JP2002040656A5 - - Google Patents

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JP2002040656A5
JP2002040656A5 JP2000219253A JP2000219253A JP2002040656A5 JP 2002040656 A5 JP2002040656 A5 JP 2002040656A5 JP 2000219253 A JP2000219253 A JP 2000219253A JP 2000219253 A JP2000219253 A JP 2000219253A JP 2002040656 A5 JP2002040656 A5 JP 2002040656A5
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group
substituent
hydrogen atom
electron beam
single bond
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JP4149122B2 (en
JP2002040656A (en
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Priority claimed from JP2000219253A external-priority patent/JP4149122B2/en
Priority to TW090116739A priority patent/TW567402B/en
Priority to KR1020010043328A priority patent/KR100775453B1/en
Publication of JP2002040656A publication Critical patent/JP2002040656A/en
Publication of JP2002040656A5 publication Critical patent/JP2002040656A5/ja
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【特許請求の範囲】
【請求項1】 (A)電子線又はX線の照射により、ラジカル種を発生する化合物、
(B)水不溶でアルカリ水溶液に可溶な樹脂、
(C)ラジカルにより重合可能な不飽和結合を少なくとも1個有する化合物、
を含有することを特徴とする電子線又はX線用ネガ型レジスト組成物。
【請求項2】 (B)成分の樹脂が、一般式(a1)で表される繰り返し単位を含有する樹脂であることを特徴とする請求項1に記載の電子線又はX線用ネガ型レジスト組成物。
【化1】

Figure 2002040656
式中、R1は水素原子、ハロゲン原子、シアノ基、置換基を有していても良い、アルキル基又はハロアルキル基を表す。R2は水素原子、置換基を有していても良い、アルキル基、シクロアルキル基、アリール基、アラルキル基、あるいはアシル基を表す。R3、R4は同じでも異なっていても良く、水素原子、ハロゲン原子、シアノ基、又は置換基を有していても良い、アルキル基、シクロアルキル基、アルケニル基、アラルキル基、もしくはアリール基を表す。
Aは単結合、置換基を有しても良い、アルキレン基、アルケニレン基、シクロアルキレン基、もしくはアリーレン基、又は−O−、−SO2−、−O−CO−R5−、−CO−O−R6−、−CO−N(R7)−R8−を表す。
5、R6、R8は同じでも異なっていても良く、単結合、置換基を有しても良い、アルキレン基、アルケニレン基、シクロアルキレン基、もしくはアリーレン基の単独、又はこれらの基とエーテル構造、エステル構造、アミド構造、ウレタン構造もしくはウレイド構造の群より選択される少なくとも1種が一緒になって形成した2価の基を表す。
7は同じでも異なっていても良く、水素原子、置換基を有していても良い、アルキル基、シクロアルキル基、アラルキル基、又はアリール基を表す。
lは1〜3の整数を表す。また複数のR2、又はR2とR3もしくはR4が結合して環を形成しても良い。
【請求項3】 (B)成分の樹脂が、ラジカルにより重合可能な不飽和結合を少なくとも1個有する樹脂であることを特徴とする請求項1又は2に記載の電子線又はX線用ネガ型レジスト組成物。
【請求項4】 (B)成分の樹脂が、一般式(a2)の繰り返し単位を含有する樹脂であることを特徴とする請求項1〜3のいずれかに記載の電子線又はX線用ネガ型レジスト組成物。
【化2】
Figure 2002040656
式中、R9は水素原子、ハロゲン原子、シアノ基、置換基を有していても良い、アルキル基又はハロアルキル基を表す。
10〜R12は水素原子、一般式(b)、(c)、又は(d)の何れかの基、置換基を有していても良い、アルキル基、シクロアルキル基、アリール基、アラルキル基、あるいはアシル基を表す。
13、R14は同じでも異なっていても良く、水素原子、ヒドロキシル基、ハロゲン原子、シアノ基、又は置換基を有していても良い、アルキル基、シクロアルキル基、アルケニル基、アラルキル基、もしくはアリール基を表す。
【化3】
Figure 2002040656
式中、R15〜R20、R24、R25は水素原子、ハロゲン原子、シアノ基、置換基を有していても良い、アルキル基又はハロアルキル基を表す。
21、R22は水素原子、ハロゲン原子、ヒドロキシ基、置換基を有していても良い、アルキル基、アルコキシ基、アシロキシ基を表す。
23は水素原子、置換基を有していても良い、アルキル基、シクロアルキル基、アラルキル基、又はアリール基を表す。
1は単結合、置換基を有しても良い、2価のアルキレン基、アルケニレン基、シクロアルキレン基、もしくはアリーレン基、又は−O−、−SO2−、−O−CO−R26−、−CO−O−R27−、−CO−N(R28)−R29−を表す。
26、R27、R29は同じでも異なっていても良く、単結合、又はエーテル構造、エステル構造、アミド構造、ウレタン構造もしくはウレイド構造を有しても良い、また置換基を有しても良い、2価のアルキレン基、アルケニレン基、シクロアルキレン基、アリーレン基を表す。
28は水素原子、置換基を有していても良い、アルキル基、シクロアルキル基、アラルキル基、又はアリール基を表す。
2は単結合、−O−R27−、−N(R28)−R29−を表す。
3は単結合、−SO2−もしくはアルキレン構造を有しても良い、また置換基を有しても良い、アリーレン基を表す。
4は単結合、置換基を有しても良い、2価のアルキレン基、シクロアルキレン基、アリーレン基、−O−、−SO2−、−CO−、−CO−O−R21−を表す。
x、y、zは0又は1を表し、m、nは0又は1以上の整数を表す。
但し、一般式(a2)中、少なくとも一つは一般式(b)、(c)、もしくは(d)の基を有する。またR10〜R12のうちの二つ、又はR10〜R12の一つとR13もしくはR14が結合して環を形成しても良い。
【請求項5】 (A)成分の化合物が、スルホニウム、又はヨードニウムのスルホン酸塩化合物から選択されることを特徴とする請求項1〜4のいずれかに記載の電子線又はX線用ネガ型レジスト組成物。
【請求項6】 75keV以上の加速電圧条件下で電子線照射することを特徴とする請求項1〜5のいずれかに記載の電子線又はX線用ネガ型レジスト組成物。
請求項7】 請求項1〜6のいずれかに記載の電子線又はX線用ネガ型レジスト組成物によりレジスト膜を形成し、当該レジスト膜に電子線又はX線を照射し、現像することを特徴とするパターン形成方法。 [Claims]
(A) a compound which generates a radical species upon irradiation with an electron beam or X-ray,
(B) a resin which is insoluble in water and soluble in an aqueous alkali solution,
(C) a compound having at least one unsaturated bond polymerizable by a radical,
A negative resist composition for electron beams or X-rays, comprising:
2. The negative resist for an electron beam or X-ray according to claim 1, wherein the resin as the component (B) is a resin containing a repeating unit represented by the general formula (a1). Composition.
Embedded image
Figure 2002040656
In the formula, R 1 represents a hydrogen atom, a halogen atom, a cyano group, or an optionally substituted alkyl group or haloalkyl group. R 2 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an acyl group which may have a substituent. R 3 and R 4 may be the same or different and may have a hydrogen atom, a halogen atom, a cyano group, or an optionally substituted alkyl group, a cycloalkyl group, an alkenyl group, an aralkyl group, or an aryl group. Represents
A may have a single bond, a substituted group, alkylene group, alkenylene group, cycloalkylene group or arylene group, or -O -, - SO 2 -, - O-CO-R 5 -, - CO- O-R 6 -, - CO -N (R 7) -R 8 - represents a.
R 5 , R 6 , and R 8 may be the same or different, and may be a single bond, may have a substituent, an alkylene group, an alkenylene group, a cycloalkylene group, or an arylene group alone, or It represents a divalent group formed by at least one selected from the group consisting of an ether structure, an ester structure, an amide structure, a urethane structure and a ureide structure.
R 7 may be the same or different and represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group or an aryl group which may have a substituent.
l represents an integer of 1 to 3. Further, a plurality of R 2 , or a combination of R 2 and R 3 or R 4 may form a ring.
3. The electron beam or X-ray negative type according to claim 1, wherein the resin as the component (B) is a resin having at least one unsaturated bond polymerizable by a radical. Resist composition.
4. The electron beam or X-ray negative according to claim 1, wherein the resin as the component (B) is a resin containing a repeating unit represented by the general formula (a2). -Type resist composition.
Embedded image
Figure 2002040656
In the formula, R 9 represents a hydrogen atom, a halogen atom, a cyano group, or an optionally substituted alkyl group or haloalkyl group.
R 10 to R 12 are a hydrogen atom, a group represented by any of formulas (b), (c) and (d), an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl, which may have a substituent; Group or an acyl group.
R 13 and R 14 may be the same or different, and may have a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, or an optionally substituted alkyl group, a cycloalkyl group, an alkenyl group, an aralkyl group, Alternatively, it represents an aryl group.
Embedded image
Figure 2002040656
In the formula, R 15 to R 20 , R 24 and R 25 represent a hydrogen atom, a halogen atom, a cyano group, or an alkyl group or a haloalkyl group which may have a substituent.
R 21 and R 22 represent a hydrogen atom, a halogen atom, a hydroxy group, an alkyl group, an alkoxy group, or an acyloxy group which may have a substituent.
R 23 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group which may have a substituent.
A 1 is a single bond, which may have a substituent, a divalent alkylene group, an alkenylene group, a cycloalkylene group, or an arylene group, or —O—, —SO 2 —, —O—CO—R 26, -CO-O-R 27 - , - CO-N (R 28) -R 29 - represents a.
R 26 , R 27 , and R 29 may be the same or different and may have a single bond, an ether structure, an ester structure, an amide structure, a urethane structure, or a ureide structure, or may have a substituent. Good represents a divalent alkylene group, alkenylene group, cycloalkylene group, or arylene group.
R 28 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group which may have a substituent.
A 2 represents a single bond, —O—R 27 —, or —N (R 28 ) —R 29 —.
A 3 represents an arylene group which may have a single bond, —SO 2 — or an alkylene structure, and may have a substituent.
A 4 represents a single bond, which may have a substituent, a divalent alkylene group, a cycloalkylene group, an arylene group, —O—, —SO 2 —, —CO—, —CO—O—R 21 — Represent.
x, y, and z represent 0 or 1, and m and n represent 0 or an integer of 1 or more.
However, in the general formula (a2), at least one has a group represented by the general formula (b), (c) or (d). Also two of R 10 to R 12, or one with R 13 or R 14 of R 10 to R 12 may combine with each other to form a ring.
5. The electron beam or X-ray negative type according to claim 1, wherein the compound of the component (A) is selected from sulfonium or iodonium sulfonate compounds. Resist composition.
6. The negative resist composition for electron beam or X-ray according to claim 1, wherein the electron beam is irradiated under an acceleration voltage condition of 75 keV or more.
7. A resist film was formed by electron beam or X-ray negative resist composition according to any one of claims 1 to 6, it is irradiated with an electron beam or X-rays, and developed in the resist film A pattern forming method characterized by the above-mentioned.

JP2000219253A 2000-07-19 2000-07-19 Negative resist composition for electron beam or X-ray Expired - Fee Related JP4149122B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000219253A JP4149122B2 (en) 2000-07-19 2000-07-19 Negative resist composition for electron beam or X-ray
TW090116739A TW567402B (en) 2000-07-19 2001-07-09 Negative resist composition for electron ray or X-ray
KR1020010043328A KR100775453B1 (en) 2000-07-19 2001-07-19 Negative-working resist composition for electron rays or x-rays

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000219253A JP4149122B2 (en) 2000-07-19 2000-07-19 Negative resist composition for electron beam or X-ray

Publications (3)

Publication Number Publication Date
JP2002040656A JP2002040656A (en) 2002-02-06
JP2002040656A5 true JP2002040656A5 (en) 2006-01-12
JP4149122B2 JP4149122B2 (en) 2008-09-10

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JP (1) JP4149122B2 (en)
KR (1) KR100775453B1 (en)
TW (1) TW567402B (en)

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NO20031736D0 (en) * 2003-04-15 2003-04-15 Amersham Health As compounds
US9469941B2 (en) 2011-07-01 2016-10-18 Empire Technology Development Llc Paraben derivatives for preserving cellulosic materials

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08240911A (en) * 1995-03-02 1996-09-17 Japan Synthetic Rubber Co Ltd Radiation sensitive resin composition
JPH08272099A (en) * 1995-03-31 1996-10-18 Oki Electric Ind Co Ltd Radiation sensitive resin composition and pattern forming method using the composition
JP3633179B2 (en) * 1997-01-27 2005-03-30 Jsr株式会社 Positive photoresist composition
JPH1149847A (en) * 1997-05-15 1999-02-23 Hitachi Ltd Photosensitive resin composition and insulation film and multilayer circuit board produced by using the composition
JPH1115154A (en) * 1997-06-20 1999-01-22 Chisso Corp Photosensitive resin composition and display device using the same
TWI250379B (en) * 1998-08-07 2006-03-01 Az Electronic Materials Japan Chemical amplified radiation-sensitive composition which contains onium salt and generator
JP2000147752A (en) * 1998-11-05 2000-05-26 Fuji Photo Film Co Ltd Negative resist composition
JP2000159828A (en) * 1998-11-30 2000-06-13 Nippon Shokubai Co Ltd Photosensitive resin composition, electron-beam-curable resin composition, and their cured items

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