JP2001139344A - Leadless low melting point glass and glass frit - Google Patents

Leadless low melting point glass and glass frit

Info

Publication number
JP2001139344A
JP2001139344A JP31562299A JP31562299A JP2001139344A JP 2001139344 A JP2001139344 A JP 2001139344A JP 31562299 A JP31562299 A JP 31562299A JP 31562299 A JP31562299 A JP 31562299A JP 2001139344 A JP2001139344 A JP 2001139344A
Authority
JP
Japan
Prior art keywords
glass
less
melting point
low melting
sno
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP31562299A
Other languages
Japanese (ja)
Other versions
JP2001139344A5 (en
JP4061792B2 (en
Inventor
Yasuko Douya
康子 堂谷
Hiroshi Usui
寛 臼井
Tsuneo Manabe
恒夫 真鍋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP31562299A priority Critical patent/JP4061792B2/en
Publication of JP2001139344A publication Critical patent/JP2001139344A/en
Publication of JP2001139344A5 publication Critical patent/JP2001139344A5/ja
Application granted granted Critical
Publication of JP4061792B2 publication Critical patent/JP4061792B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/16Silica-free oxide glass compositions containing phosphorus
    • C03C3/19Silica-free oxide glass compositions containing phosphorus containing boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain leadless low melting point glass which is usable for adhesive sealing, coating, etc. of plasma display panels, fluorescent display tubes, etc. and of which the fired matter has an excellent electrical insulation characteristic. SOLUTION: This leadless low melting point glass consists of, by molar %, 15 to 50 P2O5, 2 to 35 SnO, 5 to 45 ZnO, 0.1 to 30 B2O3, <1 SnO/ZnO, 0 to 35 MgO+CaO+SrO+BaO, 0 to 10 Al2O3+In2O3+WO3 and 0 to 3 Li2O+Na2O +K2O.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プラズマディスプ
レイパネル(PDP)、蛍光表示管(VFD)等のフラ
ットディスプレイパネルにおける封着、被覆、隔壁形成
に好適な無鉛低融点ガラスおよびガラスフリットに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead-free low-melting glass and a glass frit suitable for sealing, coating, and forming barrier ribs in flat display panels such as plasma display panels (PDPs) and fluorescent display tubes (VFDs).

【0002】[0002]

【従来の技術】PDP、VFDの封着用、被覆用、また
は隔壁形成用のガラスフリットに用いられるガラス粉末
のガラスとして、電気絶縁性を低下させるおそれのある
アルカリ金属酸化物を含有することなく、または含有し
たとしても低含有量で、低軟化点を実現できるリン酸ス
ズ亜鉛系ガラスが注目されている。
2. Description of the Related Art As glass of glass powder used for sealing, coating, or forming a partition wall of PDPs and VFDs, it does not contain an alkali metal oxide which may lower electric insulation. In addition, tin-zinc phosphate-based glass that can realize a low softening point with a low content even if it is contained has been attracting attention.

【0003】[0003]

【発明が解決しようとする課題】従来知られているリン
酸スズ亜鉛系ガラスは焼成時に結晶化しやすく、2回以
上焼成・流動させて使う場合、2回目以降の焼成におい
て流動しにくい、または繰り返し焼成によって寸法安定
性が低下する、等の問題があった。本発明は、以上の課
題を解決し、2回以上焼成を行う用途にも適用できる無
鉛低融点ガラスおよびガラスフリットの提供を目的とす
る。
The conventionally known tin-zinc phosphate glass is easily crystallized at the time of firing, and when used after firing and flowing more than once, it is difficult to flow at the second and subsequent firings, or repeated. There was a problem that dimensional stability was reduced by firing. An object of the present invention is to solve the above problems and to provide a lead-free low-melting glass and a glass frit that can be applied to applications where firing is performed twice or more.

【0004】[0004]

【課題を解決するための手段】本発明は、下記酸化物基
準のモル%表示で、P25:15〜50、SnO:2〜
35、ZnO:5〜45、B23:0.1〜30、Mg
O:0〜35、CaO:0〜35、SrO:0〜35、
BaO:0〜35、Al23:0〜10、In 23:0
〜10、WO3:0〜10、Li2O:0〜3、Na
2O:0〜3、K2O:0〜3、から実質的になり、Mg
O+CaO+SrO+BaOが0〜35モル%であり、
Al23+In23+WO3が0〜10モル%であり、
Li2O+Na 2O+K2Oが0〜3モル%であり、か
つ、SnOのZnOに対するモル比が1未満である無鉛
低融点ガラス、および、低膨張セラミックスフィラーお
よび耐熱顔料の少なくともいずれか一方と、前記無鉛低
融点ガラスの粉末を含有するガラスフリットを提供す
る。
According to the present invention, there is provided the following oxide group:
In terms of semi-mol%, PTwoOFive: 15-50, SnO: 2
35, ZnO: 5-45, BTwoOThree: 0.1 to 30, Mg
O: 0 to 35, CaO: 0 to 35, SrO: 0 to 35,
BaO: 0-35, AlTwoOThree: 0 to 10, In TwoOThree: 0
-10, WOThree: 0 to 10, LiTwoO: 0-3, Na
TwoO: 0-3, KTwoO: substantially consisting of 0 to 3, Mg
O + CaO + SrO + BaO is 0 to 35 mol%,
AlTwoOThree+ InTwoOThree+ WOThreeIs 0 to 10 mol%,
LiTwoO + Na TwoO + KTwoO is 0 to 3 mol%,
Lead-free, the molar ratio of SnO to ZnO is less than 1
Low melting glass and low expansion ceramic filler and
And at least one of the heat-resistant pigments and the lead-free low
Provide glass frit containing melting glass powder
You.

【0005】[0005]

【発明の実施の形態】本発明の無鉛低融点ガラス(以下
単に本発明のガラスという。)を、封着、被覆、または
隔壁形成に用いるときは、粉末化して使用される。この
粉末化されたガラスは通常、必要に応じて低膨張セラミ
ックスフィラー、耐熱顔料、等と混合され、次にビヒク
ルと混練してペースト化される。このガラスペーストは
下地のガラスの所定部位に塗布され、焼成される。ここ
でいう下地のガラスは、ガラスの上に透明電導膜等が被
覆されているものも含む。
BEST MODE FOR CARRYING OUT THE INVENTION When the lead-free low-melting glass of the present invention (hereinafter simply referred to as the glass of the present invention) is used for sealing, coating, or forming partition walls, it is used in the form of powder. This powdered glass is usually mixed with a low-expansion ceramic filler, a heat-resistant pigment, or the like, if necessary, and then kneaded with a vehicle to form a paste. This glass paste is applied to a predetermined portion of the underlying glass and fired. The base glass referred to here includes those in which a transparent conductive film or the like is coated on the glass.

【0006】本発明のガラスの軟化点(Ts)は580
℃以下であることが好ましい。580℃超では、PD
P、VFD、等の封着、被覆、または隔壁形成に用いる
ことが困難になるおそれがある。より好ましくは560
℃以下、特に好ましくは550℃以下である。また、T
sは500℃以上であることが好ましい。500℃未満
では、PDP、VFD、等における被覆または隔壁形成
に用いることが困難になるおそれがある。より好ましく
は510℃以上、特に好ましくは520℃以上、最も好
ましくは530℃以上である。
The softening point (T s ) of the glass of the present invention is 580
It is preferable that the temperature is not higher than ° C. If the temperature exceeds 580 ° C, PD
It may be difficult to use P, VFD, or the like for sealing, coating, or forming a partition. More preferably 560
° C or lower, particularly preferably 550 ° C or lower. Also, T
s is preferably 500 ° C. or higher. If the temperature is lower than 500 ° C., it may be difficult to use it for coating or forming a partition in PDP, VFD, and the like. It is more preferably at least 510 ° C, particularly preferably at least 520 ° C, most preferably at least 530 ° C.

【0007】本発明のガラスの結晶化温度(Tc)はTs
よりも40℃以上高いことが好ましい。TcとTsの差
(Tc−Ts)が40℃未満では焼成時に結晶化しやすく
なるおそれがある。ここで、Tcは示差熱分析(DT
A)によって得られる結晶化ピーク温度であり、結晶化
ピークが認められない場合は、Tc=∞とする。(Tc
s)は60℃以上であることがより好ましく、70℃
以上であることが特に好ましく、80℃以上であること
が最も好ましい。
The crystallization temperature (T) of the glass of the present inventionc) Is Ts
It is preferable that the temperature is higher by 40 ° C. or more than that. TcAnd TsDifference
(Tc-Ts) Is less than 40 ° C, it tends to crystallize during firing.
Could be. Where TcIndicates differential thermal analysis (DT
A) is the crystallization peak temperature obtained by A)
If no peak is observed, Tc= ∞. (Tc
T s) Is more preferably 60 ° C. or more,
It is particularly preferable that the temperature is 80 ° C or higher.
Is most preferred.

【0008】本発明のガラスの50〜250℃における
線膨張係数は120×10-7/℃以下であることが好ま
しい。120×10-7/℃超では、後述の本発明のガラ
スフリットの焼成物の前記線膨張係数が大きくなりすぎ
るおそれがある。より好ましくは110×10-7/℃以
下、特に好ましくは100×10-7/℃以下である。ま
た、前記線膨張係数は60×10-7/℃以上であること
が好ましい。以下、50〜250℃における線膨張係数
を単に膨張係数という。
The linear expansion coefficient of the glass of the present invention at 50 to 250 ° C. is preferably 120 × 10 −7 / ° C. or less. If it exceeds 120 × 10 −7 / ° C., the coefficient of linear expansion of a fired product of the glass frit of the present invention described below may be too large. It is more preferably at most 110 × 10 −7 / ° C., particularly preferably at most 100 × 10 −7 / ° C. Further, the coefficient of linear expansion is preferably 60 × 10 −7 / ° C. or more. Hereinafter, the coefficient of linear expansion at 50 to 250 ° C. is simply referred to as an expansion coefficient.

【0009】次に、本発明のガラスの組成について、モ
ル%を単に%と記して以下に説明する。P25はネット
ワークフォーマであり、必須である。15%未満ではガ
ラス化が困難になる。好ましくは25%以上、より好ま
しくは27%以上、特に好ましくは28%以上である。
50%超では化学的耐久性が低下する。好ましくは40
%以下、より好ましくは37%以下である。
Next, the composition of the glass of the present invention will be described below by simply writing mol% as%. P 2 O 5 is a network former and is essential. If it is less than 15%, vitrification becomes difficult. It is preferably at least 25%, more preferably at least 27%, particularly preferably at least 28%.
If it exceeds 50%, the chemical durability decreases. Preferably 40
% Or less, more preferably 37% or less.

【0010】SnOは軟化点を下げ流動性を増加させる
成分であり、必須である。2%未満では軟化点が高くな
りすぎる。好ましくは3%以上、より好ましくは7%以
上、特に好ましくは15%以上である。35%超ではガ
ラスの溶解性が低下し、溶融ガラス表面に被膜状の異物
層が形成される。好ましくは30%以下、より好ましく
は25%以下である。
[0010] SnO is a component that lowers the softening point and increases the fluidity, and is essential. If it is less than 2%, the softening point becomes too high. It is preferably at least 3%, more preferably at least 7%, particularly preferably at least 15%. If it exceeds 35%, the solubility of the glass decreases, and a film-like foreign substance layer is formed on the surface of the molten glass. It is preferably at most 30%, more preferably at most 25%.

【0011】ZnOは、ガラスを安定化させる効果、化
学的耐久性を向上させる効果、膨張係数を低下させる効
果、または、軟化点を下げる効果を有し、必須である。
5%未満では前記効果が小さい。好ましくは20%以
上、より好ましくは24%以上、特に好ましくは25%
以上である。45%超では焼成時に結晶化しやすくな
る。好ましくは35%以下、より好ましくは32%未満
である。
[0011] ZnO is essential because it has the effect of stabilizing the glass, the effect of improving the chemical durability, the effect of reducing the expansion coefficient, and the effect of lowering the softening point.
If it is less than 5%, the effect is small. Preferably at least 20%, more preferably at least 24%, particularly preferably at least 25%
That is all. If it exceeds 45%, it tends to crystallize during firing. Preferably it is 35% or less, more preferably less than 32%.

【0012】SnOのZnOに対するモル比、すなわち
SnOの含有量をZnOの含有量で除した値は1未満で
なければならない。このモル比が1以上では、ガラスの
溶解性が低下し、溶融ガラス表面に被膜状の異物層が形
成される。好ましくは0.97以下、より好ましくは
0.93以下、特に好ましくは0.90以下である。
The molar ratio of SnO to ZnO, ie, the value obtained by dividing the SnO content by the ZnO content, must be less than 1. When the molar ratio is 1 or more, the solubility of the glass decreases, and a film-like foreign material layer is formed on the surface of the molten glass. Preferably it is 0.97 or less, more preferably 0.93 or less, particularly preferably 0.90 or less.

【0013】B23はガラスを安定化し、また流動性を
増加させる効果を有し、必須である。0.1%未満では
前記効果が小さくなりすぎる。好ましくは0.5%以
上、より好ましくは1%以上である。30%超では化学
的耐久性が低下する、またはガラスが不安定になる。好
ましくは20%以下、より好ましくは15%以下、特に
好ましくは10%以下、最も好ましくは5%以下であ
る。
B 2 O 3 has the effect of stabilizing the glass and increasing the flowability, and is essential. If it is less than 0.1%, the above effect is too small. Preferably it is 0.5% or more, more preferably 1% or more. If it exceeds 30%, the chemical durability is reduced or the glass becomes unstable. It is preferably at most 20%, more preferably at most 15%, particularly preferably at most 10%, most preferably at most 5%.

【0014】MgO、CaO、SrOおよびBaOはい
ずれも必須ではないが、ガラスを安定化するために、ま
たは焼成時の結晶化を抑制するために、それぞれ35%
まで含有してもよい。35%超では軟化点が高くなりす
ぎるおそれがある。より好ましくは19%以下、特に好
ましくは15%以下である。
Although MgO, CaO, SrO and BaO are not essential, they are each 35% in order to stabilize the glass or to suppress crystallization during firing.
May be contained. If it exceeds 35%, the softening point may be too high. It is more preferably at most 19%, particularly preferably at most 15%.

【0015】MgO、CaO、SrOおよびBaOの内
の1種以上を含有する場合、その含有量の合計は35%
以下であることが好ましい。35%超では軟化点が高く
なりすぎるおそれがある。より好ましくは19%以下、
特に好ましくは15%以下である。また、前記含有量の
合計は2%以上であることが好ましい。2%未満では、
ガラスが不安定になるおそれがある、または焼成時に結
晶が析出しやすくなるおそれがある。より好ましくは
2.5%以上、特に好ましくは4%以上、最も好ましく
は8%以上である。
When one or more of MgO, CaO, SrO and BaO are contained, the total content thereof is 35%
The following is preferred. If it exceeds 35%, the softening point may be too high. More preferably 19% or less,
Especially preferably, it is 15% or less. Further, the total content is preferably 2% or more. If less than 2%,
The glass may become unstable, or crystals may be easily precipitated during firing. It is more preferably at least 2.5%, particularly preferably at least 4%, most preferably at least 8%.

【0016】Al23、In23およびWO3はいずれ
も必須ではないが、化学的耐久性を高くするために、ま
たは焼成時の結晶化を抑制するために、それぞれ10%
まで含有してもよい。10%超では軟化点が高くなりす
ぎるおそれがある。より好ましくは5%以下、特に好ま
しくは4%以下である。
Al 2 O 3 , In 2 O 3 and WO 3 are not essential, but are each 10% in order to increase chemical durability or suppress crystallization during firing.
May be contained. If it exceeds 10%, the softening point may be too high. It is more preferably at most 5%, particularly preferably at most 4%.

【0017】Al23、In23およびWO3の内の1
種以上を含有する場合、その含有量の合計は0.5〜1
0%の範囲にあることが好ましい。10%超では軟化点
が高くなりすぎるおそれがある。より好ましくは7%以
下、特に好ましくは5%以下である。
One of Al 2 O 3 , In 2 O 3 and WO 3
When containing more than one species, the total content is 0.5 to 1
It is preferably in the range of 0%. If it exceeds 10%, the softening point may be too high. It is more preferably at most 7%, particularly preferably at most 5%.

【0018】Li2O、Na2OおよびK2Oはいずれも
必須ではないが、軟化点を低下させるためにそれぞれ3
%まで含有してもよい。3%超では電気絶縁性が低下す
るおそれがある、化学的耐久性が低下するおそれがあ
る、または膨張係数が大きくなりすぎるおそれがある。
より好ましくは1%以下、特に好ましくは0.5%以下
である。Li2O、Na2OおよびK2Oのいずれも実質
的に含有しないこと、すなわち不純物レベル以下である
ことが最も好ましい。
Although Li 2 O, Na 2 O and K 2 O are not essential, they are each 3 to reduce the softening point.
%. If it exceeds 3%, the electrical insulation may be reduced, the chemical durability may be reduced, or the coefficient of expansion may be too large.
It is more preferably at most 1%, particularly preferably at most 0.5%. Most preferably, it does not substantially contain any of Li 2 O, Na 2 O and K 2 O, that is, it is at most an impurity level or less.

【0019】Li2O、Na2OおよびK2Oの含有量の
合計は3%以下であることが好ましい。3%超では電気
絶縁性が低下するおそれがある、化学的耐久性が低下す
るおそれがある、または膨張係数が大きくなりすぎるお
それがある。より好ましくは1%以下、特に好ましくは
0.5%以下である。
The total content of Li 2 O, Na 2 O and K 2 O is preferably at most 3%. If it exceeds 3%, the electrical insulation may be reduced, the chemical durability may be reduced, or the coefficient of expansion may be too large. It is more preferably at most 1%, particularly preferably at most 0.5%.

【0020】本発明のガラスは実質的に上記成分からな
るが、これ以外の成分を合計で5モル%まで含有しても
よい。このような成分として、La23、CeO2、等
の希土類酸化物、SiO2、TiO2、V25、MnO、
Fe23、CoO、NiO、CuO、Y23、Zr
2、MoO3、Rh23、PdO、Ag2O、TeO2
Bi23が例示される。なお、PbOおよびCdOにつ
いてはいずれも実質的に含有しない、すなわち不純物レ
ベル以下である。
The glass of the present invention consists essentially of the above components, but may contain other components up to 5 mol% in total. Such components include rare earth oxides such as La 2 O 3 and CeO 2 , SiO 2 , TiO 2 , V 2 O 5 , MnO,
Fe 2 O 3 , CoO, NiO, CuO, Y 2 O 3 , Zr
O 2 , MoO 3 , Rh 2 O 3 , PdO, Ag 2 O, TeO 2 ,
Bi 2 O 3 is exemplified. It should be noted that PbO and CdO are substantially not contained, that is, they are lower than the impurity level.

【0021】また、F、Cl、等のハロゲン元素も実質
的に含有しないことが好ましい。ハロゲン元素は焼成時
にガス化し、PDP、VFD、等における蛍光体と反応
して蛍光体を劣化させたり、また、VFDのフィラメン
トに付着してエミッション低下を起したりするおそれが
あるからである。
Further, it is preferable that halogen elements such as F and Cl are not substantially contained. This is because the halogen element gasifies during firing and may react with the phosphor in PDPs, VFDs, and the like to degrade the phosphor, or adhere to VFD filaments to cause a reduction in emission.

【0022】本発明のガラスフリットは本発明のガラス
の粉末を含有し、この他に、低膨張セラミックスフィラ
ー、耐熱顔料の内の少なくとも一方を含有する。ここで
いう低膨張セラミックスフィラーは、膨張係数が70×
10-7/℃以下であるセラミックスフィラーであり、ア
ルミナ、ムライト、ジルコン、コーディエライト、チタ
ン酸アルミニウム、β−スポデュメン、α−石英、β−
石英固溶体およびβ−ユークリプタイトから選ばれる1
種以上の粉末であることが、取り扱いやすさまたは入手
しやすさの点から好ましい。また、耐熱顔料として、た
とえばチタニア等の白色顔料、Fe−Mn複酸化物系、
Fe−Co−Cr複酸化物系、Fe−Mn−Al複酸化
物系等の黒色顔料が挙げられる。
The glass frit of the present invention contains the powder of the glass of the present invention, and further contains at least one of a low expansion ceramic filler and a heat-resistant pigment. The low expansion ceramic filler here has an expansion coefficient of 70 ×
A ceramic filler having a temperature of 10 −7 / ° C. or less, alumina, mullite, zircon, cordierite, aluminum titanate, β-spodumene, α-quartz, β-
1 selected from quartz solid solution and β-eucryptite
More than one kind of powder is preferable from the viewpoint of easy handling or availability. As the heat-resistant pigment, for example, white pigments such as titania, Fe-Mn double oxide,
Black pigments such as Fe-Co-Cr double oxides and Fe-Mn-Al double oxides are exemplified.

【0023】本発明のガラスフリットを焼成して得られ
る焼成物の膨張係数は60×10-7〜90×10-7/℃
の範囲にあることが好ましい。膨張係数がこの範囲外で
は焼成物と下地のガラスとの膨張マッチングが困難にな
るおそれがある。
The coefficient of expansion of the fired product obtained by firing the glass frit of the present invention is 60 × 10 −7 to 90 × 10 −7 / ° C.
Is preferably within the range. If the expansion coefficient is out of this range, expansion matching between the fired material and the underlying glass may be difficult.

【0024】次に本発明のガラスフリットの組成につい
て説明する。本発明のガラスの粉末は必須である。その
含有量は50〜99.9体積%であることが好ましい。
50体積%未満ではガラスフリットの焼成時の流動性が
小さくなりすぎるおそれがある。より好ましくは55体
積%以上、特に好ましくは60体積%以上である。ま
た、その含有量が99.9体積%超では、低膨張セラミ
ックスフィラーまたは耐熱顔料の含有量が小さくなりす
ぎる。より好ましくは99体積%以下、特に好ましくは
98体積%以下である。
Next, the composition of the glass frit of the present invention will be described. The powder of the glass of the present invention is essential. The content is preferably 50 to 99.9% by volume.
If it is less than 50% by volume, the fluidity of the glass frit during firing may be too small. It is more preferably at least 55% by volume, particularly preferably at least 60% by volume. On the other hand, when the content exceeds 99.9% by volume, the content of the low expansion ceramic filler or the heat-resistant pigment becomes too small. It is more preferably at most 99% by volume, particularly preferably at most 98% by volume.

【0025】低膨張セラミックスフィラーは、膨張係数
を小さくするために50体積%まで含有してもよい。5
0体積%超では焼成時の流動性が小さくなりすぎるおそ
れがある。より好ましくは45体積%以下、特に好まし
くは40体積%以下である。また、低膨張セラミックス
フィラーを含有する場合はその含有量は1体積%以上で
あることがより好ましく、2体積%以上であることが特
に好ましい。耐熱顔料は、必要に応じて40体積%まで
含有してもよい。40体積%超では焼成時の流動性が小
さくなりすぎるおそれがある。
The low expansion ceramic filler may be contained up to 50% by volume in order to reduce the expansion coefficient. 5
If it exceeds 0% by volume, the fluidity during firing may be too small. It is more preferably at most 45% by volume, particularly preferably at most 40% by volume. When the low-expansion ceramic filler is contained, the content is more preferably 1% by volume or more, and particularly preferably 2% by volume or more. The heat-resistant pigment may be contained up to 40% by volume as necessary. If it exceeds 40% by volume, the fluidity during firing may be too small.

【0026】本発明のガラスフリットは低膨張セラミッ
クスフィラー、耐熱顔料の内の少なくともいずれか一方
を含有しなければならないが、それらの含有量の合計は
0.1〜50体積%であることが好ましい。より好まし
くは1〜45体積%、特に好ましくは2〜40体積%で
ある。
The glass frit of the present invention must contain at least one of a low-expansion ceramic filler and a heat-resistant pigment, and the total content thereof is preferably 0.1 to 50% by volume. . It is more preferably 1 to 45% by volume, particularly preferably 2 to 40% by volume.

【0027】本発明のガラスフリットは、通常はビヒク
ルと混合してガラスペーストとされる。ビヒクルとの混
合は、乳鉢、三本ロール、等を用いて行われる。このガ
ラスペーストをスクリーン印刷等の方法により下地のガ
ラス、たとえばガラス基板またはガラス基板上に形成さ
れた薄膜の所定部位に塗布し、たとえば600℃以下で
焼成し、封着、被覆、隔壁形成、等を行う。前記ビヒク
ルとしては、エチルセルロース、ニトロセルロース、等
の樹脂を、α−テルピネオール、ブチルカルビトールア
セテート、酢酸イソペンチル、等の溶剤に溶解したもの
が通常用いられる。
The glass frit of the present invention is usually mixed with a vehicle to form a glass paste. Mixing with the vehicle is performed using a mortar, a three-roll mill, or the like. The glass paste is applied to a predetermined portion of an underlying glass, for example, a glass substrate or a thin film formed on the glass substrate, by a method such as screen printing, and baked at, for example, 600 ° C. or less, and sealing, coating, partition wall formation, and the like are performed. I do. As the vehicle, those obtained by dissolving a resin such as ethyl cellulose or nitrocellulose in a solvent such as α-terpineol, butyl carbitol acetate, or isopentyl acetate are generally used.

【0028】[0028]

【実施例】表のP25〜WO3の欄にモル%表示で示し
た組成となるように原料を調合、混合して蓋付きの石英
ルツボに入れ、1100℃に加熱し30分間溶融した。
次いで、溶融ガラスをステンレス製ローラに流し込んで
フレーク化した。得られたフレーク状のガラスをアルミ
ナ製ボールミルで105分間粉砕してガラス粉末とし
た。
EXAMPLES Raw materials were prepared and mixed so as to have the composition indicated by mol% in the column of P 2 O 5 to WO 3 in the table, put into a quartz crucible with a lid, and heated to 1100 ° C. and melted for 30 minutes. did.
Next, the molten glass was poured into a stainless steel roller to form flakes. The obtained flaky glass was pulverized with an alumina ball mill for 105 minutes to obtain glass powder.

【0029】得られたガラス粉末について、ガラス転移
点Tg(単位:℃)、軟化点Ts(単位:℃)、結晶化ピ
ーク温度Tc(単位:℃)、膨張係数α(単位:10-7
/℃)、溶出量Qd(%)、フローボタン径D(単位:
mm)、フローボタン外観、を測定・評価した。その方
法を以下に、結果を表に示す。例1〜5は560℃での
焼成に好適な実施例、例6、7は580℃での焼成に好
適な実施例、例8は比較例である。
With respect to the obtained glass powder, glass transition point T g (unit: ° C.), softening point T s (unit: ° C.), crystallization peak temperature T c (unit: ° C.), expansion coefficient α (unit: 10) -7
/ ° C), elution amount Q d (%), flow button diameter D (unit:
mm) and flow button appearance were measured and evaluated. The method is described below, and the results are shown in the table. Examples 1 to 5 are examples suitable for firing at 560 ° C, Examples 6 and 7 are examples suitable for firing at 580 ° C, and Example 8 is a comparative example.

【0030】ガラス転移点、軟化点、結晶化ピーク温
度:平均粒径が10〜20μmのガラス粉末を試料とし
て示差熱分析により昇温速度10℃/分で室温から80
0℃までの範囲で測定した。なお、アルミナ粉末を標準
物質とした。560℃で焼成する場合は、軟化点が56
0℃以下かつ結晶化ピーク温度が620℃以上であるこ
とが好ましい。580℃で焼成する場合は、軟化点が5
80℃以下かつ結晶化ピーク温度が650℃以上である
ことが好ましい。
Glass transition point, softening point, crystallization peak temperature: A glass powder having an average particle size of 10 to 20 μm was used as a sample, and the temperature was raised from room temperature to 80 ° C. at a heating rate of 10 ° C./min.
It was measured in the range up to 0 ° C. Alumina powder was used as a standard substance. When firing at 560 ° C., the softening point is 56
It is preferable that the crystallization peak temperature is 0 ° C or lower and the crystallization peak temperature is 620 ° C or higher. When firing at 580 ° C., the softening point is 5
It is preferable that the crystallization peak temperature is not higher than 650 ° C and not higher than 80 ° C.

【0031】膨張係数:前記溶融ガラスをステンレス製
板の上に流し出し、ガラス転移点近傍で徐冷した。徐冷
したガラスを直径2mm、長さ20mmの棒状に加工し
たものを試料とし、石英ガラスを標準試料として、示差
熱膨張計により50〜250℃の範囲における平均線膨
張係数を測定した。
Expansion coefficient: The molten glass was poured onto a stainless steel plate and gradually cooled near the glass transition point. A sample obtained by processing the slowly cooled glass into a rod having a diameter of 2 mm and a length of 20 mm was used as a sample, and the average linear expansion coefficient in the range of 50 to 250 ° C. was measured with a differential thermal dilatometer using quartz glass as a standard sample.

【0032】溶出量:膨張係数測定用試料と同じ試料を
80℃の水に24時間浸漬し、浸漬前後の試料重量から
重量減少率を算出し、%表示とした。この溶出量は化学
的耐久性の指標であり、0.1%以下であることが好ま
しく、0.02%以下であることがより好ましく、0.
01%未満であることが特に好ましい。
Elution amount: The same sample as the sample for measuring the expansion coefficient was immersed in water at 80 ° C. for 24 hours, and the weight loss rate was calculated from the weight of the sample before and after immersion, and expressed as%. This elution amount is an index of chemical durability, and is preferably 0.1% or less, more preferably 0.02% or less, and 0.1% or less.
Particularly preferred is less than 01%.

【0033】フローボタン径:ガラス粉末3.5gを直
径12.7mmの円柱状に加圧成形したものを試料とし
た。この試料を、例1〜5および例8については560
℃に10分間、例6、7については580℃に10分
間、それぞれ保持した。この加熱処理後の試料の直径を
測定した。この直径は13mm以上であることが好まし
く、14mm以上であることがより好ましい。
Flow button diameter: A sample was prepared by pressing 3.5 g of glass powder into a columnar shape having a diameter of 12.7 mm. This sample was 560 for Examples 1-5 and 8
C. for 10 minutes and for Examples 6 and 7 at 580.degree. C. for 10 minutes. The diameter of the sample after the heat treatment was measured. This diameter is preferably at least 13 mm, more preferably at least 14 mm.

【0034】フローボタン外観:フローボタン径の測定
によって得られた前記加熱処理後の試料の外観を観察し
た。光沢があることが好ましい。光沢があるものを○、
光沢がないものを×、でそれぞれ示した。なお、例8の
ガラスの粉末は前記加熱処理によっては充分焼結しなか
った。
Flow button appearance: The appearance of the sample after the heat treatment obtained by measuring the flow button diameter was observed. It is preferably glossy. ○, glossy
Those having no gloss are indicated by x. The glass powder of Example 8 was not sufficiently sintered by the heat treatment.

【0035】[0035]

【表1】 [Table 1]

【0036】[0036]

【発明の効果】本発明のガラスを用いることにより、P
DP、VFD、等における封着、被覆、隔壁形成、等に
使用できる焼成物が得られる。また、電気絶縁性にも優
れているので電気的な問題がおこりにくい。
By using the glass of the present invention, P
A fired product that can be used for sealing, coating, partition wall formation, and the like in DP, VFD, and the like is obtained. In addition, since it has excellent electrical insulation, electrical problems are unlikely to occur.

フロントページの続き Fターム(参考) 4G062 AA08 AA09 AA15 BB09 CC10 DA01 DB01 DB02 DB03 DC02 DC03 DC04 DD04 DD05 DE03 DE04 DE05 DF01 EA01 EA02 EA03 EA10 EB01 EB02 EB03 EC01 EC02 EC03 ED01 ED02 ED03 ED04 ED05 EE01 EE02 EE03 EE04 EE05 EF01 EF02 EF03 EF04 EF05 EG01 EG02 EG03 EG04 EG05 FA01 FB01 FC01 FD01 FE03 FE04 FE05 FF01 FG01 FH01 FJ01 FK01 FL01 GA01 GA10 GB01 GC01 GD01 GE01 HH01 HH03 HH05 HH06 HH07 HH08 HH09 HH11 HH13 HH15 HH17 HH20 JJ01 JJ03 JJ05 JJ07 JJ10 KK01 KK03 KK05 KK07 KK10 MM07 MM10 NN26 NN30 NN32 PP01 PP02 PP03 PP04 PP05 PP06 PP09 PP13 PP16 5G303 AA07 AB01 BA12 CA02 CB01 CB02 CB03 CB06 CB14 CB16 CB17 CB20 CB24 CB31 CB32 CB37 CB38 CB43 Continued on the front page F-term (reference) 4G062 AA08 AA09 AA15 BB09 CC10 DA01 DB01 DB02 DB03 DC02 DC03 DC04 DD04 DD05 DE03 DE04 DE05 DF01 EA01 EA02 EA03 EA10 EB01 EB02 EB03 EC01 EC02 EC03 ED01 ED02 EE03 EE03 ED04 EF03 EF04 EF05 EG01 EG02 EG03 EG04 EG05 FA01 FB01 FC01 FD01 FE03 FE04 FE05 FF01 FG01 FH01 FJ01 FK01 FL01 GA01 GA10 GB01 GC01 GD01 GE01 H07 KK01 GH01 H07 KK MM10 NN26 NN30 NN32 PP01 PP02 PP03 PP04 PP05 PP06 PP09 PP13 PP16 5G303 AA07 AB01 BA12 CA02 CB01 CB02 CB03 CB06 CB14 CB16 CB17 CB20 CB24 CB31 CB32 CB37 CB38 CB43

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】下記酸化物基準のモル%表示で、 P25 15〜50、 SnO 2〜35、 ZnO 5〜45、 B23 0.1〜30、 MgO 0〜35、 CaO 0〜35、 SrO 0〜35、 BaO 0〜35、 Al23 0〜10、 In23 0〜10、 WO3 0〜10、 Li2O 0〜3、 Na2O 0〜3、 K2O 0〜3、 から実質的になり、MgO+CaO+SrO+BaOが
0〜35モル%であり、Al23+In23+WO3
0〜10モル%であり、Li2O+Na2O+K2Oが0
〜3モル%であり、かつ、SnOのZnOに対するモル
比が1未満である無鉛低融点ガラス。
1. The following oxide-based molar percentages are represented by: P 2 O 5 15 to 50, SnO 2 to 35, ZnO 5 to 45, B 2 O 3 0.1 to 30, MgO 0 to 35, CaO 0 ~35, SrO 0~35, BaO 0~35, Al 2 O 3 0~10, In 2 O 3 0~10, WO 3 0~10, Li 2 O 0~3, Na 2 O 0~3, K 2 O 0 to 3, essentially made from, MgO + CaO + SrO + BaO is 0 to 35 mol%, Al 2 O 3 + in 2 O 3 + WO 3 is 0 to 10 mol%, Li 2 O + Na 2 O + K 2 O is 0
A lead-free low-melting glass having a molar ratio of SnO to ZnO of less than 1 by 3 mol%.
【請求項2】低膨張セラミックスフィラーおよび耐熱顔
料の少なくともいずれか一方と、請求項1に記載の無鉛
低融点ガラスの粉末を含有するガラスフリット。
2. A glass frit containing at least one of a low-expansion ceramic filler and a heat-resistant pigment, and the powder of the lead-free low-melting glass according to claim 1.
JP31562299A 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit Expired - Fee Related JP4061792B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31562299A JP4061792B2 (en) 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31562299A JP4061792B2 (en) 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit

Publications (3)

Publication Number Publication Date
JP2001139344A true JP2001139344A (en) 2001-05-22
JP2001139344A5 JP2001139344A5 (en) 2005-06-02
JP4061792B2 JP4061792B2 (en) 2008-03-19

Family

ID=18067592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31562299A Expired - Fee Related JP4061792B2 (en) 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit

Country Status (1)

Country Link
JP (1) JP4061792B2 (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008092A (en) * 2001-06-20 2003-01-10 Mutsuo Munekata Laminated piezoelectric element and its manufacturing method as well as sealing material for laminated piezoelectric element
JP2005112715A (en) * 2003-09-19 2005-04-28 Nippon Electric Glass Co Ltd Low melting point sealing composition, low melting point glass paste, and low melting point glass tablet
JP2005350314A (en) * 2004-06-11 2005-12-22 Nippon Electric Glass Co Ltd Glass for sealing and sealing method
WO2006090534A1 (en) * 2005-02-22 2006-08-31 Nitto Denko Corporation Dielectric layer and method for manufacturing substrate on which dielectric layer is formed
WO2006132102A1 (en) * 2005-06-09 2006-12-14 Nihon Yamamura Glass Co., Ltd. Zinc phosphate based lead-free glass composition
JP2008186697A (en) * 2007-01-30 2008-08-14 Univ Of Tokyo Manufacturing method of panel body
WO2008146886A1 (en) * 2007-05-30 2008-12-04 Asahi Glass Company, Limited Glass for optical device covering, glass-covered light-emitting element, and glass-covered light-emitting device
JP2008300536A (en) * 2007-05-30 2008-12-11 Asahi Glass Co Ltd Glass coated light emitting element, and glass coated light emitting device
WO2009088086A1 (en) * 2008-01-10 2009-07-16 Asahi Glass Company, Limited Glass, coating material for light-emitting device, and light-emitting device
KR100911068B1 (en) * 2001-12-25 2009-08-06 니폰 덴키 가라스 가부시키가이샤 Lead-free tin phosphate-based glass sealable at low temperature and composite material using the same
JP2011016688A (en) * 2009-07-09 2011-01-27 Asahi Glass Co Ltd Glass for sealing
US7888870B2 (en) 2004-12-16 2011-02-15 Panasonic Corporation Plasma display panel, method of producing the same, and sealing member
WO2012014619A1 (en) * 2010-07-28 2012-02-02 日本電気硝子株式会社 Sealing glass and sealing composite material
JP2012046408A (en) * 2010-07-28 2012-03-08 Nippon Electric Glass Co Ltd Sealing glass
JP2012046358A (en) * 2010-08-24 2012-03-08 Nippon Electric Glass Co Ltd Sealing glass tablet
JP2012046409A (en) * 2010-07-28 2012-03-08 Nippon Electric Glass Co Ltd Sealing glass
EP2562147A1 (en) * 2010-04-19 2013-02-27 Panasonic Corporation Glass composition, light source device and illumination device
JP2013220982A (en) * 2012-04-19 2013-10-28 Central Glass Co Ltd Glass powder material and method of producing porous vitreous film
CN111268911A (en) * 2020-02-21 2020-06-12 Oppo广东移动通信有限公司 Welding composition, shell assembly, preparation method and electronic equipment
WO2021075070A1 (en) * 2019-10-15 2021-04-22 Yejガラス株式会社 Low melting point tin phosphate-based glass frit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102765884B (en) * 2011-05-06 2014-11-05 中国科学院过程工程研究所 Low-softening-temperature leadless glass powder for bonding, preparation method and application thereof

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008092A (en) * 2001-06-20 2003-01-10 Mutsuo Munekata Laminated piezoelectric element and its manufacturing method as well as sealing material for laminated piezoelectric element
KR100911068B1 (en) * 2001-12-25 2009-08-06 니폰 덴키 가라스 가부시키가이샤 Lead-free tin phosphate-based glass sealable at low temperature and composite material using the same
JP2005112715A (en) * 2003-09-19 2005-04-28 Nippon Electric Glass Co Ltd Low melting point sealing composition, low melting point glass paste, and low melting point glass tablet
JP4682556B2 (en) * 2003-09-19 2011-05-11 日本電気硝子株式会社 Low melting point sealing composition, low melting point glass paste and low melting point glass tablet
JP2005350314A (en) * 2004-06-11 2005-12-22 Nippon Electric Glass Co Ltd Glass for sealing and sealing method
JP4529173B2 (en) * 2004-06-11 2010-08-25 日本電気硝子株式会社 Glass for sealing and sealing method
US7888870B2 (en) 2004-12-16 2011-02-15 Panasonic Corporation Plasma display panel, method of producing the same, and sealing member
WO2006090534A1 (en) * 2005-02-22 2006-08-31 Nitto Denko Corporation Dielectric layer and method for manufacturing substrate on which dielectric layer is formed
WO2006132102A1 (en) * 2005-06-09 2006-12-14 Nihon Yamamura Glass Co., Ltd. Zinc phosphate based lead-free glass composition
JP2006342018A (en) * 2005-06-09 2006-12-21 Nihon Yamamura Glass Co Ltd Zinc phosphate-based lead-free glass composition
JP2008186697A (en) * 2007-01-30 2008-08-14 Univ Of Tokyo Manufacturing method of panel body
EP2151872A4 (en) * 2007-05-30 2012-12-05 Asahi Glass Co Ltd Glass for optical device covering, glass-covered light-emitting element, and glass-covered light-emitting device
JP2008300536A (en) * 2007-05-30 2008-12-11 Asahi Glass Co Ltd Glass coated light emitting element, and glass coated light emitting device
EP2151872A1 (en) * 2007-05-30 2010-02-10 Asahi Glass Company, Limited Glass for optical device covering, glass-covered light-emitting element, and glass-covered light-emitting device
WO2008146886A1 (en) * 2007-05-30 2008-12-04 Asahi Glass Company, Limited Glass for optical device covering, glass-covered light-emitting element, and glass-covered light-emitting device
US8174045B2 (en) 2007-05-30 2012-05-08 Asahi Glass Company, Limited Glass for covering optical element, glass-covered light-emitting element and glass-covered light-emitting device
JPWO2009088086A1 (en) * 2008-01-10 2011-05-26 旭硝子株式会社 Glass, coating material for light emitting device and light emitting device
JP5458893B2 (en) * 2008-01-10 2014-04-02 旭硝子株式会社 Glass, coating material for light emitting device and light emitting device
WO2009088086A1 (en) * 2008-01-10 2009-07-16 Asahi Glass Company, Limited Glass, coating material for light-emitting device, and light-emitting device
US8203169B2 (en) 2008-01-10 2012-06-19 Asahi Glass Company, Limited Glass, coating material for light-emitting devices and light-emitting device
JP2011016688A (en) * 2009-07-09 2011-01-27 Asahi Glass Co Ltd Glass for sealing
JPWO2011132402A1 (en) * 2010-04-19 2013-07-18 パナソニック株式会社 Glass composition, light source device and lighting device
EP2562147A4 (en) * 2010-04-19 2013-09-18 Panasonic Corp Glass composition, light source device and illumination device
JP5842178B2 (en) * 2010-04-19 2016-01-13 パナソニックIpマネジメント株式会社 Light source device and lighting device
EP2562147A1 (en) * 2010-04-19 2013-02-27 Panasonic Corporation Glass composition, light source device and illumination device
JP2012046408A (en) * 2010-07-28 2012-03-08 Nippon Electric Glass Co Ltd Sealing glass
WO2012014619A1 (en) * 2010-07-28 2012-02-02 日本電気硝子株式会社 Sealing glass and sealing composite material
JP2012046409A (en) * 2010-07-28 2012-03-08 Nippon Electric Glass Co Ltd Sealing glass
JP2012046358A (en) * 2010-08-24 2012-03-08 Nippon Electric Glass Co Ltd Sealing glass tablet
JP2013220982A (en) * 2012-04-19 2013-10-28 Central Glass Co Ltd Glass powder material and method of producing porous vitreous film
WO2021075070A1 (en) * 2019-10-15 2021-04-22 Yejガラス株式会社 Low melting point tin phosphate-based glass frit
JP2021062988A (en) * 2019-10-15 2021-04-22 Yejガラス株式会社 Low-melting tin phosphate-based glass frit
EP3998241A4 (en) * 2019-10-15 2022-08-17 YEJ GLASS Co., Ltd. Low melting point tin phosphate-based glass frit
JP7205043B2 (en) 2019-10-15 2023-01-17 Yejガラス株式会社 Low-melting stannous phosphate-based glass frit
CN111268911A (en) * 2020-02-21 2020-06-12 Oppo广东移动通信有限公司 Welding composition, shell assembly, preparation method and electronic equipment

Also Published As

Publication number Publication date
JP4061792B2 (en) 2008-03-19

Similar Documents

Publication Publication Date Title
JP2001139344A (en) Leadless low melting point glass and glass frit
JP3827987B2 (en) Lead-free glass frit
JP2001139345A (en) Leadless low melting point glass and glass frit
US6355586B1 (en) Low melting point glass and glass ceramic composition
JP4061762B2 (en) Low hygroscopic glass frit, glass ceramic composition and fired body
JP3951514B2 (en) Silica tin phosphate glass and sealing material
JP4930897B2 (en) Bi2O3-B2O3 sealing material
JP2004284934A (en) Lead-free low-melting point glass
KR20070088296A (en) Glass for coating electrode
JP2005041734A (en) Glass for dielectric formation and dielectric formation material for plasma display panel
JP2000313635A (en) Material for plasma display panel
JP2000264677A (en) Glass composition, paste using the same, green sheet, electric insulator, bulkhead for pdp and pdp
JP2001302279A (en) Lead-free and low-melting point glass and glass frit
JP2007332018A (en) Bismuth-based sealing material and bismuth-based paste material
JP4411648B2 (en) Tin phosphate glass and composite materials
JP2001172046A (en) Low melting point glass for forming bulkhead
JP4013012B2 (en) Tin borophosphate glass and sealing material
JPH09268026A (en) Glass composition for electrical insulation
JP2002308645A (en) Lead-free glass, glass-ceramics composition and glass paste
JP4874492B2 (en) Glass composition and glass-forming material containing the composition
JP4924985B2 (en) Dielectric material for plasma display panel
JP2001163635A (en) Lead-free low melting point glass for formation of barrier rib and glass ceramic composition
JP4092936B2 (en) Tin phosphate glass and composite materials
JP2001180972A (en) Lead free glass with low melting point
JP4324965B2 (en) Insulation material for display tube

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040816

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040816

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070213

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070409

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070918

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071011

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071217

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110111

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120111

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120111

Year of fee payment: 4

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120111

Year of fee payment: 4

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120111

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130111

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130111

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140111

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees