JP2002057101A - Adjustment system of projection aligner, aligning device, adjustment method of projection aligner, aligning method, information-processing device, and projection aligner, device-manufacturing method using them, adjustment information supply method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the adjustment system of a projection aligner that functions as an offset analyzer, and at the same time cancels increase in device cost. SOLUTION: The relative alignment between the first and second objects is made by the offset analyzer 10 before the shape of a plurality of marks on the second object is measured, a mark detection signal and shape information are sent from a host computer 12 to a vender 11 via the Internet, indication that a device variable is changed by the vender 11 as needed and the mark is detected with optimized conditions communicates via the Internet, the mark detection signal and shape information are sent to the vender 11, an offset generated by the simulation by the vender 11 is calculated, information containing the offset is transferred to a stepper 14 via the Internet, the alignment between the first and second objects is carried out based on the information containing the offset, and exposure is made by a stepper 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus adjustment system, an adjustment method, and an exposure system, and more particularly, to an IC formed on a reticle surface as a first object in an exposure apparatus for manufacturing a device such as a semiconductor. , LSI, V
The present invention can be favorably applied to a positioning apparatus, a positioning method, and an exposure apparatus for performing relative positioning (alignment) between a fine electronic circuit pattern such as an LSI and a wafer as a second object. Here, most of the exposure apparatuses are currently called steppers and scanners. However, in this specification, for the sake of convenience, if no special distinction is required, the exposure apparatus will be referred to as an exposure apparatus.

Further, the present invention provides a method for transferring information between a place where an exposure apparatus is located (= a semiconductor manufacturing factory or the like) and a remote place (= a manufacturing apparatus maker or a consultant company or the like = a vendor) via a public data line such as the Internet. The present invention relates to a method for exchanging information and optimally using an exposure apparatus.

[0003]

2. Description of the Related Art Projection exposure apparatuses for manufacturing semiconductors are required to be able to project and expose a circuit pattern on a reticle surface with a higher resolution on a wafer surface with the miniaturization and higher density of integrated circuits. Since the projection resolution of a circuit pattern depends on the numerical aperture (NA) of the projection optical system and the exposure wavelength, a method of increasing the NA of the projection optical system by fixing the exposure wavelength or shortening the exposure wavelength, for example, From the g-line to the i-line, from the i-line to the excimer laser oscillation wavelength, and also to the excimer laser oscillation wavelength, 248, 193 [nm],
Further, an exposure method using 157 [nm] is being studied, and an exposure wavelength of 193 [nm] has already been commercialized.

On the other hand, with the miniaturization of circuit patterns, it has been required to align a reticle on which an electronic circuit pattern is formed with a wafer with high accuracy.

[0005] Alignment errors can be broadly divided into device factors and process factors. Recently, as far as possible, error correction for device-related errors has been completed.
WIS (Wafer In), another name for process factor error
The applicant has proposed an alignment detection system corresponding to duced shift) as a system called an offset analyzer.

First, as an example, WIS means that the alignment mark shape and the resist shape thereon become asymmetric due to a process factor error. Recently introduced metal CMP (Chemical Mechanical Polishing: Chem)
In a planarization process such as a mechanical mechanical polishing process, the structure of the alignment mark frequently becomes asymmetric, and in the global alignment, the alignment mark shown in FIG.
And a magnification error shown in FIG. 10, which are serious problems such as deterioration of accuracy. Here, FIG.
FIG. 10 is a diagram showing a conventional example when a rotation error occurs in global alignment, and FIG. 10 is a diagram showing a conventional example in which a magnification error occurs in global alignment.

Therefore, in the offset analyzer, in order to perform relative positioning between the wafer and the reticle, the position of the wafer is detected by a non-exposure light TTL off-axis (Through-The-Lens (TTL) with a high baseline stability. ) Of
faxis) type alignment detection system, and before that, the shape of the same multiple marks used for alignment on the wafer can be detected outside the alignment device (= exposure device) before and after resist application. The shape is measured (at the time of calibration or the like) by a three-dimensional shape measuring instrument (profiler) such as an AFM (Atomic Force Microscope). Then, an offset is calculated when the three-dimensional relative positional relationship between the resist and the wafer mark is adjusted to match the signal of the detection system of the alignment device, and alignment is performed using the value. A method has been proposed to eliminate the deterioration in accuracy due to the asymmetrical alignment mark shape by the above-described process.

Outside the positioning device (= exposure device), the surface shape is measured by a profiler such as an AFM before and after the application of the resist, and the three-dimensional relative positional relationship between the resist and the wafer mark is determined. A system that calculates an offset when the signal is adjusted to match the signal of the detection system of the positioning device is called an offset analyzer.

FIG. 11 shows data measured by AFM on an actual alignment mark.

This signal is obtained after the resist is applied. The structure of the alignment mark is the same as that of the metal CMP shown in FIG.
It is what is called. Here, FIG. 12 is a diagram showing the structure of an alignment mark called metal CMP. As can be seen from FIG. 11, the resist shapes on the alignment marks in the left and right and the middle shots of the wafer have a symmetric surface shape in the middle shot, but have asymmetric surface shapes in the left and right shots. It can be seen that the sex is reversed on the left and right. This is WIS.

[0011] The offset analyzer enables a highly accurate and stable alignment method with little baseline variation corresponding to WIS.

The offset analyzer that has already been proposed will be described below with reference to FIGS.
Here, FIG. 13 is a conceptual diagram showing a wafer and a flow of information when an offset analyzer is arranged, and FIG. 14 is a diagram showing a configuration of the offset analyzer.

Hereinafter, as described above, various types of exposure devices such as steppers, scanners, and aligners are referred to as exposure devices, alignment detection systems are referred to as alignment scopes, and outside the alignment device (= exposure device) before and after resist coating. A system that measures the surface shape with a profiler and calculates the offset when the three-dimensional relative positional relationship between the resist and the wafer mark is adjusted to match the signal of the detection system of the alignment device is called an offset analyzer. Is the same as already proposed by the present applicant.

Referring to FIG. 13, the flow of information in a wafer and information in the offset analyzer will be described first.

In this conventional example, first, as shown in FIG. 13-, the wafer 31 shown in FIG. 13- is transferred to the offset analyzer 32 before applying a resist, and the shape (surface shape) of the alignment mark on the wafer 31 is changed. Measured with a profiler.

Next, as shown in FIG.
1 is transported to a coater 33 to apply a resist, and the resist is applied.

Next, as shown in FIG.
1 is again transferred to the offset analyzer 32, and the surface shape of the resist on the alignment mark is measured by a profiler.

Next, the signal of the alignment mark of the wafer 31 is detected by a detection system constituted by an offset analyzer 32 and equivalent to an alignment scope constituted by an exposure apparatus.

Next, the offset generated in the wafer 31 is calculated by the signal simulator of the offset analyzer 32. In the method of calculating the offset, first, it is necessary to match the three-dimensional relative positional relationship between the resist and the wafer mark. By changing the three-dimensional relative positional relationship between the resist and the wafer mark, the relationship in which the result of the signal simulator matches the signal of the alignment mark is
The three-dimensional relative positional relationship between the resist and the wafer mark is assumed. An alignment signal is obtained using the relative positional relationship at this time, an offset for alignment measurement is calculated from the alignment signal, and the value is sent to an exposure apparatus (Stepper) 35 (see the dotted arrow in FIG. 12).

Based on the offset, the stepper 35 performs alignment and exposure, as shown in FIG.
Then, as shown in FIG. 13-, after the exposure of all shots on the stepper 35 is completed, the wafer 31 is transferred to a developer 36 for development, and a development process is performed.

Next, the configuration of the offset analyzer 32 shown in FIG. 13 will be described with reference to FIG.

The offset analyzer 32 is used for the wafer 31
, A three-dimensionally moved XYZ stage (XYZ stage) 42, a profiler 43 for measuring the surface based on the presence or absence of a resist, a detection system 44 equivalent to an alignment scope configured in an exposure device 35 (FIG. 13),
And a simulator (Simulator) that controls the entire offset analyzer 32 and calculates an alignment offset (offset amount for alignment measurement) from the surface shape.
) 46 (a central processing unit) 45 (a wafer transfer system and a focus detection system for the wafer 31 are not shown in FIG. 14).

When calculating the alignment offset by the offset analyzer 32, it is necessary to manage device errors (= TIS: Tool Induced Shift) between the detection system of the offset analyzer 32 and the alignment scope of the exposure device 35, or to know information. . For example, the coma aberration of the optical system, the uniformity of the illumination system, and the like correspond to this. The alignment scope of the exposure apparatus 35 may have no error until the error can be ignored, or the alignment scope of the exposure apparatus 35 and the alignment detection system of the offset analyzer 32 may have the same error. As a method of evaluating the TIS, a method as disclosed in Japanese Patent Application Laid-Open No. 9-280816 has already been proposed by the present applicant, and its effect has been actually confirmed.

If the offset analyzer 32 knows the device error information of the alignment scope of the exposure device 35, the offset analyzer 32
(For example, the offset analyzer 32 is a bright-field detection system and the exposure device 35 is a dark-field detection system) without configuring the same alignment detection system as that of the alignment scope described above. The calculation may be performed.

The offset analyzer 32 is constructed separately from the exposure device 35, which is an exposure device. The offset analyzer 32 calculates the alignment offset in a sequence that does not hinder the exposure of the exposure device 35 so as to calculate the alignment offset. Thus, it is effective in terms of throughput to configure a single or a plurality of (not necessarily equal to the number of exposure devices 35) offset analyzers 32.

As described above, the above-described offset analyzer measures the alignment mark, and calculates the offset generated therefrom in advance by the offset analyzer, thereby deteriorating the accuracy due to the asymmetric alignment mark shape due to the process. prevent,
A highly accurate and high-throughput positioning method can be realized.

When this offset analyzer is used, alignment mark measurement and offset calculation may be performed on all wafers, or may be performed only on the first wafer under limited conditions, for example. For the second and subsequent wafers, the offset can be used.

Of course, in the second and subsequent wafers,
The case where the offset is used is a case where the asymmetry variation in the alignment mark shape of the wafer is small under limited conditions (for example, within a certain lot).

As described above, at least in the above-described offset analyzer, a sequence that is used once or more can be realized.

[0030]

As described above,
In a sense corresponding to WIS, the offset analyzer can exert a sufficiently large effect. However, in the entire exposure system, it is necessary to newly add an offset analyzer. In particular, when a signal simulation is performed by a simulator to obtain an alignment signal and calculate a measurement error therefrom, a simulator for each offset analyzer and a computer for operating the simulator are required. Therefore, in order to perform these processes at high speed, an expensive computer having a high calculation speed is required for each exposure system.

The present invention has been made in view of the above problems, and solves the problem of an increase in apparatus cost while maintaining the function of an offset analyzer. An exposure system adjustment system that responds using a public data line,
An object of the present invention is to provide an alignment apparatus, an exposure apparatus adjustment method, an alignment method, an information processing apparatus, an exposure apparatus, a device manufacturing method using them, an adjustment information supply method, and the like.

[0032]

In order to solve the above-mentioned problems, an exposure apparatus adjustment system according to the present invention is directed to a system having an exposure apparatus for transferring a pattern of a first object onto a second object. Has a detection system for performing relative positioning between the first object and the second object, and the detection system detects a mark on the second object and a mark detection signal obtained by detecting a mark on the second object. The shape information obtained by measuring the shape of the mark on the two objects is transmitted to a remote place via a public data line, an offset is calculated by simulation at the remote place, and the offset is calculated via the public data line. Transmitting information including the offset to the exposure apparatus,
Based on the information including the offset in the detection system,
The position of the first object and the position of the second object are aligned, and the exposure is performed by the exposure apparatus. here,
The “remote place” is not limited to a remote place in a narrow sense, but includes a place where information can be transmitted via a public data line (for example, the Internet).

When calculating the offset by the simulation, the adjustment system of the exposure apparatus communicates, via the public data line, an instruction to perform the detection of the plurality of marks under different conditions from the remote location when necessary.
At least the mark detection signal obtained by the detection system under the different conditions can be sent to the remote place via the public data line. When measuring the shape of the mark on the second object outside the exposure apparatus, it is preferable to measure the surface shape before and after resist application. The surface shape may be measured by a three-dimensional shape measuring device at the time of calibration. The three-dimensional shape measuring device is preferably an atomic force microscope, and more preferably a stylus type three-dimensional shape measuring device.

The adjustment system for the exposure apparatus is provided with the second
The first object of the exposure apparatus for transferring the pattern of the first object onto the second object when measuring the surface shape of a plurality of marks on the object before and after resist application outside the exposure apparatus It is possible to use an offset when the exposure apparatus is adjusted so as to match a signal of a detection system that performs relative positioning between the exposure apparatus and the second object. It is preferable that the surface shape is measured outside the exposure apparatus by light three-dimensional measurement calibrated by a non-exposure light three-dimensional shape measurement system. Further, it is preferable that a database of information including device error information is created at the remote place.

According to the method of adjusting an exposure apparatus of the present invention, when measuring the shape of a plurality of marks on a second object outside the exposure apparatus in the adjustment system of the exposure apparatus, the surface shape is measured before and after resist application. Is possible. It is preferable that the surface shape is measured by a three-dimensional shape measuring device at the time of calibration. The three-dimensional shape measuring instrument is preferably an atomic force microscope, and more preferably a stylus type three-dimensional shape measuring instrument.

The method of adjusting the exposure apparatus may be such that when the shape of a plurality of marks on the second object is measured before and after resist application outside the exposure apparatus, the pattern of the first object is converted to the first object pattern. It is possible to use in the exposure apparatus an offset when the exposure apparatus is transferred so as to match a signal of a detection system that performs relative positioning between the first object and the second object of the exposure apparatus. It is. It is preferable that the surface shape is measured outside the exposure apparatus by light three-dimensional measurement calibrated by a non-exposure light three-dimensional shape measurement system.

According to the positioning method of the present invention, in the adjusting system of the exposure apparatus, when positioning a plurality of the second objects, the first object and the second object are firstly positioned with respect to the second object. It is possible to measure the offset when the signal is adjusted so as to match the signal of the detection system for performing the relative position adjustment, and to use the same offset for the second and subsequent second objects.

An information processing apparatus according to the present invention is an information processing apparatus for calculating offset information or offset correction information generated in an exposure apparatus for transferring a pattern of a first object onto a second object, which is obtained at a remote place. Means for acquiring the shape information of the mark on the second object and the detection information of the mark by the exposure device from a remote place via a public data line; and acquiring the acquired shape information and the detected information. Means for calculating the offset generated in the exposure apparatus based on the information, and means for transmitting the offset information or the offset correction information to the remote exposure apparatus via the public data line. Features.

An exposure system according to the present invention performs offset correction processing for a plurality of distant exposure apparatuses based on information from the information processing apparatus. It is possible to perform pattern transfer on the second object by performing alignment with the two objects.
Further, it is possible to manufacture a device by transferring a pattern onto the second object using the exposure system.

According to the device manufacturing method of the present invention, device manufacturing can be performed by using the adjustment system of the exposure apparatus.

In the exposure apparatus of the present invention, when exposing a pattern of an original onto a substrate, the positioning apparatus aligns the original and the substrate relative to each other. Can be used. The exposure apparatus further includes a display, a network interface, and a computer that executes network software, and is capable of performing data communication of maintenance information of the exposure apparatus via a computer network. The network software is connected to an external network of a factory where the exposure apparatus is installed, and provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus on the display. , It is possible to obtain information from the database.

The device manufacturing method of the present invention includes a step of installing a group of manufacturing apparatuses for various processes including the exposure apparatus in a manufacturing factory, and a step of manufacturing a device by a plurality of processes using the group of manufacturing apparatuses. It is possible to have. A step of connecting the group of manufacturing apparatuses via a local area network; and a step of performing data communication of information on at least one of the group of manufacturing apparatuses between the local area network and an external network outside the manufacturing factory. More preferably, it is provided. Further, a database provided by a vendor or a user of the exposure apparatus may be accessed via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or between the manufacturing factory and another manufacturing factory. Production management may be performed by data communication via an external network.

The semiconductor manufacturing plant according to the present invention is capable of accessing a manufacturing apparatus group for various processes including the exposure apparatus, a local area network connecting the manufacturing apparatus group, and an external network outside the factory from the local area network. , And can perform data communication of information on at least one of the manufacturing apparatus groups.

The maintenance method for an exposure apparatus according to the present invention is a method for maintaining the exposure apparatus, wherein a vendor or a user of the exposure apparatus installed in a manufacturing factory is connected to a maintenance database connected to an external network of the manufacturing factory. Providing access to the maintenance database from within the manufacturing plant via the external network, and transmitting maintenance information stored in the maintenance database to the manufacturing plant via the external network. And a step of performing

The method for adjusting an exposure apparatus according to the present invention is a method for adjusting a plurality of exposure apparatuses for transferring a pattern of a first object onto a second object. Transmitting the shape information of the mark and the detection information of the mark by the corresponding exposure apparatus via a public data line limited to the respective supply destinations of the respective exposure apparatuses; and Transmitting the offset information or the offset correction information transmitted to the corresponding exposure apparatus. Further, it is possible to manufacture a device using the exposure apparatus adjusted by the above-described method of adjusting the exposure apparatus.

An adjustment information supply method according to the present invention is a method for supplying adjustment information of an exposure apparatus for transferring a pattern of a first object onto a second object, wherein the first object and the second object of the exposure apparatus are connected to each other. A mark detection signal obtained by detecting a mark on the second object, and a shape information obtained by measuring a surface shape of the mark on the second object by a detection system for performing positioning of the mark. Receiving from a remote place via a public data line; creating a database from the data received at the remote place; calculating the offset of the exposure apparatus using the database; and And transmitting an information including the offset to the exposure apparatus via a data line. The first detection is performed by the detection system based on the information including the offset.
It is characterized in that the positioning of the object and the second object is performed, and the accounting of the user of the exposure apparatus is calculated in the offset transmitting step.

An adjustment information supply method according to the present invention is a method for supplying adjustment information of an exposure apparatus for transferring a pattern of a first object onto a second object, wherein the first object and the second object of the exposure apparatus are connected to each other. A mark detection signal obtained by detecting a mark on the second object, and a shape information obtained by measuring a surface shape of the mark on the second object by a detection system for performing positioning of the mark. Receiving from a remote place via a public data line; creating a database from the data received at the remote place; calculating the offset of the exposure apparatus using the database; and And transmitting an information including the offset to the exposure apparatus via a data line. The first detection is performed by the detection system based on the information including the offset.
It is characterized in that the positioning of the object and the second object is performed, and the accounting of the user of the exposure apparatus is calculated in the offset transmitting step.

Preferably, the adjustment information supply method further includes a step of obtaining information on the number of times of data acquisition in the receiving step, and the accounting calculation is preferably performed in consideration of the information on the number of times of data acquisition. Preferably, the receiving step is performed for a plurality of remote locations, and the shape information is information obtained by measuring the surface shape of the mark before and after resist application outside the exposure apparatus. Can be used.

Furthermore, the method for supplying adjustment information enables a computer device having software for executing the same.

[0050]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a preferred embodiment of an exposure apparatus adjustment system, an alignment apparatus, an exposure apparatus adjustment method, an alignment method, and the like, a wafer and a reticle are aligned relative to each other. Therefore, the detection position of the wafer is detected by, for example, a non-exposure light TTL off-axis type alignment detection system having a high stability of the baseline, and before that, the same plurality of marks used for alignment on the wafer are detected. Outside the alignment device (= exposure device), the surface shape is measured by a profiler before and after resist application, and the measured mark detection signal and shape information are transmitted to a remote vendor via the Internet. Then, if necessary, change the device variables and re-detect the mark under optimal conditions. (Signals and shape information) are sent to the vendor, and the offset generated in the simulation there is adjusted so that the three-dimensional relative positional relationship between the resist and the wafer mark matches the signal of the alignment detection system outside the exposure apparatus. The information is transmitted to the exposure apparatus via the Internet again, and the wafer and the reticle are aligned and exposed based on the calculated offset amount. Due to these, an exposure apparatus adjustment system, an alignment apparatus, an exposure apparatus adjustment method, an alignment method, which eliminates accuracy degradation due to the asymmetric alignment mark shape caused by the above-described process.
An information processing apparatus, an exposure apparatus, a device manufacturing method using the same, an adjustment information supply method, and the like can be provided.

[0051]

Next, an embodiment of the present invention will be described in detail with reference to the drawings. [First Embodiment] FIG. 1 is a diagram showing a wafer and a flow of information in an offset analyzer according to an embodiment of the present invention. Where 10 is an offset analyzer,
11 is a vendor, 12 is a host computer, 13 is a coater, 14 is an exposure apparatus (stepper), 15 is a developer, 16 is an overlay measurement tool (Overlay Measurement Tool). ).

A major difference from the offset analyzer already proposed in FIG. 12 is that the signal simulator is located on the vendor 11 side, and the three-dimensional shape data and the alignment signal data are transmitted from the host computer 12 on the semiconductor manufacturing factory side to the Internet. The signal is sent to the host computer of the vendor 11 via the signal processor, where the offset amount generated by the signal simulator is calculated. The calculation method is the same as in the above-described conventional example. Then, the calculated offset amount is sent to the host computer 12 on the semiconductor manufacturing factory side again via the Internet, and then sent to the exposure device 14 to perform exposure.

FIG. 2 is a conceptual diagram showing the configuration of the offset analyzer 10 using the Internet according to one embodiment of the present invention.

13 differs from the already proposed configuration of the offset analyzer 32 (FIG. 12) in that there is no signal simulation (simulator 46) in the CPU 21 of the offset analyzer 10 and the host computer 12 (FIG. 1). It is a point that is connected to.

The invention of a remote maintenance management system for industrial equipment using the Internet has already been disclosed by the present applicant in Japanese Patent Application Laid-Open No. Hei 10-97966.

Also in the invention of Japanese Patent Application Laid-Open No. Hei 10-97966, similarly to the present embodiment, a place where an exposure apparatus as an example of industrial equipment is located (= a semiconductor manufacturing factory or the like) and a remote place (= a manufacturing apparatus maker or a consultant company). An invention has been disclosed for a method of using the Internet for exchanging information with another (vendor) and maintaining an exposure apparatus.

Japanese Patent Application Laid-Open No. 10-97966 is for maintenance, and is an effective system when a problem due to a device factor occurs. On the other hand, the present embodiment is a countermeasure (adjustment system or the like) for a problem caused by a process factor such as WIS, and can be said to be an effective embodiment for the user. Further, this embodiment can be said to be an embodiment of an information processing apparatus that performs various processes on information such as an exposure apparatus using a public data line.

The Internet-related portions of this embodiment and Japanese Patent Application Laid-Open No. 10-97966 are the same. In the offset analyzer 10 of this embodiment shown in FIG. 1, the coater 13, the exposure device (stepper 14), the developer 15, The overlay inspection device (overlay measurement tool 16) and the like are connected to the host computer 12 via a LAN (intranet or the like), and the host computer 12 and the computer of the vendor 11 can communicate with each other via the Internet to form an exposure system. . In this embodiment, a packet communication protocol (TCP / IP) used on the Internet is used as a communication protocol.

[Other Embodiments] Information is exchanged between a place where an exposure apparatus is located (= a semiconductor manufacturing factory or the like) and a remote place (= a manufacturing apparatus maker or a consultant company or the like = a vendor), and the exposure apparatus is compatible with WIS. When used effectively, new functions will be created.

This is because information such as a wafer signal, a shape measurement value, and an overlay inspection result is sent from a plurality of semiconductor manufacturing factories to a vendor (= manufacturing apparatus maker, consultant company, etc.) via the Internet. That is, a database of various information including device errors is created on the vendor side.

Using this database, error classification of device factors and process factors with respect to required accuracy can be created based on data actually obtained at a plurality of semiconductor manufacturing factories. In other words, it is possible to reconstruct an error budget of alignment (Error Budget), and this budget also takes WIS into account.

Unfortunately, at present, the error amount that can be obtained is mostly due to only the device factor, and a database that can be used effectively for the first time by exchanging data over the Internet as in this embodiment or the first embodiment described above. Can be created, and from there it is possible to reconstruct the error budget for the first time in consideration of the WIS.

In this way, it is possible to judge what error can be effectively improved by reducing the number of errors. This can serve as a guideline for not only improving the yield at present but also improving the accuracy.

As described above, in the method using the offset analyzer, the precision deterioration due to the asymmetrical alignment mark shape due to the process is prevented.
And the like, without being affected by a semiconductor forming process such as a semiconductor device, a highly accurate and high-throughput alignment method (alignment apparatus and / or alignment method) can be performed. By exchanging data by using a database, it is possible to create a database that can be used effectively for the first time, and from that, it is possible to reconstruct an error budget for the first time in consideration of WIS, and a CoO (cost of Ownership (Cost of Ownership) can be improved.

In the description so far, an exposure apparatus for exposing a circuit pattern has been described as an exposure apparatus. However, as described above, the exposure apparatus is used for convenience, and is referred to as a so-called stepper. It is needless to say that the present invention is effective for a positioning device and / or a positioning method of all exposure methods such as a scanner, an X-ray exposure at the same magnification, an EB (Electron Beam) direct drawing, and an EUV.

Of course, if alignment marks and resist shape information are known from signals of an alignment detection system included in the exposure type exposure apparatus, it is premised that the information can be calculated by signal simulation based on the information.

[Embodiment of Semiconductor Production System] Next, devices such as semiconductors (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads) using the exposure apparatus managed by the adjustment system described above. , A micromachine, etc.) will be described. In this method, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 3 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a business establishment of a vendor (apparatus supply maker) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing plant, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment,
It is assumed that flattening equipment and the like and post-processing equipment (assembly equipment, inspection equipment, etc.) are used. In the business office 101, a host management system 10 for providing a maintenance database of manufacturing equipment
8. It has a plurality of operation terminal computers 110 and a local area network (LAN) 109 connecting these to construct an intranet or the like. Host management system 1
Reference numeral 08 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the business office, and a security function for restricting external access.

On the other hand, reference numerals 102 to 104 denote manufacturing factories of a semiconductor manufacturer as users of the manufacturing apparatus. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106 (including a plurality of exposure apparatuses), a local area network (LAN) 111 connecting them to construct an intranet or the like, and an operation status of each manufacturing apparatus 106 The host management system 107 is provided as a monitoring device that monitors the status of the host. The host management system 107 provided in each of the factories 102 to 104 has a LAN 111 in each of the factories.
To the Internet 105 which is an external network of the factory.
It has a gateway for connecting to. As a result, access from the LAN 111 of each factory to the host management system 108 on the vendor 101 side via the Internet 105 is possible, and only users limited by the security function of the host management system 108 are permitted to access. More specifically, the factory notifies the vendor of status information indicating the operating status of each manufacturing apparatus 106 (for example, a symptom of the manufacturing apparatus in which a trouble has occurred) via the Internet 105, and responds to the notification. Response information (for example, information instructing a coping method for a trouble, software and data for coping), and maintenance information such as the latest software and help information can be received from the vendor. Each factory 102-104 and vendor 101
The communication protocol (TCP / IP) generally used in the Internet is used for data communication between the Internet and the LAN 111 in each factory. Instead of using the Internet as an external network outside the factory, it is also possible to use a dedicated line network (such as ISDN) that is not accessible from a third party and has high security. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access from a plurality of factories of the user to the database.

In such a system, as described above, the three-dimensional shape data of the mark on the wafer sent from the host management system 107 to the corresponding exposure apparatus 106 and the alignment signal data in the corresponding exposure apparatus 106 are transmitted via the Internet or the like. The data is transmitted to the vendor-side host management system 108 via a signal simulator, and the offset data is sent to the host management system 107 again via the Internet or the like. Make corrections.

FIG. 4 is a conceptual diagram showing the entire system according to the present embodiment cut out from an angle different from that of FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. Data communication of the information of the manufacturing apparatus. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing line for performing various processes, for example, an exposure apparatus 202, a resist processing apparatus 203;
A film forming apparatus 204 is introduced. Although FIG. 4 shows only one manufacturing factory 201, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by a LAN 206 to form an intranet or the like, and a host management system 205 manages the operation of the production line. On the other hand, an exposure apparatus maker 210, a resist processing apparatus maker 220, a film forming apparatus maker 230, etc.
Each business establishment of the vendor (equipment maker) is provided with host management systems 211, 221, and 231 for remote maintenance of the supplied equipment, and these are provided with the maintenance database and the gateway of the external network as described above. . The host management system 205 that manages each device in the user's manufacturing factory and the vendor management systems 211, 221, and 231 of each device are connected to the external network 20.
0 or a dedicated line network. In this system, if a trouble occurs in any of a series of manufacturing equipment in the manufacturing line, the operation of the manufacturing line is stopped, but remote maintenance is performed via the Internet 200 from the vendor of the equipment in which the trouble has occurred. As a result, quick response is possible, and downtime of the production line can be minimized.

Each manufacturing apparatus installed in the semiconductor manufacturing factory has a display, a network interface, and a computer for executing network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 5 on a display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 4.
01, serial number 402, trouble subject 40
3. Information such as date of occurrence 404, degree of urgency 405, symptom 406, coping method 407, progress 408, etc. is input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. The user interface provided by the web browser further includes a hyperlink function 41 as shown in the figure.
0, 411, 412, allowing the operator to access more detailed information on each item, extract the latest version of software used for manufacturing equipment from the software library provided by the vendor, and provide information for factory operators. An operation guide (help information) can be pulled out. Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

In such a system, the host management system 205 converts the three-dimensional shape data of the mark on the wafer and the obtained alignment signal data of the corresponding exposure apparatus 202 into the host of the manufacturer of the corresponding exposure apparatus. Data transmission is performed by giving high confidentiality only to the management system using an encryption program or the like. The vendor calculates offset data by using a simulator, and sends the calculated offset data to the host management system 205 with high confidentiality. The host management system 205 sends the offset data only to the corresponding exposure apparatus, and
Performs the offset correction of the alignment using this. Although the first embodiment is applied to the systems shown in FIGS. 3 and 4 described above, other embodiments may be applied.

Next, a mechanism for providing management information by a vendor using this system will be described. In advance, the user and a specific vendor supply various data on the user side to the vendor side, and the vendor updates the offset data of the apparatus to the user side at any time and provides the data to the user side. That is, each user can transmit various data with high confidentiality to the vendor side via the Internet regularly or every time information is collected, and can transmit offset data from the vendor side with high confidentiality via the Internet. Software that can be extracted is supplied from the vendor side and is input to each host management system 205. At the same time, the vendor-side host management system, for example, the host management system 211
Counts how many times data relating to each device has been supplied from the user side, checks for each device whether offset data of the device has been supplied, and creates billing data for each device.

This will be described in detail. The user transmits the three-dimensional shape data of the mark on the wafer and the obtained alignment signal data sent from the host management system 205 to the exposure apparatus manufactured by the vendor to the vendor in association with the corresponding exposure apparatus. In addition, the user side also obtains the data of the result of the overlay inspection executed in the corresponding exposure apparatus, including the ID of the corresponding apparatus, the execution timing, and various exposure conditions (resist type, illumination condition, magnification, etc.) in actual exposure. The data is also stored in the host management system 205, and these data are transmitted to the vendor in the same manner.

On the vendor side, these data are collected from a plurality of users and a plurality of factories via the Internet, for example, the external network 200, through a vendor-side host management system, and a processing device for creating a database (not shown)
Create a database by From the analysis of the tendency of the alignment error and the like using this database, it is possible to obtain an error classification as to whether it is a device factor or a process factor of the alignment error occurring under each exposure condition of each device. On the basis of this error classification, the vendor creates offset data corresponding to the alignment error actually occurring in the corresponding exposure apparatus for each exposure apparatus, and uses this offset data for the user who manages the corresponding exposure apparatus. The data is transmitted to the host management system 205.

The accounting method of the vendor-side host management system will be described with reference to the flowchart of FIG. When transmitting the offset data corresponding to the corresponding exposure apparatus on the user side (YES in step 51), the vendor side transmits the data from the user stored in step 52 with respect to the corresponding exposure apparatus. The number of receptions is read. If the offset data is not transmitted corresponding to the corresponding exposure apparatus on the user side (NO in step 51), step 51 is repeated. When creating the offset data, the vendor side has benefited from the data obtained from the user side with respect to the corresponding device, and therefore provides the user with a discount corresponding to the number of receptions of this data when charging. Here, in step 53, a discount amount according to the number of times of the data is calculated, and in step 54, the amount obtained by subtracting this discount amount from the basic charging amount is output as the charging amount of the corresponding device.

With such a charging system, the user side can receive the service at a discounted price for the data given to the vendor side when obtaining the appropriate offset data according to the apparatus. There is an advantage that a service can be provided to the user side with an appropriate charge according to the degree of contribution by a simple discount billing system.

Next, a manufacturing process of a semiconductor device using the above-described production system will be described. FIG.
1 shows a flow of an overall semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and an assembly process (dicing, dicing,
Bonding), an assembly process such as a packaging process (chip encapsulation) and the like. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Also, between the pre-process factory and the post-process factory,
Information and the like for production management and device maintenance are communicated via the Internet or a dedicated line network.

FIG. 8 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Productivity can be improved.

[0081]

As described above, according to the present invention,
By constructing and using an offset analyzer using a public data line such as the Internet, it is possible to prevent the accuracy degradation due to the asymmetric alignment mark shape caused by the process, and to be affected by processes such as CMP (for example, a semiconductor forming process). Thus, a high-accuracy and high-throughput alignment method can be realized without increasing costs.

According to the present invention, complicated optimization in the above process is not required.

Further, by exchanging data through the public data line, a database that can be used effectively can be created for the first time, and the error budget can be reconstructed for the first time in consideration of the process factor error (WIS). Thus, it is possible to improve CoO considering the entire lithography.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing a flow of information and a wafer in an offset analyzer using the Internet according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram illustrating a configuration of an offset analyzer using the Internet according to an embodiment of the present invention.

FIG. 3 is a conceptual view of a semiconductor device production system including an exposure apparatus according to one embodiment of the present invention as viewed from a certain angle.

FIG. 4 is a conceptual view of a semiconductor device production system including an exposure apparatus according to one embodiment of the present invention, as viewed from another angle.

FIG. 5 is a diagram showing a specific example of a user interface in a semiconductor device production system including an exposure apparatus according to one embodiment of the present invention.

FIG. 6 is a diagram illustrating a flow of a billing system according to an embodiment of the present invention.

FIG. 7 is a diagram illustrating a flow of a device manufacturing process by an exposure apparatus according to an embodiment of the present invention.

FIG. 8 is a diagram illustrating a wafer process by an exposure apparatus according to one embodiment of the present invention.

FIG. 9 is a diagram showing a conventional example when a rotation error occurs in global alignment.

FIG. 10 is a diagram showing a conventional example when a magnification error occurs in global alignment.

FIG. 11 is a diagram showing data measured on an actual alignment mark by AFM.

FIG. 12 is a diagram showing a structure of an alignment mark called metal CMP.

FIG. 13 is a conceptual diagram showing a wafer and a flow of information when an offset analyzer is arranged.

FIG. 14 is a diagram showing a configuration of an offset analyzer.

[Explanation of symbols]

10, 32: offset analyzer, 11: vendor, 1
2: host computer, 13, 33: coater, 14,
35: stepper (exposure device), 15, 36: developer, 16: overlay measurement tool, 21:
CPU, 31: wafer, 41: chuck, 42: XYZ
Stage, 43: profiler, 44: detection system, 45:
CPU, 46: simulator, 101: vendor's office, 102, 103, 104: manufacturing factory, 105: Internet, 106: manufacturing equipment, 107: factory host management system, 108: vendor host management system, 109: Vendor-side local area network (LAN), 110: operation terminal computer, 111:
Factory Local Area Network (LAN), 20
0: external network, 201: manufacturing apparatus user's manufacturing factory, 202: exposure apparatus, 203: resist processing apparatus
204: film forming apparatus, 205: factory host management system, 206: factory local area network (L
AN), 210: exposure equipment maker, 211: host management system of the business of the exposure equipment maker, 220: resist processing equipment maker, 221: host management system of the business establishment of the resist processing equipment maker, 230: film forming equipment maker,
231: Host management system of the office of the film forming apparatus maker, 401: Model of manufacturing apparatus, 402: Serial number, 403: Subject of trouble, 404: Date of occurrence, 40
5: urgency, 406: symptom, 407: coping method, 408:
Progress, 410, 411, 412: hyperlink function.

Claims (36)

[Claims] 1. A system having an exposure device for transferring a pattern of a first object onto a second object, wherein a configuration of the exposure device includes a detection system for performing relative positioning between the first object and the second object. A mark detection signal obtained by detecting a mark on the second object and shape information obtained by measuring the shape of the mark on the second object by a public data line. , Calculating an offset by simulation at the remote location, transmitting information including the offset to the exposure apparatus via the public data line, and including the offset at the detection system. Based on the information,
An alignment system for an exposure apparatus, wherein the first object is aligned with the second object, and exposure is performed by the exposure apparatus. 2. When calculating an offset by the simulation, an instruction to perform the detection of the plurality of marks under different conditions when necessary from the remote location is communicated via the public data line, and at least under the different conditions, The adjustment system for an exposure apparatus according to claim 1, wherein the mark detection signal obtained by a detection system is sent to the remote place via the public data line. 3. The exposure apparatus according to claim 1, wherein when the shape of the mark on the second object is measured outside the exposure apparatus, a surface shape is measured before and after resist application. Adjustment system. 4. The adjustment system according to claim 3, wherein the surface shape is measured by a three-dimensional shape measuring device at the time of calibration. 5. The adjustment system according to claim 4, wherein the three-dimensional shape measuring device is an atomic force microscope. 6. The adjusting system according to claim 4, wherein the three-dimensional shape measuring device is a stylus type three-dimensional shape measuring device. 7. When the shape of a plurality of marks on the second object is measured before and after resist application outside the exposure apparatus, the pattern of the first object is transferred onto the second object. The first object and the second object of the exposure apparatus;
The exposure apparatus according to any one of claims 1 to 6, wherein an offset when adjusted so as to match a signal of a detection system that performs relative alignment with an object is used in the exposure apparatus. Adjustment system. 8. The light 3 calibrated by a non-exposure light three-dimensional shape measurement system outside the exposure apparatus.
4. The measurement according to claim 3, wherein the measurement is performed by dimension measurement.
An adjustment system for an exposure apparatus according to any one of claims 4 and 7. 9. The adjustment system for an exposure apparatus according to claim 1, wherein a database of information including apparatus error information is created at the remote place. 10. An alignment system for an exposure apparatus according to claim 1, wherein when the plurality of second objects are aligned, the first second object is first aligned. An alignment apparatus, comprising: measuring an offset when matching an object with a signal of a detection system that performs relative alignment between the object and the second object; and using the same offset for the second and subsequent objects. 11. When measuring the shapes of a plurality of marks on a second object outside the exposure apparatus in the adjustment system of the exposure apparatus according to claim 1, the surface is before and after resist application. A method for adjusting an exposure apparatus, comprising measuring a shape. 12. The method according to claim 11, wherein the surface shape is measured by a three-dimensional shape measuring device at the time of calibration. 13. The method according to claim 12, wherein the three-dimensional shape measuring device is an atomic force microscope. 14. The method according to claim 12, wherein the three-dimensional shape measuring device is a stylus type three-dimensional shape measuring device. 15. When the surface shapes of a plurality of marks on the second object are measured before and after resist application outside the exposure apparatus, the pattern of the first object is changed to the second shape.
An offset used when matching the signal of a detection system that performs relative positioning between the first object and the second object of the exposure apparatus to be transferred onto an object is used in the exposure apparatus. The method for adjusting an exposure apparatus according to any one of claims 11 to 14. 16. The apparatus according to claim 1, wherein the surface shape is measured outside the exposure apparatus by three-dimensional optical measurement calibrated by a three-dimensional shape measurement system using non-exposure light.
16. The method for adjusting an exposure apparatus according to any one of 1 to 15. 17. The adjusting system for an exposure apparatus according to claim 1, wherein when aligning a plurality of the second objects, the first object is the first one of the second objects. Measuring an offset when the signal is adjusted to match a signal of a detection system that performs relative positioning between the second object and the second object, and using the same offset for the second and subsequent second objects. Alignment method. 18. An information processing apparatus for calculating offset information or offset correction information generated in an exposure apparatus for transferring a pattern of a first object onto a second object, the information processing apparatus comprising: Means for acquiring the shape information of the mark and the detection information of the mark by the exposure apparatus from a remote place via a public data line; and the exposure apparatus based on the acquired shape information and the detection information. An information processing apparatus comprising: means for calculating the offset to be generated; and means for transmitting the offset information or the offset correction information to the remote exposure apparatus via the public data line. . 19. An offset correction process for a plurality of remotely located exposure apparatuses based on the information from the information processing apparatus according to claim 18.
Aligning the object with the second object,
An exposure system for transferring a pattern onto an object. 20. A device manufacturing method, wherein a device is manufactured by transferring a pattern onto the second object using the exposure system according to claim 19. 21. A device manufacturing method, wherein the device is manufactured using the adjustment system for an exposure apparatus according to claim 1. Description: 22. When exposing a pattern of an original onto a substrate,
An exposure apparatus for performing relative positioning between the original and the substrate by a positioning apparatus, wherein the positioning apparatus according to claim 10 is used as the positioning apparatus. 23. The exposure apparatus according to claim 22, wherein: a display; a network interface;
An exposure apparatus further comprising a computer that executes network software, wherein maintenance information of the exposure apparatus can be data-communicated via a computer network. 24. The network software,
Provided on the display is a user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed, and from the database via the external network. The exposure apparatus according to claim 23, wherein information can be obtained. 25. A step of installing a group of manufacturing apparatuses for various processes including the exposure apparatus according to claim 22 in a manufacturing factory, and a device using the group of manufacturing apparatuses by a plurality of processes. A method of manufacturing a device. 26. A step of connecting the group of manufacturing apparatuses via a local area network, and a step of connecting between the local area network and an external network outside the manufacturing plant.
Data communication of information on at least one of the manufacturing apparatus groups.
6. The device manufacturing method according to 5. 27. Access to a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or to establish a connection with a manufacturing factory different from the manufacturing factory. 27. The device manufacturing method according to claim 26, wherein production control is performed by performing data communication between the devices via the external network. 28. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 22, a local area network connecting the manufacturing apparatus group,
A semiconductor manufacturing plant, comprising: a gateway for allowing access from the local area network to an external network outside the plant; and enabling data communication of information on at least one of the manufacturing equipment groups. 29. The maintenance method of an exposure apparatus according to claim 22, wherein a vendor or a user of the exposure apparatus installed in a manufacturing factory connects to an external network of the manufacturing factory. Providing the maintained maintenance database, allowing access to the maintenance database from within the manufacturing plant via the external network, and manufacturing the maintenance information stored in the maintenance database via the external network. And transmitting to the factory. 30. A method for adjusting a plurality of exposure apparatuses for transferring a pattern of a first object onto a second object, the shape information of a mark on the second object to be used in each exposure apparatus, and the mark information of the mark. Transmitting the detection information by the corresponding exposure apparatus, via the public data line only to the supply destination of each exposure apparatus, and offset information or offset transmitted from the respective supply destination via the public data line Transmitting the correction information to the corresponding exposure apparatus. 31. A device manufacturing method, wherein a device is manufactured using the exposure apparatus adjusted by the exposure apparatus adjustment method according to claim 30. 32. A method for supplying adjustment information of an exposure apparatus for transferring a pattern of a first object onto a second object, the method comprising: aligning the first object with the second object of the exposure apparatus. Through a public data line, a mark detection signal obtained by detecting a mark on the second object and shape information obtained by measuring the surface shape of the mark on the second object are detected by a detection system. Receiving from a remote location, and creating a database from the data received at the remote location,
An arithmetic step of calculating an offset of the exposure apparatus using the database, and an offset transmission step of transmitting information including the offset to the exposure apparatus via the public data line, the information including the offset The position of the first object and the position of the second object are adjusted by the detection system on the basis of the offset, and the accounting of the user of the exposure apparatus is calculated along with the offset transmitting step. Adjustment information supply method. 33. The adjustment information according to claim 32, further comprising a step of obtaining information on the number of times of data acquisition in the receiving step, wherein the accounting calculation is performed in consideration of the information on the number of times of data acquisition. Supply method. 34. The adjustment information supply method according to claim 32, wherein the receiving step is performed for a plurality of remote locations. 35. The apparatus according to claim 32, wherein the shape information is information obtained by measuring the surface shape of the mark before and after resist application outside the exposure apparatus.
35. The adjustment information supply method according to any one of 34. 36. A computer device having software for executing the adjustment information supply method according to claim 32.