JP2001308569A - Heat radiating structure of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently radiate to the outside heat that is generated by electronic components being incorporated in equipment. SOLUTION: The three legs of metal components 2 is inserted into a hole that is provided at the three legs of resins 4 so that the legs are exposed to the inside of the resin components 4. The leg of the resin components 4 where the metal components 2 are assembled is inserted into gaps 17a-17c that are provided between CCDs 15a-15c and substrates 16a-16c. At this time, the leg of the metal components 2 is brought into contact with the CCDs 15a-15c, and the leg of the resin components 4 is inserted between the leg of the metal components 2 and the substrates 16a-16c. Also, the metal components 2 are fixed to a metal frame whose one portion is an armored part using screws. Heat being generated by the CCDs 15a-15c is directly propagated through the leg of the metal components, the metal frame, and the armored part, and is radiated into the fresh air efficiently.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a video camera C
The present invention relates to a heat dissipation structure of an electronic component that dissipates heat generated by an electronic component such as a CD.

[0002]

2. Description of the Related Art In recent years, in a video camera, heat generated inside the device has been easily trapped due to miniaturization of the device and high integration of circuits. In a video camera, a CCD used as an image sensor is one of heat sources.
One. Therefore, conventionally, in order to suppress a rise in the temperature inside the device, a metal heat radiating component is attached to the CCD and the heat is radiated into the device, or the heat is radiated by fixing the heat radiating component to a metal frame or the like inside the device. Was.

[0003]

However, in the conventional heat dissipating parts, heat is hard to be transmitted to the exterior surface of the equipment that is releasing heat, and heat is not efficiently dissipated. In particular, 3
In a video camera in which three CCDs are arranged in a prism block composed of two prisms, the shape of the prism block varies greatly, and it is difficult to fix the heat radiation component to another component. For this reason, variations in shape are absorbed by a method such as sandwiching rubber or the like having thermal conductivity, but there is a problem that heat can not be efficiently radiated due to a decrease in thermal conductivity.

Accordingly, an object of the present invention is to provide a heat radiation structure of an electronic component capable of efficiently radiating heat generated by an electronic component disposed in a device to the outside.

[0005]

In order to achieve the above object, a heat radiating structure for an electronic component according to the first aspect of the present invention is a heat radiating structure for an electronic component that radiates heat generated by an electronic component mounted on a substrate. In a gap provided between the substrate and the electronic component, a metal member temporarily fixed to a resin member is inserted, and the metal member is brought into contact with a heating surface of the electronic component,
Preferably, the metal component is fixed to a metal frame also serving as an exterior of a device in which the electronic component is built.

In a preferred embodiment, the metal member is temporarily attached to the resin member so as to be movable in a direction of insertion into the gap. It may be stopped.

[0007] In a preferred embodiment, for example, in the heat dissipating structure for an electronic component according to the first or second aspect, the fixing position of the metal component and the frame is set to a gap between the metal components. May be adjustable in a direction perpendicular to the insertion direction of the.

In a preferred aspect, in the heat dissipation structure for an electronic component according to the first aspect, at least a part of the resin member is disposed between the metal member and the substrate. It may be inserted.

According to the present invention, a metal member temporarily fixed to a resin member is inserted into a gap provided between the substrate and the electronic component, and the metal member is brought into contact with a heating surface of the electronic component.
The metal component is fixed to a metal frame also serving as an exterior of a device in which the electronic component is built. Therefore, it is possible to efficiently radiate the heat generated by the electronic components provided in the device to the outside.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to FIGS.
An example in which the present invention is applied to a video camera including three CCDs arranged in a prism block composed of three prisms will be described with reference to the drawings.

FIG. 1 is a perspective view showing a structure of a heat radiation component according to an embodiment of the present invention. The heat dissipating component 1 includes a metal component 2 and a resin component 3 shown in the drawing. The metal component 2 is formed from a metal member having high thermal conductivity such as copper. The metal part 2 has a leg 3 at a position corresponding to a CCD arranged for three prisms described later.
a, 3b and 3c are provided. Next, the resin component 4
Is formed from a resin member having appropriate elasticity.
The resin component 4 has legs 3a, 3b,
Legs 5a, 5b, 5c are provided at positions corresponding to 3c, and holes for inserting legs 3a, 3b, 3c of metal component 2 are respectively formed in legs 5a, 5b, 5c. Part 6
a, 6b and 6c are provided.

Also, the legs 3a, 3b,
3c are provided with holes 7a, 7b, 7c for positioning and fixing with respect to the resin component 4, respectively.
On the other hand, the resin component 4 has legs 3a, 3b,
Projections 8a, 8b, 8c are formed at positions corresponding to 3c. That is, the holes 7a, 7
The protrusions 8a, 8b, and 8c of the resin component 4 are positioned and fixed by fitting into the b and 7c. Further, screw holes 9 and 10 for fixing the heat radiating component 1 to a metal frame to be described later are provided at a central portion of the metal component 2 and a corresponding position of the resin component 4, respectively. By fixing the heat radiating component 1 to the frame, heat is easily radiated to the outside, and the heat radiation efficiency is improved.

FIG. 2 is a perspective view showing a state where the metal part 2 is assembled to the resin part 4. FIG. 3 is a top view showing the heat radiating component 1 in a state where the metal component 2 is assembled to the resin component 4. FIG. 4 is a plan view of the heat dissipating component 1 as seen from the leg direction. Further, FIG.
FIG. 2 is a side view of the heat radiating component 1 viewed from a lateral direction. The metal part 2 has its legs 3a, 3b, 3c connected to the holes 6a, 5b, 5c provided in the legs 5a, 5b, 5c of the resin component 4.
In the form of being inserted into 6b, 6c, the resin component 4 is assembled so as to cover the resin component 4 from above and to be in close contact with the resin component 4. At this time, the inner surfaces of the legs 3a, 3b, 3c of the metal component 2 inserted into the holes 6a, 6b, 6c are exposed, and the outer surfaces of the legs 3a, 5b,
5c.

More specifically, the legs 3a, 3 of the metal part 2
Holes 30a, 30b, and 30c are provided in b and 3c, and claws 31a, 31b, and 31c are provided at positions where the legs 5a, 5b, and 5c of the resin component 4 face each other. I have. Claw part 31 in the leg part of resin part 4
a, 31b, 31c are locked in the holes 30a, 30b, 30c in the legs of the metal component 2 so that the metal component 2
Is temporarily fixed to the resin component 4. The holes 30a, 30b, and 30c in the legs of the metal component 2 are attached to the resin component 4 so that the metal component 2 can move to some extent freely in the direction of arrow A shown in the drawing. It is formed large in the direction of arrow A. This is to absorb a shape variation of the prism block described later. The legs 5a, 5b, 5c of the resin component 4 are CCDs respectively arranged for three prisms described later.
And a driving board of the CCD.

Next, FIG. 6 is a schematic diagram showing a lens block on which a CCD to which the above-mentioned heat radiating component is actually mounted is arranged. FIGS. 7A and 7B are perspective views showing a state before and after the heat radiation component is incorporated in the CCD shown in FIG. The lens block 12
It comprises an optical system, a mechanism for driving the optical system, three prism blocks, a CCD, and the like. Behind the lens block 12, three prism blocks 1
3 is arranged via the prism holder 14. The prism block 13 includes three prisms 13a, 13b,
13c. Prisms 13a, 13b,
13c, as shown in FIG.
15b and 15c (hatched portions in the figure) are arranged.
The CCDs 15a, 15b, 15c are composed of IC type chips, and each has a substrate 16a, 16b, 16c on which a drive circuit, a signal processing circuit and the like are assembled.

Gaps 17a, 17b are provided between the CCDs 15a, 15b, 15c and the substrates 16a, 16b, 16c.
b, 17c, and the gaps 17a, 17b,
17c, the leg 5 of the resin component 4 of the heat radiation component 1 described above.
a, 5b and 5c are inserted. Here, the heat radiation component 1
Positioned by the prism holder 14. Therefore, for example, even when an external force is applied to the heat dissipating component 1 to attach the heat dissipating component 1, no force is directly applied to the prism block 13 and no misregistration occurs. Also, by disposing the legs 5a, 5b, 5c of the resin component 4 on the sides of the substrates 16a, 16b, 16c, the legs 3a, 3b, 3c of the metal component 2 and the substrates 16a, 16b, 16c.
This prevents a short circuit with c.

Next, FIGS. 8A and 8B are a top view and a front view showing a state before the lens block to which the heat radiating component is attached is attached to the exterior component. FIG.
(A), (b) is the top view and front view which show the state which attached the lens block to which the heat radiation component was attached to the exterior component. The exterior component 20 is formed of, for example, a metal member such as magnesium. As shown in FIGS. Part) 21b. The device frame portion 21b is formed from a metal member, and as shown in FIGS.
Is attached to the lens block 12 and the exterior component 2
0, the prism block 13,
CCDs 15a, 15b, 15c, substrates 16a, 16b,
16c and the heat dissipating component 1 are housed so as to cover them (U-shaped). At this time, the metal plate 22 constituting the device frame portion 21b and the metal component 2 of the heat radiating component 1 are in surface contact.

The metal plate 22 has a metal part 2
A screw hole 23 is provided at a position corresponding to the screw hole 9 provided in the screw hole 9. In other words, as shown in FIGS. 9A and 9B, in a state where the lens block 12 to which the heat radiating component is attached is fitted to the exterior component 20, the metal component 2 of the heat radiating component 1 has its own screw. It is fixed to the metal plate 22 with fixing screws 24 through the holes 9 and the screw holes 23 of the metal plate 22. Thereby, the metal component 2 of the heat radiating component 1 and the metal plate 22 come into close contact with each other on the surface, and the heat radiation efficiency is improved. Since the diameter of the screw hole 23 of the metal plate 22 is larger than the diameter of the fixing screw 24, the metal component 2 of the heat radiating component 1 and the metal plate 22 are fixed to each other.
No external force is applied to the prism block 13 at the time of fixing.

According to the above-described embodiment, the CCD 15
a, 15b, and 15c generate heat directly from the metal component 2
, 3b, 3c, the device frame portion 21b, and the exterior portion 21a, and can efficiently radiate heat to the outside air. Further, the heat radiating component 1 is connected to the device frame portion 21b.
When fixing to the metal plate 22 of the
Since the diameter of the screw hole 23 is larger than the diameter of the fixing screw 24, no stress is applied to the prism block 13, so that the occurrence of misregistration can be prevented.

[0020]

According to the first aspect of the present invention, in the gap provided between the board and the electronic component mounted on the board, and in the gap provided between the board and the electronic component. A metal member temporarily fixed to a resin member is inserted, and the metal member is brought into contact with a heat generating surface of the electronic component, and the metal component is mounted on a metal frame also serving as an exterior of a device in which the electronic component is built. Since the fixing is performed, there is an advantage that heat generated by the electronic components disposed in the device can be efficiently radiated to the outside.

According to the second aspect of the present invention, the metal member is temporarily fixed to the resin member so as to be movable in the direction of insertion into the gap. This has the advantage that the heat generated by the components can be efficiently dissipated to the outside, and the components can be attached to peripheral electronic components without applying external force.

According to the third aspect of the present invention, the fixing position of the metal component and the frame can be adjusted in a direction perpendicular to the direction in which the metal component is inserted into the gap. An advantage is obtained that the electronic component can be attached without applying external force.

According to the fourth aspect of the present invention, at least a part of the resin member is interposed between the metal member and the substrate, so that the electronic device provided in the device is provided. The advantage is that the heat generated by the components can be efficiently dissipated to the outside, and the components can be attached to the surrounding electronic components without any electrical influence.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a structure of a heat dissipation component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state where the metal component 2 is assembled to the resin component 4;

FIG. 3 is a top view showing the heat radiating component 1 in a state where the metal component 2 is assembled to the resin component 4.

FIG. 4 is a plan view of the heat radiating component 1 as viewed from a leg portion direction.

FIG. 5 is a side view of the heat radiating component 1 as viewed from a lateral direction.

FIG. 6 is a schematic diagram showing a lens block on which a CCD to which a heat radiation component is actually attached is arranged.

7 is a perspective view showing a state before and after the heat radiation component is incorporated in the CCD shown in FIG. 6;

8A and 8B are a top view and a front view showing a state before the lens block to which the heat radiating component is attached is attached to the exterior component.

9A and 9B are a top view and a front view showing a state where a lens block to which a heat radiating component is attached is attached to an exterior component.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat dissipating component, 2 ... Metal component, 3a-3c ... Leg, 4 ... Resin component, 5a-5c ... Leg, 6a-6c
... Holes, 7a to 7c ... Holes, 8a to 8c protrusions, 9,
10 screw holes, 12 lens block, 13 prism block, 14 prism holder, 13a, 13
b, 13c: prism, 15a, 15b, 15c ...
CCD, 16a, 16b, 16c substrate, 17a, 17
b, 17c ... gap, 21a ... exterior part, 21b ...
Equipment frame part, 22 Metal plate, 23 Screw hole, 24 Screw

Claims (4)

[Claims] 1. A heat dissipating structure for an electronic component that dissipates heat generated by an electronic component mounted on a substrate, wherein a metal member temporarily fixed to a resin member in a gap provided between the substrate and the electronic component. Wherein the metal member is brought into contact with a heat-generating surface of the electronic component, and the metal component is fixed to a metal frame also serving as an exterior of a device in which the electronic component is built. Heat dissipation structure. 2. The heat radiating structure for an electronic component according to claim 1, wherein said metal member is temporarily fixed to said resin member so as to be movable in a direction of insertion into said gap. 3. The fixing position between the metal component and the frame is adjustable in a direction orthogonal to a direction in which the metal component is inserted into the gap.
Heat dissipation structure of the described electronic component. 4. The heat radiating structure for an electronic component according to claim 1, wherein at least a part of the resin member is interposed between the metal member and the substrate.