JP2001230584A - Cooling method for component mounted on printed wiring board utilizing thermoelectric cooling element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling method for components mounted on a printed wiring board that copes with surface mounted components, without having to decrease mounted component density of the printed wiring board. SOLUTION: A thermal electric cooling element (Peltier module) is placed on and in contact with the upper face on a high heat generating component on the printed wiring board, and the Peltier module is connected through a printed wiring pattern or a wire to supply power to the Peltier module. By supplying a current to the Peltier module via the connector cools a side of the Peltier module at a side which is in contact with a high heat generating component, the opposite side is heated. The side opposite to the side of the Peltier module, in contact with the high heat generating component is in contact with a heat pipe to move the heat generated in the Peltier module to a heat dissipating section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to heat radiation of electronic components, and more particularly to a method for cooling printed circuit board mounted components using thermoelectric cooling elements.

[0002]

2. Description of the Related Art Generally, means for radiating heat from components mounted on a printed wiring board are classified into an air cooling method using a fan and a liquid cooling method using a liquid. For electronic devices mounted on rockets, artificial satellites, and space stations, it is difficult to obtain a cooling effect by an air-cooled system, so a natural cooling system or a liquid-cooled system is used. The printed wiring board used in the electronic device is a mounted IC
The heat generation tends to increase significantly due to the increase in speed and scale of the system. In order to make the natural cooling method or the liquid cooling method more efficient, the component mounting interval is increased as a structural countermeasure for the printed wiring board, or the metal core or heat sink structure is used to dissipate the heat generated by the electronic components mounted on the printed wiring board. The method of inducing is taken. FIG. 3 shows a structural example of a conventional metal core printed wiring board and heat sink printed wiring board. FIG. 3A shows an example of a metal core printed wiring board 9 using an aluminum plate, a copper plate, a copper-invar copper plate or the like as a metal core 10, and FIG. 3B shows a print using an aluminum plate, a copper plate or the like as a heat sink 12. This is an example of the wiring board 11.

[0003]

However, the above-mentioned method has a problem in that the restrictions on the design of the printed wiring board are increased, and the component mounting density and the wiring density are reduced. Further, in the case of a surface mount IC, it is necessary to cut out the heat sink 12 of the IC mount portion as shown in FIG. 4A, or the entire periphery of the IC mount outer peripheral portion of the metal core 10 as shown in FIG. Over the clearance hole 13
There is also a problem that the heat sink and the metal core cannot exhibit the initial heat conduction effect due to the necessity of providing the heat sink and the metal core. The present invention has been made in order to solve the above-mentioned problems, and does not reduce the component mounting density of a printed wiring board, without reducing the wiring density, and also provides a method of cooling a printed wiring board mounted component corresponding to a surface mounted component. The purpose is to provide.

[0004]

According to a first aspect of the present invention, there is provided a method of cooling a component mounted on a printed wiring board using a thermoelectric cooling element. A thermoelectric cooling element is disposed in contact with a component, and the heat generation side of the thermoelectric cooling element is brought into contact with a heat sink or an end of a heat pipe.

According to the method for cooling a printed wiring board mounted component utilizing the thermoelectric cooling element of the first aspect, the heat of the high heat generating component can be transferred to the outside without changing the structure of the printed wiring board. In addition, there is no restriction on the design of the printed wiring board, so that high-density design is easy, and heat generation of the surface mount components can be transferred efficiently, unlike the existing metal core printed wiring board and the printed wiring board with a heat sink.

According to a second aspect of the present invention, there is provided a method of cooling a component mounted on a printed wiring board using a thermoelectric cooling element, wherein the high heat generating component cooling structure on the printed wiring board is brought into contact with the back surface of the printed wiring board on the mounting surface of the high heat generating component. A thermoelectric cooling element is disposed, and the heat generation side of the thermoelectric cooling element is brought into contact with a heat radiating plate or an end of a heat pipe.

According to the method for cooling a printed circuit board mounted component using a thermoelectric cooling element according to the second aspect, heat can be efficiently transferred, particularly in the case of a high heat-generating component in which the mounting bottom generates heat.

According to a third aspect of the present invention, there is provided a method for cooling a printed circuit board mounted component utilizing a thermoelectric cooling element, wherein a temperature sensor is disposed near a high heat generating component, and the output of the temperature sensor is returned to the thermoelectric cooling element by a temperature control circuit. It is characterized by doing.

According to the method for cooling a printed wiring board mounted component using a thermoelectric cooling element according to the third aspect, the cooling capability of the thermoelectric cooling element can be varied according to the heat generation state detected by the temperature sensor. And the electronic device can operate stably.

[0010]

Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an example of a structure of a printed circuit board using a thermoelectric cooling element (for example, a Peltier module, which is hereinafter referred to as a Peltier module), and a structure of a forced liquid cooling system.
In the figure, 1 is a printed wiring board, 2 is a heat radiating plate (aluminum plate), 3 is a high heat generating component, 4 is a Peltier module, 5 is a connector, 6 is a heat pipe, 7 is a liquid cooling pipe, and 8 is a temperature sensor (for example, Thermistor).

In FIG. 1, a Peltier module 4 is arranged on the upper surface of a high heat generating component 3 of a printed wiring board 1 in contact with the component 3, and a printed wiring pattern or a wire is used to supply power to the Peltier module 4. Connect to connector 5. An electric current is supplied to the Peltier module 4 via the connector 5 to cool the Peltier module 4 contacting the high heat generating component 3 and operate the Peltier module 4 to generate heat on the opposite side. The heat generated in the Peltier module 4 is quickly spread over the entire area of the heat dissipation plate 2 having excellent heat conduction by keeping the side of the Peltier module 4 opposite to the contact side of the high heat generating component 3 with the heat dissipation plate (aluminum plate) 2. become. The heat spread throughout the heat radiating plate 2 is radiated from the surface of the heat radiating plate 2 having a large surface area, and further receives the flow of heat from the Peltier module 4.

In the example of the forced liquid cooling shown in FIG. 2, the end of the heat pipe 6 is brought into contact with the side of the Peltier module 4 opposite to the high heat generating component 3 in place of the heat sink 2 in the case of the natural heat radiation cooling. The other end of the heat pipe 6 is thermally and mechanically connected to the liquid cooling pipe 7. The heat generated by the high heat-generating component 3 heats one end of the heat pipe 6, and a temperature difference is generated at both ends of the heat pipe 6, so that the heat moves from the high temperature part to the low temperature part at high speed. The heat reaching the liquid cooling pipe 7 is sequentially cooled by a forced liquid cooling cooling mechanism not shown in the drawing.

Further, a plurality of temperature sensors 8 are arranged near or in contact with the high heat generating component 3, and the output of the temperature sensor 8 and the power input of the plurality of Peltier modules 4 are omitted in the figure. Temperature sensor 8 connected to temperature control circuit
Is fed back to the Peltier module 4 drive current to control the current applied to each Peltier module 4,
By varying the cooling capacity of the Peltier module 4, it is possible to adjust the temperature of the high heat-generating component. Further, by developing this temperature adjusting function, the current applied to the Peltier module 4 when the environmental temperature is lowered is made to reverse the polarity, so that the parts in contact with the Peltier module 4 are heated, and the proper operation guarantee range of the parts is ensured. It is also possible to increase the temperature.

The choice between the natural heat radiation cooling method and the forced liquid cooling method is advantageous when the heat generated by the heat-generating components of the electronic device is large. The forced liquid cooling method is advantageous. The method is suitable. FIGS. 1 and 2 show a method in which the Peltier module is brought into contact with the upper surface of the high heat generating component. However, when the heat generating portion of the high heat generating component is the bottom portion, it is omitted in the drawings. A method in which a Peltier module is brought into contact with the back surface of a printed wiring board is also effective.

[0015]

According to the present invention, since the heat of the high heat-generating component can be transferred without changing the structure of the printed wiring board main body, there is no restriction on the wiring and structure of the printed wiring board design. High-density mounting and high-density wiring can be performed without being affected by high heat-generating components. In addition, precise temperature control can be performed by controlling the current supplied to the Peltier module, so that the electronic components can be maintained at an appropriate temperature and the operation of the electronic device can be stabilized. Furthermore, since the electronic components can be heated by reversing the direction of the current supplied to the Peltier module, the operation of the electronic device can be maintained by heating the electronic components even in a low-temperature environment in the shade in outer space.

[Brief description of the drawings]

FIG. 1 shows a structural example of a printed wiring board using a thermoelectric cooling element, which is a natural heat radiation cooling system according to an embodiment of the present invention.

FIG. 2 shows a structural example of a forced wiring cooling system using a thermoelectric cooling element according to an embodiment of the present invention.

FIG. 3 shows a structural example of a conventional metal core printed wiring board and a heat sink printed wiring board.

FIG. 4 shows a shape example of a surface mount IC in a conventional metal core and heat sink.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Heat sink (Aluminum board) 3 High heat generation parts 4 Thermoelectric cooling element (Peltier module) 5 Connector 6 Heat pipe 7 Liquid cooling pipe 8 Temperature sensor (for example, thermistor) 9 Metal core printed wiring board 10 Metal core (Aluminum board) , Copper plate, copper invar copper plate, etc.) 11 printed wiring board 12 heat sink (aluminum plate, copper plate, etc.) 13 clearance hole

Claims (3)

[Claims] In a cooling structure for a high heat-generating component on a printed wiring board, a thermoelectric cooling element is arranged on an upper surface of the high heat-generating component in contact with the component, and a heat-generating side of the thermoelectric cooling element is disposed on a heat-radiating plate or a heat-radiating plate. A method for cooling a printed wiring board mounted part using a thermoelectric cooling element, which is brought into contact with an end of a heat pipe. 2. A structure for cooling a high heat generating component on a printed wiring board, wherein a thermoelectric cooling element is arranged in contact with the back surface of the printed wiring board on a surface on which the high heat generating component is mounted, and the heat generation side of the thermoelectric cooling element is radiated. A method for cooling a component mounted on a printed wiring board using a thermoelectric cooling element, which is brought into contact with an end of a board or a heat pipe. 3. A component mounted on a printed wiring board using a thermoelectric cooling element, wherein a temperature sensor is arranged near a high heat generating component, and an output of the temperature sensor is returned to a thermoelectric cooling element by a temperature control circuit. Cooling method.