JP2002124534A - Rectilinear propagation estimating equipment and method of metal thin wire - Google Patents

Rectilinear propagation estimating equipment and method of metal thin wire

Info

Publication number
JP2002124534A
JP2002124534A JP2000314228A JP2000314228A JP2002124534A JP 2002124534 A JP2002124534 A JP 2002124534A JP 2000314228 A JP2000314228 A JP 2000314228A JP 2000314228 A JP2000314228 A JP 2000314228A JP 2002124534 A JP2002124534 A JP 2002124534A
Authority
JP
Japan
Prior art keywords
thin metal
metal wire
straightness
image
evaluating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000314228A
Other languages
Japanese (ja)
Inventor
Tadao Asuke
忠雄 安助
Takuji Asano
卓司 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP2000314228A priority Critical patent/JP2002124534A/en
Publication of JP2002124534A publication Critical patent/JP2002124534A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/786Means for supplying the connector to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01012Magnesium [Mg]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Abstract

PROBLEM TO BE SOLVED: To reduce irregularity of estimation in rectilinear propagation estimation of a metal thin wire by visual observation. SOLUTION: This rectilinear propagation estimating equipment is provided with an object material holding means which suspends vertically the metal thin wire by a prescribed length from the tip, an illumination device for lighting the object material (it is preferably that light sources are arranged on both the right and left sides of the front of the object material), an imaging device for imaging the object material, and an image processing means for data- processing an imaged object.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、金属細線の直進性
評価装置及び方法に関し、詳しくは半導体装置の実装に
際して、ICチップ電極と外部リードを接続するボンデ
ィングワイヤとして用いられる金属細線の直進性評価装
置及び方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for evaluating the straightness of a thin metal wire, and more particularly to the evaluation of the straightness of a thin metal wire used as a bonding wire for connecting an IC chip electrode to an external lead when mounting a semiconductor device. Apparatus and method.

【0002】[0002]

【従来の技術】現在、半導体装置の小型化、薄肉化に伴
い狭ピッチ、長ループのボンディング方法に対応する為
に半導体装置の実装に用いられる金属細線に要求される
性能も高まっており、これらの要求性能の中で金属細線
の直進性が重要な性能であり、これの向上が求められて
いる。
2. Description of the Related Art At present, with the miniaturization and thinning of semiconductor devices, the performance required for thin metal wires used for mounting semiconductor devices has been increased in order to cope with narrow pitch and long loop bonding methods. Among the required performances, straightness of the thin metal wire is an important performance, and improvement of this is required.

【0003】該金属細線の直進性向上の為にはその測定
方法が必要である為、本出願人は先に、該直進性を評価
する為の金属細線の直進性測定装置及び測定方法を特開
平11−190604号公報に提案した。本提案の概要
を図1を用いて説明する。1は風防用容器、2は正面
扉、3は金属細線を巻き回したスプール、4は繰り出し
モータ、5はコントローラ、6は平面鏡、7は垂下した
金属細線、8は透明性目盛りである。
[0003] In order to improve the straightness of the thin metal wire, a method of measuring the straightness is required. Therefore, the applicant of the present invention firstly described an apparatus and method for measuring the straightness of a thin metal wire for evaluating the straightness. It was proposed in Japanese Unexamined Patent Publication No. Hei 11-190604. The outline of the proposal will be described with reference to FIG. 1 is a windshield container, 2 is a front door, 3 is a spool around which a thin metal wire is wound, 4 is a feeding motor, 5 is a controller, 6 is a plane mirror, 7 is a hanging thin metal wire, and 8 is a transparency scale.

【0004】コントローラ5を用いてモータ4を駆動
し、スプール3を回転させるとスプール3から金属細線
7が繰り出されて下方に垂下する。図2を参照すると平
面鏡に写る金属細線の像9が金属細線7と一致する位置
から目視観察し、目盛り部8を利用して金属細線の直進
性を測定するものである。直進性を評価する情報とし
て、ねじれ、蛇行幅、蛇行回数、はね幅、ループ曲がり
等多くの情報を得ることが出来るものである。
When the motor 4 is driven using the controller 5 and the spool 3 is rotated, the thin metal wire 7 is fed out of the spool 3 and hangs downward. Referring to FIG. 2, an image 9 of a thin metal wire reflected on a plane mirror is visually observed from a position where the thin metal wire coincides with the thin metal wire 7, and the linearity of the thin metal wire is measured using the scale 8. As information for evaluating the straightness, a great deal of information such as twist, meandering width, meandering frequency, splash width, and loop bend can be obtained.

【0005】[0005]

【発明が解決しようとする課題】前述の目視による金属
細線の直進性測定装置及び測定方法を用いると、線曲が
りについての多くの情報を得ることが可能になり、製造
工程の異常の発見及び品質保証を行う際所定の成果を得
ることが出来るようになった。しかしながら前記測定方
法を用いている中で測定値のばらつきが大きいという問
題が生じてきた。
The use of the above-described apparatus and method for measuring the straightness of a thin metal wire by visual observation makes it possible to obtain a great deal of information on wire bending, and to detect abnormalities in the manufacturing process and improve the quality. It is now possible to obtain a certain result when making a guarantee. However, there has been a problem that the dispersion of measured values is large while using the above-mentioned measuring method.

【0006】ばらつきが生じる原因として第1に被測定
材料が測定中にゆれること、第2に目視測定であるため
人による個人差が提起出来る。第1の材料の揺れは金属
細線があまりに軽量である為に生じるものである。因み
に半導体装置の実装に多用される金属細線である直径2
5μmの金線を30cm垂下させると、その重量は3mgで
あり、軽量であるが故に外部からの微量な風、モータ発
熱から生じる対流による微小な風の影響を受けていると
考えられる。
As the causes of the variation, firstly, the material to be measured is shaken during the measurement, and secondly, since the measurement is performed by visual observation, individual differences between persons can be caused. The swing of the first material occurs because the thin metal wire is too light. Incidentally, a diameter of 2 which is a thin metal wire often used for mounting a semiconductor device.
When a 5 μm gold wire is suspended by 30 cm, the weight is 3 mg, and it is considered that the wire is lightweight and is affected by a small amount of wind from the outside and a minute wind due to convection generated by heat generated by the motor.

【0007】一方曲がり情報の中には例えば蛇行幅測定
のように目盛りのセットから測定値を得るまで1〜2分
の時間を要する為、材料の揺れが測定誤差を大きくして
いる。本発明は上述したような事情に鑑みてなされたも
のであり、その目的とするところは金属細線の直進性測
定に於いて、測定値のばらつきを小さく抑えることが出
来る金属細線の直進性評価装置及び方法を提供すること
にある。
On the other hand, in the bending information, for example, as in the meandering width measurement, it takes 1 to 2 minutes to obtain a measurement value from the setting of the scale, so that the fluctuation of the material increases the measurement error. The present invention has been made in view of the above-described circumstances, and an object of the present invention is to measure the straightness of a thin metal wire and, in the measurement of the straightness of a thin metal wire, to evaluate the linearity of a thin metal wire that can suppress the variation of the measured value. And a method.

【0008】[0008]

【課題を解決するための手段】前述の事情に鑑み、本発
明者等が鋭意検討の結果、金属細線が繰り出されて下方
に垂下した状態を静止画像としてカメラで撮影し、更に
コンピュータを用いて画像処理することにより、測定値
のばらつきを小さく抑えることが出来ると考えた。
In view of the above-mentioned circumstances, the present inventors have made intensive studies and as a result, photographed a state in which a thin metal wire was extended and hung downward as a still image with a camera, and further used a computer. By performing image processing, it was considered that variation in measured values could be suppressed to a small value.

【0009】しかしながら対象材料の必要長さ全体を明
瞭に撮像することは必ずしも容易ではなかった。前記し
た金属細線の1例から直径25μmの金属細線の長さ約
30cm全部を明瞭に撮影することが困難であった。そこ
で本発明者等が更に検討を進めた結果、照明装置を設置
し、さらに照明を工夫することにより前記した微小直径
であり、所定長さの金属細線全長の画像処理が可能とな
り本発明を完成するに到った。
[0009] However, it has not always been easy to clearly image the entire required length of the target material. It was difficult to clearly photograph the entire length of about 30 cm of a 25 μm-diameter thin metal wire from one of the above-described thin metal wires. Therefore, as a result of further study by the present inventors, it was possible to perform image processing on the entire length of the fine metal wire having the above-mentioned small diameter and a predetermined length by installing a lighting device and further devising the lighting, thereby completing the present invention. I came to.

【0010】すなわち、本発明は下記を提供する。 (1)金属細線を先端から所定長さを垂下させる対象材
料保持手段と、対象材料に照明を施す照明装置と、対象
材料を撮像する為の撮像装置を備え、該撮像装置から対
象材料の画像を入力した後に該画像を処理する画像処理
手段を備えて成ることを特徴とする金属細線の直進性評
価装置。
That is, the present invention provides the following. (1) A target material holding means for hanging a thin metal wire from a tip by a predetermined length, an illumination device for illuminating the target material, and an imaging device for imaging the target material, and an image of the target material from the imaging device And an image processing means for processing the image after inputting the information.

【0011】(2)照明装置が対象材料の前方左右に光
源を有する照明装置である(1)記載の金属細線の直進
性評価装置。 (3)画像処理手段が画像不明瞭箇所の補正手段を有す
る(1)(2)記載の金属細線の直進性評価装置。 (4)金属細線を先端から所定長さを垂下させ、対象材
料に照明を施して該垂下した金属細線を撮像装置によっ
て撮像し、得られた金属細線の撮影像にもとづいて金属
細線の直進性を評価することを特徴とする金属細線の直
進性評価方法。
(2) The device for evaluating straightness of a thin metal wire according to (1), wherein the lighting device has a light source in front and left and right of the target material. (3) The straight metal linearity evaluation device according to (1) or (2), wherein the image processing means has a means for correcting an unclear image portion. (4) The thin metal wire is suspended from the tip by a predetermined length, the target material is illuminated, the suspended thin metal wire is imaged by an imaging device, and the straightness of the thin metal wire is obtained based on the obtained captured image of the thin metal wire. A method for evaluating the straightness of a thin metal wire, comprising:

【0012】(5)前記撮影像にもとづく金属細線の直
進性の評価をデータ処理装置で行なう(4)記載の金属
細線の直進性評価方法。 (6)前記垂下した金属細線に対して先方左右両方に光
源を配して照明を施す(4)(5)記載の金属細線の直
進性評価方法。 (7)前記撮影像に画像不明瞭箇所があるとき、その部
分を補正する(4)〜(6)記載の金属細線の直進性評
価方法。
(5) The method for evaluating straightness of a thin metal wire according to (4), wherein the straightness of the thin metal wire is evaluated by a data processor based on the photographed image. (6) The method for evaluating straightness of a thin metal wire according to (4) or (5), wherein a light source is disposed on both the left and right sides of the hanging thin metal wire to illuminate the thin metal wire. (7) The method for evaluating straightness of a thin metal wire according to any one of (4) to (6), wherein when there is an unclear image portion in the photographed image, the portion is corrected.

【0013】[0013]

【発明の実施の形態】(1)金属細線 本発明において評価の対象となる金属細線は、主として
半導体装置実装に用いられる直径10〜100μmのも
のを500〜5000m単位にスプールに巻き回して使
用されているものであるが、これは更に長尺になってい
く傾向にある。直径600μm程度のものも半導体装置
実装に用いられている。組成としてはAu,Al,C
u,Sn,Pbなど及びそれらを主成分とする合金が用
いられている。
BEST MODE FOR CARRYING OUT THE INVENTION (1) Fine metal wire The fine metal wire to be evaluated in the present invention is used by winding a wire having a diameter of 10 to 100 μm mainly used for mounting a semiconductor device on a spool in a unit of 500 to 5000 m. However, this tends to be longer. Those having a diameter of about 600 μm are also used for mounting semiconductor devices. The composition is Au, Al, C
u, Sn, Pb and the like and alloys containing these as main components are used.

【0014】本発明はスプールに巻かれた金属細線の直
進性を客観的に精度よく評価することを目的としてい
る。本発明で評価の対象とする金属細線は、基本的にス
プールから巻き出されると、自重で垂下して直線になる
性質を有するものである。そこで、金属細線をスプール
から巻き出して、所定範囲の直進性を測定し、その測定
値の平均及び総合評価によりスプールにまかれた金属細
線の直進性を評価することを企図している。 (2)評価装置 図面を参照して、本発明に従う金属細線の直進性を評価
する装置を説明する。
An object of the present invention is to objectively and accurately evaluate the straightness of a thin metal wire wound on a spool. The metal thin wire to be evaluated in the present invention basically has a property of hanging down by its own weight and becoming a straight line when unwound from a spool. Therefore, it is intended to unwind the thin metal wire from the spool, measure the straightness in a predetermined range, and evaluate the straightness of the thin metal wire wound on the spool by averaging the measured values and comprehensive evaluation. (2) Evaluation apparatus An apparatus for evaluating the straightness of a thin metal wire according to the present invention will be described with reference to the drawings.

【0015】図3に装置の1例を示す。1は風防用容
器、2は正面扉、3は金属細線を巻き回したスプール、
4は繰り出しモータ、5はコントローラ、15は黒色ア
ルマイト板、7は垂下した金属細線、16はモータ固定
台、17は固定台回転軸、11は環状照明、12は撮像
装置、13はコントローラ、14は画像処理装置であ
る。 対象材料保持手段 本発明の対象材料である金属細線7を巻き回したスプー
ル3は、スプール装着部(図示省略)に回転可能に装着
する。スプール装着部は回転可能で且つスプールを固定
出来る媒体であればよいが、好適にはモータ駆動式と
し、簡単にはモータの回転軸(図示省略)に直接にスプ
ール3を装着するようにしてもよい。
FIG. 3 shows an example of the apparatus. 1 is a windshield container, 2 is a front door, 3 is a spool wound with a thin metal wire,
4 is a feed motor, 5 is a controller, 15 is a black alumite plate, 7 is a hanging thin metal wire, 16 is a motor fixed base, 17 is a fixed base rotating shaft, 11 is an annular illumination, 12 is an imaging device, 13 is a controller, 14 Denotes an image processing device. Target Material Holding Means The spool 3 around which the thin metal wire 7 as the target material of the present invention is wound is rotatably mounted on a spool mounting portion (not shown). The spool mounting portion may be any medium that can rotate and can fix the spool. Preferably, the spool mounting portion is a motor-driven type, and simply, the spool 3 can be mounted directly on a rotating shaft (not shown) of the motor. Good.

【0016】コントローラ5を用いてモータ4を駆動
し、スプール3を回転させると、スプール3から金属細
線7が繰り出されてくるので所定長さ垂下させる。本発
明の対象材料である図3のように垂下した金属細線7を
含む領域は、人の移動や空調等の風の影響を防止する為
に、正面に開閉扉2を設けた風防用容器1で覆って用い
ることが好ましい。
When the motor 4 is driven by the controller 5 and the spool 3 is rotated, the thin metal wire 7 is drawn out of the spool 3 and is suspended for a predetermined length. As shown in FIG. 3, which is the target material of the present invention, the region including the hanging thin metal wire 7 is a windshield container 1 provided with an opening / closing door 2 on the front in order to prevent the influence of wind such as movement of a person or air conditioning. It is preferable to use it by covering it.

【0017】又正面からみた金属細線7の円周方向の位
置を変えて測定すると金属細線7の直進性がより正確に
把握出来て好ましい。この為、モータ4をモータ固定台
16に固定し、回転軸17を用いて所定角度の回転が出
来るようにする。図3に示す位置、更にここから45
度、90度回転させた位置で測定することが好ましい。
金属細線7の円周方向の位置を変えて測定すると直進性
の悪い材料よりも直進性の良い材料の方がばらつきが生
じ易い。この為、比較的直進性の良い金属細線の中でそ
の差異を明確にして更なる直進性向上試験を行う場合に
は、金属細線の円周方向の位置を変える手段を評価装置
の中に含めることが好ましい。 照明装置 11は対象材料に照明を施す照明装置である。図3では
環状照明装置を示している。本発明に用いる対象材料は
垂下させた金属細線の長さは約30cmであり、直径は通
常10〜100μmであって極細線で用いられている。
したがって極細線である上にアスペクト比は3×104
〜3×105と大きいものである。
It is preferable to change the position of the thin metal wire 7 in the circumferential direction as viewed from the front so that the straightness of the thin metal wire 7 can be more accurately grasped. Therefore, the motor 4 is fixed to the motor fixing base 16 so that the motor 4 can be rotated at a predetermined angle by using the rotating shaft 17. The position shown in FIG.
It is preferable to measure at a position rotated by 90 degrees.
When the measurement is performed while changing the circumferential position of the thin metal wire 7, a material having good straightness tends to be more easily scattered than a material having poor straightness. For this reason, when conducting a further straightness improvement test by clarifying the difference in a relatively thin straight metal wire, a means for changing the circumferential position of the thin metal wire is included in the evaluation device. Is preferred. The lighting device 11 is a lighting device that illuminates the target material. FIG. 3 shows an annular illumination device. The target material used in the present invention has a length of a suspended metal fine wire of about 30 cm, a diameter of usually 10 to 100 μm, and is used as a very fine wire.
Therefore, it is a very fine line and the aspect ratio is 3 × 10 4
It is as large as 3 × 10 5 .

【0018】本発明の対象材料は極細線である上にアス
ペクト比が大きい為、照明装置を用いることが必要であ
る。大きさが数cm程度のものが撮像可能な状況において
も前述の極細線の場合、照明を直接極細線に照射し、そ
の反射光を撮像装置で撮像した場合、画像が得られる。
本発明で言う照明装置とは、通常の部屋の照明とは別
に、金属細線の撮影を目的とした特別の照明をいう。こ
の特別の照明装置を用いることによってカメラによる金
属細線の撮影が欠落が全くないかあるいは殆んどないよ
うにすることが可能になる。この照明装置は本評価装置
に内蔵されいることが望ましいが、別体として用意して
もよい。また、本発明の照明装置が普通の部屋の照明と
異なることは、金属細線に対して多方向から照明される
ことにあり、金属細線の各部分からむらなく反射光線が
撮像装置に入ることを可能にする点にあり、従って金属
細線及び撮像装置に関して面状、環状光源が好ましい。
Since the target material of the present invention is a very fine line and has a large aspect ratio, it is necessary to use a lighting device. Even in a situation where an image having a size of about several centimeters can be imaged, an image can be obtained by directly illuminating the ultrafine line and imaging the reflected light with an imaging device in the case of the aforementioned ultrafine line.
The illumination device according to the present invention refers to a special illumination for photographing a thin metal wire, separately from the illumination of a normal room. By using this special lighting device, it is possible to make the photographing of the thin metal wire by the camera with no or almost no omission. This lighting device is desirably incorporated in the evaluation device, but may be prepared separately. Further, the lighting device of the present invention is different from ordinary room lighting in that the thin metal wire is illuminated from multiple directions, and the reflected light beams from each portion of the thin metal wire enter the imaging device evenly. For this reason, a planar, annular light source is preferred for the metal wires and the imaging device.

【0019】本発明の対象材料の極細線は任意の方向に
曲がっている為、多方向から照射し、何れかの反射光が
撮像装置の方向となるようにすることが理想的である。
照明装置としては、光源が1箇所であると対象材料であ
る極細線の全長を静止画像として撮像されない部分が複
数箇所に生じてしまう。該不明瞭箇所は後述する補正に
よって推定像として像を完成させて測定に供する。
Since the ultrafine line of the object material of the present invention is bent in an arbitrary direction, it is ideal to irradiate the light from multiple directions so that any reflected light is directed to the imaging device.
In the lighting device, if the number of light sources is one, a portion where the entire length of the ultrafine line as the target material is not captured as a still image is generated in a plurality of places. The image of the unclear portion is completed as an estimated image by the correction described later, and is used for measurement.

【0020】しかし不明瞭箇所が少ない程補正をする必
要がないこと及び後述する補正の基準となる曲線式が正
確になる為、像の精度が上がって好ましい。最も好まし
くは不明瞭箇所が全くないものである。このような不明
瞭箇所を少なくする為には対象材料の前方左右に光源を
有する照明装置であることが好ましい。本発明の対象材
料の極細線は任意の方向に曲がっている為、多方向から
照射し、何れかの反射光が撮像装置の方向となる状況が
対象材料の全長にわたって生じることが好ましい。
However, as the number of unclear portions is smaller, it is not necessary to perform the correction, and the curve formula as a reference for the correction described later becomes more accurate. Most preferably, there are no unclear portions. In order to reduce such unclear portions, it is preferable that the lighting device has a light source in front and left of the target material. Since the ultrafine line of the target material of the present invention is bent in an arbitrary direction, it is preferable that irradiation is performed from multiple directions, and a situation in which any reflected light is directed to the imaging device occurs over the entire length of the target material.

【0021】前述した前方左右の光源は各々1個の点状
でもよいが、左右それぞれが1個より複数個である方が
良い。複数個の光源を配列して対象材料の全長を照射出
来るようにすることが好ましい。左右に複数の点からな
る光源を配置する具体的方法としては、直線状、曲線状
などの光源を用いることが、簡便で好ましい。あるい
は、面上、環状、ランダム配列を行なうと、対象材料に
対して多方向から照射出来る為、不明瞭箇所が低減して
好ましい。内部に空洞を有する面状又は環状の光源を対
象材料の正面においてカメラアングルの外側の位置に配
設すると、簡単な照明装置でありながら、対象材料の左
右を含む多方向から照射出来る為、不明瞭箇所が低減し
て好ましい。
The above-mentioned front and left and right light sources may each be a single point, but it is preferable that each of the right and left light sources is more than one. It is preferable to arrange a plurality of light sources so that the entire length of the target material can be irradiated. As a specific method of arranging a light source composed of a plurality of points on the left and right, it is simple and preferable to use a linear or curved light source. Alternatively, it is preferable to perform an annular, random arrangement on the surface, since irradiation to the target material can be performed from multiple directions, so that unclear portions are reduced. If a planar or annular light source with a cavity inside is arranged at a position outside the camera angle in front of the target material, it can be illuminated from multiple directions including the left and right of the target material, even though it is a simple lighting device. It is preferable because clear parts are reduced.

【0022】線状照明装置としては、直線状蛍光管や点
状光源を直線状に並べた照明装置が例示出来る。面状照
明装置としては、直線状蛍光管や点状光源を直線状に並
べ更にそれを平行に並べて面状にした照明装置が例示出
来る。又環状照明装置としては環状蛍光管や点状光源を
環状に並べた照明装置が例示出来る。又環状としては
丸、楕円、四角、三角等任意の形状とすることが出来
る。さらに直線、曲線状の光源を用いる時、蛍光管のよ
うな連続形状のものでも良いし、目的形状に点光源を連
続して並べても良い。点光源を用いて線状、面状、環状
照明装置とする場合、多少の隙間はあってよい。
Illustrative examples of the linear lighting device include a linear fluorescent tube and a lighting device in which point light sources are arranged in a straight line. Illustrative examples of the planar lighting device include a linear fluorescent tube and a point light source arranged linearly and further arranged in parallel to form a planar illumination device. An example of the annular illuminating device is an illuminating device in which an annular fluorescent tube and a point light source are arranged in an annular shape. The ring may have any shape such as a circle, an ellipse, a square, and a triangle. Further, when a linear or curved light source is used, a continuous light source such as a fluorescent tube may be used, or point light sources may be continuously arranged in a target shape. When a linear, planar, or annular illumination device is formed using a point light source, there may be some gaps.

【0023】光源の位置は対象材料の前方即ち撮像装置
側であればよいが、撮像装置の後方即ち対象材料の反対
側であることが好ましい。対象材料の裏面を黒色にする
とコントラストが明確になり撮像の程度は良くなって好
ましい。 (3)撮像装置 12は撮像装置である。撮像装置としては市販のカメラ
を使用することが出来る。いわゆる写真フィルム用カメ
ラでもよい。必要であればスキャナで読んで画像処理で
きる。しかし、電子式カメラの方が画像データを直接処
理できるので好ましい。いわゆるCCD方式のカメラで
よく、例えばオムロン(株)製「3Dデジタルファイン
スコープVC4500」、キーエンス(株)製「デジタ
ルHDマイクロスコープVH−7000」等が好ましく
用いられる。 (4)画像処理手段 14は撮像装置で撮像した静止画像を画像処理する画像
処理手段である。画像処理手段としては市販の画像処理
ソフトを利用することが出来る。
The position of the light source may be in front of the target material, that is, on the imaging device side, but is preferably behind the imaging device, that is, on the opposite side of the target material. It is preferable to make the back surface of the target material black, since the contrast becomes clear and the degree of imaging is improved. (3) Imaging device 12 is an imaging device. A commercially available camera can be used as the imaging device. A so-called photographic film camera may be used. If necessary, it can be read and image processed by a scanner. However, electronic cameras are preferred because they can directly process image data. A so-called CCD camera may be used. For example, “3D Digital Finescope VC4500” manufactured by OMRON Corporation, “Digital HD Microscope VH-7000” manufactured by Keyence Corporation, etc. are preferably used. (4) Image processing unit 14 is an image processing unit that performs image processing on a still image captured by the imaging device. Commercially available image processing software can be used as the image processing means.

【0024】ここで画像処理を図5を用いて具体的に説
明する。直進性評価内容としてここでは「はね幅」、
「山かず」、「蛇行幅」について説明する。 はね幅 スプール3から垂下させた金属細線7の下端P1をクリ
ックする。P1から所定長さ(図5の場合は50mm)上
方の金属細線7との交点P2を検出する。P1とP2の
外接四角形の横方向長さを測定し、はね幅とする。 山かず P2を中心とする所定長さの半径(図5の場合は220
mm)の円弧と金属細線7との交点P3を検出する。P2
とP3を結ぶ直線を画像に書き込み左右の山かずをカウ
ントする。カウント方法の一例として金属細線の曲線式
を作り、微分値が0になる回数のカウントやP2とP3
を結ぶ直線との交点の数をカウントする方法等が挙げら
れる。 「蛇行幅」 金属細線の曲線状の点からP2とP3を結ぶ線への垂線
の最大長さを左側蛇行幅又は右側蛇行幅とし、隣接する
合計を蛇行幅とする。
Here, the image processing will be specifically described with reference to FIG. Here, "spring width"
"Kazu Yamazu" and "meandering width" will be described. Splash width Click the lower end P1 of the thin metal wire 7 suspended from the spool 3. An intersection P2 with the thin metal wire 7 located a predetermined length (50 mm in FIG. 5) above P1 is detected. The lateral length of the circumscribed rectangle of P1 and P2 is measured and defined as the splash width. Radius of predetermined length centering on P2
mm) and the intersection P3 between the thin metal wire 7 and the arc. P2
And a straight line connecting P3 to the image is counted. As an example of the counting method, a curve expression of a thin metal wire is made, and the number of times the differential value becomes 0, P2 and P3
A method of counting the number of intersections with a straight line connecting. "Wandering width" The maximum length of a perpendicular line from the curved point of the thin metal wire to the line connecting P2 and P3 is defined as the left-side meandering width or the right-side meandering width, and the adjacent total is defined as the meandering width.

【0025】ここで本画像処理手段は静止画像の撮像が
不充分で曲線の一部に不明瞭箇所が生じた場合(図4参
照)、隣接曲線の曲線式から補正して静止画像を完成さ
せる機能を有している。この場合も照明を充分に行い不
明瞭箇所が生じないようにすることが好ましい。
Here, the image processing means completes the still image by correcting the curve equation of the adjacent curve when the still image is not sufficiently captured and an unclear portion occurs in a part of the curve (see FIG. 4). Has a function. In this case as well, it is preferable to perform sufficient illumination so that unclear portions do not occur.

【0026】[0026]

【実施例】純度99.99重量%Au線について、直径
25μmに伸線加工して、4%伸び率になるようにアニ
ールし、その表面に潤滑剤を塗布した後アルミ製スプー
ルに1000m巻き取った試料を作成した。この中で金
属細線の直進性に影響を及ぼす工程を調整して飼料A、
試料Bの2種類の試料を作成し、供試材料とした。
EXAMPLE A wire with a purity of 99.99% by weight of Au was drawn to a diameter of 25 μm, annealed so as to have an elongation of 4%, a lubricant was applied to the surface, and then wound 1000 m on an aluminum spool. A sample was prepared. In this process, feed A,
Two types of sample B were prepared and used as test materials.

【0027】まず図3に示す3の位置にスプールをセッ
トして、モータ4を駆動してスプールを回転させ金線7
を図示のように垂下させ、バックは黒色アルマイト板1
5とした。次いで、照明装置11をAu線7とカメラ1
2の間でありカメラアングルの外側になるように配置し
た。図3に於いては照明装置して環状光源を用いた例を
示している。
First, the spool is set at the position 3 shown in FIG. 3, and the motor 4 is driven to rotate the spool so that the wire 7
As shown in the illustration, and the back is a black alumite plate 1
It was set to 5. Next, the lighting device 11 is connected to the Au wire 7 and the camera 1.
It was arranged between two and outside the camera angle. FIG. 3 shows an example in which an annular light source is used as a lighting device.

【0028】次に撮像装置としてのカメラ12をセット
し、金線7を撮像した。次にその静止画像をコントロー
ラ13で操作して画像処理手段としてのパソコン14に
取り込みその画像を表示させた。不撮像箇所が生じた場
合、前後の曲線の式を用いて補正し金線の連続した画像
を完成させた。ここで不撮像箇所の一例を図4に示す。
図4(1)は試料Aを用いた後述の実施例3、図4
(2)は試料Bを用いた後述の実施例9で生じた不撮像
箇所の状況である。
Next, the camera 12 as an imaging device was set, and the gold wire 7 was imaged. Next, the still image was operated by the controller 13 and taken into the personal computer 14 as an image processing means to display the image. When a non-imaging location occurred, correction was performed using the equations of the front and rear curves to complete a continuous image of gold lines. Here, an example of a non-imaging location is shown in FIG.
FIG. 4A shows a third embodiment using the sample A, and FIG.
(2) is the situation of the non-imaging location that occurred in Example 9 described below using sample B.

【0029】Au線の連続した画像を用いて直進性評価
としての「はね幅」「山かず」「蛇行幅」を測定した。
「はね幅」測定はまず、図5に於ける金線先端P1とP
1から垂直方向長さ50mmに於けるAu線の位置P2を
検出する。P1とP2の外接四角形の横方向長さを測定
しはね幅とした。「山かず」は図5に於けるP2を中心
とする半径220mm円弧と金線7との交点P3を検出す
る。P2とP3を結ぶ直線を画像に書き込み左右の金属
細線の曲線式を作り、微分値が0になる回数をカウント
した。「蛇行幅」は図5に於ける金線7の曲線上の点か
らP2とP3を結ぶ線への垂線の最大長さを左側蛇行幅
又は右側蛇行幅とし、隣接する合計の最大値を蛇行幅と
した。
Using a continuous image of Au lines, “bounce width”, “kazu no mountain”, and “meandering width” as straightness evaluation were measured.
First, the "spring width" measurement is performed by firstly arranging the gold wire tips P1 and P1 in FIG.
From position 1, the position P2 of the Au line at a vertical length of 50 mm is detected. The lateral length of the circumscribed rectangle of P1 and P2 was measured and defined as the splash width. "Kazu Yamazu" detects the intersection P3 of the arc of 220 mm in radius centered on P2 and the gold wire 7 in FIG. A straight line connecting P2 and P3 was written in the image to create a curve equation of the left and right thin metal wires, and the number of times the differential value became 0 was counted. The meandering width is defined as the leftmost meandering width or the rightmost meandering width of the perpendicular from the point on the curve of the gold wire 7 in FIG. 5 to the line connecting P2 and P3, and the maximum value of the adjacent total is meandering. Width.

【0030】照明装置として実施例1,7は点状光源を
対象材料長さ方向の中央部、向かって左側に1個設置
し、実施例2,8は点状光源を対象材料長さ方向の中央
部、左右各々1個合計2個設置し、実施例3,9は点状
光源を対象材料長さ方向の上下1/4の高さに、左右各
々2個合計4個設置し、実施例4,10は対象材料を超
える長さの線状光源を左右各々1本合計2本設置し、
5,11は図3に示すような環状光源を対象材の正面即
ち、撮像装置と対象材料の間に1本設置し、実施例6,
12は点状光源を対象材料長さ方向のランダム位置に、
左右各々5個合計10個設置した。試料は直進性の異な
る試料A、試料Bを用いた。
In the first and seventh embodiments, one point light source is provided at the center in the longitudinal direction of the target material, and one point light source is installed on the left side. In the second and eighth embodiments, the point light source is disposed in the longitudinal direction of the target material. In the third and ninth embodiments, a total of four point light sources are installed at each of the left and right sides at a height of the upper and lower quarters in the longitudinal direction of the target material. 4 and 10 install two linear light sources with a length exceeding the target material, one each on the left and right,
5 and 11 each install one annular light source as shown in FIG. 3 in front of the target material, that is, between the imaging device and the target material.
12 is a point light source at a random position in the length direction of the target material,
A total of 10 pieces were installed, 5 pieces each on the left and right. Samples A and B having different linearity were used.

【0031】まず試料Aを繰り出して30cm程度垂下す
るように先端を切断し、そのワイヤ位置で照明装置を実
施例1〜6のように変更して、「はね幅」「山かず」
「蛇行幅」及び不撮像部分の数を測定した。同一条件で
10回の測定を行いその平均値とばらつきの測定結果を
実施例1〜6として表1に示した。次いで、試料Aに変
えて試料Bを用いたこと以外は実施例1〜6に対応して
実施例7〜12の測定を行いその測定結果を同様に表1
に示した。
First, the sample A was extended, the tip was cut so as to hang down by about 30 cm, and the lighting device was changed at the wire position as in Examples 1 to 6, and the “splash width” and “mountain” were changed.
The “meandering width” and the number of non-imaging portions were measured. The measurement was performed ten times under the same conditions, and the average and the measurement results of the variations are shown in Table 1 as Examples 1 to 6. Then, the measurements of Examples 7 to 12 were performed in correspondence with Examples 1 to 6 except that Sample B was used instead of Sample A, and the measurement results were similarly shown in Table 1.
It was shown to.

【0032】従来方法として図1に示す装置を用いて正
面扉2に設置した透明目盛板8を利用して「はね幅]
「山かず」「蛇行幅]について目視による測定を行っ
た。この時図2に示す平面鏡に写る金線の像9と金線7
が一致する位置から観察した。試料A、試料Bを用いて
P1,P2,P3の設定は実施例と同様にして同一条件
で10回の測定を行い、その平均値とばらつきの測定結
果を比較例1,2として表1に示した。
As a conventional method, using the apparatus shown in FIG. 1 and utilizing a transparent scale plate 8 installed on the front door 2, "spring width"
The measurement was carried out visually for “Kazu Yamazu” and “meandering width.” At this time, the gold wire image 9 and the gold wire 7 shown in the plane mirror shown in FIG.
Observed from the position where. Using the samples A and B, P1, P2, and P3 were set ten times under the same conditions as in the example, and the average value and the measurement results of the variation were shown in Table 1 as Comparative Examples 1 and 2. Indicated.

【0033】[0033]

【表1】 [Table 1]

【0034】(試験結果) (1)測定値の信頼度は統計的に、平均値±1.96σ
/(n1/2)(但しσは標準偏差、nは測定回数)とし
て取り扱われる。実務上n=2〜3が用いられる事を考
慮すると測定値の標準偏差は小さいことが信頼度向上の
点で必要であることが判る。 (2)試料Aを用いた目視解析と画像解析によるはね幅
の標準偏差を比較してみると比較例1と実施例1〜6の
対比から次のことが判る。
(Test Results) (1) The reliability of the measured values was statistically averaged ± 1.96σ.
/ (N 1/2 ) (where σ is the standard deviation and n is the number of measurements). Considering that n = 2 to 3 is practically used, it is understood that it is necessary that the standard deviation of the measured value be small in order to improve the reliability. (2) A comparison of the standard deviation of the spring width by visual analysis and image analysis using the sample A reveals the following from comparison between Comparative Example 1 and Examples 1 to 6.

【0035】 標準偏差は、目視測定である比較例1
が0.95mmであることに対して画像解析である実施例
1〜6のものでは0.11〜0.47mmとばらつきが小
さくなっていることが判る。 画像解析の中でも照明装置を試料の両側に設置した
実施例2〜6のものは、標準偏差が0.11〜0.43
mmとばらつきが更に小さくなっていることが判る。 (3)試料Aを用いた目視解析と画像解析による蛇行幅
の標準偏差を比較してみると比較例1と実施例1〜6の
対比から次のことが判る。
Comparative Example 1 where the standard deviation is a visual measurement
Is 0.95 mm, whereas in Examples 1 to 6 which are image analysis, the variation is as small as 0.11 to 0.47 mm. Among the image analysis, those of Examples 2 to 6 in which the illumination devices were installed on both sides of the sample had a standard deviation of 0.11 to 0.43.
It can be seen that the variation with mm is even smaller. (3) Comparing the standard deviation of the meandering width by visual analysis and image analysis using the sample A, the following is found from the comparison between the comparative example 1 and the examples 1 to 6.

【0036】 標準偏差は、目視測定である比較例1
が0.88mmであることに対して画像解析である実施例
1〜6のものでは0.07〜0.42mmとばらつきが小
さくなっていることが判る。 画像解析の中でも照明装置を試料の両側に設置した
実施例2〜6のものは、標準偏差が0.07〜0.39
mmとばらつきが更に小さくなっていることが判る。 (4)試料Bを用いた目視解析と画像解析によるはね幅
の標準偏差を比較してみると比較例2と実施例7〜12
の対比から次のことが判る。
Comparative Example 1 is a standard deviation by visual measurement.
Is 0.88 mm, whereas in the case of Examples 1 to 6 which are image analysis, the variation is as small as 0.07 to 0.42 mm. Among the image analyses, those of Examples 2 to 6 in which the illumination devices were installed on both sides of the sample had a standard deviation of 0.07 to 0.39.
It can be seen that the variation with mm is even smaller. (4) A comparison of the standard deviation of the bounce width by visual analysis and image analysis using the sample B shows that Comparative Example 2 and Examples 7 to 12 were compared.
The following can be seen from the comparison of

【0037】 標準偏差は、目視測定である比較例2
が0.64mmであることに対して画像解析である実施例
1〜6のものでは0.09〜0.13mmとばらつきが小
さくなっていることが判る。 画像解析の中でも照明装置を試料の両側に各々複数
箇所に光源を設けるように設置した実施例3〜6のもの
は、標準偏差が0.09mmとばらつきが更に小さくなっ
てることが判る。 (5)試料Bを用いた目視解析と画像解析による蛇行幅
の標準偏差を比較してみると比較例2と実施例7〜12
の対比から次のことが判る。
The standard deviation is a visual measurement, Comparative Example 2
Is 0.64 mm, whereas in Examples 1 to 6 which are image analysis, the variation is small to 0.09 to 0.13 mm. In the image analysis, it can be seen that in Examples 3 to 6 in which the illuminating devices were installed at a plurality of positions on both sides of the sample, the standard deviation was 0.09 mm and the variation was further reduced. (5) Comparison of the standard deviation of the meandering width by visual analysis using sample B and image analysis shows that Comparative Example 2 and Examples 7 to 12 were compared.
The following can be seen from the comparison of

【0038】 標準偏差は、目視測定である比較例2
が0.53mmであることに対して画像解析である実施例
7〜12のものでは0.06〜0.13mmとばらつきが
小さくなっていることが判る。 画像解析の中でも照明装置を試料の両側に各々複数
箇所に光源を設けるように設置した実施例9〜12のも
のは、標準偏差が0.06〜0.09mmとばらつきが更
に小さくなっていることが判る。 (6)以上の測定結果から次のことがいえる 目視観察より画像解析による方がはね幅、蛇行幅等
の直進性測定値のばらつきを大幅に抑制することができ
る。
The standard deviation is a comparative example 2 which is a visual measurement.
Is 0.53 mm, whereas in the case of Examples 7 to 12, which are image analysis, the variation is as small as 0.06 to 0.13 mm. In the image analysis, in the case of Examples 9 to 12 in which the illuminating devices were installed so as to provide light sources at a plurality of locations on both sides of the sample, the standard deviation was 0.06 to 0.09 mm, and the variation was further reduced. I understand. (6) The following can be said from the above measurement results. Variations in the rectilinearity measured values such as the spring width and meandering width can be significantly suppressed by image analysis rather than by visual observation.

【0039】 画像解析方法の中でも、不撮像箇所を
補正して測定したものと対比して照明を確実にして不撮
像箇所を減少させる程直進性測定値のばらつきを更に抑
制することができる。
Among the image analysis methods, the dispersion of the straightness measurement value can be further suppressed as the illumination is made more reliable and the number of the non-imaging portions is reduced as compared with the method in which the non-imaging portions are corrected and measured.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来例の金属細線の直進性評価装置。FIG. 1 is a conventional thin metal wire straightness evaluation device.

【図2】図1の装置による金属細線の目視像を示す。FIG. 2 shows a visual image of a thin metal wire by the apparatus of FIG.

【図3】本発明の金属細線の直進性の評価装置の例。FIG. 3 is an example of an apparatus for evaluating the straightness of a thin metal wire according to the present invention.

【図4】金属細線の撮影像における欠落部の説明図。FIG. 4 is an explanatory diagram of a missing portion in a captured image of a thin metal wire.

【図5】金属細線の直進性の評価を説明する図。FIG. 5 is a diagram illustrating evaluation of straightness of a thin metal wire.

【符号の説明】[Explanation of symbols]

1…風防用容器 2…正面扉 3…スプール 4…繰り出しモータ 5…コントローラ 7…垂下した金属細線 11…照明装置 12…撮像装置 13…コントローラ 14…画像処理装置 15…黒色アルマイト板 16…モータ固定台 17…固定台回転軸 DESCRIPTION OF SYMBOLS 1 ... Windshield container 2 ... Front door 3 ... Spool 4 ... Feeding motor 5 ... Controller 7 ... Hanging thin metal wire 11 ... Illumination device 12 ... Imaging device 13 ... Controller 14 ... Image processing device 15 ... Black anodized plate 16 ... Motor fixed Table 17: Fixed table rotation axis

フロントページの続き Fターム(参考) 2F065 AA47 BB12 DD06 DD11 FF04 GG15 GG16 GG17 HH14 JJ03 JJ26 PP11 QQ00 QQ17 QQ41 5B057 AA01 BA02 CF05 DA03 DA13 DB02 DC07 DC36 5F044 FF00 Continuation of the front page F term (reference) 2F065 AA47 BB12 DD06 DD11 FF04 GG15 GG16 GG17 HH14 JJ03 JJ26 PP11 QQ00 QQ17 QQ41 5B057 AA01 BA02 CF05 DA03 DA13 DB02 DC07 DC36 5F044 FF00

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 金属細線を先端から所定長さを垂下させ
る対象材料保持手段と、対象材料に照明を施す照明装置
と、対象材料を撮像する為の撮像装置を備え、該撮像装
置から対象材料の画像を入力した後に該画像を処理する
画像処理手段を備えて成ることを特徴とする金属細線の
直進性評価装置。
An object material holding means for suspending a thin metal wire from a tip by a predetermined length, an illuminating device for illuminating the object material, and an imaging device for imaging the object material, wherein the object material An image processing means for processing the image after the image has been input.
【請求項2】 照明装置が対象材料の前方左右に光源を
有する照明装置である請求項1記載の金属細線の直進性
評価装置。
2. The apparatus for evaluating the straightness of a thin metal wire according to claim 1, wherein the illuminating apparatus is an illuminating apparatus having a light source in front and left and right of a target material.
【請求項3】 画像処理手段が画像不明瞭箇所の補正手
段を有する請求項1または請求項2記載の金属細線の直
進性評価装置。
3. The apparatus for evaluating straightness of a thin metal wire according to claim 1, wherein the image processing means has a means for correcting an unclear image portion.
【請求項4】 金属細線を先端から所定長さに垂下さ
せ、対象材料に照明を施して該垂下した金属細線を撮像
装置によって撮像し、得られた金属細線の撮像にもとづ
いて金属細線の直進性を評価することを特徴とする金属
細線の直進性評価方法。
4. A thin metal wire is suspended from a tip to a predetermined length, a target material is illuminated, an image of the suspended metal thin wire is taken by an imaging device, and the thin metal wire is straightened based on the obtained image of the thin metal wire. A method for evaluating the straightness of thin metal wires, comprising evaluating the straightness.
【請求項5】 前記撮影像にもとづく金属細線の直進性
の評価をデータ処理装置で行なう請求項4記載の金属細
線の直進性評価方法。
5. The method for evaluating the straightness of a thin metal wire according to claim 4, wherein the straightness of the thin metal wire is evaluated by a data processor based on the photographed image.
【請求項6】 前記垂下した金属細線に対して先方左右
両方に光源を配して照明を施す請求項4又は5記載の金
属細線の直進性評価方法。
6. The method for evaluating the straightness of a thin metal wire according to claim 4, wherein a light source is disposed on both the left and right sides of the hanging thin metal wire for illumination.
【請求項7】 前記撮影像に画像不明瞭箇所があると
き、その部分を補正する請求項4〜6のいずれかに記載
の金属細線の直進性評価方法。
7. The method for evaluating the straightness of a thin metal wire according to claim 4, wherein when there is an unclear portion in the photographed image, the portion is corrected.
JP2000314228A 2000-10-13 2000-10-13 Rectilinear propagation estimating equipment and method of metal thin wire Pending JP2002124534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000314228A JP2002124534A (en) 2000-10-13 2000-10-13 Rectilinear propagation estimating equipment and method of metal thin wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000314228A JP2002124534A (en) 2000-10-13 2000-10-13 Rectilinear propagation estimating equipment and method of metal thin wire

Publications (1)

Publication Number Publication Date
JP2002124534A true JP2002124534A (en) 2002-04-26

Family

ID=18793522

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2002124534A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008268229A (en) * 2008-06-06 2008-11-06 Kao Corp Fiber shape evaluation method
KR101117059B1 (en) * 2002-09-20 2012-02-29 퀄컴 엠이엠에스 테크놀로지스 인크. Controlling electromechanical behavior of structures within a microelectromechanical systems device
TWI393198B (en) * 2004-09-14 2013-04-11 Tanaka Electronics Ind Evaluation method and straightness evaluation device of fine metal wire

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175310A (en) * 1991-12-26 1993-07-13 Canon Inc Wire bonding inspecting apparatus
JPH06323822A (en) * 1993-05-17 1994-11-25 Toshiba Corp Method for recognizing profile of bonding wire
JPH11190604A (en) * 1997-12-26 1999-07-13 Tanaka Electron Ind Co Ltd Linearity measuring device and method for metal fine wire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175310A (en) * 1991-12-26 1993-07-13 Canon Inc Wire bonding inspecting apparatus
JPH06323822A (en) * 1993-05-17 1994-11-25 Toshiba Corp Method for recognizing profile of bonding wire
JPH11190604A (en) * 1997-12-26 1999-07-13 Tanaka Electron Ind Co Ltd Linearity measuring device and method for metal fine wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101117059B1 (en) * 2002-09-20 2012-02-29 퀄컴 엠이엠에스 테크놀로지스 인크. Controlling electromechanical behavior of structures within a microelectromechanical systems device
TWI393198B (en) * 2004-09-14 2013-04-11 Tanaka Electronics Ind Evaluation method and straightness evaluation device of fine metal wire
JP2008268229A (en) * 2008-06-06 2008-11-06 Kao Corp Fiber shape evaluation method
JP4688902B2 (en) * 2008-06-06 2011-05-25 花王株式会社 Fiber shape evaluation method

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