JP2001131509A - Non-halogenated resin composition for adhesive tape, film which is formed from the same and is used for adhesive tape, and adhesive tape - Google Patents

Non-halogenated resin composition for adhesive tape, film which is formed from the same and is used for adhesive tape, and adhesive tape

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Publication number
JP2001131509A
JP2001131509A JP31777499A JP31777499A JP2001131509A JP 2001131509 A JP2001131509 A JP 2001131509A JP 31777499 A JP31777499 A JP 31777499A JP 31777499 A JP31777499 A JP 31777499A JP 2001131509 A JP2001131509 A JP 2001131509A
Authority
JP
Japan
Prior art keywords
adhesive tape
ethylene
resin composition
film
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31777499A
Other languages
Japanese (ja)
Inventor
Hiroshi Ichikawa
広 市川
Yoji Domon
洋二 土門
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP31777499A priority Critical patent/JP2001131509A/en
Publication of JP2001131509A publication Critical patent/JP2001131509A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a non-halogenated resin composition for an adhesive tape in which a plasticizer contained in a film is transferred to an adhesive layer to ensure tackiness and adhesiveness the same as or higher than those of conventional polyvinyl halide adhesive tapes, to provide a film which is formed from the same and is useful for an adhesive tape, and to provide the adhesive tape. SOLUTION: This non-halogenated resin composition for adhesive tape, comprising 100 pts.wt. of a polyolefin-based resin and 60 to 150 pts.wt. of an inorganic flame retardant, characterized by containing 3 to 5 pts.wt. of a plasticizer. The polyolefin-based resin is preferably at least one resin selected from polyethylene, polypropylene, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-hexene copolymer and ethylene-octene copolymer. The plasticizer is preferably at least one compound selected from dioctyl phthalate, diisononyl phthalate, diisodecyl phthalate and ditriisodecyl phthalate.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、粘着テープ用ノン
ハロゲン樹脂組成物、これを成形してなる粘着テープ用
フィルム、及び、自動車用組電線の結束に有用な粘着テ
ープに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-halogen resin composition for an adhesive tape, a film for an adhesive tape obtained by molding the same, and an adhesive tape useful for bundling a cable for an automobile.

【0002】[0002]

【従来の技術】従来、自動車用組電線を結束する難燃性
の粘着テープとして、ポリ塩化ビニル等のハロゲン化ビ
ニル樹脂を含有する樹脂組成物を原料とするフィルムが
使用されてきた。このようなハロゲン化ビニル樹脂フィ
ルムは、焼却処分する際に有害ガスを発生するので、最
近では、ポリオレフィン系樹脂に水酸化マグネシウム等
の無機系難燃剤を多量に含有させたノンハロゲン樹脂組
成物を原料とするフィルムが使用され始めている。
2. Description of the Related Art Heretofore, a film made of a resin composition containing a halogenated vinyl resin such as polyvinyl chloride has been used as a flame-retardant adhesive tape for bundling automobile electric wires. Such vinyl halide resin films generate harmful gases when incinerated. Therefore, recently, a non-halogen resin composition containing a large amount of an inorganic flame retardant such as magnesium hydroxide in a polyolefin resin is used as a raw material. Films have begun to be used.

【0003】ハロゲン化ビニル樹脂を含有する樹脂組成
物を原料とするフィルムに粘着層を設けた粘着テープで
は、フィルムから粘着層への可塑剤の移行による軟化効
果を利用して、そのタック性を確保していたが、ノンハ
ロゲン樹脂組成物を原料とするフィルムでは、フィルム
から粘着層への可塑剤の移行がないために、粘着層に予
め可塑剤を含有させることが技術常識とされていた。
[0003] In an adhesive tape in which an adhesive layer is provided on a film made of a resin composition containing a vinyl halide resin, the tackiness of the adhesive tape is reduced by utilizing the softening effect of the transfer of the plasticizer from the film to the adhesive layer. Although it was ensured, in a film made of a non-halogen resin composition as a raw material, it was considered common technical knowledge that a plasticizer was previously contained in the adhesive layer because there was no transfer of the plasticizer from the film to the adhesive layer.

【0004】このようなフィルムを用いたノンハロゲン
粘着テープは、エチレン−エチルアクリレート共重合
(以下、「EEA」という)等のポリオレフィン系樹脂
100重量部及び水酸化マグネシウム等の無機系難燃剤
100重量部からなるノンハロゲン樹脂組成物をインフ
レーション法等により成形してフィルムとし、このフィ
ルムをスリットしてテープとした後、このテープの表面
に、粘着組成物100重量部にジオクチルフタレート等
の可塑剤25重量部を配合して均一に分散させたもの
を、被覆することにより製造されてきた。粘着組成物と
しては、例えば、天然ゴム50重量部、アクリル系粘着
剤25重量部及び粘着付与剤粘着剤25重量部からなる
樹脂組成物が用いられてきた。
A non-halogen adhesive tape using such a film is 100 parts by weight of a polyolefin resin such as ethylene-ethyl acrylate copolymer (hereinafter referred to as "EEA") and 100 parts by weight of an inorganic flame retardant such as magnesium hydroxide. A non-halogen resin composition comprising a non-halogen resin composition is formed into a film by an inflation method or the like, and the film is slit into a tape. On the surface of the tape, 100 parts by weight of an adhesive composition and 25 parts by weight of a plasticizer such as dioctyl phthalate are used. Has been manufactured by coating a mixture of the components dispersed uniformly. As the adhesive composition, for example, a resin composition comprising 50 parts by weight of natural rubber, 25 parts by weight of an acrylic adhesive, and 25 parts by weight of a tackifier adhesive has been used.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、このよ
うなノンハロゲン粘着テープを製造するには、粘着組成
物に可塑剤を配合し、攪拌して均一に分散させなければ
ならず、そのために、可塑剤を配合した粘着組成物を攪
拌するのに時間がかかるという問題があった。また、こ
のような粘着組成物に可塑剤を添加すると、これがエマ
ルジョンタイプの粘着組成物である場合には、粘着組成
物を分散、攪拌した後しばらく放置すると、粘着組成物
を構成するエマルジョン粒子が可塑剤に犯されて不安定
化し、そのために、粘着組成物の粘度が急激に上昇し
て、その粘度コントロールが難しくなるという問題があ
った。
However, in order to produce such a halogen-free pressure-sensitive adhesive tape, a plasticizer must be blended with the pressure-sensitive adhesive composition and uniformly dispersed by stirring. However, there is a problem that it takes time to stir the pressure-sensitive adhesive composition containing the compound. In addition, when a plasticizer is added to such an adhesive composition, if this is an emulsion-type adhesive composition, the adhesive composition is dispersed, stirred, and then left for a while to obtain emulsion particles constituting the adhesive composition. There was a problem that the viscosity of the pressure-sensitive adhesive composition was rapidly increased due to the instability caused by the plasticizer, which made it difficult to control the viscosity.

【0006】本発明は、かかる問題を解決することを目
的としている。即ち、本発明は、フィルムに含有された
可塑剤を粘着層に移行させて従来のポリハロゲン化ビニ
ル粘着テープと同等又は同等以上のタック性及び粘着性
を確保した粘着テープ用ノンハロゲン樹脂組成物、これ
を成形してなる粘着テープ用フィルム、及び、粘着テー
プを提供する。
An object of the present invention is to solve such a problem. That is, the present invention is a non-halogen resin composition for an adhesive tape that secures tackiness and adhesiveness equal to or greater than that of a conventional polyvinyl halide adhesive tape by transferring a plasticizer contained in a film to an adhesive layer, A pressure-sensitive adhesive tape film and a pressure-sensitive adhesive tape obtained by molding the same are provided.

【0007】[0007]

【課題を解決するための手段】本発明者は、上記問題を
解決するために、ノンハロゲン樹脂組成物を原料とする
フィルムに粘着層を設けた粘着テープにおいて、粘着層
に予め可塑剤を含有させる、という従来の技術常識に反
して、ポリオレフィン系樹脂100重量部及び無機系難
燃剤60〜150重量部重量部からなるノンハロゲン樹
脂組成物に可塑剤3〜5重量部を含有させものを原料と
するフィルムを粘着テープの基材として用いたところ、
以外にも、粘着層に予め可塑剤を含有さなくても、タッ
ク性及び粘着性を確保した粘着テープとすることができ
ることを見出して本発明を完成するに至った。
Means for Solving the Problems In order to solve the above-mentioned problems, the present inventor has proposed that a pressure-sensitive adhesive tape provided with a pressure-sensitive adhesive layer on a film made of a non-halogen resin composition as a raw material contains a plasticizer in advance in the pressure-sensitive adhesive layer. Contrary to conventional technical common knowledge, a non-halogen resin composition comprising 100 parts by weight of a polyolefin resin and 60 to 150 parts by weight of an inorganic flame retardant contains 3 to 5 parts by weight of a plasticizer as a raw material. When using the film as the base material of the adhesive tape,
In addition, they have found that a pressure-sensitive adhesive tape having sufficient tackiness and tackiness can be obtained without previously containing a plasticizer in the pressure-sensitive adhesive layer, thereby completing the present invention.

【0008】請求項1に記載された発明は、ポリオレフ
ィン系樹脂100重量部及び無機系難燃剤60〜150
重量部重量部からなる粘着テープ用ノンハロゲン樹脂組
成物において、可塑剤3〜5重量部を含有させたことを
特徴とする粘着テープ用ノンハロゲン樹脂組成物であ
る。
The first aspect of the present invention relates to a polyolefin resin 100 parts by weight and an inorganic flame retardant 60 to 150.
A non-halogen resin composition for an adhesive tape, comprising 3 to 5 parts by weight of a plasticizer in a non-halogen resin composition for an adhesive tape composed of parts by weight.

【0009】請求項2に記載された発明は、請求項1に
記載された発明において、ポリオレフィン系樹脂がポリ
エチレン、ポリプロピレン、エチレン−エチルアクリレ
ート共重合体、エチレン−メチルアクリレート共重合
体、エチレン−酢酸ビニル共重合体、エチレン−プロピ
レン共重合体、エチレン−ヘキセン共重合体及びエチレ
ン−オクテン共重合体から選ばれる少なくとも1種の樹
脂であることを特徴とするものである。
According to a second aspect of the present invention, in the first aspect, the polyolefin resin is polyethylene, polypropylene, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-acetic acid. It is characterized by being at least one resin selected from a vinyl copolymer, an ethylene-propylene copolymer, an ethylene-hexene copolymer and an ethylene-octene copolymer.

【0010】請求項3に記載された発明は、請求項1又
は2に記載された発明において、無機系難燃剤が水酸化
マグネシウム及び水酸化アルミニウムから選ばれる少な
くとも1種の難燃剤であることを特徴とするものであ
る。
[0010] According to a third aspect of the present invention, in the first or second aspect, the inorganic flame retardant is at least one flame retardant selected from magnesium hydroxide and aluminum hydroxide. It is a feature.

【0011】請求項4に記載された発明は、請求項1〜
3のいずれかに記載された発明において、可塑剤がフタ
ル酸ジオクチル、フタル酸ジイソノニル、フタル酸ジイ
ソデシル及びフタル酸ジトリイソデシルから選ばれる少
なくとも1種の化合物あることを特徴とするものであ
る。
The invention described in claim 4 is the first invention.
3. The invention according to any one of 3), wherein the plasticizer is at least one compound selected from dioctyl phthalate, diisononyl phthalate, diisodecyl phthalate, and ditriisodecyl phthalate.

【0012】請求項5に記載された発明は、請求項1〜
4のいずれかに記載された粘着テープ用ノンハロゲン樹
脂組成物を成形してなるフィルムである。
The invention described in claim 5 is the first invention.
4. A film obtained by molding the non-halogen resin composition for an adhesive tape according to any one of the above items 4.

【0013】請求項6に記載された発明は、請求項5に
記載されたフィルムを切断して得たテープの片面にアク
リル系エマルジョン粘着組成物を塗布してなる粘着テー
プである。
According to a sixth aspect of the present invention, there is provided an adhesive tape obtained by applying an acrylic emulsion adhesive composition to one side of a tape obtained by cutting the film according to the fifth aspect.

【0014】[0014]

【発明の実施の形態】本発明のポリオレフィン系樹脂1
00重量部及び無機系難燃剤60〜150重量部重量部
からなる粘着テープ用ノンハロゲン樹脂組成物には、可
塑剤3〜5重量部が含有されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Polyolefin resin 1 of the present invention
The non-halogen resin composition for an adhesive tape comprising 00 parts by weight and 60 to 150 parts by weight of an inorganic flame retardant contains 3 to 5 parts by weight of a plasticizer.

【0015】本発明において用いられる「ポリオレフィ
ン系樹脂」は、ハロゲンを含有していないポリオレフィ
ン樹脂であり、好ましくは、ポリエチレン、ポリプロピ
レン、エチレン−エチルアクリレート共重合体(EE
A)、エチレン−メチルアクリレート共重合体、エチレ
ン−酢酸ビニル共重合体、エチレン−プロピレン共重合
体、エチレン−ヘキセン共重合体及びエチレン−オクテ
ン共重合体から選ばれる少なくとも1種の樹脂である
が、これらのみに限定されるものではなく、本発明の目
的に反しない限り、これら以外のハロゲンを含有してい
ないポリオレフィン樹脂であってもかまわない。
The "polyolefin resin" used in the present invention is a polyolefin resin containing no halogen, and is preferably polyethylene, polypropylene, ethylene-ethyl acrylate copolymer (EE
A), at least one resin selected from ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-hexene copolymer and ethylene-octene copolymer, However, the present invention is not limited thereto, and other halogen-free polyolefin resins may be used as long as the object of the present invention is not violated.

【0016】本発明において用いられる「無機系難燃
剤」は、好ましくは、水酸化マグネシウム及び水酸化ア
ルミニウムから選ばれる少なくとも1種の難燃剤である
が、これらのみに限定されるものではなく、本発明の目
的に反しない限り、これら以外の無機難燃剤であっても
かまわない。
The “inorganic flame retardant” used in the present invention is preferably at least one kind of flame retardant selected from magnesium hydroxide and aluminum hydroxide, but is not limited thereto. Other inorganic flame retardants may be used as long as they do not contradict the purpose of the invention.

【0017】本発明において用いられる「可塑剤」は、
好ましくは、フタル酸ジオクチル(以下、「DOP」と
いう)、フタル酸ジイソノニル、フタル酸ジイソデシル
及びフタル酸ジトリイソデシルから選ばれる少なくとも
1種の化合物あが、これらのみに限定されるものではな
く、本発明の目的に反しない限り、これら以外の可塑剤
であってもかまわない。かかる可塑剤は、粘着テープ用
ノンハロゲン樹脂組成物100重量部に対して3〜5重
量部の割合で含有されている。可塑剤の含有量が2重量
部未満では、従来の粘着テープよりタック感が劣る傾向
となり、そして、可塑剤の含有量が5重量部を越えると
粘着力が劣る傾向となる。
The "plasticizer" used in the present invention is:
Preferably, at least one compound selected from dioctyl phthalate (hereinafter, referred to as “DOP”), diisononyl phthalate, diisodecyl phthalate, and ditriisodecyl phthalate is not limited thereto, and is not limited thereto. A plasticizer other than these may be used as long as the purpose is not adversely affected. Such a plasticizer is contained in an amount of 3 to 5 parts by weight based on 100 parts by weight of the non-halogen resin composition for an adhesive tape. When the content of the plasticizer is less than 2 parts by weight, the tackiness tends to be inferior to that of the conventional adhesive tape, and when the content of the plasticizer exceeds 5 parts by weight, the adhesive strength tends to be inferior.

【0018】本発明の粘着テープ用ノンハロゲン樹脂組
成物は、インフレーション法等によりフィルムに成形さ
れる。このように成形されたフィルムは、テープ状にス
リットされ、その片面に、好ましくは、アクリル系エマ
ルジョン粘着組成物が塗布されて粘着テープとされる。
この「粘着テープ」は、難燃性を有しているので、自動
車、家電製品、機械製品等の製造に有用であり、特に、
自動車用組電線を結束する難燃性の粘着テープとして有
用である。
The non-halogen resin composition for an adhesive tape of the present invention is formed into a film by an inflation method or the like. The film thus formed is slit into a tape shape, and an acrylic emulsion adhesive composition is preferably applied to one surface thereof to form an adhesive tape.
Since this "adhesive tape" has flame retardancy, it is useful for manufacturing automobiles, home appliances, mechanical products, etc.
It is useful as a flame-retardant pressure-sensitive adhesive tape for binding automotive electric wires.

【0019】[0019]

【実施例】(実施例1)メルトインデックス:0.75
及びエチルアクリレート含有率:15%のエチレン−エ
チルアクリレート共重合体(日本ポリオレフィン社製、
A1150)100重量部、水酸化マグネシウム(協和
化学社製、キスマ5A)100重量部、及び、DOP
1重量部以下をヘンシェルミキサー投入し、これらを常
温から100℃程度に加熱混合して、ノンハロゲンポリ
オレフィン系樹脂組成物とした。このノンハロゲンポリ
オレフィン系樹脂組成物をインフレーション法により成
形して厚さ約0.11mmフィルムとした。そして、こ
のフィルムをテープ状に切断した後、それらの片面に天
然ゴム50重量部、アクリル系粘着剤(日本カーバイト
社製、TS805)25重量部、及び、粘着付与剤(荒
川化学工業社製、E726)よりなる粘着組成物を約
0.03mmの厚さに塗布し、続いて、この接着剤を塗
布したテープを巻き取って粘着テープとした。
EXAMPLES (Example 1) Melt index: 0.75
And ethyl acrylate content: 15% ethylene-ethyl acrylate copolymer (manufactured by Nippon Polyolefin Co., Ltd.
A1150) 100 parts by weight, 100 parts by weight of magnesium hydroxide (Kisuma 5A, manufactured by Kyowa Chemical Co., Ltd.), and DOP
1 part by weight or less was charged into a Henschel mixer, and these were heated and mixed from room temperature to about 100 ° C. to obtain a non-halogen polyolefin resin composition. This non-halogen polyolefin-based resin composition was molded by an inflation method to obtain a film having a thickness of about 0.11 mm. Then, after this film is cut into a tape shape, 50 parts by weight of natural rubber, 25 parts by weight of an acrylic adhesive (TS805, manufactured by Nippon Carbide Co., Ltd.) and a tackifier (manufactured by Arakawa Chemical Industries, Ltd.) , E726) was applied to a thickness of about 0.03 mm, and the tape coated with the adhesive was wound up to form an adhesive tape.

【0020】(実施例2)メルトインデックス:0.7
5及びエチルアクリレート含有率:15%のエチレン−
エチルアクリレート共重合体(日本ポリオレフィン社
製、A1150)100重量部、水酸化マグネシウム
(協和化学社製、キスマ5A)100重量部、及び、D
OP 1〜2重量部をヘンシェルミキサー投入し、これ
らを常温から100℃程度に加熱混合して、ノンハロゲ
ンポリオレフィン系樹脂組成物とした。このノンハロゲ
ンポリオレフィン系樹脂組成物をインフレーション法に
より成形して厚さ約0.11mmフィルムとした。そし
て、このフィルムをテープ状に切断した後、それらの片
面に実施例1と同様に粘着組成物を塗布して粘着テープ
とした。
(Example 2) Melt index: 0.7
5 and ethyl acrylate content: 15% ethylene-
100 parts by weight of an ethyl acrylate copolymer (A1150, manufactured by Nippon Polyolefin Co., Ltd.), 100 parts by weight of magnesium hydroxide (Kisuma 5A, manufactured by Kyowa Chemical Co., Ltd.), and D
1 to 2 parts by weight of OP was charged into a Henschel mixer, and these were heated and mixed from room temperature to about 100 ° C. to obtain a non-halogen polyolefin resin composition. This non-halogen polyolefin-based resin composition was molded by an inflation method to obtain a film having a thickness of about 0.11 mm. Then, after this film was cut into a tape shape, an adhesive composition was applied to one surface of the film in the same manner as in Example 1 to obtain an adhesive tape.

【0021】(実施例3)メルトインデックス:0.7
5及びエチルアクリレート含有率:15%のエチレン−
エチルアクリレート共重合体(日本ポリオレフィン社
製、A1150)100重量部、水酸化マグネシウム
(協和化学社製、キスマ5A)100重量部、及び、D
OP 3〜5重量部をヘンシェルミキサー投入し、これ
らを常温から100℃程度に加熱混合して、ノンハロゲ
ンポリオレフィン系樹脂組成物とした。このノンハロゲ
ンポリオレフィン系樹脂組成物をインフレーション法に
より成形して厚さ約0.11mmフィルムとした。そし
て、このフィルムをテープ状に切断した後、それらの片
面に実施例1と同様に粘着組成物を塗布して粘着テープ
とした。
(Example 3) Melt index: 0.7
5 and ethyl acrylate content: 15% ethylene-
100 parts by weight of an ethyl acrylate copolymer (A1150, manufactured by Nippon Polyolefin Co., Ltd.), 100 parts by weight of magnesium hydroxide (Kisuma 5A, manufactured by Kyowa Chemical Co., Ltd.), and D
3 to 5 parts by weight of OP was charged into a Henschel mixer, and these were heated and mixed from room temperature to about 100 ° C. to obtain a non-halogen polyolefin resin composition. This non-halogen polyolefin-based resin composition was molded by an inflation method to obtain a film having a thickness of about 0.11 mm. Then, after this film was cut into a tape shape, an adhesive composition was applied to one surface of the film in the same manner as in Example 1 to obtain an adhesive tape.

【0022】(実施例4)メルトインデックス:0.7
5及びエチルアクリレート含有率:15%のエチレン−
エチルアクリレート共重合体(日本ポリオレフィン社
製、A1150)100重量部、水酸化マグネシウム
(協和化学社製、キスマ5A)100重量部、及び、D
OP 6〜10重量部をヘンシェルミキサー投入し、こ
れらを常温から100℃程度に加熱混合して、ノンハロ
ゲンポリオレフィン系樹脂組成物とした。このノンハロ
ゲンポリオレフィン系樹脂組成物をインフレーション法
により成形して厚さ約0.11mmフィルムとした。そ
して、このフィルムをテープ状に切断した後、それらの
片面に実施例1と同様に粘着組成物を塗布して粘着テー
プとした。
(Example 4) Melt index: 0.7
5 and ethyl acrylate content: 15% ethylene-
100 parts by weight of an ethyl acrylate copolymer (A1150, manufactured by Nippon Polyolefin Co., Ltd.), 100 parts by weight of magnesium hydroxide (Kisuma 5A, manufactured by Kyowa Chemical Co., Ltd.), and D
6 to 10 parts by weight of OP was charged into a Henschel mixer, and these were heated and mixed from room temperature to about 100 ° C. to obtain a non-halogen polyolefin resin composition. This non-halogen polyolefin-based resin composition was molded by an inflation method to obtain a film having a thickness of about 0.11 mm. Then, after this film was cut into a tape shape, an adhesive composition was applied to one surface of the film in the same manner as in Example 1 to obtain an adhesive tape.

【0023】(実施例5)メルトインデックス:0.7
5及びエチルアクリレート含有率:15%のエチレン−
エチルアクリレート共重合体(日本ポリオレフィン社
製、A1150)100重量部、水酸化マグネシウム
(協和化学社製、キスマ5A)100重量部、及び、D
OP 10重量部以上をヘンシェルミキサー投入し、こ
れらを常温から100℃程度に加熱混合して、ノンハロ
ゲンポリオレフィン系樹脂組成物とした。このノンハロ
ゲンポリオレフィン系樹脂組成物をインフレーション法
により成形して厚さ約0.11mmフィルムとした。そ
して、このフィルムをテープ状に切断した後、それらの
片面に実施例1と同様に粘着組成物を塗布して粘着テー
プとした。
(Example 5) Melt index: 0.7
5 and ethyl acrylate content: 15% ethylene-
100 parts by weight of an ethyl acrylate copolymer (A1150, manufactured by Nippon Polyolefin Co., Ltd.), 100 parts by weight of magnesium hydroxide (Kisuma 5A, manufactured by Kyowa Chemical Co., Ltd.), and D
10 parts by weight or more of OP was charged into a Henschel mixer, and these were heated and mixed from room temperature to about 100 ° C. to obtain a non-halogen polyolefin resin composition. This non-halogen polyolefin-based resin composition was molded by an inflation method to obtain a film having a thickness of about 0.11 mm. Then, after this film was cut into a tape shape, an adhesive composition was applied to one surface of the film in the same manner as in Example 1 to obtain an adhesive tape.

【0024】(比較例1)メルトインデックス:0.7
5及びエチルアクリレート含有率:15%のエチレン−
エチルアクリレート共重合体(日本ポリオレフィン社
製、A1150)100重量部及び水酸化マグネシウム
(協和化学社製、キスマ5A)100重量部をヘンシェ
ルミキサー投入し、これらを常温から100℃程度に加
熱混合して、ノンハロゲンポリオレフィン系樹脂組成物
とした。このノンハロゲンポリオレフィン系樹脂組成物
をインフレーション法により成形して厚さ約0.11m
mフィルムとした。そして、このフィルムをテープ状に
切断した後、それらの片面に実施例1と同様に粘着組成
物を塗布して粘着テープとした。
Comparative Example 1 Melt Index: 0.7
5 and ethyl acrylate content: 15% ethylene-
100 parts by weight of an ethyl acrylate copolymer (manufactured by Nippon Polyolefin Co., Ltd., A1150) and 100 parts by weight of magnesium hydroxide (manufactured by Kyowa Chemical Co., Ltd., Kisuma 5A) were charged into a Henschel mixer, and these were heated and mixed from room temperature to about 100 ° C. And a non-halogen polyolefin resin composition. This non-halogen polyolefin resin composition is molded by an inflation method to a thickness of about 0.11 m.
m film. Then, after this film was cut into a tape shape, an adhesive composition was applied to one surface of the film in the same manner as in Example 1 to obtain an adhesive tape.

【0025】前記実施例1〜5及び比較例1で得た粘着
テープの「触感によるタック性(触感タック)」及び
「粘着力」をJISC2107に記載された180度引
き剥がし粘着力により測定し、次の評価基準で評価し
た。 (イ)「触感タック」の評価基準 ◎・・・良 ○・・・並 ×・・・悪 (ロ)「粘着力」の評価基準 ◎・・・従来と比べて優れる ○・・・従来と比べて同等 ×・・・従来と比べて劣る
The "tacky (tactile tack)" and "adhesive strength" of the adhesive tapes obtained in Examples 1 to 5 and Comparative Example 1 were measured by 180-degree peel adhesive force described in JISC2107. The following evaluation criteria evaluated. (A) Evaluation criteria for “tactile tack” ◎ ・ ・ ・ good ○ ・ ・ ・ Normal × ・ ・ ・ poor (b) Evaluation criteria for “adhesive strength” ◎ ・ ・ ・ Excellent compared to conventional ○○ Equal to × × Inferior to conventional

【0026】評価結果は次の表1に示される。The evaluation results are shown in Table 1 below.

【0027】[0027]

【表1】 [Table 1]

【0028】[0028]

【発明の効果】本発明によれば、フィルムに含有された
可塑剤を粘着層に移行させて従来のポリハロゲン化ビニ
ル粘着テープと同等又は同等以上のタック性及び粘着性
を確保した粘着テープ用ノンハロゲン樹脂組成物、これ
を成形してなる粘着テープ用フィルム、及び、粘着テー
プを提供することができる。それ故、本発明によれば、
従来のように粘着組成物に可塑剤を含有させる必要がな
く、そのために、粘着剤組成物を均一に分散させるため
の攪拌時間を短縮させることができ、また、粘度コント
ロールを容易にすることができる。そして、本発明によ
る粘着テープは、難燃性を有しているので、自動車、家
電製品、機械製品等の製造に有用であり、特に、自動車
用組電線を結束する難燃性の粘着テープとして有用であ
る。
According to the present invention, a plasticizer contained in a film is transferred to an adhesive layer to secure tackiness and adhesiveness equal to or greater than that of a conventional polyvinyl halide adhesive tape. A non-halogen resin composition, a film for an adhesive tape obtained by molding the same, and an adhesive tape can be provided. Therefore, according to the present invention,
There is no need to include a plasticizer in the pressure-sensitive adhesive composition as in the past, and therefore, the stirring time for uniformly dispersing the pressure-sensitive adhesive composition can be shortened, and viscosity control can be facilitated. it can. And since the pressure-sensitive adhesive tape according to the present invention has flame retardancy, it is useful for the production of automobiles, home electric appliances, mechanical products, and the like. Useful.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F071 AA15 AA20X AA28X AA33X AH07 AH12 AH17 BC01 4J002 BB031 BB061 BB071 BB141 BB151 BB171 BF031 BG001 DE076 DE146 EH137 FD027 FD136 GH01 GJ00 HA07 4J004 AA10 AB01 CA03 CA04 CA07 CC02  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA15 AA20X AA28X AA33X AH07 AH12 AH17 BC01 4J002 BB031 BB061 BB071 BB141 BB151 BB171 BF031 BG001 DE076 DE146 EH137 FD027 FD136 GH01 AJ04 CA07 CC04

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 ポリオレフィン系樹脂100重量部及び
無機系難燃剤60〜150重量部からなる粘着テープ用
ノンハロゲン樹脂組成物において、可塑剤3〜5重量部
を含有させたことを特徴とする粘着テープ用ノンハロゲ
ン樹脂組成物。
1. A non-halogen resin composition for an adhesive tape comprising 100 parts by weight of a polyolefin resin and 60 to 150 parts by weight of an inorganic flame retardant, wherein 3 to 5 parts by weight of a plasticizer is contained. Non-halogen resin composition for use.
【請求項2】 ポリオレフィン系樹脂がポリエチレン、
ポリプロピレン、エチレン−エチルアクリレート共重合
体、エチレン−メチルアクリレート共重合体、エチレン
−酢酸ビニル共重合体、エチレン−プロピレン共重合
体、エチレン−ヘキセン共重合体及びエチレン−オクテ
ン共重合体から選ばれる少なくとも1種の樹脂であるこ
とを特徴とする請求項1記載の粘着テープ用ノンハロゲ
ン樹脂組成物。
2. The polyolefin resin is polyethylene,
Polypropylene, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, at least one selected from ethylene-hexene copolymer and ethylene-octene copolymer 2. The non-halogen resin composition for an adhesive tape according to claim 1, which is one kind of resin.
【請求項3】 無機系難燃剤が水酸化マグネシウム及び
水酸化アルミニウムから選ばれる少なくとも1種の難燃
剤であることを特徴とする請求項1又は2記載の粘着テ
ープ用ノンハロゲン樹脂組成物。
3. The non-halogen resin composition for an adhesive tape according to claim 1, wherein the inorganic flame retardant is at least one flame retardant selected from magnesium hydroxide and aluminum hydroxide.
【請求項4】 可塑剤がフタル酸ジオクチル、フタル酸
ジイソノニル、フタル酸ジイソデシル及びフタル酸ジト
リイソデシルから選ばれる少なくとも1種の化合物ある
ことを特徴とする請求項1〜3のいずれかに記載の粘着
テープ用ノンハロゲン樹脂組成物。
4. The pressure-sensitive adhesive tape according to claim 1, wherein the plasticizer is at least one compound selected from dioctyl phthalate, diisononyl phthalate, diisodecyl phthalate, and ditriisodecyl phthalate. Non-halogen resin composition for use.
【請求項5】 請求項1〜4のいずれかに記載された粘
着テープ用ノンハロゲン樹脂組成物を成形してなるフィ
ルム。
5. A film obtained by molding the non-halogen resin composition for a pressure-sensitive adhesive tape according to claim 1.
【請求項6】 請求項5に記載されたフィルムを切断し
て得たテープの片面にアクリル系エマルジョン粘着剤を
塗布してなる粘着テープ。
6. A pressure-sensitive adhesive tape obtained by applying an acrylic emulsion pressure-sensitive adhesive to one side of a tape obtained by cutting the film according to claim 5.
JP31777499A 1999-11-09 1999-11-09 Non-halogenated resin composition for adhesive tape, film which is formed from the same and is used for adhesive tape, and adhesive tape Pending JP2001131509A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31777499A JP2001131509A (en) 1999-11-09 1999-11-09 Non-halogenated resin composition for adhesive tape, film which is formed from the same and is used for adhesive tape, and adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31777499A JP2001131509A (en) 1999-11-09 1999-11-09 Non-halogenated resin composition for adhesive tape, film which is formed from the same and is used for adhesive tape, and adhesive tape

Publications (1)

Publication Number Publication Date
JP2001131509A true JP2001131509A (en) 2001-05-15

Family

ID=18091910

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Country Link
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002371250A (en) * 2001-06-14 2002-12-26 Hagihara Industries Inc Base fabric for pressure-sensitive adhesive tape
WO2003070848A1 (en) * 2002-02-25 2003-08-28 Yazaki Corporation Nonhalogenic flame-retardant adhesive tape and method for manufacturing the same
JP2005170990A (en) * 2003-12-08 2005-06-30 Nitto Denko Corp Adhesive tape
JP2006241260A (en) * 2005-03-02 2006-09-14 Prime Polymer:Kk Polypropylene-based resin composition and molded product thereof
US7875670B2 (en) 2002-08-12 2011-01-25 Exxonmobil Chemical Patents Inc. Articles from plasticized polyolefin compositions
US7985801B2 (en) 2002-08-12 2011-07-26 Exxonmobil Chemical Patents Inc. Fibers and nonwovens from plasticized polyolefin compositions
US7998579B2 (en) 2002-08-12 2011-08-16 Exxonmobil Chemical Patents Inc. Polypropylene based fibers and nonwovens
US8003725B2 (en) 2002-08-12 2011-08-23 Exxonmobil Chemical Patents Inc. Plasticized hetero-phase polyolefin blends
EP2383321A2 (en) 2007-11-28 2011-11-02 Nitto Denko Corporation Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process
US8192813B2 (en) 2003-08-12 2012-06-05 Exxonmobil Chemical Patents, Inc. Crosslinked polyethylene articles and processes to produce same
US8211968B2 (en) 2002-08-12 2012-07-03 Exxonmobil Chemical Patents Inc. Plasticized polyolefin compositions
US8298660B2 (en) 2007-04-17 2012-10-30 Nitto Denko Corporation Flame-retardant polyolefin resin composition and adhesive tape substrate composed of the composition, and adhesive tape
US8389615B2 (en) 2004-12-17 2013-03-05 Exxonmobil Chemical Patents Inc. Elastomeric compositions comprising vinylaromatic block copolymer, polypropylene, plastomer, and low molecular weight polyolefin
US8513347B2 (en) 2005-07-15 2013-08-20 Exxonmobil Chemical Patents Inc. Elastomeric compositions

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002371250A (en) * 2001-06-14 2002-12-26 Hagihara Industries Inc Base fabric for pressure-sensitive adhesive tape
WO2003070848A1 (en) * 2002-02-25 2003-08-28 Yazaki Corporation Nonhalogenic flame-retardant adhesive tape and method for manufacturing the same
US8003725B2 (en) 2002-08-12 2011-08-23 Exxonmobil Chemical Patents Inc. Plasticized hetero-phase polyolefin blends
US8217112B2 (en) 2002-08-12 2012-07-10 Exxonmobil Chemical Patents Inc. Plasticized polyolefin compositions
US7875670B2 (en) 2002-08-12 2011-01-25 Exxonmobil Chemical Patents Inc. Articles from plasticized polyolefin compositions
US8211968B2 (en) 2002-08-12 2012-07-03 Exxonmobil Chemical Patents Inc. Plasticized polyolefin compositions
US7985801B2 (en) 2002-08-12 2011-07-26 Exxonmobil Chemical Patents Inc. Fibers and nonwovens from plasticized polyolefin compositions
US7998579B2 (en) 2002-08-12 2011-08-16 Exxonmobil Chemical Patents Inc. Polypropylene based fibers and nonwovens
US8192813B2 (en) 2003-08-12 2012-06-05 Exxonmobil Chemical Patents, Inc. Crosslinked polyethylene articles and processes to produce same
US8703030B2 (en) 2003-08-12 2014-04-22 Exxonmobil Chemical Patents Inc. Crosslinked polyethylene process
JP2005170990A (en) * 2003-12-08 2005-06-30 Nitto Denko Corp Adhesive tape
US8389615B2 (en) 2004-12-17 2013-03-05 Exxonmobil Chemical Patents Inc. Elastomeric compositions comprising vinylaromatic block copolymer, polypropylene, plastomer, and low molecular weight polyolefin
JP4638256B2 (en) * 2005-03-02 2011-02-23 株式会社プライムポリマー Polypropylene resin composition and molded product thereof
JP2006241260A (en) * 2005-03-02 2006-09-14 Prime Polymer:Kk Polypropylene-based resin composition and molded product thereof
US8513347B2 (en) 2005-07-15 2013-08-20 Exxonmobil Chemical Patents Inc. Elastomeric compositions
US8298660B2 (en) 2007-04-17 2012-10-30 Nitto Denko Corporation Flame-retardant polyolefin resin composition and adhesive tape substrate composed of the composition, and adhesive tape
EP2383321A2 (en) 2007-11-28 2011-11-02 Nitto Denko Corporation Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process

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