JP2002198284A - Stage device and projection aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce disturbance due to a power supply member even if a stage body is moved. SOLUTION: The stage device has the stage body XG that is connected to the power supply member TB 1 for supplying power for moving. Also, the stage device has a power supply stage 63, a detection device 67, and a drive control device. The power supply stage 63 retains the power supply member TB1, and synchronously moves with the stage body XG. The detection device 67 detects the relative position relationship between the stage body XG and the power supply stage 63. The drive control device controls the drive of the stage body XG and the power supply stage 63 based on a result obtained by comparing a result detected by the detection device 67 with a specific threshold.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage apparatus in which a stage body is moved by supplying various utilities, and an exposure apparatus for exposing a mask pattern on a substrate using a mask and a substrate held by the stage apparatus. Regarding, especially when manufacturing devices such as liquid crystal display elements and semiconductor elements,
The present invention relates to a stage apparatus and an exposure apparatus suitable for use in a lithography process.

[0002]

2. Description of the Related Art Conventionally, in a lithography process which is one of the manufacturing processes of a semiconductor device, a circuit pattern formed on a mask or a reticle (hereinafter referred to as a reticle) is coated with a resist (photosensitive agent) on a wafer. Alternatively, various exposure apparatuses for transferring the image onto a substrate such as a glass plate have been used. For example, as an exposure apparatus for a semiconductor device, a reticle pattern is projected onto a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of a pattern accompanying the high integration of an integrated circuit in recent years. A reduction projection exposure apparatus that performs reduction transfer is mainly used.

As this reduction projection exposure apparatus, a step-and-repeat type static exposure reduction projection exposure apparatus (so-called stepper) for sequentially transferring a reticle pattern to a plurality of shot areas (exposure areas) on a wafer.
And an improved version of this stepper.
No. 043, etc., a reticle and a wafer are synchronously moved in a one-dimensional direction to transfer a reticle pattern to each shot area on the wafer. Scanning steppers) are known.

In such a stepper or a scanning stepper, a table (stage body) holding a wafer by suction means such as negative pressure suction, which can be moved in the optical axis direction and leveled for focus position adjustment, is placed on the stage. In a state where these tables and stages are levitated by air bearings that are non-contact bearings,
It is moved on the surface plate by a drive device such as a linear motor. A movable mirror for reflecting the detection light is provided on the table, and the detection light is emitted from a position detecting device such as a laser interferometer disposed opposite to the movable mirror, based on the reflected light from the movable mirror. The position of the wafer is detected with high accuracy by measuring the distance from the stage. Similarly, in the case of a reticle, a movable mirror is provided on a reticle stage (stage main body) that holds the reticle by suction, a detection light is emitted from a position detection device, and the distance between the reticle and the reticle stage is measured. Is detected with high accuracy.

[0005] To the stage main body such as the table and the reticle stage are connected pipes and wires as utility supply members to which various utilities are supplied. Specifically, piping for supplying air for air bearing as a utility, piping for supplying a negative pressure for suction means as a utility, piping for supplying a temperature adjusting medium such as Fluorinert as a utility, and even a leveling sensor. Wiring for supplying power as a utility, system wiring for supplying various control signals as a utility, and the like are connected to the stage body.

[0006] Incidentally, these utility supply members may apply a pulling force with the movement of the stage main body or generate a micro-vibration by a reaction force thereof, which may cause an error in the synchronization accuracy of the stage main body. Conventionally, the synchronization error caused by the micro-vibration has been neglected, but in recent years, as the exposure accuracy has advanced with the miniaturization of patterns, it has been necessary to take measures against this error. To solve this problem, a stage device shown in FIG. 8 is provided.

In the stage device 91 shown in this figure, movers 93, 93 move in the X direction along stators 92, 92 extending in the X direction, and are suspended between the movers 93, 93 and extend in the Y direction. Stator 95 provided on guide bar 94 of length
The stage main body 96 as a mover moves in the Y direction along the axis, and a piping tray 97 is disposed on the X side of the stage main body 96. The piping tray 97 is connected to the movers 93, 93 (or the guide bar 94), and is configured to move integrally with the stage main body 96 in the X direction. The air supplied from the utility supply member 98 is supplied to an air bearing provided on the stage body 96 so as to face the guide bar 94. The above-mentioned various supply members 98 connected to the stage main body 96 and a supply member 99 connected to one of the movable elements 93 are accommodated and supported in the piping tray 97. Then, in this stage device, the utility tray 98 moves along the X direction of the stage main body 96, thereby reducing the pulling force and vibration applied to the stage main body 96 by the utility supply member 98.

Similarly, a stage device described in Japanese Patent Application Laid-Open No. 8-63231 is provided as a stage device for reducing the pulling force and vibration applied to the stage main body 96 by the utility supply member 98. In this stage device, a mover provided on the stage body and a mover provided on a carrier / follower to which a cable as a utility supply member is connected simultaneously provide magnetic flux from the same magnetic track as a stator. In this way, the carrier /
The follower moves following and the cable removes the tensile force applied to the stage body.

[0009]

However, the conventional stage apparatus and exposure apparatus as described above have the following problems. Regarding the movement of the stage body 96 in the Y direction, as shown in FIG.
And the piping tray 97 relatively move, so that various disturbances are transmitted to the stage body 96 via the utility supply member 98. During the disturbance, for example, when the stage body 96 moves in the −Y direction, the contact of the utility supply member 98 with the piping tray 97 or the rubbing and hitting of the utility supply members 98 with each other is performed. Further, there are micro vibrations generated due to fluctuations in the internal pressure of the fluid in the utility supply member 98, transmission of floor vibrations, and the like, and this micro vibration may be transmitted to the stage body 96.

Among the disturbances, a static one is a drag caused by the deformation of the utility supply member 98, and this drag may be transmitted to the stage body 96. In particular, in recent years, the demand for a chemical clean for the power supply member 98 has been increased, and from the viewpoint of preventing internal fluid from permeating and preventing seepage, the power supply member 98 has a large thickness or a hardened material having a double structure. Has been adopted. Therefore, the drag of the utility supply member 98 tends to be further increased, and there is a concern that the influence on the stage body 96 will be increased. In such an exposure apparatus that exposes a mask pattern onto a substrate such as a wafer by using a stage apparatus, if disturbance interferes with movement control of the stage body, the pattern is exposed on the substrate with high precision. The problem of not being able to do so will occur.

Therefore, as a method of avoiding the above-mentioned problem, for example, it is conceivable to move the stage body 96 and the piping tray 97 synchronously. In this case, however, the positional relationship between the stage body 96 and the piping tray 97 is considered. If the synchronization is lost, one or both of the power supply members 98 may be damaged. The stage body 96
When the length of the utility supply member 98 is set while allowing the synchronization deviation between the power supply member 98 and the piping tray 97, the length becomes large, and the natural vibration and the inertia force of the utility supply member 98 itself are reduced by the stage body
A problem arises that it becomes a disturbance to.

The present invention has been made in view of the above points, and it is possible to reduce disturbance (vibration) caused by a utility supply member even when the stage body moves, and to damage the stage body and the like. It is an object of the present invention to provide a stage device that can prevent the occurrence of a pattern, and an exposure device that can expose a pattern of a mask onto a substrate with high accuracy by using the stage device.

[0013]

In order to achieve the above object, the present invention employs the following structure corresponding to FIGS. 1 to 6 showing an embodiment. The stage device according to the present invention is a stage device (7) including a stage main body (XG) that is connected to and moves with a power supply member (TB1) for supplying a power. A power supply stage (63) that moves synchronously with the (XG), and a detection device (6) that detects a relative positional relationship between the stage body (XG) and the power supply stage (63).
7) and a drive control device that controls the drive of the stage body (XG) and the utility supply stage (63) based on a comparison result between the detection result of the detection device (67) and a predetermined threshold value. It is assumed that.

Therefore, in the stage apparatus of the present invention, the utility supply stage (63) moves synchronously with the stage body (XG), and the relative positional relationship between them is maintained, so that the utility supply member (TB1) is deformed. Can suppress the occurrence of micro-vibration and drag due to the vibration, and can prevent transmission to the stage body (XG) as a disturbance. However, the relative positional relationship exceeds, for example, a threshold value for allowing a minimum synchronization deviation. The stage body (XG) and the utility supply stage (6
By stopping the driving of 3), these can be prevented from being damaged. Also, the stage body (X
Since the relative positional relationship between G) and the power supply stage (63) can be suppressed within the range up to the threshold value, it is not necessary to make the length of the power supply member (TB1) longer than necessary, and the power supply member (TB1) The natural vibration or inertia force of itself can suppress disturbance to the stage body.

The exposure apparatus of the present invention is directed to an exposure apparatus (1) for exposing a pattern of a mask (R) held on a mask stage (2) to a substrate (W) held on a substrate stage (5). The stage device (7) according to any one of claims 1 to 6 is used as at least one of the mask stage (2) and the substrate stage (5).

Therefore, in the exposure apparatus of the present invention, it is possible to suppress the disturbance accompanying the movement of the utility supply stage (63) from being transmitted to the mask (R) and the substrate (W). Therefore, position control between the mask (R) and the substrate (W) can be performed with high precision, and the pattern of the mask (R) can be formed on the substrate (W) by exposure with high precision. In addition, it is possible to prevent production efficiency from being reduced due to damage to the utility supply stage (63) and the stage body (XG).

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a stage apparatus and an exposure apparatus according to the present invention will be described below with reference to FIGS. Here, an example in which a scanning stepper that transfers a circuit pattern of a semiconductor device formed on a reticle onto a wafer while synchronously moving a reticle and a wafer is used as an exposure apparatus will be described. In this exposure apparatus, the stage device of the present invention is applied to a wafer stage. In addition,
In these figures, the same components as those in FIGS. 8 and 9 shown as conventional examples are denoted by the same reference numerals, and description thereof will be omitted.

An exposure apparatus 1 shown in FIG. 1 has a light source (not shown).
An illumination optical system IU that illuminates a rectangular (or arc) illumination area on a reticle (mask) R with uniform illumination by exposure illumination light from a reticle (mask) R, and a reticle stage (mask stage) that holds and moves the reticle R 2) and a stage apparatus 4 including a reticle surface plate 3 supporting the reticle stage 2; a projection optical system PL for projecting illumination light emitted from the reticle R onto a wafer (substrate, photosensitive substrate) W;
A stage device 7 including a wafer stage (substrate stage) 5 that holds and moves a wafer W as a sample and a wafer surface plate 6 that holds the wafer stage 5, and a reaction that supports the stage device 4 and the projection optical system PL And a frame 8. Here, the optical axis direction of the projection optical system PL is defined as the Z direction, the direction of the synchronous movement of the reticle R and the wafer W is defined as the Y direction, and the direction of the asynchronous movement is defined as the X direction in a direction perpendicular to the Z direction. The rotation directions around the respective axes are denoted by θZ, θY, and θX.

The illumination optical system IU is supported by a support column 9 fixed on the upper surface of the reaction frame 8. Examples of the illumination light for exposure include far ultraviolet light (DUV light) such as an ultraviolet bright line (g-line, i-line) and KrF excimer laser light (wavelength: 248 nm) emitted from an ultra-high pressure mercury lamp, and ArF. Excimer laser light (wavelength 19
Vacuum ultraviolet light (VUV) such as 3 nm) and F ₂ laser light (wavelength 157 nm).

The reaction frame 8 is installed on a base plate 10 placed horizontally on the floor, and has inwardly projecting step portions 8a and 8b formed on its upper and lower sides, respectively. ing.

In the stage device 4, the reticle platen 3
Step 8a of reaction frame 8 at each corner
An opening 3a through which a pattern image formed on the reticle R passes is supported in a substantially horizontal manner via an anti-vibration unit 11 (note that the anti-vibration unit on the back side of the drawing is not shown). Are formed. Note that metal or ceramics can be used as the material of the reticle surface plate 3. The anti-vibration unit 11 has a configuration in which an air mount 12 whose internal pressure can be adjusted and a voice coil motor 13 are arranged in series on the step 8a. With these vibration isolation units 11, micro vibrations transmitted to the reticle surface plate 3 via the base plate 10 and the reaction frame 8 are insulated at a micro G level (G
Is the gravitational acceleration).

A reticle stage 2 is supported on the reticle base 3 so as to be two-dimensionally movable along the reticle base 3. A plurality of air bearings (air pads) 14 are fixed to the bottom of the reticle stage 2.
The reticle stage 2 is levitated and supported by the air bearings 14 on the reticle surface plate 3 with a clearance of about several microns. In addition, the central portion of the reticle stage 2 communicates with the opening 3a of the reticle surface plate 3,
An opening 2a through which the pattern image of the reticle R passes is formed.

The reticle stage 2 will be described in detail.
As shown in FIG. 2, the reticle stage 2 includes a reticle coarse movement stage 16 that is driven on the reticle surface plate 3 by a pair of Y linear motors 15 in a predetermined stroke in the Y-axis direction. A pair of X above
A reticle fine movement stage 18 that is finely driven in the X, Y, and θZ directions by a voice coil motor 17X and a pair of Y voice coil motors 17Y is provided. As illustrated).

Each Y linear motor 15 has a reticle surface plate 3
A stator 20 floating above and supported in the Y-axis direction by a plurality of air bearings (air pads) 19 as non-contact bearings, and a reticle coarse movement stage provided corresponding to the stator 20 via a connecting member 22 The movable element 21 is fixed to the movable element 16. Therefore, the reticle coarse movement stage 16 has + Y
In accordance with the movement in the direction, the stator 20 moves in the −Y direction. The movement of the stator 20 cancels the reaction force caused by the movement of the reticle coarse movement stage 16 and can prevent a change in the position of the center of gravity.

The stator 20 may be provided on the reaction frame 8 instead of on the reticle surface plate 3. When the stator 20 is provided on the reaction frame 8, the air bearing 19 is omitted, the stator 20 is fixed to the reaction frame 8, and the reaction force acting on the stator 20 due to the movement of the reticle coarse movement stage 16 is reacted. You may escape to the floor via the frame 8.

The reticle coarse movement stage 16 is guided in the Y-axis direction by a pair of Y guides 51, 51 fixed to the upper surface of an upper protruding portion 3b formed in the center of the reticle surface plate 3 and extending in the Y-axis direction. It has become. The reticle coarse movement stage 16 is supported by the Y guides 51 and 51 by an air bearing (not shown) in a non-contact manner.

The reticle R is held by suction on the reticle fine movement stage 18 via a vacuum chuck (not shown). -Y of reticle fine movement stage 18
A pair of Y moving mirrors 52a and 52b formed of corner cubes are fixed to the ends in the direction, and an X moving mirror formed of a plane mirror extending in the Y axis direction is provided to the + X direction end of the reticle fine movement stage 18. 53 is fixed. Then, three laser interferometers (all not shown) for irradiating the movable mirrors 52a, 52b, and 53 with a length measurement beam.
By measuring the distance from each movable mirror, the position of the reticle stage 2 in the X, Y, and θZ (rotation around the Z axis) direction can be measured with high accuracy. Reticle fine movement stage 1
As the material of No. 8, metal, ceramics made of cordierite or SiC can be used.

Returning to FIG. 1, as the projection optical system PL, here, both the object plane (reticle R) side and the image plane (wafer W) side are telecentric and have a circular projection field, and quartz and fluorite are optically projected. A refraction optical system having a 1/4 (or 1/5) reduction magnification composed of a refraction optical element (lens element) made of a glass material is used. For this reason, when the reticle R is irradiated with the illumination light, of the circuit pattern on the reticle R, an image forming light beam from a portion illuminated by the illumination light enters the projection optical system PL, and the circuit pattern is partially inverted. The image is limited to a slit shape and formed at the center of the circular field on the image plane side of the projection optical system PL. Thus, the projected partial inverted image of the circuit pattern is transferred to the wafer W placed on the image forming plane of the projection optical system PL.
Of the plurality of upper shot areas, the reduced transfer is performed to the resist layer on the surface of one shot area.

A flange 23 integrated with the lens barrel is provided on the outer periphery of the lens barrel of the projection optical system PL. The projection optical system PL is mounted on a lens barrel base 25 made of a casting or the like substantially horizontally supported on the stepped portion 8b of the reaction frame 8 via an anti-vibration unit 24 with the optical axis direction being the Z direction. And the flange 23 is engaged. The lens barrel base 25 may be made of a ceramic material having high rigidity and low thermal expansion.

As a material of the flange 23, a material having low thermal expansion, for example, Invar (nickel 36%,
(A low-expansion alloy composed of 0.25% of manganese and iron containing trace amounts of carbon and other elements). The flange 23 constitutes a so-called kinematic support mount that supports the projection optical system PL at three points with respect to the barrel base 25 via points, surfaces, and V-grooves. When such a kinematic support structure is employed, it is easy to assemble the projection optical system PL to the lens barrel base 25, and it is caused by vibrations, temperature changes, and the like of the assembled lens barrel base 25 and the projection optical system PL. There is an advantage that stress can be reduced most effectively.

The anti-vibration unit 24 is disposed at each corner of the lens barrel base 25 (the anti-vibration unit at the back of the drawing is not shown), and an air mount 26 whose internal pressure can be adjusted.
And the voice coil motor 27 are arranged in series on the step 8b. These vibration isolation units 24 insulate, at the micro G level, minute vibrations transmitted to the lens barrel base 25 (and the projection optical system PL) via the base plate 10 and the reaction frame 8.

The stage device 7 is provided integrally with the wafer stage 5, a wafer surface plate 6 for supporting the wafer stage 5 movably in a two-dimensional direction along the XY plane, and the wafer stage 5, and holding the wafer W by suction. Stage ST, X guide stage XG, X guide stage X for supporting wafer stage 5 and sample stage ST so as to be relatively movable.
It mainly comprises a synchronous stage device DS (see FIG. 4) that moves synchronously with G. On the bottom of the wafer stage 5,
A plurality of air bearings (air pads) 28, which are non-contact bearings, are fixed, and the wafer stage 5 is supported by the air bearings 28 on the wafer base 6 via a clearance of about several microns, for example. .

Many tubes having a small line width are connected between the X guide stage XG and the wafer stage 5, and the disturbance caused by these tubes is negligible. Therefore, in the present embodiment, it is assumed that the X guide stage XG is handled as a stage main body in consideration of the fact that pipes and wires for supplying power are connected to the X guide stage XG.

The wafer surface plate 6 is supported substantially horizontally above the base plate 10 via a vibration isolating unit 29. The anti-vibration unit 29 is disposed at each corner of the wafer surface plate 6 (the anti-vibration unit on the back side of the drawing is not shown), and the air mount 30 and the voice coil motor 31 whose internal pressure can be adjusted include the base plate 10. It has a configuration arranged in parallel on the top. These anti-vibration units 29
Thus, micro vibration transmitted to the wafer surface plate 6 via the base plate 10 is insulated at the micro G level.

As shown in FIG. 3, the X guide stage XG
Has an elongated shape along the X direction, and movers 36, 36 each composed of an armature unit are provided at both ends in the length direction. The stators 37, 37 having magnet units corresponding to the movers 36, 36 are provided on support portions 32, 32 protruding from the base plate 10 (see FIG. 1, and in FIG. 1, the mover 36). And the stator 37 is shown in a simplified manner). The moving coil 36 and the stator 37 constitute moving coil linear motors 33, 33. The movable element 36 is driven by electromagnetic interaction with the stator 37, so that the X guide is formed. The stage XG moves in the Y direction and rotates in the θZ direction by adjusting the drive of the linear motors 33. That is, the linear stage 33 drives the wafer stage 5 (and the sample stage ST, hereinafter simply referred to as the wafer stage 5) in the Y direction and the θZ direction almost integrally with the X guide stage XG.

A mover of the X trim motor 34 is mounted on the -X direction side of the X guide stage XG. The stator 34 b of the X trim motor 34 is provided on the reaction frame 8. For this reason, the reaction force when driving the wafer stage 5 in the X direction is reduced by the X trim motor 3.
The power is transmitted to the base plate 10 via the reaction frame 4 and the reaction frame 8.

The wafer stage 5 is an X guide stage X
It is supported and held by an X guide stage XG in a non-contact manner so as to be relatively movable in the X direction via a magnetic guide including a magnet and an actuator that maintains a predetermined amount of gap in the Z direction between G and G. The wafer stage 5 is driven in the X direction by electromagnetic interaction of an X linear motor 35 embedded in the X guide stage XG. In addition,
A wafer W is fixed to the upper surface of the wafer stage 5 via a wafer holder 41 by vacuum suction or the like (see FIG. 1, not shown in FIG. 3 and thereafter).

The synchronous stage device DS includes an air guide 6 disposed below the X guide stage XG and extending in the Y direction.
1, a stator 62 fixed on the air guide 61 along the Y direction, and a sub-stage (movable element that moves in the Y direction by being driven by electromagnetic interaction between the stator 62 and the stator 62 ( A power supply stage) 63, and a moving coil type linear motor is constituted by the stator 62 and the sub-stage 63.
Further, a plurality of air bearings (air pads) are fixed to the substage 63, and the substage 63 is movably supported by the air guide 61 via a clearance of, for example, about several microns by these air bearings. I have. The air guide 61 and the stator 62 are arranged independently of the wafer surface plate 6 in terms of vibration. The driving of the linear motor for the sub-stage 63, the linear motor 15 for driving the reticle stage 2, and the linear motors 33 and 35 for the wafer stage 5 are controlled overall by a drive control device (not shown).

Below the X guide stage XG (-Z side), a tube clamp portion 64 is protruded, and various pipes and wires are connected to the tube clamp portion 64. Specifically, a pipe for supplying and discharging a temperature adjusting refrigerant, a pipe for supplying air used for an air bearing,
Various drive devices and controls include piping for supplying a negative pressure (vacuum) for suctioning the wafer W under a negative pressure, wiring for supplying power to various sensors, and system wiring for supplying various control signals and detection signals. Installed for equipment. For example, for the wafer stage 5, a pipe for temperature adjustment, a pipe for sucking the wafer W, an air pipe for an air bearing, a power wiring for supplying power to a leveling sensor, a distance sensor described below, and the like, A detection signal and a system wiring for driving a linear motor are connected. In the following description, it is assumed that these various utilities are supplied as a utility supply member, typically via a belt-shaped tube. As the tube, a tube having a large thickness or a hardened material having a double structure and having flexibility is used in order to satisfy a demand for chemical clean.

On the side (+ X side) of the substage 63,
A tube clamp portion 65 to which a tube (power supply member, first power supply member) TB1 is connected protrudes from the tube clamp portion 64, and an end face (connection) of the tube clamp portion 64 to which the tube TB1 is connected. Surface) 64a
The end surface (connection surface) 65a of the tube clamp portion 65 is disposed so as to be substantially flush when the sub stage 63 and the X guide stage XG are positioned. A tube (second tube) is provided between the tube clamp portion 65 and a fixing portion 66 fixed to the reaction frame 8 or the like.
A tube TB3 to which a utility supply member) TB2 is connected.
Is connected. The tubes TB1 and TB2 are held and connected by a joint or the like (not shown) in the tube clamp portion 65.

The tube TB1 is connected to the end faces 64a, 65a in a curved manner in a substantially arc shape.
Assuming that the distance between the connecting portions of 5a is L, the radius of curvature is substantially L / 2. Also, the tube TB2,
The tube clamp portion 65 and the fixing portion 66 are connected in a curved manner in a substantially arc shape, and the tube TB1 and the tube TB2 are twisted so as to be substantially orthogonal to each other. I have.

On the other hand, the sub-stage 63 is provided with displacement detection sensors (detection devices) 67 and 67 and displacement-restriction stoppers (restriction devices) 68 and 68 on the X guide stage XG
It protrudes toward. The displacement detection sensor 67 is
It detects a relative positional relationship between the X guide stage XG and the sub-stage 63, and is configured by a photo sensor having a photoelectric switch function, and is disposed on both sides in the Y direction with the X guide stage XG interposed therebetween. This photosensor is provided with a light shielding plate (not shown) provided on the substage 63 when the substage 63 is positioned at a predetermined position.
And the detection light is transmitted to a position set as a threshold value, for example, at a distance of about 5 mm.
The relative positional relationship between the light source and the sub-stage 63 is shifted by 5 mm or more, and a detection signal is output to the drive control device when the light shielding plate shields the detection light.

The positional deviation limiting stopper 68 restricts the relative positional relationship between the X guide stage XG and the sub-stage 63 within a predetermined range.
When the sub-stage 63 is positioned at a predetermined position on both sides in the Y direction with respect to G,
It is arranged at a position with a gap of about mm. The stopper 68 is made of a shock absorber (impact absorbing material).
It is configured to absorb the shock when G collides.

Next, the operation of the stage device 7 of the stage device and the exposure device configured as described above will be described first. When the X guide stage XG moves in the Y direction together with the wafer stage 5 by the driving of the linear motor 33 under the control of the drive control device, the X guide stage X
In synchronization with G, the substage 63 also moves in the Y direction while maintaining the flush state of the end faces 64a and 65a of the tube clamp portions 64 and 65. Therefore, the tube TB1
Moves while maintaining a substantially arc shape, and the sub-stage 63 moves to the X guide stage XG.
In particular, low frequency vibration transmission and force transmission are reduced.

The sub-stage 63 is driven by a linear motor in a non-contact manner, and the sub-stage 63 moves along the air guide 61 in a non-contact manner by an air bearing. Vibration transmission of a high-frequency component that is likely to occur can be suppressed.

The sub-stage 63 is an X guide stage XG
Then, the substage 63 moves relative to the fixed portion 66, and the tube TB2 is deformed by utilizing its flexibility. The state at this time is schematically shown in FIGS. In FIGS. 5 and 6,
For convenience, the X direction and the Z direction are illustrated in an expanded manner. As shown in these figures, the tube TB2 is deformed according to the position of the sub-stage 63 (tube clamp unit 65) with respect to the fixed unit 66. At this time, a force that deforms the tube TB2, a force generated from the tube TB2, a disturbance, a vibration, and the like generated by friction between the tubes TB2 due to the deformation are transmitted to the sub-stage 6 via the tube clamp 65.
3 because it is absorbed and blocked by the linear motor driving the substage 63 and the air guide 61,
It can be prevented from being transmitted to the guide stage XG.
Moreover, since the air guide 61 and the stator 62 are vibrationally independent of the wafer surface plate 6, vibrations related to driving of the sub-stage 63 are transmitted to the X guide stage (wafer W) via the wafer surface plate 6. Can also be prevented.

In the normal state, the relative position relationship between the sub-stage 63 and the X guide stage XG is maintained by the drive control device. When the light is cut off, the drive control device receives the cutoff signal, stops the thrust of both the linear motor driving the sub-stage 63 and the linear motor 33 driving the X guide stage XG, and issues an error. If the sub-stage 63 and the X-guide stage XG move relative to each other due to inertial force even when the thrust of these actuators stops, the relative movement is restricted by the X-guide stage XG abutting against the displacement limiting stopper 68. .

As described above, the exposure apparatus 1 applies the illumination optical system IU to the wafer W on the wafer stage 5 in a state where the disturbance caused by the tube TB1 is blocked.
A predetermined rectangular illumination area on the reticle R is illuminated with uniform illuminance by the exposure illumination light from. In synchronization with the reticle R being scanned in the Y direction with respect to this illumination area, the wafer W is scanned with respect to an exposure area conjugate with respect to this illumination area and the projection optical system PL. As a result, the illumination light transmitted through the pattern area of the reticle R is projected onto the projection optical system PL.
Irradiates the wafer W coated with the resist. Then, the pattern of the reticle R is sequentially transferred to the exposure area on the wafer W, and the entire pattern area on the reticle R is transferred to the shot area on the wafer W by one scan.

In the stage apparatus and the exposure apparatus of the present embodiment, the sub-stage 63 holding the tube TB1 moves in synchronization with the X guide stage XG. And the like, the position controllability with respect to the X-guide stage XG is improved, and the sub-stage 63 is detected by detecting that the relative positional relationship between the X-guide stage XG and the sub-stage 63 has exceeded a threshold value and has collapsed. And the X guide stage XG is stopped, so that the stages 63 and XG can be prevented from being damaged via the tube TB1. In addition, in the present embodiment, since the displacement limit stopper 68 is provided, the sub-stage 6
3 and the X guide stage XG can be prevented from being relatively moved and damaged. In addition, since the displacement limiting stopper 68 is formed of a shock absorber, it is possible to prevent the stages 63 and XG from being damaged by the impact of the collision between the displacement limiting stopper 68 and the X guide stage XG.

In this embodiment, the X guide stage XG
The movement of the tube TB1 is mechanically restricted.
It is no longer necessary to allow extra length for the tube TB
1 X guide stage XG by its own natural vibration and inertial force
Vibration and force transmitted to can be suppressed. Moreover, in the present embodiment, by providing the tube TB1 in a substantially circular arc shape, particularly low-frequency vibration transmission and transmission of force can be reduced, and the radius of this circular arc can be reduced by the connection end surfaces 64a, 65a.
By making the distance between the connecting portions of the tube TB half, it is possible to bend in a substantially circular arc, and the length of the linear portion having a large vibration transmissibility can be shortened. Adverse effects can be reduced. in addition,
In the present embodiment, the length of the tube TB1 can be minimized by making the connection end surfaces 64a and 65a substantially flush. In the present embodiment, the sub-stage 63
Is driven by the air guide 61 and the linear motor in a non-contact manner, so that high-frequency vibration transmitted through the tube TB1 can also be suppressed.

In the present embodiment, the tube TB1
The tube clamps 64 and 65 and the fixing part 66 do not need to be arranged along the same direction because the bending directions of the tube and the TB2 are orthogonal to each other. In particular, the height in the Z direction can be reduced, and the size of the apparatus can be reduced. Can be contributed to.

Therefore, in the exposure apparatus having the above-described stage device 7, it is possible to execute the positioning control with respect to the wafer W and the speed control at the time of scanning exposure in an effectively damped state and with high security. And the accuracy relating to the exposure processing, such as the overlay accuracy, can be reliably maintained.

In the above-described embodiment, a photosensor having a photoelectric switch function is used as the displacement detection sensor. However, the present invention is not limited to this. For example, the X-guide stage XG and the sub-stage 63 may be connected to each other. A sensor that detects the relative distance may be used. In this case, the drive control device holds a threshold value of, for example, 5 mm, and drives the sub-stage 63 and the X-guide stage XG when the distance between the X-guide stage XG and the sub-stage 63 exceeds 5 mm. It may be configured to stop.

In the above embodiment, the synchronous stage device DS is provided only in the stage device 7 on the wafer side. However, the present invention is not limited to this, and the stage device 4 on the reticle side is also similar to the stage device 7. May be provided. In the above embodiment,
Although the stage apparatus of the present invention is configured to be applied to the wafer stage of the exposure apparatus 1, it is also applicable to precision measuring instruments such as a transfer mask drawing apparatus and a mask pattern position coordinate measuring apparatus in addition to the exposure apparatus 1. .

The substrate of the present embodiment is not limited to a semiconductor wafer W for a semiconductor device, but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin-film magnetic head, or a mask or a mask used in an exposure apparatus. Reticle master (synthetic quartz, silicon wafer)
Etc. are applied.

The exposure apparatus 1 includes a step-and-scan type scanning exposure apparatus (scanning stepper; US Pat. No. 5,473,410) for scanning and exposing the pattern of the reticle R by synchronously moving the reticle R and the wafer W. To
The present invention is also applicable to a step-and-repeat type projection exposure apparatus (stepper) that exposes the pattern of the reticle R while the reticle R and the wafer W are stationary and sequentially moves the wafer W stepwise.

The type of the exposure apparatus 1 is not limited to an exposure apparatus for manufacturing a semiconductor device for exposing a semiconductor device pattern onto a wafer W, but may be an exposure apparatus for manufacturing a liquid crystal display element, a thin film magnetic head, an image pickup device (CCD). Alternatively, the present invention can be widely applied to an exposure apparatus for manufacturing a reticle and the like.

As the light source of the illumination light for exposure, a bright line (g-line (436 nm), h
Line (404.7 nm), i-line (365 nm)), KrF
Not only an excimer laser (248 nm), an ArF excimer laser (193 nm), and an F ₂ laser (157 nm) but also a charged particle beam such as an X-ray or an electron beam can be used. For example, when an electron beam is used, a thermionic emission type lanthanum hexaborite (LaB ₆ ) or tantalum (Ta) can be used as an electron gun. When an electron beam is used, a configuration using a reticle R may be used, or a configuration may be used in which a pattern is directly formed on a wafer without using the reticle R. Alternatively, a high frequency such as a YAG laser or a semiconductor laser may be used.

The magnification of the projection optical system PL may be not only a reduction system but also an equal magnification system or an enlargement system. Further, As the projection optical system PL, using a material which transmits far ultraviolet rays such as quartz and fluorite as the glass material when using a far ultraviolet ray such as an excimer laser, catadioptric system, or in the case of using the F ₂ laser or X-ray An optical system of a refraction system (a reticle R of a reflection type is also used). When an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. It is needless to say that the optical path through which the electron beam passes is in a vacuum state. Further, the present invention can also be applied to a proximity exposure apparatus that exposes the pattern of the reticle R by bringing the reticle R and the wafer W into close contact without using the projection optical system PL.

A linear motor (refer to US Pat. No. 5,623,853 or US Pat. No. 5,528,118) for wafer stage 5 and reticle stage 2
Is used, any of an air levitation type using an air bearing and a magnetic levitation type using Lorentz force or reactance force may be used. In addition, each stage 2, 5
May be a type that moves along a guide or a guideless type that does not have a guide.

As a driving mechanism for each of the stages 2 and 5, a magnet unit (permanent magnet) having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil are opposed to each other, and each stage 2 and 5 is driven by electromagnetic force. 5 may be used. In this case, one of the magnet unit and the armature unit may be connected to the stages 2 and 5, and the other of the magnet unit and the armature unit may be provided on the moving surface side (base) of the stages 2 and 5.

As described above, the exposure apparatus 1 of the present embodiment
Is a system that includes various components including the components listed in the claims of the present application, with predetermined mechanical accuracy, electrical accuracy,
It is manufactured by assembling to maintain optical accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electric systems to ensure these various accuracy Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from various subsystems includes mechanical connections, wiring connections of electric circuits, and piping connections of pneumatic circuits among the various subsystems. It goes without saying that there is an assembling process for each subsystem before the assembling process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

As shown in FIG. 7, for a semiconductor device, a step 201 for designing the function and performance of the device, a step 202 for manufacturing a mask (reticle) based on the design step, a step 203 for manufacturing a wafer from a silicon material A wafer processing step 204 of exposing a reticle pattern to a wafer by the exposure apparatus 1 of the above-described embodiment, a device assembling step (dicing step,
(Including a bonding step and a package step) 205, an inspection step 206, and the like.

[0064]

As described above, in the stage apparatus according to the first aspect, the stage body and the utility supply stage are based on the result of comparison between the relative positional relationship between the stage body and the utility supply stage and a predetermined threshold value. Is controlled. As a result, in this stage device,
The position controllability with respect to the stage body is improved,
When the synchronization between the stage main body and the utility supply stage is lost, the effect that these damages can be prevented can be obtained.

The stage device according to the second aspect is configured to limit the relative positional relationship between the stage body and the utility supply stage within a predetermined range. Thus, in this stage device, even when the stage main body and the utility supply stage are relatively moved by the inertial force, an effect is obtained that these damages can be prevented.

The stage device according to the third aspect is configured such that the relative positional relationship between the stage body and the utility supply stage is limited by the shock absorbing material. Thereby, in this stage device, an effect is obtained that damage to the stage body and the utility supply stage due to the impact of the collision between the stage body and the limiting device can be obtained.

A stage device according to a fourth aspect is configured such that the connection surface of the stage body to which the power supply member is connected and the connection surface of the power supply stage to which the power supply member is connected are substantially flush. Has become. Thus, in this stage device, the effect is obtained that the length of the power supply member can be minimized, and the adverse effect due to the natural vibration and inertia force of the power supply member itself can be reduced.

In the stage device according to the fifth aspect, the first power supply member connected between the stage body and the power supply stage is curved into a substantially arc shape having a radius corresponding to the distance between the connection portions. Has become. Thus, in this stage device, since the length of the linear portion having a large vibration transmissibility can be reduced, an adverse effect due to the natural vibration and inertial force of the utility supply member itself can be reduced.

A stage device according to a sixth aspect of the present invention has a second power supply member connected in a substantially arcuate shape between the fixed portion and the power supply stage. The bending direction of the second power supply member is substantially orthogonal to the second power supply member. Thus, in this stage device, it is not necessary to dispose the fixing portion, the utility supply stage, and the stage main body in the same direction, and it is possible to reduce the size of the device.

The exposure apparatus according to a seventh aspect is configured such that the stage device according to any one of the first to sixth aspects is used as at least one of the mask stage and the substrate stage. As a result, in this exposure apparatus, the safety when driving the mask and the substrate is improved, and the positioning control with respect to the substrate and the speed control during the scanning exposure can be executed in an effectively damped state. Thus, the effect that the accuracy relating to the exposure processing, such as the overlay accuracy, can be reliably maintained.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an exposure apparatus in which a reticle stage, a wafer stage, and a projection optical system are independently arranged with respect to vibration.

FIG. 2 is an external perspective view of a reticle stage included in the exposure apparatus.

FIG. 3 is an external perspective view of a wafer-side stage device constituting the exposure apparatus.

FIG. 4 is an external perspective view of a synchronous stage device that moves synchronously with an X guide stage.

FIG. 5 is a diagram showing a state in which a sub stage and an X guide stage move synchronously.

FIG. 6 is a diagram showing a state in which a sub stage and an X guide stage move synchronously.

FIG. 7 is a flowchart illustrating an example of a semiconductor device manufacturing process.

FIG. 8 is an external perspective view illustrating an example of a conventional stage device.

FIG. 9 is a schematic front view showing a relationship between movement of a stage main body and a utility supply member.

[Explanation of symbols]

 R Reticle TB1 Tube (power supply member, first power supply member) XG X Guide stage (stage body) W Wafer (substrate) 1 Exposure device 2 Reticle stage (mask stage) 5 Wafer stage (substrate stage) 7 Stage device 63 Sub Stage (utility supply stage) 64a, 65a End face (connection surface) 67 Position shift detection sensor (detection device) 68 Position shift limit stopper (limit device)

Claims (7)

[Claims] 1. A stage device comprising a stage main body that moves by being connected to a power supply member for supplying a power, a power supply stage that holds the power supply member and moves synchronously with the stage main body, and the stage main body. A detection device that detects a relative positional relationship between the power supply stage and the power supply stage; and a drive that controls driving of the stage body and the power supply stage based on a comparison result between the detection result of the detection device and a predetermined threshold value. A stage device comprising a control device. 2. The stage device according to claim 1, further comprising a limiting device that limits a relative positional relationship between the stage main body and the utility supply stage within a predetermined range. 3. The stage device according to claim 2, wherein the limiting device is a shock absorbing material. 4. The stage device according to claim 1, wherein the connection surface of the stage main body to which the power supply member is connected, and the connection of the power supply stage to which the power supply member is connected. A stage device, wherein the stage device is disposed substantially flush with the surface. 5. The stage device according to claim 1, wherein the first power supply member connected between the stage main body and the power supply stage corresponds to a distance between the connection portions. A stage device characterized by being provided in a curved shape having a substantially circular arc with a radius. 6. The stage device according to claim 5, further comprising: a second power supply member connected between the fixed portion and the power supply stage while being curved in a substantially arc shape, wherein the first power supply member is provided. A bending direction of the second power supply member is substantially orthogonal to a bending direction of the second power supply member. 7. An exposure apparatus for exposing a pattern of a mask held on a mask stage to a substrate held on a substrate stage, wherein at least one of the mask stage and the substrate stage is used as the stage. An exposure apparatus using any one of the stage devices described above.