JP2001338813A - Electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic parts in which desired characteristics are obtained easily by a material, by which the dispersibility of grains is improved, and the miniaturization of which can be attained. SOLUTION: The electronic parts have a composite dielectric material in which the whole surfaces or parts of metallic grains or magnetic metallic grains 1 having mean grain size of 0.1-10 μm and an approximately sphere are covered with dielectric layers or insulator layer 2 and the covered grains are dispersed into a kind or more of resins 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component using a prepreg or a substrate or an electronic component manufactured by a method such as casting or molding, and more particularly to an application utilizing a dielectric property or a magnetic property and a magnetic shield. Electronic components for the purpose of.

[0002]

2. Description of the Related Art Conventionally, electronic components using a dielectric material including a resin, such as a capacitor and a piezoelectric element, include a molding material (molding material such as transfer molding or injection molding) and a casting material (potting or the like). Liquid materials for casting (molding materials), paints such as printing pastes, powder compacting powder materials (materials for molding under pressure), prepregs, substrates and the like are used as materials. Conventionally, a composite dielectric material in which powder of dielectric particles is dispersed in a resin is used as these resin-based dielectric materials. When this composite dielectric material is used, for example, for a laminated substrate, a prepreg as an intermediate product of the laminated substrate is produced by impregnating and coating the composite dielectric material on a glass cloth. And a laminate is made by pasting copper foil on this prepreg,
A desired conductor pattern is formed through a printed circuit board manufacturing process. The dielectric powder used in the composite dielectric material is obtained by firing the powder or pulverizing the sintered dielectric. Since the characteristics of the sintered dielectric used here have a close relationship with the characteristics of the finally completed composite dielectric material, it is selected in consideration of the dielectric constant, tan δ, and the like.

[0003] Electronic components such as capacitors and piezoelectric elements are formed by fixing external electrodes to both surfaces of a molded body of the composite dielectric material.

[0004] Electronic components such as inductors, transformers, or shield components using magnetic materials are known as magnetic materials.
A ferrite powder is dispersed and mixed in an organic material (Japanese Patent Application No. 9-76341). A prepreg is prepared by applying the composite magnetic material to a glass cloth, and then a copper foil is applied to the prepreg to form a copper-clad laminate. By forming a desired pattern on the laminate, an inductance element having excellent high-frequency characteristics has been obtained.

As a material of a magnetic substrate using a multilayer substrate or a prepreg, there is a material in which magnetic metal particles are dispersed and mixed in a resin. (JP-A-8-78798, JP-A-10-79
No. 593). Japanese Patent Application Laid-Open No. 8-204486 discloses a composite magnetic material in which spherical iron carbon is dispersed in a resin.

As a molding material using a composite magnetic material,
Japanese Patent Application Laid-Open No. 7-235410 discloses that the surface of a spherical iron powder having an average particle size of about 50 μm is insulated, and this is combined with a resin to form a motor,
Some are used as core materials for transformers.

[0007] As for the description of the electromagnetic shielding material,
By using magnetic metal particles of small size in the Journal of the Applied Magnetics Vol. 22, No. 4-2, 1998, pp. 885-888, the value of the complex magnetic permeability is higher up to high frequencies than cubic ferrite. In some cases, the shielding effect can be expected up to high frequencies.

[0008]

[Problems to be Solved by the Invention] (Electronic components using dielectric material) In the case of an electronic component using a conventional composite dielectric material, a different material is provided between the external electrodes in a resin. Is present in a dispersed state. In this case, the combined relative permittivity is determined by the volume ratio of the two types of materials.

Even if a dielectric material having a high relative dielectric constant is mixed, a very high relative dielectric constant cannot be obtained. For example, if the relative dielectric constant is 90
60vol% is obtained by dispersing the powder of
, The combined relative permittivity is about 20, which is reduced to about 1/5.
In addition, powder having a relative dielectric constant of 9,000 is added to epoxy resin for 4 times.
The relative dielectric constant of 0 vol% dispersion is about 15, while the specific dielectric constant of 90 vol% powder dispersed in epoxy resin at 40 vol% is about 12, which is not so large.

When the glass cloth is impregnated with the composite dielectric material, the difference in the relative dielectric constant of the dispersed powder of the composite dielectric material does not appear as compared with the case where no glass cloth is used. This is because the volume of the glass cloth occupying in the substrate cannot be ignored, and the glass cloth having a relative dielectric constant of 7.0 has an influence on the composite relative dielectric constant determined by the volume ratio.

As described above, in order to obtain a high relative dielectric constant with a conventional composite dielectric material, a powder having a relative dielectric constant of 9000 is required
l% or more. However, in order to create a thin substrate, considering the adhesion to the copper foil and delamination between layers, the content of the composite dielectric material must be 50 vol% or less, so even if expensive dielectric powder is mixed, The dielectric constant cannot be improved much. In addition, conventional dielectric powders are obtained by crushing a sintered dielectric, have irregularities, and have a large particle size, so they have poor dispersibility, and have characteristics of electronic components and substrates such as thin capacitors and piezoelectric elements. Is difficult to stabilize.

(Electronic parts using glass cloth-containing prepreg and copper-clad magnetic substrate) (a) When an inductance element is manufactured using a composite magnetic copper-clad substrate obtained by dispersing and mixing ferrite powder in an organic material, However, when high-permeability ferrite powder is used, the high-frequency characteristics tend to deteriorate.On the other hand, when a low-permeability ferrite material having excellent high-frequency characteristics is used, sufficient magnetic permeability cannot be obtained naturally. Satisfactory properties were not obtained.

(B) When a metal magnetic material such as carbonyl iron is used instead of the ferrite powder,
Although a composite magnetic substrate with relatively high magnetic permeability and good high-frequency characteristics can be obtained, the insulating property is low, and plating is also applied to parts other than the pattern due to poor insulation of the element (composite magnetic material) in the copper foil patterning process. Adhesion caused a short circuit between the patterns, causing a problem. Further, in the case of silicon iron, a composite magnetic substrate having a high magnetic permeability and a high saturation magnetic flux density can be obtained, but it cannot be used in a high frequency range and has a problem of low insulation.

(Electronic parts using magnetic molding material) (1) Sheet molding material (a) A soft magnetic metal powder such as carbonyl iron or silicon iron is dispersed and mixed in a resin, molded into a sheet, and used as a shielding material. In this case, a volume resistance of about 10 ⁷ Ω · cm can be obtained by coupling treatment, oxidation treatment, or the like on the surface of the metal powder.
It is about 50 V and cannot be regarded as an insulating material when a voltage is applied, and there is a danger of an electrical short.

(B) A shield material in which ferrite powder is dispersed instead of a soft magnetic metal powder such as carbonyl iron or silicon iron has a high volume resistance and has almost no possibility of an electrical short, but is effective for an electric field shield. Not only,
Even in the magnetic shield, the effect is small on the low frequency side.

(2) Molding Material As a measure against radiation noise of a printed wiring board on which components are mounted, there is a method of molding a molding material such that the component mounting surface is entirely covered with a composite magnetic material in which ferrite is mixed with resin. Had been used. The mold material in which ferrite powder is dispersed has no effect on the electric field shield, and also has little effect on the magnetic shield on the low frequency side. In a molding material in which a soft magnetic metal powder such as carbonyl iron or silicon iron is dispersed, the shielding effect is enhanced, but the insulating property is low, and poor characteristics are caused by poor insulation between patterns of the wiring board.

(3) Composite Magnetic Core Material The composite magnetic material used as a magnetic core of a choke coil, a transformer or the like is made of ferrite having an average particle diameter of several hundred nm to several tens μm, or magnetic metal particles whose surface is insulated. A material dispersed in a resin material such as a liquid crystal polymer, a PPS resin, and an epoxy resin has been used. It is molded into a desired shape and used as a magnetic core, but when ferrite is dispersed, the saturation magnetic flux density is small, it is difficult to use it for high power applications with large currents, and when using magnetic metal materials, Cannot sufficiently secure insulation, and there is a problem in reliability.

An object of the present invention is to provide an electronic component that can easily obtain desired characteristics and can be reduced in size by using a material having good dispersibility of particles.

Further, the present invention has high insulation and pressure resistance,
It is another object of the present invention to provide an electronic component which has no problem of occurrence of corrosion and has good high frequency characteristics.

[0020]

According to the electronic component of the present invention, the whole or a part of the surface of a substantially spherical metal particle having an average particle diameter of 0.1 to 10 μm is coated with a dielectric layer. Is characterized by having a composite dielectric material obtained by dispersing at least one kind in a resin.

Here, the dielectric layer means a layer made of a substance having a higher dielectric constant than the resin, and preferably has a relative dielectric constant of 20 or more. As described above, small-diameter spherical particles in which all or part of the surface of the metal particles are covered with the dielectric layer can be obtained by a spray pyrolysis method as described in, for example, Japanese Patent Publication No. 3-68484. This spray pyrolysis method sprays a solution containing a metal salt into droplets, and heats the droplets in the air at a temperature higher than the decomposition temperature of the metal salt and higher than the melting point of the metal, whereby the metal powder is heated. How to make. When a dielectric layer is formed on the surface of the metal powder, for example, when a barium titanate layer is formed, a solution in which a compound such as a barium salt or a titanyl salt is dissolved together with the nickel salt is spray-heated, and these dielectric materials are sprayed. Heat at a temperature higher than the decomposition temperature of the body salt. This allows
A dielectric layer is formed on the surface of the substantially single crystal spherical metal particles.

In this case, the reason that the particles are substantially a single crystal is based on the fact that the crystallinity was confirmed to be very high from a diffraction image of an electron diffraction result using a transmission electron microscope.

When these particles are formed by the spray pyrolysis method, the lower limit of the particle size is 0.05 μm and the upper limit is 20 μm.
It is about μm. Substantially, the average particle size is 0.1 to 10
μm, and particles having a particle size of 0.05 to 20 μm are 9
It is an aggregate of particles occupying 5 wt%.

Such dielectric-coated metal particles are dispersed and mixed in a resin so that a sintered dielectric material is crushed into a powder as in the prior art, which is compared with a flake or a block having irregularities. Because of its spherical shape and small diameter, it is mixed with the resin with good dispersibility. For this reason, processing is easy and desired characteristics are easily obtained. When the particles are dispersed in a resin, the dielectric layer is, for example, 1 wt% with respect to the metal particles.
When the addition amount is not able to contribute to the improvement of the dielectric constant, the insulation resistance and the withstand voltage of the composite dielectric material can be improved. The dielectric layer is, for example, 1 wt.
Exceeding the addition amount of% contributes to improvement of the dielectric constant. Further, since the metal particles are covered by the coating layer, they are not easily corroded.

Since such dielectric-coated metal particles can be produced by the spray pyrolysis method as described above, they are inexpensive as compared with the conventional case of going through a number of steps such as sintering and pulverization of a dielectric. Can be provided.

In the present invention, the composite dielectric material may be a resin further containing at least one oxide dielectric powder in addition to the dielectric coated metal particles in the resin.

In the present invention, the dielectric layer formed on the surface of the metal particles preferably has a thickness of 0.005 to 2 μm.

If the thickness of the dielectric layer is 0.005 μm or more, it can contribute to the improvement of the dielectric constant or withstand voltage. If it exceeds 2 μm, it becomes difficult to produce particles.

The thickness in this case means the maximum thickness of the coating, and the coating does not necessarily need to cover the entire surface of the metal particle, and may occupy about 50% of the surface of the metal particle. I just need.

Further, the coated metal particles are contained in an amount of 30 to 98% by weight.
It is preferable to mix them in the resin. 30 coated metal particles
If the content is less than wt%, it becomes difficult to obtain desired characteristics when forming a substrate, an electronic component, a shielding material, and the like. On the other hand, if it exceeds 98 wt%, molding becomes difficult in any case.

Further, as the metal particles, particles made of one or more of silver, gold, platinum, palladium, copper, nickel, iron, aluminum, molybdenum, and tungsten can be used. Further, in the present invention, an alloy of the above metals or an alloy with another metal can be used.

The dielectric layer formed on the surface of the metal particles may be made of titanium-barium-neodymium,
Barium-tin, lead-calcium, titanium dioxide, barium titanate, lead titanate, strontium titanate, calcium titanate, alumina, bismuth titanate, magnesium titanate, titanium-
Barium-strontium system, titanium-barium-lead system, titanium-barium-zirconium system, BaTiO ₃
—SiO ₂ system, BaO—SiO ₂ system, CaWO ₄ system, B
a (Mg, Nb) O ₃ system, Ba (Mg, Ta) O ₃ system,
Ba (Co, Mg, Nb) O ₃ system, Ba (Co, Mg, Nb)
Ta) _{O 3} based ceramics and the like.

In the electronic component of the present invention, in the manufacturing process, a composite dielectric material in which metal particles having a dielectric layer formed on the surface are dispersed in a resin is used as a molding material, a powder molding powder material, a paint, It can be used as a prepreg or a substrate. Further, the composite dielectric material of the present invention can be used as a piezoelectric material by using a piezoelectric material for the dielectric layer. The composite dielectric material of the present invention can be used as a semiconductor material by adjusting the thickness of the dielectric layer and the content of particles.

When such a composite dielectric material is used, the particles are spherical and have good dispersibility. Further, since the particles having a small diameter can be obtained by the above-mentioned spray pyrolysis method, even if the size is small, the characteristics are good. Electronic components are obtained. In addition, by forming a dielectric layer that meets the purpose on the surface, the dielectric layer works effectively and the amount of expensive dielectric can be reduced.

When the dielectric-coated metal particles are used as a capacitor material, various dielectric constants can be obtained by changing the thickness of the dielectric layer and the content of the particles with respect to the resin. In addition, the composite dielectric material used has good dispersibility because the particles have a small diameter and a spherical shape, and the characteristics are stable even when the device is configured to be small.

When the composite dielectric material is used for the laminated substrate, a capacitor can be formed in the laminated substrate. Further, by changing the thickness of the dielectric layer and the mixing ratio of the particles to the resin, various types can be obtained. A layer having a dielectric constant can be obtained, and various passive elements having different characteristics can be formed in the laminated substrate.

When the composite dielectric material is used as a shielding material, it can be used as a molding material of a shield product requiring insulation, so that it can be mounted without an insulating material and mounting is easy.

Examples of the electronic component according to the present invention using a composite dielectric material in which such a surface dielectric layer of spherical metal particles are provided and dispersed and mixed in a resin include general capacitors and multilayer capacitors. , Disk capacitors, feedthrough capacitors and the like.

The electronic components according to the present invention using a semiconductor ceramic for the dielectric layer include a ring varistor, a chip varistor, an NTC thermistor, a PTC thermistor, a temperature fuse, an angle sensor, a rotation sensor, and a thermal head.

In the present invention, a piezoelectric element is used as an electronic component by using a piezoelectric material for the dielectric layer.
A surface acoustic wave element can be configured, and its applied products are piezoelectric actuators, sounders, microphones, receivers, pyroelectric sensors, ultrasonic sensors, shock sensors,
An acceleration sensor, a piezoelectric vibrating gyroscope, a surface acoustic wave filter, a piezoelectric transformer, a resonator, a ceramic filter, and the like can be obtained.

Further, the electronic component of the present invention is characterized in that the whole or a part of the surface of a metal particle or a magnetic metal particle having a substantially single crystal spherical shape and an average particle size of 0.1 to 10 μm is formed on an insulator layer And one or more kinds of the coated metal particles are dispersed in a resin.

As described above, small-sized substantially single-crystal spherical particles in which the surfaces of metal particles are covered with an insulating layer are obtained by the spray pyrolysis method described in JP-B-3-68484. be able to.

Such an insulator-coated metal is more spherical than a conventional flake or powder block obtained by crushing ferrite by mixing and dispersing in a resin. Due to its small diameter, it is mixed with the resin with good dispersibility. Also, when these particles are dispersed in a resin, even if the insulating layer is added in a small amount of 1 wt% with respect to the metal particles, it can contribute to the improvement of the insulation resistance and also improve the withstand voltage. be able to.

Further, in the composite magnetic material, the shape of the coated metal particles retains the shape before being mixed with the composite magnetic material, and the coated insulating layer is retained without being destroyed. This contributes to the improvement of the withstand voltage as described above. Further, since the surface of the metal particles is covered with the insulator layer, there is no problem of corrosion such as rust.

When these particles are produced by the spray pyrolysis method, the lower limit of the particle size is 0.05 μm and the upper limit is about 20 μm. Substantially, the average particle diameter is about 0.1 to 10 μm, and particles having a particle diameter of 0.05 to 20 μm are 95 wt%.
Particles.

Since the diameter is small and the surface is covered with an insulator, the eddy current loss, which is one of the losses as a magnetic material, is small, despite being a composite magnetic material using metal particles. Is good. Furthermore, the small diameter facilitates the production of thin electronic components.

Further, since the metal is substantially a single crystal ferromagnetic metal, electronic components and electromagnetic shielding materials using a magnetic substrate requiring magnetism, general coils, choke coils, deflection coils, high frequency coils, etc. Can be used for the core of the coil. Further, it can be used as a core of a general transformer, a pulse transformer, a transformer for data communication, a wideband SMD transformer, a directional coupler, a power combiner, and a power distributor. In addition, magnetic identification sensor, potential sensor, toner sensor, current sensor, magnetic panel, radio wave absorption sheet, thin radio wave absorber, electromagnetic shield,
It can be used for a magnetic head. Further, a molding material such as a molding material and a plastic magnet can be provided.

In the electronic component having a composite magnetic material in which the periphery of such metal particles or magnetic metal particles is covered with an insulator layer, the thickness of the insulator layer is preferably 0.005 to 2 μm. When the thickness of the insulator layer is 0.005 μm or more, it can contribute to the improvement of the dielectric constant, insulation and withstand voltage. On the other hand, if the thickness exceeds 2 μm, it becomes difficult to form a uniform insulating layer.

The thickness in this case means the maximum thickness of the coating, and the coating does not necessarily cover the entire surface of the metal particle, and may occupy about 50% of the surface of the metal particle. I just need. Further, the content of the coated metal particles is preferably 30 to 98 wt% as described above.

As described above, by covering the fine magnetic metal particles with the insulator layer, the insulation resistance is increased and the withstand voltage is also increased. Further, since the shield material and the mold material do not need to be insulated, the structure can be simplified by combining with other members without performing the insulated treatment. Even in the case of a magnetic core of a choke coil, winding can be performed without performing insulation treatment, and the structure can be simplified as well.

In the present invention, in the case of an electronic component which employs a molding method by heating and pressing, the content of the coated metal particles in the resin is preferably 90 to 98 wt%. In the case of such heating and pressing, the amount of the coated metal particles added to the resin material can be easily increased, so that the magnetic permeability can be increased. Furthermore, the use of the insulator-coated metal particles enables a highly reliable electronic component having high insulation properties to be obtained. In addition, when the composite material of the present invention is used, the insulator layer is firmly covered, so that even if the coated metal particles are deformed during pressurization, the insulator layer is hardly broken.

The electronic component of the present invention can be configured as a composite magnetic material in which the magnetic metal particles are covered with an insulating layer and formed inside or on the electronic component by printing or the like. By using such an insulator layer-coated metal particle, a high magnetic permeability can be obtained up to a high frequency range. In addition, high insulation resistance and high withstand voltage can be obtained by covering the insulator layer.

In the present invention, when forming an electronic component using a prepreg and a magnetic substrate, high magnetic permeability up to a high frequency range can be obtained by using such minute metal particles coated with an insulating layer. In addition, high insulation resistance and high withstand voltage can be obtained by covering the insulator layer.

In the case of an electronic component in which the composite magnetic material is molded by a molding method such as injection molding, transfer molding, or extrusion, a molding material for a printed circuit board on which the component is mounted, a package material for a semiconductor, and a molding material for a wound coil. Alternatively, a core or toroid of a transformer or a choke coil, a core material for a clamp filter, a housing and a cover material of a connector, a covering material of various cables, a housing of various electronic devices, and the like can be provided.
In any case, a very useful electronic component can be provided because it has excellent insulating properties and magnetic properties.

Further, a plastic magnet can be provided by taking advantage of the fact that the holding power is improved by pulverizing the magnetic metal particles. In this case, the metal material is Nd-
A hard magnetic material such as an Fe-B-based alloy, an Sm-Co-based alloy, or an Al-Ni-Co-based alloy is used, and since the surface is coated with an insulator, it is possible to provide a magnet that is resistant to rust.

In the present invention, it is of course possible to replace the resin material with a vitreous material, combine the particles by molding and baking, and form a shape according to the application.
It is also possible to realize an electronic component having a molding material that emphasizes heat resistance.

It is also possible to add not only the coated metal particles but also the glass component to the resin, or to make the coating insulating layer a glass component and to fire after molding to obtain a composite magnetic material having excellent heat resistance. It is.

For the composite material used in the present invention, for example, both a thermosetting resin and a thermoplastic resin can be used as a resin, and an epoxy resin, a phenol resin, a polyolefin resin, a polyimide resin, a polyester resin,
Polyphenylene oxide resin, melamine resin, cyanate ester resin, diallyl phthalate resin, polyvinyl benzyl ether compound resin, liquid crystal polymer, fluorine resin, polyphenylene sulfide resin, polyacetal resin, polycarbonate resin, ABS resin, polyamide resin, silicone resin, polyurethane resin And at least one of polyvinyl butyral resin, polyvinyl alcohol resin, ethyl cellulose resin, nitrocellulose resin, and acrylic resin can be used alone or in combination.

The electronic component of the present invention can be configured as a composite dielectric material and / or composite material. Such electronic components include clamp filters, common mode filters, EMC
Filter, power supply filter, power supply unit, DC-DC
There are a converter, a DC-AC converter, an inverter, a delay line, a diplexer, and the like. Further, it can be used for a duplexer, an antenna switch module, a PLL module, a front-end module, a tuner unit, a double balanced mixer, and the like in a communication device such as a mobile phone.

Further, in the electronic component according to the present invention, the composite dielectric material or the composite material may be configured to include at least one layer in which a glass cloth is embedded in a resin. By embedding the glass cloth in this way, the strength of the component can be improved.

[0061]

FIG. 1A is a sectional view showing a metal particle used in the present invention. 1 is a metal particle,
Reference numeral 2 denotes a coating layer formed on the surface. The coated metal particles are produced by a spray pyrolysis method. The spray pyrolysis method is performed using an apparatus as shown in FIG. That is, a spray nozzle 6 connected to the introduction pipe 5 of the solution to be sprayed is arranged at the upper end of the furnace tube 4 having the heating device 3 outside. Around the nozzle 6, a carrier gas introduction pipe 7 is provided.
Are concentrically arranged. Core tube 4
Is provided at the lower end of the container with a container 9 for manufacturing particles.

In this apparatus, a solution containing a metal salt and a salt for forming a dielectric layer is sprayed from the nozzle 6 and, at the same time, a carrier gas having characteristics such as oxidizing or reducing properties according to the purpose is supplied from the guide cylinder 8. While flowing, coated metal particles are formed in the furnace tube 4.

As the material of the metal particles 1 and the coating layer 2, when forming the coating layer 2 as a dielectric layer, the above-mentioned materials can be used.

The types of salts for forming the metal particles 1 and the coating layer 2 include nitrates, sulfates, oxynitrates, oxysulfates, chlorides, ammonium complexes, phosphates, carboxylates, metal alcoholates. One or two or more of thermally decomposable compounds such as resin salts, boric acid, and silicic acid are used.

These compounds such as salts are dissolved in water, an organic solvent such as alcohol, acetone and ether, or a mixture thereof. The heating temperature set by the heating device 3 is set to a temperature higher than the melting temperature of the metal particles 1.

As shown in FIG. 1 (B), the composite dielectric material is dispersed and mixed in a resin 15 by using a ball mill or the like, by using the spray pyrolysis method. obtain. As the resin 15, each of the above-described materials can be used.

If a material having magnetism is used as the material of the metal particles, it becomes a composite magnetic material, and a magnetic electronic component can be formed. As a metal for making this composite magnetic material, nickel, iron or iron and other metals (nickel, molybdenum, silicon, aluminum, cobalt, neodymium, platinum, samarium, zinc, boron, copper, bismuth, chromium, titanium Etc.) is used. In addition, alloys containing no iron, such as Mn-Al, Co-Pt, and Cu-Ni-Co, can be used.

The material for forming the coating layer 2 for the purpose of forming an insulator layer may be any oxide composition having an insulating property, such as silicon, boron, phosphorus, tin which forms a vitreous material. Elements such as zinc, bismuth, alkali metals, alkaline earth metals germanium, copper, zinc, aluminum, titanium, zirconium, vanadium, niobium, tantalum, chromium, manganese, tungsten, iron, chromium, cobalt, rare earth metals, molybdenum There is an oxide containing at least one kind.

Further, even when a composite magnetic material is obtained, the coating layer 2 may be formed of, for example, an oxide having the following dielectric properties. Specifically, titanium-
Barium-neodymium, titanium-barium-tin, titanium-barium-strontium, titanium-barium-lead, titanium-barium-zirconium, lead-calcium, titanium dioxide, barium titanate, lead titanate Ceramics, strontium titanate, calcium titanate, bismuth titanate, and magnesium titanate. Furthermore, CaWO ₄ system,
Ba (Mg, Nb) O ₃ system, Ba (Mg, Ta) O
₃ system, Ba (Co, Mg, Nb) O ₃ system, Ba (Co,
Mg, Ta) O ₃ system, BaTiO ₃ —SiO ₂ system, Ba
O-SiO ₂ -based ceramics, alumina and the like can be mentioned.

Further, the coating layer 2 for obtaining the composite magnetic material may be a magnetic oxide as shown below. The composition includes Mn-Zn ferrite, Nn-Zn ferrite, Mn-Mg-Zn ferrite, Ni-Cu-Z
Examples include n-based ferrite, Cu-Zn-based ferrite, Mn ferrite, Co ferrite, Li ferrite, Mg ferrite, and Ni ferrite. Further, hexagonal ferrite such as Ba ferrite may be used. In addition, F
Iron oxide such as e ₂ O ₃ and Fe ₃ O ₄ may be used.

The above-mentioned salts are dissolved in water, an organic solvent such as alcohol, acetone and ether, or a mixed solution thereof. The heating temperature set by the heating device 3 is set to a temperature higher than the melting temperature of the metal particles 1.

The composite magnetic material obtained as described above is used for each electronic component described later by utilizing its magnetic properties. In the production, the prepreg containing a glass cloth and a copper-clad magnetic substrate, a magnetic molding material, a magnetic paint, and a compacted magnetic powder molding material are formed by various molding methods.

The composite magnetic material obtained according to the present invention may be coated with uncoated metal particles, flattened metal particles,
It is also possible to add oxide magnetic material and oxide dielectric particles according to the desired properties.

A prepreg used for manufacturing an electronic component according to the present invention can be manufactured by a method shown in FIG. 72 or 73. In this case, the method of FIG. 72 is relatively suitable for mass production, and the method of FIG. 73 is characterized in that the film thickness can be easily controlled and the characteristics can be adjusted relatively easily. In FIG. 72, as shown in FIG. 72 (a), the glass cloth 101a wound in a roll shape is unwound from the roll 90 and is conveyed to a coating tank 92 via a guide roller 91. In the coating tank 92, a composite dielectric material or a composite magnetic material is adjusted in a slurry state. When a glass cloth passes through the coating tank 92, it is immersed in the slurry and coated on the glass cloth. At the same time, the gap in it will be filled.

The glass cloth that has passed through the coating tank 92 is introduced into a drying oven 120 via guide rollers 93a and 93b. The glass cloth impregnated with the composite dielectric material or the composite magnetic material introduced into the drying oven is dried at a predetermined temperature and time, is B-staged, is turned around by the guide roller 95, and is wound around the winding roller 130. You.

Then, when cut into a predetermined size,
As shown in (b), a prepreg in which the composite dielectric material or the composite magnetic material 102 is disposed on both surfaces of the glass cloth 101 is obtained.

Further, as shown in (c), a metal foil 100 such as a copper foil is placed on the upper and lower surfaces of the obtained prepreg, and this is heated and pressed to obtain a double-sided metal as shown in (d). A substrate with a metal foil is obtained. Heating and pressing conditions are 10
Temperature of 0 to 200 ° C, 9.8 × 10 ^{5 to} 7.84 × 10 ⁶
The pressure may be Pa (10 to 80 kgf / cm ² ), and it is preferable to mold under such conditions for about 0.5 to 20 hours. The molding can be performed in a plurality of stages under different conditions. In the case where no metal foil is provided, heating and pressing may be performed without disposing the metal foil.

Next, the manufacturing method of FIG. 73 will be described. In FIG. 73, as shown in FIG. 73A, a slurry 102a made of a composite dielectric material or a composite magnetic material is applied onto a metal foil such as a copper foil by using a doctor blade 96 or the like while keeping the clearance constant.

Then, when cut into a predetermined size,
As shown in (b), a prepreg in which the composite dielectric material or the composite magnetic material 102 is disposed on the upper surface of the metal foil 100 is obtained.

Further, the obtained prepreg is placed on both upper and lower surfaces of the glass cloth 101 with the composite dielectric material or the composite magnetic material 102 side as the inner surface, as shown in FIG. Pressing (d)
A substrate with double-sided metal foil 100 as shown in FIG. The heating and pressing conditions may be the same as described above.

The substrate and the prepreg constituting the laminated electronic component can also be obtained by kneading a material and molding a solid kneaded material in addition to the above-mentioned coating method.
In this case, since the raw material is solid, it is easy to take a thickness, and is suitable as a method for forming a relatively thick substrate or prepreg.

The kneading may be performed by a known method such as a ball mill, stirring, and a kneader. At that time, a solvent may be used if necessary. Further, it may be pelletized or powdered as necessary.

The kneaded material thus pelletized or powdered is molded by heating and pressing using a mold. As molding conditions, 100-200 ° C., 0.5-3 hours, 4.9 × 1
The pressure may be in the range of 0 ^{5 to} 7.84 × 10 ⁶ Pa ( ^{5 to} 80 kgf / cm ² ).

The thickness of the prepreg obtained in this case is about 0.05 to 5 mm. The thickness of the prepreg may be appropriately adjusted according to the desired plate thickness and the content of the dielectric powder or the magnetic powder.

Further, a metal foil such as a copper foil was placed on both the upper and lower surfaces of the prepreg obtained in the same manner as described above, and this was heated and heated.
When pressed under pressure, a substrate with double-sided metal foil is obtained. The heating and pressurizing condition is a temperature of 100 to 200 ° C., and 9.8 × 10 ⁵ to
The pressure may be 7.84 × 10 ⁶ Pa (10 to 80 kgf / cm ² ), and it is preferable to mold under such conditions for about 0.5 to 20 hours. The molding can be performed in a plurality of stages under different conditions. In the case where no metal foil is provided, heating and pressing may be performed without disposing the metal foil.

[0086] The prepreg used in the present invention can be formed by superimposing it on a copper foil and molding by heating and pressing. In this case, the thickness of the copper foil is 12 to 3
It is about 5 μm. Examples of such a substrate with a copper foil include a double-sided patterned substrate and a multilayer substrate.

FIGS. 74 and 75 are process diagrams of an example of forming a double-sided patterned substrate. As shown in FIGS. 74 and 75, a prepreg 16 having a predetermined thickness and copper (Cu) having a predetermined thickness
The foil 17 is overlaid and pressurized and heated to form (step A). Next, a through hole 18 is formed by drilling (step B). Copper (Cu) plating is performed on the formed through hole 18 to form a plating film 25 (step C). Further, the copper foil 17 on both sides is patterned to form a conductor pattern 26 (step D). Thereafter, as shown in FIG. 74, plating for connecting external terminals and the like is performed (step E). In this case, plating is performed by a method of further plating Pd after Ni plating, a method of further plating Au after Ni plating (plating is electrolytic or electroless plating), or a method using a solder leveler.

FIGS. 76 and 77 are process diagrams of an example of forming a multilayer substrate, and show an example in which four layers are stacked. As shown in FIG. 76 and FIG. 77, a prepreg 16 having a predetermined thickness and a copper (Cu) foil 17 having a predetermined thickness are overlapped and formed by applying pressure and heating (step a). Next, the copper foil 17 on both sides is patterned to form a conductor pattern 24 (step b). A prepreg 16 and a copper foil 17 each having a predetermined thickness are further laminated on both sides of the double-sided patterned substrate thus obtained,
At the same time, molding is performed by heating under pressure (step c). Next, a through hole 18 is formed by drilling (step d). Copper (Cu) plating is applied to the formed through holes to form a plating film 19 (step e). Further, the copper foil 17 on both sides is patterned to form a conductor pattern 24 (step f). Thereafter, as shown in FIG. 76, plating for connection to external terminals is performed (step g). In this case, plating is performed by a method of further plating Pd after Ni plating, a method of further plating Au after Ni plating (plating is electrolytic or electroless plating), or a method using a solder leveler.

The molding conditions for the heating and pressing are 100 to 2
At a temperature of 00 ° C., 9.8 × 10 ^{5 to} 7.84 × 10 ⁶ Pa (1
Preferably, the pressure is 0 to 80 kgf / cm ² ) for 0.5 to 20 hours.

In the present invention, not limited to the above example, various substrates can be formed. For example, it is also possible to use a substrate as a molding material or a substrate with a copper foil and a prepreg, and use the prepreg as an adhesive layer to form a multilayer.

Further, in a mode in which a substrate as a prepreg or a molding material is bonded to a copper foil, the above-described composite dielectric material or composite magnetic material, if necessary, a flame retardant, a resin, and a high boiling solvent such as butyl carbitol acetate. The composite dielectric material or the composite magnetic material paste obtained by kneading the above may be formed on a patterned substrate by screen printing or the like, whereby the characteristics can be improved.

By combining such a prepreg, a substrate with a copper foil, a laminated substrate and the like with an element constitution pattern and a constitution material, a laminated electronic component as described later can be obtained.

[0093]

EXAMPLES Hereinafter, the present invention will be described in more detail by showing specific examples of the present invention. <Embodiment 1> FIGS. 3 and 4 are views showing an inductor according to a first embodiment of the present invention. FIG. 3 is a perspective view, and FIG. 4 is a sectional view.

In the figure, the inductor 10 has constituent layers 10a to 10e made of the composite magnetic material. That is, the constituent layers 10a to 10e are substantially single-crystal spheres, and the surface of magnetic metal particles having an average particle size of 0.1 to 10 μm is coated with an insulating layer. It is composed of a composite magnetic material in which particles are dispersed in a resin.

In these constituent layers 10a to 10e, an internal conductor (coil pattern) 13 and the internal conductor 13 are formed. Via hole 1 for electrically connecting this
And 4. The inner conductor 13 is formed of each of the layers 10a to 10a.
On the surface of e, by etching, printing, sputtering, vapor deposition, plating, etc., copper, gold, silver, palladium, platinum,
It is formed of aluminum, or a multi-layer or alloy thereof. These internal conductors 13 are connected to each other by via holes 14 and are wound up as a whole in the stacking direction to form a helical inductor. The via hole 14 can be formed by drilling, laser processing, etching, or the like. The terminal ends of the formed coils are respectively connected to terminal electrodes 12 formed on the end face of the inductor 10 and land patterns 11 formed slightly in the vertical direction from the terminal electrodes 12. The terminal electrode 12 has a structure cut in half by dicing, V-cut, or the like. The reason why the terminal electrode 12 has such a structure is that a plurality of elements are formed on the collective substrate,
This is because, when finally cut into individual pieces, cutting is performed from the center of the through via.

The equivalent circuit is shown in FIG. As shown in FIG. 12A, the equivalent circuit is an electronic component (inductor) having the coil 31.

<Embodiment 2> FIGS. 5 and 6 show a second embodiment of the present invention.
FIG. 5 is a perspective view showing an inductor according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view.

In this example, unlike the coil pattern wound in the vertical direction in the first embodiment, a helical winding wound in the horizontal direction is employed. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted. The base substrate material of Example 2,
The electrode configuration method, the layer configuration method, the via configuration method, and the terminal configuration method are the same as those in the first embodiment.

<Embodiment 3> FIGS. 7 and 8 show a third embodiment of the present invention.
FIGS. 7A and 7B show a perspective view, and FIG. 8 shows a cross-sectional view of an inductor according to an embodiment of the present invention. In this example, the coil pattern wound in the vertical direction in the first embodiment has a configuration in which spirals on the upper and lower surfaces are connected. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted. The chip inductor according to the third embodiment includes an inner conductor 13
Are formed in a spiral shape, and a plurality of internal conductors 13 are connected by the via holes 14, so that a large inductance value is obtained. Further, the base substrate material, the electrode configuration method, the layer configuration method, the via configuration method, and the terminal configuration method of the third embodiment are the same as those of the first embodiment.

<Embodiment 4> FIGS. 9 and 10 are views showing an inductor according to a fourth embodiment of the present invention. FIG. 9 is a perspective view, and FIG. 10 is a sectional view. In this example, the coil pattern wound in the vertical direction in Example 1 is configured as a meander-shaped (zigzag-shaped) pattern formed inside. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted. Further, the base substrate material, the electrode configuration method, the layer configuration method, the via configuration method, and the terminal configuration method of the fourth embodiment are the same as those of the first embodiment.

<Embodiment 5> FIG. 11 is a perspective view showing an inductor according to a fifth embodiment of the present invention. In this example, an embodiment is shown in which the coils configured independently in the first embodiment are replaced with four coils. With such a configuration, it is possible to achieve space saving, downsizing of the set, and reduction in the number of parts. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted. The equivalent circuit is shown in FIG.
(B). As shown in FIG. 10B, the equivalent circuit is an electronic component (inductor) in which four coils 31a to 31d are mounted in a row.

In the inductors shown in Examples 1 to 5, the surface of a single crystal spherical magnetic metal particle is coated with an insulating layer as a magnetic material, and the coated metal particle is dispersed and mixed in a resin. High insulation, compared to ferrite,
A chip inductor having high magnetic permeability and a high inductance value or impedance value even at a high frequency can be obtained. Further, since the particles dispersed in the resin are spherical metal particles, the dispersibility is good, the workability is good, and desired characteristics are easily obtained. In addition, since a resin is used, it is lightweight and flexible. Further, even if a multilayer structure is formed using different materials, since the flexibility is higher than that of ceramics, problems such as cracks, peeling, and warping hardly occur, and a high-performance inductor can be obtained.

<Embodiment 6> FIGS. 13 and 14 are views showing a capacitor (capacitor) according to a sixth embodiment of the present invention. FIG. 13 is a perspective view, and FIG. 14 is a sectional view. . In the figure, a capacitor 20 includes constituent layers 20a to 20g having the composite dielectric material of the present invention and constituent layers 20a to 20g.
b to 20 g, an internal conductor (internal electrode pattern) 23 formed on each of the terminal electrodes 22 formed on an end face of a capacitor alternately connected to the internal conductor 23, and formed slightly in the vertical direction from the terminal electrode 22. Conductor pattern 21
It is composed of

The constituent layers 20a to 20 of the capacitor 20
g is substantially a single crystal and has a spherical average particle diameter of 0.1 to 1;
It is composed of a composite dielectric material in which the surface of a 0-μm metal particle is coated with a coating layer made of a dielectric, and one or more types of the coated metal particles are dispersed and mixed in a resin. The electrode configuration method, the layer configuration method, and the terminal configuration method of the sixth embodiment are the same as those of the first embodiment.

FIG. 16 shows an equivalent circuit of the capacitor shown in FIG.
(A). As shown in FIG. 16A, in an equivalent circuit, an electronic component (capacitor) having a capacitor 32
It has become.

<Embodiment 7> FIG. 15 is a perspective view showing a capacitor according to a seventh embodiment of the present invention. This example is an example in which the capacitors configured alone in the sixth embodiment are arranged in a plurality of arrays to form four capacitors. The layer configuration method, materials used, and terminal configuration methods of the sixth embodiment are the same as those of the sixth embodiment.
Is the same as 15, the same components as those of FIG. 13 are denoted by the same reference numerals, and description thereof will be omitted. FIG. 16B shows an equivalent circuit thereof. As shown in FIG.
The equivalent circuit is an electronic component (capacitor) having four capacitors 32a to 32d connected in series. Such a structure having a plurality of built-in capacitors is useful for reducing the size of the set and the number of components.

As in Examples 6 and 7, a composite dielectric material in which spherical metal particles coated with a dielectric layer are dispersed and mixed in a resin is used as a dielectric constituent layer, so that the ceramic crushed powder can be used as a resin. As compared with the case where the capacitors are dispersed inside, a small and high-capacity chip capacitor can be obtained. Further, since the particles dispersed in the resin are spherical metal particles, the dispersibility is good and the workability is good. Further, since the metal particles are covered with the dielectric layer, the insulation properties and the withstand voltage are improved. Also, since resin is used,

<Eighth Embodiment> FIGS. 17 to 20 show a balun transformer according to an eighth embodiment of the present invention. 17 is a transparent perspective view, FIG. 18 is a sectional view, FIG. 19 is an exploded plan view of each constituent layer, and FIG. 20 is an equivalent circuit diagram.

17 to 19, the balun transformer 4
No. 0 has an internal GND conductor 45 disposed above, below, and in the middle of the laminated body in which the constituent layers 40a to 40o are laminated, and an internal conductor 43 formed between the internal GND conductors 45. The inner conductor 43 is formed by connecting a spiral conductor 43 having a length of λg / 4 to the coupling line 5 shown in the equivalent circuit of FIG.
They are connected by via holes 44 and the like so as to form 3a to 53d.

The constituent layers 40a to 40c of the balun transformer 40
Reference numeral 40o denotes a substantially single crystal spherical metal particle having an average particle diameter of 0.1 to 10 μm, which is coated with a dielectric coating layer, and one or more of the coated metal particles are dispersed and mixed in a resin. And a composite dielectric material. Example 8
The electrode configuration method, the layer configuration method, the via configuration method, and the terminal configuration method are the same as those in the first embodiment.

In designing the balun transformer, it is preferable that the relative dielectric constant is as high as possible in consideration of miniaturization. When the composite dielectric material according to the present invention is used for the constituent layers 40a to 40o, it is possible to obtain a balun transformer having a small size and high characteristics.

In the case where this balun transformer is constructed, in the band of several hundred MHz or less, the constituent layers 40a to 40o (base)
The composite magnetic material according to the present invention can be used. As long as the magnetic material can be used, the magnetic material can increase the inductance value and the coupling can be higher than the dielectric material. Therefore, in the region of several hundred MHz or less, the use of the composite magnetic material as the base enables the balun transformer to have higher characteristics and smaller size.

Ninth Embodiment FIGS. 21 to 23 show a laminated filter according to a ninth embodiment of the present invention. Here, FIG.
1 is a perspective view, FIG. 22 is an exploded perspective view, and FIG. 23 is an equivalent circuit diagram. This multilayer filter is configured as a two-pole filter.

In FIGS. 21 to 23, the multilayer filter 6
No. 0 has a pair of strip lines 68 and a pair of capacitor conductors 67 at substantially the center of the stacked body in which the constituent layers 60a to 60e are stacked. The capacitor conductor 67 is formed on the lower constituent layer group 60d, and the strip line 68 is formed on the constituent layer 60c thereabove. Constituent layers 60a-60
A GND conductor 65 is formed at the upper and lower ends of e, so that the strip line 68 and the capacitor conductor 67 are sandwiched therebetween. The strip line 68, the capacitor conductor 67, and the GND conductor 65 are respectively connected to an end electrode (external terminal) 62 formed on the end face and a land pattern 61 formed slightly upward and downward from the end electrode (external terminal). The GND pattern 66 formed on both side surfaces and slightly in the vertical direction from the both sides is connected to the GND conductor 65.

The strip line 68 is a strip line 74a, 74b having a length of λg / 4 or less shown in the equivalent circuit diagram of FIG. 23, and the capacitor conductor 67 constitutes an input / output coupling capacitance Ci. The strip lines 74a and 74b are coupled by a coupling capacitance Cm and a coupling coefficient M.

The constituent layers 60a to 60 of the laminated filter 60
0e is composed of a composite dielectric material in which spherical metal particles covered with a dielectric layer are dispersed and mixed in a resin.

In designing such a multilayer filter, it is better to have a high dielectric constant in consideration of miniaturization.
According to the present invention, as described above, since the constituent layers are composed of the composite dielectric material having a high dielectric constant,
It is possible to provide a small-sized multilayer filter having high characteristics.

<Embodiment 10> FIGS. 24 to 26 show a laminated filter according to a tenth embodiment of the present invention. Here, FIG. 24 is a perspective view, FIG. 25 is an exploded perspective view, and FIG. 26 is an equivalent circuit diagram. Note that this multilayer filter is configured as a 4-pole.

24 to 26, the laminated filter 60
Has four strip lines 68 and a pair of capacitor conductors 67 substantially at the center of the stacked body in which the constituent layers 60a to 60e are stacked. Other components are the same as those in the ninth embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Eleventh Embodiment> FIGS. 27 to 32 show a block filter according to an eleventh embodiment of the present invention. 27 is a transparent perspective view, FIG. 28 is a front view, FIG. 29 is a side sectional view, FIG. 30 is a plan sectional view, FIG. 31 is an equivalent circuit diagram,
FIG. 32 is a transparent side view showing the structure of the mold. In addition,
This block filter is configured as a two pole.

27 to 32, the block filter 80 has a pair of coaxial conductors 81 and a capacitor coaxial conductor 82 formed in a constituent block 80a. The coaxial conductor 81 and the capacitor coaxial conductor 82 are formed of a conductor formed in a hollow shape so as to hollow out the constituent block 80a. A surface GND conductor 87 is formed around the constituent block 80a so as to cover the constituent block 80a. A capacitor conductor 83 is formed at a portion corresponding to the capacitor coaxial conductor 82. Further, the capacitor conductor 83 and the surface GND conductor 87 are also used as input / output terminals and component fixing terminals. Note that the coaxial conductor 81 and the capacitor coaxial conductor 82 are
A conductive material is adhered to the inside of a hollow hole formed by hollowing out a by electroless plating, vapor deposition, or the like to form a transmission path.

The coaxial conductor 81 is coaxial lines 94a and 94b having a length of λg / 4 or less as shown in the equivalent circuit diagram of FIG. 31, and a GND conductor 87 is formed so as to surround them. . The capacitor coaxial conductor 8
2 and the capacitor conductor 83 constitute an input / output coupling capacitance Ci. The coupling capacitance Cm is provided between the coaxial conductors 81.
And a coupling coefficient M. With such a configuration, an equivalent circuit as shown in FIG. 31 is obtained, and a block filter having a two-pole type transfer characteristic can be obtained.

FIG. 32 is a schematic sectional view showing an example of a mold for forming the constituent block 80a of the block filter 80. In the figure, the mold is a metal base 1 such as iron.
03, a resin injection port 104 and an injection hole 106 are formed, and component forming portions 105a and 105b are formed in connection with these. The composite dielectric material for forming the constituent block 80a is injected in a liquid state from the resin injection port 104, passes through the injection hole 106, and forms the component forming portions 105a,
Reaches 05b. Then, the mold is filled with a composite dielectric material (substantially single crystal spherical metal particles covered with a dielectric layer and dispersed and mixed in a resin), and then cooled or heated. A process is performed to solidify the composite dielectric material, remove the composite dielectric material from the mold, and cut unnecessary portions hardened at an injection port or the like. Thus, the configuration block 80a shown in FIGS. 27 to 30 is formed.

The building block 8 thus formed
0a is subjected to a process such as plating, etching, printing, sputtering, vapor deposition, etc., to form a surface GND conductor 87 and a coaxial conductor 8 made of copper, gold, palladium, platinum, aluminum or the like.
1 and a capacitor coaxial conductor 82 and the like.

As for the block type filter, as in the case of the multilayer type filter, it is better to have a dielectric constant as high as possible in consideration of size reduction. By using a material obtained by dispersing and mixing crystalline and spherical metal particles with a dielectric layer in a resin, a small and high-performance block filter can be obtained.

<Twelfth Embodiment> FIGS. 33 to 37 show a coupler according to a twelfth embodiment of the present invention. Here, FIG.
34 is a transparent perspective view, FIG. 34 is a sectional view, FIG. 35 is an exploded plan view of each constituent layer, FIG. 36 is an internal connection diagram, and FIG. 37 is an equivalent circuit diagram.

33 to 37, the coupler 110 is
Internal GND formed and arranged above and below a laminated body in which constituent layers 110a to 110c made of the composite dielectric material are laminated.
It has a conductor 115 and an internal conductor 113 formed between the internal GND conductors 115. This inner conductor 113
Are connected by a via hole 114 or the like in a spiral shape so that a transformer is constituted by two coils. Also. The end of the formed coil and the internal GND conductor 115
33, as shown in FIG. 33, are connected to the through vias 112 formed on the respective end faces and the land patterns 111 formed slightly in the upper and lower surface directions from the through vias 112. With this configuration, the coupler 110 in which the two coils 125a and 125b are coupled can be obtained as shown in the equivalent circuit diagram of FIG. The electrode configuration method, layer configuration method, via configuration method, and terminal configuration method in the twelfth embodiment are the same as those in the first embodiment.

The constituent layers 110a to 11 of the coupler 110
0c is preferably as small as possible, like a balun transformer or a filter, in order to realize a wider band. Also, considering the miniaturization, the relative permittivity is preferably as high as possible. As in the present invention, it is possible to obtain a compact and high-performance coupler by coating a substantially single-crystal spherical metal particle with a dielectric layer and dispersing and mixing the same in a resin for the constituent layer. Can be.

<Thirteenth Embodiment> FIGS. 38 to 40 are views showing an antenna according to a thirteenth embodiment of the present invention. FIG. 38 is a perspective view, FIG. 39 (a) is a plan view, and FIG. b) is a side sectional view, (c) is a front sectional view, and FIG. 40 is an exploded perspective view of each constituent layer.

In the figure, the antenna 130 has constituent layers 130a to 130c made of the composite dielectric material of the present invention, and internal conductors (antenna patterns) 133 formed on the constituent layers 130b and 130c, respectively. The terminal end of the internal conductor 133 is connected to a terminal electrode 132 formed on the end face of the antenna and a land pattern 131 formed slightly in the vertical direction from the terminal electrode 132. In this example, the inner conductor 133 is
It is configured as a reactance element having a length of about λg / 4, and is formed in a meander shape. The electrode configuration method, layer configuration method, via configuration method, and terminal configuration method in the thirteenth embodiment are the same as those in the first embodiment.

The constituent layers 130a-1 of the antenna 130
In the case of 30c, it is preferable that the dielectric constant is as small as possible when realizing a wider band. Also, considering the miniaturization, it is better that the dielectric constant is as high as possible.

<Embodiment 14> FIGS. 41 and 42 show an antenna according to a fourteenth embodiment of the present invention. Here, FIG.
1 is a transparent perspective view, and FIG. 42 is an exploded perspective view. The antenna in this example is configured as an antenna having a helical internal electrode.

In FIGS. 41 and 42, the antenna 140
Are the constituent layers 140a to 140c having the composite dielectric material of the present invention.
140c and internal conductors (antenna patterns) 143 formed on the constituent layers 140b and 140c, respectively.
a, 143b. And the upper and lower inner conductors 143
The a and 143b are connected by a via hole 144 to form a helical inductance element. Other components are the same as those of the thirteenth embodiment, and the same components are denoted by the same reference numerals and description thereof is omitted.

Fifteenth Embodiment FIGS. 43 and 44 are views showing a patch antenna according to a fifteenth embodiment of the present invention. FIG. 43 is a transparent perspective view, and FIG. 44 is a cross-sectional view. In the figure, a patch antenna 150 includes a constituent layer 150a made of the composite dielectric material of the present invention, and a patch conductor 159 (antenna pattern) formed on the constituent layer 150a.
And the constituent layer 15 so as to face the patch conductor 159.
And a GND conductor 155 formed on the bottom surface of Oa.
The patch conductor 159 has a through conductor 154 for power supply.
Are connected by a feeder 153, and this through conductor 154
The GND conductor 15 is connected so as not to be connected to the ND conductor 155.
5, a gap 156 is provided. For this reason, power is supplied from the lower part of the GND conductor 155 through the through conductor 154.

Embodiment 16 FIGS. 45 and 46 are views showing a patch antenna according to a sixteenth embodiment of the present invention. FIG. 45 is a transparent perspective view, and FIG. 46 is a sectional view.

In the figure, a patch antenna 160 has a constituent layer 160a having the composite dielectric material of the present invention, a patch conductor 169 (antenna pattern) formed on the constituent layer 160a, and faces the patch conductor 169. Conductor 1 formed on the bottom surface of constituent layer 160a as described above.
65. A power supply conductor 161 for power supply is arranged near the patch conductor 169 so as not to come into contact with the patch conductor 169, and power is supplied from the power supply terminal 162 via the power supply terminal 162. The power supply terminal 162 performs a process such as plating, termination, printing, sputtering, or vapor deposition, and performs copper, gold,
It can be formed of palladium, platinum, aluminum, or the like. Other components are the same as those of the fifteenth embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Embodiment 17> FIGS. 47 and 48 are views showing a multilayer patch antenna according to a seventeenth embodiment of the present invention. FIG. 47 is a perspective view, and FIG. 48 is a sectional view. is there. In the figure, a patch antenna 170 includes constituent layers 150a and 150b having a composite dielectric material of the present invention, patch conductors 159a and 159e formed on the constituent layers 150a and 150b, and patch conductors 159a and 159a.
And a GND conductor 155 formed on the bottom surface of the constituent layer 150b so as to face the portion 59e. Also, patch conductor 1
A power supply through conductor 154 is provided on the power supply section 153a.
The through conductor 154 is connected to the GND conductor 155
And GN so as not to be connected to patch conductor 159e.
A gap 156 is provided between the D conductor 155 and the patch conductor 159e. Therefore, the GND conductor 15
5 through the through conductor 154 and the patch conductor 15
9a is supplied with power. At this time, power is supplied to the patch conductor 159e by capacitive coupling with the patch conductor 159a and capacitance formed by a gap with the through conductor 154. The other components are the same as those in Embodiment 15.
The same components are denoted by the same reference numerals and description thereof will be omitted.

<Embodiment 18> FIGS. 49 and 50 show a multiple patch antenna according to an eighteenth embodiment of the present invention. FIG. 49 is a perspective view and FIG. 50 is a sectional view. ing. In this example, a mode is shown in which the patch antennas configured independently in the seventeenth example are arranged in a plurality of arrays so as to be four in a row. In the drawing, constituent layers 150a and 150b having the composite dielectric material of the present invention and patch conductors 159a and 159a formed on the constituent layers 150a are shown.
59b, 159c, 159d and patch conductors 159e, 159f, 159 formed on the constituent layer 150b.
g, 159h, and GN formed on the bottom surface of the constituent layer 150b so as to face the patch conductors 159a, 159e.
And a D conductor 155. Other components are the first embodiment.
7 is the same as that of FIG. 7, and the same components are denoted by the same reference numerals and description thereof will be omitted.

By forming such an array, it is possible to reduce the size of the set and the number of parts.

With respect to the antennas of Embodiments 13 to 18,
Considering miniaturization, it is better that the dielectric constant is as high as possible.
As in the present invention, a compact and high-performance antenna can be obtained by coating a substantially single-crystal spherical metal particle with a dielectric layer and dispersing and mixing the same in a resin for the constituent layer. Can be.

<Embodiment 19> FIGS. 51 to 53 show a VCO (Voltage Controlled Oscillator) according to a nineteenth embodiment of the present invention. 51 is a transparent perspective view, FIG. 52 is a sectional view, and FIG. 53 is an equivalent circuit diagram.

In FIGS. 51 to 53, the VCO includes an electronic component 261 such as a capacitor, an inductor, a semiconductor, and a resistor formed and arranged on a laminated body 210 on which constituent layers 210a to 210g are stacked. ~ 21
It has conductor patterns 262, 263, and 264 formed in 0g and on the upper and lower surfaces thereof. The electrode configuration method, the layer configuration method, the via configuration method, and the terminal configuration method in the nineteenth embodiment are the same as those in the first embodiment.

Since this VCO is constituted by an equivalent circuit as shown in FIG. 53, it has a resonator, a capacitor, a signal line, a semiconductor, a power supply line and the like. For this reason, it is efficient to form the constituent layers with materials suitable for each function. The configuration shown here is one example, and there are other configuration examples.

In this example, the constituent layers 21 forming the resonator
For 0f and 210g, a composite dielectric material adjusted to have a dielectric constant suitable for the resonance frequency is used.
A composite dielectric material having a dielectric constant of 5 to 40 is used for 210e. In addition, the wiring and the inductor constituent layer 2
For 10a and 210b, a composite dielectric material having a lower dielectric constant than the capacitor is used.

The strip lines 263, G serving as internal conductors are provided on the surfaces of the constituent layers 210a to 210g.
The ND conductor 262, the capacitor conductor 264, the wiring inductor conductor 265, and the terminal conductor 266 are formed. Each internal conductor is vertically connected by a via hole 214, and a mounted electronic component 261 is mounted on the surface to form a VCO as shown in an equivalent circuit of FIG.

With such a configuration, since a material suitable for each function is configured for each layer, high performance, miniaturization, and thinning can be achieved.

Embodiment 20 FIGS. 54 to 56 show a power amplifier (power amplifier) according to a twentieth embodiment of the present invention. Here, FIG. 54 is an exploded plan view of each constituent layer, and FIG.
Is an equivalent circuit diagram, and FIG. 56 is a sectional view.

In FIGS. 54 to 56, the power amplifier
Electronic components 361 such as capacitors, inductors, semiconductors, and resistors formed and arranged on a laminated body in which the constituent layers 300a to 300e are stacked;
It has conductor patterns 313 and 315 formed in 0e and on the upper and lower surfaces thereof. 314 is a via hole for connecting the internal conductors.

Since this power amplifier is constituted by an equivalent circuit as shown in FIG.
11 to L17, capacitors C11 to C20, signal lines, power supply lines to semiconductors, and the like. For this reason, it is efficient to form the constituent layers with materials suitable for each function. The configuration shown here is one example, and there are other configuration examples.

In this example, a composite dielectric material adjusted to have a dielectric constant suitable for the frequency to be used is used for the constituent layers 300d and 300e constituting the strip line. Further, the dielectric constant of the capacitor constituent layers 300a to 300c is 5 to 40.
Is used.

The method of forming electrodes, the method of forming layers, the method of forming vias, and the method of forming terminals in the twentieth embodiment are the same as those in the first embodiment.

With this configuration, materials suitable for each function are formed for each layer, so that high performance, miniaturization, and thinning can be achieved.

<Embodiment 21> FIGS. 57 to 59 show a superposition module used in an optical pickup and the like according to a twenty-first embodiment of the present invention. Here, FIG. 57 is an exploded plan view of each constituent layer, FIG. 58 is a sectional view, and FIG. 59 is an equivalent circuit diagram.

In FIGS. 57 to 59, a superimposed module includes a capacitor, an inductor, a semiconductor, and a capacitor formed and arranged on a stacked body in which constituent layers 400a to 400k are stacked.
An electronic component 461 such as a register and the constituent layers 400a to
It has conductor patterns 413 and 415 formed in 400k and on the upper and lower surfaces thereof. Since this superimposition module is constituted by an equivalent circuit as shown in FIG. 59,
Inductors L21 and L23, capacitors C21 and C2
7, a signal line, a power supply line to a semiconductor, and the like. For this reason, it is efficient to form the constituent layers with materials suitable for each function. The configuration shown here is an example,
There are other configuration examples.

In this example, the capacitor constituting layers 400d to 400d
For 400h, a composite dielectric material adjusted to have a dielectric constant of 10 to 40 is used. Further, constituent layers 400a to 400c, 400j to 400 constituting an inductor and the like.
For k, a material having a relatively low dielectric constant is used. The internal conductors 41 are provided on the surfaces of the base materials 400a to 400k.
3, a GND conductor 415 and the like are formed. Each internal conductor is vertically connected by a via hole 414, and a mounted electronic component 461 is mounted on the surface to form a superimposed module as shown in the equivalent circuit of FIG. The method of forming electrodes, the method of forming layers, the method of forming vias, and the method of forming terminals in Example 21 are the same as those in Example 1.

With this configuration, materials suitable for each function are formed for each layer, so that high performance, miniaturization, and thinning can be achieved.

<Embodiment 22> FIGS. 60 to 64 show an RF unit according to a twenty-second embodiment of the present invention. Here, the RF unit is used for a wireless communication device such as a mobile phone, and FIG. 60 is a perspective view, FIG. 61 is a perspective view with an exterior member removed, FIG. 62 is an exploded perspective view of each constituent layer, FIG.
Is a sectional view, and FIG. 64 is a block diagram. The RF unit includes a PLL circuit 520 and a VCO 52 as shown in FIG.
1. power amplifier module 5 including hybrid circuit 522, mixer 523, bandpass filter 524, amplifier 525, coupler 526, and isolator 527
29, an antenna 530, a front-end module 533 including a low-pass filter, a 531 and a duplexer 532, amplifiers 534 to 536, and a band-pass filter 5.
37, 538, mixers 539, 540, and a surface acoustic wave filter 541.

In FIGS. 60 to 63, the RF unit is:
An electronic component 561 such as a capacitor, an inductor, a semiconductor, or a resistor formed and arranged on the laminated body 500 in which the constituent layers 500a to 500i are stacked;
a to 500i and conductor patterns 513, 515, 572 formed on the upper and lower surfaces thereof and an antenna pattern 573. This RF unit, as described above,
It has an antenna, a filter, an inductor, a capacitor, a signal line, a power supply line to a semiconductor, and the like. For this reason, it is efficient to form the constituent layers with materials suitable for each function. The configuration shown here is one example, and there are other configuration examples.

In this example, a composite dielectric material having a dielectric constant adjusted in accordance with a used frequency is used for the antenna configuration, the strip line configuration, and the wiring layers 500a to 500d and 500g. Capacitor constituent layers 500e to 500
For f, a composite dielectric material whose dielectric constant is adjusted to be as high as about 10 to 40 is used. Power line layer 500h-500
For i, a composite magnetic material obtained by dispersing and mixing the coated magnetic metal particles whose magnetic permeability is adjusted to about 3 to 20 in a resin is used.

Then, these constituent layers 500a to 500a
On the surface of i, an internal conductor 513, a GND conductor 515, an antenna conductor 573, and the like are formed. Also, the respective inner conductors are vertically connected by via holes 514,
The mounted electronic component 561 is mounted on the surface, and R
An F unit is formed.

With this configuration, by using a material suitable for each function for each layer, it is possible to achieve higher performance, smaller size, and thinner.

Embodiment 23 FIGS. 65 and 66 show a resonator according to a twenty-third embodiment of the present invention. Here, FIG.
Is a transparent perspective view, and FIG. 66 is a sectional view. In FIGS. 65 and 66, a resonator is formed in a through-hole-shaped coaxial conductor 641 in a base material 610 made of the composite dielectric material according to the present invention.
Are formed. The formation method is the same as that of the block filter of the eleventh embodiment. That is, plating, etching, printing, sputtering, evaporation, and the like are performed on the base material 610 that has been molded, and copper, gold, palladium, platinum,
Surface GND conductor 64 formed of aluminum or the like
7, and the surface GND conductor 647 and the end electrode 682
To form a coaxial conductor 641 connected to the coaxial conductor 641, and a resonator HOT terminal 681 connected to the coaxial conductor 641. The coaxial conductor 641 is a coaxial line having a certain characteristic impedance, and has a surface GND so as to surround these lines.
A conductor 647 is formed.

Embodiment 24 FIGS. 67 and 68 show a strip resonator according to a twenty-fourth embodiment of the present invention. Here, FIG. 67 is a transparent perspective view, and FIG. 68 is a cross-sectional view. FIG.
7 and 68, the strip resonator includes a rectangular strip conductor 784 and a rectangular GND conductor arranged so as to sandwich the strip conductor 784 from above and below via a constituent layer (base) 710 made of the composite dielectric material. 783. A HOT terminal 781 for a resonator and a GND terminal 782 are formed and connected to both ends of the strip conductor 784. Other forming methods are the same as those of the inductor of the first embodiment.

<Embodiment 25> FIG. 69 shows a twenty-fifth embodiment of the present invention.
FIG. 4 is a transparent perspective view showing the resonator of the embodiment. In FIG. 69, the resonator has two base materials
Two through-hole-shaped coaxial conductors 841 and 842 are formed. The surface GND conductor 847, the coaxial conductor 842 connected to the surface GND conductor 847 by the end electrode 882, the coaxial conductor 841 connected to the coaxial conductor 842 via the connection electrode 885, and the coaxial conductor 8
The resonator HOT terminal 881 and the like connected to 41 are formed. The coaxial conductors 841 and 842 are coaxial lines having a certain characteristic impedance, and a surface GND conductor 847 is formed so as to surround them.

<Embodiment 26> FIG. 70 shows a twenty-sixth embodiment of the present invention.
FIG. 4 is a transparent perspective view showing the strip resonator of the embodiment of FIG.
In FIG. 70, the strip resonator has a constituent layer 810 made of the composite dielectric material as in the twenty-fourth embodiment. Example 26 is different from Example 24 in that the strip conductor 884 is folded back. The strip conductor 884 is a strip line having a certain characteristic impedance as described above. Strip conductor 884
Form an internal ground conductor 883 so as to sandwich it. At this time, the HOT terminal 881 and the ground terminal 8
Reference numeral 82 denotes a strip conductor formed on one side surface of the base and bent so that both ends of the strip conductor 884 are connected thereto. Thus, an equivalent circuit of the resonator shown in FIG. 71 is formed. In FIG. 71, a resonator HOT terminal 981 is connected to one end of a resonator 984, 941 formed of a coaxial path or a strip line, and the other end is connected to a GND terminal 982.
FIG. 71 is also represented as an equivalent circuit of the resonators of Examples 23 to 25.

As for the resonator, the larger the permittivity is, the smaller the size of the resonator becomes. As in the present invention, the average particle size of a substantially single crystal is 0.1 to 10 μm, the surface of spherical metal particles is coated with a dielectric layer, and the coated metal particles are dispersed in a resin. By using a composite dielectric material, the size can be reduced.

In addition to these, it is possible to produce a multilayered and small isolator and circulator. Further, by appropriately combining the components of the above-described embodiments, further integration and miniaturization can be achieved. For example, products such as the front end module 533 including the antenna and the power amplifier module 529 including the isolator 527 shown in FIG. 64 can be miniaturized and integrated by using the composite dielectric material or the composite magnetic material of the present invention. Becomes

In each of the above examples, if necessary, halides such as halogenated phosphoric acid esters and brominated epoxy resins, organic compounds such as phosphoric acid ester amides, and inorganic compounds such as antimony trioxide and aluminum hydride. A flame retardant such as a material may be added to each constituent layer. Also,
In each embodiment, the glass cloth is buried in the constituent layer as needed. Also, not all layers need to be made of the same material, and some or all of the layers may be made of different materials.

[0169]

As described above, according to the present invention, the whole or a part of the surface of a substantially spherical metal particle having an average particle diameter of 0.1 to 10 μm is covered with a dielectric layer or an insulator layer. Since one or more kinds of the coated particles are dispersed in a resin, a flexible electronic component having a small size, good workability, a low specific gravity, and a small dielectric strength can be provided. Also, since the surface of the metal particles is covered with an insulator layer,
Insulation resistance and pressure resistance are increased.

When a magnetic material is formed by coating the surface of magnetic metal particles with an insulating layer, an electronic component having excellent high-frequency characteristics can be obtained as compared with a magnetic material in which metal particles are dispersed and mixed in a resin. Can be provided.

Further, even if the layers are made of different materials,
Since the flexibility is higher than that of ceramics, problems such as cracks, peeling, and warping hardly occur, and high-performance electronic components can be obtained.

Further, since there is no process such as baking or thick film printing, it is easy to manufacture and a line design which does not cause any trouble can be realized. When a glass cloth is embedded in the base, a high-strength electronic component can be obtained. Further, if a flame retardant is added, an electronic component having high flame retardancy can be obtained.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view of particles used in the present invention,
(B) is a sectional view showing an example of a composite material used in the present invention.

FIG. 2 is a configuration diagram showing an example of an apparatus used for generating particles by spray pyrolysis in the present invention.

FIG. 3 is a diagram showing an inductor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 4 is a diagram showing an inductor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 5 is a view showing an inductor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 6 is a diagram showing an inductor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 7 is a diagram illustrating an inductor that is a configuration example of the multilayer electronic component of the present invention.

FIG. 8 is a diagram showing an inductor that is a configuration example of the multilayer electronic component of the present invention.

FIG. 9 is a diagram showing an inductor that is a configuration example of the multilayer electronic component of the present invention.

FIG. 10 is a view showing an inductor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 11 is a view showing an inductor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 12 is an equivalent circuit diagram showing an inductor that is a configuration example of the multilayer electronic component of the present invention.

FIG. 13 is a view showing a capacitor as a configuration example of the multilayer electronic component of the present invention.

FIG. 14 is a diagram showing a capacitor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 15 is a view showing a capacitor which is a configuration example of the multilayer electronic component of the present invention.

FIG. 16 is an equivalent circuit diagram showing a capacitor as a configuration example of the multilayer electronic component of the present invention.

FIG. 17 is a view showing a balun transformer which is a configuration example of the multilayer electronic component of the present invention.

FIG. 18 is a view showing a balun transformer as a configuration example of the multilayer electronic component of the present invention.

FIG. 19 is a diagram showing a balun transformer which is a configuration example of the multilayer electronic component of the present invention.

FIG. 20 is an equivalent circuit diagram showing a balun transformer which is a configuration example of the multilayer electronic component of the present invention.

FIG. 21 is a view showing a multilayer filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 22 is a diagram illustrating a multilayer filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 23 is an equivalent circuit diagram showing a multilayer filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 24 is a diagram showing a multilayer filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 25 is a view showing a multilayer filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 26 is an equivalent circuit diagram showing a multilayer filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 27 is a diagram showing a block filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 28 is a diagram showing a block filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 29 is a diagram showing a block filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 30 is a diagram showing a block filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 31 is a diagram showing an equivalent circuit of a block filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 32 is a view showing a mold of a block filter which is a configuration example of the multilayer electronic component of the present invention.

FIG. 33 is a diagram illustrating a coupler that is a configuration example of the multilayer electronic component of the present invention.

FIG. 34 is a diagram illustrating a coupler that is a configuration example of the multilayer electronic component of the present invention.

FIG. 35 is a diagram illustrating a coupler that is a configuration example of the multilayer electronic component of the present invention.

FIG. 36 is a diagram showing an internal connection of a coupler which is a configuration example of the multilayer electronic component of the present invention.

FIG. 37 is a diagram showing an equivalent circuit of a coupler which is a configuration example of the multilayer electronic component of the present invention.

FIG. 38 is a diagram showing an antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 39 is a view showing an antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 40 is a diagram showing an antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 41 is a view showing an antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 42 is a diagram illustrating an antenna that is a configuration example of the multilayer electronic component of the present invention.

FIG. 43 is a view showing a patch antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 44 is a view showing a patch antenna which is a configuration example of the laminated electronic component of the present invention.

FIG. 45 is a view showing a patch antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 46 is a diagram showing a patch antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 47 is a view showing a patch antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 48 is a view showing a patch antenna which is a configuration example of the laminated electronic component of the present invention.

FIG. 49 is a view showing a patch antenna which is a configuration example of the multilayer electronic component of the present invention.

FIG. 50 is a view showing a patch antenna which is a configuration example of the laminated electronic component of the present invention.

FIG. 51 is a VCO as a configuration example of the multilayer electronic component of the present invention.
FIG.

FIG. 52 shows a VCO as a configuration example of the multilayer electronic component of the present invention.
FIG.

FIG. 53 is a VCO as a configuration example of the multilayer electronic component of the present invention.
FIG.

FIG. 54 is a diagram illustrating a power amplifier that is a configuration example of the multilayer electronic component of the present invention.

FIG. 55 is an equivalent circuit diagram showing a power amplifier that is a configuration example of the multilayer electronic component of the present invention.

FIG. 56 is a diagram showing a power amplifier that is a configuration example of the multilayer electronic component of the present invention.

FIG. 57 is a diagram showing a superposition module which is a configuration example of the multilayer electronic component of the present invention.

FIG. 58 is a diagram showing a superposition module which is a configuration example of the multilayer electronic component of the present invention.

FIG. 59 is an equivalent circuit diagram showing a superposition module which is a configuration example of the multilayer electronic component of the present invention.

FIG. 60 is a diagram showing an RF unit which is a configuration example of the multilayer electronic component of the present invention.

FIG. 61 is a diagram illustrating an RF unit that is a configuration example of the multilayer electronic component of the present invention.

FIG. 62 is a diagram illustrating an RF unit that is a configuration example of the multilayer electronic component of the present invention.

FIG. 63 is a diagram showing an RF unit that is a configuration example of the multilayer electronic component of the present invention.

FIG. 64 is a block diagram illustrating an RF unit that is a configuration example of the multilayer electronic component of the present invention.

FIG. 65 is a diagram showing a resonator that is a configuration example of the multilayer electronic component of the present invention.

FIG. 66 is a diagram showing a resonator that is a configuration example of the multilayer electronic component of the present invention.

FIG. 67 is a view showing a resonator which is a configuration example of the multilayer electronic component of the present invention.

FIG. 68 is a view showing a resonator which is a configuration example of the multilayer electronic component of the present invention.

FIG. 69 is a view showing a resonator which is a configuration example of the multilayer electronic component of the present invention.

FIG. 70 is a view showing a resonator which is a configuration example of the multilayer electronic component of the present invention.

FIG. 71 is a diagram showing an equivalent circuit of a resonator which is a configuration example of the multilayer electronic component of the present invention.

FIG. 72 is a process drawing showing an example of forming a substrate with a copper foil used in the present invention.

FIG. 73 is another process drawing showing the example of forming the substrate with copper foil used in the present invention;

FIG. 74 is a process diagram illustrating an example of forming a substrate with a copper foil.

75 is another process diagram showing the example of forming the substrate with a copper foil; FIG.

FIG. 76 is a process view showing an example of forming a multilayer substrate;

FIG. 77 is a process view showing an example of forming a multilayer substrate.

[Explanation of symbols]

 1: metal particles 2: covering layer 10 inductor 10a to 10e constituent layer 11 land pattern 12 through via 13 internal conductor (coil pattern) 14 via hole 15: resin 20 capacitor 20a to 20g constituent layer 21 conductor pattern 22 through via 23 internal conductor ( Internal electrode pattern) 40 Balun transformer 40a to 40o Constituent layer 45 GND conductor 43 Internal conductor 60 Multilayer filter 80 Block filter 110 Coupler 130, 140 Antenna 150, 160, 170 Patch antenna

Claims (7)

[Claims] 1. A surface of a substantially spherical metal particle having an average particle diameter of 0.1 to 10 .mu.m, which is entirely or partially coated with a dielectric layer, and one or more kinds of the coated particle are dispersed in a resin. An electronic component comprising a composite dielectric material. 2. The electronic component according to claim 1, wherein said dielectric layer has a thickness of 0.005 to 2 μm. 3. A metal particle having a substantially single crystal spherical shape and an average particle size of 0.1 to 10 μm is entirely or partially coated with an insulating layer, and the coated metal particle is made of one kind. An electronic component comprising a composite material dispersed in a resin as described above. 4. The whole or a part of the surface of a magnetic metal particle having a substantially single crystal spherical shape and an average particle size of 0.1 to 10 μm is coated with an insulating layer. An electronic component comprising a composite material that is dispersed in a resin in more than one kind. 5. The electronic component according to claim 3, wherein said insulator layer has a thickness of 0.005 to 2 μm. 6. The electronic component according to claim 1, wherein the composite dielectric material and / or the composite material are compounded. 7. The electronic component according to claim 1, wherein the composite dielectric material or the composite material includes at least one layer in which glass cloth is embedded in a resin. .