JP2001165995A - Burn-in test system, burn-in test method, and storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently carry out all burn-in tests by preventing works from being redundant among a plurality of burn-in tests carried out per semiconductor integrated circuit. SOLUTION: Map data, stored in a memory part in a server 20, is updated on the basis of test results by a burn-in testing apparatus 30. In executing a burn-in test in a burn-in testing apparatus 40, the test is carried out on the basis of map data stored in the memory part in the server 20. All the test results are overwritten to the map data stored in the memory part in the server 20. An unloader 50 extracts the semiconductor integrated circuit from a burn-in board, based on the map data in which propriety judgments and classifications for all burn-in tests are stored.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in test system and a burn-in test method for a semiconductor integrated circuit, and more particularly, to a burn-in test system in which a plurality of burn-in tests take over data created by an apparatus in each process. The present invention relates to a burn-in test method and a storage medium for storing the data processing program.

[0002]

2. Description of the Related Art Conventionally, semiconductor integrated circuits (ICs) and LSIs (Laser Integrated Circuits) used in various electronic devices have been developed.
rge Scale Integrated circuit)) realizes the function of each element such as a resistor, a capacitor, and a transistor by a circuit formed by a method such as printing or vapor deposition. Characteristic variations occur. It is necessary to ensure the reliability of the semiconductor integrated circuit by testing whether or not the characteristics of the semiconductor integrated circuit satisfy the standard and determining whether the semiconductor integrated circuit is good or bad. The test of the semiconductor integrated circuit, that is, the IC test is performed by an IC test system.

[0003] For example, as one form of this IC test, there is a burn-in test in which a semiconductor integrated circuit is placed in a constant temperature bath and a power supply voltage or a test pattern signal is applied to the semiconductor integrated circuit in the bath from the outside.

[0004] In the burn-in test, the temperature in the thermostat is set to a high or low temperature, a test pattern signal is applied for a long time to apply stress, and an initial failure is detected. Also, in the burn-in test, the test time per semiconductor integrated circuit is long, so thousands to 10,000 semiconductor integrated circuits are stored in the tank to shorten the test time and reduce the cost of the device. I have.

[0005] As an interface for applying a power supply voltage or a test pattern signal from outside the semiconductor integrated circuit in a thermostat, there is a board called a burn-in board on which the semiconductor integrated circuit is mounted. Each burn-in board can mount several hundreds of semiconductor integrated circuits, and can house several to several tens of burn-in boards in a thermostat.

[0006] The work of mounting the semiconductor integrated circuit on the burn-in board is performed by a mounting robot.
The mounting robot mounts the semiconductor integrated circuit on the burn-in board and creates positional information of the mounted semiconductor integrated circuit on one burn-in board.

When a burn-in board on which a semiconductor integrated circuit is mounted is set in a thermostat by a mounting robot, the burn-in test apparatus performs a burn-in test on the assumption that all of the mounted semiconductor integrated circuits are non-defective. Perform the test. And by this burn-in test,
Classifying semiconductor integrated circuits into a plurality of categories (BIN),
The result of the classification is added to the position information. After the test, remove the semiconductor integrated circuit from the burn-in board,
The operation of classifying each category is performed based on the classification result added to the position information by the robot for classification and removal operation.

[0008]

However, when a burn-in test is performed under a plurality of temperature conditions, a defective product is burned in every test from the setting that all the burn-in tests are started from a good product. After removing it from the board and mounting it again, it had to move on to the next test. That is, as the number of tests increases, several hundreds of semiconductor integrated circuits must be repeatedly mounted, removed, and classified, and the operation becomes redundant.

SUMMARY OF THE INVENTION It is an object of the present invention to prevent a redundant operation between a plurality of burn-in tests executed for one semiconductor integrated circuit and to efficiently execute all burn-in tests.

[0010]

According to the first aspect of the present invention,
A device transport / unloading device (e.g., the loader 10 and the unloader 50 in FIG. 1) for transporting and placing a plurality of devices under test on the burn-in board and unloading the plurality of devices under test from the burn-in board; The burn-in board on which the device under test is mounted is housed in a thermostat, and a test signal is applied to the plurality of devices under test to execute a burn-in test (for example, the burn-in test devices 30 and 40 in FIG. 1). )
The device transport / unloading device is connected to the burn-in test device via a communication line (for example, the network 60 in FIG. 1), and stores the arrangement information of the plurality of devices to be measured and the burn-in test result in association with each other. And a management device (for example, the server 20 of FIG. 1) having a storage unit for performing the burn-in test, wherein the device transport / unloading device transmits the arrangement information of the plurality of devices under test to the communication device. The burn-in test result is transmitted to the management device via a line and stored in the storage unit, and the burn-in test result stored in the storage unit in association with the arrangement information is read out via the communication line, based on the burn-in test result. Selecting and discharging a plurality of devices under test from the burn-in board; By reading the arrangement information stored in the storage means of the management device via the communication line, a burn-in test is performed on a plurality of devices under test on the burn-in board based on the arrangement information, and the execution of the burn-in test is performed. A burn-in test result of each device under test is determined based on the result, and each determination result is associated with the read-out arrangement information, transmitted to the management device via the communication line, and stored in the storage unit. The updated burn-in test results are updated.

Therefore, when a burn-in test is performed by a plurality of burn-in test apparatuses, the result of the test performed by the immediately preceding burn-in test apparatus can be referred to by a burn-in test apparatus that will execute the test. Therefore, for example, if all burn-in test apparatuses are set to test only devices determined to be non-defective, devices that are once determined to be defective are excluded from the test target, and the processing time of the test can be reduced. .

Further, since the test results of the plurality of burn-in test apparatuses can be updated in the storage means of the management apparatus, the device transport / unloading apparatus can store a plurality of test results based on the plurality of test results stored by the storage means. Devices can be distinguished. That is, for a plurality of burn-in tests, the operation of transporting / unloading the device to / from the burn-in board can be performed only once. This makes it possible to reduce the burden on the work operator and to significantly reduce the test time.

According to a second aspect of the present invention, in the burn-in test system according to the first aspect, the device transport / unloading device transmits arrangement information of the plurality of devices under test to the management device via the communication line. Then, when storing the data in the storage means, the burn-in test result is initialized.

Therefore, the storage means of the management device does not confuse the test result input from the burn-in test device with the position information input from the device transport / unloading device, and uses this burn-in test system. It is possible to cope with various burn-in tests.

According to a third aspect of the present invention, in the burn-in test system according to the first or second aspect, the storage unit of the management device associates a burn-in test result of each device under test with the arrangement information. It is stored as map information.

Accordingly, the position of each device with respect to the burn-in board which has been managed one-dimensionally can be displayed on the display screen as two-dimensional information, so that the user can easily manage it. As described above, when a plurality of burn-in tests are performed, a plurality of test results can be browsed as one piece of map information.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, the configuration will be described. In the embodiment of the present invention, a case where two types of burn-in tests are executed, that is, a case where the performance of a semiconductor integrated circuit is tested via two burn-in test apparatuses will be described below. For example, it is assumed that a high-temperature experiment is performed in a first burn-in test apparatus and then a low-temperature experiment is performed in a second burn-in test apparatus. However, in general, when performing two or more types of burn-in tests, relatively loose conditions are determined in the first burn-in test, and the quality is further limited in the second burn-in test. The test order is determined to be strict. Therefore, it is also assumed here that the conditions of the second burn-in test are stricter than the first.

FIG. 1 is a block diagram showing a main configuration of a burn-in test system 1 according to an embodiment of the present invention. In FIG. 1, a burn-in test system 1 includes a loader 10, a server 20, a burn-in test apparatus 3
0, 40, and an unloader 50,
These blocks are connected by a network 60.

The loader 10 mounts a semiconductor integrated circuit on a burn-in board, creates position information of each semiconductor integrated circuit with respect to the burn-in board, and creates the position information via the network 60 in the same manner as the above-described mounting operation robot. The information is output to the server 20. Further, the burn-in board on which the semiconductor integrated circuit is mounted by the loader 10 is set in a slot provided in a constant temperature bath of the burn-in test apparatus 30.

The server 20 includes a control unit for controlling the main components of the server 20, a display unit for displaying data output from the control unit on a display screen, and a control unit using information input by a keyboard, a mouse or the like as an input signal. And a storage unit for storing data instructed by the control unit, a program for the control unit to execute various processes, and the like. When the control unit creates the map 21 shown in FIG. 2 from the position information of the semiconductor integrated circuit input from the loader 10, the control unit outputs the map display data to the display unit to display on the display screen, and further stores the map data in the storage unit. Is stored. Further, the control unit controls each of the burn-in test devices 30, 40.
When the map data stored in response to the request for calling the map data is output from the unloader 50, and the test result is input from each of the burn-in test devices 30, 40, the map data stored in the storage unit is updated each time. I do.

FIG. 2 is a diagram showing an example in which a map 21 created based on the position information output from the loader 10 and details such as a test program name and a test start date and time are displayed on a display screen. In the map 21, a matrix component composed of a letter on the horizontal axis and a number on the vertical axis indicates the position of each semiconductor integrated circuit mounted on the burn-in board. Characters P, f, and s given on the map 21 indicate the results of the burn-in test of the semiconductor integrated circuit corresponding to the matrix components, where P is a pass (non-defective product judgment) and f is a fail (defective product judgment). ) And s mean a pretest failure (determination of a defective product generated in a wafer test process of a memory device having a redundant circuit).

The "Slot No ID N" in the figure
o "22 means the number of each slot provided in the thermostat provided in the burn-in test devices 30 and 40, and the ID number assigned to each burn-in board. The map 21 of the burn-in board set in the slot to be set is displayed.

Generally, by one burn-in test,
Semiconductor integrated circuits are divided into a plurality of categories (BIN) according to classification or performance. That is, in the burn-in test, the BIN number clarifies the performance of the semiconductor integrated circuit for which the quality has been determined. These details are described in BIN No. described in “DISPLAY” 23 in FIG. Or, XBIN No. Is selected, and the BIN number of each semiconductor integrated circuit is displayed on the map 21.

The burn-in test devices 30 and 40 store a test control unit for controlling the main components of each burn-in test device 30 and 40, and a test program and test results for the burn-in test and various processes to be executed by the test control unit. And a heater unit for keeping the temperature of the furnace in the constant temperature chamber constant according to an instruction signal input from the test control unit. Further, the thermostatic bath is provided with a test signal input terminal for supplying a power supply voltage and a test pattern signal input from the test control unit to a burn-in board set in the bath.

When the burn-in board is set in the oven of the constant temperature bath and the map data is read from the server 20, the burn-in test devices 30 and 40 execute the burn-in test according to the test program stored in the test device storage unit. , And outputs the test result to the server 20 to update the map data. However, the pre-test map data read by the burn-in test apparatus 30 from the server 20 is set as non-defective (P) for all the semiconductor integrated circuits. Accordingly, the burn-in test apparatus 30 determines all the semiconductor integrated circuits as non-defective / defective products under relatively loose conditions, and the burn-in test apparatus 40 determines only the semiconductor integrated circuits determined to be non-defective in the burn-in test apparatus 30. To test.

The unloader 50 is used for the burn-in test device 4
When the burn-in board which has been tested is inherited from 0, the semiconductor integrated circuits are extracted for each classification or performance added to the map data read from the server 20, and the discrimination tray prepared for each classification or performance is extracted. To unload.

Next, the operation of this embodiment will be described. FIG. 3 shows an insertion process performed by the loader 10, a server process performed by the server 20, a burn-in test process performed by the burn-in test devices 30 and 40, and a removal performed by the unloader 50 in the burn-in test system 1 of the present embodiment. It is a flowchart explaining a process.

In FIG. 3, when the burn-in board is set at a predetermined position and the start button is pressed, the loader 10 starts mounting processing. First, a plurality of semiconductor integrated circuits are mounted on a burn-in board (Step S).
1) At the same time, position information in which the semiconductor integrated circuit is mounted on the burn-in board is created (step S2). When the created position information is output to the server 20, the mounting process ends (step S3).

When the position information is input from the loader 10, the server 20 creates map data based on the position information (step S4), and based on the created map data, compares the test results of all the semiconductor integrated circuits. Good product (P)
(Step S5).

The burn-in test apparatus 30 executes a burn-in test # 1 process when a burn-in board on which a semiconductor integrated circuit is mounted is set in a thermostat by the loader 10 and a start button is pressed. First, map data is read from the server 20 (step S6), and the ID number of each burn-in board is matched with the slot number of the tank and added to the map data. Next, a burn-in test # 1 is performed (step S7), and the pass / fail judgment and each classification of each semiconductor integrated circuit are overwritten on the map data (step S8). Further, when the overwritten map data is output to the server 20, the burn-in test # 1 processing ends (step S9).

When the overwritten map data is input from the burn-in test apparatus 30, the server 20
The content of the map data stored in the storage unit provided in 0 is updated (step S10).

The burn-in test apparatus 40 executes a burn-in test # 2 process when a burn-in board for which the burn-in test # 1 has been completed by the burn-in test apparatus 30 is set and the start button is pressed. First, the updated map data is read from the server 20 (step S11), and the ID number of each burn-in board and the slot number are matched and added to the map data. Next, a burn-in test # 2 is performed on the semiconductor integrated circuit which has been judged as non-defective (P) in the map data read from the server 20 (step S12), and only the test result is overwritten on the map data (step S13). . Further, when this map data is output to the server 20, the burn-in test # 2 processing is terminated (step S14).

When the overwritten map data is input from the burn-in test apparatus 40, the server 20
The content of the map data stored in the storage unit provided in 0 is updated according to the map data having the corresponding ID number (step S15).

When the unloader 50 receives from the server 20 that all the burn-in tests (# 1, # 2) have been completed, the unloader 50 executes a removal process. First, the updated map data is read from the server 20 (step S16). Next, the semiconductor integrated circuit is removed from the burn-in board according to the pass / fail judgment and classification added to the map data having the set burn-in board ID number (step S).
17), when unloading to the discrimination tray, the removal process ends (step S18).

As described above, in the present embodiment, the server 20 is controlled based on the test result by the burn-in test apparatus 30.
Update the map data stored in the storage unit in the. When the burn-in test is performed in the burn-in test device 40, the test is performed based on the map data stored in the storage unit in the server 20. These test results are all overwritten on the map data stored in the storage unit in the server 20. However, since the burn-in test apparatus 40 does not execute the burn-in test for the defective product, the burn-in test apparatus 30 classifies the test product as a defective product. The deleted map data remains in the storage unit of the server 20 without being deleted. Therefore,
The unloader 50 removes the semiconductor integrated circuit from the burn-in board based on the map data in which pass / fail judgments and classifications of all burn-in tests are stored.

Therefore, the burn-in test apparatus 40 can inherit the test results from the burn-in test apparatus 30, and can store the test results from all the burn-in test apparatuses in one map data. Thus, the operations of mounting, removing, and classifying the semiconductor integrated circuit on the burn-in board only need to be performed once, thereby reducing the burden on the operator and greatly reducing the test time.

In this embodiment, the network 60
And the map data is stored in the storage unit of the server 20 via
Although each unit is set to read map data from this storage unit, a storage device is provided in each unit to store data created by each unit in a storage medium, and the other units store data stored in the storage medium. The data may be read and various processes may be executed, so that the created data may be overwritten on the storage medium. Further, the network 60 may be connected to a computer or the like to collectively manage the processing of each unit.

[0038]

According to the burn-in test system according to the first aspect, the burn-in test method according to the fourth aspect, and the storage medium according to the sixth aspect, when a burn-in test is performed by a plurality of burn-in test apparatuses, one step before is performed. Can be referred to by a burn-in test apparatus that executes a test from now on. Therefore, for example, if all burn-in test apparatuses are set to test only devices determined to be non-defective, devices that are once determined to be defective are excluded from the test target, and the processing time of the test can be reduced. . Also,
Since the test results of a plurality of burn-in test apparatuses can be updated in the storage unit of the management apparatus, the device transfer /
The unloading device can discriminate a plurality of devices based on a plurality of test results stored by the storage unit. That is,
For a plurality of burn-in tests, the operation of transporting / unloading the device to / from the burn-in board is required only once. This makes it possible to reduce the burden on the work operator and to significantly reduce the test time.

The burn-in test system according to claim 2,
According to the burn-in test method of the fifth aspect and the storage medium of the seventh aspect, the storage means of the management device stores the test result input from the burn-in test device and the position information input from the device transport / unloading device. It is possible to cope with various burn-in tests without confusing.

According to the third aspect of the present invention, the position of each device with respect to the burn-in board which has been managed one-dimensionally can be displayed on the display screen as two-dimensional information, so that the user can easily manage it. As described above, when a plurality of burn-in tests are performed, a plurality of test results can be browsed as one piece of map information.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a main configuration of a burn-in test system 1 according to an embodiment to which the present invention is applied.

FIG. 2 is a diagram illustrating an example in which a map created based on position information output from a loader and details such as a test program name and a test start date and time are displayed on a display screen.

FIG. 3 shows an insertion process executed by the loader 10, a server process executed by the server 20, a burn-in test process executed by the burn-in test devices 30 and 40, and a removal executed by the unloader 50 in the burn-in test system 1 of the present embodiment. It is a flowchart explaining a process.

[Explanation of symbols]

 Reference Signs List 1 burn-in test system 10 loader 20 server 21 map 30 burn-in test device 40 burn-in test device 50 unloader 60 network

Claims (7)

[Claims] 1. A device transport / unloader for transporting and placing a plurality of devices under test on a burn-in board, and transporting the plurality of devices under test from the burn-in board; and mounting the plurality of devices under test. The burn-in board is housed in a thermostat, and a burn-in test is performed by applying a test signal to the plurality of devices under test to execute a burn-in test. A management device that is connected and includes a storage unit that stores the arrangement information of the plurality of devices to be measured and the burn-in test result in association with each other, and a burn-in test system, Transmitting the location information of the plurality of devices under test to the management device via the communication line, The burn-in test result stored in the storage unit in association with the arrangement information is read out via the communication line, and a plurality of devices under test are selected from the burn-in board based on the burn-in test result. The burn-in test apparatus reads out the arrangement information stored in the storage unit of the management apparatus by the device transport / unloader via the communication line, and outputs a plurality of pieces of information on the burn-in board based on the arrangement information. Performing a burn-in test of the device under test, determining a burn-in test result of each of the devices under test based on the execution result of the burn-in test, associating each determination result with the readout arrangement information, and performing the communication. The burn-in test result transmitted to the management device via a line and stored in the storage unit is updated. A burn-in test system. 2. The device transport / unloading device according to claim 1, further comprising: transmitting the arrangement information of the plurality of devices under test to the management device via the communication line and storing the information in the storage unit. The burn-in test system according to claim 1, wherein initialization is performed. 3. The burn-in test system according to claim 1, wherein the storage unit of the management device stores a burn-in test result of each of the devices under test as map information associated with the arrangement information. . 4. A device transport / unloader for transporting and placing a plurality of devices under test on a burn-in board, and transporting the plurality of devices under test from the burn-in board, and the plurality of devices under test are mounted. The burn-in board is housed in a thermostat, and a burn-in test is performed by applying a test signal to the plurality of devices under test to execute a burn-in test. A management device, which is connected to the storage device and stores storage information of the plurality of devices to be measured and the burn-in test result in association with each other, the burn-in test method in a burn-in test system, By using the unloading device, the arrangement information of the plurality of devices under test is transmitted through the communication line. An arrangement information storing step of transmitting the arrangement information to the management device and storing the arrangement information in the storage means; and reading out the arrangement information stored in the storage means of the management apparatus through the communication line by the burn-in test device. A test step of executing a burn-in test of a plurality of devices under test on the burn-in board based on the burn-in test apparatus, and determining a burn-in test result of each of the devices under test based on the execution result of the burn-in test; An information updating step of associating each determination result with the read-out arrangement information and transmitting the result to the management device via the communication line to update the burn-in test result stored in the storage means; The device stores the burn-in test result stored in the storage means in association with the arrangement information in the communication line. Read through, burn-in test method characterized by this comprising a discharge step of the burn-in test results on the basis of discharging by sorting a plurality of devices under test from the burn-in board, the. 5. The burn-in test method according to claim 4, wherein said arrangement information storing step further includes an initialization step of initializing said burn-in test result stored in said storage means. 6. A device transport / unloader for transporting and placing a plurality of devices under test on a burn-in board and unloading a plurality of devices under test from the burn-in board; and mounting the plurality of devices under test. The burn-in board is housed in a thermostat, and a burn-in test is performed by applying a test signal to the plurality of devices under test to execute a burn-in test. A management device connected to the storage device and configured to store the arrangement information of the plurality of devices to be measured and the burn-in test result in association with each other, and a computer for controlling a burn-in test in the burn-in test system configured by the computer. A storage medium storing a possible program, wherein the device transport / unloader is mounted. The program code for transmitting the arrangement information of the plurality of devices under test to the management device via the communication line and storing the information in the storage device, and the burn-in test device stores the program information in the storage device of the management device. A program code for reading out the stored arrangement information via the communication line and executing a burn-in test for a plurality of devices under test on the burn-in board based on the arrangement information, and a burn-in test by the burn-in test apparatus. Determining the burn-in test result of each device under test based on the execution result of the device, and transmitting the determined result and the read-out arrangement information to the management device via the communication line in association with the storage unit; A program code for updating the burn-in test result stored in the The read-out device reads out the burn-in test result stored in the storage unit in association with the arrangement information via the communication line, and selects a plurality of devices under test from the burn-in board based on the burn-in test result. A storage medium storing a program including: a program code for discharging; 7. The storage device according to claim 6, wherein storing the arrangement information further includes a program code for initializing the burn-in test result stored in the storage means. Medium.