JP2002064259A - Method of manufacturing heat-resistant flexible board - Google Patents

Method of manufacturing heat-resistant flexible board

Info

Publication number
JP2002064259A
JP2002064259A JP2000248796A JP2000248796A JP2002064259A JP 2002064259 A JP2002064259 A JP 2002064259A JP 2000248796 A JP2000248796 A JP 2000248796A JP 2000248796 A JP2000248796 A JP 2000248796A JP 2002064259 A JP2002064259 A JP 2002064259A
Authority
JP
Japan
Prior art keywords
laminated
laminate
heat
protective material
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000248796A
Other languages
Japanese (ja)
Inventor
Naoki Hase
長谷直樹
Kosuke Kataoka
片岡孝介
Hiroyuki Furuya
古谷浩行
Yasuo Fushiki
伏木八洲男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP2000248796A priority Critical patent/JP2002064259A/en
Priority to US10/129,037 priority patent/US7101455B1/en
Priority to PCT/JP2000/007656 priority patent/WO2001032418A1/en
Priority to KR1020027003851A priority patent/KR100724046B1/en
Priority to TW89122865A priority patent/TWI223577B/en
Publication of JP2002064259A publication Critical patent/JP2002064259A/en
Withdrawn legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing heat-resistant flexible board suited to flexible board materials, having no appearance defects, such as curing produced during heat lamination. SOLUTION: The method of manufacturing a laminate board, made by bonding a plurality of laminating materials including heat meltable laminating materials, uses a heating and pressing forming apparatus. A protective material is laid between a pressing surface of the apparatus, the laminating material and the heating and pressing forming is applied at 200 deg.C or higher; and the protective material is peeled off a laminate board, after cooling. In a step of peeling off the protective materials the laminate board, the upper and lower protective materials are peeled off at angles symmetric with the symmetric axis of the laminate board.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、加圧加熱成形装置
で製造される積層板の製造方法に関する。特には、電子
電気機器等に用いられるフレキシブル積層板の製造方法
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated board manufactured by a press and heat forming apparatus. In particular, the present invention relates to a method for manufacturing a flexible laminate used for electronic and electrical equipment and the like.

【0002】[0002]

【従来の技術】電子電気機器用印刷回路基板に用いられ
る積層板には、金属箔が熱硬化性樹脂等の熱硬化型接着
剤によって貼付された積層板(以下、熱硬化型の積層板
と表す)と、熱可塑性樹脂等の熱融着型接着剤によって
貼付された積層板(以下、熱融着型の積層板と表す)が
ある。
2. Description of the Related Art A laminated board used for a printed circuit board for electronic and electric equipment is a laminated board in which a metal foil is adhered by a thermosetting adhesive such as a thermosetting resin (hereinafter referred to as a thermosetting laminated board). And a laminate bonded with a heat-fusible adhesive such as a thermoplastic resin (hereinafter, referred to as a heat-fusible laminate).

【0003】熱硬化型の積層板の製造方法は、従来より
種々研究されており、樹脂含浸紙、樹脂含浸ガラス布等
と金属箔を多段プレスや真空プレスを用いてプレスし、
その後、高温で数時間熱硬化させてリジッド積層板を得
る方法や、ロール状の材料を1対の加熱ロールに挟んで
ラミネートし、その後、高温で数時間熱硬化させてフレ
キシブル積層板を得る方法、加熱ロールの代わりにダブ
ルベルトプレス装置を用いて熱ラミネートする方法等が
実施されている。これら熱硬化型の積層板を製造する場
合、加熱加圧成形温度は200℃以下である場合が殆ど
である。この程度の加熱温度では、被積層材料にかかる
熱応力が小さく、熱ラミネート時のシワ等の外観不良は
発生しにくい。これら熱硬化型の積層板を製造する方法
において、装置の加圧面と被積層材料との間に保護材料
を挟んで加圧加熱成形する方法がある。(特開昭60−
109835、特開平4−89254)ところが、熱融
着型の積層板を製造する場合、接着層を構成する熱可塑
性樹脂のガラス転移温度(Tg)以上の温度で加圧加熱
を行わなければ熱融着ができない。一方、電子電気機器
用積層板は、部品実装の過程で高温加熱を受けるので、
接着層を構成する熱可塑性樹脂には少なくとも180℃
以上のTgが求められる。従って、その熱融着のために
は200℃以上の熱ラミネート温度が必要となる。この
様な高温でのラミネートでは、被積層材料の熱膨張・熱
収縮の変化が大きくなり、ラミネートされた積層体にシ
ワ等の外観不良を生じやすいという問題があった。
A variety of methods for producing a thermosetting laminate have been studied in the past, and a resin-impregnated paper, a resin-impregnated glass cloth, and a metal foil are pressed using a multi-stage press or a vacuum press.
Then, a method of obtaining a rigid laminate by heat-curing at high temperature for several hours, or a method of laminating a roll-shaped material between a pair of heating rolls and then heat-curing at high temperature for several hours to obtain a flexible laminate In addition, a method of performing thermal lamination using a double belt press device instead of a heating roll has been implemented. In the case of producing these thermosetting laminates, the heat and pressure molding temperature is almost 200 ° C. or less in most cases. At such a heating temperature, the thermal stress applied to the material to be laminated is small, and appearance defects such as wrinkles during thermal lamination hardly occur. As a method for manufacturing these thermosetting laminates, there is a method in which a protective material is sandwiched between a pressing surface of an apparatus and a material to be laminated, followed by pressurizing and heating. (JP-A-60-
However, in the case of manufacturing a heat-sealing type laminated board, heat-sealing must be performed at a temperature not lower than the glass transition temperature (Tg) of the thermoplastic resin constituting the adhesive layer unless pressure-heating is performed. I can't wear it. On the other hand, laminates for electronic and electrical equipment are subject to high-temperature heating during the component mounting process,
At least 180 ° C for the thermoplastic resin that constitutes the adhesive layer
The above Tg is required. Therefore, a heat lamination temperature of 200 ° C. or more is required for the heat fusion. Lamination at such a high temperature has a problem that the change in thermal expansion and thermal shrinkage of the material to be laminated is large, and the laminated laminate tends to have poor appearance such as wrinkles.

【0004】[0004]

【発明が解決しようとする課題】本発明は前記問題点に
鑑み、熱ラミネート時に生じるシワ・カール等の外観不
良のないフレキシブル基板材料として好適な積層板を提
供することを目的とする。
SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a laminated board suitable as a flexible substrate material free from appearance defects such as wrinkles and curls generated during thermal lamination.

【0005】[0005]

【課題を解決するための手段】本発明者らは、加圧面と
被積層材料との間に特定の保護材料を配してラミネート
すると、ラミネート後の熱可塑性ポリイミドは収縮しよ
うとするが銅箔の外側に保護材料があるために面方向の
動きが抑制され、熱可塑性ポリイミドの動きが制限され
てシワが発生しない。また、貼り合わされた積層板と上
下の保護フィルムを剥離する際、積層板を対称軸に上下
対称的になる角度で保護材料を積層板から剥離すること
によって、剥離時に生じる積層板のカールを激減させる
ことができることを見出したのである。すなわち、 1)熱融着性の被積層材料を含む複数の被積層材料を加
熱加圧成形装置により貼り合わせてなる積層板の製造方
法であって、該装置の加圧面と被積層材料との間に保護
材料を配置して、200℃以上の加熱加圧成形を行い、
冷却後に該保護材料を積層板から剥離して積層板を製造
する方法であって、保護材料と積層板とを剥離する工程
において、積層板を対称軸として上下保護材料が対称的
な角度で隔離されることを特徴とする積層板の製造方
法。 2)前記積層材料を連続的に加熱加圧して貼り合わせて
なることを特徴とする1)記載の積層板の製造方法。 3)前記保護材料の厚みが50μm以上であることを特
徴とする1)または2)に記載の積層板の製造方法。 4)2種以上の被積層材料を貼り合わせることを特徴と
する1)乃至3)のいずれか1項に記載の積層板の製造
方法。 5)前記被積層材料として、厚みが50μm以下の金属
箔を用いることを特徴とする1)乃至4)のいずれか1
項に記載の積層板の製造方法。 6)前記熱融着性の被積層材料として、熱可塑性ポリイ
ミドを50重量%以上含有する接着材料を用いることを
特徴とする1)乃至5)のいずれか1項に記載の積層板
の製造方法。 7)加圧加熱成形装置が、熱ロールラミネート機または
ダブルベルトプレス機であることを特徴とする1)乃至
6)のいずれか1項に記載の積層板の製造方法。 8)ロール状に巻かれた長尺シート状物を、被積層材料
または保護材料の少なくとも一方として用いることを特
徴とする2)乃至請求項7)のいずれか1項に記載の積
層板の製造方法。 9)前記保護材料を繰り返し使用することを特徴とする
1)乃至8)のいずれか一項に記載の積層板の製造方
法。
Means for Solving the Problems When a specific protective material is disposed between a pressing surface and a material to be laminated and laminated, the thermoplastic polyimide after lamination tends to shrink, but the copper foil Since the protective material is on the outside, movement in the surface direction is suppressed, and movement of the thermoplastic polyimide is restricted, so that wrinkles do not occur. In addition, when peeling the laminated laminate and the upper and lower protective films, the protective material is peeled from the laminate at an angle that is vertically symmetrical with respect to the axis of symmetry of the laminate, thereby greatly reducing the curl of the laminate that occurs at the time of peeling. He found that he could do that. That is, 1) a method for manufacturing a laminated board in which a plurality of materials to be laminated including a heat-fusible material to be laminated are bonded by a heating and pressing molding device, wherein a pressing surface of the device and a material to be laminated are bonded. Place the protective material in between, and perform hot press molding at 200 ° C or higher,
A method of manufacturing a laminate by peeling the protective material from the laminate after cooling, wherein in the step of peeling the protective material and the laminate, the upper and lower protective materials are separated at a symmetric angle with the laminate as a symmetric axis. A method for producing a laminate. 2) The method for producing a laminate according to 1), wherein the laminate material is continuously bonded by heating and pressing. 3) The method for producing a laminate according to 1) or 2), wherein the thickness of the protective material is 50 μm or more. 4) The method for manufacturing a laminate according to any one of 1) to 3), wherein two or more kinds of materials to be laminated are bonded. 5) As the material to be laminated, a metal foil having a thickness of 50 μm or less is used.
13. The method for producing a laminate according to the above item. 6) The method for producing a laminate according to any one of 1) to 5), wherein an adhesive material containing 50% by weight or more of a thermoplastic polyimide is used as the heat-fusible material to be laminated. . 7) The method for producing a laminate according to any one of 1) to 6), wherein the press-heating and forming apparatus is a hot roll laminator or a double belt press. 8) The production of a laminated board according to any one of 2) to 7), wherein a long sheet-like material wound in a roll shape is used as at least one of a laminated material and a protective material. Method. 9) The method for producing a laminate according to any one of 1) to 8), wherein the protective material is repeatedly used.

【0006】[0006]

【発明の実施の形態】以下、本発明の詳細について説明
する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below.

【0007】本発明の製造方法で得られる積層板の用途
は特に限定されるものではないが、主として電子電気用
のフレキシブル積層板として用いられるものである。な
お、本発明でいう被積層材料とは最終的に積層板として
一体化されるシート状または板状の材料をさし、熱融着
性の被積層材料とは加熱による融着によって被積層材料
どうしを接着する機能を有する被積層材料をさす。ま
た、保護材料とは積層板の非構成材料をさす。多段で加
熱加圧成形を行うなどの方法を採る場合においては、保
護材料は加熱加圧成形装置の加圧面に接触せずに、ある
いは隣接せずに配置され得る。
Although the use of the laminate obtained by the production method of the present invention is not particularly limited, it is mainly used as a flexible laminate for electronic and electric use. In the present invention, the material to be laminated refers to a sheet-like or plate-like material that is finally integrated as a laminated plate, and the heat-fusible material to be laminated is a material to be laminated by heating. A material to be laminated having a function of bonding together. The protective material refers to a non-constituent material of the laminate. In the case of employing a method such as performing heating and pressing in multiple stages, the protective material may be disposed without contacting or adjacent to the pressing surface of the heating and pressing device.

【0008】本発明に用いられる熱融着性の被積層材料
としては、熱可塑性樹脂フィルム、熱融着性の接着シー
ト、熱可塑性樹脂含浸紙、熱可塑性樹脂含浸ガラスクロ
ス等が挙げられるが、フレキシブル積層板用としては熱
可塑性樹脂フィルム、熱融着性の接着シートが好まし
い。熱可塑性樹脂フィルムとしては耐熱性を有するもの
が好ましく、例えば、熱可塑性ポリイミド、熱可塑性ポ
リアミドイミド、熱可塑性ポリエーテルイミド、熱可塑
性ポリエステルイミド等の成形物が挙げられ、熱可塑性
ポリイミド、熱可塑性ポリエステルイミドが特に好適に
用いられ得る。これらの耐熱性の熱可塑性樹脂を50%
以上含有する熱融着性の接着シートも本発明には好まし
く用いられ、特にエポキシ樹脂やアクリル樹脂のような
熱硬化性樹脂等を配合した熱融着性の接着シートの使用
も好ましい。また各種特性の向上のために熱融着性シー
トには種々の添加剤が配合されていても構わない。
Examples of the heat-fusible material to be laminated used in the present invention include a thermoplastic resin film, a heat-fusible adhesive sheet, a thermoplastic resin-impregnated paper, a thermoplastic resin-impregnated glass cloth, and the like. For a flexible laminate, a thermoplastic resin film and a heat-fusible adhesive sheet are preferable. As the thermoplastic resin film, those having heat resistance are preferable, for example, molded products such as thermoplastic polyimide, thermoplastic polyamide imide, thermoplastic polyether imide, and thermoplastic polyester imide, and the like, thermoplastic polyimide, thermoplastic polyester An imide can be used particularly preferably. 50% of these heat-resistant thermoplastic resins
The heat-fusible adhesive sheet containing the above is also preferably used in the present invention, and particularly, the use of a heat-fusible adhesive sheet containing a thermosetting resin such as an epoxy resin or an acrylic resin is also preferable. Further, various additives may be blended in the heat-fusible sheet for improving various properties.

【0009】耐熱性接着材料の構成については特に規定
しないが、ある程度の剛性と十分な絶縁特性・接着性を
有するものでは、接着剤層1層からなるものでも構わな
い。また、接着材料の剛性を得るために接着剤層の中心
部に剛性のある非熱可塑性のポリイミドフィルムを使用
して3層構造としてもよい。
The constitution of the heat-resistant adhesive material is not particularly limited, but may be composed of one adhesive layer as long as it has a certain degree of rigidity and sufficient insulating properties and adhesiveness. In order to obtain the rigidity of the adhesive material, a three-layer structure may be used by using a rigid non-thermoplastic polyimide film at the center of the adhesive layer.

【0010】熱融着性の被積層材料の作製方法について
は特に規定しないが、接着剤層1層からなる場合、ベル
トキャスト法、押出法等により製膜することができる。
また、耐熱性接着材料の構成が接着層/コアフィルム/
接着層というような3層からなる場合、コアフィルムの
両面に接着剤層を、片面ずつ、もしくは両面同時に塗布
する方法、特に、ポリイミド系の接着剤を使用する場
合、ポリアミック酸で塗布し、次いでイミド化する方法
と、そのまま可溶性ポリイミド樹脂を塗布・乾燥させる
方法がある。その他に、接着層/コアフィルム/接着層
のそれぞれの樹脂を共押出しして、一度に耐熱性接着材
料を製膜する方法等がある。
The method for producing the heat-fusible material to be laminated is not particularly limited, but when it is composed of one adhesive layer, it can be formed by a belt casting method, an extrusion method or the like.
The composition of the heat-resistant adhesive material is adhesive layer / core film /
When consisting of three layers such as an adhesive layer, a method of applying an adhesive layer on both sides of the core film, one side at a time, or both sides at the same time, particularly, when using a polyimide-based adhesive, apply with a polyamic acid, There are a method of imidization and a method of applying and drying a soluble polyimide resin as it is. In addition, there is a method of coextruding each resin of the adhesive layer / core film / adhesive layer to form a heat-resistant adhesive material at a time.

【0011】本発明に用いられる前記熱融着性の被積層
材料以外の被積層材料について特に限定しないが、2種
以上の被積層材料、より好ましくは、金属箔、プラスチ
ックフィルム、樹脂含浸紙、樹脂含浸ガラスクロス、お
よび樹脂含浸ガラス不織布より選択される2種以上の被
積層材料、特には金属箔とプラスチックフィルムを貼り
合わせることが好ましい。
The material to be laminated other than the heat-fusible material to be laminated used in the present invention is not particularly limited, but two or more materials to be laminated, more preferably a metal foil, a plastic film, a resin-impregnated paper, It is preferable to bond two or more kinds of materials to be laminated selected from a resin-impregnated glass cloth and a resin-impregnated glass nonwoven fabric, in particular, a metal foil and a plastic film.

【0012】金属箔については、銅箔が好ましく、50
μm以下の銅箔がより好ましい。特に35μm以下の銅
箔はそれ以上の厚みの銅箔に比べてコシがなく、熱ラミ
ネートする際にシワを生じやすいため、35μm以下の
銅箔について、本発明は顕著な効果を発揮する。また、
銅箔の種類としては圧延銅箔、電解銅箔、HTE銅箔等
が挙げられ特に制限はなく、これらの表面に接着剤が塗
布されていても構わない。
The metal foil is preferably a copper foil.
A copper foil of μm or less is more preferred. In particular, a copper foil having a thickness of 35 μm or less has less stiffness than a copper foil having a thickness of more than 30 μm, and is likely to generate wrinkles during thermal lamination. Also,
Examples of the type of copper foil include rolled copper foil, electrolytic copper foil, HTE copper foil, and the like. There is no particular limitation, and an adhesive may be applied to the surface thereof.

【0013】プラスチックフィルムとしては、熱硬化性
樹脂フィルム、熱硬化性樹脂をBステージ化した接着シ
ート、非熱可塑性樹脂フィルム等が挙げられる。非熱可
塑性樹脂フィルムの代表例としてはポリイミドフィルム
が挙げられる。プラスチックフィルムには必要に応じ
て、片面または両面に接着剤が塗布されていても構わな
いし、既に積層成形されたフィルムを更に本発明にかか
る積層成形に供しても構わない。
Examples of the plastic film include a thermosetting resin film, an adhesive sheet in which the thermosetting resin is B-staged, and a non-thermoplastic resin film. A typical example of the non-thermoplastic resin film is a polyimide film. An adhesive may be applied to one or both surfaces of the plastic film, if necessary, or a film that has already been laminated and formed may be further subjected to the lamination according to the present invention.

【0014】加熱加圧成形装置については、被積層材料
を加熱して圧力を加えてラミネートする装置であれば特
にこだわらず、例えば、単動プレス装置、多段プレス装
置、真空プレス装置、多段真空プレス装置、オートクレ
ーブ装置、熱ロールラミネート機、ダブルベルトプレス
機等が挙げられ、これらのうち熱ロールラミネート機、
ダブルベルトプレス機が好ましく用いられ得る。特に被
積層材料、保護材料としてロール状に巻かれた長尺シー
ト状物をこれらの装置と組み合わせて用いると、積層板
の連続製造が可能となり生産性の向上に繋がる。加熱方
法について、所定の温度で加熱することができるもので
あれば特にこだわらず、熱媒循環方式、熱風加熱方式、
誘導加熱方式等が挙げられる。加熱温度は200℃以上
が好ましいが、電子部品実装のために積層板が雰囲気温
度240℃の半田リフロー炉を通過する用途に供される
場合には、それに応じたTgを有する熱融着シートを使
用するため240℃以上の加熱が好ましい。加圧方式に
ついても所定の圧力を加えることができるものであれば
特にこだわらず、油圧方式、空気圧方式、ギャップ間圧
力方式等が挙げられ、圧力は特に限定されない。
The heating / pressing molding apparatus is not particularly limited as long as it is an apparatus for heating a material to be laminated and applying pressure to laminate the material. For example, a single-acting press, a multi-stage press, a vacuum press, a multi-stage vacuum press Equipment, an autoclave device, a hot roll laminating machine, a double belt press machine and the like. Among these, the hot roll laminating machine,
A double belt press can be preferably used. In particular, when a long sheet-like material wound in a roll shape is used in combination with these devices as a material to be laminated and a protective material, continuous production of a laminated plate becomes possible, leading to an improvement in productivity. The heating method is not particularly limited as long as it can be heated at a predetermined temperature, a heating medium circulation system, a hot air heating system,
An induction heating method and the like can be mentioned. The heating temperature is preferably 200 ° C. or higher. However, when the laminate is used for passing electronic components through a solder reflow furnace at an ambient temperature of 240 ° C., a heat-fused sheet having a Tg corresponding to the temperature is used. Heating at 240 ° C. or higher is preferred for use. The pressurizing method is not particularly limited as long as a predetermined pressure can be applied. Examples thereof include a hydraulic method, a pneumatic method, and a gap pressure method, and the pressure is not particularly limited.

【0015】本発明においてはシワなどの外観不良から
保護するための材料である保護材料が必須である。な
お、特開昭60−109835や特開平4−89254
には、装置の加圧面と被積層材料との間に保護材料を挟
んで加熱加圧成形する方法が記載されている。いずれ
も、熱硬化性型の積層板を製造するものであり、それゆ
え加圧加熱成形温度は200℃以下と低い場合がほとん
どで、もともとシワなどの外観不良も発生しにくいもの
であり、その目的も、本発明の効果であるシワの発生を
防ぐというものではなく、金属箔表面の傷や打痕の発生
を防いだり、熱ラミネート後の硬化炉における積層板の
反りの発生を防ぐものであった。あるいは樹脂溜まりの
ある平滑性に乏しい樹脂含浸紙や樹脂含浸ガラス布等に
より滑らかなラミネート加工が阻害される等の問題が発
生する場合に保護材料を用いるときがあるが、本願発明
の目的とは大きく異なる。
In the present invention, a protective material, which is a material for protecting appearance defects such as wrinkles, is essential. Incidentally, Japanese Patent Application Laid-Open Nos. Sho 60-109835 and 4-89254.
Describes a method of hot pressing under a protective material between a pressing surface of an apparatus and a material to be laminated. In each case, a thermosetting type laminated board is manufactured, and therefore, the pressure and heat molding temperature is almost as low as 200 ° C. or less, and appearance defects such as wrinkles are originally unlikely to occur. The purpose is not to prevent the generation of wrinkles, which is the effect of the present invention, but to prevent the occurrence of scratches and dents on the metal foil surface and to prevent the occurrence of warpage of the laminate in a curing furnace after thermal lamination. there were. Alternatively, there is a case where a protective material is used when a problem such as smooth lamination is inhibited by a resin-impregnated paper or a resin-impregnated glass cloth having poor smoothness with a resin pool, but the purpose of the present invention is to differ greatly.

【0016】シワの発生原因を詳しく説明すると、例え
ば、熱ロールラミネート機で銅箔と熱可塑性ポリイミド
をラミネートする場合、熱ロールラミネート機のプレス
ロール間を通過することで、銅箔と熱可塑性ポリイミド
が貼り合わされる。ラミネート時、各被積層材料は熱に
よって膨張した状態にあるが、一般に銅箔の線膨張係数
よりも熱可塑性ポリイミドの線膨張係数は大きいため、
銅箔より面方向に大きく伸びた状態で熱可塑性ポリイミ
ドは銅箔と熱ラミネートされ、逆に、冷却時には熱可塑
性ポリイミドは銅箔より面方向に大きく縮む。このた
め、できた積層板は面方向にシワを生じる。これは、圧
力が開放されるラミネート直後も、材料が熱を保持して
おり、その温度が熱可塑性ポリイミドのTgよりも高い
ために熱可塑性ポリイミドは流動状態にあり、シワの発
生を抑止できないことも一因となっていると考えられ
る。
The cause of wrinkles will be described in detail. For example, when laminating a copper foil and a thermoplastic polyimide with a hot roll laminating machine, the copper foil and the thermoplastic polyimide are passed between press rolls of the hot roll laminating machine. Are pasted together. At the time of lamination, each laminated material is in a state expanded by heat, but since the linear expansion coefficient of thermoplastic polyimide is generally larger than the linear expansion coefficient of copper foil,
The thermoplastic polyimide is heat-laminated with the copper foil in a state of being extended more in the plane direction than the copper foil. Conversely, upon cooling, the thermoplastic polyimide shrinks more largely in the plane direction than the copper foil. For this reason, the resulting laminated plate has wrinkles in the surface direction. This is because the material retains heat immediately after lamination when the pressure is released, and the temperature is higher than the Tg of the thermoplastic polyimide, so that the thermoplastic polyimide is in a flowing state, and the generation of wrinkles cannot be suppressed. This is also considered to be a factor.

【0017】従って、保護材料は加熱時に、ある程度の
硬さを保持しないと、保護材料としての役割を担うこと
ができないことから、貼り合わせ温度での引張弾性率が
50kgf/mm2以上を保持することが必要である。
弾性率が50kgf/mm2未満であると、ラミネート
する圧力によっては、ワレが発生する場合がある。ま
た、保護材料の線膨張係数は100ppm/℃以下であ
ることが好ましい。線膨張係数が100ppm/℃より
大きいと、ラミ時の加熱−冷却サイクルによって被積層
材料に比べて保護材料の寸法が大きく変化するため、ラ
ミ後に被積層材料の表面にシワを生じさせるという悪影
響を及ぼす。
Therefore, the protective material cannot play a role as a protective material unless it has a certain degree of hardness when heated, so that the tensile elasticity at the bonding temperature should be 50 kgf / mm 2 or more. It is necessary.
If the elastic modulus is less than 50 kgf / mm 2 , cracking may occur depending on the laminating pressure. Further, the linear expansion coefficient of the protective material is preferably 100 ppm / ° C. or less. If the coefficient of linear expansion is greater than 100 ppm / ° C., the dimensions of the protective material are significantly changed as compared with the material to be laminated due to the heating-cooling cycle during lamination, so that the surface of the material to be laminated is wrinkled after lamination. Exert.

【0018】前記保護材料は、加工時の温度に耐え得る
ものでなければならず、例えば250℃で加工する場合
は、それ以上の耐熱性を有するポリイミドフィルムや銅
箔、アルミニウム箔、SUS箔といった金属箔等が有効
である。また、一般に市販されているポリイミドフィル
ムを使用する場合、ラミネート後の積層板のシワ形成を
抑制するという点から、保護材料の厚みは75μm以上
が好ましい。
The protective material must be able to withstand the temperature during processing. For example, when processed at 250 ° C., a polyimide film, copper foil, aluminum foil, SUS foil or the like having a higher heat resistance is used. A metal foil or the like is effective. When a commercially available polyimide film is used, the thickness of the protective material is preferably 75 μm or more from the viewpoint of suppressing the formation of wrinkles in the laminated plate after lamination.

【0019】保護材料を剥離する際の積層板の温度は、
熱可塑性樹脂を被積層材料として使用する場合には、そ
のTg以下の温度が好ましい。より好ましくはTgより
も50℃以上低い温度、更に好ましくはTgよりも10
0℃以上低い温度である。最も好ましくは室温まで冷却
された時点で保護材料を積層板から剥離するのが好まし
い。
The temperature of the laminate at the time of peeling the protective material is as follows:
When a thermoplastic resin is used as the material to be laminated, the temperature is preferably equal to or lower than its Tg. More preferably, the temperature is at least 50 ° C. lower than Tg, even more preferably 10 ° C. lower than Tg.
The temperature is lower than 0 ° C. Most preferably, the protective material is peeled from the laminate at the point of cooling to room temperature.

【0020】ラミネート直後、保護材料と積層板はかす
かに融着しており、積層板と上下保護材料を剥離する
際、剥離のパスラインが上下で非対称であった場合、上
下どちらかの保護材料が先に剥離し、残りの保護材料と
積層板が剥離する時に保護材料と積層板がかすかに融着
しているため、積層板が保護材料の方に引っ張られなが
ら剥離されるため、積層板がカールしてしまう。これを
防ぐために、上下保護材料を剥離する際は、積層板を対
称軸として上下保護材料の剥離角度を同等にすることが
好ましい。このときの上下保護材料の剥離角度の差は、
30度以内であることが好ましく、さらには10度以内
が好ましい。
Immediately after lamination, the protective material and the laminate are slightly fused, and when the laminate and the upper and lower protective materials are peeled off, if the peeling path line is asymmetrical in the upper and lower directions, either the upper or lower protective material is used. Since the protective material and the laminate are slightly fused when the remaining protective material and the laminate are peeled off first, the laminate is peeled while being pulled toward the protective material. Curls. In order to prevent this, when peeling the upper and lower protective materials, it is preferable to make the peel angle of the upper and lower protective materials equal with the laminated plate as the axis of symmetry. At this time, the difference between the peeling angles of the upper and lower protective materials is
It is preferably within 30 degrees, more preferably within 10 degrees.

【0021】本発明においては、前記保護材料を繰り返
し使用することができる。熱ロールラミネート機の前後
に被積層材料の繰出・巻取装置を設置するのはもちろん
のこと、保護材料用の繰出・巻取装置を併設することに
よって、一度ラミで利用された保護材料を巻取装置で巻
取り、繰出側に再度設置することで、保護材料を再利用
することができる。巻き取る際に、端部位置検出装置と
巻取位置修正装置を設置して、精度よく保護材料の端部
を揃えて巻き取っても構わない。
In the present invention, the above-mentioned protective material can be used repeatedly. In addition to installing the feeding and winding device for the material to be laminated before and after the hot roll laminating machine, by installing the feeding and winding device for the protective material in parallel, the protective material once used for lamination can be wound. The protective material can be reused by winding it up with the take-up device and installing it again on the payout side. At the time of winding, an end position detecting device and a winding position correcting device may be installed, and the ends of the protective material may be precisely aligned and wound.

【0022】以下実施例を記載して本発明をより詳細に
説明する。
Hereinafter, the present invention will be described in more detail by way of examples.

【0023】[0023]

【実施例】(実施例1、2)Tg190℃の25μmの
熱可塑性ポリイミドフィルム(鐘淵化学工業株式会社製
PIXEO TP−T)の両側に18μmの圧延銅
箔、さらにその両側に保護材料としてポリイミドフィル
ム(鐘淵化学工業株式会社製 アピカル125AH)を
図1のように配して、熱ロールラミネート機を用いて、
ラミ温度300℃、ラミ圧力50kgf/cm、ラミ速
度2m/minの条件で耐熱性フレキシブル積層板を作
製した。その結果、外観にシワ・カール等の不良のない
フレキシブル積層板を得た。なお、線膨張係数は、JIS
K7197に準拠して、理学電機(株)製:熱分析装置TMA81
40を用いて昇温速度10℃/minで測定した。
(Examples 1 and 2) Rolled copper foil of 18 μm on both sides of a thermoplastic polyimide film (PIXEO TP-T manufactured by Kaneka Chemical Industry Co., Ltd.) of Tg 190 ° C. and 25 μm, and polyimide on both sides as a protective material A film (Apical 125AH manufactured by Kanegafuchi Chemical Industry Co., Ltd.) was arranged as shown in FIG. 1, and a hot roll laminating machine was used.
A heat-resistant flexible laminate was produced under the conditions of a lamination temperature of 300 ° C., a lamination pressure of 50 kgf / cm, and a lamination speed of 2 m / min. As a result, a flexible laminated board free from defects such as wrinkles and curls in appearance was obtained. The linear expansion coefficient is JIS
According to K7197, manufactured by Rigaku Denki Co., Ltd .: Thermal analyzer TMA81
The measurement was performed at a heating rate of 10 ° C./min using a 40.

【0024】[0024]

【発明の効果】本発明による積層板の製造方法を用いる
ことによって、カールのない外観良好な積層板を得るこ
とが出来る。
By using the method for producing a laminate according to the present invention, it is possible to obtain a laminate having good curl and good appearance.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)実施例1を示す図である。 (b)実施例2を示す図である。FIG. 1A is a diagram showing a first embodiment. (B) It is a figure showing Example 2.

【符号の説明】[Explanation of symbols]

1 銅箔繰り出し 2 接着フィルム繰り出し 3 保護フィルム繰り出し 4 加熱加圧ロール 5 保護フィルム巻き取り 6 製品巻き取り 1 Unwinding of copper foil 2 Unwinding of adhesive film 3 Unwinding of protective film 4 Heating and pressurizing roll 5 Winding of protective film 6 Winding of product

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F211 AD03 AD05 AD08 AG03 TA03 TC05 TN09 TN44 TQ01 TQ03 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F211 AD03 AD05 AD08 AG03 TA03 TC05 TN09 TN44 TQ01 TQ03

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 熱融着性の被積層材料を含む複数の被積
層材料を加熱加圧成形装置により貼り合わせてなる積層
板の製造方法であって、該装置の加圧面と被積層材料と
の間に保護材料を配置して、200℃以上の加熱加圧成
形を行い、冷却後に該保護材料を積層板から剥離して積
層板を製造する方法であって、保護材料と積層板とを剥
離する工程において、積層板を対称軸として上下保護材
料が対称的な角度で隔離されることを特徴とする積層板
の製造方法。
1. A method for manufacturing a laminated board, comprising laminating a plurality of materials to be laminated including a heat-fusible material to be laminated by a heating and pressing molding apparatus, wherein a pressing surface of the apparatus and a material to be laminated are A method of manufacturing a laminated board by disposing a protective material in between, performing heat and pressure molding at 200 ° C. or higher, and peeling the protective material from the laminated board after cooling, wherein the protective material and the laminated board are formed. A method for manufacturing a laminated board, wherein, in the peeling step, the upper and lower protective materials are separated at a symmetric angle with the laminated board as a symmetric axis.
【請求項2】 前記積層材料を連続的に加熱加圧して貼
り合わせてなることを特徴とする請求項1記載の積層板
の製造方法。
2. The method for manufacturing a laminate according to claim 1, wherein said laminate material is continuously bonded by heating and pressing.
【請求項3】 前記保護材料の厚みが50μm以上であ
ることを特徴とする請求項1または2に記載の積層板の
製造方法。
3. The method according to claim 1, wherein the thickness of the protective material is 50 μm or more.
【請求項4】 2種以上の被積層材料を貼り合わせるこ
とを特徴とする請求項1乃至3のいずれか1項に記載の
積層板の製造方法。
4. The method according to claim 1, wherein two or more kinds of materials to be laminated are bonded.
【請求項5】 前記被積層材料として、厚みが50μm
以下の金属箔を用いることを特徴とする請求項1乃至請
求項4のいずれか1項に記載の積層板の製造方法。
5. The material to be laminated has a thickness of 50 μm.
The method for producing a laminate according to any one of claims 1 to 4, wherein the following metal foil is used.
【請求項6】 前記熱融着性の被積層材料として、熱可
塑性ポリイミドを50重量%以上含有する接着材料を用
いることを特徴とする請求項1乃至5のいずれか1項に
記載の積層板の製造方法。
6. The laminate according to claim 1, wherein an adhesive material containing 50% by weight or more of a thermoplastic polyimide is used as the heat-fusible material to be laminated. Manufacturing method.
【請求項7】 加圧加熱成形装置が、熱ロールラミネー
ト機またはダブルベルトプレス機であることを特徴とす
る請求項1乃至請求項6のいずれか1項に記載の積層板
の製造方法。
7. The method for producing a laminate according to claim 1, wherein the press-heating and forming apparatus is a hot roll laminator or a double belt press.
【請求項8】 ロール状に巻かれた長尺シート状物を、
被積層材料または保護材料の少なくとも一方として用い
ることを特徴とする請求項2乃至請求項7のいずれか1
項に記載の積層板の製造方法。
8. A long sheet material wound in a roll shape,
8. The method according to claim 2, wherein the material is used as at least one of a material to be laminated and a protective material.
13. The method for producing a laminate according to the above item.
【請求項9】 前記保護材料を繰り返し使用することを
特徴とする請求項1乃至8のいずれか一項に記載の積層
板の製造方法。
9. The method for manufacturing a laminate according to claim 1, wherein the protective material is used repeatedly.
JP2000248796A 1999-11-01 2000-08-18 Method of manufacturing heat-resistant flexible board Withdrawn JP2002064259A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000248796A JP2002064259A (en) 2000-08-18 2000-08-18 Method of manufacturing heat-resistant flexible board
US10/129,037 US7101455B1 (en) 1999-11-01 2000-10-30 Method and device for manufacturing laminated plate
PCT/JP2000/007656 WO2001032418A1 (en) 1999-11-01 2000-10-30 Method and device for manufacturing laminated plate
KR1020027003851A KR100724046B1 (en) 1999-11-01 2000-10-30 Method and device for manufacturing laminated plate
TW89122865A TWI223577B (en) 1999-11-01 2000-10-31 Manufacturing method and manufacturing apparatus of laminated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000248796A JP2002064259A (en) 2000-08-18 2000-08-18 Method of manufacturing heat-resistant flexible board

Publications (1)

Publication Number Publication Date
JP2002064259A true JP2002064259A (en) 2002-02-28

Family

ID=18738639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000248796A Withdrawn JP2002064259A (en) 1999-11-01 2000-08-18 Method of manufacturing heat-resistant flexible board

Country Status (1)

Country Link
JP (1) JP2002064259A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004108397A1 (en) * 2003-06-02 2004-12-16 Nippon Steel Chemical Co., Ltd. Method for producing laminate
KR100683173B1 (en) * 2006-10-04 2007-02-16 (주) 이레비젼 Coating apparatus of carbon plate heater and method thereof
US9654248B2 (en) 2013-10-11 2017-05-16 British Telecommunications Public Limited Company Optical data transmission method and apparatus
US9860012B2 (en) 2013-04-24 2018-01-02 British Telecommunications Public Limited Company Optical data transmission

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004108397A1 (en) * 2003-06-02 2004-12-16 Nippon Steel Chemical Co., Ltd. Method for producing laminate
KR100683173B1 (en) * 2006-10-04 2007-02-16 (주) 이레비젼 Coating apparatus of carbon plate heater and method thereof
US9860012B2 (en) 2013-04-24 2018-01-02 British Telecommunications Public Limited Company Optical data transmission
US9654248B2 (en) 2013-10-11 2017-05-16 British Telecommunications Public Limited Company Optical data transmission method and apparatus

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