JP2001185902A - Composite high-frequency component and communication device using same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite high-frequency component which actualizes small size and low power consumption for a microwave circuit used for the front-end part of a dual-band device. SOLUTION: A switch made of a GaAs semiconductor having a wide frequency band is used as a switch 3. To receive a signal, the switch 3 is connected to a 2nd diplexer 2 and the receive signal inputted to a 3rd common terminal a7 is outputted from a 1st output terminal a5 or 2nd output terminal a6. To send a signal, the switch 3 is connected to a 1st diplexer 1 and the transmit signal inputted to a 1st input terminal a2 or 2nd input terminal a3 is outputted from the 3rd common terminal a7. Consequently, small size and low power consumption are actualized by decreasing the number of switches and the circuit can easily be controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applicable to a composite high-frequency component used in the field of microwave circuits and a communication device using the same, and more particularly, to a front end portion of a communication device compatible with a plurality of different wireless communication systems. The present invention relates to a composite high-frequency component and a communication device using the same.

[0002]

2. Description of the Related Art In recent years, communication devices such as mobile phones have become widespread, and there are many communication systems and standards. For example, as a standard of the TDMA system, in Europe, DC
S (Digital Cellular System)
m) and GSM (Global System comm
standards exist. And
In normal wireless communication, communication is performed using a frequency band corresponding to any one standard.

In such communication devices, recently,
A so-called dual band device, which is a communication device corresponding to a plurality of different standards, has been proposed. For example, a dual band machine of DCS and GSM has a frequency band of DCS and GSM.
Corresponding to the SM frequency band, communication is sometimes performed in the DCS frequency band, and communication is sometimes performed in the GSM frequency band. As described above, by handling the frequency bands of a plurality of standards, when communication is impossible in the frequency band of one standard, communication can be performed in the frequency band of the other standard.

FIG. 7 shows a block diagram of a conventional communication device used as a dual band device of DCS and GSM. The frequency band of the signal is the GSM transmission signal Tx
1 is a frequency band from 890 MHz to 915 MHz, a reception signal Rx1 is a frequency band from 935 MHz to 965 MHz, a DCS transmission signal Tx2 is a frequency band from 1710 MHz to 1785 MHz, and a reception signal Rx2 is a frequency band from 1805 MHz to 1880 MHz.

In FIG. 7, a conventional communication device 30 has an antenna 29 to which a reception signal is input and a transmission signal is output.
, A composite high-frequency component 20, a transmission circuit 281 for generating a transmission signal, and a reception circuit 282 for processing a reception signal. The composite high-frequency component 20 includes a diplexer 23 and a G
It has an SM diode switch 21 and a DCS diode switch 22. The diplexer 23 includes a terminal a27 connected to the antenna 29, a terminal a28 connected to the GSM diode switch 21, a terminal a29 connected to the DCS diode switch 22, and a GSM signal having a low-pass filter characteristic. It has a signal path 23a to be transmitted, and a signal path 23b having a high-pass filter characteristic and transmitting a DCS signal. The GSM diode switch 21 includes a terminal a21 connected to the diplexer 23, a terminal a22 to which the transmission signal Tx1 is input from the transmission circuit 281, and a reception signal Rx1
And a terminal a23 for outputting When transmitting, the GSM diode switch 21 is connected to the terminal a21 and the terminal a.
22 and the terminal a21 and the terminal a23 are connected during reception. The DCS diode switch 22 includes a terminal a 24 to which the diplexer 23 is connected, and a transmission circuit 2.
It has a terminal a25 to which the transmission signal Tx2 is inputted from 81 and a terminal a26 to output the reception signal Rx2 to the reception circuit 282. And the DCS diode switch 22 is
The terminal a24 and the terminal a25 are connected during transmission, and the terminal a24 and the terminal a26 are connected during reception.

As examples of the operation of the composite high-frequency component 20, the GSM transmission signal Tx1 output from the transmission circuit 281 is transmitted from the antenna 29, and the GSM reception signal Rx1 received from the antenna 29 is transmitted to the reception circuit 282. Will be described. When transmitting the GSM transmission signal Tx1, the terminals a21 and a22 of the GSM diode switch 21 are connected, and the terminal a
21 and the terminal a23 are disconnected. And the transmission circuit 2
The GSM transmission signal Tx1 output from the
The signal is input to terminal a22 via 1a, output from terminal a27 via signal path 23a, and transmitted from antenna 29. When the GSM reception signal Rx1 is received, the terminal a21 of the GSM diode switch 21 is received.
And the terminal a23 are connected, and the terminal a21 and the terminal a22 are disconnected. The reception signal received by the antenna 29 is input to the terminal a27, and among the reception signals input to the terminal a27, only the GSM reception signal Rx1 is transmitted from the terminal a23 via the signal path 23a to the reception circuit via the wiring 282a. As described above, the composite high-frequency component 20 input to the diplexer 23 has a wide frequency band of 900
From 1800 MHz to 1800 MHz,
The GSM diode switch 21 receives and transmits / receives a transmission / reception signal in the vicinity of 900 MHz having a narrow frequency band.
The diode switch 22 has a narrow frequency band 180.
A transmission / reception signal near 0 MHz is input / output. Therefore, a diode switch having a narrow frequency band is used as a switch for separating a transmission signal and a reception signal.

[0007]

SUMMARY OF THE INVENTION A composite high frequency component 20
Is mounted on the communication device 30 such as a mobile phone, so that downsizing and low power consumption are required, and at the same time, downsizing of the circuit board by simplifying the control part is also required.

The diplexer 23, which is a part of the composite high-frequency component 20 and is composed of a coil, a capacitor, and the like, can be formed in a ceramic multilayer substrate, can be reduced in size, consumes less power, and controls You don't have to.

On the other hand, the GSM diode switch 21 and the DCS diode switch 22 each composed of a diode, a transistor, and the like are difficult to configure in a ceramic multilayer substrate, are difficult to reduce in size, consume a large amount of power, You also need to control. In addition, since the composite high-frequency component 20 has two switches, the GSM diode switch 21 and the DCS diode switch 22, which are equal to the number of signal standards to be used, the composite high-frequency component 2
However, there is a problem in that it is difficult to reduce the size of the device, the power consumption is large, and the control is complicated.

According to the conventional composite high-frequency component 20, the diplexer 23, the GSM diode switch 2
1 and the DCS diode switch 22 are discretely mounted on the circuit board one by one, and in order to ensure matching characteristics, attenuation characteristics, or isolation characteristics, the diplexer 23, the GSM diode switch 21 and the DCS It is necessary to add a matching circuit between the switch and the diode switch 22. Therefore, there is a problem that the number of components increases and the mounting area increases accordingly, so that miniaturization and cost reduction cannot be achieved.

Further, in general, when designing a communication device using a composite high-frequency component, the composite high-frequency component and a portion of the communication device excluding the composite high-frequency component are individually designed, and finally, the two components are combined. Is taken. And
In the design of the part excluding the composite high-frequency component, it is often the case that the configuration of the entire circuit is divided into a transmitting unit and a receiving unit. However, in the conventional composite high-frequency component 20, the configuration of the entire circuit is divided not in the transmission unit and the reception unit but in the communication system. That is, a GSM diode switch 21 for transmitting and receiving GSM-based signals and a DC
It is divided into a DCS diode switch 22 that transmits and receives S-system signals. Therefore, when the conventional composite high-frequency component 20 is combined with a portion excluding the composite high-frequency component, the design of a matching circuit between the composite high-frequency component and the portion excluding the composite high-frequency component from the communication device becomes complicated, There is a problem that circuit wiring for connection is complicated.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a composite high-frequency component which can be reduced in size and power consumption by reducing the number of switches used, and which can be easily controlled, and a communication device using the same. I do.

Another object of the present invention is to provide a composite high-frequency component that does not require a matching circuit inside the composite high-frequency component or that can easily perform matching adjustment and that can be reduced in size and cost, and a communication device using the same. Aim.

Further, the present invention facilitates the design of a matching circuit provided between a high-frequency component and a portion obtained by removing a composite high-frequency component from a communication device, and a circuit for connecting the two components. It is an object of the present invention to provide a composite high-frequency component capable of simplifying wiring and a communication device using the same.

[0015]

To achieve the above object, a composite high-frequency component according to the present invention comprises a first diplexer having a first input terminal, a second input terminal, and a first common terminal. A second diplexer having a first output terminal, a second output terminal, and a second common terminal, and having a third input terminal, a third output terminal, and a third common terminal, Either a third input terminal or the third output terminal,
A switch that is switchably connected to the third common terminal, wherein the first common terminal is connected to the third input terminal, and the second common terminal is connected to the third output terminal. It is characterized by having.

Further, in the composite high-frequency component according to the present invention, the frequency band in which the switch performs a switch operation includes the entire frequency band of signals input to and output from the first diplexer or the second diplexer or the switch. It is characterized by.

Further, the composite high-frequency component of the present invention has a multilayer substrate, wherein the first diplexer, the second diplexer, and the switch are mounted on the multilayer substrate, or inside the multilayer substrate. By being constituted, it is characterized by being integrated with the multilayer substrate.

Further, in the composite high-frequency component of the present invention, the multilayer substrate is formed by firing a plurality of sheet layers made of a ceramic substrate having electrodes formed of copper by low-temperature firing, and is included in the multilayer substrate. It is characterized in that the inductor is constituted by a strip line.

Further, the composite high frequency component of the present invention is characterized in that the switch is mounted on the multilayer substrate.

Further, in the composite high-frequency component according to the present invention, the multilayer substrate has a concave portion, the switch is mounted in the concave portion, and the resin is filled in the concave portion so as to surround the switch. I do.

Further, the composite high frequency component of the present invention is characterized in that the switch is made of a GaAs semiconductor.

Further, the composite high frequency component of the present invention has a filter, and at least one terminal of the first diplexer, the second diplexer, and the switch is connected to the filter. .

Further, a communication device according to the present invention is characterized in that the composite high frequency component is used.

With this configuration, the number of switches used in the composite high-frequency component of the present invention can be reduced, so that downsizing, low power consumption, and easy control can be achieved.

In the composite high-frequency component of the present invention, the entire circuit can be divided into a first diplexer as a transmitting unit and a second diplexer as a receiving unit. When a part excluding the composite high-frequency component is combined with the device, a matching circuit provided between the two can be easily designed, and circuit wiring for connecting the two can be simplified.

In the composite high-frequency component of the present invention, the first diplexer, the second diplexer, and the switch are integrated into a multilayer substrate, so that the first diplexer or the second diplexer and the switch may be integrated. The matching adjustment is facilitated, or a matching circuit for performing the matching adjustment is not required, and the size and cost of the high-frequency component can be reduced.

Further, the composite high-frequency component of the present invention uses a multilayer substrate obtained by firing a plurality of sheet layers made of a ceramic substrate having electrodes formed of copper by low-temperature firing, so that high-frequency characteristics can be improved. In addition, cost can be reduced.

In the composite high-frequency component of the present invention, the first diplexer, the second diplexer, and the switch are integrated on the multilayer substrate, and the wiring of the circuit is formed on the surface or inside of the multilayer substrate. As a result, it is possible to reduce the power consumption of the entire composite high-frequency component.

Further, in the composite high-frequency component of the present invention, since the inductor is constituted by the strip line in the multilayer substrate, the length of the strip line electrode serving as the inductor can be reduced by the wavelength shortening effect. High-frequency components can be reduced in size and power consumption can be reduced.

The communication device of the present invention also has the same function and effect by mounting the composite high-frequency component of the present invention.

[0031]

FIG. 1 is a block diagram showing an embodiment of a composite high-frequency component according to the present invention. 1, the same or equivalent parts as those in FIG. 7 are denoted by the same reference numerals, and the description thereof will be omitted. In the following description, a composite high-frequency component used in a communication device that is a dual band device of DCS and GSM will be described as an example.

In FIG. 1, the composite high-frequency component 10 has a first diplexer 1 as a transmitting unit, a second diplexer 2 as a receiving unit, and a switch 3 for switching between transmission and reception. The first diplexer 1 has a terminal a1 which is a first common terminal connected to the switch 3, and a GS
A terminal a2 which is a first input terminal to which the M transmission signal Tx1 is input, a terminal a3 which is a second input terminal to which the DCS transmission signal Tx2 is input, and a low-pass between the terminals a1 and a2. Transmission signal path 1a having filter characteristics
And a transmission signal path 1b having a high-pass filter characteristic between the terminal a1 and the terminal a3. The second diplexer 2 includes a terminal a4 as a second common terminal connected to the switch 3, a terminal a5 as a first output terminal from which a GSM reception signal Rx1 is output, and a DCS reception signal Rx
2 has a second output terminal, a terminal a6, a reception signal path 2a having a low-pass filter characteristic between the terminals a4 and a5, and a high-pass filter characteristic between the terminals a4 and a6. And a reception signal path 2b. The switch 3 includes a terminal a7 that is a third common terminal connected to the antenna, a terminal a8 that is a third input terminal connected to the first diplexer 1, and a terminal a8 that is connected to the second diplexer 2. And a terminal a9 which is a third output terminal. In the switch 3, the terminal a7 is connected to the terminal a8 during transmission, and the terminal a7 is connected to the terminal a9 during reception.

Here, the transmission signal path 1a of the first diplexer 1 passes only GSM transmission signals, and the transmission signal path 1b passes only DCS transmission signals. The reception signal path 2a of the second diplexer 2 passes only GSM reception signals, and the reception signal path 2b passes only DCS reception signals.

The composite high-frequency component of the present invention having such a configuration outputs transmission signals Tx1 and Tx2 input to the first diplexer 1 from the antenna via the switch 3 during transmission, and outputs the transmission signals Tx1 and Tx2 to the antenna during reception. Input received signal R
x1 and Rx2 are output from the second diplexer 2 via the switch 3.

In the case of a GSM and DCS dual band device, the transmission signal Tx1 is 890 MHz to 915 MHz.
Hz, transmission signal Tx2 is 1710MHz to 1785M
Hz, reception signal Rx1 is 935 MHz to 965 MH
z, the received signal Rx2 is from 1805 MHz to 1880 MH
switch 3 is at least 8
It must have a frequency band from 90 MHz to 1880 MHz. Such a switch having a wide frequency band includes a switch made of a GaAs semiconductor. The frequency band of the switch composed of diodes is 3
The frequency band of the switch made of GaAs semiconductor is 1500 MHz to 200 MHz, while the frequency band is about 00 MHz.
It is about 0 MHz.

As described above, the composite high-frequency component 10 of the present invention
By providing the switch 3 having a wide frequency band between the antenna and the diplexer, only one switch is required, that is, the number of switches used can be reduced.

Further, in the composite high-frequency component 10 of the present invention, the switch 3 having a wide frequency band is provided between the antenna and the diplexer, so that the entire circuit configuration includes the first diplexer 1 as a transmitting unit and the receiving unit. And the second diplexer 2.

FIG. 2 shows a specific circuit diagram of the composite high-frequency component 10 of the present invention. In FIG. 2, the transmission signal path 1a of the first diplexer 1 includes a capacitor C1 and a coil L1.
Are connected in parallel, one end of the coil L1 is connected to the terminal a1, and the other end of the coil L1 is grounded via the capacitor C2. The other end of the coil L1 is connected to the terminal a2. The transmission signal path 1a having such a configuration has a low-pass filter characteristic for passing a signal in a frequency band of 915 MHz or less. On the other hand, in the transmission signal path 1b, one end of the capacitor C3 is connected to the terminal a1, the other end of the capacitor C3 is connected to one end of the capacitor C4, and further grounded via the coil L2 and the capacitor C5. The other end of the capacitor C4 is connected to the terminal a3. The transmission signal path 1b having such a configuration has a high-pass filter characteristic for passing a signal in a frequency band of 1710 MHz or more.

In the second diplexer 2, the reception signal path 2a is connected to the capacitor C6 and the coil L3 in parallel, one end of the coil L3 is connected to the terminal a4, and the other end of the coil L3 is connected to the capacitor C7. Grounded. The other end of the coil L3 is connected to the terminal a5. Received signal path 2a having such a configuration
Has a low-pass filter characteristic of passing a signal in a frequency band of 965 MHz or less. On the other hand, reception signal path 2
In b, one end of the capacitor C8 is connected to the terminal a4, the other end of the capacitor C8 is connected to one end of the capacitor C9, and further grounded via the coil L4 and the capacitor C10 in this order. The other end of the capacitor C9 is connected to a terminal a.
6 is connected. The reception signal path 2b having such a configuration has a high-pass filter characteristic for passing a signal in a frequency band of 1805 MHz or more.

In the switch 3, the terminals a7 and a8 are connected via a transistor Tr1, and the terminals a7 and a9 are connected via a transistor Tr2. The gates of the transistors Tr1 and Tr2 are connected to control terminals Vc1 and Vc2 via R1 and R2, respectively.

In the composite high-frequency component 10 of the present invention having such a configuration, a control voltage is applied to the control terminals Vc1 and Vc2 such that only one of the transistors Tr1 and Tr2 is turned on. At the time of transmission, the transistor Tr1 is turned on, and the terminals a7 and a8 are connected.
The transmission signal Tx1 or Tx2 input from the terminal a2 or a3 is transmitted to the transmission signal path 1a or 1x.
The signal is input to the switch 3 via b and output from the terminal a7. At the time of reception, the transistor Tr2 is turned on, and the terminals a7 and a9 are connected. The received signals Rx1 and Rx input to the switch 3 from the terminal a7
2 are connected to terminals a5 and a5 via the reception signal paths 2a and 2b.
6 is output.

FIGS. 3 and 4 show a specific structure of the composite high-frequency component 10 of the present invention. FIG. 3 shows a composite high-frequency component 10
FIG. 4 is a perspective view of the composite high-frequency component 10.
FIG. 10 shows a cross-sectional view taken along the line 0a-10a.

In FIG. 3, a composite high-frequency component 10 is provided on the side and bottom surfaces of a multilayer substrate 8a made of ceramic.
Terminals a2, a3, a5, a6, a7 and a control terminal Vc
1, Vc2 and the terminal GND are formed by screen printing or the like. Also, a concave portion 8a1 is provided on the upper surface of the multilayer substrate 8a, and the bare chip IC1 is provided in the concave portion 8a1.
Is installed. Inside the bare chip IC1, transistors Tr1 and Tr2 and resistors R1 and R2 are configured. Although the concave portion 8a1 is filled with resin so as to surround the bare chip IC1, it is not shown here.

Although not shown in FIG. 3, the composite high-frequency component 10 in FIG. 4 has a first diplexer 1 and a second diplexer 2 formed inside a multilayer substrate 8a, and a concave portion 8a1. The projection 8a2 is provided. The first diplexer 1 provided inside the multilayer substrate 8a is connected to the transistor Tr1 configured inside the bare chip IC1 via the via hole 8d1 and the wire 8c1. Further, terminals a7 formed on the side and bottom surfaces of the multilayer substrate 8a are connected to the transistor Tr1 via the via holes 8d2 and the wires 8c2. The recess 8a1 is filled with a resin 8b so as to surround the bare chip IC1.

Here, the wire 8c1 and the via hole 8d1, and the wire 8c2 and the via hole 8d are provided by providing the convex portion 8a2 substantially corresponding to the height of the bare chip IC1.
2 can be easily connected, and work efficiency can be improved.

The composite high frequency component 1 having such a configuration
No. 0 is filled with a resin 8b so as to surround the bare chip and the wire mounted on the concave portion 8a1 of the multilayer substrate 8a. Therefore, the bare chip and the wire mounted in the concave portion 8a1 can be protected from external impact and the like.

Further, since the coil and the capacitor are formed of the strip line electrode and are built in or mounted on the ceramic substrate, the length of the strip line electrode can be shortened by the wavelength shortening effect. Therefore, since the insertion loss of these stripline electrodes can be reduced, the size and power consumption of the composite high-frequency component can be reduced.

The multilayer substrate 8a is formed by printing circuit elements such as strip lines on each of the sheet layers made of ceramics containing barium oxide, aluminum oxide, and silica as main components by screen printing or the like, and sequentially printing them from the top. It is desirable to form by laminating and firing at a firing temperature of 1000 degrees or less. By using such a low-temperature sintered ceramic substrate, an electrode can be formed using copper or the like instead of silver or palladium. When copper is used for the electrodes of the composite high-frequency component 10, the high-frequency characteristics such as the Q value are improved and the manufacturing cost is lower than when silver or palladium is used. In the present embodiment, the description has been made using the embodiment in which only one bare chip is mounted on the multilayer substrate,
A plurality of bare chips and other circuit elements may be mounted.

FIG. 5 is a block diagram showing another embodiment of the composite high-frequency component of the present invention. In FIG. 5, the same or equivalent parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 5, the composite high-frequency component 11 has a filter 7a having a band-pass filter characteristic between the terminals a7 and a8 and the terminal a9.
And a filter 7b having a band-pass filter characteristic between the terminals a9 and a4. The filter 7a removes the noise of the transmission / reception signal input / output to / from the antenna, the filter 7b removes the noise of the transmission signal input from the first diplexer 1, and the filter 7c inputs the noise to the second diplexer 2. To remove noise from the received signal.

The composite high frequency component 1 having such a configuration
1 can match the filters 7a, 7b, 7c with the switch 3, the first diplexer 1, and the second diplexer 2 because the filters 7a, 7b, 7c can be integrated with the multilayer substrate. Adjustment is facilitated, or it is not necessary to provide a matching circuit.

In FIG. 5, the filters 7a, 7
Although b and 7c are illustrated, one or two of the filters 7a, 7b and 7c may be provided, or between the terminals a1 and a2 and the terminal a3, or between the terminals a4 and a5,
It may be provided between the terminal a6 and the like. Filter 7
a, 7b, and 7c may be configured on the surface of the multilayer substrate or may be configured inside the multilayer substrate. Also, as a filter,
Arbitrary filters such as a high-pass filter, a low-pass filter, a band-pass filter, and a notch filter can be appropriately used.

FIG. 6 shows a communication device of the present invention. 6, the communication device 12 includes the composite high-frequency component 10, the antenna 9, the transmission circuit 81, and the reception circuit 82 described in FIG. The antenna 9 is connected to the terminal a7. The transmission circuit 81 is connected to a terminal a2 via a wiring 81a and to a terminal a3 via a wiring 81b. The receiving circuit 82 is connected to the terminal a5 via the wiring 82a,
It is connected to terminal a6 via 2b.

The communication device 12 having such a configuration is
The configuration of the entire circuit of the composite high-frequency component 10 is divided into a first diplexer 1 as a transmitting unit and a second diplexer 2 as a receiving unit. Therefore, when designing the communication device 12 using the composite high-frequency component 10, the transmission circuit 81 and the reception circuit 82, which are parts of the communication device 12 excluding the composite high-frequency component 10, are separately provided from the composite high-frequency component 10. It is possible to take steps of designing and finally combining these. Therefore, when the communication device 12 combines the composite high frequency component 10, the transmission circuit 81, and the reception circuit 82, the design of the matching circuit is easy, and the circuit wiring for connection can be simplified.

Although the description has been given using the composite high-frequency component 10 having no filter in FIG. 6, the communication device 12 may have a filter like the composite high-frequency component 11 shown in FIG. Needless to say.

In each of the above embodiments, the diplexer having the high-pass filter characteristic and the low-pass filter characteristic has been described. However, other than this combination, the high-pass filter characteristic, the low-pass filter characteristic, the band-pass filter characteristic, and the notch may be used. It goes without saying that a similar effect can be obtained even if a diplexer having any combination of filter characteristics and the like is used. In addition, GSM and DCS, besides GSM and DCS, PCS, W-CDMA,
DECT, AMPS, PDC800, PHS or the like may be used. Also, although the description has been made using the FET as the switch,
A transistor, a diode, or the like may be used. Further, the capacitor and the coil may be provided inside or outside the multilayer substrate, and each diplexer does not necessarily need to be configured using the multilayer substrate.

[0057]

According to the composite high-frequency component of the present invention, the number of switches used can be reduced by providing a switch having a wide frequency band between the antenna and the diplexer. Control becomes easy.

In the composite high-frequency component of the present invention, a switch having a wide frequency band is provided between the antenna and the diplexer, so that the entire circuit configuration is changed to the first diplexer as the transmitting unit and the second diplexer as the receiving unit. Since it can be divided into two diplexers, when a composite high-frequency component is combined with a part excluding the composite high-frequency component from a communication device, it is easy to design a matching circuit provided between the two components. The circuit wiring for connection can be simplified.

Further, in the composite high-frequency component of the present invention, the first diplexer, the second diplexer and the switch are integrated into the multilayer substrate. The matching adjustment is facilitated, or a matching circuit for performing the matching adjustment is not required, and the size and cost of the high-frequency component can be reduced.

Further, the composite high-frequency component of the present invention uses a multilayer substrate obtained by firing a plurality of sheet layers made of a ceramic substrate having electrodes formed of copper by low-temperature firing, so that high-frequency characteristics can be improved. In addition, cost can be reduced.

In the composite high frequency component of the present invention, the first diplexer, the second diplexer, and the switch are integrated on the multilayer substrate, and the circuit wiring is also formed on the surface or inside the multilayer substrate. As a result, it is possible to reduce the power consumption of the entire composite high-frequency component.

Further, in the composite high-frequency component of the present invention, since the inductor is formed of the strip line in the multilayer substrate, the length of the strip line electrode serving as the inductor can be shortened by the wavelength shortening effect. High-frequency components can be reduced in size and power consumption can be reduced.

The communication device of the present invention also has a similar effect by mounting the composite high-frequency component of the present invention.

[Brief description of the drawings]

FIG. 1 is a block diagram showing one embodiment of a composite high-frequency component of the present invention.

FIG. 2 is a circuit diagram showing a specific example of the composite high-frequency component of FIG.

FIG. 3 is a perspective view showing a specific example of the composite high-frequency component of FIG.

FIG. 4 is a cross-sectional view of the composite high-frequency component of FIG. 3 taken along the line 10a-10a.

FIG. 5 is a block diagram showing another embodiment of the composite high-frequency component of the present invention.

FIG. 6 is a block diagram showing one embodiment of the communication device of the present invention.

FIG. 7 is a block diagram showing a conventional communication device.

[Explanation of symbols]

 10, 11: composite high frequency component 12: communication device 1: first diplexer 2: second diplexer 3: switch 1a, 1b: transmission signal path 2a, 2b: reception signal path Tx1, Tx2: transmission signal Rx1, Rx2 ... Received signal 81: Transmission circuit 82: Receiving circuit 9: Antenna

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04B 1/50 H04B 1/50 (72) Inventor Hideki Muto 2-26-10 Tenjin, Nagaokakyo-shi, Nagaoka, Kyoto Stock (72) Inventor Takanori Uejima 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company Murata Manufacturing Co., Ltd. (72) Inventor Norio Nakajima 2-26-10 Tenjin, Nagaokakyo-shi Kyoto Prefecture Murata Manufacturing Company F term (reference) 5J006 KA01 KA11 KA24 LA21 PB00 5J012 BA03 5J024 AA01 BA11 CA09 DA01 EA01 EA02 5K011 BA03 BA10 DA02 DA21 JA01 KA01

Claims (9)

[Claims] A first diplexer having a first input terminal, a second input terminal, and a first common terminal; and a first output terminal, a second output terminal, and a second common terminal. Having a second diplexer, having a third input terminal, a third output terminal, and a third common terminal, wherein one of the third input terminal and the third output terminal is A switch that is switchably connected to a third common terminal, wherein the first common terminal is connected to the third input terminal,
The composite high-frequency component, wherein the second common terminal is connected to the third output terminal. 2. The frequency band in which the switch performs a switch operation includes the entire frequency band of signals input / output to / from the first diplexer or the second diplexer or the switch. A composite high-frequency component according to item 1. 3. The multi-layer board according to claim 1, further comprising a multi-layer board, wherein the first diplexer, the second diplexer, and the switch are mounted on the multi-layer board or configured inside the multi-layer board. The composite high-frequency component according to claim 1, wherein the composite high-frequency component is integrated with a substrate. 4. The multilayer substrate is formed by firing a plurality of sheet layers made of a ceramic substrate having electrodes formed of copper by low-temperature firing, and an inductor included in the multilayer substrate is configured by a strip line. The composite high-frequency component according to claim 3, wherein: 5. The composite high-frequency component according to claim 3, wherein the switch is mounted on the multilayer substrate. 6. The multi-layer substrate according to claim 5, wherein the multilayer substrate has a concave portion, the switch is mounted in the concave portion, and the concave portion is filled with resin so as to surround the switch. Composite high frequency components. 7. The composite high-frequency component according to claim 1, wherein said switch is made of a GaAs semiconductor. 8. The filter according to claim 1, further comprising a filter, wherein at least one terminal of the first diplexer, the second diplexer, and the switch is connected to the filter. A composite high-frequency component according to any of the above. 9. A communication device using the composite high-frequency component according to claim 1.