JP2000353228A - Ic card with magnetic recording layer and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To actualize a contact type and noncontact type IC card which is usable as a magnetic card and an IC card without any trouble by embedding a magnetic recording layer in the thermoplastic resin layer of a heat-resisting sheet and making the surface smooth. SOLUTION: This is a contact type and noncontact type IC card constituted by embedding a magnetic recording layer 3 in a thermoplastic resin layer 2 on a heat-resisting sheet 12 and making the surface smooth. As heat-resisting sheets 1 used as the top and reverse sheets of the card, plastic sheets and paper are usable which sufficiently withstand a method for integrating and machining sheets stacked across hot-melt adhesives, etc., not to mention rigidity for proper printing in case of preprinting and enough resistance to heat in drying. Any thermoplastic resin 2 is variously selected without any limitation as long as sufficient performance are obtained for properties that the card needs to have.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a communication coil and an IC.
The present invention relates to an IC card in which an IC module composed of a C chip and external components is embedded, and particularly to a contact type and a non-contact type IC card in which a magnetic tape is provided so as to be entirely embedded in the card surface. is there.

[0002]

2. Description of the Related Art In recent years, IC cards have attracted attention because of their high security and the large amount of data that can be handled. IC cards are mainly classified into contact type and non-contact type. The former inserts the card into the reader as the name implies, and makes the terminal on the reader side directly contact the metal terminal exposed on the card surface. It reads and writes information. On the other hand, the latter is a non-contact IC comprising an antenna coil for power supply and information communication and an IC chip for holding data in the card.
C module embedded, record information without contact,
In recent years, there is a high demand in the market due to high convenience because reading can be performed.

Various proposals have been made for applications of these non-contact IC cards, and security-related systems for entrance / exit control such as student ID cards and employee ID cards, gate opening / closing systems for parking lots, commuter passes and other traffic-related applications. Use in various fields such as distribution use of electronic money and credit cards is being studied.

One of these applications is a driver's license or a non-contact IC card mounted on a vehicle. It is assumed that these cards are left in the car, and particularly high reliability is required. In other words, it is said that the temperature reaches around 100 ° C. around the dashboard under the scorching sun, and this card is required to have heat resistance that can withstand such an environment. In particular, there is an increasing demand not only for such applications but also for higher heat resistance of cards.

[0005] A variety of methods have been studied for producing contact-type and non-contact-type cards, and the most common method is a thermal lamination method. In this method, a rigid vinyl chloride sheet or a thermoplastic sheet such as PET-G is collated and laminated on both sides of a module, and is processed into an integrated card by heat and pressure.

[0006] The card produced by this method is one of the most promising production methods because it has almost the same characteristics in terms of tactile sensation and physical properties as conventional cards. However, when a conventional thermoplastic sheet material used in such a laminating method is used, it is greatly deformed at a temperature close to 100 ° C. Therefore, in recent years, the development of high heat-resistant sheets has been progressing, and this kind of material is being studied for general cards.

However, in order to embed a deformed object such as a contact or non-contact module, when these highly heat-resistant sheets are used, it is necessary to set the temperature condition to a considerably high temperature. There is a risk of destroying the module. Therefore, there is a limit to increasing the heat resistance of the IC card lamination method.

Therefore, as another method of manufacturing an IC card that can withstand a high temperature environment, a core sheet in which an IC module is once sandwiched between conventional types of thermoplastic sheets and the IC module is embedded by heat and pressure is biaxially stretched on both sides. A method of improving heat resistance in a portion of the sheet by bonding a high heat-resistant sheet such as a polyester film or the like and fusing it with hot pressure via an adhesive has been studied.

Also, a method of punching into a card shape after heating and hardening the filler after adjusting the thickness by using a filler having fluidity at room temperature in the core portion like a so-called adhesive for structural material, and then performing carding. Are also being considered.

As described above, a method for realizing high heat resistance by using a high heat-resistant sheet such as a biaxially stretched polyester film on the surface of the card has been studied. There are drawbacks. That is, in the case of a card using a high heat-resistant sheet on the surface as described above, it is possible to provide a magnetic tape, but since the sheet has extremely high heat resistance, the tape itself is the same as the peripheral part as in the past. It cannot be embedded and smoothed to the height.

[0011] Though the IC card, conventional magnetic R / W
Today, when the infrastructure is established, there are many demands for the addition of magnetic tape. Many of the current contact-type and non-contact-type IC card operation systems are used alone, but many proposals have been made to combine multiple application functions on a single card by using them together with magnetism. I have.

[0012]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned problems, and has been developed in order to produce a magnetic card and a single card having the functions of an IC card. Another object of the present invention is to realize a contact-type and non-contact-type IC card which can be used without any problem as an IC card and can be provided with a magnetic recording layer with the same appearance as the conventional one.

[0013]

SUMMARY OF THE INVENTION The present invention has been studied and devised in view of the above-mentioned problems of the prior art, and has been made in order to achieve the above object. A contact type or non-contact type IC card having a magnetic recording layer, wherein a magnetic recording layer is buried in a thermoplastic resin layer on the heat-resistant sheet to smooth the surface. It is.

According to a second aspect of the present invention, there is provided a contact type having a magnetic recording layer according to the first aspect, wherein the magnetic tape is buried in a thermoplastic resin by heat pressure to make the surface smooth. It is a contact type IC card.

According to a third aspect of the present invention, a thermoplastic resin layer is provided on a heat-resistant sheet in advance, and a magnetic tape is temporarily fixed on the thermoplastic resin. A contact type and non-contact type IC card having a magnetic recording layer, wherein the magnetic tape is buried in a thermoplastic resin and the surface is smoothed.

According to a fourth aspect of the present invention, a thermoplastic resin layer is provided on a heat-resistant sheet in advance, a magnetic tape is temporarily fixed on the thermoplastic resin, and the magnetic tape is attached to the thermoplastic resin by heat and pressure. A method for manufacturing a contact-type or non-contact-type IC card having a magnetic recording layer, characterized by being embedded in a core sheet containing an IC module and then laminated by heat and pressure after the surface is smoothed. is there.

According to the present invention, it is possible to obtain an IC card in which a magnetic tape is embedded so that the surface becomes smooth, similarly to a conventional magnetic card, even if a high heat-resistant sheet is used on both sides. That is, contact-type and non-contact-type IC cards having a magnetic recording layer can be produced under the same pressing conditions (temperature, pressure, and pressing time) as when stacking ordinary heat-resistant sheets.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 shows the basic layer configuration of the non-contact IC card of the present invention. The heat-resistant sheet used for the front and back sheets of the card (1) The base material has sufficient rigidity, such as the rigidity required for proper printing when pre-printing is performed, the strength to withstand the heat applied during drying, and the lamination. It is possible to use a plastic sheet or paper that can sufficiently withstand a method of integrally processing laminated sheets via an adhesive such as hot melt, as well as obtaining sufficient heat resistance and strength after carding. Examples of a plastic sheet that can be used for these include sheets such as a polyethylene terephthalate sheet (PET film), a polyethylene naphthalate sheet (PEN film), a polyimide sheet, and a polyphenylene sulfide sheet (PPS film).

The thermoplastic core sheet (6) for embedding the non-contact IC module when forming the core is not particularly limited as long as it is a material that can be embedded reliably within a temperature range that does not damage the module. As PVC
A sheet, a PET-G sheet, a vinyl chloride-vinyl acetate copolymer sheet, an ABS sheet, or the like can be appropriately selected.

The adhesive used in the method of forming a card by the step of bonding via an adhesive can be variously selected depending on the type of the plastic sheet to be laminated. Ethylene vinyl alcohol (EVA), polyester, polyurethane, acrylic Adhesives in the form of a hot melt type sheet by mixing or mixing of two types, epoxy resin of two-component type, urethane-based resin, resin that is completely cured by combined curing of UV and cationic polymerization, anaerobic, moisture, etc. or a mixture thereof I can do it.

The non-contact IC module used comprises an antenna coil (5) for communication and power supply and an IC module (4), and in some cases, external parts such as a capacitor for adjusting the resonance frequency. The specifications are various depending on the communication frequency, communication distance, memory capacity, and the presence or absence of the CPU.

As the antenna coil (5), a so-called wound coil type in which a conductive metal wire such as a copper wire or an aluminum wire is wound, or a conductive metal foil such as copper or aluminum on a tough plastic sheet such as polyimide or polyester. Can be used, and a conductive ink formed by a known printing means such as a screen printing method or a gravure printing method can be used.

Further, an IC module to be mounted (4)
Is an FPC board in which an IC is mounted on a board on which a wiring pattern is formed together with external components on a base material such as epoxy resin or polyester resin containing polyimide or glass fiber, and joined by soldering or ultrasonic waves Or a flip chip mounting method for directly bonding the chip on which the bonding bumps are formed to the coil, and the like, to form a module.

When printing is provided on a card base material,
Offset printing, gravure printing, flexo printing,
It can be provided by a known printing means such as a screen printing method.

The thermoplastic resin (2) for embedding the magnetic tape is not particularly limited and may be variously selected as long as it has sufficient performance with respect to the physical properties required for the card. The method is roughly classified into a method of providing by coating and a method of sticking a sheet into a sheet by applying heat and pressure. In the case of providing by coating, the coating method is not particularly limited as long as it can be provided with a film thickness larger than that of the magnetic tape to be processed after the embedding surface. As an example, a known printing method such as a gravure printing method or a screen printing method may be used. Also, in the case of using a sheet-like material, it can be appropriately selected as long as the magnetic tape is thicker than the magnetic tape to be processed after the embedding surface. As an example, a PVC sheet, a PET-G sheet, a vinyl chloride-vinyl acetate copolymer sheet, an ABS sheet, or the like can be provided via an adhesive. Needless to say, a sheet having a thermoplastic resin layer on the surface by a co-extrusion method may be used.

[0026]

[Example 1] White PET-250 mm thick on both sides of a non-contact IC module composed of a winding antenna coil (5) and an IC module (4).
The G sheets are collated and laminated so as to sandwich the coil. 1
A core sheet (6) is prepared by applying a heat pressure of 50 ° C. and a pressure of 10 kgf / cm ² .

Next, as a heat-resistant sheet (1) of 125 μm, a polyester resin is applied by gravure printing to a dry film thickness of 3 μm on the side to be bonded to the front and back core sheets of white stretched PET. Dry,
Picture printing is performed by the offset printing method on the reverse side of the sheet, that is, on the front side of the card.

Next, a polyester resin is applied as a thermoplastic resin (2) on the pattern print by a microgravure printing method so as to have a dry film thickness of 20 μm. After the sheet is cut, the magnetic tape is temporarily fixed to form a front and back sheet. .

Next, as shown in FIG. 2, a white stretched P with magnetic tapes temporarily fixed on both sides of the core sheet between the platens.
The ETs are gathered and laminated, and a heat pressure of 150 ° C. and 10 kgf / cm ² is applied to obtain a card sheet. Next, punching was performed to the card size with a puncher, and a non-contact IC card having a magnetic recording layer having a layer configuration as shown in FIG. 1 was obtained.

[Embodiment 2] Winding antenna coil (5)
-Contact IC composed of IC and IC module (4)
White PET with 200μm thickness on both sides of module
-G sheets are collated and laminated so as to sandwich the coil.
A core sheet (6) is prepared by applying a heat pressure of 10 kgf / cm ² at 150 ° C.

Next, the white stretch P of 125 μm
Dry film thickness 3 by gravure printing method on the side of the ET to be bonded to each of the front and back core sheets.
hot melt adhesive layer (7a)
Is provided. Thereafter, the pattern is printed on the reverse side of the sheet, that is, on the front side of the card by the offset printing method.

Next, an adhesive layer (7b) is provided on the pattern print by a gravure printing method using a resin obtained by mixing a vinyl chloride-vinyl acetate copolymer resin and a polyester resin as an adhesive so as to have a dry film thickness of 1 μm.

Next, between the surface plates, the core sheet (6)
The white stretched PET printed on both sides of the above, and an oversheet in which a magnetic tape (3) is temporarily fixed to a transparent polyvinyl chloride having a thickness of 50 μm as a thermoplastic resin (2) are gathered and laminated, and 150 ° C., 10 kgf / A heat pressure of cm ² is applied to obtain a card sheet. Next, punching was performed to a card size using a puncher to obtain a non-contact IC card having a magnetic recording layer having a layer configuration as shown in FIG.

[Embodiment 3] An embodiment in which a non-contact IC module prepared by flip-chip mounting on an antenna coil formed on a substrate by etching is used to make a card using a sheet in which a magnetic tape is embedded in advance. Is shown. One side of a white stretched PET sheet having a thickness of 125 μm as a heat-resistant sheet (1) is subjected to character and picture printing by an offset printing method, and a polyester resin as a thermoplastic resin (2) is dried by a screen printing method.
The magnetic tape is provided so as to have a thickness of 0 μm and temporarily fixed.

Next, a heat-resistant sheet having a magnetic tape temporarily fixed to the thermoplastic resin was heated at 150 ° C. and 10 kgf / cm ^2.
Then, the magnetic tape was pressed so that the magnetic tape was smoothly embedded to obtain a sheet with front and back magnetic tapes.

Next, an adhesive layer (7c) of a urethane-based adhesive is screen-printed on a surface opposite to the surface on which the magnetic tape is provided on one of the front and back sheets, and the non-contact IC module is temporarily fixed.

Next, a filling adhesive (6a) made of a two-liquid curing type epoxy resin having fluidity at normal temperature is applied to the heat-resistant sheet (1) by a nozzle on the surface opposite to the surface on which the character pattern is printed. It is provided to a thickness of about 1 mm by a coat, and a heat-resistant sheet is attached to the front and back sides, and then crushed to a desired card thickness by a thickness adjusting roller. Thereafter, the epoxy resin is cured through a drying path in a 100 ° C. atmosphere for 5 minutes. Finally, punch into a card size with a puncher.
Non-contact I having a magnetic recording layer having a layer configuration as shown in FIG.
I got a C card. The method shown in Example 3 includes a step of embedding a temporarily fixed magnetic tape in a thermoplastic resin, and a step of forming a core with a two-part curing type epoxy resin.
Since this is a method for producing an IC card by integrating with the C module, it is a preferable method in which heat and pressure applied to the IC module are small.

In the above embodiment, a non-contact type IC card is described. However, a contact type IC card can be basically implemented in the same manner although there is a difference in the presence / absence of an antenna and the presence / absence of a connection terminal.

By embedding the magnetic tape in a thermoplastic resin and making it flush, it can be used as a magnetic card or an IC card without any problem. Further, by overlaying with a heat-resistant sheet, an IC card having a magnetic recording layer having heat resistance similar to that of a conventional heat-resistant IC card can be manufactured.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an I having a magnetic recording layer according to Example 1 of the present invention.
It is sectional drawing explaining the layer structure of C card.

FIG. 2 is a schematic diagram illustrating a collating and laminating step according to the first embodiment of the present invention.

FIG. 3 is a cross sectional view showing a magnetic recording layer according to a second embodiment of the present invention;
It is sectional drawing explaining the layer structure of C card.

FIG. 4 is a cross sectional view illustrating a magnetic recording layer according to a third embodiment of the present invention;
It is sectional drawing explaining the layer structure of C card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Heat resistant sheet 2 ... Thermoplastic resin layer for magnetic tape embedding 3 ... Magnetic recording layer 4 ... IC module 5 ... Antenna coil 6 ... Core sheet 6a ... Filling adhesive (two-component curing type epoxy) 7 ... Adhesive layer 7a ... Hot melt adhesive layer 7b ... Adhesive layer (vinyl chloride / vinyl acetate copolymer / polyester) 7c ... Adhesive layer (urethane-based) 10 ... Surface plate

Claims (4)

[Claims] 1. An IC card using a heat-resistant sheet on the front and back, having a magnetic recording layer characterized by burying a magnetic recording layer in a thermoplastic resin layer on the heat-resistant sheet and smoothing the surface. Contact type and non-contact type IC cards. 2. A contact type and non-contact type IC having a magnetic recording layer according to claim 1, wherein the magnetic tape is buried in a thermoplastic resin by heat and pressure to smooth the surface.
card. 3. After a thermoplastic resin layer is provided on a heat-resistant sheet in advance, and a magnetic tape is temporarily fixed on the thermoplastic resin,
Contact type and non-contact type ICs having a magnetic recording layer, characterized in that they are laminated and integrated with a core sheet including an IC module by heat and pressure and at the same time, a magnetic tape is embedded in a thermoplastic resin to smooth the surface. Card manufacturing method. 4. A thermoplastic resin layer is provided on a heat-resistant sheet in advance, a magnetic tape is temporarily fixed on the thermoplastic resin, and the magnetic tape is buried in the thermoplastic resin by heat and pressure to smooth the surface. And a method for manufacturing a contact type and non-contact type IC card having a magnetic recording layer, wherein the core sheet and the core sheet including the IC module are laminated by heat and integrated.