JP2002093496A - Card edge connector assembly - Google Patents

Card edge connector assembly

Info

Publication number
JP2002093496A
JP2002093496A JP2000276316A JP2000276316A JP2002093496A JP 2002093496 A JP2002093496 A JP 2002093496A JP 2000276316 A JP2000276316 A JP 2000276316A JP 2000276316 A JP2000276316 A JP 2000276316A JP 2002093496 A JP2002093496 A JP 2002093496A
Authority
JP
Japan
Prior art keywords
contact
housing
contacts
board
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000276316A
Other languages
Japanese (ja)
Inventor
Shinichi Hashimoto
信一 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyco Electronics Japan GK
Original Assignee
Tyco Electronics AMP KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics AMP KK filed Critical Tyco Electronics AMP KK
Priority to JP2000276316A priority Critical patent/JP2002093496A/en
Priority to TW090121958A priority patent/TW506165B/en
Priority to US09/950,343 priority patent/US6506074B2/en
Priority to CNB011376392A priority patent/CN1237661C/en
Publication of JP2002093496A publication Critical patent/JP2002093496A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/82Coupling devices connected with low or zero insertion force
    • H01R12/83Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7005Guiding, mounting, polarizing or locking means; Extractors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/006Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily confirm the soldered state of contacts in a multi-stage card edge connector assembly. SOLUTION: One contact 12 is provided with a main body 12a, curved contact pieces 12c and 12c extending into receiving recesses 2 and 4 through contact piece insertion grooves 39 and 41, and a tine 12d at the lower end of the body 12d. The other contact 13 comprises contact members 14 and 15 and a conductive member 17 electrically connecting them at the rear section of a housing 6. A tine 15g is formed at the lower end of the contact member 15. The contact 12 is fitted from the rear section of the housing 6, and the contact members 14 and 15 of the contact 13 are fitted from the front section of the housing 6.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は子基板を装着するカ
ードエッジコネクタ組立体に関し、特に複数列となった
子基板受容凹部を有するカードエッジコネクタ組立体に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card edge connector assembly for mounting a daughter board, and more particularly to a card edge connector assembly having a plurality of rows of daughter board receiving recesses.

【0002】[0002]

【従来の技術】子基板を複数列、例えば2枚受容するタ
イプのカードエッジコネクタ組立体としては、特許第3
022230号公報に開示された2段重ね水平横置きタ
イプのモジュール基板用電気コネクタが知られている。
この電気コネクタは、上下2段の子基板受容凹部の各々
に延出するコンタクトを有する。これら全てのコンタク
トのタイン即ち親基板に接続されるコンタクトの脚部
は、ハウジングの子基板挿入側の反対側に位置してい
る。
2. Description of the Related Art As a card edge connector assembly of a type for receiving a plurality of rows of, for example, two daughter boards, Japanese Patent No.
There is known an electrical connector for a module board of a two-stage superimposed horizontal type disclosed in Japanese Patent No. 022230.
The electrical connector has contacts extending into each of the upper and lower daughter board receiving recesses. The tines of all these contacts, i.e. the legs of the contacts connected to the parent board, are located on the side of the housing opposite to the side where the daughter board is inserted.

【0003】[0003]

【発明が解決しようとする課題】前述の従来の電気コネ
クタにおいて、下段の子基板受容凹部用のコンタクトの
タインは上段の子基板受容凹部用のコンタクトのタイン
により隠されるので、外側から視認することができず、
親基板へのはんだ付状態の視認による検査が困難であ
る。また、はんだ付が不良であることが判明しても、は
んだ付用の工具をその不良個所に挿入することができな
いので修復が不可能である。
In the above-described conventional electrical connector, the tines of the contacts for the lower sub-substrate receiving recess are hidden by the tines of the contacts for the upper sub-substrate receiving recess, so that they can be visually recognized from the outside. Not be able to
It is difficult to visually inspect the soldering state of the mother board. Further, even if it turns out that the soldering is defective, it cannot be repaired because a soldering tool cannot be inserted into the defective part.

【0004】また、各列でタインの配列方向のピッチ
が、コンタクトの配置のピッチの半分になるので、親基
板への接続部の間隔が狭くなり親基板へ固定する為のは
んだ同士の短絡、所謂はんだブリッジが生じやすい。そ
の結果、不良品となりやすい。
Further, since the pitch of the tines in each row in the row direction is half the pitch of the contacts, the interval between the connecting portions to the parent substrate is reduced, and the short-circuit between the solders for fixing to the parent substrate is reduced. So-called solder bridges are likely to occur. As a result, defective products are likely to be produced.

【0005】上段の子基板受容凹部用のコンタクトのう
ち下側のコンタクトのタインを子基板挿入側に設けるこ
とも考えられるが、下段の子基板受容凹部内への子基板
挿入を阻害することになる。
Although it is conceivable to provide the tines of the lower contact on the sub-substrate insertion side among the contacts for the upper sub-substrate receiving recess, it is necessary to prevent insertion of the sub-substrate into the lower sub-substrate receiving recess. Become.

【0006】本発明は以上の点に鑑みてなされたもので
あり、複数段の子基板受容凹部を有するカードエッジコ
ネクタ組立体のコンタクトのはんだ付状態を視認により
容易に確認できるカードエッジコネクタ組立体を提供す
ることを目的とする。
The present invention has been made in view of the above points, and a card edge connector assembly capable of easily confirming the soldered state of contacts of a card edge connector assembly having a plurality of stages of daughter board receiving recesses by visual inspection. The purpose is to provide.

【0007】本発明の他の目的は、タインのはんだブリ
ッジが生じにくいカードエッジコネクタ組立体を提供す
ることにある。
It is another object of the present invention to provide a card edge connector assembly in which tine solder bridges are less likely to occur.

【0008】[0008]

【課題を解決するための手段】本発明のカードエッジコ
ネクタ組立体は、長手方向に延び且つ上下方向に複数の
段に形成された子基板受容凹部を前部に有し親基板に取
り付けられる絶縁性のハウジングと、各子基板受容凹部
内の上側および下側に長手方向に整列して配置される複
数のコンタクトとを備え、各コンタクトが上側に配置さ
れる上側接触片或いは下側に配置される下側接触片のい
ずれかを有すると共に親基板にタインを介して接続さ
れ、子基板を各子基板受容凹部内に装着して接触片と接
触させることにより親基板および子基板を電気的に相互
接続するカードエッジコネクタ組立体において、複数の
コンタクトが、ハウジングの後部から各段にまたがって
装着される、いずれかの側の接触片を有すると共に後部
にタインを有する複数の一体の第1コンタクトと、ハウ
ジングの前部から各段に夫々装着される他方の側の接触
片を有する複数の別体の接触部材を有し、該接触部材が
子基板受容凹部を避けた後部で導電部材により相互に連
結されると共に最下段に位置する接触部材がタインを有
してなる複数の第2コンタクトからなることを特徴とす
るものである。
SUMMARY OF THE INVENTION A card edge connector assembly according to the present invention is provided with an insulating board extending in a longitudinal direction and formed in a plurality of steps in a vertical direction at a front portion thereof and attached to a parent board. And a plurality of contacts arranged in a longitudinal direction on the upper and lower sides in each daughter board receiving recess, and each contact is arranged on an upper contact piece arranged on the upper side or on a lower side. The lower substrate has one of the lower contact pieces and is connected to the parent board via tines, and the parent board and the child board are electrically connected to each other by mounting the child boards in the respective child board receiving recesses and making contact with the contact pieces. In an interconnecting card edge connector assembly, a plurality of contacts are mounted across the steps from the rear of the housing, with multiple contact pieces on either side and tines at the rear. And a plurality of separate contact members each having a contact piece on the other side mounted on each stage from the front of the housing, the contact members avoiding the child substrate receiving recess. The contact member, which is interconnected by a conductive member at the rear and located at the lowest level, includes a plurality of second contacts having tines.

【0009】[0009]

【発明の効果】本発明のカードエッジコネクタ組立体
は、各子基板受容凹部内の上側および下側に長手方向に
整列して配置される複数のコンタクトが、ハウジングの
後部から各段にまたがって装着される、いずれかの側の
接触片を有すると共に後部にタインを有する複数の一体
の第1コンタクトと、ハウジングの前部から各段に夫々
装着される他方の側の接触片を有する複数の別体の接触
部材を有し、該接触部材が子基板受容凹部を避けた後部
で導電部材により相互に連結されると共に最下段に位置
する接触部材がタインを有してなる複数の第2コンタク
トからなるので、タインがハウジングの前後に分けて配
置され、それらのはんだ付状態を容易に視認できる。そ
の結果、不良品を排除でき、或いは、はんだ付が不良で
あっても容易に修復することができ、製品の品質、歩留
まりを向上させることができる。更に、タインをハウジ
ングの前後に振り分けることにより過度の狭ピッチにし
なくてすむので、半田ブリッジが生じにくい。従って不
良品が生じにくい。
According to the card edge connector assembly of the present invention, a plurality of contacts arranged in a longitudinal direction on the upper and lower sides in each daughter board receiving recess extend from the rear of the housing to each step. A plurality of integral first contacts having contact pieces on either side and having tines at the rear, and a plurality of contact pieces having contact pieces on the other side respectively mounted on each step from the front of the housing. A plurality of second contacts having a separate contact member, the contact members being interconnected by a conductive member at a rear portion avoiding the daughter board receiving recess, and a contact member located at the lowermost stage having tines; , The tines are arranged separately on the front and rear of the housing, and their soldered state can be easily visually recognized. As a result, defective products can be eliminated, or even if soldering is defective, it can be easily repaired, and the quality and yield of products can be improved. Further, since the tines are distributed to the front and rear of the housing, it is not necessary to make the pitch too narrow, so that the solder bridge is hardly generated. Therefore, defective products are unlikely to occur.

【0010】[0010]

【発明の実施の形態】以下、本発明のカードエッジコネ
クタ組立体(以下、単に組立体という)の好ましい実施
の形態について図面を参照して詳細に説明する。図1
は、2段重ね水平横置きタイプとして構成した場合の本
発明の組立体を示し、図1(A)は組立体の平面図、図
1(B)は正面図、図1(C)は側面図を夫々示す。以
下、図1を参照して説明する。組立体1は、上段の子基
板受容凹部(第2の子基板受容凹部)2及び下段の子基
板受容凹部(第1の子基板受容凹部)4を有し親基板2
0(図1(B))に取り付けられる絶縁性のハウジング
6を有する。以下、これらの子基板受容凹部2、4を単
に受容凹部2、4という。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a card edge connector assembly (hereinafter, simply referred to as "assembly") of the present invention will be described below in detail with reference to the drawings. FIG.
1 shows an assembly of the present invention when configured as a two-stage stacked horizontal type, FIG. 1A is a plan view of the assembly, FIG. 1B is a front view, and FIG. Each figure is shown. Hereinafter, description will be made with reference to FIG. The assembly 1 includes an upper sub-substrate receiving concave portion (second sub-substrate receiving concave portion) 2 and a lower sub-substrate receiving concave portion (first sub-substrate receiving concave portion) 4.
0 (FIG. 1 (B)). Hereinafter, these child substrate receiving concave portions 2 and 4 are simply referred to as receiving concave portions 2 and 4.

【0011】2列の平行な受容凹部2、4(図1
(B))はハウジング6の長手方向に沿って延び、複数
のコンタクト12(第1コンタクト)(14、15(図
2))が受容凹部2、4に臨んでハウジング6の後部即
ち図1(A)において上側の部分に取付けられている。
これらの受容凹部2、4には、図1(A)に示すように
子基板(カード)96,98が組立体1の前部から挿入
される。(下段の子基板96を第1の子基板、上段の子
基板98を第2の子基板という。)図1(B)には親基
板20を共に示す。
Two rows of parallel receiving recesses 2, 4 (FIG. 1)
(B)) extends along the longitudinal direction of the housing 6, and a plurality of contacts 12 (first contacts) (14, 15 (FIG. 2)) face the receiving recesses 2, 4, that is, a rear portion of the housing 6, that is, FIG. In A), it is attached to the upper part.
As shown in FIG. 1A, daughter boards (cards) 96 and 98 are inserted into these receiving recesses 2 and 4 from the front of the assembly 1. (The lower sub-substrate 96 is referred to as a first sub-substrate, and the upper sub-substrate 98 is referred to as a second sub-substrate.) FIG.

【0012】ハウジング6の両端部には、受容凹部2、
4に対応して2対のラッチ部材8、8、10、10が夫
々取り付けられており、挿入された子基板98、96を
これらのラッチ部材8、10で夫々係止するようになっ
ている。各ラッチ部材8、10の対は各対で左右対称と
なっている。なお、上段のラッチ部材8、8が、図1
(C)に示すようにハウジング6と一体に突設した支軸
22に回動可能に取り付けられている。尚、この支軸2
2はハウジング6と別体の部材であっても良い。
At both ends of the housing 6, receiving recesses 2,
4, two pairs of latch members 8, 8, 10, and 10 are attached, respectively, so that the inserted daughter boards 98, 96 are locked by these latch members 8, 10, respectively. . Each pair of latch members 8, 10 is symmetrical in each pair. Note that the upper latch members 8 and 8
As shown in (C), it is rotatably attached to a support shaft 22 protruding integrally with the housing 6. In addition, this support shaft 2
2 may be a member separate from the housing 6.

【0013】ハウジング6にはラッチ部材8、8、1
0、10に対応してハウジング6の両端に延びる平面形
状が略矩形のプレート(連結部材)16、18が取り付
けられている。プレート16、18は、各々1枚の金属
板から打ち抜き形成される。図1(A)に示すように上
段のプレート16は、平坦な主面24を有し、その後部
にハウジング6の長手方向に延びる段部21を経て、主
面24と同じ方向に延びる後面26が形成されている。
後面の両端部にはハウジング6の後面に回り込む断面L
字状の取付部28が延出している。
The housing 6 has latch members 8, 8, 1
Plates (connecting members) 16 and 18 having a substantially rectangular planar shape extending to both ends of the housing 6 corresponding to 0 and 10 are attached. Each of the plates 16 and 18 is stamped and formed from one metal plate. As shown in FIG. 1A, the upper plate 16 has a flat main surface 24, and a rear surface 26 extending in the same direction as the main surface 24 through a step 21 extending in the longitudinal direction of the housing 6 at the rear. Are formed.
A cross section L around the rear surface of the housing 6 is provided at both ends of the rear surface.
A letter-shaped mounting portion 28 extends.

【0014】プレート16の前端30の両側近傍にはプ
レート16の長手方向に延びる切欠き32、32が形成
されている。この各切欠き32から前端30に向かって
延びる段部34を経て、上段用のラッチ部材8の外側に
係合する略矩形の保持板36が形成されている。この保
持板36は、上段のラッチ部材8の外形形状に合わせて
前端30側が内側に収束している。この保持板36は子
基板(第2の子基板)98が挿入されてラッチ部材8と
係合した後、ラッチ部材8が外側に開いて子基板との係
合が外れないようにするためのものである。なお、主面
24が段部21、34によって相対的に上方に位置する
のは、子基板98に搭載されたIC(図示せず)のため
の空間を確保するためである。プレート18については
後述する。
Notches 32, 32 extending in the longitudinal direction of the plate 16 are formed near both sides of the front end 30 of the plate 16. A substantially rectangular holding plate 36 that engages with the outside of the upper-stage latch member 8 is formed through a step 34 extending from each notch 32 toward the front end 30. The front end 30 of the holding plate 36 converges inward in accordance with the outer shape of the upper latch member 8. The holding plate 36 is used to prevent the latch member 8 from opening and being disengaged from the daughter board after the daughter board (second daughter board) 98 is inserted and engaged with the latch member 8. Things. The reason why the main surface 24 is positioned relatively higher by the steps 21 and 34 is to secure a space for an IC (not shown) mounted on the daughter board 98. The plate 18 will be described later.

【0015】次に図2を参照して組立体1の断面形状に
ついて説明する。図2(A)は図1(A)の2A−2A
線に沿う断面図、図2(B)は図1(A)の2B−2B
線に沿う断面図である。ハウジング6は、図2(A)に
示すように、ハウジング6の後部からコンタクト12を
取り付ける上段および下段のコンタクト挿通孔(以下、
単に挿通孔という)38、40と、図2(B)に示すよ
うに前方から接触部材14、15を取り付ける上段及び
下段の挿通孔42、44をハウジング6の長手方向に位
置ずれした位置に有する。各挿通孔38、40は、上下
方向に位置合わせ(整列)し、受容凹部2、4に連通し
ている。挿通孔42、44も同様に上下方向に位置合わ
せ(整列)し、受容凹部2、4に隣接している。また、
挿通孔38、40に隣接して受容凹部2、4に連通する
接触片挿通溝39、41が形成されている。
Next, the sectional shape of the assembly 1 will be described with reference to FIG. FIG. 2 (A) is 2A-2A of FIG. 1 (A).
2B is a cross-sectional view taken along the line, and FIG.
It is sectional drawing which follows a line. As shown in FIG. 2A, the housing 6 has upper and lower contact insertion holes (hereinafter, referred to as “contact insertion holes”) for attaching the contacts 12 from the rear of the housing 6.
2B, and upper and lower insertion holes 42, 44 for attaching the contact members 14, 15 from the front as shown in FIG. 2B at positions displaced in the longitudinal direction of the housing 6. . The insertion holes 38 and 40 are vertically aligned (aligned) and communicate with the receiving recesses 2 and 4. Similarly, the insertion holes 42 and 44 are vertically aligned (aligned), and are adjacent to the receiving recesses 2 and 4. Also,
Contact piece insertion grooves 39 and 41 communicating with the receiving recesses 2 and 4 are formed adjacent to the insertion holes 38 and 40.

【0016】コンタクト12は、ハウジング6に形成さ
れたコンタクト受容溝23に配置される上下に延びる細
長い本体12aと、この本体12aから挿通孔38、4
0に圧入される取付タブ12b、12bと、これら取付
タブ12b、12bの部分から接触片挿通溝39、41
を経て受容凹部2、4内に夫々延びる湾曲した接触片
(上側接触片)12c、12cと、親基板20の図示し
ない導電パッドにはんだ付けされるタイン12dを本体
12aの下端に有する。タイン12dはハウジング6の
後部から突出するので外部からはんだ付け状態を視認す
ることができる。
The contact 12 has an elongated body 12a extending vertically, which is disposed in a contact receiving groove 23 formed in the housing 6, and insertion holes 38, 4 extending from the body 12a.
The mounting tabs 12b, 12b which are press-fitted into the contact tabs 0, and contact piece insertion grooves 39, 41 from the mounting tabs 12b, 12b.
At the lower end of the main body 12a are curved contact pieces (upper contact pieces) 12c, 12c respectively extending into the receiving recesses 2, 4 via the contact holes 12c, 12c, and tines 12d to be soldered to conductive pads (not shown) of the motherboard 20. Since the tines 12d protrude from the rear part of the housing 6, the soldering state can be visually recognized from the outside.

【0017】接触片12c、12cの先端部は、受容凹
部2、4内に挿入される子基板の導電パッド(図示せ
ず)と電気的接続をする接点12f、12fを有する。
The tips of the contact pieces 12c, 12c have contacts 12f, 12f electrically connected to conductive pads (not shown) of the daughter board inserted into the receiving recesses 2, 4.

【0018】受容凹部2、4を画成する上側の壁面2
a、4aが急角度で上方に傾斜しており、子基板はこの
角度で受容凹部2、4に挿入可能であることに注目すべ
きである。なお、この図2(A)には、前述の上段のプ
レート16の、段部21および取付部28が明瞭に示さ
れている。下段のラッチ部材10は、バーブ(刺)を側
縁に有する圧入片(図示せず)を有し、この圧入片をハ
ウジング6の図示しない溝に挿入することによりハウジ
ング6に取り付けられる。従って、ラッチ部材10はハ
ウジング6に対して上下に回動しないよう固定される。
Upper wall 2 defining receiving recesses 2, 4
It should be noted that a, 4a is inclined upward at a steep angle, so that the daughter board can be inserted into the receiving recesses 2, 4 at this angle. In FIG. 2A, the step portion 21 and the mounting portion 28 of the upper plate 16 are clearly shown. The lower latch member 10 has a press-fit piece (not shown) having a barb (stab) on a side edge, and is attached to the housing 6 by inserting the press-fit piece into a groove (not shown) of the housing 6. Therefore, the latch member 10 is fixed so as not to rotate vertically with respect to the housing 6.

【0019】次に接触部材14、15について説明す
る。接触部材14、15は本体14a、15aと、その
本体14a、15aから水平に延び、挿通孔42、44
内に夫々圧入される取付タブ14b、15bと、本体1
4a、15aから湾曲しながら受容凹部2、4内に延出
する接触片(下側接触片)14c、15cとを有する。
接触片14c、15cの先端は、子基板96、98の図
示しない電極と接触する接点14f、15fとなる。ハ
ウジング6の後部には接触部材14、15と位置合わせ
して縦長の溝25が形成され、この溝25内に金属板を
打ち抜き、形成したコ字状の連結片(導電部材)17が
配置される。連結片17の両端には接触脚17a、17
aが形成され、これらの接触脚17a、17aの間には
取付タブ17bが形成されている。接触脚17a、17
aの先端部には外向きの突起17cが夫々形成されてい
る。取付タブ17bは対応するハウジング6の溝46に
圧入されて固定され、接触脚17a、17aは対応する
ハウジング6の溝42a、44aに挿入される。溝42
a、44aは、挿通孔42、44と夫々連通し且つ隣接
しているので、接触脚17a、17aは接触部材14、
15の取付タブ14b、15bと接触し、接触部材1
4、15が電気的に接続される。これによって、接触部
材14、15は一体のコンタクト(第2コンタクト)1
3となる。接触部材15の下端にはハウジング6の前
側、且つ外側に延びるタイン15gが形成されている。
従って、このタイン15gは外部から視認でき、親基板
との半田付け状態を確認することができる。タイン15
gとタイン12dは、ハウジング6の前後に夫々振り分
けられるので、コンタクト12、13と同じピッチとな
り過度に狭ピッチとならないので、ハウジング6の長手
方向に隣接するタイン15g同士、或いは12d同士の
間に半田ブリッジが生じにくい。なお、本実施形態で
は、第1コンタクト12が上側の接触片12cを有し、
第2コンタクト13が下側の接触片14c、15cを有
した構成になっているが、各コンタクト12、13が夫
々逆側の接触片14c、15c、12cを有しても良
い。
Next, the contact members 14 and 15 will be described. The contact members 14, 15 extend horizontally from the main bodies 14a, 15a and the main bodies 14a, 15a, and the through holes 42, 44
Mounting tabs 14b, 15b respectively press-fitted into the main body 1
There are contact pieces (lower contact pieces) 14c and 15c that extend into the receiving recesses 2 and 4 while being curved from 4a and 15a.
The tips of the contact pieces 14c and 15c serve as contacts 14f and 15f that come into contact with electrodes (not shown) of the daughter boards 96 and 98. A vertically long groove 25 is formed in the rear part of the housing 6 in alignment with the contact members 14 and 15, and a U-shaped connecting piece (conductive member) 17 formed by stamping a metal plate into the groove 25 is arranged. You. Contact legs 17 a, 17 are provided at both ends of the connecting piece 17.
a is formed, and a mounting tab 17b is formed between the contact legs 17a, 17a. Contact legs 17a, 17
Outward projections 17c are formed at the tip of a. The mounting tabs 17b are pressed into the corresponding grooves 46 of the housing 6 and fixed, and the contact legs 17a, 17a are inserted into the corresponding grooves 42a, 44a of the housing 6. Groove 42
a, 44a communicate with and are adjacent to the insertion holes 42, 44, respectively, so that the contact legs 17a, 17a
The contact members 1 contact the mounting tabs 14b and 15b of the
4 and 15 are electrically connected. As a result, the contact members 14 and 15 are integrated with the integrated contact (second contact) 1
It becomes 3. At the lower end of the contact member 15, a tine 15g extending forward and outward of the housing 6 is formed.
Therefore, the tines 15g can be visually recognized from the outside, and the soldering state with the parent board can be confirmed. Tine 15
Since the g and the tine 12d are respectively distributed before and after the housing 6, the pitch is the same as that of the contacts 12 and 13, and the pitch is not excessively narrow. Solder bridges are less likely to occur. In the present embodiment, the first contact 12 has the upper contact piece 12c,
Although the second contact 13 has a configuration having the lower contact pieces 14c and 15c, the contacts 12 and 13 may have the opposite contact pieces 14c, 15c and 12c, respectively.

【0020】次に、図3を参照して下段のプレート18
について説明する。図3(A)はプレート18の平面
図、図3(B)は正面図、図3(C)は側面図を夫々示
す。プレート18は、図3(A)に最もよく示すように
プレート16と同様に略矩形形状をしている。プレート
18の後部両端にはプレート18の主面48に対し上側
に折り曲げられた矩形の取付片50、50が形成されて
いる。各取付片50には、主面48と平行に配置された
2つの取付孔52、52が穿設されている。この取付孔
52、52には上側即ち上段のラッチ部材8が取り付け
られるが、取付の詳細については後述する。
Next, referring to FIG. 3, the lower plate 18 will be described.
Will be described. 3A is a plan view of the plate 18, FIG. 3B is a front view, and FIG. 3C is a side view. The plate 18 has a substantially rectangular shape like the plate 16 as best shown in FIG. Rectangular mounting pieces 50, 50 bent upward with respect to the main surface 48 of the plate 18 are formed at both rear ends of the plate 18. Each mounting piece 50 has two mounting holes 52, 52 arranged in parallel with the main surface 48. The upper or upper latch member 8 is attached to the attachment holes 52, 52, and the details of attachment will be described later.

【0021】プレート18の両端縁54、54の前部に
は下側に折り曲げられた矩形の保持板56、56が形成
されている。この保持板56もラッチ部材8を覆うプレ
ート8の保持板36と同様に内側に収束するように形成
されている。保持板56の下端58は外方に僅かに拡開
している。各保持板56の後端近傍の主面48には略矩
形の開口(過応力防止手段)60、60が形成されてい
る。各開口60の外側縁60aは、後方に延長されて開
口60の後部にスロット60bが形成されている。この
開口60は上側のラッチ部材8と協働するが詳細につい
ては後述する。
At the front of both edges 54 of the plate 18, rectangular holding plates 56, 56 bent downward are formed. The holding plate 56 is formed so as to converge inward similarly to the holding plate 36 of the plate 8 that covers the latch member 8. The lower end 58 of the holding plate 56 slightly expands outward. Substantially rectangular openings (overstress prevention means) 60, 60 are formed in the main surface 48 near the rear end of each holding plate 56. The outer edge 60a of each opening 60 extends rearward to form a slot 60b at the rear of the opening 60. The opening 60 cooperates with the upper latch member 8, but will be described later in detail.

【0022】次に図4を参照して上段のラッチ部材8に
ついて説明する。図4(A)はラッチ部材8の側面図、
図4(B)は平面図、図4(C)は他方の側の側面図、
図4(D)は正面図を夫々示す。ラッチ部材8は1枚の
金属板を打ち抜き、折り曲げて形成したものであり、細
長い平板部即ちアーム62と、この平板部62の前端側
即ち図4(A)において左側に子基板保持部64が形成
されている。平板部62の後端部にはハウジング6の支
軸22(図1(C))に枢着される孔65が穿設されて
いる。子基板保持部64は平板部62の先端部の上縁に
折り曲げ形成された子基板保持片66と、平板部62の
先端を内側に折り曲げて突出させた鉤形のフック部68
を有する。
Next, the upper latch member 8 will be described with reference to FIG. FIG. 4A is a side view of the latch member 8,
4B is a plan view, FIG. 4C is a side view of the other side,
FIG. 4D shows front views. The latch member 8 is formed by punching and bending a single metal plate. An elongated plate portion or arm 62 and a child substrate holding portion 64 on the front end side of the plate portion 62, that is, on the left side in FIG. Is formed. At the rear end of the flat plate portion 62, a hole 65 pivotally connected to the support shaft 22 (FIG. 1C) of the housing 6 is formed. The sub-board holding portion 64 is formed by bending a sub-substrate holding piece 66 formed on the upper edge of the front end portion of the flat plate portion 62 and a hook-shaped hook portion 68 formed by bending the front end of the flat plate portion 62 inward and protruding.
Having.

【0023】子基板保持片66は、内側即ち保持する子
基板(第2の子基板)98側に傾斜したテーパ66a
と、子基板98を押さえる停止面66bを有する。この
テーパ66aは子基板98が挿入されたとき、子基板9
8を案内すると共に平板部62を外方に撓ませて子基板
98を受容可能とする。受容された子基板98は停止面
66bに達すると平板部62が弾発的に復帰して子基板
98が停止面66bにより上方へ戻らないよう押さえら
れる。またフック部68は、子基板98の円弧状の切欠
き98a(図7(A))と係合して、子基板98が前方
即ち図4(B)の左方向へ抜け出るのを阻止する。
The sub-board holding piece 66 has a taper 66a inclined inward, that is, toward the holding sub-board (second sub-board) 98.
And a stop surface 66b for holding the child substrate 98. The taper 66a is used when the child substrate 98 is inserted.
8 and bends the flat plate portion 62 outwardly so that the daughter board 98 can be received. When the received child substrate 98 reaches the stop surface 66b, the flat plate portion 62 resiliently returns, and the child substrate 98 is pressed by the stop surface 66b so as not to return upward. The hook portion 68 is engaged with the arc-shaped notch 98a (FIG. 7A) of the daughter board 98 to prevent the daughter board 98 from slipping forward, that is, leftward in FIG. 4B.

【0024】図4(B)、(C)に最もよく示すよう
に、平板部62の上縁62aの孔65寄りには、上方に
延びて平板部62に平行に折り曲げられた固定片70が
形成されている。この固定片70の折り曲げられた先端
は、更に平板部62と直角に折り曲げられて子基板保持
部64の方に延びる弾性接触片72として形成されてい
る。この弾性接触片72は先端部が上方に折り曲げられ
ており、装着された子基板98の接地電極(図示せず)
とこの先端部が接触して子基板98を接地接続する。固
定片70と平板部62に間には前述のプレート18の取
付片50を受容する間隙Gが形成されている(図4
(B)。また、固定片70にはプレート18の取付孔5
2に対応する位置に平板部62側に向けて突起74が形
成されている。
As best shown in FIGS. 4B and 4C, a fixing piece 70 extending upward and bent in parallel to the flat plate portion 62 is provided near the upper edge 62a of the flat plate portion 62 near the hole 65. Is formed. The bent front end of the fixing piece 70 is formed as an elastic contact piece 72 that is further bent at a right angle to the flat plate portion 62 and extends toward the daughter board holding portion 64. The tip of the elastic contact piece 72 is bent upward, and the ground electrode (not shown) of the mounted sub board 98 is provided.
And the tip of the sub-substrate 98 is grounded. A gap G for receiving the mounting piece 50 of the plate 18 is formed between the fixing piece 70 and the flat plate portion 62.
(B). The fixing piece 70 has a mounting hole 5 of the plate 18.
A protrusion 74 is formed at a position corresponding to 2 toward the flat plate portion 62 side.

【0025】平板部62の下縁62bには、弾性接触片
72の先端部に対応する位置に過応力防止片76が形成
されており、これにより弾性接触片72の過度の変形を
阻止するようになっている。また、平板部62の下縁6
2bの子基板保持部64の反対側には平板部62と直角
に延出した延長部77と、この延長部77から更に下方
に延びるL字状部80を有する規制片78が形成されて
いる。L字状部80は板状部62と平行に後方に延びる
突片80aを有する。
On the lower edge 62b of the flat plate portion 62, an overstress prevention piece 76 is formed at a position corresponding to the tip of the elastic contact piece 72 so as to prevent excessive deformation of the elastic contact piece 72. It has become. The lower edge 6 of the flat plate portion 62
On the opposite side of the sub-board holding portion 64 of 2b, there is formed an extension 77 extending at a right angle to the flat plate 62 and a regulating piece 78 having an L-shaped portion 80 extending further downward from the extension 77. . The L-shaped portion 80 has a protruding piece 80 a extending rearward in parallel with the plate-shaped portion 62.

【0026】次に図5を参照して、この上段のラッチ部
材8を下段のプレート18に取り付けた副組立体につい
て説明する。図5(A)は副組立体19の平面図、図5
(B)は正面図、図5(C)は側面図を夫々示す。各ラ
ッチ部材8は、弾性接触片72が内側になるように固定
片70をプレート18の取付片50に取り付ける。この
時、ラッチ部材8の固定片70の2つの突起74(図4
(C))がプレート18の2つの取付孔52(図3
(C))に係合して固定されると共に、ラッチ部材8の
L字状部80がプレート18の開口60に侵入する。侵
入する際、L字状部80の突片80aが、開口60のス
ロット60bを通って突片80aがプレート18の主面
48の下側に配置される。
Next, a sub-assembly in which the upper latch member 8 is attached to the lower plate 18 will be described with reference to FIG. FIG. 5A is a plan view of the subassembly 19, and FIG.
5B is a front view, and FIG. 5C is a side view. Each latch member 8 attaches the fixing piece 70 to the attachment piece 50 of the plate 18 so that the elastic contact piece 72 is on the inside. At this time, the two protrusions 74 of the fixing piece 70 of the latch member 8 (FIG. 4)
(C) shows two mounting holes 52 of the plate 18 (FIG. 3).
(C), the L-shaped portion 80 of the latch member 8 enters the opening 60 of the plate 18. When intruding, the protrusion 80 a of the L-shaped portion 80 passes through the slot 60 b of the opening 60, and the protrusion 80 a is disposed below the main surface 48 of the plate 18.

【0027】子基板保持部64に外力が加わっていない
ときは、突片80aはスロット60bからずれた開口6
0の部分に位置する。即ち図5(A)に示す位置にな
る。従って、ラッチ部材8に上方への力A(図5
(B))が加わった場合でも、この突片80aがプレー
ト18の主面48に下方から当接して、それ以上の移動
を規制するので、ラッチ部材8がプレート18から外れ
ることが防止される。また、ラッチ部材8はL字状部8
0が開口60内で矢印Bで示す方向(図5(A))に移
動しうる範囲内で平板部62が子基板98を受容する際
移動することが可能となる。このようにしてラッチ部材
8とプレート18が一体に組み立てられプレート副組立
体19として構成される。このように開口60と突片8
0aとが協働してラッチ部材8の過応力を防止してい
る。
When no external force is applied to the daughter board holding portion 64, the projecting piece 80a is shifted from the opening 6 shifted from the slot 60b.
It is located in the 0 part. That is, the position is as shown in FIG. Therefore, the upward force A (FIG. 5) is applied to the latch member 8.
Even when (B)) is applied, the protruding piece 80a abuts against the main surface 48 of the plate 18 from below and restricts further movement, so that the latch member 8 is prevented from coming off the plate 18. . The latch member 8 is an L-shaped part 8.
The flat plate portion 62 can move when the flat plate portion 62 receives the sub-substrate 98 within a range where 0 can move in the direction indicated by the arrow B (FIG. 5A) within the opening 60. In this manner, the latch member 8 and the plate 18 are integrally assembled to form a plate sub-assembly 19. Thus, the opening 60 and the projection 8
Oa cooperates to prevent overstress of the latch member 8.

【0028】次に、図6および図7を参照して子基板9
6、98の取付方法について説明する。図6(A)は副
組立体19をハウジング6の支軸22の周りに回動して
開いた状態を示す組立体1の側面図、図6(B)は図6
(A)の6−6線に沿って切断した平面図、図6(C)
は正面図を夫々示す。なお、図6では組立体1から上段
のプレート16を取り外した状態が示されている。図7
は下段側の子基板(第1の子基板)96を取付後、副組
立体19を閉じた状態を示し、図7(A)は平面図、図
7(B)は正面図、図7(C)は側面図を上側のプレー
ト16と共に示す。
Next, referring to FIG. 6 and FIG.
The method of attaching 6, 98 will be described. FIG. 6A is a side view of the assembly 1 showing the sub-assembly 19 rotated around the support shaft 22 of the housing 6 and opened, and FIG.
FIG. 6C is a plan view cut along the line 6-6 in FIG.
Shows front views. FIG. 6 shows a state in which the upper plate 16 is removed from the assembly 1. FIG.
7A shows a state in which the sub-assembly 19 is closed after the lower-level sub-substrate (first sub-substrate) 96 is attached, FIG. 7A is a plan view, FIG. 7B is a front view, and FIG. C) shows a side view with the upper plate 16.

【0029】図6に示すように、副組立体19が、横長
のハウジング6の両端に突設された支軸22にラッチ部
材8を介して取り付けられているのが明瞭に示されてい
る。ハウジング6の後部両端には凸部(支持部)82が
外方に突設されている。この凸部82は副組立体19
が、子基板96を装着するために開いたときラッチ部材
8の平板部62の後部近傍の上縁62cが当接して副組
立体19を開いた状態即ち退避した状態に維持する。こ
の状態で、下段側の子基板96は図6(A)に示すよう
に下段の受容凹部4に斜めに挿入され矢印Cで示すよう
に下側に押し下げられ(回動され)てラッチ部材10に
取り付けられる。このように子基板96は、ラッチ部材
8が子基板96の挿入前に、予め回動されて子基板86
の挿入経路外に退避しているのでラッチ部材8が子基板
96の挿入の妨げになることはない。
As shown in FIG. 6, it is clearly shown that the sub-assembly 19 is attached via the latch member 8 to the support shafts 22 projecting from both ends of the horizontally long housing 6. Projecting portions (supporting portions) 82 are provided on both ends of the rear portion of the housing 6 so as to protrude outward. The projection 82 is provided in the subassembly 19
However, when opened to mount the daughter board 96, the upper edge 62c near the rear of the flat plate portion 62 of the latch member 8 abuts to maintain the subassembly 19 in an open state, that is, a retracted state. In this state, the lower sub-substrate 96 is obliquely inserted into the lower receiving recess 4 as shown in FIG. 6A and is pushed down (rotated) as shown by the arrow C to latch the latch member 10. Attached to. As described above, before the latch member 8 is inserted into the child board 96, the child board 96 is
The latch member 8 does not hinder the insertion of the child board 96.

【0030】子基板96がラッチ部材10に取り付けら
れた状態を図6(B)に仮想線で示す。但し図6(C)
には子基板96を示していない。子基板96を取付けた
後、副組立体19は図6(A)に矢印Dで示すように下
段の基板96上に回動され、図7に示す状態になる。こ
の時プレート18の保持板56は、ラッチ部材10の子
基板保持部84の外側に位置し、ラッチ部材10の子基
板保持部84が外側に撓んで子基板96が外れるのを防
止している。保持板56は下端58が僅かに拡開してい
るので、子基板保持部84に係合するときに互いに位置
合わせするガイドとなる。
FIG. 6B shows a state where the daughter board 96 is attached to the latch member 10 by imaginary lines. However, FIG. 6 (C)
Does not show the child substrate 96. After attaching the daughter board 96, the sub-assembly 19 is rotated on the lower board 96 as shown by an arrow D in FIG. At this time, the holding plate 56 of the plate 18 is located outside the sub-substrate holding portion 84 of the latch member 10 to prevent the sub-substrate holding portion 84 of the latch member 10 from bending outward and the sub-substrate 96 coming off. . Since the lower end 58 of the holding plate 56 is slightly expanded, the holding plate 56 serves as a guide for aligning each other when engaging with the daughter board holding portion 84.

【0031】なお、下段のラッチ部材10は上段のラッ
チ部材8と同様な形状をしている。ラッチ部材10の平
板部10aは、後部の上縁で折り返されてラッチ部材8
と同様に子基板96と接地接続される弾性接触片10b
が形成され、また平板部10aの下縁からは、この弾性
接触片10bの過応力を防止するラッチ部材8と同様な
過応力防止片10cが内側に突設されている。
The lower latch member 10 has the same shape as the upper latch member 8. The flat plate portion 10a of the latch member 10 is folded at the upper edge of the rear portion to
Elastic contact piece 10b grounded to sub-substrate 96 in the same manner as
Further, an overstress prevention piece 10c similar to the latch member 8 for preventing overstress of the elastic contact piece 10b protrudes inward from a lower edge of the flat plate portion 10a.

【0032】図7(A)に示すように、下側のラッチ部
材10は、副組立体19により覆われて上方からは見え
ない。図7(B)ではラッチ部材10が保持板56によ
り外方への移動が規制されているのが示されている。上
段の受容凹部2には、上側の子基板98が図7(C)に
示すように斜めに挿入され、矢印Eで示す方向に回動さ
れてラッチ部材8に取り付けられる。図7(A)にこの
取り付けられた状態の子基板98を示す。子基板98が
取り付けられた後、上側のプレート16がハウジング6
に取り付けられ、図1(B)に最もよく示すようにプレ
ート16の保持板36が子基板保持部64の外側に配置
され、子基板保持部64が外方に撓むのが規制される。
これにより組立体1が完成する。
As shown in FIG. 7A, the lower latch member 10 is covered by the subassembly 19 and cannot be seen from above. FIG. 7B shows that the outward movement of the latch member 10 is restricted by the holding plate 56. The upper sub-substrate 98 is inserted into the upper receiving recess 2 obliquely as shown in FIG. 7 (C), turned in the direction indicated by the arrow E, and attached to the latch member 8. FIG. 7A shows the child board 98 in the attached state. After the daughter board 98 is attached, the upper plate 16 is
1B, the holding plate 36 of the plate 16 is disposed outside the sub-board holding section 64 as best shown in FIG. 1 (B), and the bending of the sub-board holding section 64 outward is restricted.
Thus, the assembly 1 is completed.

【0033】以上本発明について好ましい実施の形態を
参照して詳細に説明したが、実施形態はあくまでも例示
的なものであり、これらに限定されるものではない。例
えば、組立体1は親基板20上に水平に載置される形式
のものであるが、垂直に取り付ける形式のものであって
も良い。この場合、高さ方向の寸法は大きくなるもの
の、親基板上の実装面積は小さくなるという利点があ
る。
Although the present invention has been described in detail with reference to preferred embodiments, the embodiments are merely illustrative and not restrictive. For example, the assembly 1 is of a type mounted horizontally on the mother board 20, but may be of a type mounted vertically. In this case, although the dimension in the height direction is increased, there is an advantage that the mounting area on the parent board is reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の組立体を示し、図1(A)は組立体の
平面図、図1(B)は正面図、図1(C)は側面図を夫
々示す。
1 shows an assembly of the present invention, FIG. 1 (A) is a plan view of the assembly, FIG. 1 (B) is a front view, and FIG. 1 (C) is a side view.

【図2】図1の組立体の断面形状を示し、図2(A)は
図1(A)の2A−2A線に沿う断面図、2(B)は図
1(A)の2B−2B線に沿う断面図をそれぞれ示す。
2 (A) is a sectional view taken along line 2A-2A of FIG. 1 (A), and FIG. 2 (B) is a sectional view of 2B-2B of FIG. 1 (A). The sectional views along the line are shown.

【図3】下段のプレートを示し、図3(A)はプレート
の平面図、図3(B)は正面図、図3(C)は側面図を
夫々示す。
FIG. 3 shows a lower plate, FIG. 3 (A) is a plan view of the plate, FIG. 3 (B) is a front view, and FIG. 3 (C) is a side view.

【図4】上段のラッチ部材を示し、図4(A)はラッチ
部材の側面図、図4(B)は平面図、図4(C)は他方
の側の側面図、図4(D)は正面図を夫々示す。
4 (A) is a side view of the latch member, FIG. 4 (B) is a plan view, FIG. 4 (C) is a side view of the other side, FIG. 4 (D). Shows front views.

【図5】上段のラッチ部材をプレートに取り付けた副組
立体を示し、図5(A)は副組立体の平面図、図5
(B)は正面図、図5(C)は側面図を夫々示す。
5A and 5B show a subassembly in which an upper latch member is attached to a plate, and FIG. 5A is a plan view of the subassembly;
5B is a front view, and FIG. 5C is a side view.

【図6】下段の子基板の取付方法を示し図6(A)は副
組立体をハウジングの支軸の周りに回動して開いた状態
を示す組立体の側面図、図6(B)は図6(A)の6−
6線に沿って切断した平面図、図6(C)は正面図を夫
々示す。
6 (A) is a side view of an assembly showing a state in which the sub-assembly is opened by rotating the sub-assembly around a support shaft of the housing, and FIG. 6 (B). Is 6- of FIG.
A plan view cut along line 6 and FIG. 6C shows a front view, respectively.

【図7】下段側の子基板を取付後、副組立体を閉じた状
態を示し、図7(A)は平面図、図7(B)は正面図、
図7(C)は側面図を上側のプレートと共に示す。
7A and 7B show a state in which the sub-assembly is closed after the lower-level sub-board is attached, FIG. 7A is a plan view, FIG. 7B is a front view,
FIG. 7C shows a side view together with the upper plate.

【符号の説明】[Explanation of symbols]

1 カードエッジコネクタ組立体 2、4 子基板受容凹部 6 ハウジング 12 第1コンタクト 12c 上側接触片 12d、15g タイン 13 第2コンタクト 14、15 接触部材 17 導電部材 14c 下側接触片 20 親基板 96、98 子基板 REFERENCE SIGNS LIST 1 Card edge connector assembly 2, 4 Substrate receiving recess 6 Housing 12 First contact 12 c Upper contact piece 12 d, 15 g Tine 13 Second contact 14, 15 Contact member 17 Conductive member 14 c Lower contact piece 20 Parent board 96, 98 Child board

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 長手方向に延び且つ上下方向に複数の段
に形成された子基板受容凹部を前部に有し親基板に取り
付けられる絶縁性のハウジングと、前記各子基板受容凹
部内の上側および下側に前記長手方向に整列して配置さ
れる複数のコンタクトとを備え、各該コンタクトが前記
上側に配置される上側接触片或いは前記下側に配置され
る下側接触片のいずれかを有すると共に前記親基板にタ
インを介して接続され、子基板を前記各子基板受容凹部
内に装着して前記接触片と接触させることにより前記親
基板および前記子基板を電気的に相互接続するカードエ
ッジコネクタ組立体において、 前記複数のコンタクトが、前記ハウジングの後部から前
記各段にまたがって装着される、いずれかの側の前記接
触片を有すると共に前記後部に前記タインを有する複数
の一体の第1コンタクトと、前記ハウジングの前記前部
から前記各段に夫々装着される他方の側の前記接触片を
有する複数の別体の接触部材を有し、該接触部材が前記
子基板受容凹部を避けた前記後部で導電部材により相互
に連結されると共に最下段に位置する前記接触部材が前
記タインを有してなる複数の第2コンタクトからなるこ
とを特徴とするカードエッジコネクタ組立体。
An insulative housing extending in a longitudinal direction and formed in a plurality of stages in a vertical direction at a front portion thereof and attached to a parent substrate, and an upper side in each of the child substrate receiving recesses. And a plurality of contacts arranged in the longitudinal direction on the lower side, wherein each of the contacts is either an upper contact piece arranged on the upper side or a lower contact piece arranged on the lower side. A card which is connected to the parent board via tines, and which electrically connects the parent board and the child board by mounting the child board in each of the child board receiving recesses and making contact with the contact pieces; The edge connector assembly, wherein the plurality of contacts have the contact pieces on either side mounted over the respective steps from a rear part of the housing, and the tines are provided on the rear part. A plurality of separate first contact members having the plurality of integral first contacts and the contact pieces on the other side respectively mounted on the respective steps from the front portion of the housing, wherein the contact members are A card edge connector characterized in that the contact member located at the lowermost stage and connected to each other by a conductive member at the rear portion avoiding the daughter board receiving concave portion comprises a plurality of second contacts having the tines. Assembly.
JP2000276316A 2000-09-12 2000-09-12 Card edge connector assembly Withdrawn JP2002093496A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000276316A JP2002093496A (en) 2000-09-12 2000-09-12 Card edge connector assembly
TW090121958A TW506165B (en) 2000-09-12 2001-09-05 Card edge connector assembly
US09/950,343 US6506074B2 (en) 2000-09-12 2001-09-11 Card edge connector assembly for tiered daughter boards
CNB011376392A CN1237661C (en) 2000-09-12 2001-09-12 Card edge connecting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000276316A JP2002093496A (en) 2000-09-12 2000-09-12 Card edge connector assembly

Publications (1)

Publication Number Publication Date
JP2002093496A true JP2002093496A (en) 2002-03-29

Family

ID=18761806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000276316A Withdrawn JP2002093496A (en) 2000-09-12 2000-09-12 Card edge connector assembly

Country Status (4)

Country Link
US (1) US6506074B2 (en)
JP (1) JP2002093496A (en)
CN (1) CN1237661C (en)
TW (1) TW506165B (en)

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KR20040098230A (en) * 2003-05-14 2004-11-20 한국몰렉스 주식회사 Connector for fixing a modem card
CN2697866Y (en) * 2003-09-17 2005-05-04 富士康(昆山)电脑接插件有限公司 Electric connector
JP4098287B2 (en) * 2003-10-03 2008-06-11 山一電機株式会社 Flexible printed wiring board connector
US20050164549A1 (en) * 2004-01-22 2005-07-28 Ipson Lee Terminal layout structure of a two-layer electronic card connector
JP4474235B2 (en) * 2004-08-11 2010-06-02 日本圧着端子製造株式会社 connector
TWM261893U (en) * 2004-08-27 2005-04-11 Molex Taiwan Ltd Electrical connector
JP4783096B2 (en) * 2005-09-08 2011-09-28 山一電機株式会社 Flexible conductor connector
JP4223525B2 (en) * 2005-10-27 2009-02-12 山一電機株式会社 Plug connector
CA2552620C (en) * 2006-07-20 2014-07-15 Ruggedcom Inc. An anchoring member to facilitate fastening daughter boards to a mother board and a method for use
US8414961B1 (en) 2006-12-13 2013-04-09 Nanosolar, Inc. Solution deposited transparent conductors
US7625231B2 (en) * 2007-06-29 2009-12-01 Yamaichi Electronics Co., Ltd. Adaptor for cable connector
JP2009193786A (en) * 2008-02-13 2009-08-27 Yamaichi Electronics Co Ltd Connector for standard hdmi cable
US8530262B2 (en) * 2008-02-28 2013-09-10 Nanosolar, Inc. Roll-to-roll non-vacuum deposition of transparent conductive electrodes
JP2010056066A (en) * 2008-07-29 2010-03-11 Yamaichi Electronics Co Ltd Cable connector
CN201397913Y (en) * 2009-03-05 2010-02-03 富士康(昆山)电脑接插件有限公司 Stack-type electric connector
US8177564B1 (en) 2010-12-03 2012-05-15 Yamaichi Electronics Co., Ltd. Receptacle connector and an electrical connector using the same
TWI631777B (en) * 2017-11-17 2018-08-01 禾昌興業股份有限公司 Simple connector structure
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US6176737B1 (en) * 1995-02-24 2001-01-23 Hon Hai Precision Ind. Co., Ltd. Duplex connector assembly for use with plural cards
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TW400986U (en) * 1998-12-28 2000-08-01 Hon Hai Prec Ind Co Ltd Electronic card connecting device

Also Published As

Publication number Publication date
US20020031952A1 (en) 2002-03-14
CN1237661C (en) 2006-01-18
CN1343028A (en) 2002-04-03
US6506074B2 (en) 2003-01-14
TW506165B (en) 2002-10-11

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