JP2001302925A - Hot-melt composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hot-melt composition having a wider freedom of design of mix and reduced surface tackiness, and a hot-melt composition usable as the packing material of the unfixed form. SOLUTION: The hot-melt composition comprises 100 pts.wt. hot-melt material and 0.1-20 pts.wt. at least one kind selected from the group consisting of an amine compound having a melting point of 10 deg.C-200 deg.C, an amide compound having a melting point of 10 deg.C-200 deg.C, an alcohol having a melting point of 10 deg.C-200 deg.C, a fatty acid having a melting point of 10 deg.C-200 deg.C, and a fatty acid ester having a melting point of 10 deg.C-200 deg.C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot-melt composition, and more particularly, to a hot-melt composition having a low surface tack and a hot-melt composition usable as a packing material.

[0002]

2. Description of the Related Art Conventionally, a hot-melt composition having rubber elasticity, in particular, has a strong tackiness due to its properties. Therefore, when it is applied to various uses, there is an incompatibility due to surface tack. . Until now, hydrogenated SBR-based hot melt materials have been mainly developed as hot melt materials having rubber elasticity and low surface tack. However, in order to impart performance, the types and amounts of plasticizers and tackifiers can be selected only within a narrow range, and the flexibility of blending design is narrow, and the adhesion of the original purpose, It was difficult to balance with the adhesion durability to the body.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a hot melt composition having a high degree of freedom in blending design, that is, various physical properties, and having a small surface tack. An object of the present invention is to provide a hot melt composition that can be used as an atypical packing material.

[0004]

Means for Solving the Invention The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, by including a predetermined compounding agent, regardless of the hot melt material used,
It has been found that the adhesiveness of the hot melt composition can be suppressed, and the composition can have excellent peelability. Also, by including the prescribed compounding agent, unexpectedly,
Regardless of the hot melt material used, they found that the surface tack of the hot melt composition can be reduced,
The present invention has been completed.

That is, the hot melt composition according to the first aspect of the present invention is based on 100 parts by weight of the hot melt material.
Amine compound having a melting point of 10 ° C to 200 ° C, melting point of 1
Amide compound having 0 ° C to 200 ° C, melting point of 10 ° C to 2 ° C
At least one selected from the group consisting of an alcohol having a melting point of 10 ° C. to 200 ° C., and a fatty acid ester having a melting point of 10 ° C. to 200 ° C.
It is characterized by containing 1 to 20 parts by weight.

The hot melt composition according to the second aspect of the present invention is a hot melt composition for a packing material, and has a melting point of 1 part by weight with respect to 100 parts by weight of the hot melt material.
It is characterized by containing 0.1 to 20 parts by weight of an aliphatic amine compound at 0 ° C to 200 ° C.

In the present invention, the hot melt composition according to the second aspect is preferably based on SBR and / or butyl rubber.

[0008]

First, the hot melt composition according to the first aspect of the present invention will be described in detail. The hot melt composition according to the present embodiment includes a hot melt material 100.
Amine compound having a melting point of 10C to 200C, amide compound having a melting point of 10C to 200C, alcohol having a melting point of 10C to 200C, melting point of 10C
A fatty acid having a melting point of 10 ° C to 200 ° C;
It contains 0.1 part by weight to 20 parts by weight of at least one selected from the group consisting of fatty acid esters at ℃.

The hot melt material used in the hot melt composition according to the present embodiment is not particularly limited. For example, an adhesive or adhesive type hot melt material obtained by adding a tackifier, a plasticizer, a rubber composition, a wax, an inorganic filler, and other polymers to a base polymer such as rubber and amorphous polyolefin. Can be used. As the rubber, butyl rubber, styrene butadiene rubber (SBR), ethylene-propylene rubber (EPR),
Styrene-isoprene-styrene block copolymer rubber (SIS), styrene-ethylene-butylene block copolymer rubber (SEBS), styrene-ethylene-propylene block copolymer rubber (SEPS) and the like are exemplified, but butyl rubber, SBR, SIS, SEBS, S
EPS is preferred. The above rubbers can be used as a mixture of two or more kinds. As the amorphous polyolefin, atactic polypropylene (APP), amorphous poly-α
-Olefin (APAO) and the like.

Since butyl rubber is excellent in sealability, weather resistance, water resistance, heat resistance, shock absorption and the like, it is suitable as a base polymer for adhesives for automobile parts and the like, and hot melt adhesives for sealants. ML1 + 8,100 DEG C.) of 35 to 55 and a specific gravity of 0.91 to 0.93 are used.

The styrene-diene-based block copolymer rubber has a polystyrene unit melting point of 10 in the end block.
Since the temperature is around 0 ° C., when heated to 100 ° C. to 150 ° C., the rubber rapidly softens and turns into a liquid substance, while having a strong rubber elasticity when cooled. Further, since various characteristics are exhibited depending on the type of the elastomeric chain of the intermediate block, it is suitable as a base polymer of an adhesive for automobile parts and a hot melt adhesive for a sealant.

In the case of using SBR and / or butyl rubber as a base, it is preferable to use atactic polypropylene (APP), amorphous poly-α-olefin (APAO) or the like as the amorphous polyolefin.

Other polymers that may be blended with the base polymer rubber and the amorphous polyolefin include polymers such as ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, and low density polyethylene. The molecular weight, composition ratio, and the like of these other polymers are not particularly limited, and may be in a general range.

The mixing and preparation of the base polymer may be carried out in advance using only the constituent components of the base polymer. However, the mixing and preparation should be carried out simultaneously with the mixing and preparation of the base polymer and other components such as a resin-based tackifier. Can also.

The resin-based tackifier is a rosin resin, a terpene resin, a petroleum resin, a coumarone-indene resin, a modified product thereof, a hydrogenated product, or the like. When the SBR and / or butyl rubber is used as a base, the petroleum resin is used. Systems and / or terpene resin systems are preferred.

The hot melt composition according to the present embodiment contains at least one selected from the group consisting of amine compounds, amide compounds, alcohols, fatty acids and fatty acid esters, having a melting point of 10 ° C. to 200 ° C.

The inventors of the present invention added these additives to the hot-melt composition and examined the physical properties of the resulting hot-melt composition. And found that the surface tackiness of the hot melt composition can be suppressed / the surface can be made non-tacky. As a result, it has been found that a hot melt composition having a wide degree of freedom in blending design and having a small surface tack can be provided.

The amine compound, amide compound, alcohol, fatty acid and fatty acid ester used as a compounding agent in this embodiment all have a melting point of 10 ° C. to 200 ° C.
Preferably, it is 20 ° C to 140 ° C. The melting point is preferably equal to or lower than the application temperature of the hot melt composition. When the melting point is less than 10 ° C., the composition is easily exuded from the obtained composition, which causes stains and the like.

The amine compound having a melting point of 10 ° C. to 200 ° C. is not particularly limited, and may be an aliphatic amine compound or an aromatic amine compound. Examples of the aliphatic amine compound include laurylamine and stearylamine, and examples of the aromatic amine compound include tribenzylamine, diphenylamine, and m-phenylenediamine.

However, it has been found that, among the amine compounds, the hot melt composition containing the aliphatic amine compound surprisingly drastically detackifies only the surface exposed to the atmosphere. This will be described in detail in the second embodiment of the present invention.

The amide compound having a melting point of from 10 ° C. to 200 ° C. is not particularly limited. For example, lauric amide, oleic amide, erucamide, ricinoleamide, N-stearyl stearamide, N-amide Stearyl oleamide, N-oleyl stearamide, N-stearyl erucamide, N-oleyl palmitamide, lauric diethanolamide,
Palmitic acid diethanolamide, myristic acid diethanolamide, capric acid diethanolamide and the like can be mentioned.

The fatty acid having a melting point of from 10 ° C. to 200 ° C. is not particularly limited. , Behenic acid, lignoceric acid, cerotic acid, heptacosanoic acid, montanic acid, melicic acid, lacceric acid and the like.

The alcohol having a melting point of 10 ° C. to 200 ° C. is not particularly limited, and includes, for example, cetyl alcohol, heptadecyl alcohol, stearyl alcohol,
Nonadecyl alcohol, eicosyl alcohol, seryl alcohol, melisyl alcohol and the like can be mentioned.

Examples of the fatty acid ester having a melting point of 10 ° C. to 200 ° C. include butyl stearate, monoglyceride stearate, pentaerythritol tetrastearate, stearyl stearate and the like.

The hot melt composition according to the present embodiment is characterized in that at least one of the above-mentioned components is added in an amount of 0.1 to 20 parts by weight, preferably 1 part by weight, based on 100 parts by weight of the hot melt material. -5 parts by weight.

The hot melt composition of the present embodiment can contain waxes, fillers, plasticizers, antioxidants and the like. Examples of waxes include paraffin wax, microcrystalline wax, low molecular weight polyethylene, low molecular weight polypropylene, Fischer-Tropsch wax and the like. Examples of the filler include calcium carbonate, talc, white carbon, silica, carbon black and the like. Examples of the plasticizer include phthalic acid esters, glycol esters, and hydrocarbon plasticizers (polybutene, polyisobutylene, ethylene-propylene oligomer). As the antioxidant, phenol-based and amine-based antioxidants are used. In addition, various antioxidants, ultraviolet absorbers, silane coupling agents and the like may be added.

The hot melt composition of the present embodiment is generally prepared by mixing and mixing the components sequentially and then heating and preparing. However, the various components are mixed simultaneously or stepwise and mixed. It can also be prepared. Degas if necessary.

Next, the hot melt composition for a packing material according to the second embodiment of the present invention will be described. The hot melt composition according to this embodiment is a hot melt composition suitable for a packing material, and 0.1 part by weight of an aliphatic amine compound having a melting point of 10 ° C to 200 ° C with respect to 100 parts by weight of the hot melt material. -20 parts by weight.

Conventionally, packings are generally used in the opening and closing portions of devices such as refrigerators and vending machines in which an opening and closing mechanism is incorporated. No standard rubber packing was used. Adhesion or fitting of such a fixed packing to a product is performed by bonding a rubber packing preformed in a shape suitable for each device to an opening / closing portion of the device, which is an adherend, with an adhesive, or This is done by fitting into a groove formed in the body and integrating it. Therefore, manual work is required for packing installation work,
It was difficult to mechanize packing installation work. Also,
The rubber packing is vulcanized to a predetermined size, and the formed packing is transported to the packing installation workplace.
There were many complicated steps.

According to the present invention, when a hot melt composition is prepared by blending an aliphatic amine compound with a hot melt material, as described above, surprisingly, only the surface that comes into contact with the air is dramatically non-adhesive. On the other hand, it has been found that the adhesiveness of the surface that does not come into contact with the air is maintained, and a hot melt composition having such properties is very useful as an atypical packing material that can replace the conventional fixed packing material. Was found.

The hot melt composition containing an aliphatic amine compound can be remarkably detackified only on the surface that comes into contact with the atmosphere because the aliphatic amine compound having an amino group at the terminal on the surface of the hot melt composition. This is considered to be due to the fact that it reacts with carbon dioxide in the air to form an alkyl carbamate and form a white wax-like non-stick layer.

The hot-melt composition on which the non-adhesive layer is formed is heated to 100 ° C. or higher to release carbon dioxide gas and return to the state before the non-adhesive layer is formed. Similarly, the hot melt composition of the present embodiment is easily managed for storage and the like. In addition, since the hot melt composition of the present embodiment is an atypical material, it can be easily transported as a packing material. In addition, as described above, the hot melt composition of the present embodiment can form an adhesive surface and a non-adhesive surface, and has a shape maintaining function. By doing so, the packing mounting operation can be mechanized, so that productivity can be increased.

In the present embodiment, the description of the hot melt material, the aliphatic amine compound, and the additives used are the same as those described in the hot melt composition according to the first embodiment.

[0034]

EXAMPLES (Preparation of Hot Melt Composition) The following materials were blended in the amounts shown in Table 1 to produce hot melt compositions. SEBS adhesive HM: M-7500, (manufactured by Yokohama Rubber Co., Ltd.) Butyl rubber adhesive HM: M-6158, (manufactured by Yokohama Rubber Co.) Olefin adhesive HM: M6104, (Yokohama Rubber Co., Ltd.) SEBS adhesive type HM: M6241, (Yokohama Rubber Co., Ltd.)
SIS adhesive type HM: M6250, (Yokohama Rubber Co., Ltd.)
Butyl rubber adhesive type HM: M6209, (Yokohama Rubber Co., Ltd.) Stearylamine: Farmin 86-T, (Kao Corp.)
Laurylamine: Farmin 20-D, (Kao Corporation)
Stearyl alcohol: Calcol 8098, (manufactured by Kao Corporation) Palmitic acid: Palmitic acid P, (Shin Nippon Rika Co., Ltd.)
Lauric amide: Diamid Y, (Nippon Kasei Co., Ltd.)
Made)

[0035]

[Table 1]

[0036]

[Table 2]

(Surface Tack Test) A hot melt composition having the composition shown in Table 1 was allowed to stand at room temperature for 24 hours after production to examine the surface tack. A: The surface is completely cured and smooth. ：: The surface is completely cured and has less stickiness. Δ: The surface is completely cured, but is quite sticky (not at a level at which the composition adheres to the finger). ×: The surface is not cured and has a very sticky appearance. Was evaluated. Table 2 shows the results.

[0038]

[Table 3]

From Table 2, it can be seen that the hot melt composition according to the present invention containing the prescribed compounding agent has low surface tack. In addition, the hot melt composition containing an aliphatic amine compound as a compounding agent has less surface tack, particularly in a portion that comes into contact with the atmosphere, as compared with a hot melt composition that does not contain an aliphatic amine compound. It can be seen that the adhesive can be made drastically non-adhesive.

[0040]

According to the hot melt composition of the first aspect of the present invention, a hot melt composition having a small surface tack can be provided. Further, according to the hot melt composition according to the second aspect of the present invention, since the surface that comes into contact with the atmosphere particularly forms the non-adhesive surface, it can be suitably used as an atypical packing material, Enables mechanization and improves productivity.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 123/22 C09J 123/22 201/00 201/00 C09K 3/10 C09K 3/10 JZ F term ( Reference) 4H017 AA03 AA31 AB07 AB17 AC01 AC02 AD03 4J002 AC081 BB011 BB131 BB151 BB181 BC051 BP011 BP021 EF058 EH039 EH059 EN016 EN076 EN086 EP017 EP027 GJ01 GJ02 4J040 CA081 DA001 DA101 DA121 H141B001 DM01 HC03

Claims (4)

[Claims] 1. An amine compound having a melting point of 10 ° C. to 200 ° C. with respect to 100 parts by weight of a hot melt material.
Amide compound having a melting point of 10 ° C to 20 ° C.
0.1 at least one selected from the group consisting of an alcohol having a melting point of 0 ° C., a fatty acid having a melting point of 10 ° C. to 200 ° C., and a fatty acid ester having a melting point of 10 ° C. to 200 ° C.
A hot melt composition comprising from 20 parts by weight to 20 parts by weight. 2. An aliphatic amine compound having a melting point of 10 ° C. to 200 ° C. is added to 100 parts by weight of the hot melt material.
A hot melt composition for a packing material, comprising 1 to 20 parts by weight. 3. The hot melt composition according to claim 1, wherein the hot melt material is SBR-based. 4. The hot melt composition according to claim 1, wherein the hot melt material is based on butyl rubber.