JP2002191821A - Game controller - Google Patents

Game controller

Info

Publication number
JP2002191821A
JP2002191821A JP2000394818A JP2000394818A JP2002191821A JP 2002191821 A JP2002191821 A JP 2002191821A JP 2000394818 A JP2000394818 A JP 2000394818A JP 2000394818 A JP2000394818 A JP 2000394818A JP 2002191821 A JP2002191821 A JP 2002191821A
Authority
JP
Japan
Prior art keywords
control
single substrate
game
board
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000394818A
Other languages
Japanese (ja)
Inventor
Mikio Wakasa
幹夫 若狭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heiwa Corp
Original Assignee
Heiwa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heiwa Corp filed Critical Heiwa Corp
Priority to JP2000394818A priority Critical patent/JP2002191821A/en
Publication of JP2002191821A publication Critical patent/JP2002191821A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a game controller capable of reducing its cost by being made small in size and easy in assembling. SOLUTION: Areas 15-18 respectively for every control function divisions are sectioned on a single board 4 housed in one vessel 2 and 3 and function- divided control components are mounted respectively in the areas 15-18.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、制御基板を容器に
収納した構造の遊技制御装置に関する。
The present invention relates to a game control device having a structure in which a control board is housed in a container.

【0002】[0002]

【従来の技術】特開平11−128494号公報で開示
されているように、少数の心無い者による不正改造の発
見のし易さや公共機関による検査のし易さの観点から、
遊技機に搭載される電気的な遊技制御装置を、遊技全般
を電気的に制御する主制御装置と主制御装置から一方向
に出力されるコマンドにより動作する図柄制御、音制
御、表示灯制御、球払出制御、球発射制御等の従制御装
置とに機能分割することは公知である。又、特開200
0−153020号公報で開示されているように、制御
基板を複数個に分割し、それら複数個の制御基板を1つ
の透視可能な容器に収納すると共にコネクタやケーブル
で互いに接続することも公知である。
2. Description of the Related Art As disclosed in Japanese Patent Application Laid-Open No. H11-128494, from the viewpoint of easy discovery of unauthorized alteration by a small number of inexplicable persons and inspection by public institutions,
An electric game control device mounted on a gaming machine, a main control device for electrically controlling the entire game, and a symbol control, a sound control, an indicator light control operated by a command output in one direction from the main control device, It is known to divide functions into slave control devices such as ball dispensing control and ball launch control. Also, JP 200
As disclosed in Japanese Patent Application Publication No. 0-153020, it is also known to divide a control board into a plurality of parts, house the plurality of control boards in one see-through container, and connect them to each other with a connector or a cable. is there.

【0003】[0003]

【発明が解決しようとする課題】しかし、特開平11−
128494号公報の場合は、機能分割された複数の制
御基板を個別の容器に収納した構造であるため、それぞ
れの制御基板を容器に収納してなる制御装置個々を遊技
機に配置する構造も複雑となり、コストダウンを図るに
も限度がある。又、特開2000−153020号公報
の場合は、複数個に分割された制御基板を止ねじのよう
な固定具で容器に個別に取付ける構造であるため、制御
基板を容器に取付けるのに多大な労力と時間とを要し、
コストダウンを図るにも限度がある。
However, Japanese Patent Application Laid-Open No.
In the case of Japanese Patent No. 128494, the structure in which a plurality of function-divided control boards are housed in separate containers is also complicated, and the structure of disposing each control device in which each control board is housed in a container is arranged in a game machine. Therefore, there is a limit in cost reduction. In the case of Japanese Patent Application Laid-Open No. 2000-153020, since the control board divided into a plurality of pieces is individually attached to the container with a fixing tool such as a set screw, it takes a great deal of time to attach the control board to the vessel. It takes effort and time,
There are limits to cost reduction.

【0004】そこで、本発明は、小型化と取付容易化と
により、コストダウンが図れる遊技制御装置を提供する
ものである。
[0004] Therefore, the present invention provides a game control device capable of reducing cost by downsizing and facilitating mounting.

【0005】[0005]

【課題を解決するための手段】本発明にあっては、1つ
の容器に収納される単一基板に制御の機能分割毎の領域
を区分し、それらの領域毎に機能分割された制御部品を
実装したことにより、制御基板を容器に収納した遊技制
御装置を小型にすることができ、単一基板を1つの容器
に取付けて、基板の容器への取付を容易にすることがで
きる。
According to the present invention, an area for each functional division of control is divided into a single substrate accommodated in one container, and a control component divided for each area is divided into control parts. With the mounting, the game control device in which the control board is stored in the container can be reduced in size, and a single board can be mounted on one container, and the mounting of the board on the container can be facilitated.

【0006】[0006]

【発明の実施の形態】図1〜図3は第1実施形態であっ
て、図1は遊技制御装置1の外観を分解して示し、図2
は遊技制御装置1の断面を示し、図3は遊技制御装置1
を備えた遊技機の一例としてのパチンコ機の裏側を示
す。
1 to 3 show a first embodiment. FIG. 1 shows an exploded appearance of a game control device 1, and FIG.
3 shows a cross section of the game control device 1, and FIG.
1 shows a back side of a pachinko machine as an example of a gaming machine provided with.

【0007】図1及び図2を参照し、遊技制御装置1に
ついて説明する。遊技制御装置1はベース2とカバー3
とよりなる容器の内部空間に単一基板4を格納し、ベー
ス2とカバー3と単一基板4とをタッピングねじのよう
な止ねじ5で結合する形態である。ベース2は透視性の
有る合成樹脂で裏側開放状の箱型であって、周壁6で囲
まれた基板収納部7に取付孔部8を四隅に有すると共に
リブ9を格子状に有し、周壁6の端面にカバー3の周壁
11を収納する環状の取込溝10を有する。カバー3は
透視性の有る合成樹脂で前側開放状の箱型であって、周
壁11で囲まれた図2に示す基板収納室12に取付孔部
13を四隅に有すると共に周囲にコネクタ逃孔14を有
する。
Referring to FIGS. 1 and 2, the game control device 1 will be described. The game control device 1 includes a base 2 and a cover 3
In this embodiment, the single substrate 4 is stored in the internal space of the container, and the base 2, the cover 3, and the single substrate 4 are connected with the set screw 5 such as a tapping screw. The base 2 is made of a transparent synthetic resin and has a box shape with an open back side. The base 2 has mounting holes 8 at four corners in a substrate storage portion 7 surrounded by a peripheral wall 6 and ribs 9 in a lattice shape. 6 has an annular intake groove 10 for accommodating the peripheral wall 11 of the cover 3 on the end face. The cover 3 is made of transparent synthetic resin and has a front open box shape. The cover 3 has mounting holes 13 at four corners in a substrate storage room 12 shown in FIG. Having.

【0008】単一基板4はプリント基板のような基板で
あって、遊技制御全般を主制御、図柄制御、音制御、表
示灯制御、球払出制御及び球発射制御等の機能分割毎に
対応する複数の領域15;16;17;18に区分さ
れ、それらの領域15〜18毎に機能分割された制御部
品を実装する。単一基板4は例えば主制御、図柄制御、
音制御及び表示灯制御等に対応する4つの領域15〜1
8に区分され、各領域15〜18の区分たる境界を単一
基板4の板面よりV字形、U字形、角形、多角形等に切
込まれた溝19;20;21で外部より視認し得るよう
に形成し、四隅に取付孔22を有する。溝19〜21は
単一基板4を分断(分割)してはいない。
The single board 4 is a board such as a printed board, and the whole game control corresponds to each function division such as main control, symbol control, sound control, indicator light control, ball payout control, and ball firing control. A control component which is divided into a plurality of areas 15; 16; 17; 18 and divided into functions for each of these areas 15 to 18 is mounted. The single board 4 includes, for example, main control, symbol control,
Four areas 15-1 corresponding to sound control, indicator light control, etc.
8 and the boundaries between the regions 15 to 18 are visually recognized from the outside by grooves 19; 20; 21 cut into the V-shaped, U-shaped, square, polygonal, etc. from the plate surface of the single substrate 4. It has a mounting hole 22 at each of the four corners. The grooves 19 to 21 do not divide (divide) the single substrate 4.

【0009】最も面積の広い領域15には図外の主制御
用のCPU、ROM、RAM等の半導体部品やそれ以外
の電気部品を実装し、中程度の面積の一方の領域16に
は図外の図柄制御用のCPU、ROM、RAM、半導集
積回路等の半導体部品やそれ以外の電気部品を実装し、
中程度の面積の他方の領域17には図外の音制御用のC
PU、ROM、RAM、半導集積回路等の半導体部品や
それ以外の電気部品を実装し、最も面積の狭い領域18
には図外の表示灯制御用のCPU、ROM、RAM、半
導集積回路等の半導体部品やそれ以外の電気部品を実装
する。尚、上記各領域に実装された電気部品は図2に仮
想線Lで模式的に図示した。
A semiconductor component such as a main control CPU, ROM, RAM and the like (not shown) and other electric components are mounted in the region 15 having the largest area. The semiconductor components such as CPU, ROM, RAM, semiconductor integrated circuit and the like for the symbol control and other electric components are mounted,
The other area 17 having a medium area has a sound control C (not shown).
A semiconductor component such as a PU, a ROM, a RAM, and a semiconductor integrated circuit and other electric components are mounted thereon, and the region 18 having the smallest area is mounted.
A semiconductor component such as a CPU, a ROM, a RAM, and a semiconductor integrated circuit (not shown) for controlling the indicator light, and other electric components are mounted on the CPU. The electric components mounted in each of the above regions are schematically shown by a virtual line L in FIG.

【0010】各領域中における電気部品どうしはプリン
ト配線のような配線で接続され、各領域間15〜18に
おける各制御どうしは領域間コネクタ23;24;25
で接続される。各領域15〜18には外部との接続のた
めの外部用コネクタ26;27;28;29を単一基板
4の周縁に位置するように個別に備えると共に各領域1
5〜18に実装された主制御、図柄制御、音制御及び表
示灯制御等の制御名を表示する制御名表示部30;3
1;32;33を個別に備える。制御名は印刷や捺印或
いはプリント配線材料たる金属箔のエッチング等により
形成され文字や記号又はバーコード或いはキャラクタ等
の1つ又はそれの組合せで構成される。
The electrical components in each area are connected to each other by wiring such as printed wiring, and the respective controls in the areas 15 to 18 are controlled by the inter-area connectors 23; 24; 25.
Connected by Each of the regions 15 to 18 is provided with an external connector 26; 27; 28; 29 for connection to the outside so as to be located on the periphery of the single substrate 4, and each of the regions 1 to 18.
Control name display units 30; 3 for displaying control names such as main control, symbol control, sound control, and indicator light control mounted on 5 to 18
1; 32; 33 are individually provided. The control name is formed by printing, stamping, etching of a metal foil as a printed wiring material, or the like, and is composed of one or a combination of characters, symbols, bar codes, characters, and the like.

【0011】遊技制御装置1の組立は、ベース2に電気
部品の実装された単一基板4を搭載し、カバー3をベー
ス2に被せた後、止ねじ5をベース2の取付孔部8より
単一基板4の取付孔22を経由してカバー3の取付孔部
13に締結する。これによって、図2に示すように、単
一基板4を容器に収納した遊技制御装置1が完成する。
図2において、単一基板4は取付孔部22をベース2の
取付孔部8の前端に段差状に形成された嵌合部34に外
嵌装着し、取付孔部22周りをベース2の取付孔部8と
カバー3の取付孔部13とで挟み付けることにより、ベ
ース2とカバー3とでがたつくことがないように支持さ
れる。単一基板4の溝19〜21の周囲がカバー3のリ
ブ9で支持されることにより、各領域15〜18が溝1
9〜21により分断されることはない。
The game control apparatus 1 is assembled by mounting a single substrate 4 on which electric components are mounted on a base 2, covering the base 3 with a cover 3, and setting screws 5 from a mounting hole 8 of the base 2. The cover 3 is fastened to the mounting hole 13 of the cover 3 via the mounting hole 22 of the single substrate 4. Thereby, as shown in FIG. 2, the game control device 1 in which the single substrate 4 is stored in the container is completed.
In FIG. 2, the single substrate 4 has the mounting hole 22 externally fitted to a fitting portion 34 formed in a stepped shape at the front end of the mounting hole 8 of the base 2, and the mounting of the base 2 around the mounting hole 22. By being sandwiched between the hole 8 and the mounting hole 13 of the cover 3, the base 2 and the cover 3 are supported without rattling. Since the periphery of the grooves 19 to 21 of the single substrate 4 is supported by the ribs 9 of the cover 3, the regions 15 to 18 are
It is not divided by 9-21.

【0012】図3を参照し、前記遊技制御装置1をパチ
ンコ機に搭載した構造について説明する。遊技制御装置
1は遊技機枠体41に設けられた電源装置45から供給
される電源でCPU、ROM、RAM、半導集積回路等
の半導体部品やそれ以外の電気部品による電気的な制御
動作を行うものであって、遊技機枠体41に取付けられ
る枠側遊技制御装置42と遊技機枠体41に装着される
遊技盤43に取付けられる盤側遊技制御装置44とによ
り構成される。枠側遊技制御装置42は遊技盤43の種
類が異なる場合でも共通に使用可能である遊技の種類と
の関連が浅い制御としての球払出制御や球発射制御等を
備え、盤側遊技制御装置44は遊技盤43の種類が異な
る場合には交換が必要である遊技の種類との関連が深い
制御としての主制御、図柄制御、音制御及び表示灯制御
等を備える。遊技盤43と遊技機枠体41とに搭載され
る制御装置が個別に単一体として集約でき、遊技盤43
を交換する場合でも枠側遊技制御装置42はそのまま使
用可能である。よって、パチンコ店での機種替えの場
合、新機種の遊技盤43と旧機種の遊技盤43とを遊技
機枠体41に入れ替えることにより、遊技の種類との関
連が深い盤側遊技装置も入れ替えられることにより、機
種替えの作業が簡単である。
Referring to FIG. 3, a structure in which the game control device 1 is mounted on a pachinko machine will be described. The game control device 1 uses a power supply supplied from a power supply device 45 provided in the game machine frame 41 to control an electric control operation by semiconductor components such as a CPU, a ROM, a RAM, a semiconductor integrated circuit, and other electric components. The game is performed by a frame-side game control device 42 attached to the game machine frame 41 and a board-side game control device 44 attached to the game board 43 attached to the game machine frame 41. The frame-side game control device 42 includes a ball payout control and a ball firing control, etc., as controls having a small relationship with the type of game that can be used in common even when the type of the game board 43 is different. Is provided with main control, symbol control, sound control, indicator light control, and the like as controls closely related to the type of game that needs to be replaced when the type of game board 43 is different. The control devices mounted on the game board 43 and the game machine frame 41 can be individually integrated as a single unit.
Is replaced, the frame-side game control device 42 can be used as it is. Therefore, in the case of a model change at a pachinko parlor, by replacing the game board 43 of the new model and the game board 43 of the old model with the game machine frame 41, the board-side gaming device closely related to the type of game is also replaced. This makes it easy to change models.

【0013】主制御は遊技全般を制御するものであり、
球払出制御、球発射制御、図柄制御、音制御及び表示灯
制御は主制御から一方向に出力されるコマンドにより動
作する従制御である。例えば、図1に示す遊技制御装置
1を盤側遊技制御装置44とすれば、枠側遊技制御装置
42は図1に示すベース2とカバー3とからなる容器に
収納された単一基板4において、図1の溝19〜21で
区分された領域15〜18の数を2つとみなし、一方の
領域に球払出制御用のCPU、ROM、RAM等の半導
体部品やそれ以外の電気部品を実装し、他方の領域に球
発射制御用のCPU、ROM、RAM等の半導体部品や
それ以外の電気部品を実装するものと読替えれば容易に
実施できることは理解できるであろう。
The main control is for controlling the entire game,
The ball payout control, the ball launch control, the symbol control, the sound control, and the indicator light control are sub-controls that operate according to a command output in one direction from the main control. For example, assuming that the game control device 1 shown in FIG. 1 is a board-side game control device 44, the frame-side game control device 42 is a single board 4 housed in a container composed of the base 2 and the cover 3 shown in FIG. The number of areas 15 to 18 divided by grooves 19 to 21 in FIG. 1 is regarded as two, and semiconductor parts such as CPU, ROM, RAM for ball payout control and other electric parts are mounted in one area. It can be understood that the present invention can be easily implemented by replacing a semiconductor component such as a CPU, a ROM, a RAM, and the like for ball launch control and other electric components in the other area.

【0014】図4は第2実施形態の領域間コネクタ5
1;52;53の種類を示し、a図は挿入実装タイプの
領域間コネクタ51であって、合成樹脂よりなる絶縁体
51aに埋め込まれた端子51bを絶縁体51aの両側
に突出し、それぞれの突出した端子51bの足51cを
複数の隣接する領域A;Bに形成された貫通孔54に挿
入し、貫通孔54の周りで単一基板4に形成されたプリ
ント端子55に半田のような接合部材56で接続した形
態である。b図は表面実装タイプの領域間コネクタ52
であって、合成樹脂よりなる絶縁体52aに埋め込まれ
た端子52bを絶縁体52aの両側に突出し、それぞれ
の突出した端子52bの足52cを複数の隣接する領域
A;Bで単一基板4の実装面に形成されたプリント端子
57に半田のような接合部材56で接続した形態であ
る。c図は領域間コネクタ53とフラットケーブル58
とによるものであって、複数の隣接する領域A;Bにお
ける単一基板4の実装面にケーブル差込み可能な領域間
コネクタ53を個別に実装し、領域間コネクタ53にフ
ラットケーブル58を挿入し接続した形態である。領域
間コネクタ53をフラットケーブル58で接続する代り
に、領域間コネクタ53を領域A;Bに跨って実装され
るナイフスイッチのようなナイフタイプのコネクタを使
用しても良い。c図の領域間コネクタ53とフラットケ
ーブル58との組合せ形態、領域間コネクタ53のナイ
フタイプの形態のいずれでも、領域A;B間の接続を必
要に応じて遮断することが可能であるので、領域A;B
の電気的な独立を確保して公共機関の検査の利便性を図
ることができる。
FIG. 4 shows an inter-region connector 5 according to the second embodiment.
1; 52; 53 show the types of insertion-mount type inter-region connectors 51, in which terminals 51b embedded in an insulator 51a made of synthetic resin are protruded to both sides of the insulator 51a, and the respective protrusions are shown. The terminal 51b of the terminal 51b is inserted into the through-hole 54 formed in the plurality of adjacent areas A and B, and the printed terminal 55 formed on the single substrate 4 around the through-hole 54 is joined to a joining member such as solder. This is a form connected by 56. FIG. 2B shows a surface mount type inter-region connector 52.
The terminal 52b embedded in the insulator 52a made of synthetic resin protrudes on both sides of the insulator 52a, and the legs 52c of the protruding terminals 52b are connected to the plurality of adjacent regions A; This is a form in which the printed terminal 57 formed on the mounting surface is connected by a joining member 56 such as solder. c shows the inter-region connector 53 and the flat cable 58.
A plurality of inter-region connectors 53 that can be plugged into cables are individually mounted on the mounting surfaces of the single substrate 4 in a plurality of adjacent regions A and B, and a flat cable 58 is inserted into the inter-region connectors 53 and connected. It is a form that did. Instead of connecting the inter-region connector 53 with the flat cable 58, a knife-type connector such as a knife switch mounted on the inter-region connector 53 across the regions A and B may be used. The connection between the areas A and B can be cut off as necessary in the combination of the inter-area connector 53 and the flat cable 58 and the knife type of the inter-area connector 53 in FIG. Region A; B
Inspection of public institutions can be facilitated by securing electrical independence.

【0015】図5は第3実施形態の領域区分構造の種類
を示し、a図は溝61;62を単一基板4の両面より内
部に形成したものある。b図は溝63;64を単一基板
4の両面より内部に形成する場合に互い違いと形成した
ものである。c図は溝65;66;67を単一基板4の
両面より内部に互い違いに形成する場合に一方の板面に
溝65を形成し、他方の板面に複数の溝66;67を一
方の板面における溝65を挟む格好で形成したものであ
る。d図はV字形の溝68;69を単一基板4の両面で
互い違いとする場合に一方の溝68の斜面と他方の溝6
9の稜線部とが対応したものである。e図は単一基板4
に円孔又は長孔等の貫通孔70を複数形成したものであ
る。
FIG. 5 shows the type of the area dividing structure of the third embodiment. FIG. 5A shows a single substrate 4 in which grooves 61 and 62 are formed on both sides. FIG. 6B shows the case where the grooves 63 and 64 are formed alternately when formed on both sides of the single substrate 4. c shows that when the grooves 65; 66; 67 are alternately formed inside from both sides of the single substrate 4, the grooves 65 are formed on one plate surface, and a plurality of grooves 66; 67 are formed on the other plate surface. It is formed so as to sandwich the groove 65 in the plate surface. d shows a case where the V-shaped grooves 68; 69 are alternately formed on both surfaces of the single substrate 4 when the slope of one groove 68 and the other groove 6 are used.
9 correspond to the ridges. Figure e shows a single substrate 4
And a plurality of through holes 70 such as circular holes or long holes.

【0016】図6は第4実施形態の領域区分構造を示
し、a図及びb図に示すように円孔又は長孔等の複数の
隣接する貫通孔70の周りに凹部71;72をそれぞれ
の貫通孔70に掛かるように単一基板4の両面より互い
違いに形成したものである。
FIG. 6 shows a region dividing structure according to a fourth embodiment. As shown in FIGS. A and b, concave portions 71 and 72 are respectively formed around a plurality of adjacent through holes 70 such as circular holes or long holes. It is formed alternately from both surfaces of the single substrate 4 so as to hang over the through holes 70.

【0017】図5及び図6に示す領域区分構造によれ
ば、単一基板4の両側に形成された溝61〜69や貫通
孔70及び凹部71;72の深さが単一基板4の厚さ方
向で互い違いになっているので、単一基板4が多層配線
基板である場合において、溝61〜69や貫通孔70及
び凹部71;72が単一基板4の内部に埋め込まれた内
部配線を複数の領域A;B間又は複数の領域15〜18
間で遮断することができる。
According to the region dividing structure shown in FIGS. 5 and 6, the depths of the grooves 61 to 69, the through holes 70 and the concave portions 71 and 72 formed on both sides of the single substrate 4 are equal to the thickness of the single substrate 4. In the case where the single substrate 4 is a multilayer wiring substrate, the internal wiring in which the grooves 61 to 69, the through holes 70, and the concave portions 71 and 72 are embedded in the single substrate 4 is used. A plurality of areas A; between B or a plurality of areas 15 to 18
Can be shut off between.

【0018】図7は第5実施形態の領域区分構造を示
し、a図は単一基板4の板面に複数の領域A;Bを区分
する境界73をスクリーン印刷やプリント基板の導電箔
をエッチングで残すことにより形成したものである。b
図は各領域A;B間に境界74を残すように各領域A;
Bにレジスト膜75;76を個別に形成したものであ
る。b図の場合には境界74に色違いのレジスト膜又は
他の色材を充填しても良い。c図は複数の隣接する一方
の領域Aに施すレジスト膜78を形成した後、他方の領
域にレジスト膜79を形成する場合に当該レジスト膜7
9の一部を一方のレジスト膜78の一部に重ね合せるこ
とにより、レジスト膜78;79の厚さの違いで境界8
0を形成したものである。d図は複数の隣接する一方の
領域Aに施すレジスト膜81と他方の領域Bにレジスト
膜82とを互いに突合わせると共に一方のレジスト膜8
1と他方のレジスト膜82との色違いで境界83を形成
したものである。
FIG. 7 shows a region dividing structure according to a fifth embodiment. FIG. 7A shows a boundary 73 for dividing a plurality of regions A and B on a plate surface of a single substrate 4 by screen printing or etching a conductive foil of a printed circuit board. It is formed by leaving in. b
The figure shows each region A; so that a boundary 74 is left between each region A;
B, resist films 75 and 76 are individually formed. In the case of FIG. 6B, the boundary 74 may be filled with a resist film of a different color or another color material. FIG. 3C shows a case where a resist film 78 to be applied to one of a plurality of adjacent regions A is formed and then a resist film 79 is formed to the other region.
9 is superimposed on a part of one of the resist films 78, so that the thickness of the resist film 78;
0 is formed. FIG. 4D shows a resist film 81 applied to one of the plurality of adjacent areas A and a resist film 82 applied to the other area B, and one resist film 8 is formed.
The boundary 83 is formed by different colors between the first resist film 82 and the other resist film 82.

【0019】図8は第6実施形態の領域区分構造を示
す。a図は単一基板4の領域A;Bを単一基板4の一方
の板面側から他方の板面側に例えばプレス加工により半
抜き状に膨出形成し、凹状の領域A;B間に凸条の境界
84を形成し、凹状の領域A;Bに仮想線Lで示すよう
に電気部品を実装することにより、単一基板4の一方の
板面からの電気部品の突出量を少なくして電気部品を保
護するものである。b図は単一基板4の領域A;Bを単
一基板4の一方の板面側から他方の板面側に例えばプレ
ス加工により膨出形成し、凸状の領域A;B間に凹状の
境界85を形成し、凸状の領域A;Bに仮想線Lで示す
ように電気部品を挿入実装することにより、単一基板4
の一方の板面からの電気部品のリード線の突出量を少な
くするものである。a図及びb図では各領域A;Bの膨
出方向を一方向に揃えたが、両方より互い違いに膨出し
ても良い。このように単一基板に凹凸を形成することに
より、単一基板4が多層配線基板である場合において、
プレス加工時に単一基板4の内部配線を複数の領域A;
B間又は複数の領域15〜18間で遮断することができ
る。又、プレス加工に先駆けて領域A;Bに跨って製造
者名のような識別情報を単一基板4に形成しておき、そ
の状態でプレス加工で領域A;Bの凹凸を形成すれば、
識別情報が勘合符(割符;割印)のような機能を備える
こととなり、プレス加工による半抜き状の領域A又は領
域Bが心無い者によってすげ替えられることを防止する
ことができる。
FIG. 8 shows an area dividing structure according to a sixth embodiment. FIG. 3A shows a region A; B of the single substrate 4 formed by swelling from one plate surface side of the single substrate 4 to the other plate surface in a half-blank shape by, for example, press working, and a concave region A; The boundary 84 of the ridge is formed on the first substrate 4 and the electric components are mounted on the concave regions A and B as indicated by the imaginary lines L, so that the amount of protrusion of the electric components from one plate surface of the single substrate 4 is reduced. To protect the electrical components. FIG. 2B shows a region A; B of the single substrate 4 formed by swelling from one plate surface side to the other plate surface side of the single substrate 4 by, for example, press working, and forming a concave region between the convex regions A; The boundary 85 is formed, and the electric components are inserted and mounted in the convex regions A and B as indicated by the imaginary lines L.
The protrusion amount of the lead wire of the electric component from one plate surface is reduced. In the figures a and b, the bulging directions of the respective areas A and B are aligned in one direction, but they may bulge alternately from both directions. By forming the unevenness on the single substrate in this manner, when the single substrate 4 is a multilayer wiring substrate,
During the press working, the internal wiring of the single substrate 4 is divided into a plurality of areas A;
It is possible to cut off between B or a plurality of regions 15-18. Further, prior to the press working, identification information such as a manufacturer name is formed on the single substrate 4 across the areas A and B, and in that state, the unevenness of the areas A and B is formed by the press working.
The identification information is provided with a function such as a tally (tally; tally), so that it is possible to prevent a half-empty region A or B by press working from being replaced by a person who does not care.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 第1実施形態の遊技制御装置を示す分解斜視
図。
FIG. 1 is an exploded perspective view showing a game control device according to a first embodiment.

【図2】 第1実施形態の遊技制御装置を示す縦断面
図。
FIG. 2 is a longitudinal sectional view showing the game control device of the first embodiment.

【図3】 第1実施形態遊技制御装置を備えたパチンコ
機を示す裏面図。
FIG. 3 is a rear view showing the pachinko machine provided with the game control device according to the first embodiment.

【図4】 第2実施形態の領域間コネクタを示す模式
図。
FIG. 4 is a schematic view showing an inter-region connector according to a second embodiment.

【図5】 第3実施形態の領域区分構造で、a図〜d図
は側面図、e図は平面図。
5A to 5D are side views and FIG. 5E is a plan view of the area dividing structure according to the third embodiment.

【図6】 第4実施形態の領域区分構造で、a図は平面
図、b図は断面図。
6A is a plan view and FIG. 6B is a cross-sectional view of the area dividing structure according to the fourth embodiment.

【図7】 第5実施形態の領域区分構造を示す模式図。FIG. 7 is a schematic diagram showing an area division structure according to a fifth embodiment.

【図8】 第6実施形態の領域区分構造を示す断面図。FIG. 8 is a sectional view showing an area dividing structure according to a sixth embodiment.

【符号の説明】[Explanation of symbols]

1 遊技制御装置 2 ベース(容器) 3 カバー(容器) 4 単一基板 15〜18 領域 19〜21 溝 DESCRIPTION OF SYMBOLS 1 Game control apparatus 2 Base (container) 3 Cover (container) 4 Single board 15-18 Area 19-21 Groove

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 制御基板を容器に収納した遊技制御装置
において、1つの容器に収納される単一基板に制御の機
能分割毎の領域を区分し、それらの領域毎に機能分割さ
れた制御部品を実装したことを特徴とする遊技制御装
置。
1. A game control device in which a control board is housed in a container, a control board divided into areas for each functional division of control on a single board housed in one container, and the function divided for each of those areas. A game control device characterized by implementing the above.
JP2000394818A 2000-12-26 2000-12-26 Game controller Pending JP2002191821A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000394818A JP2002191821A (en) 2000-12-26 2000-12-26 Game controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000394818A JP2002191821A (en) 2000-12-26 2000-12-26 Game controller

Publications (1)

Publication Number Publication Date
JP2002191821A true JP2002191821A (en) 2002-07-10

Family

ID=18860384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000394818A Pending JP2002191821A (en) 2000-12-26 2000-12-26 Game controller

Country Status (1)

Country Link
JP (1) JP2002191821A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041428A (en) * 2004-07-30 2006-02-09 Heiwa Corp Circuit board, game machine, and drum-rotating type game machine
JP2007535242A (en) * 2004-04-22 2007-11-29 フィニサー コーポレイション Optical transceiver and host adapter having memory mapped monitoring circuit
US8086100B2 (en) 2001-02-05 2011-12-27 Finisar Corporation Optoelectronic transceiver with digital diagnostics
US8159956B2 (en) 2008-07-01 2012-04-17 Finisar Corporation Diagnostics for serial communication busses
JP2013252271A (en) * 2012-06-07 2013-12-19 Newgin Co Ltd Game machine

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078167U (en) * 1983-11-04 1985-05-31 株式会社東芝 printed wiring board
JPS61199688A (en) * 1985-02-28 1986-09-04 株式会社東芝 Printed wiring board
JPH04255289A (en) * 1991-02-07 1992-09-10 Nec Corp Metal base wiring board
JPH0661674A (en) * 1991-08-19 1994-03-04 Nippon Telegr & Teleph Corp <Ntt> Mounting structure for electronic device
JPH06190121A (en) * 1992-12-28 1994-07-12 Sankyo Kk Game machine
JPH0670274U (en) * 1993-03-11 1994-09-30 株式会社日立テレコムテクノロジー Printed board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078167U (en) * 1983-11-04 1985-05-31 株式会社東芝 printed wiring board
JPS61199688A (en) * 1985-02-28 1986-09-04 株式会社東芝 Printed wiring board
JPH04255289A (en) * 1991-02-07 1992-09-10 Nec Corp Metal base wiring board
JPH0661674A (en) * 1991-08-19 1994-03-04 Nippon Telegr & Teleph Corp <Ntt> Mounting structure for electronic device
JPH06190121A (en) * 1992-12-28 1994-07-12 Sankyo Kk Game machine
JPH0670274U (en) * 1993-03-11 1994-09-30 株式会社日立テレコムテクノロジー Printed board

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8086100B2 (en) 2001-02-05 2011-12-27 Finisar Corporation Optoelectronic transceiver with digital diagnostics
US8515284B2 (en) 2001-02-05 2013-08-20 Finisar Corporation Optoelectronic transceiver with multiple flag values for a respective operating condition
US8849123B2 (en) 2001-02-05 2014-09-30 Finisar Corporation Method of monitoring an optoelectronic transceiver with multiple flag values for a respective operating condition
US9184850B2 (en) 2001-02-05 2015-11-10 Finisar Corporation Method of monitoring an optoelectronic transceiver with multiple flag values for a respective operating condition
US9577759B2 (en) 2001-02-05 2017-02-21 Finisar Corporation Method of monitoring an optoelectronic transceiver with multiple flag values for a respective operating condition
US10291324B2 (en) 2001-02-05 2019-05-14 Finisar Corporation Method of monitoring an optoelectronic transceiver with multiple flag values for a respective operating condition
JP2007535242A (en) * 2004-04-22 2007-11-29 フィニサー コーポレイション Optical transceiver and host adapter having memory mapped monitoring circuit
JP4657291B2 (en) * 2004-04-22 2011-03-23 フィニサー コーポレイション Optical transceiver and host adapter having memory mapped monitoring circuit
JP2006041428A (en) * 2004-07-30 2006-02-09 Heiwa Corp Circuit board, game machine, and drum-rotating type game machine
US8159956B2 (en) 2008-07-01 2012-04-17 Finisar Corporation Diagnostics for serial communication busses
US8406142B2 (en) 2008-07-01 2013-03-26 Finisar Corporation Diagnostics for a serial communications device
JP2013252271A (en) * 2012-06-07 2013-12-19 Newgin Co Ltd Game machine

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