JP2002171041A - Printed wiring board, electronic component and method for manufacturing them - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board and a chip-type electronic component, wherein high reliability and stable quality of end surface terminal portions formed on end surfaces of the printed wiring board and the chip-type electronic component are realized, peeling and imperfect sticking will not be generated in a conductor film, and miniaturization, high density and high quality of the end surface terminal portions are realized. SOLUTION: In a printed wiring board 30 and its end surface terminal portion, a smooth lower surface terminal portion is made the end surface terminal portion. The terminal portion consists of a penetrating connection hole, having plating conductor which electrically connects upper surface conductor with lower surface conductor of the printed wiring board, a filler with which the inside of the penetrating connection hole is filled, and a plating conductor for covering the end surface of a lower surface of the filler. A chip component to be subjected to surface mounting, consists of the printed wiring board 30, an electronic component element 50 which is connected with the upper surface conductor of the printed wiring board by using a bonding wire or a bump, and a sealing member 28 for covering the electronic component element and a connection component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board on which electronic components and chip-type electronic parts are mounted at a high density, an electronic component using the printed wiring board, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In general, a method of forming an end terminal portion on a printed wiring board and mounting a semiconductor element or an electronic component element on the printed wiring board as a base material to form a chip-type electronic component, or printing once. There is a method of mounting a module substrate having chip-type electronic components mounted on a wiring board at high density on a motherboard. FIG. 6 (a) is a plan view for explaining that a plated through-hole (through connection hole) of a conventional printed wiring board is used as an end face terminal, and FIG. 6 (b) is a cut end face terminal. It is a perspective view of the principal part which shows the state of a part. FIG.
FIG. 5 is a plan view of a main part for describing a state in which a chip-type electronic component is mounted on an end face terminal manufactured by a conventional method of manufacturing a printed wiring board. FIG. 8A is a side view for explaining a mounting area of a conventional chip-type electronic component.
FIG. 2B is a side view for explaining the Manhattan phenomenon in a conventional chip-type electronic component.

A conventional printed wiring board plating method
When the hole (through connection hole) is used as the end face terminal, FIG.
As shown in (a), the through-hole 7 having the plated conductor 15 generally has lands 4 on the upper surface conductor and the lower surface conductor. An end terminal portion is formed by cutting at a cutting line 3 substantially at the center of the through connection hole 7 by pressing or router processing. Then, as shown in FIG. 6B, the end face terminal portion 34 after cutting the through connection hole 7 becomes the upper surface terminal portion 31 which is the pattern conductor (the upper surface land 4) on the upper surface.
And a side surface terminal portion 32 having a U-shaped through groove 7a made of a plated conductor 15 for connecting the pattern conductors on the upper and lower surfaces of the printed wiring board 2 and a lower surface terminal portion 33 which is a lower surface pattern conductor (lower land 4). Is done.

A state in which a chip type electronic component is mounted on the end face terminal portion shown in FIG. 6 manufactured by a conventional method for manufacturing a printed wiring board will be described with reference to FIG. As shown in FIG. 7, since the chip-type electronic component 8 is mounted close to the recessed through groove 7a after the through connection hole 7 has been cut, the through groove 7
A surface land 14 for mounting the chip-type electronic component 8 is provided separately from the upper surface land 4 (the upper surface terminal). For this reason, the distance L1 from the end surface of the printed wiring board 2 to the end surface of the chip-type electronic component 8 is increased by the height ΔL of the land portion 14 with the surface, and as a result, the outer dimensions of the printed wiring board 2 are increased. Also, the cut-through groove 7a after cutting
In order for the through hole 7a to function as an end face electrode, the width C of the upper surface land 4 (conductor) of the through groove 7a cannot be unnecessarily reduced, and the upper surface land diameter D1 of the through groove 7a becomes equal to the through connection hole diameter (through hole groove). Diameter) by 2C.

As shown in FIG. 8A, in a conventional chip-type electronic component 8, a left pole terminal 6 and a right pole terminal 5 are provided.
Has a structure in which lower surface terminal portions 6b and 5b and side surface terminal portions 6a and 5a are integrated and provided on both side end surfaces of the chip-type electronic component 8. Therefore, a large amount of the solder 43a, 43b adheres to the side surface terminal portions 6a, 6b of these bent portions, so that the land portions 41a, 41b of the mother board 40 extend outside both end surfaces of the conventional chip-type electronic component 8. There is a need to. Therefore, the printed wiring board 2 and the motherboard 4
0, the length L4 for mounting the chip-type electronic component 8
Since the chip-type electronic component 8 must be formed to be longer than the entire length, the area of the motherboard 40 required for mounting increases, and there is also a problem that the mounting density decreases.

Further, as shown in FIG. 8B, the left terminal 6 and the right terminal 5 are displaced with respect to the lands 41a and 41b, so that the conventional chip-type electronic component 8 is And when mounted on the motherboard 40, the solder 43a adhered on the left and right land portions 41a and 41b.
Is larger than the amount of the solder 43b. Therefore, the adhesive force (attraction force) of one solder 43a becomes larger than the adhesive force of the other solder 43b, and the chip-type electronic component 8 is easily rotated counterclockwise in the drawing due to the different adhesive force. Therefore, as shown by a two-dot chain line in the figure, the other end side of the conventional chip-type electronic component 8 rises from the printed wiring board 2 or the motherboard 40, which causes a so-called Manhattan phenomenon, and there is also a problem that a mounting failure occurs. .

[0007]

However, in the above-mentioned conventional printed wiring board 2, as shown in FIG. 6A, the inside of the through connection hole 7 is in a hollow state. Therefore, when cutting by cutting or router processing at the cutting line 3, a part of the metal portion (plated conductor 15) to be cut is elastically deformed and peels off to become a metal burr, which enters the through connection hole 7 and becomes a metal burr. May remain. Therefore, the through groove 7a is formed by the metal burr.
Is easily peeled from the base material of the printed wiring board 2, the adhesion strength becomes insufficient, and the through groove 7a is formed.
However, there is a problem that the reliability decreases due to an increase in the conductor resistance of the semiconductor device.

Further, by cutting a substantially central portion of the through connection hole 7 in which the inside of the hole is hollow by press working or router working, the upper surface land 4 of the recessed through groove 7a dented inside from the end face is formed. It becomes difficult to mount the chip-type electronic component 8 directly on the top, and as shown in FIG. 7, a land portion 14 with a surface for mounting separately from the land portion 4 of the through groove 7a is provided separately. For this reason, the component mounting density is deteriorated, and as a result, there is a problem that the outer dimensions of the printed wiring board 2 are increased. Therefore, the printed wiring board is downsized, and the printed wiring board is used as a base material for semiconductor elements and electronic component elements. This hindered the miniaturization of chip-type electronic components to be mounted. Further, since the inside of the through groove 7a is in a hollow state, chip-type electronic components and electronic component elements can be molded.
When sealing with a mold resin or the like, the inside of the through connection hole 7 or the through groove 7a
From the resin, which has hindered reliability.

The present invention has been made in view of such a problem, and a first object is to improve reliability and stabilize connection reliability. A second object is to reduce the size of printed wiring boards and chip-type electronic components and to mount electronic components with high density. A third object is to produce efficiently and improve productivity.

[0010]

In order to achieve this object, the invention according to claim 1 is directed to a printed wiring board and an end face terminal provided at an end face of a slit hole for dividing the printed wiring board into a plurality of printed wiring boards. A through connection hole having a plated conductor for conducting the upper surface conductor and the lower surface conductor of the printed wiring board, a filler filled in the through connection hole, and a plated conductor covering an end surface of the lower surface of the filler, This is a printed wiring board having a smooth lower surface terminal portion composed of an end surface terminal portion. Therefore, in order to mount the chip-type electronic component on the land with the surface using the upper surface conductor installed on the end face of the printed wiring board as the upper surface terminal, and only the lower surface terminal when the printed wiring board is mounted on the land of the motherboard. Is an end face terminal portion. In addition, as a function of connecting the pattern conductors on the upper and lower surfaces of the printed wiring board, the conventional U-shaped through groove is not used as a side terminal portion, and the filler filled in the through connection hole and the end surface of the lower surface of the filler are provided. The lower surface land 4 of the non-penetrating connection hole formed of a plated conductor covering the printed wiring board is used as an end surface terminal portion in contact with the end surface of the printed wiring board.

According to a second aspect of the present invention, in the lower surface terminal portions arranged in the individual printed wiring boards divided in the first aspect, the respective areas of the pair of lower surface terminal portions symmetrical with respect to each other are equal. It is a printed wiring board. In other words, when soldering small printed wiring boards or chip-type electronic components, the installation of the side terminals is no longer required, and the lower terminals that have the same area on the left, right, front and rear eliminate the Manhattan phenomenon, improving quality and improving connection reliability. Can be planned.

According to a third aspect of the present invention, in a chip component to be mounted on a surface, the printed wiring board according to the first or second aspect is connected to the upper surface conductor of the printed wiring board by a bonding wire or a bump. Electronic component element, and a sealing material covering the electronic component element and the connection component,
Chip-type electronic components.

According to a fourth aspect of the present invention, there is provided a chip component to be mounted on a surface, the base for mounting an electronic component element.
The printed wiring board according to claim 1 or 2 is used as a material, and an electronic component element is connected to an upper surface conductor of the printed wiring board with a bonding wire or a bump, and after covering with a sealing material, This is a method for manufacturing an electronic component in which a printed wiring board is divided and cut into chip-type electronic components. Therefore, the electronic components are connected to the large printed wiring board with bonding wires or bumps, covered with a sealing resin, and then the individual printed wiring boards are divided and cut into chip-type electronic components. High-density mounting of electronic components and improvement in productivity can be achieved.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a process chart for explaining a first embodiment of a method for manufacturing a printed wiring board according to the present invention, and FIG.
FIG. 2A is a process chart for explaining a second embodiment of the method for manufacturing a printed wiring board, and FIG. 2B is a cross-sectional view corresponding to the process. FIG. 3 is a plan view of a printed wiring board according to the present invention on which chip-type electronic components are mounted. FIG. 4 is a side view for explaining a mounted state of the chip-type electronic component according to the present invention, and FIG. 5 is a cross-sectional view for explaining the chip-type electronic component according to the present invention.

In FIG. 1A, a double-sided copper-clad laminate generally denoted by reference numeral 11 is provided with copper foils 13 attached to both sides of an insulating resin substrate 12. Note that the insulating resin substrate 12 may be a thermosetting resin or a thermoplastic resin. As shown in FIG. 1B, this double-sided copper-clad laminate 11
After drilling through holes 3 and 3 with a drill, as shown in FIG. 3 (c), panel plating is performed by a first copper plating process to form a copper plated conductor 15 on the copper foil 13 and a through hole. Copper plated conductor 15 on the hole walls in 3 and 3
Is formed, and the through connection holes 7 are formed.

As shown in FIG. 1D, upper surface terminal portions 17a, 17b and 17c which are electrically connected to each other through the through connection hole 7 around the through connection hole 7 by etching.
And the lower surface terminal portions 18a and 18b are formed. Next, as shown in FIG. 3E, the non-through connection holes 16 are formed by filling the through connection holes 7 with an insulating resin 9 which is a resin paste as a filler. Thereafter, a second plating process is performed to form a plated conductor covering the upper and lower end surfaces of the insulating resin 9 of the filler in the non-penetrating connection hole 16 and the upper surface terminal portions 17a, as shown in FIG. 17b, 17c and lower surface terminal portions 18a, 1
8b, a copper plating and a film of nickel, gold or the like are formed to form a right-electrode conductor layer 21, a left-electrode conductor layer 22, right-electrode terminals 23, and left-electrode terminals 24, respectively. To form Therefore, the end surfaces of the upper and lower surfaces of the insulating resin 9 in the through-hole 7 are connected to the conductor layers 21 for the right electrode.
, Right pole terminal 23 and left pole conductor layer 22 and left pole terminal 24
Thus, the upper and lower portions of the non-through connection hole 16 are covered. That is, the non-penetrating connection holes 16 for electrically connecting the conductor layers on the upper and lower surfaces of the printed wiring board are provided in the area of the land portion with the surface of the right pole terminal 23 and the left pole terminal 24.

FIG. 2 shows a second embodiment of the method for manufacturing a printed wiring board according to the present invention, and FIG.
FIGS. 4A and 4B are process diagrams for explaining the method for manufacturing a printed wiring board according to the embodiment, and FIG. 3B is a plan view for explaining the features of the process. In the second embodiment, as shown in FIG. 2B, a large board is formed by forming a circuit conductor in step (VI) of FIG. Printed wiring board 3
In order to divide a large number of individual printed wiring boards 30 from 01, four slits 4 forming a substantially rectangular
5 is provided.

Next, in the electronic component mounting step of step (VIII), the chip type electronic components 8 are mounted on the land portions 14 of the individual printed wiring boards 30 of the printed wiring board 301 of the large board.
After mounting and mounting (not shown), the printed wiring board 301 of the large board is divided and cut into individual printed wiring boards 30 on which chip-type electronic components are mounted and mounted in step (X). It is a manufacturing method. The second embodiment is different from the first embodiment in that four uncut portions 46 having a small area are provided between the four slit holes 45. It is in. Therefore, in the state where the printed wiring board 30 is not divided from the large-sized printed wiring board 301 through the uncut portions 46, the printed wiring board 301 is mounted on the entire large-sized printed wiring board 301 in the mounting process of the electronic component in the step (VIII). This is a method of manufacturing a chip-type electronic component with high mounting efficiency in which the chip-type electronic component is mounted.

When a chip-type electronic component is mounted on a printed wiring board based on FIG. 3, in the printed wiring board 30 of the present invention, the upper surface terminal portion 31 is used as the surface land portion 14 and the area of the surface land portion 14 is set. A non-through connection hole 16 for electrically connecting the conductor layers on the upper and lower surfaces of the printed wiring board is buried therein, and the chip-type electronic component 8 is mounted on the land portion 14 covering the non-through connection hole 16. As a result, the end surface of the printed wiring board 30 and the chip-type electronic component 8 are
Can be reduced in distance L2 from the outer end surface. Further, the diameter of the non-penetrating connection hole 16 can be reduced because it is not used as a side terminal.

Therefore, not only can the external dimensions of the printed wiring board 30 be reduced, but also the chip-type electronic component 8 on which semiconductor elements and electronic component elements are mounted using the printed wiring board 30 as a base material. High density and miniaturization are possible. That is, the land width C of the through connection hole 7 described in the related art in FIG. 7 is not required, and the upper surface terminal portion 31 and the land portion 14 with the surface can be set so as to overlap with each other. The mounting pitch l2 of the chip-type electronic components 8, 8
Can be set small, so that the printed wiring board 30
And miniaturization of chip-type electronic components.

FIG. 4 is a side view for explaining a mounting area of the chip-type electronic component according to the embodiment of the present invention. In the figure, a chip-type electronic component 8 of the present invention is
3 and the left pole terminal 24 are provided only on the lower surface of the chip-type electronic component 8. Therefore, mounting the chip-type electronic component 8 on the printed wiring board 30 or the land portion 41 of the motherboard 40 is not performed via the side surface terminal portion, and electrical connection between the upper surface terminal portion and the non-penetrating connection hole is achieved. Only the lower surface terminal portion is a terminal terminal portion. Land portions 41a, 41 of printed wiring board 30 or motherboard 40
When the right pole terminal 23 and the left pole terminal 24 are soldered to b, the solder 43a, 43b does not leak from both side surfaces of the chip-type electronic component 8. There is no possibility that the so-called left and right solder amounts are equal and the Manhattan phenomenon is caused to cause mounting failure.

Therefore, the lengths B1 and B2 of the lands 41a and 41b are determined by the right pole terminal 23 and the left pole terminal 24.
Of the land portions 41a,
It is not necessary to expose and extend 41b from both end surfaces of the chip-type electronic component 8 in the left-right direction. Therefore, the length 14 for mounting the chip-type electronic component 8 on the printed wiring board 30 or the motherboard 40 can be formed to be the same as the entire length of the chip-type electronic component 8, so that the mounting area is minimized and the mounting density is improved. I do. As a result of comparing the mounting area with a conventional product, it was confirmed that the mounting area was reduced by 60% or more.

FIG. 5 is a sectional view of a chip-type electronic component showing an embodiment of the present invention. In the embodiment of the chip-type electronic component, an example of an electronic component having three terminals of a transistor and a diode is shown as the chip-type electronic component. Right pole terminal), collector terminal 52
(Left pole terminal) is protruded, and a base terminal portion 53 (lower surface terminal portion) is provided on a part of the outer peripheral portion. On the upper surface of the printed wiring board 30, three conductor layers 55,
56, 57 are formed, and three terminals 58, 59, 60 are formed on the lower surface of the printed wiring board 30 as lower surface terminal portions. These three conductor layers 55, 56, 57,
The three terminals 58, 59, 60 are electrically connected to the three terminals 58, 59, 60 via the non-through connection holes 16, 16, 16, in which the insulating resin 9 is filled in the through connection holes formed in the printed wiring board 30. .

The base terminal portion 53 of the component element 50 is placed on the conductor layer 57 of the printed wiring board 30 and is electrically connected by a conductive adhesive 47 (for example, solder paste), thereby forming a base. The terminal portion 53 and the terminal 60 are electrically connected through the non-through connection hole 16. Also, the conductive adhesive 47 may be replaced by a BGA (ball grid array) bump. Further, on the conductor layers 55 and 56 (land portions) of the printed wiring board 30 and the component elements 5
The emitter terminal portion 51 and the collector terminal portion 52 are electrically connected to the emitter terminal portion 51 and the collector terminal portion 52 from both end surfaces of the upper surface of the reference numeral 0 via bonding wires 27, respectively. The electronic component element 50 is connected with a conductive adhesive 47 such as a bonding wire 27 or a bump and then covered with a sealing resin 28 to obtain a small chip-type electronic component.

That is, in the chip type electronic component, the printed wiring board 3 is mounted on the base material on which the electronic component element is mounted.
Then, the electronic component element 50 is connected to the land portions (the conductor layers 55 and 56) of the upper surface conductor of the printed wiring board 30 by using bonding wires 27 or bumps. Next, after a conductive adhesive 47 such as an electronic component element 50, a bonding wire 27 or a bump is covered with a sealing resin 28,
This is a method of manufacturing an electronic component in which the printed wiring board 30 on which the electronic component element 50 is mounted is divided and cut into chip-type electronic components. Therefore, after the electronic component elements 50 and the like are covered with the sealing resin 28 on the large printed wiring board, the individual printed wiring boards 30 are divided and cut into chip-shaped electronic components. Density mounting and productivity can be improved. Further, when the chip-type electronic component 8 is sealed with a sealing resin 28 such as a mold resin, the non-through connection hole 16 filled with the insulating resin causes resin leakage from the inside of the hole, which impairs reliability. Nothing.

[0026]

As described above, according to the first and second aspects of the present invention, the filler filled in the through-hole having the plated conductor and the upper and lower portions of the filler are provided. The smooth bottom end surface consisting of a plated conductor that covers the end surface of the surface not only reduces the size of the printed wiring board, but also enables high-density mounting of electronic components to achieve high quality and high connection reliability. Can be planned.

According to the first, second, third, and fourth aspects of the present invention, not only the operability is improved, but also the cost is reduced, and furthermore, the upper and lower portions of the printed wiring board are reduced. Since the connection reliability of the non-through connection hole for electrically connecting the conductor layer on the surface of the part is high, the quality is stable.

Further, according to the third and fourth aspects of the present invention, it is possible to reduce the size and the mounting density of the chip-type electronic component,
A chip-type electronic component having high connection reliability and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a process chart for explaining a method for manufacturing a printed wiring board according to the present invention.

2A and 2B show a second embodiment of the printed wiring board according to the present invention, and FIG. 2A is a process diagram for explaining a method of manufacturing the printed wiring board according to the second embodiment; FIG. 2B is a plan view for explaining the features of the process.

FIG. 3 is a plan view of a main part for describing a state in which electronic components are mounted on a printed wiring board manufactured by the method for manufacturing a printed wiring board according to the present invention.

FIG. 4 is a side view for explaining a mounted state of a chip-type electronic component according to the present invention.

FIG. 5 is a cross-sectional view illustrating a chip-type electronic component according to the present invention.

FIG. 6 (a) is a plan view illustrating an end face terminal portion manufactured by a conventional method for manufacturing a printed wiring board, and FIG. 6 (b) is an essential part showing a state of the end face terminal portion after cutting. It is a perspective view.

FIG. 7 is a plan view of a main part for describing a state in which electronic components are mounted on a printed wiring board manufactured by a conventional method for manufacturing a printed wiring board.

8A is a side view for explaining a mounting area of a conventional chip type electronic component, and FIG. 8B is a side view for explaining a Manhattan phenomenon in the conventional chip type electronic component. is there.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 4 ... Land part, 7 ... Through connection hole, 8 ... Chip type electronic component, 14 ... Land part with surface, 15 ... Plating conductor, 16 ... Non-through connection hole, 30 ... Printed wiring board, 34 ... End terminal part, 40 ... mother board, 45 ... slit hole, 46 ... uncut part, 50 ... electronic component element.

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[Procedure amendment]

[Submission date] June 11, 2001 (2001.6.1)
1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

[0010]

In order to achieve this object, the invention according to claim 1 is directed to an end face terminal portion provided on an end face of a printed wiring board or an end face of a hole for dividing the printed wiring board into a plurality of pieces. A through connection hole having a plated conductor for conducting the upper surface conductor and the lower surface conductor of the printed wiring board, a filler filled in the through connection hole, and a plated conductor covering an end surface of the lower surface of the filler. And a printed wiring board having a smooth lower surface terminal portion made of an end surface terminal portion. Therefore, as a function of connecting the pattern conductors on the upper and lower surfaces of the printed wiring board, the conventional U-shaped through groove is not used as the side terminal portion, but is provided on the land portion with the surface installed on the upper end surface of the printed wiring board and on the lower end surface. Non-penetrating connection hole that conducts to the end face terminal part to be buried is buried in the area of the surface land part and the lower surface terminal part, and the surface of the filler filled in the through connection hole is covered with the plated conductor. And a printed wiring board.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

According to a third aspect of the present invention, in a chip component to be mounted on a surface, the printed wiring board according to the first or second aspect, and an electronic component element mounted on a land portion with an upper surface of the printed wiring board. An electronic component, a connection component such as a bonding wire or a bump or a conductive adhesive for connecting the printed wiring board to the electronic component or the electronic component, and a sealing material covering the electronic component and the electronic component and the connection component When,
Chip-type electronic components.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

According to a fourth aspect of the present invention, there is provided a process of mounting an electronic component or an electronic component on the land portion with an upper surface of the printed wiring board according to the first or second aspect of the present invention. The present invention is a method for manufacturing a chip-type electronic component, comprising: a step of connecting components; a step of covering with a sealing material; and a step of dividing and cutting the printed wiring board into a chip-type electronic component. Therefore, the electronic components are connected to the large printed wiring board with bonding wires or bumps, covered with a sealing resin, and then the individual printed wiring boards are divided and cut into chip-type electronic components. High-density mounting of electronic components and improvement in productivity can be achieved.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/02 H05K 1/02 J H01G 1/14 VF term (Reference) 5E032 BB01 CA02 CC03 CC04 CC11 CC16 CC18 DA11 5E082 AA01 BC38 BC39 GG10 GG26 GG28 HH25 HH27 HH47 JJ12 JJ15 JJ21 JJ25 JJ26 JJ27 KK01 KK10 LL35 5E317 AA01 AA22 CC31 CC51 CD27 CD34 GG11 GG14 5E338 AA02 BB02 BB13 BB25 BB13 BB25 BB13 BB25 BB25

Claims (4)

[Claims] 1. A through-hole having a plated conductor for conducting between an upper surface conductor and a lower surface conductor of a printed wiring board at an end surface terminal portion provided at an end surface of a printed circuit board or a slit hole for dividing the printed wiring board into a plurality of printed wiring boards. Printed wiring characterized in that a smooth lower surface terminal portion composed of a connection hole, a filler filled in the through connection hole, and a plated conductor covering an end surface of a lower surface of the filler is an end terminal portion. Board. 2. The printed wiring board according to claim 1, wherein the pair of lower surface terminal portions arranged in each of the divided lower surface terminal portions have the same area. . 3. A chip component to be mounted on a surface, comprising: the printed wiring board according to claim 1; and an electronic component element connected to an upper surface conductor of the printed wiring board by a bonding wire or a bump. A chip-type electronic component comprising: the electronic component element; and a sealing material covering the connection component. 4. A chip component to be mounted on a surface, wherein the printed wiring board according to claim 1 or 2 is used as a base material for mounting an electronic component element, and an upper surface conductor of the printed wiring board is used. A method of manufacturing an electronic component in which electronic component elements are connected with bonding wires or bumps or solder paste, covered with a sealing material, and then the printed wiring board is divided and cut into chip-type electronic components.