JP2001284405A - Apparatus for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing semiconductor device capable of improving productivity by reducing working preparation time such as transfer, capable of reducing installation area of the apparatus by the miniaturization, and reducing the cost of the same. SOLUTION: This apparatus for manufacturing semiconductor device is composed of a wafer magazine 35, a wafer exchanger 38, an IC chip plunging mechanism 39, an IC chip supplier 30 and a spacer transfer bond mechanism 52 having an IC chip transfer arm 40, an X-Y-θtable 55 which lays a lead 2a of a tape carrier 2 on a pad 1a of an IC chip 1, a bonding apparatus 50 having a bonding head 13 which bonds the pad 1a and the lead 2a, and a tape carrier apparatus 60 which continuously carries the tape carrier 2 wounded around a drum. The IC chip supplier 30 is connected to the bonding apparatus 50 by the IC chip transfer arm 40.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus used in a semiconductor device assembling process. In particular,
The present invention relates to a semiconductor manufacturing apparatus which mounts an IC chip on a package in a CSP (Chip Size Package) and bonds pads of the IC chip inside the package to leads of the package.

[0002]

2. Description of the Related Art Conventionally, a QFP (Quad Flat Pack) has been used as a package for surface mounting a semiconductor device.
Age) is used, but in recent years, a CSP having a small mounting area, light weight and thinness has begun to be used. C
The bonding between the pads of the IC chip inside the SP and the leads of the package is performed by a method such as wire bonding, gang bonding, and single point bonding.

Hereinafter, a description will be given of an assembly of a CSP in which a tape carrier is used and the leads of the tape carrier and the pads of the IC chip are joined by single point bonding.

FIG. 5A is a plan view showing the tape carrier 2, and FIG. 5B is a sectional view of the tape carrier 2.

As shown in FIG. 5 (b), the tape carrier 2 has a plurality of leads (inners) formed by etching a copper foil 2f on a substrate of a tape-like film 2e made of a polyimide as a support. Lead) 2a
It is composed of As shown in FIG. 5A, a long hole is formed in the film 2e at the tip of the lead 2a. The tape carrier 2 is provided with electrode lands 2c for connection to external terminals as shown in FIG. 5A.

The electrode lands 2c are for forming external electrodes of the package. FIG. 5 (a)
The tape carrier 2 shown in (1) shows a portion corresponding to one package of a semiconductor device (hereinafter, this portion is referred to as a frame). On both sides of the tape carrier 2 in the longitudinal direction, perforations 2d for transporting the tape carrier 2 are provided. The perforations 2d are used when the tape carrier 2 formed in a tape shape is transported by a sprocket or the like. When transporting the tape carrier 2 cut into strips in several frames, the perforations 2
d is not used.

A spacer 4 as an insulating material is bonded to the upper surface of the IC chip 1 in advance (see FIG. 6). The spacer 4 is provided with an IC by applying heat.
It is bonded to the upper surface of the chip 1. The spacer 4
Is to measure the electrical insulation between the IC chip 1 and the tape carrier 2 and to absorb the thermal stress caused by the difference in the coefficient of thermal expansion between the IC chip 1 and the tape carrier 2.

The bonding of the spacer 4 to the upper surface of the IC chip 1 is performed by a spacer bonding device. The spacer 4 may be bonded to the surface of the tape carrier 2 where the IC chip 1 is bonded, instead of bonding the spacer 4 to the upper surface of the IC chip 1.

Next, the above I to which the spacer 4 is bonded is
The pad 1a of the C chip 1 and the lead 2a of the tape carrier 2 are overlapped. FIG. 6 is an exploded perspective view showing a state in which the tape carrier 2 and the IC chip 1 to which the spacer 4 is adhered are overlapped.

As shown by the broken line in FIG. 6, the superposition is performed so that the leads 2a of the tape carrier 2 corresponding to the pads 1a of the IC chip 1 are located directly above. Pad 1a of the IC chip 1 and lead 2a of the tape carrier 2
Is performed by an IC chip mounting device.

The IC chip mounting device includes an IC chip with a spacer supplied from the spacer bonding device.
Then, the IC chip 1 is heated and the IC chip 1 is mounted on the tape carrier 2 via the spacer 4 on the IC chip 1 by superimposing the leads 2a on the tape carrier 2. After mounting the IC chip 1 on the tape carrier 2 by the IC chip mounting device, the leads 2a of the tape carrier 2 and the pads 1a of the IC chip 1 are connected by bonding.

A single point bonder 10 for connecting the leads 2a of the tape carrier 2 and the pads 1a of the IC chip 1 by single point bonding will be described below. FIG. 7A is a plan view showing a conventional single point bonder 10, and FIG. 7B is a front view showing a conventional single point bonder.

As shown in FIGS. 7 (a) and 7 (b), a conventional single point bonder 10 has a camera 11 for picking up an image of a lead 2a of a tape carrier 2, a capillary 13c mounted on the tip, and an ultrasonic wave. A bonding arm 13a comprising an ultrasonic horn for generating vibration, a bonding head 13 for driving the bonding arm 13a up and down, the camera 11, a bonding arm 13a
And an XY table 14 on which the bonding head 13 is mounted and moved and positioned in the X and Y directions,
A tape carrier transport mechanism 16 for transporting the tape carrier 2 to a bonding stage 16a, a tape carrier supply mechanism 17 for supplying the tape carrier 2 from the magazine storing the tape carrier 2 to the tape carrier transport mechanism 16, A tape carrier storage mechanism 18 for storing the tape carrier 2 sent out from the carrier transport mechanism 16, a control circuit (not shown) for driving and controlling each of the mechanical units, and an image recognition device for detecting a position based on an image from the camera 11. (Not shown) and a gantry 20 containing the control unit.

The tip of the single point bonding capillary 13c has a cone shape.
The surface of the tip of the capillary 13c that contacts the lead 2a has a cross-shaped projection.

The operation of the single point bonder 10 will be described below.

[0016] The IC chip mounting device allows the
The tape carrier 2 on which the C chip 1 is mounted is cut into a strip shape in advance, and is stored in the magazine of the tape carrier supply mechanism 17. The tape carrier supply mechanism 17 supplies the tape carrier 2 to the tape carrier transport mechanism 16 from the magazine.

The tape carrier transport mechanism 16 transports the tape carrier 2 supplied from the tape carrier supply mechanism 17 to a bonding stage 16a.
Perform positioning. The position of the lead 2a of the tape carrier 2 positioned on the bonding stage 16a is detected by the camera 11 mounted on the XY table 14 and the image recognition device in the control unit. The XY table 14 moves so that the capillary 13c of the bonding arm 13a is positioned immediately above the lead 2a of the tape carrier 2 whose position has been detected, and stops.

Hereinafter, a bonding sequence for bonding the pads 1a of the IC chip 1 and the leads 2a of the tape carrier 2 will be described.

The IC chip 1 to which the spacer 4 is adhered is
The bonding of the pads 1a of the IC chip 1 and the leads 2a of the tape carrier 2 is performed on the bonding stage 16a. The capillary 13c is a lead 2 of the tape carrier 2.
a, and thereafter, the capillary 13c located at the tip of the bonding arm 13a is lowered, and after the tip of the capillary 13c contacts the lead 2a of the tape carrier 2, the capillary 13c is further lowered at a low speed.

The bonding head 13 detects that the lead 2a of the tape carrier 2 has come into contact with the surface of the pad 1a of the IC chip 1 and the lowering of the capillary 13c has stopped. Thereafter, the capillary 13c is moved toward the fixed end of the lead 2a. At this time, the capillary 13c is connected to the lead 2
By moving in the direction of the fixed end of a, the lead 2a is pushed by the capillary 13c to have an S-shape.

Thereafter, a predetermined bonding load is applied to the bonding arm 13a and an ultrasonic wave is applied to the tip of the capillary 13c to join the lead 2a of the tape carrier 2 and the pad 1a of the IC chip 1.

After applying ultrasonic vibration and load for a predetermined time,
Raise the capillary 13c. After the capillary 13c is moved to the position of the next lead 2a by the XY table 14,
The above operation is performed to bond the lead 2a and the pad 1a.

The above bonding operation is performed for all leads 2a of the tape carrier 2. After bonding is completed,
The tape carrier transport mechanism 16 includes a tape carrier 2
Of the tape carrier 2 so that the next frame of the tape carrier 2 is positioned on the bonding stage 16a. When the bonding of all the frames of the tape carrier 2 is completed, the tape carrier 2 is transported by the tape carrier transport mechanism 16 and stored in the tape carrier storage mechanism 18.

[0024]

In a conventional semiconductor manufacturing apparatus, in order to assemble a CSP using a tape carrier, it is necessary to prepare an apparatus for each assembling process. That is, the step of bonding a spacer as an insulating material on the IC chip, the step of superposing and bonding a tape carrier on the IC chip to which the spacer is bonded, and the step of bonding leads of the tape carrier and pads of the IC chip are performed. Are performed by different devices.

For this reason, after each step is completed, it is necessary to transfer the bonding member to the next step, and this transfer operation is performed by an operator, which lowers the efficiency of semiconductor device production. Was. For this reason, it is required to improve the productivity of semiconductor devices by reducing work preparation time such as transfer work. Further, in the conventional production method, it is necessary to prepare an apparatus for each process, and there is a problem that the cost of the apparatus is increased. Further, since the total installation area of the apparatus is increased, the size of the apparatus is required to be reduced.

Accordingly, the present invention provides a semiconductor manufacturing apparatus comprising:
By adding a chip supply device, a tape supply device, and a tape storage device as sub-devices to the bonding device, it is possible to reduce the work of transferring the bonding members between the devices in each process, increase the productivity of the semiconductor device, and
It is an object of the present invention to provide an inexpensive semiconductor manufacturing apparatus by reducing the size of the semiconductor manufacturing apparatus and the installation area of the apparatus.

[0027]

SUMMARY OF THE INVENTION A semiconductor manufacturing apparatus according to the present invention comprises an IC wafer storing means for storing an IC wafer, and an IC wafer taken out of the IC wafer storing means. IC wafer exchange means mounted on a stage, IC chip separation means for separating an IC chip from the IC wafer, and IC chip transfer means for transferring the IC chip separated by the IC chip separation means. IC chip supply device, spacer bonding means for bonding a spacer as an insulating material on the upper surface of the IC chip, and positioning means for overlapping a pad of the IC chip to which the spacer is bonded with a lead of a tape carrier A bonding device having bonding means for bonding the pad and the lead; and a bonding device wound around a drum. A semiconductor manufacturing apparatus comprising a tape feeding device which conveys continuously the said tape carrier is a and the IC chip supply device and the bonding device made of linked by the IC chip transfer means.

The transport path of the IC chip transfer means is disposed in parallel with the transport path of the tape carrier of the tape transport device.

Further, the IC chip transfer means has an up-down drive means for varying the amount of up-down movement, and the amount of movement to the surface of the IC chip held by the IC chip separation means, The moving amount of the mounting position to the surface is set individually.

[0030]

Embodiments of the present invention will be described below with reference to the accompanying drawings. Parts having the same configurations and functions as those of the conventional bonding apparatus shown in FIG. 7 are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 1 is a front view showing a semiconductor manufacturing apparatus of the present invention, and FIG. 2 is a plan view showing a semiconductor manufacturing apparatus of the present invention.

As shown in FIG. 1, in the semiconductor manufacturing apparatus, a bonding apparatus 50, an IC chip supply apparatus 30 as a sub-apparatus, and a tape transport apparatus 60 (not shown in FIG. 2) are closely connected in series as a line. Are located.

First, the IC chip supply device 30 as a sub device arranged on the side surface of the bonding device 50 will be described.

As shown in FIGS. 1 and 2, the IC chip supply device 30 includes a wafer frame for holding an IC wafer 32 by attaching it to a wafer sheet (adhesive resin tape for holding the IC chip 1). Wafer magazine 35 as IC wafer storage means containing IC 34
And the wafer frame 3 from the wafer magazine 35
A wafer exchanging mechanism 38 as an IC wafer exchanging means for taking out the wafer 4 and placing it on a wafer stage 37, and an individual IC chip 1 from an IC wafer 32 held on a wafer sheet of a wafer frame 34 taken out of the wafer magazine 35. An IC chip push-up mechanism 39 as an IC chip separating means for separating and taking out;
The IC chip 1 separated from the C chip push-up mechanism 39 is placed on the XYθ table 55
It comprises an IC chip transfer arm 40 as IC chip transfer means for transferring to the C chip mounting position. A camera 44 for detecting the position of the IC chip 1 is mounted directly above the IC chip lifting mechanism 39.

A collet 40a, which is a suction holding tool for sucking the IC chip 1, is mounted on the tip of the IC chip transfer arm 40 as the IC chip transfer means.
Further, the IC chip transfer arm 40 is provided with
It has a slide portion 40b as a transfer path for transferring the chip 1 to the bonding device 50, and the slide portion 40b serves as a tape transfer means for continuously transferring a series of tape carriers 2 wound on a drum. Is provided in parallel with the transport path of the tape transport device 60. The tape transport device 60 is controlled by a control device (not shown) of the bonding device 50.

Further, the IC chip transfer means has a vertical drive means for varying the vertical movement amount. The up / down driving means is composed of a pulse motor (not shown) and a slide portion (not shown). By controlling the rotation of the pulse motor, the IC chip transfer arm 40 is driven.
Is moved up and down. The amount of movement of the IC chip transfer arm 40 to the surface of the IC chip 1 held by the IC chip push-up mechanism 39 and the X
The amount of movement of the IC chip mounting position on the Yθ table 55 to the surface is individually set in a control device (not shown) of the IC chip supply device 30.
0 moves up and down based on the set movement amount.

The IC on the wafer frame 34
The wafer 32 is diced in advance and the individual IC
It is divided into chips 1.

The wafer stage 37 has an XY table (not shown) capable of two-dimensionally moving in the X and Y directions, and an IC wafer fixing mechanism (not shown) for fixing the wafer frame 34. Consists of

Further, the IC chip supply device 30 is provided with I
Camera 44 located directly above C chip push-up mechanism 39
An image processing device (not shown) for receiving a video signal from
A control device (not shown) including a microprocessor, and a wafer stage 3 in response to a command signal from the control device.
And a drive unit (not shown) for driving the XY table 7, the IC chip transfer arm 40, the wafer exchange mechanism 38, and the like.

Next, the IC chip 1 and the tape carrier 2
(See FIG. 5) with lead 2a (single point)
The configuration of a bonding apparatus 50 that performs bonding will be described with reference to FIG.

The bonding apparatus 50 is used for the IC chip 1
A spacer supply mechanism 51 for supplying a spacer 4 (see FIG. 6) as an insulating material adhered to the upper surface of the device. The spacer supply mechanism 51 includes an XY table 51a and a spacer tray 51c placed on the XY table 51a and containing the spacers 4.

The spacer 4 is taken out from the spacer tray 51c, and the spacer transfer / joining mechanism 5 is used as a spacer bonding means for bonding the spacer 4 onto the IC chip 1.
Two. After taking out the spacer 4 from the spacer tray 51c, the XY
It moves to the spacer delivery position where the θ table 55 is located, and bonds the spacer 4 to the surface of the IC chip 1 placed on the XY θ table 55.

The binding device 50 includes a camera 11 as an image pickup means for picking up an image of the IC chip 1 and the leads 2a, a bonding arm 13a having a capillary 13c mounted at the tip thereof, and drives the bonding arm 13a up and down. A bonding head 13; an XY table 14 serving as a positioning means on which the bonding means including the bonding arm 13a and the bonding head 13 and the imaging means are mounted and two-dimensionally moved and positioned in the X and Y directions; XY as positioning means for positioning the IC chip 1 and superimposing the pad 1a of the IC chip 1 and the lead 2a (see FIG. 6) of the tape carrier 2
θ table 55 is provided.

The XYθ table 55 is provided for the X direction and the Y direction.
On the XY table that is moved two-dimensionally in the direction and positioned, a θ table that is positioned in the rotational direction by rotation is mounted. The θ table mounted on the XY table fixes an IC chip mounting portion (not shown) for mounting the IC chip 1, a heater (not shown) for heating the IC chip 1 and the like, and the chip. Suction mechanism (not shown) for performing the operation, and a vertical raising mechanism (not shown) for raising the IC chip mounting portion so that the surface of the spacer 4 on the IC chip 1 contacts the tape carrier 2 during bonding. Have.

The bonding device 50 includes an image processing device (not shown) for receiving a video signal from the camera 11, a monitor 22 for receiving and displaying an output from the image processing device, and a microprocessor. A control device (not shown) and a drive for issuing drive signals to the bonding head 13, the XY table 14, the spacer supply mechanism 51, the spacer transfer / joining mechanism 52, the XYθ table 55, etc. in response to a command signal from the control device. And a gantry 20 containing devices (not shown) and the like.

Tape transport device 6 as tape transport means
0 is a tape supply device 61 for continuously supplying a series of tape carriers 2 wound on a drum, as shown in FIG.
A tape supply / conveyance mechanism 63 for supplying the tape carrier 2 from the tape supply device 61 to the conveyance path of the bonding apparatus 50, and a tape housing for conveying the tape carrier 2 discharged from the conveyance path in synchronization with the tape supply / conveyance mechanism 63. It comprises a transport mechanism 64 and a tape storage device 62 for continuously winding and storing a series of tape carriers 2 from the tape storage and transport mechanism 64. The tape transport device 60 is configured to be controlled by a control device (not shown) of the bonding device 50.

The control device (not shown) of the bonding device 50 and the control device (not shown) of the IC chip supply device 30 are connected by a communication interface circuit (not shown). It is configured to perform work while performing communication.

Hereinafter, an IC using the semiconductor manufacturing apparatus of the present invention will be described.
The mounting of the chip 1 on the tape carrier 2 and the bonding operation will be described with reference to FIGS. FIG. 3 shows an IC
4 is a flowchart showing the operation of the chip supply device 30, FIG.
5 is a flowchart showing the operation of the bonding device 50 and the tape transport device 60.

The wafer magazine 35 is loaded with a plurality of wafer frames 34 for attaching and holding the IC wafer 32 on the wafer sheet, and the tape carrier 2 is fed out from the tape supply device 61. It is assumed that the leading empty tape (tape without leads) of the tape carrier 2 is wound on the tape storage device 62 through the tape supply / conveyance mechanism 63 and the tape storage / conveyance mechanism 64.

First, the bonding apparatus 50 conveys the tape carrier 2 onto the bonding stage 16a by the tape supply / conveyance mechanism 63 and the tape storage / conveyance mechanism 64 (Step S20).

At the same time, the IC chip supply device 30
Takes out the wafer frame 34 loaded in the wafer magazine 35 from the wafer magazine 35 by the wafer exchange mechanism 38 (Step S1 in FIG. 3), and places it on the wafer stage 37 (Step S2 in FIG. 3).

The wafer frame 34 set on the wafer stage 37 is fixed by an IC wafer fixing mechanism (not shown). After the fixing of the wafer frame 34 is completed, the XY table of the wafer stage 37
The first IC chip 1 on the wafer 32 is moved so as to be positioned within the field of view of the camera 44 of the IC chip supply device 30 (step S3 in FIG. 3).

The camera 44 of the IC chip supply device 30
Captures an image of the IC chip 1 and outputs an image signal to an image recognition device. The image recognition device detects the presence or absence of a defective mark on the IC chip 1 based on an image signal from the camera 44 (step S4 in FIG. 3), and when the defective mark is detected (step S5 in FIG. 3). Determines that the IC chip 1 is defective and notifies the control device.

[0054] The control device transmits the I
When a defect mark signal of the C chip 1 is received, a control signal is outputted to the wafer stage 37 so as to move to the next position detection position of the IC chip 1 (step S6 in FIG. 3). When there is no defect mark on the IC chip 1,
The image recognition device detects the position of the center of the IC chip 1 (Step S7 in FIG. 3).

The XY table of the wafer stage 37 is based on position information detected by the image recognition device.
The IC chip 1 is moved to the IC chip push-up mechanism 39 so that the center of the IC chip 1 is located (step S8 in FIG. 3).

The IC chip 1 whose position has been detected is separated from the wafer sheet of the IC wafer 32 by the IC chip push-up mechanism 39 (step S 9 in FIG. 3), and the collet 40 attached to the tip of the IC chip transfer arm 40.
(Step S10 in FIG. 3).

The IC chip transfer arm 40 that has absorbed the IC chip 1 is moved by the slide portion 4 of the IC chip transfer arm 40.
0b, the IC chip 1 is moved to the bonding apparatus 50 side (Step S11 in FIG. 3), and the IC chip 1 is moved to the bonding apparatus 50 side.
Transfer to

XYθ table 5 of bonding apparatus 50
5 moves to the IC chip receiving position (Step S21 in FIG. 4) and receives the IC chip 1 from the IC chip transfer arm 40 of the IC chip supply device 30 (Step S22 in FIG. 4).

After receiving the IC chip 1 from the IC chip transfer arm 40, the XYθ table 55 fixes the IC chip 1 by vacuum suction (step S2 in FIG. 4).
3).

Thereafter, the XYθ table 55 moves to the image pickup position of the camera 11 (step S24 in FIG. 4),
An image of the IC chip 1 is taken, and XY
X direction of IC chip 1 placed on θ table 55, Y direction
The position and rotation angle of the direction are detected (step S in FIG. 4).
25). The XYθ table 55 moves based on the position information detected by the image recognition device so that the center of the IC chip 1 is located at the joint position of the spacer 4 (FIG. 4).
Step S26).

Next, the spacer 4 is taken out from the spacer supply mechanism 51 of the bonding apparatus 50 (step S27 in FIG. 4), placed on the IC chip 1 by the spacer transfer / joining mechanism 52, and the spacer 4 is bonded (FIG. 4). Step S28).

Next, an image of the lead 2a of the tape carrier 2 is taken by the camera 11, and the position of the entire lead is detected (FIG. 4).
Step S29). The XYθ table 55 indicates the displacement amount of the IC chip 1 detected in step S25 in FIG.
Of the tape carrier 2 based on the deviation amount of the lead 2a of the tape carrier 2 detected in step S29 of FIG.
Moves to a position where the pad 1a of the IC chip 1 corresponding to the lead overlaps.

After the movement is completed, the XYθ table 55
The IC chip mounting portion on which the chip 1 is mounted is raised vertically, and the spacer 4 on the IC chip 1 is
(Step S30 in FIG. 4).

The bonding head 1 mounted on the XY table 14 with the pads 1 a of the IC chip 1 and the leads 2 a of the tape carrier 2 overlapping via the spacer 4
3, bonding between the pad 1a of the IC chip 1 and the lead 2a of the tape carrier 2 is performed (step S31 in FIG. 4).

It is checked whether the bonding of all the leads has been completed (step S32 in FIG. 4). If the bonding of the leads has not been completed, the XY table 14 on which the bonding head 13 is mounted is positioned at the bonding position of the next lead 2a. (Step S33 in FIG. 4), and the operation of Step S31 in FIG. 4 is repeated.

After the bonding of all the leads 2a is completed, the tape transport device 60 transports one frame of the tape carrier 2 and positions the next frame of the tape carrier 2 on the bonding stage 16a (step in FIG. 4). S
34). After the transport of the tape carrier 2, step S in FIG.
The operation from 21 is repeated.

As shown in the operation flowchart of FIG. 4, the bonding apparatus 50 is used to bond a spacer to the upper surface of the IC chip 1, align the pad 1 a of the IC chip 1 with the lead 2 a of the tape carrier 2, and
Pad 1a of chip 1 and lead 2a of tape carrier 2
Bonding the IC chip 1 to the XYθ table 5
5 is carried out.

[0068]

As described above, the semiconductor manufacturing apparatus according to the present invention is one semiconductor manufacturing apparatus, which comprises a bonding apparatus, a chip supply apparatus as a sub apparatus, and a tape transport apparatus. Since the mounting of the IC chip on the package, the mounting of the spacer 4 on the IC chip, and the bonding between the pad of the IC chip inside the package and the lead of the package can be performed consistently, an apparatus for each process is not required. . Further, in the semiconductor manufacturing apparatus of the present invention, since the bonding apparatus and the chip supply apparatus are connected by the IC chip transfer arm as IC chip transfer means of the chip supply apparatus, the entire apparatus can be downsized. .

Further, the bonding apparatus includes a mount such as a general-purpose wire bonding apparatus, a bonding head,
Since an XY table or the like can be used, it can be manufactured at low cost. Further, the bonding apparatus of the semiconductor manufacturing apparatus according to the present invention performs bonding of the spacer to the upper surface of the IC chip, alignment of the pad of the IC chip with the lead of the tape carrier, and bonding of the pad of the IC chip with the lead of the tape carrier. Since the configuration is such that the IC chips are mounted on the same table, there is no need to transfer the IC chips, and the IC chip position detection operation can be performed only once. Can be improved.

Further, since the bonding device and the chip supply device can be individually adjusted and installed, the device can be operated in a short time.

Further, the IC chip transfer means individually sets the amount of movement to the surface of the IC chip held by the IC chip separation means and the amount of movement to the surface of the IC chip mounting position of the bonding apparatus. Thereby, even if the height position of the IC chip 1 on the wafer stage 37 is different from the height of the IC chip mounting position of the bonding apparatus, the IC chip 1 can be smoothly transferred.
The degree of freedom in design is high.

[Brief description of the drawings]

FIG. 1 is a front view showing a semiconductor manufacturing apparatus of the present invention.

FIG. 2 is a plan view showing a semiconductor manufacturing apparatus of the present invention.

FIG. 3 is a flowchart showing an operation of the IC chip supply device.

FIG. 4 is a flowchart showing an operation of the bonding apparatus.

5A is a plan view of a tape carrier, and FIG. 5B is a cross-sectional view of the tape carrier.

FIG. 6 is an exploded perspective view showing a state in which a tape carrier and an IC chip to which a spacer is adhered are overlapped.

FIG. 7A is a plan view showing a conventional single point bonder, and FIG. 7B is a front view of the conventional single point bonder.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 1a Pad 2 Tape carrier 2a Lead (inner lead) 2c Land 2d Perforation 2e Film 2f Copper night 4 Spacer 10 Single point bonder 11, 44 Camera 13 Bonding head 13a Bonding arm 13c Capillary 14, 51a XY table 16 Tape carrier conveyance Mechanism 16a Bonding stage 17 Tape carrier supply mechanism 18 Tape carrier storage mechanism 20 Mount 22 Monitor 30 IC chip supply device 32 IC wafer 34 Wafer frame 35 Wafer magazine 37 Wafer stage 38 Wafer exchange mechanism 39 IC chip push-up mechanism 40 IC chip transfer arm 40a Collet 40b Slide unit 50 Bonding device 51 Spacer supply mechanism 51c Spacer tray 52 Spacer transfer joining mechanism 60 Tape transport device 61 Tape supply device 62 Tape storage device 63 Tape supply transport mechanism 64 Tape storage transport mechanism

Claims (3)

[Claims] 1. An IC wafer storage means for storing an IC wafer, and an IC wafer exchange means for taking out an IC wafer from the IC wafer storage means and mounting the IC wafer on an IC wafer stage. An IC chip supply device comprising: an IC chip separation unit for separating an IC chip from the IC wafer; and an IC chip transfer unit for transferring the IC chip separated by the IC chip separation unit. Spacer bonding means for bonding a spacer as an insulating material on the upper surface, positioning means for overlapping a pad of the IC chip to which the spacer is bonded with a lead of a tape carrier, and bonding for bonding the pad and the lead Means for continuously transporting a series of the tape carriers wound on a drum. A semiconductor manufacturing apparatus comprising a transporting device, a semiconductor manufacturing apparatus characterized by comprising the said IC chip supply device and the bonding device coupled by said IC chip transfer means. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a transfer path of said IC chip transfer means is disposed in parallel with a transfer path of a tape carrier of said tape transfer device. 3. The IC chip transfer means has an up-and-down drive means for changing an up-and-down movement amount, and an amount of movement to a surface of the IC chip held by the IC chip separation means and an IC chip on the bonding device. The moving amount of the mounting position to the surface is individually set.
Or a semiconductor manufacturing apparatus according to claim 2.