main feature of the present invention is that the light modulator has a shape that increases gradually from the two opposite sides of the doubly supported beam toward the center of the doubly supported beam. According to a twenty-second aspect of the present invention, in the optical modulator according to the nineteenth or twentieth aspect, the gap formed by the non-parallel inclined surface formed between the doubly supported beam and the opposing substrate electrode is held by the substrate. The light having the maximum shape at the center of the doubly supported beam and gradually increasing from two opposite sides and the other two sides of the doubly supported beam toward the center of the doubly supported beam. The main feature is that it is a modulator. According to a twenty-third aspect of the present invention, in the optical modulator according to the nineteenth or twentieth aspect, the gap formed by the non-parallel inclined surface formed between the doubly supported beam and the opposing substrate electrode is held by the substrate. The maximum value is near one of the two opposite ends of the doubly supported beam, and the one of the two opposite sides of the opposed both ends of the doubly supported beam held by the substrate is The main feature is that it is a light modulation device that increases sequentially toward the side. The invention according to claim 24 is based on claims 1, 2, 3,
4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 1
4, 15, 16, 17, 18, 19, 20, 21, 22
Alternatively, in the optical modulation device described in Item 23, the held portion held on the doubly supported substrate is a light modulation device including a divided held portion divided into a plurality of parts.
According to a twenty-fifth aspect of the present invention, in the optical modulation device according to the twenty-fourth aspect, the divided held portion is a light modulation device arranged at a corner of a doubly supported beam. According to a twenty-sixth aspect of the present invention, in the optical modulation device according to the twenty-fourth or twenty-fifth aspect, the divided held portion is a light modulation device having a smooth outer shape with a smooth outer shape at a connection portion with the double-supported beam. Is the main feature. The invention according to claim 27 is the invention according to claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 1
2, 13, 14, 15, 16, 17, 18, 19, 2,
The optical modulator according to any one of 0, 21, 22, 23, 24, 25, and 26, wherein the held portion held on the doubly supported substrate is an optical modulator including a folded structure. And

The present invention of claim 28 is the invention according to claims 13 and 1
4, 15, 16, 17, 18, 19, 20, 21, 2,
In the light modulation device according to 2, 23, 24, 25, 26, or 27, at least a gap near a gap having a non-parallel inclined surface formed between the doubly supported beam and the opposing substrate electrode has a maximum interval. The main feature is that the held portion held by the doubly supported substrate is an optical modulation device including a divided held portion divided into a plurality. The present invention of claim 29 is the invention of claims 13, 14, 15, 16, 17, 18, 1
9, 20, 21, 22, 23, 24, 25, 26, 27
Or the optical modulator according to 28, wherein the gap formed by at least the non-parallel inclined surface formed between the doubly-supported beam and the opposing substrate electrode is held by the doubly-supported beam substrate near the maximum spacing. The main feature is that the held portion is a light modulation device including a folding structure. The invention according to claim 30 is based on claims 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
The optical modulator according to 5, 26, 27, 28 or 29 is characterized in that the doubly supported beam is an optical modulator composed of a member having a tensile stress. Claim 31
The present invention of claims 1, 2, 3, 4, 5, 6, 7, 8,
9, 10, 11, 12, 13, 14, 15, 16, 1
7, 18, 19, 20, 21, 22, 23, 24, 2
In the optical modulator according to any one of 5, 26, 27, 28, 29, and 30, the doubly supported beam has a thickness (t) of a plurality of members combined with the doubly supported beam, a positive sign for tensile stress, and a compressive sign. Each combination of stresses (σ) with stresses as negative signs is (t ₁ , σ ₁ ), (t ₂ , σ ₂ ),.
(T _n , σ _n ), t ₁ · σ ₁ + t ₂ · σ ₂ + ... +
The main feature is that the optical modulator is t _n · σ _n / t ₁ + t ₂ +... + t _n ≧ 0. The invention according to claim 32 is the invention according to claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 1
0, 11, 12, 13, 14, 15, 16, 17, 1
8, 19, 20, 21, 22, 23, 24, 25, 2,
In the optical modulator according to 6, 27, 28, 29, 30, or 31, the doubly supported beam is held by the substrate, with the tensile stress (σ), the thickness (t), the Young's modulus (E) of the forming material, and the like. An optical modulator having a relationship of (t / l) ² ≧ σ / E between a distance (l) between one side and the other side of two opposite ends of the doubly supported beam. Is the main feature.

The present invention according to claim 33 is based on claims 1, 2,
3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 1
3, 14, 15, 16, 17, 18, 19, 20, 2
1, 22, 23, 24, 25, 26, 27, 28, 2
The optical modulator according to 9, 30, 31, or 32,
An optical modulator in which all or a part of a driving circuit to be driven is formed on a substrate. The present invention of claim 34 is based on claim 1,
2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12,
13, 14, 15, 16, 17, 18, 19, 20, 2
1, 22, 23, 24, 25, 26, 27, 28, 2
In the optical modulator according to 9, 30, 31, 32, or 33, the doubly supported beam abuts on the surface of the substrate by electrostatic force generated by application of a driving voltage between the substrate electrodes, and The main feature is that it is an optical modulator that deforms along the gap shape of the gap formed on the other surface. The present invention of claim 35 provides the present invention according to claims 1, 2, 3, 4, 5, 6,
7, 8, 9, 10, 11, 12, 13, 14, 15, 1,
6, 17, 18, 19, 20, 21, 22, 23, 2,
4, 25, 26, 27, 28, 29, 30, 31, 3,
In the optical modulator according to 2, 33 or 34, after the doubly supported beam is deformed by an electrostatic force caused by application of a drive voltage between the substrate electrodes, a voltage is applied between the substrate electrodes having opposite polarities to such an extent that the beam is not deformed. The main feature of the present invention is that it is a light modulator. The invention according to claim 36 is based on claims 1, 2, 3,
4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 1
4, 15, 16, 17, 18, 19, 20, 21, 2,
2, 23, 24, 25, 26, 27, 28, 29, 3,
In the optical modulator according to 0, 31, 32, 33, 34, or 35, the doubly supported beam alternates a driving voltage between the substrate electrodes with a positive voltage and a negative voltage with reference to the potential of the doubly supported beam. The main feature is that it is a light modulation device that is deformed by being applied to the light. According to a thirty-seventh aspect of the present invention, the light modulation is performed by changing the reflection direction of the incident light beam.
6, 7, 8, 9, 10, 11, 12, 13, 14, 1
5, 16, 17, 18, 19, 20, 21, 22, 2,
3, 24, 25, 26, 27, 28, 29, 30, 3
In the method for manufacturing a light modulation device according to any one of 1, 32, 33, 34, 35, and 36, after forming a gap on the substrate, a sacrificial material layer made of a sacrificial material is formed to flatten the substrate. The most main feature of the present invention is a method of manufacturing an optical modulation device in which the sacrificial material layer is removed after forming the doubly supported beam to manufacture an optical modulation device.

According to a thirty-eighth aspect of the present invention, in the method of manufacturing a light modulator according to the thirty-seventh aspect, a concave part forming step of forming a concave part on the substrate by a thin film forming method or a fine processing method on the substrate; A substrate electrode forming step of forming all or a part of the substrate electrode in the concave portion; a sacrificial material layer forming step of forming a sacrificial material layer made of a sacrificial material in the concave portion on the substrate; The main feature of the present invention is a method for manufacturing an optical modulation device including a doubly supported beam forming step of forming a cantilever and a sacrificial material layer removing step of removing the sacrificial material layer in the concave portion. A thirty-ninth aspect of the present invention is the method for manufacturing a light modulation device according to the thirty-seventh or thirty-eighth aspect, wherein the sacrificial material layer is a method for manufacturing a light modulation device in which a silicon oxide film is used. The present invention of claim 40 is the method of manufacturing an optical modulator according to claim 37 or 38, wherein the sacrificial material layer is a method of manufacturing an optical modulator in which a polycrystalline silicon film or an amorphous silicon film is used. Characteristics. The invention of claim 41 is
The method of manufacturing a light modulator according to claim 37 or 38 is characterized in that the sacrificial material layer is a method of manufacturing a light modulator that is an organic material film. The present invention according to claim 42 is an optical information processing apparatus for processing optical information using an optical modulator that modulates light by changing the reflection direction of an incident light beam. 4, 5, 6,
7, 8, 9, 10, 11, 12, 13, 14, 15, 1,
6, 17, 18, 19, 20, 21, 22, 23, 2,
4, 25, 26, 27, 28, 29, 30, 31, 3,
The most main feature of the optical information processing apparatus is an optical information processing apparatus including: the optical modulation device according to any one of 2, 33, 34, 35, and 36; and an independent driving unit that independently drives the plurality of optical modulation devices. And

The present invention according to claim 43, in an image forming apparatus for forming an image by performing optical writing in an electrophotographic process, an image carrier that is rotatably held and carries the formed image, and the image carrier 5. The method according to claim 1, wherein a latent image is formed by performing light writing on the upper surface.
7, 8, 9, 10, 11, 12, 13, 14, 15, 1,
6, 17, 18, 19, 20, 21, 22, 23, 2,
4, 25, 26, 27, 28, 29, 30, 31, 3,
A latent image forming means comprising the light modulating device according to any one of 2, 33, 34, 35 or 36, and a latent image formed by the light modulating device of the latent image forming means is visualized to form a toner image. The most main feature of the image forming apparatus is an image forming apparatus including a developing unit for forming and a transfer unit for transferring the toner image formed by the developing unit to a transfer target. In a preferred embodiment of the present invention, in the image projection display device for projecting and displaying an image, the image is projected by changing the reflection direction of incident light of the image projection data and performing light modulation.
2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12,
13, 14, 15, 16, 17, 18, 19, 20, 2
1, 22, 23, 24, 25, 26, 27, 28, 2
An optical switch means comprising the optical modulation device according to any one of 9, 30, 31, 32, 33, 34, 35, or 36;
The most main feature of the present invention is an image projection display device including a projection screen for displaying an image projected by the light modulation device of the light switch means.

[0012]

The light modulator having the above structure, the method of manufacturing the light modulator, the optical information processing apparatus having the light modulator, the image forming apparatus having the light modulator, and the light modulator are described. The image projection display device provided comprises:
In the first aspect, a gap formed on the other surface of the doubly-supported beam, which is formed of a thin film configured by combining a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force, is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate is formed in a concave part with the opposite surface to hold the held part of the doubly supported beam, and the structure that modulates the light by changing the reflection direction of the incident light is simple, quick response, and used. It is possible to provide an optical modulator that is stable in operation and has high reliability without limiting the wavelength of incident light. According to the second aspect, the other end of the doubly supported beam, which is formed of a thin film formed by combining a light reflecting film formed of a metal thin film that specularly reflects incident light on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly supported beam through a gap formed in the surface. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a facing surface opposed to the doubly supported beam so that the held portion of the doubly supported beam is held, so that the light reflecting film can be used as an electrode, and the It is possible to provide a light modulation device which has a simpler structure, performs light modulation by changing the reflection direction of a light beam, has a quick response, does not limit the wavelength of incident light to be used, and has stable operation and high reliability. To do. According to the third aspect, the other end of a double-supported beam formed of a thin film formed by combining a light reflecting film for regularly reflecting incident light on one surface and having both ends fixed and deformed by electrostatic force. A drive voltage is applied to the doubly supported beam through a gap formed in the surface of the substrate. The substrate is formed in a concave portion and has a substrate electrode composed of an opposing surface facing the doubly supported beam for modulation, so as to hold the held portion of the doubly supported beam, so that the doubly supported beam can also be used as an electrode, It is possible to provide a light modulation device that has a simpler structure, performs faster light response by changing the reflection direction of incident light, has a faster response, does not limit the wavelength of the incident light to be used, and has stable operation and high reliability. Make it possible.

According to a fourth aspect of the present invention, silicon is formed by forming a thin film comprising a light reflecting film for regularly reflecting incident light on one surface and fixed at both ends and deformed by electrostatic force by means of impurities to reduce the resistance. A light is applied by restricting the deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode, which applies a drive voltage to the doubly supported beam via a gap formed on the other surface of the doubly supported beam. The substrate is formed in a concave portion with a facing surface facing the doubly supported beam that modulates the incident light of the reflection film so that the substrate holds the held portion of the doubly supported beam, and the doubly supported beam is used as an electrode. Can be used, the structure that modulates the light by changing the reflection direction of the incident light is simpler and the response is faster, and the light that operates stably and has high reliability without restriction on the wavelength of the incident light to be used. To provide modulation equipment . According to a fifth aspect of the present invention, there is provided a double-supported beam formed of a single-crystal silicon thin film which is formed by combining a light reflecting film for regularly reflecting incident light on one surface and is fixed at both ends and deformed by electrostatic force. A drive voltage is applied to the doubly supported beam through a gap formed on the other surface, and a deformation of the doubly supported beam caused by application of a drive voltage to the substrate electrode is controlled by abutment to reduce incident light of the light reflecting film. The substrate is formed in a concave part with a facing surface facing the doubly supported beam that performs light modulation so that the held portion of the doubly supported beam is held, and the defect of the doubly supported beam is reduced and the life is extended. To provide a light modulation device that has a simple structure that performs light modulation by changing the reflection direction of an incident light beam, has a quick response, does not limit the wavelength of the incident light to be used, operates more stably, and has high reliability. To be able to According to a sixth aspect of the present invention, there is provided a doubly supported beam formed of a polycrystalline silicon thin film which is formed by combining a light reflecting film for regularly reflecting incident light on one surface and is fixed at both ends and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through a gap formed on the other surface, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutment to reduce the incident light of the light reflecting film. The substrate electrode is formed in the concave portion and has a surface facing the doubly-supported beam for performing the light modulation so that the held portion of the doubly-supported beam is held. Therefore, the cost is low, the structure for performing light modulation by changing the direction of reflection of the incident light beam is simple, the response is fast, the wavelength of the incident light to be used is not limited, and the operation is more stable and highly reliable. Can be provided.

According to a seventh aspect of the present invention, there is provided a two-sided support made of a thin film formed by combining a light reflection film for regularly reflecting incident light on one surface and having both ends fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through a gap formed on the other surface of the beam to apply a drive voltage. The substrate is formed in a concave portion with a substrate surface facing the doubly supported beam that modulates light, so that the held portion of the doubly supported beam is held, and the switching response speed is increased by the action of tensile stress. It is possible to change the direction of reflection of the incident light beam, the structure is simple, the response is even faster, the wavelength of the incident light used is not restricted, and the operation is more stable and reliable. Provide light modulator It is to be able to. Claim 8
In the above, both sides are formed through a gap formed on the other surface of a doubly-supported beam that is formed of a thin film that is configured by combining a light reflection film that specularly reflects incident light on one surface and is fixed at both ends and deformed by electrostatic force. Opposite surface facing the double-supported beam that modulates the incident light of the light reflecting film by restricting the deformation of the double-supported beam by applying the drive voltage of the substrate electrode that applies the drive voltage opposite to the supportable beam. A substrate electrode is formed in a concave portion of the substrate to hold and fix two opposing ends of the held portion of the doubly supported beam, so that both ends of the doubly supported beam are restrained to generate free vibration. The response speed is fast with little change over time and little change over time, the structure is simpler to modulate the light by changing the reflection direction of the incident light, the response is even faster, and the wavelength of the incident light used is not limited. To provide a more reliable and highly reliable optical modulator. It is to be able to. In the ninth aspect, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film configured by combining a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate is formed in a concave portion with the opposite surface to hold the held portion of the doubly supported beam, and one side and the other side of two opposite ends of the doubly supported beam held by the substrate. Is fixed to be equal to or longer than the length of one of the two sides or the other side,
Driving at lower driving voltage is possible, the structure that modulates the light by changing the reflection direction of the incident light is simple and quick, and the operation is stable and reliable without limiting the wavelength of the incident light used It is possible to provide a light modulation device having high performance.

According to a tenth aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on the other surface of the doubly supported beam which is fixed at both ends and is deformed by electrostatic force. A drive voltage is applied opposite the doubly supported beam through a gap, and the deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate forms a substrate electrode consisting of a facing surface facing the beam in a concave portion to hold the held portion of the doubly supported beam, and the substrate arranges a plurality of light reflection films, a doubly supported beam, and a substrate electrode in a one-dimensional array shape. As a result, it is possible to perform line-shaped light modulation, and the structure for performing light modulation by changing the reflection direction of incident light is simple and quick in response, without limiting the wavelength of incident light to be used. , A stable and highly reliable optical modulator It is to be able to provide. In the eleventh aspect, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film configured by combining a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is regulated by abutment to oppose the doubly supported beam to perform light modulation of incident light on the light reflection film. The substrate electrode is formed in a concave portion, and the substrate is formed in a concave portion to hold the held portion of the doubly supported beam, and the substrate has a plurality of light reflecting films, the doubly supported beam and the substrate electrode arranged in a two-dimensional array. Therefore, it is possible to perform planar light modulation, the structure for performing light modulation by changing the direction of reflection of incident light is simple and quick, and operation is not restricted by the wavelength of incident light used. Providing a stable and highly reliable optical modulator Come so. In the twelfth aspect, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film combining and forming a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied opposite to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage to the substrate electrode is restricted by abutment, and the light is modulated in parallel with the doubly supported beam to perform light modulation of incident light on the light reflection film. The substrate is formed in a concave portion, and the substrate electrode is formed in a concave portion, and the held portion of the doubly supported beam is held, and the direction of the reflected light of the incident light is disturbed, so that the device is darkly turned off. It is possible to provide a light modulation device which has a simple structure for performing light modulation, has a quick response, does not limit the wavelength of incident light to be used, and has stable operation and high reliability.

According to a thirteenth aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on the other surface of a doubly supported beam which is fixed at both ends and is deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a non-parallel opposing surface partially opposing the beam on a non-parallel surface so that the substrate holds the held portion of the doubly supported beam, and is operated at a low driving voltage. Driving is possible, the structure that modulates the light by changing part of the incident light reflection direction is simple and the response is fast, the operation of the incident light used is not limited, the operation is stable and the reliability is high An optical modulator can be provided. According to claim 14, a gap formed on the other surface of the doubly-supported beam, which is formed of a thin film in which a light reflection film for regularly reflecting incident light is formed on one surface and is fixed at both ends and deformed by electrostatic force, is formed. A drive voltage is applied to the doubly supported beam through the substrate. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is restricted by abutment, and a plurality of doubly supported beams are used to modulate the light incident on the light reflecting film. The substrate electrode formed of a plurality of non-parallel opposing surfaces opposing each other on the non-parallel surface is formed in a concave portion so as to hold the held portion of the doubly supported beam, thereby enabling driving at a lower driving voltage. An optical modulator that has a simple structure that performs light modulation by changing the direction of reflection of incident light in multiple directions, has a fast response, does not limit the wavelength of incident light to be used, has stable operation, and has high reliability. Be able to provide. Claim 1
In 5, a light reflecting film for regularly reflecting incident light is formed on the one surface by a thin film formed by combining the light reflecting films on both surfaces, and both ends are fixed, and a gap is formed on the other surface of the doubly supported beam deformed by electrostatic force. A drive voltage is applied to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage to the substrate electrode is regulated by abutment to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a non-parallel opposing surface facing the entire surface in parallel so as to hold the held portion of the doubly supported beam, thereby enabling driving at a lower driving voltage. An optical modulator that has a simple structure that performs reliable light modulation by changing incident light in one direction of reflection, has a quick response, does not limit the wavelength of the incident light used, has stable operation, and has high reliability. Be able to provide.

According to a sixteenth aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on the other surface, and is formed on the other surface of a double-ended beam which is fixed at both ends and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. A substrate made of a light-transmitting glass material is formed in a concave portion with a substrate electrode made of a facing surface facing the beam, and the held portion of the doubly supported beam is held, and the state of the doubly supported beam is seen from the back side of the substrate. It is advantageous for product inspection, has a simple structure that modulates light by changing the direction of reflection of incident light, has a fast response, does not limit the wavelength of incident light to be used, and has stable operation and reliability. To be able to provide a high light modulation device That. According to claim 17, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film configured by combining a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. A substrate electrode made of a single-crystal silicon material is formed in a concave portion so as to hold a held portion of a doubly supported beam, and an electrode is formed in the single-crystal silicon of the substrate by an impurity diffusion method. A simple and quick response structure that modulates the light by changing the direction of reflection of the incident light makes it possible to operate the optical modulator with stable operation and high reliability without limiting the wavelength of the incident light used. Be able to provide equipment . According to claim 18, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film configured by combining a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate electrode composed of a single crystal silicon material and a driving circuit formed on the opposite surface is formed in a concave portion so as to hold the held portion of the doubly supported beam, thereby diffusing impurities into the single crystal silicon of the substrate. The electrode can be formed by the method described above, and it is possible to form part or all of the electronic circuit of the driving circuit on the substrate by the diffusion method, and the structure for performing the light modulation by changing the reflection direction of the incident light is further simplified and the response is improved. Fast, limited wavelength of incident light used Without being, it operates to be able to provide an even higher light modulator stable and reliable.

According to a nineteenth aspect, a light reflecting film for regularly reflecting incident light is formed on the other surface of a doubly-supported beam which is fixed at both ends and is deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. A substrate electrode formed of a concave surface facing the beam is formed in the concave portion to hold the held portion of the doubly supported beam and a substrate electrode formed on the concave portion of the substrate opposed to the doubly held beam held by the substrate The gap formed between them is made of a non-parallel inclined surface, which enables driving at a lower driving voltage, and has a simple structure that modulates the light by changing the reflection direction of the incident light and has a high response. Fast, without limiting the wavelength of incident light used Operation is to be able to provide an even higher light modulator stable and reliable. In the twentieth aspect, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film configured by combining a light reflection film for regularly reflecting incident light on one surface and has both ends fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is regulated by abutment to oppose the doubly supported beam to perform light modulation of incident light on the light reflection film. The substrate is formed in a concave portion, and the substrate electrode is formed in the concave portion to hold the held portion of the doubly supported beam, and the gap formed between the doubly supported beam and the opposing substrate electrode is held by the substrate. A non-parallel inclined surface is formed between the two opposite ends of the beam, so that driving at a lower driving voltage can be ensured, and a structure that modulates light by changing the reflection direction of incident light is used. Simple and fast response, limiting the wavelength of incident light used Ku, operation is to be able to provide an even higher light modulator stable and reliable. According to claim 21, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film in which a light reflecting film for regularly reflecting incident light is formed on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is regulated by abutment to oppose the doubly supported beam to perform light modulation of incident light on the light reflection film. The substrate electrode formed of the opposed surface is formed in the concave portion of the substrate to hold the held portion of the doubly supported beam, and between the doubly held beam held by the substrate and the substrate electrode formed on the opposed concave portion of the substrate. Is formed at the center of the doubly supported beam held by the substrate, and is formed from non-parallel inclined surfaces, and sequentially from two opposite sides of the doubly supported beam toward the center of the doubly supported beam. Lower drive voltage by increasing the shape The light modulation is simple, the response is fast and the optical modulation is performed by changing the reflection direction of the incident light. The light modulation is stable and highly reliable without any limitation on the wavelength of the incident light to be used. Equipment can be provided.

According to a twenty-second aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on one surface of a thin film, and both ends are fixed and formed on the other surface of a double-ended beam deformable by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. A substrate electrode formed of a concave surface facing the beam is formed in the concave portion to hold the held portion of the doubly supported beam, and a substrate electrode formed on the concave portion of the substrate opposed to the doubly held beam held by the substrate. Is formed at the center of the doubly supported beam held by the substrate, and is formed between the two opposite ends of the doubly supported beam and the other two sides. So that the shape gradually increases toward the center of the beam It is possible to drive at a lower driving voltage, and the structure that modulates the light by changing the reflection direction of the incident light is simple and quick, and the operation is stable without limiting the wavelength of the incident light to be used. Therefore, it is possible to provide an optical modulation device having high reliability. According to claim 23, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film combining and forming a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate electrode formed of the opposed surface is formed in the concave portion of the substrate to hold the held portion of the doubly supported beam, and between the doubly held beam held by the substrate and the substrate electrode formed on the opposed concave portion of the substrate. Is formed near the one of the two opposing ends of the doubly supported beam held by the substrate and is opposed to the doubly supported beam held by the substrate. Increases sequentially from the other side of the two sides at both ends to one side In this way, the light can be driven at a lower driving voltage, the structure that modulates the light by changing the direction of reflection of the incident light is simple and quick, and the wavelength of the incident light used is limited. The present invention makes it possible to provide an optical modulator that is stable in operation and highly reliable.

According to a twenty-fourth aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on one surface of a thin film, and both ends are fixed and formed on the other surface of a double-ended beam deformable by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in the concave portion with the substrate electrode formed of the opposing surface facing the beam, and the divided held portion, which is divided into a plurality of the held portions of the doubly held beam, is held, so that driving at a lower driving voltage can be performed. It is possible to provide an optical modulator that has a simple structure that performs light modulation by changing the reflection direction of incident light, has a fast response, does not limit the wavelength of the incident light used, has stable operation, and has high reliability. To be able to According to claim 25, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film configured by combining a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is regulated by abutment to oppose the doubly supported beam to perform light modulation of incident light on the light reflection film. The substrate electrode formed of the opposing surface is formed in the concave portion of the substrate, and the divided held portion divided into a plurality of the held portions of the doubly supported beam is arranged and held at the corner portion of the doubly supported beam, and further, Drive at low drive voltage is possible, the structure that modulates light by changing the direction of reflection of incident light is simple and quick, and the operation is more stable and reliable without limiting the wavelength of incident light used. To provide an optical modulator with high reliability In claim 26, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film combining and forming a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is regulated by abutment to oppose the doubly supported beam to perform light modulation of incident light on the light reflection film. The substrate electrode formed of the opposing surface is formed in the concave portion, and the divided held portion, which is divided into a plurality of the held portions of the doubly supported beam, is held by the smooth outer shape portion, so that the driving at a lower driving voltage is performed. Is possible, the structure that modulates the light by changing the reflection direction of the incident light is simple, the response is fast, and the wavelength of the incident light to be used is not limited.
An optical modulator which is stable in operation, prevents concentration of stress, and has high reliability can be provided.

In the twenty-seventh aspect, a light reflecting film for regularly reflecting incident light is formed on the other surface of a doubly-supported beam which is fixed at both ends and is deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode composed of an opposing surface facing the beam so as to hold a portion to be retained composed of a folded structure of a doubly supported beam. It is possible to provide a light modulation device that has a simple structure that performs light modulation by changing the reflection direction of light, has a quick response, does not limit the wavelength of incident light to be used, has stable operation, and has high reliability. To Claim 2
In 8, a light reflecting film for regularly reflecting incident light is formed on the one surface by a thin film which is formed by combining the light reflecting films on both surfaces, and both ends are fixed to each other through an air gap formed on the other surface of the doubly supported beam deformed by electrostatic force. A drive voltage is applied opposite to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to partially modulate the light incident on the light reflecting film. A substrate is formed in a concave portion and has a substrate electrode composed of a part of a non-parallel opposing surface opposed to a non-parallel surface to hold a held portion of the doubly supported beam and at least a substrate electrode opposed to the doubly supported beam. The held portion held by the substrate of the doubly supported beam near the gap where the gap formed by the non-parallel inclined surface becomes the maximum interval is constituted by the divided held portions divided into a plurality of portions, so that the holding portion at a lower driving voltage can be used. Driving becomes possible, changing the direction of reflection of incident light to change light. Faster structure is simple reply to perform, without the wavelength of the incident light to be used is limited, operation is to be able to provide an even higher light modulator stable and reliable. According to claim 29, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film combining and forming a light reflection film for regular reflection of incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. The drive voltage applied to the substrate electrode is applied to the both-sided beam through the intervening beam. The substrate is formed in a concave portion with a non-parallel opposing surface in which the portion opposes in a non-parallel surface to hold the held portion of the doubly supported beam and at least the substrate electrode facing the doubly supported beam. The held portion held on the substrate of the doubly supported beam in the vicinity where the gap formed by the non-parallel inclined surfaces formed between the substrates becomes the maximum interval is constituted by the folding structure portion, so that driving at a lower driving voltage can be performed. It is possible to change the light Faster structure is simple reply to perform, without the wavelength of the incident light to be used is limited,
An optical modulator having stable operation and high reliability can be provided.

According to a thirty-third aspect, a doubly supported beam formed of a thin film composed of a light reflecting film for regularly reflecting incident light on one surface and fixed at both ends and having a tensile stress deformable by electrostatic force. A drive voltage is applied to the doubly supported beam through a gap formed on the other surface of the substrate. It is possible to obtain a higher drive frequency by forming a substrate electrode formed of a facing surface facing the doubly supported beam that performs light modulation to hold the held portion of the doubly supported beam, It is possible to provide a light modulation device that has a simple structure that performs light modulation by changing the reflection direction of incident light, has a fast response, does not limit the wavelength of incident light to be used, operates more stably, and has high reliability. Make it possible. In claim 31, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film combining and forming a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam caused by the application of the drive voltage to the substrate electrode is regulated by abutment to oppose the doubly supported beam to perform light modulation of incident light on the light reflection film. The substrate is formed in a concave portion by forming a substrate electrode formed of the opposed surface to hold the held portion of the doubly supported beam, and the doubly supported beam is formed by combining the doubly supported beam with the thickness (t) of a plurality of members and the tensile stress. Is a positive sign, and a combination of stress (σ) with a compressive stress being a negative sign is (t ₁ ,
σ ₁ ), (t ₂ , σ ₂ ),... (t _n , σ _n )
t ₁ · σ ₁ + t ₂ · σ ₂ + ... + t _n · σ _n / t ₁ + t ₂ + ·
.. + T _n ≧ 0, so that the driving frequency can be increased, the structure for performing light modulation by changing the direction of reflection of incident light is simple and quick, and the wavelength of incident light to be used is limited. Therefore, it is possible to provide an optical modulator that is more stable in operation and highly reliable.

According to a thirty-second aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on the other surface of a doubly-supported beam which is fixed at both ends and is deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate forms a substrate electrode having a surface facing the beam in a concave portion to hold the held portion of the doubly supported beam, and the doubly supported beam has a tensile stress (σ), a thickness (t), and a Young's modulus of a forming material. (E), between the distance (l) between one of the two opposite sides of the doubly supported beam held by the substrate and the other, (t / l) ² ≧ σ / E In this way, it is possible to drive at a lower driving voltage, and change the reflection direction of the incident light. A light modulation device having a simple structure, a fast response, and no limitation on the wavelength of incident light to be used, with stable operation and high reliability. In claim 33, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film in which a light reflection film for regularly reflecting incident light is formed on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate is formed in a concave portion having an opposing surface to hold the held portion of the doubly supported beam, and the substrate is formed with all or a part of a driving circuit to be driven to reflect incident light. In order to provide a compact, highly reliable and highly reliable optical modulator with a simple structure that performs light modulation by changing the direction, quick response, and no limitation on the wavelength of incident light to be used. I do. According to claim 34, a gap formed on the other surface of the doubly-supported beam which is formed of a thin film combining and forming a light reflection film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force is formed. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate electrode formed of the opposing surface is formed in the concave portion of the substrate to hold the held portion of the doubly supported beam, and the doubly supported beam is brought into contact with the surface of the substrate by electrostatic force due to application of a driving voltage between the substrate electrodes. The structure that performs light modulation by changing the reflection direction of incident light by changing the shape of the gap formed on the other surface of the doubly supported beam is simple and quick, and the wavelength of the incident light used Operation is stable and reliable without any restrictions It is so can provide a modulating device.

According to a thirty-fifth aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on one surface of a thin film, the both ends of which are fixed and deformed by electrostatic force on the other surface. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate electrode is formed in the concave part, which consists of the opposing surface facing the beam, holds the held part of the doubly supported beam, and the doubly supported beam is deformed by the electrostatic force caused by the application of the drive voltage between the substrate electrodes A high frequency drive is possible by applying a voltage between the substrate electrodes of opposite polarity to the extent that it does not occur, a simple structure that modulates the light by changing the reflection direction of the incident light, the response is fast, and the incident light used Without limiting the wavelength of light, Moving further it is to be able to provide an even higher light modulator stable and reliable. In claim 36, a gap formed on the other surface of the doubly-supported beam that is formed of a thin film that combines and forms a light reflection film that regularly reflects incident light on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate is formed in a concave portion with a substrate electrode formed of a facing surface to hold the held portion of the doubly supported beam, and the doubly supported beam is driven by a positive voltage and a negative voltage between the substrate electrodes based on the potential of the doubly supported beam. High-frequency driving is possible by alternately applying voltage and deforming, and the structure that modulates light by changing the direction of reflection of incident light is simple, quick in response, and limits the wavelength of incident light used. Light modulator with more stable operation and higher reliability To be able to provide. In claim 37, a light modulating device is manufactured by forming a gap on the substrate, forming a sacrificial material layer made of a sacrificial material, flattening the substrate, forming a doubly supported beam, and removing the sacrificial material layer. Thus, it is possible to provide a method of manufacturing an optical modulation device having a small number of manufacturing steps and a high yield. Claim 3
In 8, a concave portion forming step of forming a concave portion on the substrate by a thin film forming method or a fine processing method on the substrate, a substrate electrode forming step of forming all or a part of the substrate electrode in the concave portion of the substrate, and a concave portion on the substrate A sacrificial material layer forming step of forming a sacrificial material layer made of a sacrificial material, a doubly supported beam forming step of forming a doubly supported beam on the sacrificial material layer, and a sacrificial material layer removing step of removing the sacrificial material layer in the concave portion. Forming a sacrificial material layer made of a sacrificial material after forming a gap on the substrate, flattening the substrate to form a doubly supported beam, and removing the sacrificial material layer to manufacture an optical modulation device. It is possible to provide a method for manufacturing an optical modulation device with a small yield and a high yield.

According to a thirty-ninth aspect of the present invention, after forming a gap on the substrate, a sacrificial material layer made of a sacrificial material as a silicon oxide film is formed, and the substrate is flattened. In this manner, a method of manufacturing an optical modulator can be provided in which the sacrificial material layer is stable, the number of manufacturing steps is small, and the yield and accuracy are high. In claim 40, after forming a gap on the substrate, a sacrificial material layer made of a sacrificial material that is a polycrystalline silicon film or an amorphous silicon film is formed, and the substrate is flattened. Since the light modulation device can be manufactured by removing the light modulation device, the method of CVD can be used. Therefore, it is possible to provide a method of manufacturing the light modulation device which is low in cost, has few manufacturing steps, and has high yield. In claim 41, after forming a gap on the substrate, a sacrificial material layer made of a sacrificial material, which is an organic material film, is formed, the substrate is flattened, a doubly supported beam is formed, and then the sacrificial material layer is removed. To make the device,
An object of the present invention is to provide a method of manufacturing an optical modulator in which a sacrificial layer material layer can be easily formed at low cost, the number of manufacturing steps is small, and the yield is high. In claim 42, a plurality of claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 1
0, 11, 12, 13, 14, 15, 16, 17, 1
8, 19, 20, 21, 22, 23, 24, 25, 2,
6, 27, 28, 29, 30, 31, 32, 33, 3
The light modulation device according to any one of 4, 35, and 36 is independently driven by independent driving means to process optical information, and the structure for performing light modulation by changing the reflection direction of an incident light beam is simple. It is possible to provide an optical information processing device having a small light modulator that is fast in response, does not limit the wavelength of an incident light beam to be used, operates stably, has high reliability and has a low voltage, and consumes little power. Make it possible. Claim 4
3. The method according to claim 1, wherein a latent image is formed by writing light on an image carrier which is rotatably held and carries a formed image. 9, 1
0, 11, 12, 13, 14, 15, 16, 17, 1
8, 19, 20, 21, 22, 23, 24, 25, 2,
6, 27, 28, 29, 30, 31, 32, 33, 3
A latent image formed by the light modulation device of the latent image forming device comprising the light modulation device according to any one of 4, 35, and 36, and the toner image formed by the developing device for forming a toner image by visualizing the latent image is transferred. By transferring the light to the transfer target by means to form an image, the structure for performing light modulation by changing the reflection direction of the incident light is simple and fast in response, without limiting the wavelength of the incident light beam used, It is possible to provide an image forming apparatus including a small-sized light modulation device that operates stably, has high reliability, and has low voltage because of low voltage consumption.

In a forty-fourth aspect, an image is projected by changing the direction of reflection of incident light of image projection data and performing light modulation to project an image. 1
0, 11, 12, 13, 14, 15, 16, 17, 1
8, 19, 20, 21, 22, 23, 24, 25, 2,
6, 27, 28, 29, 30, 31, 32, 33, 3
Structure for performing light modulation by changing the reflection direction of incident light by displaying an image projected by the light modulation device of the light switching device comprising the light modulation device according to any one of 4, 35, and 36 on a projection screen. The present invention provides an image projection display device including a small light modulation device that is simple, has a fast response, does not limit the wavelength of incident light to be used, operates stably, has high reliability, and has a low voltage so that power consumption is small. To be able to

[0027]

Next, embodiments of the present invention will be described in detail with reference to the drawings. In FIGS. 1 and 2, a light modulation device 0 that modulates light by changing the reflection direction of incident light includes:
A doubly-supported beam formed of a light reflecting film 1 for regularly reflecting incident light and a thin film formed by combining the light reflecting film 1 formed of a metal thin film on one surface, and fixed at both ends and deformed by electrostatic force 2 is driven in opposition to the doubly supported beam 2 via a gap (G) of a concave portion 4a formed on the back surface of the other surface of the doubly supported beam 2 in which a beam electrode 2f is configured to apply a voltage. The deformation of the doubly supported beam 2 due to the application of a drive voltage to the substrate electrode 3 to which a voltage is applied and the substrate electrode 3 protected by the protective film 7 is regulated by contact to perform light modulation of the incident light on the light reflection film 1. parallel opposing surface 3a ₁ of the substrate electrode 3 in a doubly supported beam 2 are opposed parallel surfaces of the opposing surface 3a facing the substrate electrode 3 made of parallel opposing surface 3a ₁ Tokyo opposing face 3a is formed in the concave portion 4a Driving the light transmitting glass material holding the held portion 2a of the doubly supported beam 2 or the doubly supported beam 2 And a substrate 4 made of a single-crystal silicon material or the like on which a driving circuit 2d is formed.
The operation is stable and reliable with no restriction on the wavelength of the incident light used. Double support beam 2
Is formed of a thin film of single crystal silicon, polycrystal silicon, or silicon nitride. The doubly supported beam 2 made of a single crystal silicon material has few defects and a long life. The cantilever 2 made of polycrystalline silicon can be manufactured at low cost because a technique such as CVD can be used. The double-supported beam 2 formed of the silicon nitride thin film can increase the switching response speed by the action of the tensile stress of the silicon nitride thin film.

As a member of the light reflecting film 1 formed of a metal thin film combined and formed on one surface of the doubly supported beam 2,
Although a metal thin film is generally used, a reflective film may be formed by a multilayer film of a dielectric material. The doubly supported beam 2 is formed by combining and forming another beam electrode 2f that generates an electrostatic force. The beam electrode 2f may be formed independently. However, when the light reflection film 1 for reflecting the incident light is a metal thin film, the beam electrode 2f is omitted if this metal thin film is used as an electrode. Can be done. When the doubly supported beam 2 is formed of single crystal and polycrystalline silicon, if the single crystal silicon or polycrystal silicon is reduced in resistance by impurities and used as an electrode, the beam electrode 2f is omitted. You can do it. One side 2b ₁ of the two sides 2b at opposite ends of the doubly supported beam 2 held and fixed to the substrate 4
And the distance between the other side 2b ₂ is one side ₂ of the two sides 2b.
Since it is fixed so as to be equal to or longer than the length of b ₁ or the other side 2b ₂ , it is possible to reliably drive at a lower drive voltage, and the deformation of the doubly supported beam 2 proceeds. Will be. The substrate electrode 3 for driving the doubly supported beam 2 is A
A metal such as l, Cr, Ti, TiN, or a thin film of a metal compound is generally used. When the substrate 4 is formed of a light-transmitting glass, if a transparent conductive film of ITO is used for the substrate electrode 3, the state of the doubly supported beam 2 can be observed from the back side of the substrate 4 and can be observed at the time of inspection. It is advantageous. When the substrate 4 is formed of single-crystal silicon, electrodes can be formed in the single-crystal silicon by an impurity diffusion method, and a part or all of the electronic circuit 6a of the drive circuit 6 can be formed in the substrate 4 by a diffusion method. Can be formed. Further, a wiring matrix can be formed by combining the diffusion methods, which is advantageous for forming a complicated and large number of wirings. Further, it is possible to form a part or all of the drive circuit 2d for applying a voltage to the doubly supported beam 2 in the silicon substrate 4 to make the circuit compact. Protective film 7
In general, an oxide film formed by a vacuum film forming method is used. The protective film 7 allows the substrate electrode 3 to contact the doubly supported beam 2,
It works to prevent short circuit. The protective film 7 has a pad opening 8 as a portion for connecting the substrate electrode 3 and an external signal.
Are formed.

3 and 4, when no electrostatic force acts on the doubly supported beam 2, the held portion 2a of the doubly supported beam 2
It is held and fixed to one side 2b ₁ and the other side 2b ₂ of 2 sides 2b of the opposite end portions of the doubly supported beam 2 on the substrate 4. The incident light beam (R) at this time is specularly reflected on the surface of the light reflecting film 1 combined with one surface of the doubly supported beam 2, and travels in the direction of the arrow shown in the figure (see FIG. 3). . A driving voltage is applied between the beam electrode 2 f and the substrate electrode 3 combined with the doubly supported beam 2 to cause an electrostatic force to act on the doubly supported beam 2. At that time, the doubly supported beam 2 whose both ends are held and fixed bends, abuts on the surface of the substrate 4 and follows the gap shape of the gap (G) of the parallel concave portion 4 a formed on the other surface of the doubly supported beam 2. deformed Te, attracted to parallel opposing surface 3a ₁ side of the opposing face 3a of the substrate electrode 3 flexure contacts is restricted, and drives the digital signal. At this time,
The surface of the light reflecting film 1 combined with the doubly supported beam 2 is affected by the bending of the doubly supported beam 2, and the direction of the reflected light of the incident light beam (R) is disturbed (see FIG. 4). Incident light flux (R)
When viewed from the direction where the light reflected, the state of FIG.
4 is brightly turned on by the regular reflection of the light reflecting film 1 configured in the above manner, and the state shown in FIG.
The direction of the reflected light is disturbed, and it becomes dark OFF state,
Therefore, the optical modulation is simple, the response is fast, the wavelength of the incident light to be used is not limited, and the operation is stable and the light modulation is highly reliable. In the light modulation device 0, since the doubly supported beam 2 for switching light is a fixed beam holding both ends,
Compared to a cantilever, free vibration is less likely to occur, there is no deformation even if there is residual stress, there is little change over time, and there is no problem of free vibration. Excellent in terms of stability and response speed. Double support beam 2
Are deformed by an electrostatic force caused by application of a drive voltage between the substrate electrodes 3 and then are reversed in such a degree that the substrate electrodes 3 do not deform.
By applying a voltage between them, the stability of the doubly supported beam 2 is more excellent, and high-frequency driving can be performed. The doubly supported beam 2 is similarly deformed by alternately applying a positive voltage and a negative voltage to the drive voltage between the substrate electrodes 3 based on the potential of the doubly supported beam 2, thereby similarly stabilizing the doubly supported beam 2. Is better,
High frequency drive is now possible.

The recesses 5 and 6, a portion of the doubly supported beam 2 opposite to the opposed surface 3a of the substrate electrode 3 is formed between the non-parallel opposing surface 3a ₂ part facing the non-parallel faces The gap (G) 4 a is a partially inclined surface that is partially non-parallel between two opposing sides 2 b of the doubly supported beam 2 held on the substrate 4, and is partially formed with respect to the doubly supported beam 2. It is formed on a partially non-parallel inclined surface. Such a shape of a partly non-parallel partly inclined surface is effective for reducing a drive voltage for deformation of the doubly supported beam 2. The electrostatic force acting on the doubly supported beam 2 is half proportional to the square of the distance between the substrate electrode 3 and the doubly supported beam 2. That is, the smaller the distance between the substrate electrode 3 and the doubly supported beam 2 is, the larger the acting electrostatic force is. Therefore, when the driving voltage is applied, the doubly supported beam 2 starts to deform from the narrow portion of the gap (G) of the concave portion 4a, and comes into contact with the surface of the substrate 4 and
Is deformed along the space shape of the gap (G) of the concave portion 4a of the partially non-parallel partially inclined surface formed on the other surface of the substrate electrode 3, and the non-parallel opposing surface 3a of the opposing surface 3a of the substrate electrode 3. _It is attracted to the _two sides and comes into contact with it to control the bending, and is driven by a digital signal. In this case, sequentially the deformation of the doubly supported beam 2, narrows the gap of the recess 4a (G), allows the drive at a low driving voltage than that of the gap (G) parallel recesses 4a parallel opposing face 3a ₁ Thus, the deformation of the doubly supported beam 2 proceeds.

In FIGS. 7 and 8, the doubly supported beam 2 is a beam configured by combining a light reflecting film 1 for regularly reflecting incident light with a beam electrode 2f on one surface so that a voltage can be applied. the one side 2b ₁ and the other side 2b ₂ of 2 sides 2b of the opposite end portions are held and fixed to the substrate 4. The substrate electrode 3 is formed in a concave portion 4a of the substrate 4 facing the doubly supported beam 2.
The gap (G) of the concave portion 4a formed between the non-parallel opposing surfaces 3a ₃ protected by the protective film 7 opposing the two non-parallel surfaces of the opposing surface 3a is held and fixed by the substrate 4. The two surfaces are formed of two non-parallel inclined surfaces between the two sides 2b at opposite ends of the doubly supported beam 2. Substrate 4 facing doubly supported beam 2
And formed between the plurality of non-parallel opposing surfaces 3a ₃ protected by the opposing protective film 7 with two non-parallel inclined surfaces of the opposing surface 3a of the substrate electrode 3. Due to the gap (G) of the concave portion 4a, a plurality of non-parallel non-parallel structures protected by two non-parallel inclined surfaces of the beam electrode 2f of the doubly supported beam 2 and the opposing surface 3a of the substrate electrode 3 are provided. distance between the opposing surfaces 3a ₃ is formed on the inclined surface of the two surfaces of the non-parallel. The electrostatic force acting on the doubly supported beam 2 is formed in a concave portion 4a of the substrate 4 facing the doubly supported beam 2 and protected by two non-parallel inclined surfaces of the two opposing surfaces 3a of the substrate electrode 3. A plurality of non-parallel opposing surfaces 3a ₃ protected by the film 7 are formed in the concavities 4a of the substrate 4 formed facing the doubly supported beams 2 via the gaps (G) of the concavities 4a formed between the surfaces. And a plurality of non-parallel opposing surfaces 3a ₃ protected by a protective film 7 opposing the two non-parallel inclined surfaces of the opposing surface 3a of the substrate electrode 3 and combined with the doubly supported beam 2. Opposite surface 3a of beam electrode 2f and substrate electrode 3
Between the plurality nonparallel opposing face 3a ₃ protected by the protective film 7 which faces the inclined surface of the two surfaces of the non-parallel two surfaces of, by applying a driving voltage, an electrostatic force to deflect the doubly supported beam 2 Let it.

The doubly supported beam 2 is formed of a thin film, and as a material thereof, a thin film of a wide variety of materials such as single crystal silicon, polycrystalline silicon, amorphous silicon thin film or silicon nitride, or a metal thin film or an organic thin film is used. The doubly supported beam 2 made of single crystal silicon has few defects and high reliability. Also, polycrystalline silicon, amorphous silicon thin film,
The cantilever beam 2 formed of a silicon nitride thin film can be manufactured at low cost because a method such as CVD can be used for the manufacturing method. When forming the doubly supported beam 2 with a metal thin film,
The cantilever 2, the beam electrode 2 f, and the light reflection film 1 for regularly reflecting incident light can be combined and integrally formed. A metal thin film is generally used as the light reflecting film 1 which is formed in combination with one of the surfaces of the doubly supported beam 2 and which regularly reflects incident light, but a reflecting film is formed by a multilayer film of a dielectric material. May be. Also, the other end of the doubly supported beam 2 is formed with a combination of the two surfaces, and another beam electrode 2f for generating an electrostatic force is formed on the doubly supported beam 2. The beam electrode 2f may be formed independently, but when the light reflecting film 1 for regularly reflecting the incident light is a metal thin film, this metal thin film is used as an electrode and the beam electrode 2f is omitted. I can do it. When the doubly supported beam 2 is formed of single crystal and polycrystalline silicon, if the single crystal silicon or the polycrystalline silicon is reduced in resistance by impurity diffusion and used as an electrode, the beam electrode can be used. 2f can be omitted. In addition to these, the light reflecting film 1
In some cases, a transparent protective film is formed for the purpose of protecting the beam electrode 2f. The doubly supported beam 2 is formed by combining these thin films, and is formed to have a tensile stress by adjusting the forming conditions of each thin film.
Alternatively, the doubly supported beam 2, the light reflecting film 1, the beam electrode 2f, etc.
When the tensile stress is a positive sign and the compressive stress is a negative sign, the combination of the film thickness (t) and the stress (σ) is represented by (t ₁ , σ ₁ ), (t ₂ , σ ₂ ), ... (t _n , σ _n ), t ₁ · σ ₁ + t ₂ · σ ₂ + ... + t _n · σ _n / t ₁ + t ₂
+ ... + t _n ≧ 0, the doubly supported beam 2 is formed by adjusting the film thickness (t) and the stress (σ). In this way, since the tensile stress is preserved in the doubly supported beam 2, the stability of the shape of the doubly supported beam 2 and higher driving frequency can be obtained. Further, the doubly supported beam 2
Tensile stress (σ), thickness (t), Young's modulus (E) of the forming material, one side 2b ₁ and the other side of two sides 2b at opposite ends of doubly supported beam 2 held on substrate 4 Since the relationship of (t / l) ² ≧ σ / E is established between the distance (l) between 2b ₂ , the driving voltage can be reduced.

The substrate 4 has a recess 4a for generating an electrostatic force.
All or a part of the gap (G) is formed, and various materials such as a light transmissive glass material, a ceramic material, single crystal silicon, a metal, and an organic material can be used. When the substrate 4 is made of light transmissive glass, the state of the doubly supported beam 2 can be seen from the back side of the substrate 4, which is advantageous for product inspection. When the substrate 4 is formed of single crystal silicon,
The electronic circuit 6a of the drive circuit 6 is formed in the substrate 4 by the diffusion method, and a wiring matrix can be formed by combining the diffusion methods, which is advantageous for forming a complicated and large number of wirings. By forming part or all of the drive circuit 2d for applying a voltage to the doubly supported beam 2, it is possible to make the device compact. Substrate 4 facing doubly supported beam 2
Non-parallel recess 4a formed with a plurality non-parallel opposing surfaces 3a ₃ protected by the protective film 7 is formed in the concave portion 4a facing in a non-parallel two face opposing face 3a of the substrate electrode 3 of The shape of the gap (G) is defined by two opposing sides 2 at both ends of the doubly supported beam 2.
2b from the holding end of the held portion 2a on _one side 2b1
a first non-parallel inclined surface changes toward the holding end of b of the other side 2b ₂ side of the held portion 2a, and, doubly supported beam 2
Second varying toward the holding end of the other side 2b ₂ side of the held portion 2a of the opposing two sides 2b at both ends to the holding end of the holding portion 2a of one side 2b ₁ side of the two sides 2b Are formed on the doubly supported beam 2 so that the sizes of the gaps (G) at equal distances from the respective held portions 2 a are equal to each other, and the two It is the maximum distance at the center of the cantilever 2, and one side ₂ b ₁ and the other side ₂ b ₂ of the two sides 2 b at opposite ends of the doubly supported beam ₂ and the other 2
A spindle shape which sequentially increases toward the other one of the sides 2c ₁ and other other side 2c ₂ Metropolitan sides 2c at the central portion of the doubly supported beam 2. The shape of the gap (G) of the concave portion 4a formed on the other surface of the doubly supported beam 2 is as follows.
A plurality of non-parallel opposing surfaces 3a which are formed in the concave portion 4a of the substrate electrode 3 and oppose by two non-parallel inclined surfaces of the opposing surfaces 3a of the substrate electrode 3.
₃ , the maximum gap portion is not limited to the shape of the gap (G) of the concave portion 4a formed of two non-parallel inclined surfaces, and the largest gap portion is on _one side 2b1 side of the held portion 2a or the other. such as those being closer to the edge 2b ₂ side is variously.

A plurality of non-parallel opposing surfaces 3a ₃ which are formed in the concave portion 4a of the substrate 4 opposing the doubly supported beam 2 and oppose by two non-parallel inclined surfaces of the opposing surface 3a of the substrate electrode 3. The gap (G) of the concave portion 4a of the two non-parallel inclined surfaces formed between them
Can be formed by photolithography and dry etching. A photosensitive resist material serving as a dry etching mask is formed on the substrate 4, and a photoresist is formed in a desired non-parallel recess 4 a by using a photomask having an adjusted light transmission amount. After that, it can be formed by transferring and etching the shape of the photoresist onto the substrate 4 by anisotropic dry etching. The substrate electrode 3 is made of a conductive thin film such as a metal or a metal compound such as Al, Cr, Ti, and TiN, and the whole or a part of the substrate electrode 3 is formed in a concave portion 4 a formed on the substrate 4. When the substrate 4 is formed of light transmissive glass, if a transparent conductive film, such as ITO or ZnO, is used for the substrate electrode 3, the state of the double-supported beam 2 can be observed from the back side of the substrate 4, which is advantageous during inspection. . When the substrate 4 is made of single crystal silicon,
The substrate electrode 3 can be formed by a method of diffusing impurities of different conductivity types into the single crystal silicon of the substrate 4. The substrate 4
In the case of a conductive material such as a metal, the substrate electrode 3 is formed via an insulating material. As the protective film 7, an insulating material, in particular, an oxide film formed by a vacuum film forming method is generally used. The protective film 7 is formed such that the substrate electrode 3 is a beam electrode 2 f of the doubly supported beam 2.
To prevent short circuit. A pad opening 8 may be formed in a part of the protective film 7 as a portion connecting the substrate electrode 3 and an external signal.

The one side 2b ₁ and the other ends of the sides 2b ₂ are each held portion 2a of the opposing two sides 2b at both ends of the doubly supported beam 2
As a method of forming the doubly supported beam 2 held by the above, a technique of a sacrificial layer process is effective. That is, a gap (G) of the concave portion 4a formed in the concave portion 4a of the substrate 4 facing the doubly supported beam 2 and formed with the facing surface 3a of the substrate electrode 3 is made of a material (not shown) that can be removed later. The sacrifice layer material layer 5 is buried and flattened, and the doubly supported beam 2 is formed thereon. Thereafter, the sacrifice layer material layer 5 (not shown) is removed by etching. The sacrificial layer material layer 5 is appropriately selected in relation to the material of the substrate 4 in which the gap (G) of the doubly supported beam 2 and the concave portion 4a is formed. That is, when removing the sacrificial layer material layer 5 (not shown), it is necessary that the doubly supported beam 2 and the substrate 4 are not damaged. Removal of the sacrificial layer material layer 5 (not shown)
Since the etching is performed by wet or dry etching, a material having a high etching selectivity, an etching rate of the sacrificial layer material layer 5 (not shown), an etching rate of the doubly supported beam 2, and an etching rate of the substrate 4 is selected. When the material of the doubly supported beam 2 is a nitride film or a polycrystalline silicon film, an oxide film formed by CVD can be selected as the sacrificial layer material layer 5 (not shown). It is also possible to combine a doubly supported beam 2 of a nitride film and a sacrificial layer material layer 5 (not shown) of a polycrystalline silicon film. If dry etching can be used to remove the sacrificial layer material layer 5 (not shown), the sacrificial layer material layer 5 (not shown) of the resist film can be used widely.
However, in this case, other process temperatures such as the formation of the doubly supported beam 2 must be performed at 300 ° C. or less.

In FIGS. 9 and 10, the electrostatic
When no force is applied, the held portion 2a of the doubly supported beam 2
Is one of the two sides 2b at opposite ends of the doubly supported beam 2.
2b ₁And the other side 2b_TwoIs fixedly held on the substrate 4
You. The incident light beam (R) at this time is one of the two
In the surface of the light reflection film 1 configured in combination with the surface of
The light is specularly reflected and travels in the direction of the arrow shown in FIG.
See). Beam electrode 2f combined with doubly supported beam 2
A plurality of non-parallel surfaces of the two opposing surfaces 3a of the substrate electrode 3 oppose each other.
Number non-parallel opposing surface 3a_ThreeDrive voltage is applied between
An electrostatic force is applied to the beam 2. At that time, both ends are fixed
The bent doubly supported beam 2 flexes and comes into contact with the surface of the substrate 4 to support it.
Inclination of two non-parallel surfaces formed on the other surface of beam 2
Deformed along the shape of the gap (G) of the concave portion 4a of the surface.
And a plurality of non-parallel opposing surfaces 3a of opposing surfaces 3a of the substrate electrode 3._Three
Side of the digital signal.
It is driven by a signal. At this time,
2, the surface of the light reflecting film 1 configured in combination
The reflected light of the incident light flux (R) is affected by the deflection of the beam 2
The directions are disturbed in two directions (see FIG. 10). Incident light flux (R)
When viewed from the direction in which is reflected, the state of FIG.
The light is reflected by the specular reflection on the light reflection film 1 configured in combination with
In the state shown in FIG.
(R) The reflected light is disturbed in two directions and is dark and OFF.
Thus, light modulation is performed. Therefore, the light modulator
0 means that the beam 2 that switches light is a fixed beam at both ends.
Free vibration is less likely to occur than cantilever beams
It does not deform even if there is residual stress.
Response time is fast because there is little problem of free vibration
And has excellent stability and response speed of the doubly supported beam 2.
You.

A gap of a non-parallel concave portion 4a formed between the non-parallel opposing surfaces 3a ₃ opposing the two non-parallel inclined surfaces of the opposing surface 3a of the substrate electrode 3 opposing the doubly supported beam 2. (G) is an inclined surface in which two surfaces are non-parallel between two opposite sides 2 b of the doubly supported beam 2 held on the substrate 4, and two surfaces are non-parallel to the doubly supported beam 2. It is formed on two inclined surfaces. Such a shape of the two inclined surfaces in which the two surfaces are non-parallel is effective for further reducing the driving voltage required for the deformation of the doubly supported beam 2. The electrostatic force acting on the doubly-supported beam 2 is divided into a plurality of non-parallel opposing surfaces 3a ₃ which are opposed by two non-parallel inclined surfaces of the opposing surface 3a of the substrate electrode 3 and the doubly-supported beam 2
Is half proportional to the square of the distance between That is, the smaller the distance between the plurality of non-parallel opposing surfaces 3a ₃ and the doubly supported beam 2 which are two non-parallel inclined surfaces of the opposing surfaces 3a of the substrate electrode 3, the larger the applied electrostatic force. Therefore, when the driving voltage is applied, the doubly supported beam 2 starts to deform from the narrow portion of the two inclined surfaces of the gap (G) of the concave portion 4a. Also, sequential by the deformation of the doubly supported beam 2, the gap of the serial recess 4a of the upper recessed portion 4a (G) is narrowed, the concave portion 4a of the parallel flat surfaces parallel opposing surface 3a ₁ gap (G) and some non-parallel opposing part of the surface 3a ₂ than in the void spaces of valleys 4a of portion inclined surface of the non-parallel (G), further,
The deformation of the doubly supported beam 2 proceeds at a low voltage.

In FIGS. 11 and 12, a non-parallel opposing surface 3a is formed in a concave portion 4a of the substrate 4 opposing the doubly supported beam 2, and the opposing surface 3a of the substrate electrode 3 opposes a non-parallel surface.
Shape of the gap of the non-parallel recesses 4a (G) formed between the ₄ is the maximum in the vicinity of the maximum gap portion is closer to one side 2b ₁ side of the held portion 2a, held by the substrate 4 sequentially increases toward the one side 2b ₁ from the other side 2b ₂ of 2 sides 2b of the opposite end portions of the doubly supported beam 2 which is. Double support beam 2
When no electrostatic force acts on the substrate 4, the held portion 2 a of the doubly supported beam 2 attaches one side ₂ b ₁ and the other side ₂ b ₂ of the two opposite sides 2 b of the doubly supported beam ₂ to the substrate 4. Retained and fixed. The incident light beam (R) at this time is specularly reflected by the surface of the light reflecting film 1 combined with one surface of the doubly supported beam 2, and travels in the direction of the illustrated arrow (see FIG. 11). . A drive voltage is applied between the beam electrode 2f combined with the doubly supported beam 2 and the entire non-parallel opposing surface 3a ₄ where the entire opposing surface 3a of the substrate electrode 3 opposes a non-parallel surface,
An electrostatic force is applied to the doubly supported beam 2. At that time, the doubly supported beam 2 whose both ends are held and fixed bends, and abuts on the surface of the substrate 4 to form a gap (G ), The entire surface of the opposing surface 3a of the substrate electrode 3 is attracted to the entire non-parallel opposing surface 3a ₄ which is opposed by a non-parallel inclined surface to abut and restrict the bending, thereby controlling the digital signal. To be driven. At this time, the surface of the light reflecting film 1 combined with the doubly supported beam 2 is affected by the bending of the doubly supported beam 2, and the direction of the reflected light of the incident light beam (R) changes in one direction (FIG. 12). See).

When viewed from the direction in which the incident light beam (R) is reflected, the state shown in FIG. 11 is turned ON brightly by regular reflection on the light reflecting film 1 combined with the doubly supported beam 2, and
In the state shown in FIG. 12, since the direction of the reflected light of the incident light beam (R) changes in one direction, the state becomes dark and the state is surely turned off, so that reliable light modulation is performed. Light modulator 0
Since both ends of the doubly supported beam 2 for switching light are fixed and held at both ends, free vibration is less likely to occur compared to the cantilever, and there is no deformation even if there is residual stress. Since there is little change with time and there is no problem of free vibration, the response speed is increased, and the stability of the doubly supported beam 2 and the response speed are excellent. Opposite surface 3a of substrate electrode 3 facing doubly supported beam 2
Non-parallel opposing surface 3 in which the entire surfaces of the non-parallel surfaces are non-parallel inclined surfaces
void nonparallel recesses 4a formed between a ₄ (G)
Is a non-parallel inclined surface between the two sides 2b at opposite ends of the doubly supported beam 2 held by the substrate 4;
Are formed on non-parallel inclined surfaces. Such a shape of the inclined surface whose entire surface is non-parallel is effective for further reducing the drive voltage for deforming the doubly supported beam 2. The electrostatic force acting on the doubly supported beam 2 is half the square of the distance between the doubly supported beam 3 and the entire non-parallel opposing surface 3a ₄ where the entire opposing surface 3a of the substrate electrode 3 is non-parallel and inclined. Proportional. That is, the entire non-parallel opposing surface 3a ₄ where the entire opposing surface 3a of the substrate electrode 3 opposes with a non-parallel inclined surface and the doubly supported beam 2
The smaller the distance is, the larger the applied electrostatic force. Therefore, when the driving voltage is applied, the doubly supported beam 2 starts to deform from the narrow portion of the gap (G) of the concave portion 4a. Also, sequential by the deformation of the doubly supported beam 2, narrows the gap of the recess 4a (G), the recess 4a of the parallel flat surfaces parallel opposing surface 3a ₁ gap (G) and some non-parallel opposing surface 3a ₂ one Not only does the deformation of the doubly supported beam 2 proceed at a lower voltage than in the case of the gap (G) of the partially inclined surface that is not parallel to the part, and the incidence when the doubly supported beam 2 is bent by electrostatic force. Since the reflection direction of the light beam (R) changes in one direction, it becomes darker and is reliably turned off.
Therefore, light modulation is reliably performed, and optical information processing is facilitated.

In FIGS. 13 and 14, the held portion 2a held and fixed to the substrate 4 of the doubly supported beam 2 is composed of a folded structure 2e having a folded shape near the held and fixed portion. Since the folding structure 2e can substantially increase the distance between the held portions 2a, a large amount of bending can be obtained with the same driving voltage. The substrate 4 of the doubly supported beam 2 in the vicinity where the gap (G) of the non-parallel concave portion 4a formed by at least the doubly supported beam 2 and the opposing substrate electrode 3 is the maximum distance.
Since the held portion 2a held and fixed in the above-described manner is composed of the folding structure portion 2e, the driving voltage can be further reduced.

[0041] In FIG 15 FIG 16, the held portion 2a which is held fixed to the substrate 4 of the doubly supported beam 2, one of the two sides 2b of the opposite end portions of the doubly supported beam 2 sides 2b ₁ and the other The divided holding parts 2a _{1 to n obtained} by dividing _one side 2c ₁ and the other side 2c ₂ of the side 2b ₂ or the other two sides 2c (not shown) into a plurality of pieces, and the dividing method is various. Although it is possible, for example, divided and six 6 divided as shown held portion 2a ₁
When a division held portion 2a _2, and dividing the held portion 2a _3, and dividing the held portion 2a _4, divided the held portion 2a _5, so as to consist of dividing the held portion 2a ₆ Prefecture, doubly supported beam The voltage required for deformation 2 can be further reduced.
Maximum deflection amount when the doubly supported beam 2 having both sides of the plate thickness (h) and having both ends of the plate thickness (h) subjected to the uniform load (P) receives the uniform distribution weight (P). (Ω ₁ ) is ω ₁ = 0.025 *, where Young's modulus of the two members of the doubly supported beam is (E).
It is represented by Pa ⁴ / Eh ³ . On the other hand, the same maximum bending amount (ω ₂ ) of the doubly supported beam 2 excluding the holding and fixing conditions is ω ₂ = 0.0
45 * Pa ⁴ / Eh ³ , which is about twice the amount of deflection. A doubly supported beam held portion 2a which is held by the substrate 4 of 2, one side 2b ₁ and the other side 2b ₂ of 2 sides 2b of the opposite end portions of the doubly supported beam 2, or, in other not shown 2 if it is divided edges 2c ₁ and other other side 2c ₂ other one of the sides 2c into a plurality of division held portions 2a _{1 ~ n,} the amount of deflection of doubly supported beam 2, (omega ₁ ) And (ω ₂ ) and the amount of flexure increases, so that the electrostatic force can be reduced, and as a result, the drive voltage required for flexure decreases. When dividing the held portion 2a is held in the substrate 4 of the doubly supported beam 2, the corner portions 2g of doubly supported beam 2 as shown, and dividing the held portion 2a _1,
And dividing the held portion 2a _3, and dividing the held portion 2a _4, by holding at the division held portion 2a _6, carried out a stable operation, reflection direction of the incident light is stabilized.

The held portion 2 is provided at the corner 2g of the doubly supported beam 2.
If the divided held portions 2a _{1 to n of a} do not exist, when the doubly supported beam 2 is deformed by the electrostatic force, the corner portion 2g is largely deformed and thus is obliquely deformed. This causes the reflection direction of the incident light beam to become unstable. Divided held part 2a
_{1 to n} are connected to the connecting portion with the doubly supported beam 2 by a smooth outer shape portion 2h in order to prevent concentration of bending stress due to electrostatic force at the connecting portion with the doubly supported beam 2. When the external shape of the doubly supported beam 2 undergoing a stress changes rapidly, the stress concentrates on the portion where the change is the largest. Due to this concentration, the doubly supported beam 2 is broken even when the acting stress is smaller than the breaking stress. The divided held portions 2a _{1 to n obtained} by dividing the held portion 2a are formed into a smooth outer portion 2h having a smooth outer shape at a connection portion with the doubly supported beam 2, thereby preventing concentration of stress and improving reliability of light modulation. Have improved. As the shape of the smooth outer portion 2h at the connection portion of the smooth outer portion 2h having a smooth outer shape, a part of an arc or a part of an oblong arc is desirable. The plurality of held portions 2a held by the substrate 4 of the doubly supported beam 2 in the vicinity where the gap (G) of the non-parallel concave portion 4a formed by the doubly supported beam 2 and the opposing substrate electrode 3 is the maximum interval are plural. since the division held portion 2a ₂ divided into pieces from dividing the held portion 2a _5, now can be lowered more driving voltage.

In FIG. 17, since a plurality of light reflecting films 1, a doubly supported beam 2, a substrate electrode 3 and the like are arranged on a substrate 4 in a one-dimensional array, light modulation in a line shape can be performed. A possible light modulation device 10 can be provided. In FIG. 18, since a plurality of light reflecting films 1, a doubly supported beam 2, a substrate electrode 3 and the like are arranged on a substrate 4 in a two-dimensional array shape, light capable of performing light modulation in a planar shape is provided. The modulation device 100 can be provided. 19 to 30, the light modulation device 0 flattens the substrate 4 by forming a sacrifice material layer 5 made of a sacrifice material after forming a gap (G) of the concave portion 4 a on the substrate 4 as follows. Thus, the sacrificial material layer 5 is removed after the doubly supported beam 2 is formed, so that it is possible to provide a method of manufacturing the optical modulator 0 having a small number of manufacturing steps and a high yield. In the recess forming step (a), the substrate 4 is made of a silicon substrate 4c on which an oxide film 4b is formed. A gap (G) in the concave portion 4a is formed in the substrate 4 by photolithography and dry etching. If a photomask on which an area gradation pattern is formed or a method of thermally deforming a resist material is used, the gap (G) of the non-parallel concave portion 4a can be formed. The gap (G) of the recess 4a has a width of 20μ.
m and a depth of 2.4 μm (see FIGS. 19 and 20). In the substrate electrode forming step (b), the substrate electrode 3 is formed of a thin film of TiN in the gap (G) of the concave portion 4a. T
The iN thin film was formed to a thickness of 0.1 μm by a sputtering method using Ti as a target. A TiN thin film was formed to have a width of 20 μm as a substrate electrode 3 by photolithography and dry etching. Part of the substrate electrode 3 protrudes from the gap (G) of the concave portion 4a to the surface 4d of the substrate 4 for connection to the outside (see FIGS. 21 and 22).

In the sacrificial material layer forming step (c), the sacrificial layer material layer 5 and the protective film 7 formed by the plasma CVD method
The silicon oxide film was formed on the substrate 4 so as to cover the substrate electrode 3 until the gap (G) of the concave portion 4a was filled. The oxide film of the sacrificial layer material layer 5 and the protective film 7 was planarized by polishing or dry etching. As the sacrificial layer material layer 5, a silicon oxide film, a polycrystalline silicon film, an amorphous silicon film, or an organic material film is used. The silicon oxide film is a highly accurate manufacturing method in which the sacrificial layer material layer 5 is stable. A polycrystalline silicon film or an amorphous silicon film can be manufactured at low cost because a CVD method can be used. The organic material film is a low-cost manufacturing method in which the sacrificial layer material layer 5 can be easily formed (see FIGS. 23 and 24). In the doubly supported beam forming step (d), the flattened sacrificial layer material layer 5 and the protection film 7 are flattened.
On the silicon oxide film, a silicon nitride film as a material of the doubly supported beam 2 was formed with a thickness of 0.04 μm by thermal CVD. Next, an Al thin film of the light reflection film 1 serving as a reflection surface of the incident light was formed on the silicon nitride film to a thickness of 0.05 μm by a sputtering method. Photolithography,
Then, a silicon nitride film including the reflection film layer of the light reflection film 1 is formed in the shape of the doubly supported beam 2 by a dry etching technique. The dimensions of the doubly supported beam 2 are 20 μm in width and 27 μm in length
(See FIGS. 25 and 26). In the sacrificial material layer removing step (e), after the doubly supported beam 2 is formed, the oxide film of the sacrificial layer material layer 5 that has flattened the gap (G) of the concave portion 4a is removed by etching. The held portions 2a at both ends are held and fixed to the substrate 4 via the gap (G) of the concave portion 4a (see FIGS. 27 and 28). Finally, a pad opening 8 for external connection of the substrate electrode 3 is formed in the protective film 7, and the light modulation device 0 is completed (see FIGS. 29 and 30).

In FIGS. 31 to 42, the light modulator 0
Is a plurality of non-parallel opposing surfaces 3 opposing each other on a substrate 4 with two non-parallel inclined surfaces opposing the doubly supported beam 2 on the substrate 4 as follows.
After forming a gap (G) of the recess 4a formed between the a _3, to form a sacrificial material layer 5 made of a sacrificial material substrate 4
Is flattened to form the doubly supported beam 2, and then the sacrificial material layer 5 is removed, so that it is possible to provide a method of manufacturing the optical modulator 0 having a small number of manufacturing steps and a high yield.
In the recess forming step (a), the substrate 4 is a silicon substrate 4c. A plurality of non-parallel opposing surfaces 3 opposing the substrate 4 by two non-parallel inclined surfaces opposing the doubly supported beam 2 by photolithography and dry etching.
forming voids (G) of the recess 4a formed between the a _3. Shape of the gap of the recess 4a formed with a plurality non-parallel opposing surfaces 3a ₃ facing the inclined surface of the two surfaces of the non-parallel of doubly supported beam 2 and two surfaces facing (G) is, the area gradation A photomask on which a pattern is formed, a method of thermally deforming a resist material, or the like can be used. A plurality of non-parallel opposing surfaces 3a opposing the doubly supported beam 2 by two non-parallel inclined surfaces.
The gap (G) of the concave portion 4a formed between the first and second concave portions ₃ has a width 20
The central portion of the void (G) of the concave portion 4a formed between the doubly supported beam 2 and the plurality of non-parallel opposing surfaces 3a ₃ opposing each other on the two non-parallel two inclined surfaces is the maximum depth. And the depth was formed to 1.0 μm. A plurality of non-parallel opposing surfaces 3a ₃ opposing the doubly supported beam 2 by two non-parallel two inclined surfaces.
After the shape of the void (G) of the concave portion 4a formed between the silicon substrate 4c and the silicon substrate 4c is thermally oxidized, the oxide film 4 is formed on the surface.
b was formed to a thickness of 0.2 μm (see FIGS. 31 and 32). In the substrate electrode forming step (b), the gap (G) of the concave portion 4a
Multiple non-parallel opposing surfaces 3a ₃ facing the inclined surface of the two surfaces of the non-parallel two surfaces of the opposed surface 3a of the substrate electrode 3 is formed by a thin film of TiN in. The TiN thin film was formed to a thickness of 0.1 μm by a reactive sputtering method using Ti as a target. T
Photo a thin film of iN lithography, and the length as a multiple non-parallel opposing surfaces 3a ₃ facing the inclined surface of the two surfaces of the non-parallel two surfaces of the opposed surface 3a of the substrate electrode 3 with the technique of dry etching, the recesses 4a The dimension in the direction orthogonal to the width of the gap (G) was formed to be 20 μm. Some of the more non-parallel opposing surfaces 3a ₃ facing the inclined surface of the two surfaces of the non-parallel two surfaces of the opposing electrodes 3a of the substrate electrode 3 from the gap of the recess 4a to be connected to an external (G) of the substrate 4 It protrudes to the surface 4d. Further, a plasma nitride film as an electrode protection film is formed thereon to a thickness of 0.05 μm.
Was formed (see FIGS. 33 and 34).

In the sacrifice material layer forming step (c), the polycrystalline silicon film of the sacrifice layer material layer 5 formed by the plasma CVD method has two non-parallel inclinations of the two opposing surfaces 3 a of the substrate electrode 3. gap recess 4a on the substrate 4 to cover the non-parallel opposing surfaces 3a ₃ facing a plane (G) was deposited to fill. The oxide film of the sacrificial layer material layer 5 is formed by CMP (Chemical
The surface was flattened by a mechanical polishing method to obtain a sacrificial layer film for forming the doubly supported beam 2 (FIGS. 35 and 36).
See). In the doubly supported beam forming step (d), a silicon nitride film to be the material of the doubly supported beam 2 was formed to a thickness of 0.04 μm on the flattened sacrificial layer material layer 5 by a thermal CVD method. Next, a Cr thin film of the light reflection film 1 serving as a reflection surface of incident light was formed on the silicon nitride film with a thickness of 0.05 μm by a sputtering method. Photolithography,
In addition, the silicon nitride film including the reflective film layer is dry-etched into a divided holding portion 2a ₁ , a divided holding portion 2a ₂ , and a divided holding portion 2a ₃ in which the held portion 2a is divided into four portions. , dividing the held portion 2a ₄ is formed on both ends shape of the beam 2 held by the connecting part. The dimensions of the doubly supported beam 2 are width 20
μm and a length of 20 μm. The connecting portions of the divided held portion 2a ₁ , the split held portion 2a ₂ , the split held portion 2a ₃ , and the split held portion 2a ₄ divided into _four portions are formed at the corners 2g of the doubly supported beam 2 respectively. And its dimensions are 5 μm wide (see FIGS. 37 and 38). In the sacrificial material layer removing step (e), after the doubly supported beam 2 is formed, the sacrificial layer material layer 5 having flattened the gap (G) is removed by wet etching with tetramethylammonium hydroxide (TMAH). 2 is the held parts 2 at both ends
a is held and fixed to the substrate 4 via the gap (G) of the concave portion 4a (see FIGS. 39 and 40). Finally, a pad opening 8 for external connection of the substrate electrode 3 is formed in the protective film 7, and the light modulation device 0 is completed (see FIGS. 41 and 42).

In FIGS. 43 to 54, the light modulator 0
Is a non-parallel opposing surface 3 on the substrate 4 where the entire surface opposing the doubly supported beam 2 is non-parallel and faces the non-parallel inclined surface.
After forming a gap (G) of the recess 4a formed between the a _4, to form a sacrificial material layer 5 made of a sacrificial material substrate 4
Is flattened to form the doubly supported beam 2, and then the sacrificial material layer 5 is removed, so that it is possible to provide a method of manufacturing the optical modulator 0 having a small number of manufacturing steps and a high yield.
In the recess forming step (a), the substrate 4 is composed of a silicon substrate 4c having a surface 4d on which a plasma CVD oxide film 4b is formed with a thickness of 7 μm. Photolithography on the substrate 4 and
The void (G) of the concave portion 4a formed between the entire surface facing the doubly supported beam 2 and the entire non-parallel opposing surface 3a ₄ facing the non-parallel inclined surface is formed by a dry etching technique. Shape of the gap of the recess 4a of doubly supported beam 2 opposite to the entire surface is formed between the entire surface non-parallel opposing surfaces 3a ₄ opposed to each other in non-parallel plane (G), the maximum depth of the concave portion 4a gap ( G), and is formed so that the gap (G) depth of the concave portion 4a changes gradually from the other end to the maximum depth. Non-parallel non-parallel opposing surface 3a in which the entire surface opposing the doubly supported beam 2 is non-parallel and inclined with the entire inclined surface
Shape of the gap of the recess 4a formed between the ₄ (G) is,
A photomask on which an area gradation pattern is formed, a thermal deformation method of a resist material, or the like can be used. The gap (G) of the concave portion 4a formed between the non-parallel opposing surface 3a ₄ and the entire non-parallel inclined surface whose entire surface facing the doubly supported beam 2 is non-parallel is 100 μm wide and 5.0 μm deep.
m (see FIGS. 43 and 44).

In the substrate electrode forming step (b), the recess 4
The entire non-parallel opposing surface 3a _{4 in} which the entire surface of the opposing surface 3a of the substrate electrode 3 opposes the non-parallel inclined surface in the gap (G) of FIG.
Is formed with a thin film of TiN. The TiN thin film is 0.1 μm thick by a reactive sputtering method using Ti as a target.
Was formed. The opposing surface 3a of the substrate electrode 3 is applied to the TiN thin film by photolithography and dry etching.
Entire surface inclined surfaces at opposite entirely non-parallel opposing surface 3a ₄ as the length of the non-parallel entire surface to form a dimension perpendicular to the width of the gap of the recess 4a (G) to 20μm of. A part of the entire non-parallel opposing surface 3a ₄ in which the entire surface of the opposing surface 3a of the substrate electrode 3 is non-parallel inclined surface is connected to the outside. It is overhanging. Further, a plasma nitride film having a thickness of 0.05 μm was formed thereon as an electrode protection film (see FIGS. 45 and 46). In the sacrifice material layer forming step (c), the oxide film of the sacrifice layer material layer 5 formed by the plasma CVD method has an entire non-parallel surface in which the entire surface of the opposing surface 3a of the substrate electrode 3 is non-parallel. recess 4a on the substrate 4 so as to cover the opposing face 3a ₄
Was formed until the void (G) was filled. The oxide film of the sacrificial layer material layer 5 is formed by CMP (Chemical Mechanical Polishing).
This was flattened by a polishing method to form a sacrificial layer film for forming the doubly supported beam 2 (see FIGS. 47 and 48). In the doubly supported beam forming step (d), a plasma nitride film as a material of the doubly supported beam 2 having a thickness of 0.08 μm is formed on the flattened sacrificial layer material layer 5.
m to form a film. Next, a Cr thin film of the light reflection film 1 serving as a reflection surface of incident light was formed on the silicon nitride film with a thickness of 0.05 μm by a sputtering method. A silicon nitride film including a reflective film layer is formed in the shape of the doubly supported beam 2 by photolithography and dry etching.
The dimensions of the doubly supported beam 2 are 100 μm in width and 20 μm in length (see FIGS. 49 and 50). Sacrificial material layer removing step (e)
After the doubly supported beam 2 is formed, the sacrificial layer material layer 5 having flattened the gap (G) of the concave portion 4a is replaced with hydrofluoric acid (H
When wet etching is removed by F), the beam 2
Are held and fixed to the substrate 4 via the gap (G) of the concave portion 4a (see FIGS. 51 and 52). Finally, a pad opening 8 for external connection of the substrate electrode 3 is formed in the protective film 7 to complete the light modulation device 0 (FIG. 5).
3 and FIG. 554).

In FIGS. 55 and 66, the light modulator 0
Forms a folded structure 2e having a folded shape near the held portion 2a held by the substrate 4 of the doubly supported beam 2 and forms a sacrificial material layer 5 made of a sacrificial material as follows. Since the substrate 4 is flattened to form the doubly supported beam 2 and then the sacrificial material layer 5 is removed, it is possible to provide a method of manufacturing the optical modulator 0 having a small number of manufacturing steps and a high yield. In the recess forming step (a), the substrate 4 is a transparent quartz glass substrate made of a light-transmitting glass material. Substrate 4 clay photolithography, and a recess formed between the plurality non-parallel opposing surfaces 3a ₃ facing the inclined surface of the two surfaces of the non-parallel of doubly supported beam 2 opposite to the second surface by a method for dry etching A void (G) of 4a is formed. The width of the gap (G) of the concave portion 4a formed between the doubly supported beam 2 and the plurality of non-parallel opposing surfaces 3a ₃ facing each other with two non-parallel inclined surfaces is 20 μm. Non-parallel opposing surfaces 3a opposing by two non-parallel inclined surfaces opposing to each other
The center of the gap (G) of the concave portion 4a formed between the groove ₃ and the groove ₃ has the maximum depth, and the depth is 1.0 μm. A photomask on which an area gradation pattern is formed, a thermal deformation method of a resist material, or the like can be used (see FIGS. 55 and 56). In the substrate electrode forming step (b), the substrate electrode 3 is inserted into the gap (G) of the concave portion 4a.
Multiple non-parallel opposing surfaces 3a ₃ facing the inclined surface of the two surfaces of the non-parallel two surfaces of the opposing surfaces 3a formed with a thin film of Pt. Pt
Was formed to a thickness of 0.1 μm by sputtering using Pt as a target. The Pt thin film is formed as a plurality of non-parallel opposing surfaces 3a ₃ facing each other by two non-parallel inclined surfaces of the opposing surfaces 3a of the substrate electrode 3 by photolithography and sputter etching techniques, and has a gap of the recess 4a. The dimension in the direction orthogonal to the width of (G) was formed to be 20 μm. Some of the more non-parallel opposing surfaces 3a ₃ facing the inclined surface of the two surfaces of the non-parallel two surfaces of the opposing electrodes 3a of the substrate electrode 3 from the gap of the recess 4a to be connected to an external (G) of the substrate 4 It protrudes to the surface 4d. Further, a 0.05 μm thick plasma nitride film was formed thereon as an electrode protection film (see FIGS. 56 and 57).

In the sacrifice material layer forming step (c), the amorphous silicon or polycrystalline silicon of the sacrifice layer material layer 5 formed by the plasma CVD method has two non-parallel surfaces of the two opposing surfaces 3a of the substrate electrode 3. 2.0 μm thick on the substrate 4 so as to cover the plurality of non-parallel opposing surfaces 3a ₃ opposing each other with the inclined surface of
m, and the double-sided beam 2 is formed by photolithography and dry etching in the same manner as when the gap (G) of the concave portion 4a opposed by the two non-parallel two inclined surfaces is formed. A sacrificial layer having a folded structure portion 2e in a folded shape near the portion to be held 2a held by the substrate 4 was formed (see FIGS. 59 and 60). In the doubly supported beam forming step (d), the flattened sacrificial layer material layer 5
A polycrystalline silicon film serving as a material of the doubly supported beam 2 was formed on the entire surface to a thickness of 0.2 μm by a thermal CVD method. Next, an Al thin film of the light reflection film 1 serving as a reflection surface of the incident light was formed to a thickness of 0.05 μm on the polycrystalline silicon film by a sputtering method. A folding structure portion 2e is formed by folding a silicon nitride film including a reflective film layer by photolithography and dry etching near the holding portion 2a held on the substrate 4 of the doubly supported beam 2 in a folded shape. It is formed in the shape of a doubly supported beam 2. Double support beam 2
Has a width of 100 μm and a length of 20 μm (see FIGS. 61 and 62). In the sacrificial material layer removing step (e),
After the doubly supported beam 2 is formed, the sacrificial layer material layer 5 which flattened the gap (G) of the concave portion 4a is removed by etching. ) Is held and fixed (see FIGS. 63 and 64). Finally, a pad opening 8 for external connection of the substrate electrode 3 is formed in the protective film 7 to complete the light modulation device 0 (FIG. 6).
54 and FIG. 66).

In FIG. 67 to FIG. 78, the light modulator 0
The concave portion 4a formed between the non-parallel non-parallel opposing surface 3a ₄ and the non-parallel non-parallel opposing surface 3a _{4 in} which the entire surface facing the doubly supported beam 2 is non-parallel is formed on the substrate 4 as follows. Is formed, a sacrificial material layer 5 made of a sacrificial material is formed, the substrate 4 is flattened, the doubly supported beam 2 is formed, and the sacrificial material layer 5 is removed. It has become possible to provide a method of manufacturing the optical modulator 0 of the array. In the recess forming step (a), the substrate 4 is a transparent optical glass substrate made of a light-transmitting glass material. A gap of a recess 4a formed between the substrate ₄ and the non-parallel non-parallel opposing surface 3a ₄ where the entire surface opposing the doubly supported beam 2 is non-parallel and inclined by the photolithography and dry etching techniques. (G) is formed. A gap (G) of a concave portion 4a formed between the entire surface facing the doubly supported beam 2 and the non-parallel facing surface 3a ₄ facing the non-parallel entire inclined surface.
Is such that the maximum depth is at the end of the gap (G) of the concave portion 4a, and the gap (G) depth of the concave portion 4a gradually changes from the other end toward the maximum depth portion. Is formed. The shape of the void (G) of the concave portion 4a formed between the entire surface facing the doubly supported beam 2 and the entire non-parallel facing surface 3a ₄ facing the entire non-parallel inclined surface has a pattern of area gradation. A formed photomask, a method of thermally deforming a resist material, or the like can be used. Double support beam 2
And opposing the entire surface of the recess 4a formed between the entire surface non-parallel opposing surfaces 3a ₄ facing the inclined surface of the non-parallel entire gap (G) was formed to a width 100 [mu] m, depth 5.0 .mu.m ( 67 and 68). In the substrate electrode forming step (b), the entire non-parallel opposing surface 3a _{4 in} which the entire surface of the opposing surface 3a of the substrate electrode 3 opposes the non-parallel inclined surface in the gap (G) of the concave portion 4a with an Al thin film. Form. Al thin film is A
0.1μm thickness by sputtering method targeting l
Was formed. Photolithography of Al thin film, and
In an array on the technique of the dry etching, the facing surface 3a of the entire length as the entire surface non-parallel opposing surfaces 3a ₄ facing the inclined surface of the non-parallel surface of the substrate electrode 3, the recess 4a gap (G)
The dimension in the direction perpendicular to the width of the substrate was 20 μm. A part of the entire non-parallel opposing surface 3a ₄ in which the entire surface of the opposing surface 3a of the substrate electrode 3 is non-parallel inclined surface is connected to the outside. It is overhanging. Further, a 0.05 μm plasma nitride film was formed thereon as an electrode protection film (see FIGS. 69 and 70).

In the sacrifice material layer forming step (c), the resist layer of the sacrifice layer material layer 5 is made of a non-parallel opposing surface 3a ₄ where the entire opposing surface 3a of the substrate electrode 3 opposes a non-parallel inclined surface. (G) of the concave portion 4a on the substrate 4 so as to cover
Was formed until it was buried, and flattened by a thermal annealing technique. After the planarization, the resist layer of the sacrificial layer material layer 5 was removed by dry etching except for the portion of the concave portion 4a that filled the void (G) (see FIGS. 71 and 72). In the doubly supported beam forming step (d), a silicon nitride film as a material of the doubly supported beam 2 was formed on the flattened sacrificial layer material layer 5 to a thickness of 0.1 μm by plasma CVD. Next, the light reflecting film 1 serving as a reflecting surface of the incident light beam (R)
Was formed by sputtering on a silicon nitride film with a thickness of 0.05 μm. A silicon nitride film including a reflective film layer is formed in a shape of an array-like doubly supported beam 2 held by a connection portion in which a held portion 2a is divided into two portions by photolithography and dry etching. . The dimensions of the doubly supported beam 2 are 100 μm in width and 20 μm in length. Each of the connecting portions into which the held portion 2a is divided is located at a corner 2g of the held portion 2a, and has a width of 5 μm (see FIGS. 73 and 74). In the sacrificial material layer removing step (e), after the doubly supported beam 2 is formed, the sacrificial layer material layer 5 having flattened the gap (G) of the concave portion 4a is removed by etching. Holder 2a
Is held and fixed to the substrate 4 via the gap (G) of the concave portion 4a (see FIGS. 75 and 76). Finally, a pad opening 8 for external connection of the substrate electrode 3 is formed in the protective film 7, and the light modulator 0 is completed.

Referring to FIG. 79, an image forming apparatus 300 for forming an image by performing optical writing in an electrophotographic process
Is a light modulation device that rotates on a drum-shaped photoconductor of an image carrier 301 that is rotatably held and carries a formed image, and a drum-shaped photoconductor of the image carrier 301 that is uniformly charged by the charging unit 305. Optical information processing apparatus 2 comprising independent driving means 201 for independently driving a plurality of light modulation devices 0
The latent image forming means 302 comprising a latent image forming means 302 performs optical writing to form a latent image.
The latent image formed by the developing unit 303 is visualized by a developing unit 303 to form a toner image, and the toner image formed by the developing unit 303 is transferred to a transfer target (P) by a transfer unit 304.
Fixing means 30 for fixing the toner image transferred to the transfer target (P)
6, the transfer target (P) is transferred to the discharge tray 307.
The paper is discharged and stored. On the other hand, the transfer means 3
The image carrier 301 after being transferred to the transfer target (P) in 04
The drum-shaped photoreceptor is cleaned by the cleaning unit 308 to prepare for the next step of image formation. The optical information processing apparatus 200 irradiates an incident light beam (R) from a light source 202 to a light modulation device 10 in which a plurality of light modulation devices 0 are arranged in a one-dimensional array in an array via a first lens system 203. And a plurality of light modulators 0
Each of the light modulators 0 of the light modulators 10 arranged in the one-dimensional array is independently driven by the independent driving means 201 between the beam electrode 2f of each doubly supported beam 2 and the substrate electrode 3 according to image information. A drive voltage is applied to control the doubly supported beam 2, and the incident light beam (R) is transmitted through the light reflecting film 1 to the second lens system 2.
An image is formed on the surface of the image bearing member 301 on the drum-shaped photosensitive member through the line 04. An optical modulator 10 in which a plurality of optical modulators 0 are arranged in a one-dimensional array,
The substrate 4 uses a silicon wafer as a substrate, and
To 78. The doubly supported beam 2 is disposed at a distance of 100 μm, a length of 15 μm, and a pitch of 20 μm between the held portions 2 a at both ends, and has a thickness of 0.08 formed of a nitride film.
The thickness is 0.01 μm on the surface as a light reflecting layer of the light reflecting film 1.
A μm Al thin film is formed. The gap (G) of the concave portion 4a in the substrate 4 is such that the maximum depth of the entire non-parallel inclined surface is located at the end of the gap (G), and the other end gradually slopes in the maximum depth direction. It is formed so that the depth changes. The maximum depth was formed at 5.00 μm. The driving voltage at this time was 37V. Drive circuit 2 for doubly supported beam 2
d and the IC of the electronic circuit 6 a of the drive circuit 6 are mounted on the substrate 4. Therefore, the structure for performing light modulation by changing the direction of reflection of the incident light beam (R) is simple and quick in response, and the wavelength of the incident light beam (R) to be used is not limited, and the operation is stable, high in reliability and low. It is possible to provide the optical information processing apparatus 200 and the image forming apparatus 300 each including the light modulation device 10 in which a plurality of small light modulation devices 0 having small power consumption because of the voltage are arranged in a one-dimensional array. .

In FIG. 80, an image projection display device 400 for projecting and displaying an image includes a light modulation device 0 for projecting an image by performing light modulation while changing the reflection direction of an incident light beam (R) of projection image data. An optical information processing apparatus 2 comprising independent driving means 201 for independently driving a plurality of optical modulation apparatuses 0
The light modulation device 0 of the light switch means 401 is configured to project and display an image on the projection screen 402. Optical modulator 1 in which a plurality of optical modulators 0 are arranged in a two-dimensional array in an array of optical information processing device 200
Each doubly supported beam 2 of 00 is 20 μm wide and 20 μm long. The interval between the adjacent doubly supported beams 2 is 1.0 μm.
The substrate 4 is made of a single-crystal silicon wafer, and the wiring for the substrate electrode 3 penetrates through the oxide film in which the gap (G) of the concave portion 4a is formed corresponding to each cantilever 2 to form a silicon wafer. A driving circuit 2d for driving the formed doubly supported beam 2
Connected to the transistor. The opposing surface 3a of the substrate electrode 3 is formed in the recess 4a of the substrate 4 facing the doubly supported beam 2.
The depth of the gap (G) of the non-parallel concave portion 4a formed between the two non-parallel opposing surfaces 3a ₃ formed by the two non-parallel two inclined surfaces is 1 μm, Is formed so that the central portion of the substrate has the maximum depth. Optical switch means 401
In the optical information processing apparatus 200, the incident light flux (R) from the light source 202 is irradiated in an array onto the light modulation apparatus 100 in which a plurality of light modulation apparatuses 0 are arranged in a two-dimensional array. Are reflected by the mirrors of the light reflecting film 1 of each doubly supported beam 2, and the projection lens 20
5, and the image is projected on the projection screen 402 through the stop 206. In order to perform color display, a rotating color hole 207 can be provided in front of the light source 202, or a microlens array 208 can be used to improve performance. Therefore, the structure for performing light modulation by changing the reflection direction of the incident light beam (R) is simple and quick in response, the wavelength of the incident light to be used is not restricted, and the operation is stable, the reliability is high, and the voltage is low. It is possible to provide the optical information processing apparatus 200 and the image projection display apparatus 400 each including the small light modulation device 0 with low power.

[0055]

According to the present invention, the light reflecting film for regularly reflecting incident light is formed on one surface by a thin film. Both ends are fixed and deformed by electrostatic force. The drive voltage is applied to the substrate electrode that applies a drive voltage to the doubly supported beam through the gap formed on the other surface of the doubly supported beam. The substrate is formed in a concave portion with a substrate electrode formed of an opposing surface facing the doubly supported beam that modulates the incident light of the light reflecting film by restricting the abutment so that the held portion of the doubly supported beam is held. As a result, an optical modulator is provided that has a simple structure that performs light modulation by changing the reflection direction of incident light, has a quick response, does not limit the wavelength of the incident light to be used, and has stable operation and high reliability. I can do it. According to the second aspect of the present invention, a doubly supported beam formed of a thin film formed by combining a light reflecting film formed of a metal thin film for regularly reflecting incident light on one surface and having both ends fixed and deformed by electrostatic force A driving voltage is applied to the doubly supported beam through a gap formed on the other surface of the substrate. The substrate electrode is formed in the concave part, which consists of the opposing surface facing the doubly supported beam that modulates the light, so that the held portion of the doubly supported beam is held, so that the light reflection film can be used as an electrode. A simpler and faster response structure that modulates the light by changing the direction of reflection of the incident light flux provides an optical modulator with stable operation and high reliability without limiting the wavelength of the incident light used. Now you can do it. According to the third aspect of the present invention, a two-sided support made of a thin film formed by combining a light reflection film for regularly reflecting incident light on one surface and having both ends fixed and deformed by electrostatic force. A drive voltage is applied to the doubly supported beam through a gap formed on the other surface of the beam. Since the substrate is formed in a concave portion and has a substrate electrode consisting of an opposing surface facing the doubly supported beam that modulates light, and holds the held portion of the doubly supported beam, the doubly supported beam can also be used as an electrode. It is possible to provide an optical modulator that is simpler, has a faster response, changes the direction of reflection of the incident light, and has a faster response, does not limit the wavelength of the incident light to be used, and has stable operation and high reliability. It can now be provided.

According to the fourth aspect of the present invention, silicon is formed of a thin film composed of a light reflecting film for regularly reflecting incident light on one surface and is fixed at both ends and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through the gap formed on the other surface of the doubly supported beam, and applying a drive voltage to the substrate electrode to restrict deformation of the doubly supported beam by contact The substrate is formed in a concave portion with a substrate electrode comprising an opposing surface facing the doubly supported beam that modulates the incident light of the light reflecting film so as to hold the held portion of the doubly supported beam. The beam can be used as an electrode, and the structure that modulates light by changing the direction of reflection of incident light is simpler and quicker to respond. The wavelength of incident light to be used is not limited, and operation is stable and reliable. It is possible to provide an optical modulator with high reliability It became a jar. According to the fifth aspect of the present invention, both the light reflection films for reflecting the incident light are formed on the one surface and formed of a thin film composed of a single crystal silicon thin film fixed at both ends and deformed by electrostatic force. Applying a driving voltage to the substrate electrode through the air gap formed on the other surface of the cantilever, and applying a drive voltage to the substrate electrode. Since the substrate electrode is formed in the concave portion and has a surface facing the doubly supported beam that modulates the incident light to hold the held portion of the doubly supported beam, defects of the doubly supported beam are reduced. Light modulator that has a long life, has a simple structure that modulates light by changing the direction of reflection of the incident light beam, has a quick response, does not limit the wavelength of the incident light used, operates more stably, and has high reliability. Can now be provided. According to the sixth aspect of the present invention, both the light reflection films for regularly reflecting incident light are formed on the one surface and formed of a thin film, and both ends are formed of a polycrystalline silicon thin film which is fixed and deformed by electrostatic force. Applying a driving voltage to the substrate electrode through the air gap formed on the other surface of the cantilever, and applying a drive voltage to the substrate electrode. Since the substrate is formed in a concave portion and has a substrate electrode composed of an opposing surface facing the doubly supported beam that modulates the incident light and holds the held portion of the doubly supported beam, CVD is used for forming the doubly supported beam. The cost can be reduced because the method can be used, and the structure that modulates the light by changing the direction of reflection of the incident light beam is simple, the response is fast, and the operation of the incident light is not restricted and the operation is more stable. To provide a highly reliable optical modulator It began to come.

According to the seventh aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on one surface by a thin film composed of a combination thereof, and both ends are formed by a silicon nitride thin film which is fixed and deformed by electrostatic force. Applying a driving voltage to the doubly supported beam via a gap formed on the other surface of the doubly supported beam, and restricting the deformation of the doubly supported beam caused by the application of the driving voltage to the substrate electrode by abutting light reflection. The substrate is formed in a concave part with a facing surface facing the doubly supported beam that modulates the incident light of the film, so that the held portion of the doubly supported beam is held. The speed of response can be increased, the structure that modulates the light by changing the direction of reflection of the incident light beam is simple, the response is even faster, and the operation is more stable without limiting the wavelength of the incident light used. Highly reliable optical modulator Now it is possible to provide. According to the invention of claim 8, the light reflecting film for regularly reflecting the incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming the light reflecting film on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. Since the substrate is formed in the concave portion with the substrate electrode having the opposing surface facing the beam, and the two ends of the opposite end of the held portion of the doubly held beam are held and fixed, both ends of the doubly held beam are The generation of free vibration is restrained and deformation is suppressed, and there is little change over time and the response speed is fast.The structure that modulates the light by changing the reflection direction of the incident light is simple and the response is even faster. Stable operation and high reliability without wavelength limitation It has become possible to provide an optical modulation device. According to the ninth aspect of the present invention, the light reflecting film for regularly reflecting incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming on one surface, the both ends of which are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode comprising an opposing surface opposing the beam to hold the held portion of the doubly supported beam and to one of two opposite ends of the doubly supported beam held by the substrate. Since the distance to the other side is fixed to be equal to or longer than the length of one of the two sides or the other side, it is possible to drive at a lower driving voltage. It has a simple and quick response structure that modulates light by changing the direction of reflection of incident light. Without the wavelength of the incident light is limited, operation is now able to provide even higher light modulator stable and reliable.

According to the tenth aspect of the present invention, the other surface of the double-supported beam which is formed of a thin film in which a light reflecting film for regularly reflecting incident light is formed on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through the gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutting to modulate the light modulation of the incident light on the light reflection film. The substrate is formed in a concave portion with a substrate electrode having an opposing surface facing the doubly supported beam to hold the held portion of the doubly supported beam, and the substrate is made up of a plurality of light reflecting films, the doubly supported beam and the substrate electrode in a one-dimensional array. Because of the arrangement in the shape, it is possible to perform line-shaped light modulation, the structure that performs light modulation by changing the direction of reflection of incident light is simple and quick, and the wavelength of incident light used is limited. Operation is stable and reliable. It has become possible to provide a device. According to the eleventh aspect of the present invention, the light reflecting film for regularly reflecting the incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming the light reflecting film on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate forms a substrate electrode consisting of an opposing surface facing the beam in a concave portion to hold the held portion of the doubly supported beam, and the substrate arranges a plurality of light reflection films, a doubly supported beam, and a substrate electrode in a two-dimensional array shape. In this way, it is possible to perform planar light modulation, and the structure for performing light modulation by changing the reflection direction of incident light is simple and quick, and the wavelength of incident light to be used is limited. To provide an optical modulator with stable operation and high reliability It has become possible. According to the twelfth aspect of the present invention, the light reflecting film for regularly reflecting the incident light is formed on the other surface of the doubly-supported beam which is formed of a thin film formed by combining the light reflecting film on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. Since the substrate is formed in a concave portion and has a substrate electrode consisting of a parallel opposing surface facing the beam and holding the held portion of the doubly supported beam, the direction of reflected light of incident light is disturbed, so it becomes dark. It is possible to provide an optical modulator that has a simple structure that performs light modulation to be in an OFF state, has a quick response, does not limit the wavelength of incident light to be used, has stable operation, and has high reliability. .

According to the thirteenth aspect, the other surface of the doubly supported beam which is formed of a thin film in which a light reflecting film for regularly reflecting incident light is formed on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through the gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutting to modulate the light modulation of the incident light on the light reflection film. Since the substrate is formed in a recessed portion and has a substrate electrode composed of a partially non-parallel opposing surface that partially faces the non-parallel surface to the doubly supported beam, the held portion of the doubly supported beam is held low. Driving with a drive voltage becomes possible, the structure that modulates light by changing part of the incident light reflection direction is simple and quick, and the operation is stable without limiting the wavelength of the incident light used. An optical modulator with high reliability can be provided. According to the fourteenth aspect of the present invention, the light reflecting film for regularly reflecting the incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming on one surface, the both ends of which are fixed and deformed by electrostatic force. A drive voltage is applied opposite the doubly supported beam through a gap, and the deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. Since the substrate is formed in a concave portion and has a plurality of non-parallel opposing surfaces opposing the beam with a plurality of non-parallel surfaces to hold the held portion of the doubly supported beam, a lower driving voltage can be obtained. Driving becomes possible, the structure that modulates the light by changing the reflection direction of the incident light in multiple directions is simple and the response is fast,
It is possible to provide an optical modulator that is stable in operation and high in reliability without limiting the wavelength of incident light to be used. According to the fifteenth aspect of the present invention, the light reflecting film for regularly reflecting the incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming the light reflecting film on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. Since the substrate is formed in a concave portion and has a substrate electrode composed of a non-parallel opposing surface which is entirely non-parallel to the beam and holds the held portion of the doubly supported beam, a lower driving voltage can be obtained. It is possible to drive, the structure that performs the light modulation surely by changing the incident light to one direction of reflection is simple and quick, and the wavelength of the incident light to be used is not limited,
An optical modulator with stable operation and high reliability can be provided.

According to the sixteenth aspect of the present invention, the other surface of the doubly-supported beam which is formed of a thin film formed by combining a light reflecting film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through the gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutting to modulate the light modulation of the incident light on the light reflection film. The substrate electrode made of a light-transmitting glass material is formed in a concave portion so as to hold the held portion of the doubly supported beam, so that the doubly supported beam is held from the back side of the substrate. It is advantageous for product inspection because it has a simple structure that performs light modulation by changing the direction of reflection of incident light, has a fast response, and has stable operation without limiting the wavelength of incident light used. And a highly reliable optical modulator can be provided. It became way. According to the seventeenth aspect of the present invention, the light reflecting film for regularly reflecting the incident light is formed on the one surface and formed on the other surface of the doubly supported beam which is fixed at both ends and is deformed by electrostatic force. A drive voltage is applied opposite the doubly supported beam through a gap, and the deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. Since the substrate electrode made of a single crystal silicon material is formed in a concave portion so as to hold the held portion of the doubly supported beam, the substrate electrode formed of the opposing surface facing the beam is formed so that the impurity diffusion diffusion into the single crystal silicon of the substrate is performed. It is possible to form the electrode by the method, the structure that modulates the light by changing the reflection direction of the incident light is simple and the response is fast, the operation is stable and reliable without limiting the wavelength of the incident light used To provide an optical modulator with high Became so that. According to the eighteenth aspect of the present invention, the light reflecting film for regularly reflecting the incident light is formed on the one surface, and is formed on the other surface of the doubly-supported beam which is fixed at both ends and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate electrode composed of a single-crystal silicon material, which is made of a single-crystal silicon material, is formed in a concave portion so as to hold the held portion of the double-supported beam. An electrode can be formed by a method of impurity diffusion in the inside, and it becomes possible to form part or all of an electronic circuit of a drive circuit on a substrate by a diffusion method,
It is possible to provide a light modulation device that has a simpler structure, performs faster light response by changing the reflection direction of incident light, has a faster response, does not limit the wavelength of the incident light to be used, and has stable operation and high reliability. I can do it.

According to the nineteenth aspect of the present invention, the other surface of the doubly supported beam which is formed of a thin film composed of a light reflecting film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through a gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutment to modulate the light modulation of the incident light on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode composed of an opposing surface facing the doubly supported beam, and is formed on a concave portion of the substrate opposed to the doubly supported beam held by the substrate while holding the held portion of the doubly supported beam. The gap formed between the substrate electrode and the substrate electrode is made of a non-parallel inclined surface, so that it can be driven at a lower driving voltage and a structure that modulates light by changing the direction of reflection of incident light. Simple and fast response, limiting the wavelength of incident light used And without actuation it has become possible to provide an even higher light modulator stable and reliable. According to the twentieth aspect, the light reflecting film for regularly reflecting incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming the light reflecting film on one surface and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied opposite the doubly supported beam through a gap, and the deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode comprising an opposing surface opposing the beam to hold a held portion of the doubly supported beam, and a gap formed between the doubly supported beam and the opposing substrate electrode is held by the substrate. The two sides of the opposite end of the doubly supported beam are formed with non-parallel inclined surfaces, so that driving at a lower driving voltage can be ensured, and light reflection is changed by changing the direction of reflection of incident light. Simple structure, fast response and limited wavelength of incident light used Without Rukoto, actuation has become possible to provide an even higher light modulator stable and reliable.

According to the twenty-first aspect of the present invention, the other surface of the doubly-supported beam which is formed of a thin film in which a light reflecting film for regularly reflecting incident light is formed on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through a gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutment to modulate the light modulation of the incident light on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode comprising an opposing surface facing the doubly supported beam, and is formed on a concave portion of the substrate opposed to the doubly supported beam held by the substrate and holding the held portion of the doubly supported beam. The gap formed between the substrate electrode and the substrate electrode is a non-parallel inclined surface, is largest at the center of the doubly supported beam held on the substrate, and extends from two opposite sides of the doubly supported beam to the doubly supported beam. The shape gradually increased toward the center In addition, it is possible to drive at a lower driving voltage, the structure for performing light modulation by changing the reflection direction of the incident light is simple and quick, and the operation is stable without limiting the wavelength of the incident light to be used. An optical modulator with high reliability can be provided. According to the invention of claim 22, the light reflecting film for regularly reflecting the incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming on one surface, the both ends of which are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. A substrate electrode formed of a concave surface facing the beam is formed in the concave portion to hold the held portion of the doubly supported beam, and a substrate electrode formed on the concave portion of the substrate opposed to the doubly held beam held by the substrate. Is formed at the center of the doubly supported beam held by the substrate, and is formed between the two opposite sides of the doubly supported beam and the other two sides. Since the shape gradually increases toward the center of the beam, Further, it can be driven at a lower drive voltage, has a simple structure that modulates the light by changing the direction of reflection of the incident light, has a quick response, and has a stable and reliable operation without limiting the wavelength of the incident light used. It has become possible to provide a light modulation device having high performance.

According to the twenty-third aspect of the present invention, the other surface of the double-supported beam which is formed of a thin film formed by combining a light reflecting film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through a gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutment to modulate the light modulation of the incident light on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode comprising an opposing surface facing the doubly supported beam, and is formed on a concave portion of the substrate opposed to the doubly supported beam held by the substrate and holding the held portion of the doubly supported beam. The gap formed between the substrate electrode and the substrate electrode is formed of a non-parallel inclined surface, and is largest near one of two opposite sides of the doubly supported beam held by the substrate and held by the substrate. From the other side of the two opposite ends of the doubly supported beam to one side Therefore, it is possible to drive at a lower driving voltage, the structure for performing light modulation by changing the reflection direction of incident light is simple, quick response, and It has become possible to provide an optical modulator that is stable in operation and has high reliability without limiting the wavelength of light. According to the invention of claim 24, the light reflecting film for regularly reflecting the incident light is formed on the one surface and formed on the other surface of the doubly supported beam which is fixed at both ends and deformed by electrostatic force. A drive voltage is applied opposite the doubly supported beam through a gap, and the deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. Since the substrate is formed in a concave portion with a substrate electrode composed of an opposing surface facing the beam and holds the divided held portion divided into a plurality of held portions of the doubly supported beam, driving at a lower driving voltage is further performed. A simple and quick response structure that modulates the light by changing the reflection direction of the incident light makes it possible to provide a stable and highly reliable light modulation device that does not limit the wavelength of the incident light used. Can now be provided.

According to the twenty-fifth aspect of the present invention, the other surface of the double-supported beam which is formed of a thin film constituted by combining a light reflecting film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through a gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutment to modulate the light modulation of the incident light on the light reflecting film. The substrate electrode composed of the opposing surface facing the doubly supported beam is formed in the concave portion of the substrate, and the divided held portion divided into a plurality of the held portions of the doubly supported beam is arranged and held at the corner portion of the doubly supported beam. Drive, it is possible to drive at a lower drive voltage, the structure for performing light modulation by changing the reflection direction of the incident light is simple and quick, and the wavelength of the incident light to be used is not limited. To provide an optical modulator that operates more stably and has high reliability. It came to be. Claim 26
According to the invention, the gap formed on the other surface of the doubly-supported beam that is formed of a thin film composed of a light reflection film that regularly reflects incident light on one surface and is fixed at both ends and deformed by electrostatic force. A drive voltage is applied in opposition to the doubly supported beam. The deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is regulated by abutment to oppose the doubly supported beam for performing light modulation of incident light of the light reflection film. The substrate electrode formed of the opposing surface is formed in a concave portion of the substrate, and the divided held portion, which is divided into a plurality of held portions of the doubly supported beam, is held with a smooth outer shape portion, so that a lower driving voltage can be obtained. Driving is possible, the structure that modulates the light by changing the reflection direction of the incident light is simple and the response is fast, the operation is stable without any limitation on the wavelength of the incident light to be used, and the concentration of stress is prevented and the reliability is further improved. To provide an optical modulator with high reliability. . According to the invention of claim 27, the light reflecting film for regularly reflecting incident light is formed on the other surface of the doubly-supported beam which is formed by combining and forming on one surface, the both ends of which are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. Since the substrate is formed in the concave portion with the substrate electrode composed of the opposing surface facing the beam, and the retained portion composed of the folded structure of the doubly supported beam is held,
Further, it can be driven at a lower drive voltage, has a simple structure that modulates the light by changing the direction of reflection of the incident light, has a quick response, and has a stable and reliable operation without limiting the wavelength of the incident light used. It has become possible to provide a light modulation device having high performance.

According to the twenty-eighth aspect of the present invention, the other surface of the doubly-supported beam which is formed of a thin film formed by combining a light reflecting film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through the gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutting to modulate the light modulation of the incident light on the light reflection film. The substrate is formed in a concave portion with a substrate electrode composed of a partially non-parallel opposing surface partially facing the non-parallel surface to the doubly supported beam, and holds the held portion of the doubly supported beam at least with the doubly supported beam. The held portion held on the substrate of the doubly supported beam in the vicinity where the gap formed by the non-parallel inclined surface formed with the opposing substrate electrode has the maximum interval is made of a divided held portion divided into a plurality. As a result, driving at a lower driving voltage becomes possible, It is possible to provide an optical modulator that has a simple structure that performs light modulation by changing a part of the reflection direction, has a quick response, does not limit the wavelength of incident light to be used, has stable operation, and has high reliability. It became so. According to the invention of claim 29, the light reflecting film for regularly reflecting incident light is formed on the other surface and formed on the other surface of the doubly supported beam which is fixed at both ends and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode composed of a partially non-parallel opposing surface partially facing the beam on a non-parallel surface to hold the held portion of the doubly supported beam and at least the substrate facing the doubly supported beam Since the held portion held on the substrate of the doubly supported beam in the vicinity where the gap formed by the non-parallel inclined surface formed between the electrode and the gap becomes the maximum interval is constituted by the folding structure portion, the driving voltage is further reduced. Drive, and change part of the incident light reflection direction. Faster response is simple structure for performing optical modulation Te without wavelength of the incident light to be used is limited, operation is now able to provide even higher light modulator stable and reliable. According to the invention of claim 30, a doubly supported beam formed of a thin film formed by combining a light reflecting film for regularly reflecting incident light on one surface and having both ends fixed and having a tensile stress deformable by electrostatic force A driving voltage is applied to the doubly supported beam through a gap formed on the other surface of the substrate. Since the substrate is formed in a concave portion and has a substrate electrode consisting of an opposing surface facing the doubly supported beam that performs light modulation, and holds the held portion of the doubly supported beam, a higher driving frequency can be obtained. To provide a light modulation device that has a simple structure and a fast response that changes the direction of reflection of incident light to perform light modulation, has no limitation on the wavelength of the incident light to be used, operates more stably, and has high reliability. Is now available.

According to the thirty-first aspect of the present invention, the other surface of the double-supported beam which is formed of a thin film formed by combining a light reflecting film for regularly reflecting incident light on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through a gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutment to modulate the light modulation of the incident light on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode having an opposing surface facing the doubly supported beam to hold the held portion of the doubly supported beam, and the doubly supported beam has a thickness of a plurality of members combined with the doubly supported beam ( (t) and stress (σ) with the tensile stress being a positive sign and the compressive stress being a negative sign are (t ₁ , σ ₁ ), (t ₂ , σ ₂ ),... (t _n , σ _n ), t ₁ · σ ₁ + t ₂ · σ ₂ + ... + t _n · σ _n / t ₁ +
Since t ₂ +... + t _n ≧ 0, the driving frequency can be increased, the structure for performing light modulation by changing the reflection direction of the incident light is simple, the response is fast, and the incident light is used. It has become possible to provide an optical modulation device that operates more stably and has high reliability without limiting the wavelength of light. According to the invention of claim 32, the light reflecting film for regularly reflecting incident light is formed on the other surface of the doubly supported beam which is formed by combining and forming on one surface, both ends of which are fixed and deformed by electrostatic force. A drive voltage is applied opposite the doubly supported beam through a gap, and the deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode having an opposing surface facing the beam to hold the held portion of the doubly supported beam, and the doubly supported beam has a tensile stress (σ), a thickness (t), a Young's modulus of a forming material. (E), (t / l) ² ≧ σ / E between a distance (l) between one of two opposite sides of the doubly supported beam held by the substrate and the other side. , It is possible to drive at a lower driving voltage,
It is possible to provide an optical modulator that has a simple structure that performs light modulation by changing the reflection direction of incident light, has a quick response, does not limit the wavelength of the incident light used, has stable operation, and has high reliability. It became so.

According to the thirty-third aspect of the present invention, the other surface of the doubly supported beam which is formed of a thin film in which a light reflecting film for regularly reflecting incident light is formed on one surface and whose both ends are fixed and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through the gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutting to modulate the light modulation of the incident light on the light reflection film. The substrate electrode formed of the opposing surface facing the doubly supported beam is formed in the concave portion so that the held portion of the doubly supported beam is held, and at the same time, all or a part of the driving circuit for driving is formed on the substrate. As a result, a simple and quick response structure that modulates the light by changing the direction of reflection of the incident light provides a stable, highly reliable, and compact optical modulator that does not limit the wavelength of the incident light used. Can now be provided. According to the thirty-fourth aspect of the present invention, the light reflecting film for regularly reflecting incident light is formed on the other surface of a doubly-supported beam which is formed by combining and forming on one surface, the both ends of which are fixed and deformed by electrostatic force. A drive voltage is applied to the doubly-supported beam through the air gap, and the deformation of the doubly-supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate has a substrate electrode formed of a concave surface facing the beam in a concave portion to hold the held portion of the doubly supported beam, and the doubly supported beam is applied to the surface of the substrate by electrostatic force generated by applying a driving voltage between the substrate electrodes. Since it is deformed along the gap of the gap formed on the other surface of the doubly supported beam in contact with it, the structure that modulates the light by changing the reflection direction of the incident light is simple, quick response, and used. Operation is stable and reliable without limiting the wavelength of incident light It has become possible to provide an even higher light modulator. According to the thirty-fifth aspect of the present invention, a light reflecting film for regularly reflecting incident light is formed on the other surface of a doubly-supported beam that is formed by combining and forming on one surface, and whose both ends are fixed and deformed by electrostatic force. A drive voltage is applied opposite the doubly supported beam through a gap, and the deformation of the doubly supported beam due to the application of the drive voltage of the substrate electrode is abutted to modulate the light incident on the light reflecting film. The substrate is formed in a concave portion with a substrate electrode consisting of an opposing surface facing the beam, holds the held portion of the doubly supported beam, and the doubly supported beam is deformed by electrostatic force caused by application of a drive voltage between the substrate electrodes A voltage between the substrate electrodes of opposite polarity is applied so that high-frequency driving is possible, a structure that modulates light by changing the direction of reflection of incident light is simple, has a fast response, and is used. Operates without limiting the wavelength of incident light It has become possible to further provide even higher light modulator stable and reliable.

According to the thirty-sixth aspect, the other surface of the doubly-supported beam, which is formed of a thin film composed of a light reflecting film for regularly reflecting incident light on one surface and is fixed at both ends and deformed by electrostatic force. Applying a drive voltage to the doubly supported beam through a gap formed in the substrate, and applying a drive voltage to the substrate electrode to restrict the deformation of the doubly supported beam by abutment to modulate the light modulation of the incident light on the light reflecting film. The substrate electrode is formed in a concave portion having a facing surface facing the doubly supported beam to hold the held portion of the doubly supported beam, and the doubly supported beam is driven between the substrate electrodes based on the potential of the doubly supported beam. Since the voltage is deformed by applying a positive voltage and a negative voltage alternately, high-frequency driving is possible, the structure that modulates the light by changing the reflection direction of the incident light is simple, the response is fast, and the incident light used The operation is more stable and the signal is not restricted without limiting the wavelength of light. Sex also become possible to provide a high light modulator. According to the invention of Claim 37, after forming a gap on the substrate, a sacrificial material layer made of a sacrificial material is formed, the substrate is flattened, a doubly supported beam is formed, and the sacrificial material layer is removed. As we have to manufacture,
It has become possible to provide a method of manufacturing an optical modulator having a small number of manufacturing steps and a high yield. According to the invention of claim 38, a concave part forming step of forming a concave part on the substrate by a thin film forming method or a fine processing method on the substrate and a substrate electrode forming step of forming all or a part of the substrate electrode in the concave part on the substrate Material layer forming step of forming a sacrificial material layer made of a sacrificial material in a recess on a substrate, a doubly supported beam forming step of forming a doubly supported beam on the sacrificial material layer, and a sacrificial material layer removing the sacrificial material layer of the recess Forming an air gap on the substrate, forming a sacrificial material layer made of a sacrificial material, flattening the substrate, forming a doubly supported beam, and removing the sacrificial material layer to manufacture an optical modulator. Therefore, it is possible to provide a method of manufacturing an optical modulator having a small number of manufacturing steps and a high yield. According to the thirty-ninth aspect of the present invention, a sacrificial material layer made of a sacrificial material, which is a silicon oxide film, is formed after forming an air gap on the substrate, the substrate is flattened, and the sacrificial material layer is removed after forming a cantilever beam. As a result, the method of manufacturing a light modulator can be provided in which the sacrificial material layer is stable, the number of manufacturing steps is small, and the yield and accuracy are high.

According to the forty-ninth aspect, after forming a gap on the substrate, a sacrificial material layer made of a polycrystalline silicon film or an amorphous silicon film made of a sacrificial material is formed, and the substrate is flattened to form a doubly supported beam. An optical modulator is manufactured by removing a sacrificial material layer after formation, so that a method of CVD can be used. Therefore, it is possible to provide a method of manufacturing an optical modulator at a low cost with a small number of manufacturing steps and a high yield. Is now available. According to the invention of claim 41, after forming a gap on the substrate, a sacrificial material layer made of a sacrificial material as an organic material film is formed, and the substrate is flattened. As a result, the method of manufacturing a light modulation device can be provided, in which a sacrificial layer material layer can be easily formed at low cost, the number of manufacturing steps is small, and the yield is high. Claim 42
According to the invention, a plurality of the above claims 1, 2, 3, 4,
5, 6, 7, 8, 9, 10, 11, 12, 13, 14,
15, 16, 17, 18, 19, 20, 21, 22, 2,
3, 24, 25, 26, 27, 28, 29, 30, 3
The optical modulator according to any one of 1, 32, 33, 34, 35, and 36 is independently driven by independent driving means to process optical information, so that the reflection direction of the incident light beam is changed. Optical information with a small light modulator that has a simple structure that performs light modulation, has a fast response, does not limit the wavelength of the incident light beam used, operates stably, has a high reliability and has a low voltage, and consumes little power. Processing equipment can now be provided. According to the invention of Claim 43, the latent image is formed by performing light writing on the image carrier which is rotatably held and carries the formed image.
3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 1
3, 14, 15, 16, 17, 18, 19, 20, 2
1, 22, 23, 24, 25, 26, 27, 28, 2
The latent image formed by the light modulator of the latent image forming means comprising the light modulator described in any one of 9, 30, 31, 32, 33, 34, 35 and 36 is visualized to form a toner image. The image is formed by transferring the toner image formed by the developing unit to the transfer target by the transfer unit. Therefore, the structure for performing light modulation by changing the reflection direction of the incident light is simple, has a fast response, and is used. It is possible to provide an image forming apparatus provided with a small light modulator that consumes little power because of stable operation, high reliability, and low voltage without limiting the wavelength of the incident light beam.

According to the forty-fourth aspect, the image projection data
Light modulation by changing the direction of reflection of incident light
Claims 1, 2, 3, 4, 5, 6, 7, 8, 9,
10, 11, 12, 13, 14, 15, 16, 17, 1
8, 19, 20, 21, 22, 23, 24, 25, 2,
6, 27, 28, 29, 30, 31, 32, 33, 3
The optical modulator according to any one of 4, 35 and 36.
The image projected by the light modulation device of the
Because the display is clean, the direction of reflection of incident light
It has a simple structure that performs light modulation by changing
The operation is stable and the signal is
Compact optical modulation with low power consumption due to high reliability and low voltage
Can provide an image projection display device comprising the device.
It became so.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an optical modulation device according to an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is an explanatory diagram illustrating a state of a main part of the optical modulation device according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram illustrating another state of a main part of the optical modulation device according to the embodiment of the present invention.

FIG. 5 is an explanatory diagram illustrating a state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 6 is an explanatory diagram illustrating another state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 7 is an explanatory diagram illustrating an optical modulation device according to another embodiment of the present invention.

FIG. 8 is a plan view of FIG. 7;

FIG. 9 is an explanatory diagram illustrating a state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 10 is an explanatory diagram illustrating another state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 11 is an explanatory diagram illustrating a state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 12 is an explanatory diagram illustrating another state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 13 is an explanatory diagram illustrating a state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 14 is a plan view of FIG.

FIG. 15 is an explanatory diagram illustrating a state of a main part of an optical modulation device according to another embodiment of the present invention.

FIG. 16 is a plan view of FIG.

FIG. 17 is an explanatory diagram illustrating an optical modulation device according to another embodiment of the present invention.

FIG. 18 is an explanatory diagram illustrating an optical modulation device according to another embodiment of the present invention.

FIG. 19 is an explanatory diagram illustrating main steps of a method of manufacturing the optical modulation device according to the embodiment of the present invention.

FIG. 20 is a plan view of FIG. 19;

FIG. 21 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to the embodiment of the present invention.

FIG. 22 is a plan view of FIG. 21.

FIG. 23 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to the embodiment of the present invention.

FIG. 24 is a plan view of FIG. 23;

FIG. 25 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to the embodiment of the present invention.

FIG. 26 is a plan view of FIG. 25.

FIG. 27 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to the embodiment of the present invention.

FIG. 28 is a plan view of FIG. 27.

FIG. 29 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to the embodiment of the present invention.

FIG. 30 is a plan view of FIG. 29;

FIG. 31 is an explanatory diagram illustrating main steps of a method of manufacturing an optical modulation device according to another embodiment of the present invention.

FIG. 32 is a plan view of FIG. 29.

FIG. 33 is an explanatory view illustrating a step of another main part of the method of manufacturing the light modulation device according to another embodiment of the present invention.

FIG. 34 is a plan view of FIG. 29.

FIG. 35 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 36 is a plan view of FIG. 35;

FIG. 37 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 38 is a plan view of FIG. 37.

FIG. 39 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 40 is a plan view of FIG. 39.

FIG. 41 is an explanatory diagram illustrating a process of another main part of a method of manufacturing an optical modulation device according to another embodiment of the present invention.

FIG. 42 is a plan view of FIG. 41.

FIG. 43 is an explanatory diagram illustrating main steps of a method of manufacturing an optical modulation device according to another embodiment of the present invention.

FIG. 44 is a plan view of FIG. 43.

FIG. 45 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 46 is a plan view of FIG. 45.

FIG. 47 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the light modulation device according to another embodiment of the present invention.

FIG. 48 is a plan view of FIG. 47.

FIG. 49 is an explanatory diagram illustrating a step of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 50 is a plan view of FIG. 49;

FIG. 51 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 52 is a plan view of FIG. 51.

FIG. 53 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 54 is a plan view of FIG. 53.

FIG. 55 is an explanatory diagram illustrating main steps of a method of manufacturing an optical modulation device according to another embodiment of the present invention.

FIG. 56 is a plan view of FIG. 55.

FIG. 57 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the light modulation device according to another embodiment of the present invention.

FIG. 58 is a plan view of FIG. 29;

FIG. 59 is an explanatory diagram for explaining a process of another main part of a method for manufacturing an optical modulation device according to another embodiment of the present invention.

FIG. 60 is a plan view of FIG. 59.

FIG. 61 is an explanatory diagram illustrating a process of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 62 is a plan view of FIG. 61.

FIG. 63 is an explanatory view illustrating a step of another main part of the method of manufacturing the light modulation device according to another embodiment of the present invention.

FIG. 64 is a plan view of FIG. 63.

FIG. 65 is an explanatory diagram for explaining a process of another main part of the method for manufacturing the optical modulation device according to another embodiment of the present invention;

FIG. 66 is a plan view of FIG. 65.

FIG. 67 is an explanatory diagram illustrating main steps of a method of manufacturing an optical modulator according to another embodiment of the present invention;

FIG. 68 is a plan view of FIG. 67.

FIG. 69 is an explanatory diagram for explaining a process of another main part of the method for manufacturing the optical modulation device according to another embodiment of the present invention;

70 is a plan view of FIG. 69. FIG.

FIG. 71 is an explanatory view illustrating a step of another main part of the method of manufacturing the light modulation device according to another embodiment of the present invention.

FIG. 72 is a plan view of FIG. 71.

FIG. 73 is an explanatory diagram for explaining a step of another main part of the method for manufacturing the optical modulation device according to another embodiment of the present invention;

FIG. 74 is a plan view of FIG. 73.

FIG. 75 is an explanatory diagram for explaining another main part of a method for manufacturing an optical modulation device according to another embodiment of the present invention;

FIG. 76 is a plan view of FIG. 75.

FIG. 77 is an explanatory diagram illustrating steps of another main part of the method of manufacturing the optical modulation device according to another embodiment of the present invention.

FIG. 78 is a plan view of FIG. 77;

FIG. 79 is an explanatory diagram illustrating an optical information processing apparatus including a light modulation device and an image forming apparatus including the light modulation device according to an embodiment of the present invention.

FIG. 80 is an explanatory diagram illustrating an optical information processing device including a light modulation device and an image projection display device including the light modulation device according to an embodiment of the present invention.

[Explanation of symbols]

0 light modulation device 1 light reflection film 2 doubly supported beam, 2a held portion, 2a _{1 to n} divided held portion, 2b 2 side, 2b ₁ one side, 2b _{2 the} other side, 2c other 2 sides, 2c _{1 The} other side, 2c ₂
Other side, 2d drive circuit, 2e folding structure, 2f beam electrode, 2g corner, 2h smooth outer shape 3 substrate electrode, 3a opposing surface, 3a ₁ parallel opposing surface, 3
a ₂ part non-parallel opposing surfaces, 3a ₃ multiple non-parallel opposing surfaces, 3
a ₄ overall non-parallel opposing surface 4 substrate, 4a recess, 4b
Oxide film, 4c silicon substrate, 4d surface 5 sacrificial material layer 6 drive circuit, 6a electronic circuit 7 protective film 8 pad opening 10 light modulation device 100 light modulation device 200 light information processing device 201 independent driving means 202 light source 203 first Lens system 204 Second lens system 205 Projection lens 206 Aperture 207 Rotating color hole 208 Micro lens array 300 Image forming device 301 Image carrier 302 Latent image forming unit 303 Developing unit 304 Transfer unit 305 Charging unit 306 Fixing unit 307 Output tray 308 Cleaning means 400 Image projection display device 401 Optical switch means 402 Projection screen (a) Depressed part forming step (b) Substrate electrode forming step (c) Sacrificial material layer forming step (d) Doubly supported beam forming step (e) Sacrificial material layer Removal process

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04N 5/74 H04N 1/04 104Z // B41J 2/445 B41J 3/21 V (72) Inventor Masaki Horiya Ricoh Co., Ltd. 1-3-6 Nakamagome, Ota-ku, Tokyo (72) Inventor Eiichi Ota 1-3-6 Nakamagome, Ota-ku, Tokyo F-term in Ricoh Co., Ltd. 2C162 AE21 AE28 FA09 FA45 FA50 2H041 AA16 AB38 AC06 AZ02 AZ08 5C051 AA02 CA06 DA01 DB02 DB08 DB22 DB24 DB28 DC04 DC05 DC07 DE26 5C058 AA18 EA11 EA27 5C072 AA03 BA02 BA03 DA02 DA04 DA21 DA23 HA01 HA14 HB15

Claims (44)

[Claims] 1. A light modulation device for modulating light by changing the reflection direction of incident light, comprising: a light reflection film for regularly reflecting incident light;
A doubly-supported beam that is formed of a thin film combining and configuring the light reflecting film on one surface and is fixed at both ends and deformed by electrostatic force,
A substrate electrode opposed to the doubly supported beam via a gap formed on the other surface of the doubly supported beam, and a deformation of the doubly supported beam caused by application of a drive voltage to the substrate electrode is restricted by contact. A facing surface where the substrate electrode faces the doubly supported beam that performs light modulation of incident light of the light reflecting film, and the substrate electrode formed of the facing surface is formed in a concave portion to form a held portion of the doubly supported beam. An optical modulation device comprising: a substrate to be held. 2. The optical modulation device according to claim 1, wherein
The light modulator, wherein the light reflection film is formed of a metal thin film. 3. The optical modulation device according to claim 1, wherein
The light modulating device, wherein the doubly supported beam is formed of a low resistance material. 4. The optical modulation device according to claim 3, wherein
The light modulator according to claim 1, wherein the low-resistance material of the doubly supported beam is formed by reducing the resistance of silicon with an impurity. 5. The light modulation device according to claim 1, wherein the doubly supported beam is formed of a single-crystal silicon thin film. 6. The light modulation device according to claim 1, wherein the doubly supported beam is formed of a polycrystalline silicon thin film. 7. The light modulation device according to claim 1, wherein the doubly supported beam is formed of a silicon nitride thin film. 8. The light modulation device according to claim 1, wherein the held portion of the doubly supported beam has two opposite ends fixed to the substrate. An optical modulation device, comprising: 9. The light modulation device according to claim 1, wherein one of two opposite ends of the doubly supported beam held on a substrate. The distance between the side and the other side is fixed to be equal to or longer than the length of the one side or the other side of the two sides. 10. The method of claim 1, 2, 3, 4, 5, 6, 7,
10. The light modulation device according to 8 or 9, wherein the substrate has a plurality of light reflection films, a doubly supported beam, and a substrate electrode arranged in a one-dimensional array. 11. The method of claim 1, 2, 3, 4, 5, 6, 7,
10. The light modulation device according to 8 or 9, wherein the substrate has a plurality of light reflection films, a doubly supported beam, and a substrate electrode arranged in a two-dimensional array. 12. The method of claim 1, 2, 3, 4, 5, 6, 7,
12. The light modulation device according to 8, 9, 10 or 11, wherein the opposing surface of the substrate electrode comprises a parallel opposing surface opposing a surface parallel to the doubly supported beam. 13. The method of claim 1, 2, 3, 4, 5, 6, 7,
8. The optical modulator according to 8, 9, 10 or 11, wherein the opposing surface of the substrate electrode includes a partially non-parallel opposing surface that partially opposes the doubly supported beam with a non-parallel surface. A light modulation device characterized by the following. 14. The method of claim 1, 2, 3, 4, 5, 6, 7,
12. The optical modulator according to 8, 9, 10 or 11, wherein the opposing surface of the substrate electrode comprises a plurality of non-parallel opposing surfaces opposing the doubly supported beam with a plurality of non-parallel surfaces. Light modulation device. 15. The method of claim 1, 2, 3, 4, 5, 6, 7,
12. The optical modulator according to 8, 9, 10 or 11, wherein the opposing surface of the substrate electrode comprises a non-parallel non-parallel surface that is entirely non-parallel to the doubly supported beam. Light modulator. 16. The method of claim 1, 2, 3, 4, 5, 6, 7,
The light modulation device according to 8, 9, 10, 11, 12, 13, 14, or 15, wherein the substrate is made of a light-transmitting glass material. 17. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, or 16
3. The light modulation device according to claim 1, wherein the substrate is made of a single crystal silicon material. 18. The light modulation device according to claim 17, wherein a part or all of a drive circuit is formed in the single-crystal silicon material of the substrate. 19. The method of claim 1, 2, 3, 4, 5, 6, 7,
In the optical modulator according to any one of 8, 9, 10, 11, 13, 14, 15, 16, 17, and 18, a substrate electrode is formed on a concave portion of the substrate facing the doubly held beam held by the substrate. The light modulator is characterized in that the gap formed between the light modulation device and the non-parallel surface is formed of a non-parallel inclined surface. 20. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 13, 14, 15, 16, 17,
20. The light modulation device according to claim 18 or 19, wherein a gap formed between the doubly supported beam and the opposing substrate electrode is non-existent between two opposing ends of the doubly supported beam held by the substrate. An optical modulator comprising a parallel inclined surface. 21. The light modulation device according to claim 19, wherein a gap formed by a non-parallel inclined surface formed between the doubly supported beam and a facing substrate electrode is held by the substrate. The largest at the center of the doubly supported beam,
An optical modulation device having a shape that increases sequentially from the two sides at opposite ends of the doubly supported beam toward the center of the doubly supported beam. 22. The light modulation device according to claim 19, wherein a gap formed by a non-parallel inclined surface formed between the doubly supported beam and the opposing substrate electrode is held by the substrate. The largest at the center of the doubly supported beam,
An optical modulator having a weight shape that increases sequentially from two opposite sides of the doubly supported beam and the other two sides toward the center of the doubly supported beam. 23. The light modulation device according to claim 19, wherein a gap formed by a non-parallel inclined surface formed between the doubly supported beam and a facing substrate electrode is held by the substrate. One of the two sides of the opposite ends of the doubly supported beam is largest near one of the two sides, and the one of the two sides of the opposite both ends of the doubly supported beam held on the substrate is the one of the two sides. An optical modulation device characterized by increasing sequentially toward a side. 24. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
In the optical modulator according to any one of 17, 18, 19, 20, 21, 22, and 23, the held portion held by the doubly supported substrate is constituted by a plurality of divided held portions. Light modulation device. 25. The light modulation device according to claim 24, wherein the divided held portion is disposed at a corner of the doubly supported beam. 26. The light modulation device according to claim 24, wherein the divided held portion has a smooth outer portion having a smooth outer shape at a connection portion with the doubly supported beam. apparatus. 27. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
27. The light modulation device according to 5 or 26, wherein the held portion held by the doubly supported substrate is formed of a folding structure. 28. The method of claim 13, 14, 15, 16, 1
7, 18, 19, 20, 21, 22, 23, 24, 2
28. The light modulation device according to 5, 26, or 27, wherein at least a gap formed by a non-parallel inclined surface formed between the doubly supported beam and the opposing substrate electrode has a maximum interval. The light modulation device, wherein the held portion held by the substrate is composed of a plurality of divided held portions. 29. The method of claim 13, 14, 15, 16, 1
7, 18, 19, 20, 21, 22, 23, 24, 2
The optical modulator according to 5, 26, 27 or 28,
The held portion held by the substrate of the doubly supported beam in the vicinity where the gap formed by the non-parallel inclined surface formed between at least the doubly supported beam and the opposing substrate electrode is the maximum interval, is from the folding structure portion. An optical modulation device, comprising: 30. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
30. The light modulation device according to 5, 26, 27, 28 or 29, wherein the doubly supported beam is made of a member having a tensile stress. 31. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
In the optical modulator according to any one of 5, 26, 27, 28, 29, and 30, the doubly supported beam has a positive sign indicating the thickness (t) of a plurality of members combined with the doubly supported beam and a tensile stress. Combinations of stresses (σ) with the compressive stress being a negative sign are (t ₁ , σ ₁ ), (t ₂ , σ ₂ ),.
(T _n , σ _n ), t ₁ · σ ₁ + t ₂ · σ ₂ + ... +
An optical modulation device, wherein t _n σ _n / t ₁ + t ₂ +... + t _n ≧ 0. 32. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
In the optical modulator according to 5, 26, 27, 28, 29, 30, or 31, the doubly supported beam has a tensile stress (σ), a thickness (t), a Young's modulus (E) of a forming material, (T / l) ² between the distance (l) between one of the two opposing ends of the doubly supported beam and the other.
An optical modulator characterized by a relationship of ≧ σ / E. 33. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
33. The light modulation device according to any one of 5, 26, 27, 28, 29, 30, 31 and 32, wherein all or a part of a driving circuit to be driven is formed on the substrate. . 34. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
5. In the optical modulator according to 5, 26, 27, 28, 29, 30, 31, 32, or 33, the doubly supported beam is formed by an electrostatic force generated by applying a drive voltage between the substrate electrodes.
A light modulation device, wherein the light modulation device is deformed along an interval shape of a gap formed on the other surface of the doubly supported beam in contact with a surface of the substrate. 35. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
5, 26, 27, 28, 29, 30, 31, 32, 33
Or the optical modulator according to 34, wherein the doubly supported beam is deformed by an electrostatic force generated by applying a drive voltage between the substrate electrodes, and then applies a voltage between the substrate electrodes having opposite polarities to such an extent that the beam is not deformed. An optical modulation device, comprising: 36. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, 16,
17, 18, 19, 20, 21, 22, 23, 24, 2
5, 26, 27, 28, 29, 30, 31, 32, 3,
33. The light modulator according to 3, 34, or 35, wherein the doubly supported beam alternately applies a positive voltage and a negative voltage to a drive voltage between the substrate electrodes based on a potential of the doubly supported beam. An optical modulator characterized by being deformed. 37. The method according to claim 1, wherein light modulation is performed by changing a reflection direction of the incident light beam.
10, 11, 12, 13, 14, 15, 16, 17, 1
8, 19, 20, 21, 22, 23, 24, 25, 2,
6, 27, 28, 29, 30, 31, 32, 33, 3
In the method for manufacturing a light modulator according to any one of 4, 35, and 36, after forming a gap on the substrate, a sacrificial material layer made of a sacrificial material is formed, and the substrate is planarized.
A method for manufacturing a light modulation device, comprising: after forming a doubly supported beam, removing the sacrificial material layer to manufacture a light modulation device. 38. The method for manufacturing a light modulation device according to claim 37, wherein a concave portion is formed on the substrate by a thin film forming method or a fine processing method on the substrate, and a substrate electrode is provided on the concave portion on the substrate. Forming a sacrificial material layer made of a sacrificial material in the concave portion on the substrate, and forming a doubly supported beam on the sacrificial material layer. A method for manufacturing a light modulation device, comprising: a step of forming a cantilever; and a step of removing a sacrificial material layer in the concave portion. 39. The method of manufacturing a light modulation device according to claim 37, wherein the sacrificial material layer is a silicon oxide film. 40. The method of manufacturing a light modulation device according to claim 37, wherein the sacrificial material layer is a polycrystalline silicon film or an amorphous silicon film. 41. The method of manufacturing a light modulator according to claim 37, wherein the sacrificial material layer is an organic material film. 42. An optical information processing apparatus for processing optical information by using an optical modulator that modulates light by changing the reflection direction of an incident light beam, wherein a plurality of said optical information processing apparatuses are provided.
5, 6, 7, 8, 9, 10, 11, 12, 13, 14,
15, 16, 17, 18, 19, 20, 21, 22, 2,
3, 24, 25, 26, 27, 28, 29, 30, 3
An optical information processing apparatus comprising: the optical modulation device according to any one of 1, 32, 33, 34, 35, and 36; and independent driving means for independently driving a plurality of the light modulation devices. 43. An image forming apparatus for forming an image by performing light writing in an electrophotographic process, comprising: an image carrier that is rotatably held and carries a formed image; and an image carrier that performs light writing on the image carrier. The above-mentioned claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10,
11, 12, 13, 14, 15, 16, 17, 18, 1
9, 20, 21, 22, 23, 24, 25, 26, 2,
7, 28, 29, 30, 31, 32, 33, 34, 35
Or a latent image forming means comprising the light modulation device according to any one of the above, and a developing means for visualizing a latent image formed by the light modulation device of the latent image forming means to form a toner image; An image forming apparatus comprising: a transfer unit that transfers a toner image formed by a developing unit to a transfer target. 44. An image projection display device for projecting and displaying an image, wherein the image is projected by changing the direction of reflection of incident light of the image projection data and performing light modulation.
2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12,
13, 14, 15, 16, 17, 18, 19, 20, 2
1, 22, 23, 24, 25, 26, 27, 28, 2
An optical switch means comprising the optical modulation device according to any one of 9, 30, 31, 32, 33, 34, 35, or 36;
A projection screen for displaying an image projected by the light modulation device of the light switch means.