JP2001153918A - Jig for measuring rein-sealed chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jig for measuring a resin-sealed chip which correctly measures high frequency characteristics of the resin-sealed chip. SOLUTION: The jig 40 for measuring the resin-sealed chip includes a pellet check board 14 connected to an external measuring system via a terminal 12, a spacer 16 electrically and mechanically connected to the board, and a substrate 42 for measurement which is electrically connected to the board via the spacer. A socket 44 is a holding tool in which the chip to be measured is stored and held, and is set on a contact terminal part 45 of an upper face of the substrate. The socket is set to bring a lead of the chip in contact with the contact terminal part, whereby the lead of the chip held to the socket is kept in electric contact with the contact terminal part via a conductive sheet 58. A high frequency signal line 48 extending on the substrate for measurement from the contact terminal part to an SMA connector 46 via a through hole is formed in a micro strip line structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed chip measuring jig, and more particularly to a resin-sealed chip measuring jig capable of accurately measuring high-frequency electrical characteristics of a resin-sealed chip.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device, each time each process is completed, or before each chip formed on a wafer is diced and separated, DC and high-frequency electrical characteristics (hereinafter, referred to as "hereafter") of a semiconductor integrated circuit of each chip. Simply called electrical characteristics)
And a step of sorting non-defective and non-defective products is performed. Measuring the electrical characteristics of the semiconductor integrated circuit of each chip in this sorting step is generally called pellet check measurement. In the pellet check measurement, usually, each chip on the wafer is measured by a probe card (needle) while holding the wafer using a pellet check measurement jig to obtain a measured value. The measured value of the electrical characteristics of the semiconductor integrated circuit of the semi-finished chip is the same as the measured value of the electrical characteristics of the resin-sealed chip, that is, the almost completed semiconductor device (hereinafter simply referred to as the resin-sealed chip) We correlate and sort out good and bad products.

[0003] The measurement of the electrical characteristics of the resin-sealed chip is performed using a resin-sealed chip measuring jig. When measuring the electrical characteristics of a resin-encapsulated chip using a resin-encapsulated chip measurement jig, the resin-encapsulated chip measurement board is usually used as shown in FIGS. Attach a general-purpose manual socket, connect the signal terminals of the socket and the resin-encapsulated chip measurement board with lead wires, and connect the pellet check board and the resin-encapsulated chip measurement board with mail pins. It is electrically and mechanically connected to an external measurement system.

Here, the configuration of a conventional resin-sealed chip measuring jig will be described with reference to FIGS. 7 and 8. FIG. FIG. 7 (a)
Is a plan view showing the configuration of a conventional resin-sealed chip measuring jig,
FIG. 7B is a side sectional view showing the configuration of the resin-sealed chip measuring jig along line II-II in FIG. 7A, and FIG. 8 is a partial sectional side view of the socket. The conventional resin-encapsulated chip measurement jig 10 includes a pellet check board 14 connected to an external measurement system via a terminal 12 and a pellet check board 14.
A spacer ring 16 electrically and mechanically connected to the board 14, and a resin-sealed chip measuring substrate (hereinafter simply referred to as a “substrate”) electrically connected to the pellet check board 14 via the spacer ring 16. , Called measurement substrate)
18 is provided.

The measuring board 18 includes a socket 20 for accommodating and holding a resin-encapsulated chip (hereinafter, simply referred to as a chip to be measured) to be measured, and connecting pins (not shown) provided at a peripheral portion of the upper surface. ) Are provided on the upper surface. The measurement substrate 18 is electrically and mechanically inserted into the pin holes provided on the lower surface of the spacer ring 16 corresponding to the pins of the measurement substrate 18, thereby electrically and mechanically forming the spacer ring 16 and thus the pellet. It is connected to the check board 14.

The socket 20 is a holder for accommodating and holding the chip to be measured. For example, as shown in FIG. 8, a base 22 having a terminal lead 21 for connection to the measurement substrate 18 at a lower portion is provided. An upper lid 24 hinged to one end of the base 22 and rotatable about a shaft 23; and a chip receiving base 2 attached to the base 22 via a coil spring 26.
8 is provided. When the chip to be measured is held by using the socket 20, the chip to be measured is placed on the chip receiving base 28, and the upper lid 24 is rotated toward the base 22 and closed to hold the chip to be measured. You can do it. Note that a coil spring 30 is also provided on the chip pressing portion of the upper lid 24 so as not to apply excessive force to the chip to be measured.

[0007]

However, the above-mentioned conventional resin-sealed chip measuring jig has the following problems in measuring high-frequency electrical characteristics. It is 1GHz
Even if an attempt is made to measure the high-frequency electrical characteristics by transmitting the high-frequency signal described above, there is a problem that an error is increased and accurate high-frequency electrical characteristics cannot be measured. In other words, there is a problem in that an error occurs when measuring high-frequency electrical characteristics because the measurement substrate is not impedance-matched with the characteristic impedance of the external measurement system. In particular, in the measurement of insertion loss and isolation of a resin-encapsulated chip for a high-frequency device, accurate measurement cannot be performed unless impedance matching is obtained. In this case, it is difficult to measure the high-frequency electric characteristics of a semiconductor integrated circuit provided in a mobile phone or the like that requires good high-frequency electric characteristics. Therefore, in a factory for manufacturing semiconductor devices used for high-frequency devices, a resin-sealed chip measuring jig for accurately measuring high-frequency electrical characteristics of a resin-sealed chip is required.

Accordingly, an object of the present invention is to provide a resin-sealed chip measuring jig for accurately measuring DC electric characteristics and high-frequency electric characteristics of a resin-sealed chip.

[0009]

The present inventor has investigated the reason why the conventional measurement substrate has poor impedance matching with an external measurement system, and has found out the following. First, in the conventional resin-encapsulated chip measuring jig, the distance between the resin-encapsulated chip held in the socket and the substrate for measurement is wide, which results in poor impedance matching. Second, the impedance matching of each terminal lead of the socket is not taken, and
Because the terminal lead length is long, inductance is large,
It is not suitable for high-frequency signal transmission. Third, signal transmission between the pellet check board and the measurement board is performed via mail pins, and is not suitable for transmitting high-frequency signals.

In order to achieve the above object, based on the above findings, a resin-sealed chip measuring jig according to the present invention comprises:
A pellet check board having terminals connected to an external measurement system, a spacer ring electrically connected to the pellet check board, and electrically and mechanically connected to the pellet check board via the spacer ring. Measurement having a socket connected and holding a resin-encapsulated chip to be measured, an electrical contact portion of the resin-encapsulated chip held by the socket with a lead, and an electrical connection portion with a spacer ring on an upper surface. And a resin sealing chip held in the socket is electrically connected to an external measurement system via a spacer ring and a pellet check board to measure DC electric characteristics and high-frequency electric characteristics. In the resin-encapsulated chip measuring jig, the electric contact between the resin-encapsulated chip lead and the spacer ring is formed. In the signal lines extending the measurement for the upper substrate, it is characterized in that it is formed by a microstrip line.

By forming the high-frequency signal line by a micro strip line, the resin-encapsulated chip measuring jig achieves impedance matching with an external measuring system with a predetermined impedance, for example, 50Ω.
Measurement of insertion loss, isolation, and the like of the resin-encapsulated chip becomes possible, and the measurement accuracy of high-frequency electrical characteristics of the resin-encapsulated chip is improved.

In a preferred embodiment of the present invention, the socket is formed so that the lead of the resin-encapsulated chip held by the socket directly contacts the electrical contact portion of the measurement substrate. This eliminates the need for a lead, which is provided in a conventional socket, reduces the inductance between the resin-encapsulated chip and the measurement substrate, and realizes good transmission of high-frequency signals. In a further preferred embodiment of the present invention, the lead of the resin-encapsulated chip held by the socket is brought into contact with the electrical contact portion of the measurement substrate via a conductive sheet. Thus, the electrical contact portion of the measurement substrate comes into contact with the lead via the conductive sheet, so that damage due to direct contact with the lead can be prevented.

Further, the socket has a lead holding portion for pressing and contacting the lead of the resin-encapsulated chip on the electrical contact portion of the measurement substrate, so that the lead holding portion can be replaced according to the outer shape of the resin-encapsulated chip. It has become. This eliminates the need to prepare a socket for each resin-encapsulated chip, which is economical. Further, a bypass capacitor is provided between the lead contact terminals of the electrical contact portion. This makes it possible to accurately measure the DC electrical characteristics of the resin-encapsulated chip.

[0014]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Embodiment 1 This embodiment is an example of an embodiment of a resin-sealed chip measuring jig according to the present invention. FIG. 1A is a plan view of the resin-sealed chip measuring jig of this embodiment. FIG. 1 (b) shows FIG.
FIG. 2A is a cross-sectional view of the resin-sealed chip measurement jig taken in the direction of arrow II, FIG. 2 is a top view of the measurement board, FIG. 3 is a bottom view of the measurement board, FIG. FIG. 5 is a plan view of the pedestal for fixing the conductive sheet. The resin-sealed chip measuring jig (hereinafter simply referred to as a measuring jig) 40 of the present embodiment is
As shown in FIGS. 1A and 1B, a pellet check board 14 and a pellet check board 1 which are connected to an external measurement system via a terminal 12 and have the same configuration as a conventional one.
4 is electrically and mechanically connected to the spacer ring 16 of the same configuration as the conventional one, and a resin seal of a new configuration electrically connected to the pellet check board 14 via the spacer ring 16. A measurement chip substrate (hereinafter simply referred to as a measurement substrate) 42 and a socket 44 having a novel configuration mounted on the measurement substrate 42 are provided.

As shown in FIG. 2, the measuring substrate 42 is provided with pins 43 for connection to the spacer ring 16 on the periphery of the upper surface, and provided on the lower surface of the spacer ring 16 corresponding to the pins 43. It is electrically and mechanically connected to the spacer ring 16 and thus to the pellet check board 14 by being inserted into a pin hole (not shown). The socket 44 is a holder for accommodating and holding a resin-encapsulated chip (hereinafter simply referred to as a chip to be measured) whose electric characteristics are to be measured, and is attached to the contact terminal portion 45 on the upper surface of the measurement substrate 42. It is supposed to be.

The measurement board 42 has a socket 44 mounted thereon so that the lead of the chip to be measured contacts the contact terminal portion 45 provided on the upper surface. The contact terminals 45 are electrically contacted via the sheet. A high-frequency signal line 48 extending from the contact terminal portion 45 to the SMA (Sub Miniature Type A) connector 46 (see FIG. 4) on the lower surface via a through hole (not shown) through the through-hole (not shown) is shown in FIG. 2
As shown in FIG. The micro strip line is basically configured as a thin conductor band provided with a dielectric film separated from a ground plane, and is often housed in a metal case. The SMA connector is one of the coaxial connectors generally used for evaluating high-frequency characteristics. Since the high-frequency signal line 48 has a microstrip line structure, impedance matching with an external measurement system can be established with, for example, an impedance of 50Ω, and measurement of insertion loss, isolation, and the like of a chip to be measured can be performed. This makes it possible to improve the measurement accuracy of the high-frequency electrical characteristics of the chip under test.

As shown in FIG. 3, the measuring substrate 42
SMA to which MA connector 46 (see FIG. 4) is attached
A connector mounting portion 46a is provided on the lower surface, and the contact terminal portion 45 on the upper surface is connected to the SMA connector 46 via a through hole by a high-frequency signal line 48, and further via the spacer ring 16 and the terminal 12 of the pellet check board 14. To be connected to an external measurement system.

Further, as shown in FIG. 3, a pattern of a DC line 50 is provided from the contact terminal portion 45 through a through hole (not shown), and a DC signal of a chip to be measured is provided by the DC line 50. Given and received. Lands 52 are provided in the through-hole area, and a bypass capacitor (not shown) is attached between the lands 52, that is, immediately near the leads of the chip to be measured.
By providing a bypass capacitor between the terminals in the immediate vicinity of the lead of the chip to be measured, the DC electrical characteristics of the chip to be measured can be accurately measured.

As shown in FIG. 4, the socket 44 has a chip holder 54 for accommodating the chip to be measured, and the socket 44 overlaps the chip holder 54 from above. A socket body 56 for holding, a conductive sheet 58 formed of a conductive plastic sheet or the like, and interposed between the chip to be measured and the measurement substrate 42;
A conductive sheet fixing base 60 for fixing the conductive sheet 58 on the measurement substrate 42 is provided.

The chip receiving base 54 has a central opening (not shown) for accommodating the chip to be measured in the center and a socket fixing hook 62 on a side. The chip to be measured is accommodated in the central opening, and socket positioning pins 6
The socket main body 56 can be combined with the chip receiving base 54 by engaging the socket fixing lever 66 of the socket main body 56 with the socket fixing hook 62 while inserting the pin hole 66 of the socket main body 56 into the socket body 4. Then, by combining the socket main body 56 and the chip receiving base 54, the lead wire of the chip to be measured is pressed by the IC lead pressing part 70 of the socket main body 56, and the contact terminal part of the measurement substrate 42 via the conductive sheet 58. 45
Can be contacted. IC lead holding part 70
The spring (not shown) incorporated in the socket body 56 adjusts the load for pressing the lead of the chip to be measured, so that the lead is not damaged. Further, when the external shape of the chip to be measured is variously different, the IC lead holding portion is detachable so that the IC lead pressing portion can be replaced with an IC according to the external shape of the chip to be measured.

The chip receiving base 54 is fixed by sandwiching the measuring substrate 42 between the conductive sheet fixing pedestal 60 and the conductive sheet fixing base 60 via a square annular spacer 71 and fastening a screw 72 penetrating the measuring substrate 42. You. Further, the conductive sheet 5
8 is fixed to the measuring substrate 42 by tightening the rectangular annular conductive sheet holder 74 to the conductive sheet fixing pedestal 60 with a screw 76 penetrating the measuring substrate 42.

As shown in FIG. 5, the conductive sheet fixing pedestal 60 has a screw hole 78 for receiving a screw 76 and a conductive sheet positioning pin 80, and the conductive sheet positioning pin 80 is The conductive sheet 58 is inserted into the hole 82 so that the IC contact terminal 45 of the measurement substrate 42 does not shift from the conductive sheet 58.
Can be positioned. The conductive sheet fixing pedestal 60 is provided with a grooved portion 84 provided with a step, and the measuring substrate 4 is not contacted with the conductive sheet fixing pedestal 60.
The DC line 50, bypass capacitor, GND, and the like provided on the lower surface of the second 2 are accommodated in the grooved portion 84.

In the present embodiment, the use of the conductive sheet 58 can prevent the contact terminal portion 45 of the measurement substrate 42 from being worn by contact with the lead of the chip to be measured. Wear due to the contact can be dealt with by replacing the conductive sheet 58 instead of replacing the measurement substrate as in the related art. Further, the electrical connection between the leads of the chip to be measured and the measurement substrate is replaced with the electrical connection using a lead wire having a redundant wiring length such as a conventional socket, and a conductive sheet 58 is provided on the contact terminal portion 45.
Are arranged, and the leads of the chip to be measured and the contact terminals 45 of the measurement substrate 42 are directly contacted via the conductive sheet 58, so that a high-frequency signal can be transmitted without attenuation.

The resin-sealed chip measuring jig 4 according to the present embodiment.
When the return loss of 0 was measured, it was confirmed that the transmission line loss of the signal line was small as shown in FIG. Accordingly, high-frequency electrical characteristics of 1 GHz or more can be measured with high accuracy. FIG. 6 is a copy of a measurement sheet showing the result of measuring the return loss of the resin-sealed chip measurement jig 40. The data shown in FIG. It is a result measured in an open state, and is a half of a loss value shown in 1 to 5.
Is a transmission line loss in the signal line 48.

[0025]

According to the present invention, the signal line extending on the measurement substrate from the electrical contact portion with the lead of the resin-encapsulated chip to the electrical connection portion with the spacer ring is connected to the micro-connector.
By forming a strip line, high-frequency electric characteristics of 1 GHz or more can be measured with high accuracy.
In addition, by interposing a conductive sheet between the chip to be measured and the substrate for measurement, it is possible to prevent the contact terminals of the substrate for measurement from being worn, instead of replacing the substrate for measurement as in the related art. By replacing the conductive sheet, it is possible to cope with the problem, so that it is economical and does not require much time for replacement. Furthermore, by replacing the lead holding portion of the socket body according to the external shape of the chip to be measured, it is possible to cope with various external shapes of the chip to be measured.
It is economical.

[Brief description of the drawings]

FIG. 1A is a plan view of a resin-sealed chip measuring jig according to an embodiment, and FIG. 1B is a view taken along a line I- in FIG. 1A.
It is sectional drawing of the resin sealing chip measurement jig of I.

FIG. 2 is a top view of a measurement substrate.

FIG. 3 is a bottom view of the measurement substrate.

FIG. 4 is an exploded view of the socket.

FIG. 5 is a plan view of a conductive sheet fixing base.

FIG. 6 is a graph showing a result of measuring a return loss of a measurement substrate.

7A is a plan view showing a configuration of a conventional resin-sealed chip measuring jig, and FIG. 7B is a line II in FIG. 7A.
It is a side sectional view showing the composition of the resin sealing chip measurement jig in -II.

FIG. 8 is a longitudinal sectional view of the socket.

[Explanation of symbols]

10: Conventional resin-sealed chip measurement jig, 12: Terminal, 14: Pellet check board, 16: Spacer ring, 18: Measurement board, 20: Socket, 21: Terminal lead , 22 ... base, 23 ... axis,
24 top cover 26 coil spring 28 chip receiving base 30 coil spring 40 resin sealing chip measuring jig 42 resin sealing chip measuring substrate 43
Pin, 44: Socket, 45: Contact terminal part, 46:
... SMA connector, 46a ... SMA connector attachment part, 48 ... high frequency signal line, 50 ... DC line,
Reference numeral 52: land, 54: chip holder, 56: socket body, 58: conductive sheet, 60: base for fixing the conductive sheet, 62: hook for fixing the socket, 64: pin for positioning the socket, 66 …… Pin hole, 70 …… IC
Lead holding part, 72: Screw, 74: Conductive sheet retainer, 76: Screw, 78: Screw hole, 80: Conductive sheet positioning pin, 82: Pin hole, 84: Groove processing part.

Claims (5)

[Claims] 1. A pellet check board having a terminal connected to an external measurement system, a spacer ring electrically connected to the pellet check board, and a pellet check board electrically connected to the pellet check board via the spacer ring. Target,
The socket that is mechanically connected and holds the resin-encapsulated chip to be measured, the electrical contact portion of the resin-encapsulated chip held by the socket with the lead, and the electrical connection portion with the spacer ring are on top. The resin sealing chip held in the socket is electrically connected to an external measurement system via a spacer ring and a pellet check board to provide DC electric characteristics and high-frequency electric characteristics. In the resin-encapsulated chip measuring jig, the signal line extending from the electrical contact portion of the resin-encapsulated chip with the lead to the electrical connection portion with the spacer ring is formed on the measurement substrate. A resin-sealed chip measuring jig formed by a micro strip line. 2. The socket according to claim 1, wherein the socket is formed so that the lead of the resin-encapsulated chip held by the socket is brought into direct contact with the electrical contact portion of the measurement substrate. Jig for measuring resin-sealed chips. 3. The resin encapsulation according to claim 1, wherein a lead of the resin encapsulation chip held by the socket is brought into contact with an electrical contact portion of the measurement substrate via a conductive sheet. Tip measuring jig. 4. A socket having a lead holding portion for pressing and contacting a lead of a resin-encapsulated chip at an electrical contact portion of a measurement substrate, wherein the lead holding portion can be exchanged according to the outer shape of the resin-encapsulated chip. 2. The resin-sealed chip measuring jig according to claim 1, wherein: 5. A device according to claim 1, wherein a bypass capacitor is provided between the lead contact terminals of the electrical contact portion.
5. The resin-sealed chip measuring jig according to any one of items 1 to 4.