JP2002170458A - Chip part storing structure for dome switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip part storing structure for a dome switch where a chip part can be mounted on circuit body. SOLUTION: In the device, a storing part 34 for the chip part 38 which is mounted on the side of a contact point 37 of FPC 24 is formed on a spacer sheet 23 of the dome switch 21 provided with a sheet 22, a spacer sheet 23, the FPC 24 as the circuit body and an adhesive sheet 25. Furthermore, an embossed part 28 for the chip part 38 is formed on the surface sheet 22 as required.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dome switch provided with a front sheet having a dome-shaped projection, a spacer sheet, a circuit body and an adhesive sheet, for accommodating a chip component mounted on the circuit body.

[0002]

2. Description of the Related Art FIG. 7 is an exploded perspective view of a conventional polydome switch (dome switch), FIG. 8 is a cross-sectional view of a main part before a switch is operated, and FIG. 9 is a cross-sectional view of a main part when a switch is operated. . In FIG. 7, a conventional polydome switch (dome switch) 1 used for household appliances includes a front sheet 2, a spacer sheet 3, an FPC 4, and an adhesive sheet 5. And is fixed to a plate 6 as a member to be attached.

The front sheet 2 has a plurality of dome-shaped protrusions 7 projecting outward and reversible toward the inner surface.
Are formed. An electrode 8 (see FIG. 8) for the FPC 4 is provided on the inner surface of the protrusion 7.

[0004] The spacer sheet 3 is a thin sheet member, and is provided to prevent deformation of the front sheet 2. In addition, the spacer sheet 3 is provided with an adhesive layer on the front and back surfaces thereof, so that the front sheet 2 and the FPC 4 can be fixed. A plurality of through holes 9 are formed in the spacer sheet 3 at positions corresponding to the protrusions 7. A slit-shaped air escape portion 10 is formed between the through holes 9.

[0005] The FPC 4 is a circuit body having a plurality of circuits arranged in a desired pattern. On the spacer sheet 3 side, the contact 1 with which the electrode 8 (see FIG. 8) contacts is provided.
1 is provided in plurality. Further, the FPC 4 is adhered and fixed to the pressure-sensitive adhesive sheet 5. The adhesive sheet 5 also has a function as a reinforcing member.

In the above configuration, as shown in FIG. 9, when the protruding portion 7 is pressed down and the switch is operated as shown in FIG. 9, the protruding portion 7 is turned toward the FPC 4 (at this time, a click feeling is generated) and the electrode is turned on. 8 acts so that the above-mentioned circuit becomes conductive by contacting the contact 11. Note that the protrusion 7 is F
When inverted toward the PC 4, the air existing on the inner surface side of the protrusion 7 is released to the air release unit 10 through the through hole 9.

[0007]

By the way, in the conventional polydome switch 1, the spacer sheet 3 and the F
The structure was such that the PC 4 and the PC 4 were in surface contact with each other.
Therefore, when the chip components are mounted on the FPC 4 and assembly is attempted, there is a problem that the height of the chip components influences and the spacer sheet 3 is lifted and deformed with respect to the FPC 4. Incidentally, if the spacer sheet 3 is lifted and deformed, it naturally affects the function of the switch.

The present invention has been made in view of the above circumstances, and has as its object to provide a chip component storage structure in a dome switch that can mount a chip component on a circuit body.

[0009]

According to a first aspect of the present invention, there is provided a dome switch having a chip component storage structure which protrudes outwardly and is reversible toward the inner side. A surface sheet having a dome-shaped protrusion provided with an electrode, a circuit body having a contact with which the electrode of the protrusion turned over on the inner surface side has a contact, and between the front sheet and the circuit body. One or more spacer sheets interposed and formed with through holes for ensuring contact between the electrodes and the contacts, and having a circuit body mounting surface for the circuit body on one side and an adhesive fixing surface for a member to be mounted. A chip component storage structure in a dome switch comprising: It is characterized in that the formation of the spacer sheet side storage unit to the chip component was.

According to a second aspect of the present invention, there is provided a dome switch having a chip component housing structure according to the second aspect, wherein the dome switch protrudes outward and is reversible inward and has an electrode provided on the inner surface. A surface sheet having a protruding portion having a shape, a circuit body having a contact with which the electrode of the protruding portion turned to the inner side contacts, and the electrode interposed between the surface sheet and the circuit body. One or more spacer sheets formed with through holes for ensuring contact with the contacts, and an adhesive sheet having a circuit body mounting surface for the circuit body on one side and an adhesive fixing surface for a member to be mounted on the other side. A chip component storage structure in a dome switch comprising: a chip component mounted on the adhesive sheet on the side opposite to the contact of the circuit body. A storage portion for the adhesive sheet is formed.

According to a third aspect of the present invention, there is provided a dome switch having a chip component housing structure according to the third aspect of the present invention, wherein the dome switch protrudes outward and is reversible inward and has an electrode provided on the inner surface. A surface sheet having a protruding portion having a shape, a circuit body having a contact with which the electrode of the protruding portion turned to the inner side contacts, and the electrode interposed between the surface sheet and the circuit body. One or more spacer sheets formed with through holes for ensuring contact with the contacts, and an adhesive sheet having a circuit body mounting surface for the circuit body on one side and an adhesive fixing surface for a member to be mounted on the other side. A chip component storage structure in a dome switch comprising: a chip component mounted on the spacer sheet on the contact side of the circuit body. In addition to forming a spacer sheet-side storage part for the chip part, the pressure-sensitive adhesive sheet-side storage part for the chip component mounted on the opposite side of the contact of the circuit body is formed in the adhesive sheet.

According to a fourth aspect of the present invention, there is provided a dome switch according to the first or third aspect.
In the chip component storage structure of the dome switch described in (1), an embossed portion for the chip component is formed on the front sheet in accordance with the position of the spacer sheet side storage portion.

According to a fifth aspect of the present invention, there is provided a chip component storage structure in the dome switch according to the second or third aspect.
In the chip component storage structure of the dome switch described in (1), a concave portion for the chip component is formed in the attached member in accordance with the position of the adhesive sheet side storage portion.

According to the first aspect of the present invention,
In assembling the dome switch, the chip component mounted on the contact side of the circuit body is stored in the spacer sheet-side storage section of the spacer sheet. By forming the spacer sheet side storage portion in the spacer sheet, it becomes possible to mount the chip component on the contact side of the circuit body.

According to the second aspect of the present invention,
In assembling the dome switch, the chip component mounted on the opposite side of the contact of the circuit body is stored in the adhesive sheet-side storage section of the adhesive sheet. By forming the adhesive sheet side storage portion on the adhesive sheet, it becomes possible to mount the chip component on the opposite side of the contact point of the circuit body.

According to the third aspect of the present invention,
In assembling the dome switch, the chip component mounted on the contact side of the circuit body is stored in the spacer sheet-side storage section of the spacer sheet. The chip component mounted on the opposite side of the contact of the circuit body is stored in the pressure-sensitive adhesive sheet-side storage portion of the pressure-sensitive adhesive sheet. By forming the spacer sheet side storage portion in the spacer sheet, it becomes possible to mount the chip component on the contact side of the circuit body. Further, by forming the pressure-sensitive adhesive sheet-side storage portion on the pressure-sensitive adhesive sheet, it becomes possible to mount the chip component on the opposite side of the contact point of the circuit body.

According to the present invention as set forth in claim 4,
When the height of the chip component mounted on the contact side of the circuit body is high, the tip of the chip component is stored in the raised portion of the front sheet. By forming the raised part on the front sheet,
A tall chip component can be mounted on the contact side of the circuit body.

According to the present invention as set forth in claim 5,
When the height of the chip component mounted on the opposite side of the contact of the circuit body is high, the tip of the chip component is housed in the recess of the member to be mounted. By forming the concave portion in the member to be mounted, it is possible to mount a high-height chip component on the opposite side of the contact point of the circuit body.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing a first embodiment of a chip component storage structure in a dome switch according to the present invention. FIG. 2 is an enlarged cross-sectional view of the chip component storage portion of FIG.

In FIG. 1, a polydome switch indicated by reference numeral 21 (corresponding to a dome switch described in the claims) includes a front sheet 22 and a spacer sheet 2.
3, an FPC 24 and an adhesive sheet 25. In addition, the polydome switch 21 includes the adhesive sheet 2
Plate 26 as an example of a member to be attached via 5
Fixed to. In the first embodiment of the present invention, a chip component storage structure is formed on the front sheet 22 and the spacer sheet 23.

The front sheet 22 has a plurality of protrusions 27.
And an embossed portion 28 that constitutes the chip component storage structure.
And Each protruding portion 27 is formed in a dome shape protruding to the outer surface side and reversible to the inner surface side,
An electrode 29 (see FIG. 2) for the FPC 24 is provided on the inner surface of each protrusion 27. Electrode 29
(See FIG. 2) is provided on the top of the inner surface.

The protruding portion 28 is formed in a rectangular dome shape (not limited to this shape) protruding to the outer surface side, like the protruding portion 27. Also,
The raised portion 28 is formed in accordance with a mounting position of a chip component 38 described later. Further, the raised portion 28
It is formed so that the tip of a chip component 38 described later can be stored. Note that the raised portion 28 does not need to be reversible, unlike the protruding portion 27.

The table sheet 22 will be described in more detail. The table sheet 22 is a sheet made of a synthetic resin made of, for example, polyethylene terephthalate (PET), and is hot pressed (a pressure is applied from the inner surface to the outer surface). And a plurality of dome-shaped protruding portions 27 formed by applying the above-mentioned method, and a rectangular dome-shaped raised portion 28. The electrode 29 provided on the inner surface top of each protrusion 27 is formed of carbon or the like (in the case of the electrode 29 made of carbon, it is provided by printing).

The spacer sheet 23 includes an upper spacer sheet 30 and lower spacer sheets 31 and 31. That is, the spacer sheet 23
It is composed of three layers (the spacer sheet 23 does not need to be composed of three layers. It may be one layer, two layers, or four or more layers. Also has the advantage of being able to have flexibility). Further, the spacer sheet 23 is a
This serves as a member for preventing deformation of the.

The upper spacer sheet 30 is a sheet member made of a synthetic resin made of, for example, polyethylene terephthalate (PET). The upper spacer sheet 30 is formed to be thinner than the lower spacer sheets 31. That is, it functions as a sheet member for fine adjustment for adjusting the thickness of the spacer sheet 23. Further, the upper spacer sheet 30 has an adhesive layer (not shown) on the front and back surfaces, so that the front sheet 22 and the lower spacer sheet 31 can be fixed to the front and back surfaces, respectively.

The upper spacer sheet 30 will be described in more detail.
It has a plurality of through holes 32, a plurality of air escape portions 33, and a storage portion 34 (corresponding to a spacer sheet side storage portion described in the claims) constituting the chip component storage structure. Each through hole 32 is formed between the electrode 29 of the protrusion 27 and the F
It is a portion for ensuring contact with a contact 37 described later of the PC 24, and is formed to penetrate each corresponding to the position of the corresponding protruding portion 27. Each through-hole 32 is formed to have a diameter larger than or equal to the diameter of the protruding portion 27 (see FIG. 2).

Each of the air release portions 33 is a portion for allowing the air existing on the inner surface side to be appropriately released when each of the protrusions 27 is turned over. It is formed between the through holes 32 arranged in the longitudinal direction. Each air release portion 33 is formed in a slit shape and communicates with the corresponding through hole 32.

The storage section 34 is provided with a chip component 38 described later.
Is formed in a rectangular shape depending on the mounting position.

The lower spacer sheets 31, 31 are sheet members made of, for example, polyethylene terephthalate (PET) and made of a synthetic resin, and have an adhesive layer (not shown) on the front and back surfaces. The upper spacer sheet 30 and the FPC 24 can be respectively fixed to the front and back surfaces. Further, the lower spacer sheets 31, 31 have a plurality of through holes 32, a plurality of air escape portions 33, and a storage portion 34 having the same number, shape, position, and function as those of the upper spacer sheet 30 (upper spacers). The same reference numerals as those of the sheet 30 are used, and the description thereof is omitted.
It is assumed that the diameter of each through hole 32 of 1 and 31 can be formed so as to be larger or equal to the diameter of each through hole 32 of the upper spacer sheet 30. If the diameter of each through hole 32 of the lower spacer sheets 31 and 31 is increased, a large space for air release can be taken, and it is needless to say that the click feeling at the time of switch operation is improved.)

The FPC 24 (FPC: Flexible Printed Circuit) is a circuit body having a plurality of circuits 35 arranged in a desired pattern. Air release holes 36, 36 communicating with each other are formed. Also,
The electrode 29 is provided on the spacer sheet 23 side of the FPC 24.
(See FIG. 2). Further, a plurality of chip components 38 are mounted on the spacer sheet 23 side (contact 37 side) of the FPC 24. The circuit is not limited to the FPC (FPC 24).

The pressure-sensitive adhesive sheet 25 is formed so that the FPC 24 can be adhered and fixed. Also,
The adhesive sheet 25 is formed so as to be adhered and fixed to the plate 26. That is, the adhesive sheet 25 is FP
A circuit body mounting surface for C24 is provided on one side, and an adhesive fixing surface for plate 26 is provided on the other side. Further, the adhesive sheet 25 has a function as a reinforcing member. The pressure-sensitive adhesive sheet 25 is formed with air release holes 39 and 39 similar to the air release holes 36 and 36 of the FPC 24.

The plate 26 has a mounting surface 40 on which the adhesive fixing surface of the adhesive sheet 25 is in close contact. On the mounting surface 40, for example, space portions 41, 41 having a concave shape in cross section are arranged and formed. Spaces 41, 4
1 communicates with the air release portions 33 of the spacer sheet 23 via the air release holes 36, 36 of the FPC 24 and the air release holes 39, 39 of the adhesive sheet 25 (the air release holes 36, 36 of the FPC 24). The air release holes 39 of the adhesive sheet 25 and the air release portions 33 of the spacer sheet 23 and the space portions 4 of the plate 26
1, 41). The plate 26 may be formed in a housing shape such as a switch case.

Reference numeral 42 denotes an LED mounted on the spacer sheet 23 side (contact point 37 side) of the FPC 24. Reference numerals 43 and 43 in the lower spacer sheets 31 and 31 indicate light guide portions for the LEDs 42. The light guides 43 are formed so as to have a storage structure (application of the present invention) for the LED 42. Further, reference numeral 44 in the upper spacer sheet 30 indicates a diffusing means 44 for diffusing light from the LED 42. Furthermore, reference numeral 45 in the front sheet 22 indicates a light emitting portion that is illuminated by light from the LED 42 and passes the light.

In the above configuration, the polydome switch 21 is assembled as follows. First, the upper spacer sheet 30 and the lower spacer sheets 31, 31 are bonded and fixed to form the spacer sheet 23. Next, Table sheet 2
2 is bonded and fixed to the surface of the spacer sheet 23 (actually, the upper spacer sheet 30), and the FPC 24 is bonded and fixed to the back surface of the spacer sheet 23 (actually, the lower spacer sheet 31 which is the lowermost layer). At this time, the storage sheets 34, 34, 34 of the upper spacer sheet 30 and the lower spacer sheets 31, 31 are provided with the spacer sheet 2 of the FPC 24.
A plurality of chip components 38 mounted on the third side (contact 37 side)
Is stored (see FIG. 2). Then, these are FPC2
Adhesively fixed to the circuit mounting surface of the adhesive sheet 25 from the fourth side. Thus, the assembly is completed. The assembled polydome switch 21 is attached by bringing the adhesive fixing surface of the adhesive sheet 25 into close contact with the attachment surface 40 of the plate 26.

As described above, the polydome switch 21 according to the first embodiment includes the spacer sheet 23 of the FPC 24.
Chip components 38 mounted on the side (contact 37 side)
To the upper spacer sheet 30 and the lower spacer sheet 3
It has a chip component storage structure that can be stored in the storage portions 34, 34, 34 of the first sheet 31 and the raised portions 28 of the front sheet 22. As a result, even when the chip component 38 is mounted on the FPC 24, the spacer sheet 23
There is no possibility that it will be lifted and deformed. Therefore, even if the chip component 38 is mounted on the FPC 24, the function of the switch is not affected.

Next, a chip component housing structure in a dome switch according to a second embodiment will be described with reference to FIG. FIG. 3 is an exploded perspective view showing a second embodiment of the chip component storage structure in the dome switch. The same components as those described above are denoted by the same reference numerals, and description thereof is omitted.

In FIG. 3, a polydome switch indicated by reference numeral 51 (corresponding to a dome switch described in the claims) includes a front sheet 52 and a spacer sheet 5.
3, an FPC 54 and an adhesive sheet 55. In addition, the polydome switch 51 includes the adhesive sheet 5
Plate 56 as an example of a member to be attached via 5
Fixed to. In the second embodiment of the present invention, a chip component storage structure is formed on the adhesive sheet 55 and the plate 56.

The front sheet 52 is a synthetic resin sheet made of, for example, polyethylene terephthalate (PET), and has a plurality of protrusions 27. Further, an electrode 29 (see FIG. 4) for the FPC 54 is provided on the inner surface of each protrusion 27. Electrode 29
(See FIG. 2) is provided on the top of the inner surface.

The spacer sheet 53 includes an upper spacer sheet 57 and lower spacer sheets 58, 58. That is, the spacer sheet 53
The spacer sheet 53 does not need to be formed of three layers, like the spacer sheet 23 described above. The spacer sheet 53 may be formed of one layer, two layers, or four or more layers. The spacer sheet 53 functions as a member for preventing the front sheet 52 from being deformed.

The upper spacer sheet 57 is a sheet member made of a synthetic resin made of, for example, polyethylene terephthalate (PET). The upper spacer sheet 57 is formed thinner than the lower spacer sheets 58, 58. That is, it functions as a sheet member for fine adjustment for adjusting the thickness of the spacer sheet 53. The upper spacer sheet 53 has an adhesive layer (not shown) on the front and back surfaces, so that the front sheet 52 and the lower spacer sheet 58 can be fixed to the front and back surfaces, respectively. Further, the upper spacer sheet 53 includes a plurality of through holes 32 and a plurality of air release portions 3.
And 3.

Each of the lower spacer sheets 58, 58 is a sheet member made of a synthetic resin made of, for example, polyethylene terephthalate (PET) and has an adhesive layer (not shown) on the front and back surfaces. The upper spacer sheet 57 and the FPC 54 can be fixed to the front and back surfaces, respectively. The lower spacer sheets 58, 58 have a plurality of through holes 32 and a plurality of air escape portions 33 having the same number, shape, position, and function as the upper spacer sheet 57 (the same as the upper spacer sheet 57). It is to be noted that the diameter of each through hole 32 of the lower spacer sheet 58, 58 can be formed so as to be larger than or equal to the diameter of each of the through holes 32 of the upper spacer sheet 57. If the diameter of each through hole 32 of the lower spacer sheets 58, 58 becomes larger, a larger space for air release can be taken, and it is needless to say that the click feeling at the time of switch operation is improved.

The FPC 54 (FPC: Flexible Printed Circuit) is a circuit having a plurality of circuits 35 arranged in a desired pattern. Air release holes 36, 36 communicating with each other are formed. Also,
A plurality of contacts 3 are provided on the spacer sheet 53 side of the FPC 54.
7 are provided. Further, a plurality of chip components 38 are mounted on the side of the adhesive sheet 55 of the FPC 54 (the side opposite to the contact 37). The circuit body is an FPC (FPC5
It is not limited to 4).

The pressure-sensitive adhesive sheet 55 is formed so that the FPC 54 can be adhered and fixed. Also,
The adhesive sheet 55 is formed so as to be adhesively fixed to the plate 56. That is, the adhesive sheet 55 is FP
One side has a circuit body mounting surface for C54 and the other side has an adhesive fixing surface for plate 56. Further, the adhesive sheet 55 has a function as a reinforcing member. The adhesive sheet 55 has the same air release holes 39, 39 communicating with the air release holes 36, 36 of the FPC 54, and the storage section 59 (the adhesive described in the claims) constituting the chip component storage structure. (Corresponding to the sheet-side storage portion). The storage section 59
The plurality of chip components 38 mounted on the adhesive sheet 25 side of the FPC 54 are formed in a rectangular shape depending on the mounting positions.

The plate 56 has a mounting surface 60 to which the adhesive fixing surface of the adhesive sheet 55 is in close contact. On the mounting surface 60, for example, space portions 41, 41 having a concave shape in a sectional view, and a concave portion 61 constituting the chip component housing structure are arranged and formed. The recess 61 is formed according to the mounting position of the chip component 38. The recess 61 is formed so that the tip of the chip component 38 can be housed. In addition, the plate 56
The shape may be formed in a housing shape such as a switch case.

In the above configuration, the polydome switch 51 is assembled as follows. First, the upper spacer sheet 57 and the lower spacer sheets 58, 58 are bonded and fixed to form the spacer sheet 53. Next, Table sheet 5
2 is adhesively fixed to the front surface of the spacer sheet 53 (actually, the upper spacer sheet 57), and the FPC 54 is adhesively fixed to the back surface of the spacer sheet 53 (actually, the lowermost spacer sheet 58, which is the lowermost layer). Subsequently, these are adhesively fixed to the circuit body mounting surface of the adhesive sheet 55 from the FPC 54 side. At this time, the adhesive sheet 5 of the FPC 54 is placed in the storage portion 59 of the adhesive sheet 55 and the concave portion 61 of the plate 56.
A plurality of chip components 38 mounted on the fifth side (opposite side of the contact 37) are stored (see FIG. 4). Thus, the assembly is completed. In addition, the assembled polydome switch 5
1 is to attach the adhesive fixing surface of the adhesive sheet 55 to the plate 56
Is attached by closely contacting the surface 60 to be attached.

As described above, the polydome switch 51 according to the second embodiment includes a plurality of chip components 3 mounted on the adhesive sheet 55 side of the FPC 54 (opposite the contact 37).
8 has a chip component storage structure capable of being stored in the storage portion 59 of the adhesive sheet 55 and the concave portion 61 of the plate 56. As a result, the chip component 3 is attached to the FPC 54.
Even if 8 is mounted, the adhesive sheet 55 will not be lifted and deformed with respect to the FPC 54. Therefore, FPC5
Even if the chip component 38 is mounted on the switch 4, the function of the switch is not affected.

Next, a structure for storing chip components in a dome switch according to a third embodiment will be described with reference to FIG. FIG. 5 is an exploded sectional view showing a third embodiment of the chip component storage structure in the dome switch. The same components as those described above are denoted by the same reference numerals, and description thereof is omitted.

In FIG. 5, a polydome switch indicated by reference numeral 65 (corresponding to a dome switch described in the claims) has a front sheet 22 having a raised portion 28 and storage portions 34, 34, 34. A spacer sheet 23 (consisting of an upper spacer sheet 30 and lower spacer sheets 31, 31) and chip components 38 on both sides
And a pressure-sensitive adhesive sheet 55 having a storage section 59. The polydome switch 65 is fixed to a plate 56 having a concave portion 61 via an adhesive sheet 55. In the third embodiment of the present invention, the front sheet 22, the spacer sheet 23, the adhesive sheet 55, and the plate 56
A chip component storage structure is formed in the semiconductor device. The circuit is not limited to the FPC (FPC 66).

As described above, the polydome switch 65 according to the third embodiment is the same as the spacer sheet 23 of the FPC 66.
A plurality of chip components 38, 38 mounted on the side can be stored in the storage portions 34, 34, 34 of the upper spacer sheet 30 and the lower spacer sheets 31, 31, and the raised portions 28 of the front sheet 22. It has a chip component storage structure. In addition, the chip component 38 mounted on the adhesive sheet 55 side of the FPC 66 is
9 and a chip component storage structure that can be stored in the recess 61 of the plate 56. Thereby, FP
Even if the chip components 38, 38 are mounted on the C66, the spacer sheet 23 does not rise and deform with respect to the FPC 66. Further, even when the chip component 38 is mounted on the FPC 66, the adhesive sheet 55 does not rise and deform with respect to the FPC 66. Therefore, even if the chip component 38 is mounted on the FPC 66, the function of the switch is not affected.

Next, a specific example of mounting the dome switch will be described with reference to FIG. FIG. 6 is an exploded perspective view showing a specific mounting example of the dome switch.

In FIG. 6, reference numeral 71 indicates a switch unit of a vehicle such as an automobile having a plurality of knob switches and a polydome switch. The switch unit 71 includes a bezel 7 having a plurality of switch knobs 72.
3, a rubber contact 74, an FPC 76 as a circuit body having a plurality of contacts 75, and a dome-shaped protrusion 7
A front seat 78 having the front and rear seats 7 and 77, a spacer sheet 79 closely contacting the front seat 78, and an undercase 80 with which the bezel 73 is engaged are provided near a driver-side door or a center console. ing. In the switch unit 71, a poly dome switch 81 (corresponding to the dome switch described in the claims) is constituted by the front sheet 78, the spacer sheet 79, and a part of the FPC 76 (the above-described chip). A reference numeral 82 corresponds to a chip component, and an under case 80 corresponds to a member to be attached described in claims. However, it is needless to say that a polydome switch such as the above-described polydome switch 81 can be used as a whole.

In addition, it goes without saying that the present invention can be variously modified and implemented without departing from the gist of the present invention. That is, in the first and third embodiments, the front sheet 22
However, it is needless to say that this can be omitted when the height of the chip component 38 is low. Further, in the second and third embodiments, the concave portion 61 is formed in the plate 56. However, when the height of the chip component 38 is low, it is needless to say that this can be omitted.

It should be noted that the polydome switch (dome switch) is not limited to being applied to the above-described switch unit of a vehicle such as an automobile or a switch of a device mounted on the vehicle. That is, it is naturally applicable to a switch used for household appliances, a switch of a manufacturing apparatus, and the like. Further, the number of projecting portions and the number of chip components are not limited to those described above.

[0054]

As described above, according to the first aspect of the present invention, since the spacer sheet side storage portion is formed on the spacer sheet, the contacts of the circuit body are assembled in assembling the dome switch. The chip components mounted on the side can be stored in the spacer sheet side storage section. Therefore, it is possible to provide a chip component storage structure in a dome switch in which chip components can be mounted on a circuit body.

According to the second aspect of the present invention,
Since the pressure-sensitive adhesive sheet has the pressure-sensitive adhesive sheet-side storage portion, the chip component mounted on the side opposite to the contact point of the circuit body can be stored in the pressure-sensitive adhesive sheet-side storage portion in assembling the dome switch. Therefore, it is possible to provide a chip component storage structure in a dome switch in which chip components can be mounted on a circuit body.

According to the third aspect of the present invention,
Since the spacer sheet side storage portion is formed on the spacer sheet, the chip component mounted on the contact side of the circuit body can be stored in the spacer sheet side storage portion in assembling the dome switch. Further, since the pressure-sensitive adhesive sheet has the pressure-sensitive adhesive sheet-side storage portion, it is possible to store the chip component mounted on the opposite side of the contact of the circuit body in the pressure-sensitive adhesive sheet-side storage portion in assembling the dome switch. Therefore, it is possible to provide a chip component storage structure in a dome switch in which chip components can be mounted on a circuit body.

According to the fourth aspect of the present invention,
Since the raised portion is formed on the front sheet, a chip component having a high height can be mounted on the contact side of the circuit body.

According to the fifth aspect of the present invention,
Since the concave portion is formed in the member to be mounted, a high-height chip component can be mounted on the opposite side of the contact point of the circuit body.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a chip component storage structure in a dome switch according to the present invention.

FIG. 2 is an enlarged cross-sectional view of a chip component storage portion of FIG.

FIG. 3 is an exploded perspective view showing a second embodiment of the chip component storage structure in the dome switch according to the present invention.

FIG. 4 is an enlarged cross-sectional view of a chip component storage portion of FIG.

FIG. 5 is an exploded sectional view showing a third embodiment of the chip component storage structure in the dome switch according to the present invention.

FIG. 6 is an exploded perspective view showing a specific mounting example of the dome switch.

FIG. 7 is an exploded perspective view of a conventional polydome switch (dome switch).

FIG. 8 is a sectional view of a main part before a switch is operated.

FIG. 9 is a sectional view of a main part when a switch is operated.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Poly dome switch (dome switch) 22 Front sheet 23 Spacer sheet 24 FPC (circuit body) 25 Adhesive sheet 26 Plate (attached member) 27 Projection part 28 Embossed part 29 Electrode 30 Upper spacer sheet 31 Lower spacer sheet 32 Through hole 33 Air release section 34 Storage section (spacer sheet side storage section) 35 Circuit 36 Air release hole 37 Contact point 38 Chip component 39 Air release hole 40 Mounting surface 41 Space section 51 Polydome switch (dome switch) 52 Front sheet 53 Spacer sheet 54 FPC (circuit body) 56 Plate (attached member) 57 Upper spacer sheet 58 Lower spacer sheet 59 Storage section (adhesive sheet side storage section) 60 Mounting surface 61 Depression 65 Polydome switch (dome switch) 66 FPC (circuit)

Claims (5)

[Claims] 1. A front sheet having a dome-shaped protrusion that protrudes to the outside and is reversible to the inside and has an electrode provided on the inside, and the electrode of the protrusion that is reversed to the inside A circuit body having contacts that are in contact with, one or a plurality of spacer sheets interposed between the front sheet and the circuit body and formed with through holes for ensuring contact between the electrodes and the contacts, A pressure-sensitive adhesive sheet having a circuit body mounting surface for the circuit body on one side and an adhesive fixing surface for a member to be mounted on the other side, and a chip component housing structure for a dome switch, comprising: A chip component storage structure for a dome switch, wherein a spacer sheet side storage portion for the chip component mounted on the contact side is formed. . 2. A front sheet having a dome-shaped protruding portion that protrudes to the outer surface side and is reversible to the inner surface side and is provided with an electrode on the inner surface, and the electrode of the protruding portion turned to the inner surface side. A circuit body having contacts that are in contact with, one or a plurality of spacer sheets interposed between the front sheet and the circuit body and formed with through holes for ensuring contact between the electrodes and the contacts, A pressure-sensitive adhesive sheet having a circuit body mounting surface for the circuit body on one side and an adhesive fixing surface for the mounted member on the other side, a chip component storage structure for a dome switch comprising: A chip component storage structure for a dome switch, wherein an adhesive sheet side storage portion for a chip component mounted on the opposite side of the contact is formed. 3. A front sheet that has a dome-shaped protrusion that protrudes to the outer surface and is reversible to the inner surface and has electrodes on the inner surface, and the electrode of the protrusion that is reversed to the inner surface. A circuit body having contacts that are in contact with, one or a plurality of spacer sheets interposed between the front sheet and the circuit body and formed with through holes for ensuring contact between the electrodes and the contacts, A pressure-sensitive adhesive sheet having a circuit body mounting surface for the circuit body on one side and an adhesive fixing surface for the mounted member on the other side, and a chip component storage structure for a dome switch, comprising: Forming a spacer sheet-side storage portion for the chip component mounted on the contact side of the contact body, and attaching the opposite side of the contact of the circuit body to the adhesive sheet. Chip component storage structure in a dome switch, characterized in that the formation of the pressure-sensitive adhesive sheet side storage unit for mounting the chip components on. 4. The chip component storage structure for a dome switch according to claim 1, wherein a protruding portion for the chip component is formed on the front sheet in accordance with a position of the spacer sheet side storage portion. A chip component storage structure in a dome switch characterized by the above-mentioned. 5. The chip component storage structure for a dome switch according to claim 2, wherein a concave portion for the chip component is formed in the attached member in accordance with a position of the adhesive sheet side storage portion. A chip component storage structure in a dome switch characterized by the above-mentioned.