JP2002043738A - Soldering apparatus and production system provided with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering method, a soldering apparatus, and a production system, which allow a plurality of soldering spots on a substrate to be efficiently soldered, and also enhance quality of soldering and reduce cost of soldering without causing interference of the soldering spots with parts. SOLUTION: A soldering robot solders a soldering spot adjacent to a solder feeding surface of an iron tip 31 mounted on an iron component 32 with the iron tip heated 31, where solder feeding surfaces 310A, 310B are two exposed sides formed on the iron tip 31, respectively, which are along a relative movement direction of the iron tip 31 to the substrate. A thread solder 40 is fed to each of the solder feeding surfaces 310A, 310B of the iron tip 31 from needle components 35A, 35B of solder feeding heads 34A, 34B, respectively. The thread solder 40 may be selectively fed to either of the solder feeding surfaces 310A, 310B according to information about the soldering spots.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method for soldering an object to be soldered, such as a substrate, on which components such as electronic components and connectors are mounted, a device therefor, and a production system using the device. More particularly, the present invention relates to a soldering method and a device capable of efficiently performing soldering to a plurality of soldering points on a soldering target object with a single iron tip, a device therefor, and a production system using the device. is there.

[0002]

2. Description of the Related Art Conventionally, as this type of soldering device,
An automatic soldering device (soldering robot) including a soldering iron member having one solder supply surface on a soldering tip, and solder supply means for supplying thread-like solder from one direction to the soldering surface of the soldering tip. Is known. In this apparatus, when the iron tip of the soldering iron member is heated and the solder is supplied to the solder supply surface of the iron tip by the solder supply means, the solder melts and flows down on the solder supply surface. The molten solder that has flowed down reaches the soldering point adjacent to the solder supply surface,
The soldering location can be soldered. Further, when soldering is performed on a plurality of soldering points arranged in a straight line on a soldering object using this apparatus, the soldering iron member of the soldering iron member is connected to the soldering points. , The plurality of soldering locations can be continuously soldered.

[0003]

However, when a plurality of soldering points arranged in a plurality of rows are soldered by the above-mentioned conventional soldering apparatus, the soldering iron member is arranged along the soldering points. It had to be moved multiple times. For example, when the above-mentioned soldering portions are arranged in two rows, it is necessary to move the distance in which the soldering portions are arranged twice. If the soldering iron member does not support reciprocation, that is, if the soldering iron member is configured to be able to be soldered only when it is moving in one direction, the distance at which the soldering portions are arranged is 4 Will be moved twice. As described above, it is necessary to move the soldering iron member by at least the number of rows of the soldering locations, and it has been difficult to improve the efficiency of the soldering process.

[0004] Assuming that two rows of soldering points can be soldered by a single movement of the soldering iron member, a portal iron tip formed so as to surround the two rows of soldering points is used. Are known. FIG. 11 is a partial sectional view showing an example of a gate-shaped iron tip. This portal iron tip 500
Is formed so as to sandwich the soldering location where the two rows of leads 201 protrude on the component-mounted board 200, which is the soldering target, between the two legs 500a and 500b. The legs 500a of the iron tip 500,
The molten solder is supplied through a solder supply path 500d in the iron tip 500 to the solder reservoir 500c, which is a groove-shaped space between 500b. Then, in a state where the molten solder 40 'is filled in the solder reservoir 500c,
By moving the iron tip 500 in the column direction of the leads 201, the molten solder 40 'is brought into contact with the two rows of soldering locations where the leads 201 protrude one after another, and the two rows of soldering locations are soldered. can do.

[0005] However, since the gate-shaped iron tip has a shape in which the soldering portion is sandwiched between the two legs, the surface for soldering is used as in the case of a double-sided mounting board in which components are mounted on both sides. If the soldering point and the component are adjacent to each other on the side, the leg of the ironing tip and the component interfere with each other, so that the ironing tip cannot be moved and the soldering point may not be soldered. . In addition, when the above-mentioned gate-shaped iron tip is used, there is a possibility that a soldering defect may occur due to soldering more than necessary at a soldering location or soldering at an unnecessary location. there were. This soldering failure is particularly problematic when attempting to perform a single-row soldering location with a portal-type iron tip with the above-mentioned spacing between the legs set for two rows of soldering locations. In addition, since the above-mentioned gate-shaped iron tip is used by filling the solder reservoir with solder, wasteful solder consumption occurs, and complicated processing of the groove-shaped solder reservoir and the solder supply path is required. Since the manufacturing cost is high, it has been difficult to reduce the cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to solder a plurality of soldering locations as compared to a case where solder is supplied from one direction to one solder supply surface of a soldering iron tip. It is possible to efficiently perform the soldering, and unlike the case of using the conventional gate-shaped iron tip, even when the component is adjacent to the soldering location, the component and the soldering location do not interfere with each other. An object of the present invention is to provide a soldering method and an apparatus thereof capable of performing high-quality and low-cost soldering, and a production system using the apparatus.

[0007]

To achieve the above object, according to the first aspect of the present invention, a soldering iron tip of a soldering iron member is heated and solder is supplied to a solder supply surface of the soldering iron tip. A soldering method for soldering a soldering portion adjacent to the solder supply surface, wherein each of the two exposed side surfaces extending along a direction of relative movement of the soldering tip with respect to an object to be soldered as the soldering tip; A soldering surface corresponding to each solder supply surface by supplying solder to each of the solder supply surfaces of the iron tip using a solder supply surface. It is.

According to the first aspect of the present invention, the solder is supplied to each of the solder supply surfaces in a state where the two solder supply surfaces of the heated iron tip of the soldering iron member are respectively adjacent to the soldering locations. Melting the solder on the solder supply surface. The molten solder on each solder supply surface flows down along the solder supply surface and reaches two solder supply positions corresponding to each solder supply surface, whereby the two soldering positions are soldered. You. Further, since the two solder supply surfaces are formed on the two exposed side surfaces extending along the direction of relative movement of the iron tip to the soldering target, the above-described gate for sandwiching the soldering location is provided. Unlike the case of the iron tip of the mold, it is possible to make the solder supply surface on the exposed side surface of the iron tip adjacent to the soldering point with the soldering point exposed. Therefore, even when a component is attached near the soldering point, the iron tip can be made to be adjacent to the soldering point from the side opposite to the component, so that the iron tip and the The soldered portion can be soldered without causing interference with parts. Also, since an appropriate amount of solder can be supplied to the solder supply surface of the iron tip and soldering can be performed, unlike the case where a conventional portal iron tip is used, more solder than necessary is required at the soldering location. There is no sticking or soldering on unnecessary parts. Accordingly, high-quality soldering can be performed, and unnecessary solder consumption is reduced. Further, since a relatively simple iron tip having a solder supply surface formed on each of the two exposed side surfaces facing outward is used, complicated processing such as the groove-shaped solder reservoir and the solder supply path is performed. The manufacturing cost of the iron tip is lower than that of a conventional gate-type iron tip that requires the following.

According to a second aspect of the present invention, there is provided a soldering iron member having an iron tip having a solder supply surface formed thereon, a heating means for heating the iron tip, and supplying solder to the solder supply surface of the iron tip. A soldering device provided with solder supply means, wherein the iron tip has a solder supply surface on each of two exposed side surfaces extending along the direction of relative movement of the iron tip with respect to the soldering target. The solder supply means is configured to be capable of supplying solder to each of the solder supply surfaces of the iron tip.

[0010] In the soldering apparatus according to the second aspect, the iron tip of the soldering iron member is heated by the heating means. With the heated iron tip adjacent to the soldering point, solder is supplied to each solder supply surface of the iron tip by the solder supply means, and the solder is melted on the solder supply surface.
The molten solder on each of the solder supply surfaces flows down along the solder supply surfaces and reaches a plurality of solder supply points corresponding to the respective solder supply surfaces, whereby the plurality of soldering positions are soldered. You. Further, since the two solder supply surfaces are formed on the two exposed side surfaces extending along the direction of the relative movement of the iron tip to the soldering target, as described above, the soldering is performed. Even when a component is attached near the location, the soldering location can be soldered without causing the iron tip to interfere with the component. Further, as described above, high-quality soldering can be performed, wasteful solder consumption is reduced, and the manufacturing cost of the iron tip is reduced.

According to a third aspect of the present invention, in the soldering apparatus according to the second aspect, the width of the iron tip is greater than a distance between the projecting members projecting from the surface of the soldering object so as to face each solder supply surface. Is also characterized by being narrow.

According to the third aspect of the present invention, since the width of the iron tip is smaller than the interval between the protruding members at the soldering point, the iron tip can be reliably inserted between the protruding members. Accordingly, each of the soldering portions can be securely connected in a state where each solder supply surface of the iron tip is securely opposed to the soldering portion where each of the protruding members protrudes without interference between the protruding member and the iron tip. Can be soldered.

According to a fourth aspect of the present invention, there is provided the soldering device of the second aspect, wherein the soldering device has a plurality of iron tips of different types, and is provided with an iron tip switching means for switching the iron tips for use in soldering. It is a feature.

In the soldering apparatus according to the fourth aspect, since a plurality of types of iron tips can be switched by the iron tip switching means and used for soldering, an iron tip is selected according to the type of the soldering location and the iron member is selected. Soldering suitable for each soldering location can be performed without performing the replacement work of the soldering iron tip to attach.

According to a fifth aspect of the present invention, in the soldering device of the fourth aspect, the widths of the plurality of iron tips are different from each other.

In the soldering apparatus according to the fifth aspect, even when there is a soldering point on the object to be soldered where the interval between the protruding members is different, an iron tip having a width smaller than the interval between the protruding members is selected. By moving the iron tip along the row of the protruding members, a plurality of soldering locations corresponding to the respective solder supply surfaces of the iron tip can be collectively soldered.

According to a sixth aspect of the present invention, in the soldering apparatus of the second, third, fourth, or fifth aspect, the solder supply means comprises:
It is characterized in that the solder is selectively supplied to each solder supply surface of the iron tip.

In the soldering apparatus according to the sixth aspect, the solder can be selectively supplied to each solder supply surface of the iron tip by the solder supply means, so that the presence or absence of a soldering position corresponding to each solder supply surface is determined. It becomes possible to supply solder accordingly.

According to a seventh aspect of the present invention, in the soldering apparatus according to the sixth aspect, a storage means for storing information on a soldering location on the soldering object, and the soldering object and the soldering iron. A relative position changing means for changing a relative positional relationship between the member and the soldering object and the soldering iron member based on information on the soldering location stored in the storage means; Control means for controlling the relative position varying means so as to change the relative positional relationship between the soldering means and control means for controlling the solder supply means so as to switch the solder supply to each solder supply surface of the iron tip. It is characterized by having been provided.
Here, the relative positional relationship between the soldering object and the soldering iron member is a positional relationship representing a linear distance between the soldering object and the soldering iron member. Not only that, but also includes a rotational positional relationship indicating a relative rotational angle between the two. Further, the relative position changing means for changing the relative positional relationship includes means for moving or rotating at least one of the soldering object and the soldering iron member.

In the soldering device according to the present invention, information on a soldering position on the soldering object is stored in the storage means in advance. Then, based on the information on the soldering location stored in the storage means, the position of the soldering location on the soldering target is determined by the control means, and the soldering iron tip of the soldering iron member is used to determine the soldering tip. The relative position varying means is controlled to be adjacent to the location. Further, based on the above information, before starting the soldering operation, the control means determines which solder supply surface of the soldering tip of the soldering iron member corresponds to the soldering location. By controlling the solder supply means by the control means based on the determination result, the solder supply to each solder supply surface of the iron tip is switched. By switching the solder supply to each solder supply surface in this way, depending on whether there is a soldering location corresponding to each solder supply surface,
The solder is automatically supplied only to the solder supply surface corresponding to the soldering location.

According to an eighth aspect of the present invention, in the soldering apparatus according to the seventh aspect, the relative position varying means and the solder supply means are controlled so that each solder supply surface of the iron tip is used evenly. It is a feature.

In the soldering apparatus according to the eighth aspect, by using the two solder supply surfaces of the iron tip equally, only one solder supply surface is prevented from being deteriorated early.
The life of the iron tip as a whole can be extended. In addition, when a plurality of solder housing sections accommodating the solder to be supplied to each solder supply surface of the soldering iron tip are provided, the amount of solder used in each solder housing section becomes equal, so that the solder is supplied to the solder housing section. The frequency of work can be reduced.

According to a ninth aspect of the present invention, in the soldering apparatus of the seventh aspect, the solder supply means is constituted by using a plurality of solder guide members for guiding and supplying solder to each solder supply surface of the iron tip. And each solder guide member,
Solder guide member driving means for moving between a solder supply position close to the solder supply surface and a retreat position retracted upward away from the solder supply surface so that solder can be supplied to the corresponding solder supply surface is provided. And controlling the solder guide member driving means based on the information on the soldering location.

In the soldering apparatus according to the ninth aspect, it is determined on the basis of the information on the soldering location which soldering surface of the soldering tip the soldering location corresponds to.
Here, when soldering the soldering portions corresponding to both solder supply surfaces of the iron tip, each solder guide member is moved to the solder supply position, and the solder is supplied to each solder supply surface. On the other hand, when soldering only the soldering portion corresponding to one solder supply surface of the iron tip, only the solder guide member corresponding to the one solder supply surface is moved to the solder supply position. Then, the solder guide member corresponding to the other solder supply surface is moved to a retracted position away from the solder supply surface, and the component mounted near the soldering point on the soldering target object and the solder guide member are Avoid interference.

According to a tenth aspect of the present invention, in the soldering device of the seventh aspect, the moving distance at each soldering point and the moving distance between each soldering point are minimized based on the information on the soldering points. Preferably, the relative position changing means and the solder supply means are controlled.

According to a tenth aspect of the present invention, the moving distance at each soldering point and the moving distance between each soldering point are minimized on the basis of the information on the soldering points, so that each soldering object is To reduce the time required for soldering.

According to an eleventh aspect of the present invention, in the soldering apparatus of the seventh aspect, two solder accommodation portions accommodating the solder supplied by the solder supply means on each of the solder supply surfaces of the iron tip. Control means for selecting and executing a double-sided soldering mode in which soldering can be performed using the solder supply surface of the above and a single-sided soldering mode in which soldering is performed using only one of the two solder supply surfaces. It is characterized by having.

In the soldering apparatus according to the eleventh aspect, when soldering is performed in a state where the solder of each solder accommodating portion is present, the two-sided soldering mode is selected and executed, so that the two solder supply surfaces can be formed. Solder using both. On the other hand, when one of the solders in the solder container runs out, the one-sided soldering mode is selected and executed.

According to a twelfth aspect of the present invention, there is provided a soldering device for soldering to a soldering object on which components are mounted, and an inspection device for inspecting the soldering object soldered by the soldering device. In the production system for an object to be soldered, as the soldering device,
Characterized by using any one of the soldering devices of (1) to (11).

In the substrate production system according to the twelfth aspect, the use of the above-mentioned soldering device makes it possible to achieve higher quality than in the case of the conventional flow soldering method using a solder tank or the case of performing manual soldering. Can be soldered,
Variations in soldering quality on each soldering object are also reduced. Therefore, it is possible to shorten the time required to inspect the soldered object after the soldering. Also,
Unlike the flow soldering method using a conventional solder bath or the case of manual soldering, the adjustment of the soldering speed allows the process of mounting components to the soldering object and the inspection process after soldering. Since the tact adjustment can be easily performed, the production system for the soldering object can be easily inlined. Furthermore, compared to the case of the flow soldering method using a conventional solder tank or the case of performing manual soldering, the work space for performing the soldering process using the above-described soldering device can be reduced, so that it is relatively difficult. Since the soldering device and the inspection device can be arranged side by side in a narrow space, it is easy to centralize a system combining the soldering device and the inspection device. In particular, when using a soldering apparatus having solder supply means configured to selectively supply solder to a plurality of solder supply surfaces of the iron tip, the portal iron tip is used. Unlike the case, a single soldering device enables high-quality soldering of a wide variety of soldering objects, and facilitates integration of the soldering devices.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a soldering robot as a soldering device will be described below. This soldering robot automatically solders a board (PCB) as an object to be soldered. FIG. 2 is a front view showing a schematic configuration of the soldering robot according to the present embodiment. This soldering robot has an apparatus main body 10 having a worktable 101 at the top.
0, stand members 102 and 103 attached to both sides of the apparatus body 100, and the stand members 102 and 1
An X-axis guide member 104 attached to the upper portion of the support member 03 so as to bridge between the two stand members; and a soldering member attached to the X-axis guide member 104 so as to be movable in the X-axis direction (left-right direction in the drawing). And a unit 10.

At the center of the worktable 101, two guide rails 10 extending in the Y-axis direction (the front-back direction in the drawing) are provided.
5 and 106 are formed, and movable brackets 107 and 108 are attached along the guide rail so as to be movable in the Y-axis direction. A work table 109 is mounted on the movable brackets 107 and 108, and a board 200 as an object to be soldered is mounted on the work table 109 via board support stands 110 and 111. The driving of the movable brackets 107 and 108 in the Y-axis direction is controlled by a control unit, which will be described later, based on information on a soldering location on the board. The data of the information on the soldering location on the board is acquired in a data capturing operation (teaching operation) performed in advance, and together with data such as various parameters at the time of soldering, the memory card 113 inserted into the memory card slot 112. Is stored.

The soldering unit 10 includes a unit main body 11, a pair of solder supply subunits 20A and 20B attached to both sides of the unit main body 11, and an elevating slide shaft 12 extending downward from the unit main body 11.
And a soldering head 30 attached via a relay member 13, a swing arm 14, and the like. A movable bracket (not shown) is provided on the back side of the unit body 11, and the movable bracket is guided by a guide rail (not shown) formed on the X-axis guide member 104 side, so that the soldering unit 10 is mounted. It can be moved in the X-axis direction.

The elevating slide shaft 12 extending downward from the unit main body 10 is drive-controlled so as to move in the Z-axis direction (vertical direction in the drawing), and is rotated about the center axis in the Z-axis direction. It can be driven to rotate. The relay member 13 connected to the elevating slide shaft 12 has a soldering tip at the tip of the soldering head 30 so that the iron tip can be pressed against the substrate 200 with a predetermined pressure.
An air pressure mechanism (not shown) is incorporated. Further, the swing arm 14 connected to the relay member 13 is configured so that the soldering head 30 can be fixed by being inclined at a predetermined angle.

The soldering head 30 has a built-in heater as a heating means and has a flat iron tip 31 at a tip end thereof (hereinafter referred to as "iron member") 32, and the iron member. A pair of solder supply heads 34A and 34B fixed by fixed arm members 33A and 33B are provided on both sides of 32. At the tips of the soldering heads 34A and 34B on the iron tip 31 side, needle members 35A and 35B having a hollow structure through which thread-like solder can pass are provided as solder guide members. Also,
The solder supply heads 34A, 34B are connected to the solder supply tubes 21A, 21B from the solder supply sub-units 20A, 20B, which can control solder supply independently.
Is supplied through the thread.

The solder supply heads 34A, 34
B, the thread-like solder 40 is attached to the needle members 35A and 35A.
A heater is provided as preheating means for preliminarily heating before discharging from 5B. By preliminarily heating in this way, a sharp rise in the temperature of the flux is suppressed,
Solder balls and flux scattering can be prevented.

The solder supply subunits 20A and 20A
B includes solder supply devices 23A and 23B each having a pair of delivery rollers 22A and 22B and a motor (not shown), and solder reels 24A and 24B as solder housing portions around which a predetermined amount of thread-like solder 40 is wound. The delivery roller pair 22A and 22B rotate while pinching the thread-like solder 40, thereby connecting the solder 40 to the solder supply tube 2.
1A and 21B, and one of the pair of rollers is a driving roller driven by a motor, and the other roller is a driven roller. The distance between the rollers is adjusted so as to clamp the thread solder 40 at a predetermined pressure. The drive roller sends the thread solder 40 at a predetermined speed and selectively turns on / off the thread solder.
The rotation is controlled so that it can be turned off. The solder supply subunits 20A and 20B and the solder supply tube 2
1A, 21B and the solder supply heads 34A, 34B
Thus, solder supply means for supplying solder to the iron tip 31 of the iron member 32 is configured. In addition, the solder supply devices 23A and 23B may be provided with a sensor for detecting solder breakage, a sensor for detecting solder clogging, and the like, as appropriate. Further, the solder supply devices 23A, 23B
Is not limited to the one using the delivery roller pair 22A, 22B, but may be configured to deliver the thread solder by another mechanism.

FIGS. 1 and 3 are an enlarged front view and an enlarged side view of the tip of the iron member 32, respectively. The iron tip 31 of the iron member 32 is formed in a flat plate shape, and has solder supply surfaces 310A and 310B on two outwardly exposed side surfaces extending along the direction of movement of the iron tip relative to the substrate 200, respectively. . The distal ends of the needle members 35A, 35B of the solder supply heads 34A, 34B are arranged so as to be close to and opposed to the solder supply surfaces 310A, 310B, respectively. The thread-like solder 40 ′ discharged from the tips of the needle members 35 A, 35 B comes into contact with the solder supply surfaces 310 A, 310 B of the iron tip 31, melts, and flows down by gravity along the respective solder supply surfaces, so that the solder on the substrate 200. Is supplied so as to cover the lead 201, which is a protruding member protruding from the soldered portion of FIG. Further, as shown in FIG. 3, the tip end surface of the iron tip 31 is machined into a surface inclined at a predetermined angle with respect to the center axis of the iron member 32.
Even when the iron member 32 is moved while being tilted, the front end surface of the iron tip 31 and the surface of the substrate 200 are substantially parallel to each other so that they can be surely in contact with each other. By tilting the iron member 32 in this manner, the iron member 32 can be smoothly moved on the substrate 200 and the iron member 3
2 can also reduce the driving load.

Further, as shown in FIG.
Is set to be smaller than the interval W2 between the leads 201, which is the interval between the solder supply points. By setting the width W1 of the iron tip 31 in this manner, the iron tip 3 can be prevented from interfering with the iron tip 31 and the lead 201.
The solder 20 ′ melted on the solder supply surface of No. 1 is connected to the lead 20.
1 can be reliably flowed down, and the soldering location can be reliably soldered. In this embodiment, the iron tip 3
Two solder supply surfaces 310A, 31 on one exposed side
0B, the solder is melted, and the solder supply surfaces 310A and 310A are melted.
Since it flows down onto the lead 201 located outside B, even if there is a component 202 near the lead 201 like a double-sided mounting board, the component 202 does not interfere with the iron tip 31. In addition, the soldering portion can be securely soldered (see FIG. 4). In addition, iron tip 3
1 does not come into contact with the component 202, so that damage to the component 202 can be avoided.

As shown in FIG. 5, the iron member 32 is provided with a heating gas blowing means for emitting a heating gas F from the iron tip holding portion side of the iron tip 31 toward the tip end portion and spraying the heated gas F to the soldering point. May be provided. By blowing the heated gas F, the soldering location where the iron tip 31 and the lead 201 are located is preheated, and the temperature of the iron tip 31 is prevented from lowering.
Thereby, the moving speed of the iron tip 31 can be increased, and the tact of the soldering process can be reduced.

FIG. 6 is a block diagram showing a main part of a control system of the soldering robot. The control unit 300 as a control unit is configured using a CPU, a RAM, a ROM, an I / O interface, and the like. This control unit 30
0 is a memory card drive device 30 for writing and reading data to and from the memory card 113.
1, and various motor drive circuits 302A, 302B, 30
3 to 305 are connected. The various motor drive circuits 302A, 302B, 303 to 305, motors connected to the respective circuits, movable brackets driven by the respective motors, guide rails for guiding the movable brackets, etc., allow the board 200 and the iron member 32 to move between the board 200 and the iron member 32. Relative position changing means for changing the relative positional relationship (linear distance and rotation angle) of the above.

As described above, data on the soldering location of the board 200 to be soldered and data on various parameters (such as the amount of thread-like solder discharged and the moving speed of the ironing member) during soldering are stored in the memory card 113. It is remembered. The data in the memory card 113 is taken into the control unit 300 via the memory card drive 301. A command signal for each motor drive unit is generated and transmitted based on the data. Based on the command signal, each motor drive unit controls the corresponding pulse motor 3
06A, 306B, and 307 to 309 are rotationally driven. It should be noted that the data and the like relating to the soldering location may be stored in another storage medium such as a floppy (registered trademark) disk or a hard disk for use. Also,
The configuration may be such that data relating to the soldering location and the like are taken in from an external device such as a personal computer connected to the device main body 100.

FIG. 7 is an explanatory diagram when a plurality of soldering portions arranged in four rows on the substrate 200 are soldered by using the soldering robot having the above configuration. First, the substrate 200 is placed on the substrate support stand 110 on the work table 109.
Is set. Next, by controlling the position of the work table 109 in the Y-axis direction, the rotation angle of the soldering head 30, and the position of the soldering unit 10 in the X-axis direction,
As shown in FIG. 7, the iron tip 31 is positioned at the point P1 on the substrate 200. Next, the soldering head 30 is moved downward in the Z-axis to bring the iron tip 31 into contact with the substrate 200, and the work table 109 is moved toward the Y-axis to move the iron tip 31 relative to the substrate 200. Solder is supplied to both solder supply surfaces of the iron tip 31 while being moved, and soldering is performed on two rows of soldering points 211 and 212 located on both sides of the iron tip 31. And
When the iron tip 31 has relatively moved to the point P2 in FIG. 6, the supply of solder to the iron tip 31 is stopped, and the soldering head 30 is moved upward in the Z-axis.

Next, the soldering unit 10 is moved to the left on the X-axis, and the work table 109 is moved to the far side on the Y-axis, so that the iron tip 31 is located at the point P3 in FIG. Then, as described above, the iron tip 3
1 is brought into contact with the substrate 200, and the work table 109 is moved to the near side of the Y-axis, so that soldering is performed on two rows of soldering points 213 and 214 located on both sides of the ironing tip 31. Then, when the iron tip 31 has relatively moved to the point P4 in FIG. 7, the supply of solder to the iron tip 31 is stopped, and the soldering head 30 is moved upward in the Z-axis. Thus, a series of soldering is completed.

When soldering is to be performed on soldering locations (lead insertion locations) in odd rows such as three rows,
For the last row, control is performed so that solder is supplied only to the solder supply surface corresponding to the soldering location. Thereby, useless supply of solder can be avoided. When performing the point soldering to one soldering point by the soldering robot of the present embodiment, the iron tip 31 is adjacent to the soldering point.
The work table 109, the soldering head 30, and the soldering unit 10 are drive-controlled. Then, by controlling the on / off of the rotation of the delivery roller pair 22A, 22B so as to supply the solder only to the solder supply surface facing the soldering location,
The soldering location is soldered.

The iron tip 31 and the work table 1
In step 09, it is preferable to control the moving distance of the iron tip 31 and the work table 109 from the start of the soldering to the end of the soldering to the work table 109 based on the data on the soldering position of the board so as to be the shortest distance. By performing such control, the time for soldering to each substrate 200 can be shortened. When switching from using both sides of the iron tip 31 to using one side, such as when soldering two rows of leads after soldering one row of leads, the solder supply surface that has not been used is placed on the solder supply surface that has not been used. When starting supply, increase the number of rotations of the delivery roller pair of the corresponding solder supply subunit,
It is preferable to supply a relatively large amount of solder. In this case, the used solder supply surface can be wetted with an appropriate amount of solder, and the soldering can be reliably performed from the first part of the two rows of leads. Further, it is preferable that after the iron tip 31 is moved to a soldering start position of a series of soldering locations, immediately before the solder tip is brought into contact with the substrate, the rotation of the delivery roller pair of the solder supply subunit is started. In this case, it is possible to reliably perform soldering from a soldering start position of a series of soldering locations while preventing wasteful consumption of solder.

As described above, according to the present embodiment, the iron member 32
Soldering surfaces 310A and 310B of the iron tip 31 of FIG.
And the molten solder 40 'can reach two rows of solder supply points facing each solder supply surface. Therefore, compared to the case where solder is supplied from one direction to one solder supply surface of a conventional iron tip,
The soldering of the two rows of solder supply points can be performed more efficiently. In addition, by switching the solder supply to the solder supply surfaces 310A and 310B of the iron tip 31, not only two rows of soldering points but also one
Since soldering can be performed at a row or at one point of soldering, a single soldering robot can handle a wide variety of substrates and can also avoid wasteful solder consumption.

Furthermore, compared to the conventional flow soldering method using a solder bath or manual soldering, high quality soldering is possible, and the variation in soldering quality on each substrate 200 is improved. Is also smaller.

In the above embodiment, the soldering head 30 may be provided with a plurality of iron tips having different widths, and iron tip switching means for switching the iron tips used for soldering. FIG. 8 is an explanatory diagram showing an example of the configuration of the iron tip switching means. In this configuration example, two soldering heads 30A and 30B each having an iron tip are provided, and each of the soldering heads 30A and 30B is placed at a soldering position P5.
And the retreat position P6A, P6B, the iron tip is switched. Each soldering head 3
Reference numerals 0A and 30B denote ironing members 32A and 32A each having a built-in heater to which a current is supplied via power cables 36A and 36B.
Iron tips 31A and 31B having different widths are attached to each of 32B. Then, the iron members 32A, 32B
Are held by holding members 37A and 37B, and the end of each holding member is movable in the Y-shaped guide groove 15a of the guide member 15. Each of the holding members 37A, 37B is moved between a soldering position P5 and a retracted position P6A, P6B by a drive mechanism (not shown). In the case where the iron tip switching means for switching a plurality of iron tips having different widths is provided, even if there are soldering portions on the substrate 200 where the row intervals of the leads 201 are different, the lead 201
Can be appropriately selected and moved to the soldering position P5 of the guide member 15 described above. Then, by moving the iron tip 31 along the rows of the leads 201, the soldering locations where the two rows of leads protrude corresponding to the respective solder supply surfaces of the iron tip can be collectively soldered. In the configuration example of FIG. 8, the soldering heads 30A and 30B are configured to be switched individually. However, the configuration may be such that only the iron tip is switched by a rotary mechanism or the like.

In the above embodiment, the solder supply heads 34A and 34B are provided with the respective needle members 35A and 35B as solder guide members from the solder supply position close to the solder supply surface of the iron tip 31 and from the solder supply surface. Needle member driving means (solder guide member driving means) may be provided for moving between a retracted position retracted upward and away. FIG. 9 is an explanatory diagram showing one configuration example of the solder supply heads 34A and 34B provided with the needle member driving means. The head main bodies 340A and 340B of the solder supply heads 34A and 34B are respectively provided with arm members 330.
A, 330B, 331A, 331B and an air-type cylinder member as an advance / retreat drive mechanism are attached to the iron member 32. Each of the cylinder members includes a cylinder body 341A, 341B, and rods 342A, 342B that can move forward and backward from the cylinder body. Then, the cylinder bodies 341A, 341B and the iron member 32 are connected by arm members 330A, 330B, and the distal ends of the rods 342A, 342B and the head bodies 340A, 340B are connected to the arm members 331A, 331.
31B. Each cylinder body 341
A and 341B are supplied with air at predetermined timings via air tubes 343A and 343B. When the rods 342A, 342B move so as to protrude from the cylinder body by the supply of the air, the needle members 35A, 35B move to the solder supply positions P7A, P7B.
Go to On the other hand, when the air supply to the cylinder body is released and the rods 342A, 342B move back into the cylinder body, the needle members 35A, 35B move to the retreat positions P8A, P8B. The solid line in FIG. 9 indicates that the left needle member 35A is at the solder supply position P7A.
And the right needle member 35B is in the retracted position P8B. Here, when soldering using both the solder supply surfaces 310A and 310B of the iron tip 31, the respective needle members 35A and 35B are moved to the solder supply positions P7A and P7B to supply the solder to the respective solder supply surfaces. . On the other hand, as shown by the solid line in FIG. 9, when soldering is performed using only one solder supply surface 310A of the iron tip 31, only the needle member 35A corresponding to the solder supply surface 310A is moved to the solder supply position P7A. Then, the needle member 35B corresponding to the solder supply surface 310B not used for soldering is moved to the retreat position P8B away from the solder supply surface. This needle member 35B
, The interference between the component mounted near the soldering point on the substrate and the needle member 35B can be avoided.

In the above embodiment, the iron member 32 having only one plate-shaped iron tip 31 is used.
The iron member may be configured to have a plurality of iron tips.
In this case, moving the iron member in one direction only
This allows simultaneous soldering of more than one row of soldering locations. In the case of an iron member having a plurality of plate-shaped iron tips, each iron tip may be configured to be able to move up and down so that only necessary iron tips can be brought into contact with the substrate. By controlling the elevation of each iron tip according to the arrangement of soldering points, etc., it is possible to avoid interference between iron tips not used for soldering and components existing near the soldering points on the board. it can.

Further, in the above embodiment, the motor 3 constituting the relative position changing means is used so that the solder supply surfaces 310A and 310B of the iron tip 31 are used equally.
07 to 309 and the motors 306A and 306B constituting the solder supply means are preferably controlled. In this case, only one solder supply surface of the iron tip 31 does not deteriorate at an early stage, and the life of the entire iron tip can be extended. In addition, each of the solder reels 24A, 24A
Since the amount of use of the solder in B becomes uniform, the frequency of the solder replenishing operation for the solder reel can be reduced.

In the above embodiment, the iron tip 31
And a single-sided soldering mode in which soldering can be performed using only one of the two soldering supply surfaces and a single-sided soldering mode in which only one of the soldering supply surfaces is used. You may comprise. In this case, when soldering is performed in a state where solder is present on each of the solder reels 24A and 24B, the above-mentioned double-sided soldering mode is selected and executed, so that the
Soldering is performed using both of the solder supply surfaces.
On the other hand, when one of the solder reels 24A and 24B has run out, the single-sided soldering mode is selected and executed, and the soldering is performed using the solder supply surface corresponding to the solder reel with the remaining solder. So you can
There is no need to interrupt the soldering operation.

FIG. 10 is a block diagram of a printed circuit board (PCB) production system provided with the soldering robot having the above configuration. This production system includes a component mounting step 401 using an automatic mounter as a component mounting device,
A soldering step 402 using the soldering robot having the above-described configuration, and an in-circuit tester (IC) as a board inspection apparatus for conducting an electrical inspection of the board 200 on which soldering has been completed.
T) using a substrate inspection step. In the component mounting step 401, a printed wiring board (PWB)
While inserting the leads of various electronic components such as capacitors, resistors and connectors into the predetermined holes, the components are mounted on the board. If any parts are not compatible with the auto mounter,
The parts are mounted manually. The board on which the above components are mounted is automatically stored in a predetermined board storage space (substrate storage box) 404, and is transported and supplied to the soldering robot 402 in the next step as needed. The component mounting step 40
1 to adjust the tact between the soldering step 402 and directly transport and supply the substrate to the soldering robot 402 without accommodating the substrate in the substrate accommodation space 404;
You may comprise so that a component mounting process and a soldering process may be performed continuously. The board soldered in the soldering step is transported to the inspection standby position in the board inspection step 403, and is in a state in which the current can be inspected. In the substrate inspection step 403, after setting the substrate at a predetermined inspection position, a plurality of probe terminals are brought into contact with predetermined test ports of the substrate, and a current is sequentially passed to each test port to perform a conduction test. . The tact adjustment may also be performed between the soldering step and the inspection step, so that the component mounting step and the soldering step may be performed continuously.

According to the substrate production system having the above configuration,
By using the above soldering robot, as described above, compared to the case of the flow soldering method using a solder tank that requires the most man-hours and cost and has large variations in quality, or the case of performing soldering manually. As a result, high quality soldering is possible, and variations in soldering quality on each substrate 200 are reduced. Therefore, the number of inspection locations and the number of inspection items in the current inspection of the substrate by the ICT can be reduced, and the inspection time per one substrate can be shortened. Actually, when the inspection time by ICT is measured for the board soldered by the soldering robot of the present embodiment, it can be reduced to about 80% of the inspection time of the board soldered by the conventional flow soldering method or manually. all right.

Further, according to the production system of this embodiment, unlike the conventional flow soldering method or the case of performing soldering manually, the relative movement speed of the iron tip and the speed of supplying the solder to the iron tip change. By doing so, the soldering speed can be easily adjusted, so that the tact adjustment between the component mounting step and the board inspection step is facilitated, so that the in-line production system for the board is facilitated. In addition, the inspection time in the board inspection process, which required a longer time than the work time in the conventional soldering process, can be shortened as described above, so that tact adjustment between the soldering process and the board inspection process can be performed. Becomes even easier.

Further, according to the production system of the present embodiment, when the soldering is performed by the conventional flow soldering method using a large-sized soldering tank, or when the soldering is performed manually by a large number of workers. Since the work space for performing the soldering process is smaller than when soldering, the soldering robot and the ICT can be arranged side by side in a relatively narrow space, and a system in which the soldering robot and the ICT are combined. Can be easily integrated. In particular, when a soldering robot configured to be able to selectively supply solder to two solder supply surfaces of the iron tip 31 as in the present embodiment is used, a conventional portal iron tip is used. Unlike the above-described case, a single soldering robot can perform high-quality soldering on various types of substrates, and can easily integrate the soldering robots themselves.

On the other hand, depending on the type of the soldering robot used in the production system, as shown in the comparative example of FIG. 12, the types of substrates that can be produced by the production system (three types in the example of FIG. 12). ), It is necessary to install a dedicated soldering robot. For example, in a conventional soldering robot using a gate-shaped iron tip, it is difficult to perform high-quality soldering on a variety of substrates having different lead arrangements with one type of iron tip. It is necessary to install a dedicated soldering robot for each type. In such a case, it is difficult to centralize a system combining the soldering robot and the ICT.

[0059]

According to the first to eleventh aspects of the present invention, the solder is supplied to the two solder supply surfaces of the soldering iron tip of the soldering iron member, so that two solder supply surfaces corresponding to the respective solder supply surfaces are provided.
The molten solder can reach two solder supply points. Therefore, compared to the case where the solder is supplied from one direction to one solder supply surface of the iron tip, the soldering to the plurality of solder supply locations can be performed more efficiently. Moreover, even when a component is adjacent to a soldering location, there is an effect that high-quality and low-cost soldering can be performed without causing interference between the iron tip and the component.

In particular, according to the third aspect of the present invention, even when the protruding member protrudes from the soldering location on the soldering object, each protruding member and the iron tip do not interfere with each other. There is an effect that the portion can be securely soldered.

In particular, according to the fourth and fifth aspects of the present invention, there is an effect that soldering suitable for each soldering portion can be performed without performing work of replacing a soldering tip with interruption of the soldering operation. .

In particular, according to the fifth aspect of the present invention, even when there is a soldering point on the object to be soldered where the distance between the protruding members is different, by moving the iron tip along the line of each protruding member, There is an effect that a plurality of soldering portions where the protruding members protrude can be collectively soldered.

In particular, according to the sixth aspect of the present invention, it is possible to supply solder in accordance with the presence or absence of a soldering position corresponding to each solder supply surface. Soldering can be freely performed on the soldering location. Therefore, it is possible to solder various types of soldering objects. In addition, since unnecessary solder supply can be stopped on the solder supply surface where there is no corresponding soldering portion, useless solder consumption can be prevented.

In particular, according to the invention of claim 7, the soldering iron member can be automatically moved to the soldering position on the soldering object, and the soldering corresponding to each of the above-mentioned solder supply surfaces can be performed. There is an effect that the solder can be automatically supplied according to the presence or absence of the location.

In particular, according to the invention of claim 8, it is possible to extend the life of the iron tip as a whole, and to replenish solder to each solder accommodating portion accommodating the solder to be supplied to each solder supply surface of the iron tip. There is an effect that the frequency of the operation can be reduced.

In particular, according to the ninth aspect of the present invention, when only the soldering portion corresponding to one of the solder supply surfaces of the iron tip is soldered, the solder guide member corresponding to the other solder supply surface and the solder guide member corresponding to the other solder supply surface. This has the effect of preventing interference with components mounted near the soldering point on the object to be mounted.

In particular, according to the tenth aspect of the present invention, there is an effect that the time of the soldering operation for each soldering object can be shortened.

In particular, according to the eleventh aspect of the present invention, when one of the plurality of solder receiving portions is lost,
The single-sided soldering mode is selected and executed, and the soldering can be performed using the solder supply surface corresponding to the solder storage portion where the solder remains, so that there is no need to interrupt the soldering operation. is there.

According to the twelfth aspect of the present invention, the inspection of the soldered object after the soldering is completed as compared with the case of the conventional flow soldering method using a solder tank or the case of performing the manual soldering. You can shorten the time,
This makes it easy to inline a production system for the soldering object and to integrate a system combining a soldering device and an inspection device. In particular, when a soldering apparatus having solder supply means configured to selectively supply solder to the two solder supply surfaces of the iron tip is used, the portal iron tip is used. Unlike the case,
High quality soldering can be performed for a wide variety of soldering objects, and there is an effect that it is easy to integrate soldering devices.

[Brief description of the drawings]

FIG. 1 is an enlarged front view of a tip end of a soldering member in a soldering device according to an embodiment of the present invention.

FIG. 2 is a front view showing a schematic configuration of the soldering device.

FIG. 3 is an enlarged side view of a tip portion of the ironing member.

FIG. 4 is an enlarged view of an iron tip of the iron member.

FIG. 5 is an enlarged front view of a distal end portion of an iron member according to a modification.

FIG. 6 is a block diagram showing a main part of a control system of the soldering device.

FIG. 7 is an explanatory view of four rows of soldering using the soldering device.

FIG. 8 is an explanatory diagram showing an example of a configuration of an iron tip switching means in a soldering head according to a modification.

FIG. 9 is an explanatory diagram of a solder supply head including a needle member driving unit according to another modification.

FIG. 10 is a block diagram of a board production system including the soldering device.

FIG. 11 is a partial cross-sectional view of an iron tip according to a comparative example.

FIG. 12 is a block diagram of a substrate production system according to a comparative example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Soldering unit 11 Unit main body 12 Elevating slide shaft 13 Relay member 14 Swing arm 20A, 20B Solder supply subunit 21A, 21B Solder supply tube 22A, 22B Delivery roller pair 23A, 23B Solder supply device 24A, 24B Solder reel 30 Solder Soldering head 31 Iron tip 310A, 310B Solder supply surface 32 Iron member 33A, 33B Fixed arm member 34A, 34B Solder supply head 35A, 35B Needle member 40 Threaded solder 40 'Molten solder 100 Device main body 101 Work table 102, 103 Stand member 104 X-axis guide member 112 Memory card 200 Substrate 201 Lead 300 Control unit 301 Memory card drive

[Procedure amendment]

[Submission date] October 30, 2001 (2001.10.
30)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Name of invention

[Correction method] Change

[Correction contents]

Installing solder [Title of Invention] equipment and production system including the device

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a manufacturing system using the only equipment and said device soldering performing soldered to soldering object such as a substrate component is attached, such as electronic components and connectors relates, more particularly, to a production system using only equipment and said device solder soldering can be performed efficiently in one tip to for a plurality of soldered points on soldering object.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0002

[Correction method] Change

[Correction contents]

[0002]

2. Description of the Related Art Conventionally, as this type of soldering device,
An automatic soldering device (soldering robot) including a soldering iron member having one solder supply surface on a soldering tip, and solder supply means for supplying thread-like solder from one direction to the soldering surface of the soldering tip. There has been known. In this apparatus, when the iron tip of the soldering iron member is heated and the solder is supplied to the solder supply surface of the iron tip by the solder supply means, the solder melts and flows down on the solder supply surface. The molten solder that has flowed down reaches the soldering point adjacent to the solder supply surface,
The soldering location can be soldered. Further, when soldering is performed on a plurality of soldering points arranged in a straight line on a soldering object using this apparatus, the soldering iron member of the soldering iron member is connected to the soldering points. , The plurality of soldering locations can be continuously soldered.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to solder a plurality of soldering locations as compared to a case where solder is supplied from one direction to one solder supply surface of a soldering iron tip. It is possible to efficiently perform the soldering, and unlike the case of using the conventional gate-shaped iron tip, even when the component is adjacent to the soldering location, the component and the soldering location do not interfere with each other. to provide a production system using a soldering only equipment and the device-quality and low-cost soldering becomes possible.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

[0007]

To achieve the above object, according to the first aspect of the present invention, there is provided a soldering device having a solder supply surface formed thereon.
A soldering iron member having a tip, and heating the iron tip
Heating means and solder to the solder supply surface of the iron tip
Soldering device provided with
Therefore, the iron tip is used for the soldering object.
That of the two exposed sides extending along the direction of relative movement
Each having a solder supply surface.
Means for selecting solder for each solder supply surface of the iron tip.
Each of the soldering tips.
The solder supplied by the solder supply means to each of the supply surfaces
Two solder storage sections for storing the solder and the soldering target
Memory for storing information about soldering points on objects
Means, the soldering object and the soldering iron member
Relative position variable hand that changes the relative positional relationship between
Step and the soldering location stored in the storage means.
Based on the information, the object to be soldered and the solder
To change the relative positional relationship with the iron member
Controlling the relative position varying means to supply each solder to the iron tip;
The solder supply means for switching the solder supply to the surface
And solderable using both solder supply surfaces
Two-sided soldering mode and two solder supply surfaces
With single-sided soldering using only one or the other
And a control means for selecting and executing the backup mode . Here, the above soldering pair
Relative position between the elephant and the soldering iron
The relationship between the soldering object and the soldering iron member
Not only the positional relationship that represents the linear distance between
It also includes the rotational position relationship that indicates the relative rotational angle between
is there. In addition, the relative position for changing the relative positional relationship described above.
The placement variable means includes the soldering object and the soldering
Move or rotate at least one of the soldering iron members
Or other means.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Deleted

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Deleted

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

[0010] In the soldering device of the first aspect, the ironing tip of the soldering iron member is heated by the heating means. With the heated iron tip adjacent to the soldering point, solder is supplied to each solder supply surface of the iron tip by the solder supply means, and the solder is melted on the solder supply surface.
The molten solder on each of the solder supply surfaces flows down along the solder supply surfaces and reaches a plurality of solder supply points corresponding to the respective solder supply surfaces, whereby the plurality of soldering positions are soldered. You. Further, since the two solder supply surfaces are formed on the two exposed side surfaces extending along the direction of the relative movement of the iron tip to the soldering target, as described above, the soldering is performed. Even when a component is attached near the location, the soldering location can be soldered without causing the iron tip to interfere with the component. Also, the solder supply surface of the above iron tip
To supply an appropriate amount of solder to
Therefore, unlike the case of using the conventional portal iron tip,
Unnecessary or unnecessary solder is attached to the soldering point
There is no possibility that the solder will be attached to an important part. Follow
And high quality soldering is possible,
Costs are also reduced. Furthermore, the two exposed side faces facing outward.
A relatively simple structure with a solder supply surface
Since the iron tip is used, the above-mentioned grooved solder reservoir
Conventional core type that requires complicated processing such as
The manufacturing cost of the iron tip is lower than that of the iron tip. Also,
In the soldering device of the first aspect, the solder supply means
Select solder for each solder supply side of the above iron tip
Soldering for each solder supply surface
It is possible to supply solder according to the presence or absence of soldering points
Become. Further, in the soldering device of the first aspect, the soldering device is used.
Information about the soldering location on the soldering object
Store it in the column. And stored in the storage means.
Based on the information about the soldering location
The position of the soldering point on the soldering object is determined by the control means
And the soldering tip of the soldering iron member is
The relative position changing means is controlled so as to be adjacent to. Ma
Before starting the soldering operation based on the above information
Which solder supply surface of the iron tip of the soldering iron
The control means determines whether or not it corresponds to the soldering location.
Set. Based on the result of the determination, the control means
By controlling the solder supply means, the solder
Switch the solder supply to the supply surface. Thus each Han
By switching the solder supply to the solder supply surface, each solder
Depending on whether there is a soldering point corresponding to the solder supply surface,
Solder only to the solder supply surface corresponding to the soldering location.
Automatically supply the solder. In addition, the soldering of claim 1
In the device, soldering is performed in a state where the solder of each solder storage section exists.
When performing soldering, select the above two-sided soldering mode.
By selecting and executing both solder supply surfaces
Perform soldering using. On the other hand, one of the solder
If one of the solders is gone,
Select and execute the mode.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Deleted

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Deleted

[Procedure amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Deleted

[Procedure amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Deleted

[Procedure amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Deleted

[Procedure amendment 15]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Deleted

[Procedure amendment 16]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Deleted

[Procedure amendment 17]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Deleted

[Procedure amendment 18]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Deleted

[Procedure amendment 19]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Deleted

[Procedure amendment 20]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Deleted

[Procedure amendment 21]

[Document name to be amended] Statement

[Correction target item name] 0022

[Correction method] Deleted

[Procedure amendment 22]

[Document name to be amended] Statement

[Correction target item name] 0023

[Correction method] Deleted

[Procedure amendment 23]

[Document name to be amended] Statement

[Correction target item name] 0024

[Correction method] Deleted

[Procedure amendment 24]

[Document name to be amended] Statement

[Correction target item name] 0025

[Correction method] Deleted

[Procedure amendment 25]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Deleted

[Procedure amendment 26]

[Document name to be amended] Statement

[Correction target item name] 0027

[Correction method] Deleted

[Procedure amendment 27]

[Document name to be amended] Statement

[Correction target item name] 0028

[Correction method] Deleted

[Procedure amendment 28]

[Document name to be amended] Statement

[Correction target item name] 0029

[Correction method] Change

[Correction contents]

According to a second aspect of the present invention, there is provided a soldering device for soldering to a soldering object on which components are mounted, and an inspection device for inspecting the soldering object soldered by the soldering device. In the production system for an object to be soldered, the soldering device according to claim 1 is used as the soldering device.

[Procedure amendment 29]

[Document name to be amended] Statement

[Correction target item name] 0030

[Correction method] Change

[Correction contents]

In the substrate production system according to the second aspect, the use of the above-mentioned soldering device provides a higher quality than the conventional flow soldering method using a solder tank or the case of performing manual soldering. Is possible, and the variation in soldering quality on each soldering object is reduced. Therefore, it is possible to shorten the time required to inspect the soldered object after the soldering. Also, unlike the flow soldering method using a conventional solder bath or the manual soldering, adjusting the soldering speed allows the component mounting process to the soldering target and the inspection process after soldering. Since the tact adjustment can be easily performed, it is easy to inline the production system of the soldering object. Furthermore, compared to the case of the flow soldering method using a conventional solder tank or the case of performing manual soldering, the work space for performing the soldering process using the above-described soldering device can be reduced, so that it is relatively difficult. Since the soldering device and the inspection device can be arranged side by side in a narrow space, it is easy to centralize a system combining the soldering device and the inspection device. In particular, when using a soldering apparatus having solder supply means configured to selectively supply solder to a plurality of solder supply surfaces of the iron tip, the portal iron tip is used. Unlike the case, a single soldering device enables high-quality soldering of a wide variety of soldering objects, and facilitates integration of the soldering devices.

[Procedure amendment 30]

[Document name to be amended] Statement

[Correction target item name] 0059

[Correction method] Change

[Correction contents]

[0059]

According to the first aspect of the present invention, the solder is supplied to the two solder supply surfaces at the soldering iron tip of the soldering iron member, so that the two solder supply portions corresponding to the respective solder supply surfaces are melted. Solder that has reached can be reached. Therefore, compared to the case where the solder is supplied from one direction to one solder supply surface of the iron tip, the soldering to the plurality of solder supply locations can be performed more efficiently . May then <br/>, without interfering with the soldering tip and the component, even when the part is adjacent to the soldering portion, it is possible to solder the high quality and low cost. Also, each solder supply side has
Supply solder according to the presence or absence of the corresponding soldering location
So that one point, one row, two rows, etc.
It can be soldered freely to the soldering location
I will be able to. Therefore, for various types of soldering objects
Can be soldered. Moreover, it corresponds
Unnecessary solder on the solder supply surface where there is no soldering
Supply can be stopped, so waste solder consumption
Can be prevented. In addition, the solder on the soldering object
The soldering iron is automatically moved to the soldering point.
As well as the above solder supply surfaces
Solder supply automatically according to the presence or absence of
Can be done. In addition, among the plurality of solder accommodation sections,
If one of the solders runs out, the single-sided soldering mode
Select and execute the solder, and the solder storage area where the solder remains
Soldering using a solder supply surface compatible with
It is not necessary to interrupt the soldering operation.
The effect is that

[Procedure amendment 31]

[Document name to be amended] Statement

[Correction target item name] 0060

[Correction method] Deleted

[Procedure amendment 32]

[Document name to be amended] Statement

[Correction target item name] 0061

[Correction method] Deleted

[Procedure amendment 33]

[Document name to be amended] Statement

[Correction target item name] 0062

[Correction method] Deleted

[Procedure amendment 34]

[Document name to be amended] Statement

[Correction target item name] 0063

[Correction method] Deleted

[Procedure amendment 35]

[Document name to be amended] Statement

[Correction target item name] 0064

[Correction method] Deleted

[Procedure amendment 36]

[Document name to be amended] Statement

[Correction target item name] 0065

[Correction method] Deleted

[Procedure amendment 37]

[Document name to be amended] Statement

[Correction target item name] 0066

[Correction method] Deleted

[Procedure amendment 38]

[Document name to be amended] Statement

[Correction target item name] 0067

[Correction method] Deleted

[Procedure amendment 39]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Deleted

[Procedure amendment 40]

[Document name to be amended] Statement

[Correction target item name] 0069

[Correction method] Change

[Correction contents]

According to the second aspect of the present invention, the inspection of the soldered object which has been soldered is completed as compared with the case of the conventional flow soldering method using a solder bath or the case of manually soldering. The time can be shortened, and the in-line production system for the soldering object and the integration of a system combining the soldering device and the inspection device can be easily performed. In particular, when a soldering apparatus having solder supply means configured to selectively supply solder to the two solder supply surfaces of the iron tip is used, the portal iron tip is used. Unlike the above case, it is possible to perform high-quality soldering on a wide variety of soldering objects, and there is an effect that it is easy to integrate soldering devices.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B23K 3/02 B23K 3/02 J 3/06 3/06 K

Claims (12)

[Claims] 1. An iron tip of a soldering iron member is heated,
In a soldering method for soldering a soldering portion adjacent to the solder supply surface by supplying solder to a solder supply surface of the iron tip, a relative movement of the iron tip to an object to be soldered as the iron tip A solder supply surface is provided on each of the two exposed side surfaces extending along the direction of the soldering, and solder is supplied to each of the solder supply surfaces of the soldering iron tip. A soldering method characterized by soldering two soldering portions. 2. A soldering iron member having an iron tip having a solder supply surface formed thereon, heating means for heating the iron tip, and solder supply means for supplying solder to the solder supply surface of the iron tip. A soldering device provided with the soldering tip, wherein the soldering tip has a solder supply surface on each of two exposed side surfaces extending along a direction of relative movement of the tip with respect to a soldering target; A soldering device configured to supply the solder to each of the solder supply surfaces of the iron tip. 3. The soldering device according to claim 2, wherein the width of the iron tip is smaller than the interval between the protruding members projecting from the surface of the soldering object so as to face the respective solder supply surfaces. Soldering equipment. 4. A soldering apparatus according to claim 2, wherein said soldering apparatus has a plurality of iron tips of different types, and is provided with iron tip switching means for switching said iron tips for use in soldering. apparatus. 5. The soldering device according to claim 4, wherein said plurality of iron tips have different widths from each other. 6. The soldering apparatus according to claim 2, wherein said solder supply means is capable of selectively supplying solder to each solder supply surface of said iron tip. A soldering device characterized by the above-mentioned. 7. A soldering apparatus according to claim 6, wherein: a storage means for storing information on a soldering position on the soldering target; and a storage means for storing information between the soldering target and the soldering iron member. A relative position changing unit that changes a relative positional relationship, and a relative position between the soldering target and the soldering iron member based on the information of the soldering location stored in the storage unit. Control means for controlling the relative position changing means so as to change the relative positional relationship, and controlling the solder supply means so as to switch the solder supply to each solder supply surface of the iron tip. Soldering equipment. 8. The soldering device according to claim 7, wherein each solder supply surface of the iron tip is used evenly.
A soldering device for controlling the relative position changing means and the solder supply means. 9. The soldering apparatus according to claim 7, wherein said solder supply means is constituted by using a plurality of solder guide members for guiding and supplying solder to each solder supply surface of said iron tip. A solder guide member drive for moving a member between a solder supply position close to the solder supply surface and a retracted position retracted upward away from the solder supply surface so that solder can be supplied to the corresponding solder supply surface. Means for controlling the solder guide member driving means based on the information of the soldering location. 10. The soldering apparatus according to claim 7, wherein the relative position is determined based on the information on the soldering points so that a moving distance at each soldering point and a moving distance between the soldering points are minimized. A soldering device for controlling a variable means and the solder supply means. 11. A soldering apparatus according to claim 7, wherein two solder storage portions for storing the solder supplied by the solder supply means on each of the solder supply surfaces of the iron tip, and both solder supply surfaces. Control means for selecting and executing a double-sided soldering mode that can be used for soldering and a single-sided soldering mode for soldering using only one of the two solder supply surfaces. A unique soldering device. 12. A soldering apparatus for performing soldering on a soldering object on which components are mounted, and an inspection apparatus for inspecting the soldering object soldered by the soldering apparatus. A production system, wherein the soldering device according to any one of claims 2 to 11 is used as the soldering device.