JP2002100595A - Device and method for releasing wafer and wafer treatment device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily release a thinned wafer from the sub-plate with which the circuit pattern face is temporarily adhered to a sub-plate by an adhesive agent and the back is polished. SOLUTION: A sub-plate (1) with wafer (3) is held on a holder (7) and the adhesive agent is heated to a temperature capable of releasing and fused. Afterwards, a vacuum chuck (11) is lowered and the wafer is adsorbed. By forward and backward turning and laterally sliding this vacuum chuck (11), the wafer (3) is released from the sub-plate (1). The sub-plate (1) is taken out of the holder. Besides, the released wafer can be continuously washed, dried and stuck to a wafer sheet as well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thinned wafer.
The present invention relates to a wafer separating apparatus and method for separating wafers from a sub-plate and a wafer processing apparatus using the same.

[0002]

2. Description of the Related Art In recent years, wafer level CSP (Chip Size) has been developed.
Package) It has been proposed to develop a semiconductor device having a three-dimensional stacked structure which achieves high speed and multi-functionality by developing technology. For this purpose, the back surface of a wafer on which a circuit pattern is formed is ground. Then, the thickness must be reduced to about 50 μm. It is known that such backside grinding is performed by attaching a holding tape to a circuit pattern (device) side formed on the wafer, but in such a method, the thickness of the wafer is reduced. Can be reduced to only about 100 μm. Also, grinding can be achieved by grinding the wafer while it is temporarily bonded to the sub-plate with an adhesive. However, since the back-ground wafer is extremely thin as described above, Handling was troublesome, and it was difficult to easily peel off the subplate or transport it. As a method for peeling, a method is known in which the whole is immersed in a solution of acetone or IPA (isopropyl alcohol) to peel the film. However, it takes a long time to peel the film and can be applied only to a wafer having a small diameter. Large size way
Ha could not be applied. In addition, about 30-1
If the wafer has a thickness of 50 μm or more, it can be mechanically pushed from the side of the wafer, manually peeled off using a razor, or peeled off by absorbing the wafer as described above. A thin wafer cannot be easily peeled off.

[0003]

The problem to be solved by the present invention is as follows.
A wafer peeling apparatus and method capable of peeling a thin wafer having a back surface ground by being attached to a sub-plate as described above from the sub-plate in a short time and facilitating subsequent cleaning. And a wafer processing apparatus using the same.

[0004]

According to the present invention, a wafer having an adhesive applied to a circuit pattern surface is attached to a sub-plate, and the back surface thereof is ground to reduce the thickness of the wafer. An apparatus for separating from a sub-plate, the apparatus comprising: holding means for holding a sub-plate to which a wafer is attached in a fixed position; and bonding of an adhesive between the wafer and the sub-plate. Means for eliminating the adhesive force for weakening the force, suction means for sucking and holding the back surface of the wafer, and moving means for moving the suction means to a position in contact with the wafer and a position away from the subplate. The above object is achieved by providing a wafer peeling apparatus and method characterized by the following. The wafer thus peeled off is washed and dried, and
There is provided a wafer processing apparatus which can be attached to a sheet (dicing tape).

[0005]

FIG. 1 is an explanatory view showing a state in which a wafer (3) is adhered on a sub-plate (1) via an adhesive (2). The adhesive to be applied to the circuit pattern (device) (4) side is a natural adhesive or a synthetic resin adhesive that can be used well without damaging the wafer pattern surface. Can be used,
Among these adhesives, there are adhesives such as those which are melted by heating to a temperature at which the adhesive can be peeled according to their properties and whose adhesive strength is weakened, and those which lose their adhesive strength when irradiated with ultraviolet rays. It is preferably used. The sub-plate is made of ceramic, sapphire, quartz, silicon or the like and has a thickness of about 2 mm.

The back surface of the wafer (3) attached to the sub-plate (1) as described above is ground by a grinding device (not shown), and the thickness of the wafer itself is about 30 to 70 μm.
m, preferably about 50 μm. After that, the wafer-attached sub-plate undergoes a photolithography process for lamination, a metal deposition process, an unnecessary metal removal process, a solder plating process, and other appropriate processing processes, and is then conveyed to a peeling process. As described above, the back surface of the wafer may be a ground surface, a bump surface, or the like. Also, as described later, a wafer sheet is attached to the back surface of the wafer, and then the wafer is carried into a peeling step. May be.

As shown in FIG. 2, the peeling device (5) comprises holding means for holding the sub-plate (1) to which the wafer (3) is attached in a fixed position, a wafer and a sub-plate. Means for reducing the adhesive force of the adhesive between the substrates, suction means for sucking and holding the rear surface of the wafer, and the suction means at a position in contact with the wafer and at a position away from the subplate. It includes moving means for moving.

In the drawing, the holding means is constituted by a holding body (7) made of aluminum or another metal material having good heat conductivity having a concave portion (6) in which the subplate (1) is fitted. By connecting the suction holes (8) provided in the holder (7) to a vacuum suction source (not shown), the sub-plate (1) placed in the recess (6) is suction-held. The concave portion (6) is formed corresponding to the outer shape of the subplate (1). The concave portion is formed larger than the subplate, and is fitted along the peripheral wall of the concave portion. An adjusting ring (not shown) is formed, and the adjusting ring is appropriately fitted into the concave portion so as to correspond to a plurality of sub-plates having different outer shapes. There is an insertion portion (not shown) into which the light-emitting device enters.

The above-mentioned adhesive force eliminating means can be appropriately constituted in association with the adhesive used for temporarily adhering the above-mentioned wafer to the subplate. In the figure, a natural adhesive is used as the adhesive, and the adhesive is melted by raising the temperature to the peeling temperature, the adhesive strength is weakened, and the peelable adhesive is used. Heater
The heating plate (10) embedded with (9) is used. The temperature of the heater is controlled by a temperature sensor and a set time, and the heater (3) must be heated to a temperature below the circuit pattern (device). For example, the temperature is set to 250 ° C. or less, preferably about 145 ° C. In addition, a cooling device that cools the adhesive or an ultraviolet irradiation device that weakens the adhesive force can be used as the adhesive force eliminating means depending on the properties of the adhesive.

A vacuum chuck (11) is used as suction means for sucking and holding the back surface of the wafer. The vacuum chuck is formed in a size corresponding to the wafer, so that a wafer of each size can be held by suction. In this case, the outer diameter of the wafer suction surface of the chuck is slightly smaller than the outer diameter of the wafer, for example, about 2 to 2 mm.
It may be formed to be smaller by about 0 mm, preferably about 4 to 10 mm. In this way, when the wafer is sucked and held and is slid in the horizontal direction as described later, the molten adhesive may be pushed by the peripheral edge of the wafer and may rise to the upper surface of the wafer. Can also be prevented from entering between the wafer and the wafer suction surface.

In order to be able to selectively suction a plurality of wafers having different sizes with one vacuum chuck, the arrangement shown in FIG. 3 may be used. That is, the chuck body (1
In (2), individual flow paths (13
a) ..., (13b) ... are formed, and these flow paths are connected to a vacuum suction source or a compressed air supply source via an electromagnetic valve (not shown). Then, for each of the individual flow paths (13a) and (13b), for example, a suction hole (14) corresponding to a 3-inch wafer (3a) is provided.
a) Suction hole (14b) corresponding to 4-inch wafer (3b)
... is opened. With this configuration, when suctioning a 3-inch wafer (3a), a vacuum suction action is generated on the suction surface (15) through the individual flow path (13a) to cause the 4-inch wafer (3a) to suction.
In the case of C (3b), the suction surface (15) is passed through the individual flow path (13b).
In this case, a vacuum suction effect may be generated.

The wafer suction surface of the suction means is provided with a buffer member (16) having a buffer action by a heat-resistant elastic material such as synthetic rubber, elastic synthetic resin material and porous rubber material. In the buffer member (16), the suction holes (14a), (14
b) is open and the wafer (3) is
The suction member is sucked and held in contact with the suction surface of the surface of (16), is transferred as described later, and is separated from the suction surface of the surface of the buffer member by ejecting air from the suction hole in an unloader conveyor section or the like. At this time, it is preferable that the surface of the buffer member be a non-adhesive surface so that the wafer can be easily separated from the thinned wafer as described above without damaging the wafer. As such a non-adhesive surface, for example, a fine uneven shape may be provided on the surface, a non-adhesive treatment may be performed, or the buffer member may be formed of a non-adhesive material. If a cloth (16a) such as a non-adhesive gauze is provided on the wafer with good air permeability so as to cover the entire surface of the suction surface, air is blown out from the suction hole of the vacuum chuck. In this case, the wafer can be reliably removed.

Moving means (17) for moving the suction means
Since it is only necessary to have a function capable of moving the suction means to a position in contact with the wafer and a position away from the subplate, specifically, a fluid pressure cylinder, a motor,
The vacuum chuck (11) is suitably configured to be lowered, raised, moved horizontally, etc., preferably in such a manner as to be able to adjust the moving speed, by appropriately combining a cylinder, a motor and the like as a drive source. .

When the wafer is moved, the adhesive is heated and melted. Therefore, if the wafer is directly lifted in the vertical direction with respect to the subplate, the adhesive in the molten state spreads in a plane. Depending on the layer, the wafer may not be easily peeled off. Therefore, in the present invention, after the vacuum chuck sucks and holds the wafer,
The wafer is moved in the lateral direction along the subplate. More preferably, when the wafer is chucked and held, the vacuum chuck is rotated clockwise.
The wafer is peeled by sliding in the horizontal direction after the adhesive is weakened by linearly rotating and reversing the adhesive in a counterclockwise direction at a rotation angle of several degrees to gather the adhesive in a line and weaken the adhesive force. . Therefore, when such an adhesive is used, the moving means also has a function of rotating the vacuum chuck.

The operation of the peeling section of the peeling apparatus and the peeling method will be described with reference to FIG. 4. The wafer (3) whose back surface has been ground and reduced in thickness has a sub-plate (1) made of a natural material. As shown in FIG. 4A in a state of being temporarily bonded with a system adhesive,
It is carried to the concave portion (6) of the holder (7) by an appropriate robot or transport arm. At this time, when the wafer is slid by the moving means in a later step, the wafer is set in a direction in which the strength of the wafer does not become weaker with respect to the moving direction, and the wafer is loaded. Thereafter, when the adhesive is heated to the peeling temperature and melted by heating from the heating plate (10), the vacuum chuck (11) descends from the upper surface.

When the vacuum chuck (11) sucks and holds the wafer (3), the vacuum chuck (11) rotates several degrees in the forward and reverse directions to collect the adhesive in a substantially linear shape. Then, the wafer is slid in the lateral direction to separate the wafer from the sub-plate, and is carried out to an unloader (not shown) (FIG. 4B). At this time, the wafer may be lifted after rotating and sliding the vacuum chuck (11) to carry the wafer to the unloader portion of the wafer (FIG. 4C). After that, sub-plate (1)
Is taken out to the unloader section of the sub-plate by a suitable robot or a transfer means such as a transfer arm (FIG. 4D).

After the wafer is transferred to the unloader, the wafer is separated from the suction surface by supplying air to the suction hole of the chuck. At this time, if a molten adhesive enters between the wafer suction surface of the chuck and the wafer, a part of the wafer may adhere and may not easily drop. If the outer diameter of the wafer suction surface is formed smaller than the outer diameter of the wafer, the molten adhesive does not enter between the wafer and the suction surface, and there is no such a possibility. In addition, if the air-absorbing non-adhesive cloth body (16a) is provided on the wafer suction surface as described above, the wafer can be dropped more reliably when air is supplied from the suction hole. Can be.

When a synthetic resin adhesive whose adhesive strength is lost or weakened by ultraviolet irradiation is used as the adhesive, the vacuum chuck (11) rises after adsorbing the wafer. The wafer is transferred to an unloader. While the transfer arm transfers the subplate (1) to its unloader section and the upper surface of the holder is open,
The next sub-plate with a wafer is carried into the holder, and the ultraviolet irradiation device (not shown) is moved to the upper surface to irradiate the ultraviolet light from the upper surface. If the evacuation is performed, there is no problem in operation. The ultraviolet irradiation device can be linked with the vacuum chuck, and if the holder and the heating plate are made of a transparent material such as quartz, the ultraviolet light can be irradiated from the lower surface side (not shown).

FIG. 5 is an explanatory view showing a process in which a peeling section of a peeling device is incorporated and a wafer can be peeled automatically. In the figure, the apparatus is provided in a frame (18), and a cassette accommodating a sub-plate (1) with a wafer (3) before peeling is provided inside an opening / closing slot for carrying the cassette. A cassette elevator section (19) for holding is provided, and the sub-plates with wafers are sent out one by one to a loader conveyor section (20), and are held at a fixed position by a positioning mechanism at this position. . The loader conveyor section (20)
The sub-plate (1) with the wafer (3) is provided by a plate transport section (23) having a transport arm (22). It is sent to the peeling section (21).

In the stripping section (21), the wafer (3) is stripped from the sub-plate (1) as described above,
In FIG. 5, the wafer (3) is sent to the unloader conveyor (24) by the vacuum chuck (11) and the moving means (17) not shown. When the unloader conveyor provided in the unloader conveyor section (24) rotates, the wafers are stored one by one in the cassette of the cassette elevator section (25).

The sub-plate (1) from which the wafer has been peeled is sent to the unloader conveyor section (26) by the plate transport section (23), and the unloader conveyor section (26).
Cassette elevator section by unloader conveyor (27)
Are stored one by one in the cassette.

The unloader conveyors (24), (2)
The unloader conveyor of 6) is preferably constituted by a conveyor in which Teflon (registered trademark) rollers and the like are arranged in parallel so as to prevent the adhesive from adhering. Further, instead of the cassette for accommodating the wafers, the wafers may be laminated with an appropriate protective sheet interposed (not shown).

In order to supply the wafer-attached sub-plate to the peeling step manually, the arrangement shown in FIG. 6 may be used. In this case, the sub-plate (1) with the wafer (3) is directly placed on the loader (28) inside the opening / closing type charging section formed on the frame (18). After peeling the c, the sub-plate (1) is carried out to the above-mentioned loading section (28) by the plate transport section (23), and is taken out from the loading section. Is almost the same as the configuration shown in FIG.

After the peeling step shown in FIG. 5, a step of cleaning the wafer or the sub-plate may be connected. For example, as shown in FIG. 7, a washing / drying section (29) of the wafer is connected so as to receive the wafer (3) peeled off from the sub-plate in a communicating manner. A cleaning and drying section (30) of the sub-plate is connected so that the separated sub-plate (1) can be communicated and received, and a cassette is provided at the end of each of the cleaning and drying sections (29) and (30) for cleaning. The wafers and sub-plates may be stored in a cassette or the like. The washing and drying can be performed by a process such as showering with an adhesive removing washing solution, drying with an air knife, rinsing with pure water, drying with an air or nitrogen gas knife, or the like.

In the above embodiment, the wafer is transported to a dicing step or the like after the wafer is peeled off from the sub-plate, and the wafer is processed in the dicing step. The wafer sheet (dicing tape) to be used may be pasted on the wafer. FIG. 8 shows such an embodiment, in which a wafer frame (31) is provided on the back surface of the thinned wafer (3).
A wafer sheet (32), such as a UV tape, supported on the carrier is adhered and carried to the concave portion (6) of the holder (7). Then, the wafer is subjected to a process substantially similar to the peeling process shown in FIG.
The wafer sheet (32) attached to the back of the wafer (3) is sucked by the vacuum chuck (11) and the wafer (3) is sub-plated.
(1). At this time, the adhesive of the wafer sheet (32) is the same as the adhesive (2) used when the wafer (3) was temporarily bonded to the sub-plate (1) at a peeling temperature. Using a temperature higher than the peeling temperature,
This prevents the wafer sheet (32) from peeling off from the wafer (3) when heated by the heating plate. Since a wafer sheet (32) is adhered to the peeled wafer (3), the wafer (3) is subjected to a dicing process as shown in FIG.
As shown in (D), the dicing saw (33) can be used for immediate cutting, and the processing can be simplified.

FIG. 9 shows still another embodiment, in which wafers are peeled off from the sub-plate, washed and dried, and the steps up to attaching the wafer sheet for dicing can be performed continuously. -Wafer removal unit (34), wafer cleaning unit (3
5) and a wafer attaching device section (36) are sequentially connected.

The wafer peeling device section (34) is basically constructed in substantially the same manner as the apparatus shown in FIG. 5, and the wafer-attached sub-plate (1) comprises a cassette elevator section. (1
It is stored in the cassettes in (9) and (19) and sent to the transfer station (37) through the loader conveyor sections (20) and (20) sequentially.
Centered. By a transfer arm (22) of a plate transfer section (23) provided adjacent to the transfer station (37),
Substrate with wafer (1) from the station (37)
Is the peeling part (21) including a heating plate and a vacuum chuck, etc.
The wafer (3) is peeled from the sub-plate (1) as described above. The peeled wafer (3) is transferred to an unloader conveyor section (wafer station after peeling) (24) by the moving means (17) including the chuck (11) as described above. The sub-plate (1) is transmitted and received by the plate transport section (23).
It is returned to the cassette (37) and transported to the cassette elevator units (27), (27) having the sub-plate storage cassettes by a suitable robot or a transfer means such as a belt conveyor. A plurality of cassette elevator units (19), (27), etc. are provided so that they can be processed one after another. However, one or an appropriate number of cassette elevator units may be provided, or the cassette elevator units may be omitted. , May be supplied manually. The unloader conveyor (24) of the wafer is provided with a plurality of projections for supporting the wafer by floating so that the molten adhesive does not adhere to the belt. The projection is lowered so that the wafer is placed on the conveyor belt.

The wafer cleaning device section (35) is provided with various cleaning sections continuously through a shutter (38) so as to sequentially clean the wafer. As shown in FIG. 10, each washing section has a plurality of belt conveyors (39) running in parallel at intervals so as to place a wafer, and various types of belt conveyors are provided on both sides of the wafer. Nozzles (40) and (40) are provided above and below between the belts so as to simultaneously wash the cleaning liquid and the like, and the conveyor is moved left and right to simultaneously wash both surfaces. Various cleaning liquids such as acid and alkali can be used as the cleaning liquid. In the figure, acetone cleaning is performed in the first cleaning section (41), and IPA cleaning is performed in the second cleaning section (42) and the third cleaning section (43). ing.
Then, the wafer is washed with pure water in the fourth washing section (44), and finally dried in the drying section (44a), and the wafer is sent to the delivery station (45). The shower and the like are performed with a weak shower pressure that does not damage the wafer, and are dried with an air knife (46) before entering the next washing section from each washing section. Further, in the last drying section (44a), for example, it is possible to dry at about 80 ° C. by using a hot air device capable of varying from about 30 to 150 ° C. so that moisture entering the uneven surface of both surfaces of the wafer can be sufficiently dried. is there.

The delivery station (45) and the wafer
The wafer is adsorbed and held between the wafer sticking units (36), and the wafer mount (47) of the wafer sheet sticking unit (36) is held.
A mounting chuck (48) for moving the mounting chuck (48) is provided movably, and an auxiliary chuck (49) is provided between the belt conveyors below the portion where the mounting chuck (48) is located.
Are vertically movable (FIG. 11). The assisting chuck (49) rises when the mounting chuck (48) descends to attract the wafer to the mounting chuck (48). Preferably, a non-adhesive cloth is provided on the wafer on the suction surface of the mounting chuck (48).

The delivery station (45) is used to reverse the wafer on the delivery station according to the state of the device surface and the bump surface formed on the wafer (3). Are provided. For example, when the washed wafer (3) sent to the delivery station (45) is a wafer having a bump surface on the upper surface and a device surface on the rear surface, the reversing device is used. Does not operate, and the mounting chuck (48) sucks the wafer as it is. When the upper surface of the wafer is a mirror surface and the device surface and the bump surface are formed on the back surface side, the reversing device (50) is operated to place the wafer on the station (45). And stand by, and suck by the mounting chuck (48). In order to perform the above operation, the wafer suction chuck of the reversing device has functions of reversing the wafer, moving up and down, and moving back and forth.

In the wafer sheet sticking device section (36),
Wafer frame with wafer frame (31) mounted around
The wafer (32) is stored in the cassettes (51), (51) before wafer mounting, and sent one by one to the wafer mounting part (47) via the loader conveyor parts (52), (52). Come. An air stamp (53) is provided on the lower surface of the wafer mount (47) as shown in FIG. When the wafer (3) is sent onto the wafer sheet (32) by the mounting chuck (48), after the centering, the air stamp is released when the wafer comes into contact with the sheet. Ascend and attach the wafer to the sheet. Thereafter, the wafer sheet with the wafer attached thereto is unloaded from the unloader conveyor (54), (54).
After the wafer is mounted, it is stored in cassettes (55) and (55). The air stamp is preferably provided with a non-adhesive cloth so as not to adhere to the wafer sheet.

As shown in the drawing, the wafer peeling device (34) for receiving the wafer peeled from the sub-plate has a wafer station (unloader conveyor) (2) after peeling.
4), a delivery station (45) of a wafer cleaning unit (35) for receiving a wafer after cleaning and drying, and
The wafer mount unit (47) of the wafer sheet sticking unit (36) for receiving the wafer from the transfer station and the delivery station.
Are arranged so that the movement locus of the center of the wafer (3) moves in a straight line. Therefore, the thinned wafer is always transported in a stable state, washed and dried, and attached to a wafer sheet (dicing tape), so that the risk of breakage can be reduced.

[0033]

According to the present invention, a wafer having the above-mentioned structure, in which the circuit pattern surface is temporarily bonded to the sub-plate with an adhesive, is thinned by grinding the back surface of the wafer. And can be peeled from the sub-plate without breaking,
Further, it is possible to continuously perform processes such as washing and sticking to a wafer sheet.

[Brief description of the drawings]

FIG. 1 is a partially omitted explanatory view of a wafer and a subplate in a state where a circuit pattern surface of the wafer is temporarily bonded to a subplate with an adhesive.

FIG. 2 is a sectional view showing one embodiment of a peeling device.

FIGS. 3A and 3B show a vacuum chuck, wherein FIG. 3A is an explanatory diagram viewed from the bottom, and FIG.

FIGS. 4A to 4D are explanatory views showing a step of peeling a wafer from a sub-plate.

FIG. 5 is a configuration diagram of one embodiment by automatic processing incorporating a peeling unit.

FIG. 6 is an overall configuration diagram showing an embodiment in the case of performing manually.

FIG. 7 is a configuration diagram showing one embodiment in which a washing and drying step is connected.

FIGS. 8A to 8D are explanatory views showing another embodiment of the wafer peeling step.

FIG. 9 is a configuration diagram showing an embodiment of a processing apparatus that is continuous up to a step of attaching to a wafer sheet.

FIG. 10 is an explanatory view of a cleaning unit of the apparatus shown in FIG. 9;

11 is an explanatory diagram of a delivery station unit of the device shown in FIG.

12 is an explanatory diagram of a wafer mount section of the device shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Subplate 3 Wafer 5 Peeling device 7 Holder 10 Heating plate 11 Vacuum chuck 16 Buffer member

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[Procedure amendment]

[Submission date] November 1, 2001 (2001.11.
1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 4

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claim 12

[Correction method] Change

[Correction contents]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

When the wafer is moved, the adhesive is heated and melted. Therefore, if the wafer is directly lifted in the vertical direction with respect to the subplate, the adhesive in the molten state spreads in a plane. Depending on the layer, the wafer may not be easily peeled off. Therefore, in the present invention, after the vacuum chuck sucks and holds the wafer,
The wafer is moved in the lateral direction along the subplate. More preferably, when the wafer is chucked and held, the vacuum chuck is rotated clockwise.
After weakening the adhesive force gathered the adhesive is rotating alternately linearized with the rotation angle of a few degrees counterclockwise, weather by sliding laterally - so that stripping the wafer. Therefore, when such an adhesive is used, the moving means also has a function of rotating the vacuum chuck.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

When the vacuum chuck (11) holds the wafer (3) by suction, the vacuum chuck (11) is rotated clockwise and counterclockwise.
The adhesive is rotated several degrees in the measuring direction to collect the adhesive in a substantially linear shape, and then slid laterally to separate the wafer from the subplate and to carry it out to an unloader (not shown) (see FIG. 4 (B)).
At this time, the wafer may be lifted after rotating and sliding the vacuum chuck (11) to carry the wafer to the unloader portion of the wafer (FIG. 4C). Thereafter, the sub-plate (1) is taken out to the unloader section of the sub-plate by a suitable robot or a transfer means such as a transfer arm (FIG. 4).
(D)).

Claims (17)

[Claims] 1. An apparatus for attaching a wafer having an adhesive applied to a circuit pattern surface to a sub-plate and grinding the back surface of the thinned wafer from the sub-plate. The apparatus comprises: holding means for holding the sub-plate on which the wafer is attached in a fixed position; adhesive-loss means for reducing the adhesive strength of the adhesive between the wafer and the sub-plate;
A wafer peeling device comprising: suction means for sucking and holding the back surface of the wafer; and moving means for moving the suction means to a position in contact with the wafer and a position away from the subplate. . 2. The wafer peeling device according to claim 1, wherein said adhesive force eliminating means is a heating means for melting the adhesive. 3. The wafer peeling device according to claim 1, wherein the moving means slides the suction means in a lateral direction along the sub-plate when the suction means sucks the wafer. 4. The wafer peeling device according to claim 3, wherein the moving means rotates the suction means forward and reverse before sliding the suction means. 5. The wafer peeling device according to claim 1, wherein said adhesive force eliminating means is an ultraviolet irradiation means for irradiating the adhesive with ultraviolet light. 6. The wafer peeling apparatus according to claim 1, wherein said suction means is provided so that a suction part can be selected according to a size of the wafer. 7. The wafer peeling device according to claim 1, wherein an outer diameter of the wafer attaching surface of the suction means is smaller than an outer diameter of the wafer. 8. The wafer peeling device according to claim 7, wherein the outer diameter of the wafer attaching surface of the suction means is smaller than the outer diameter of the wafer by 2 to 20 mm. 9. The wafer peeling device according to claim 1, wherein a buffer member having a surface that is not adhered to the wafer is provided on the wafer suction surface of the suction means. 10. The wafer peeling device according to claim 1, wherein a wafer body that is not bonded to a gas permeable wafer is provided on a wafer suction surface of the suction means. 11. The wafer peeling device according to claim 1, wherein a wafer sheet is attached to a back surface of the wafer. 12. A wafer-attached sub-plate having a wafer which has been thinned by polishing the back surface of the sub-plate which has been adhered to the sub-plate with an adhesive, and the above-mentioned wafer has been adhered. The agent is melted so that it can be peeled off, the chuck is lowered to the back of the wafer, suction-held by the chuck, the chuck is rotated forward and inverted, and then laterally moved to sub-plate the wafer. Wafer peeling method for peeling from wafers. 13. The wafer peeling method according to claim 12, wherein an outer diameter of a wafer suction surface of the chuck is smaller than an outer diameter of the wafer. 14. The wafer peeling method according to claim 12, wherein the suction holding by the chuck is performed via a non-adhesive cloth body to a gas permeable wafer. 15. The wafer peeling method according to claim 12, wherein a wafer sheet is attached to a back surface of the wafer. 16. A wafer peeling device including the peeling device according to claim 1, and a wafer peeled from the sub-plate by the wafer peeling device, and is washed and dried while being conveyed by a belt. A wafer cleaning device, and a wafer sheet attaching device for attaching a wafer washed and dried by the wafer cleaning device to a wafer having a wafer frame attached to a periphery thereof. A wafer processing apparatus in which thinned wafers separated from a sub-plate are washed, dried, and continuously attached to a wafer sheet. 17. A post-peeling wafer stay of a wafer peeling device for receiving a wafer peeled from the subplate.
And a wafer to receive the wafer after washing and drying
A delivery station of the cleaning unit, and a wafer sheet and the wafer for receiving the wafer from the delivery station.
The wafer mount part of the sheet sticking device is
17. The wafer according to claim 16, wherein the trajectory along which the center of the c moves moves is arranged in a straight line.
C processing equipment.