JP2000349475A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a personal computer having an excellent cooling function for a CPU and a structure suitable to a low profile device. SOLUTION: A personal computer is provided with rotors 12 and 13 respectively having wing parts 16 and 17 on the front and rear surfaces of a main substrate 4. Further, the upper rotor 12 and the lower rotor 13 are supported on a single bearing 10 caulked on the main substrate 4 via a single rotor shaft 11. Moreover, heat sinks 7 and 8 are provided in substantially opposite positions so as to sandwich a CPU 5. Accordingly, in the personal computer, since heat can be removed from both surfaces of the CPU 5 via respective heat sinks, an excellent cooling effect can be obtained. At the same time, since stator parts are fixed on the main substrate 4, and the rotor part is supported on the single bearing caulked on the main substrate 4, a case can be made thin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin electronic device such as a notebook personal computer.

[0002]

2. Description of the Related Art In recent years, integrated circuit components such as a microprocessor unit (hereinafter, referred to as MPU) tend to increase in heat generation with an increase in data processing speed. MPU
If data processing is performed while heat is generated, a malfunction may occur. Therefore, in order to suppress an increase in the temperature of the MPU main body due to heat generation, a method of cooling the MPU using a cooling fan is generally adopted.

For example, the cooling mechanism of an MPU such as a personal computer
A heat sink is attached in close contact with the top surface of the MPU mounted on the main board inside the personal computer, and this heat sink is cooled from the direction along the board surface by a cooling fan mounted inside the housing of the personal computer. , MPU
Is configured to remove heat.

In recent years, there has been an increasing demand for thinner and lighter personal computers, particularly notebook-type or mobile-type personal computers, which are particularly suitable for portable use. How to configure the cooling mechanism of the MPU while utilizing
This is an important item in designing such a portable terminal.

[0005]

However, such a structure of a conventional notebook personal computer or the like requires at least a thickness of a main board in a housing and a thickness of a cooling fan in providing a cooling mechanism of the MPU. Space must be secured in the thickness direction inside the housing of the personal computer, and there is a limit to the overall thickness of the personal computer.

As described above, since the operation speed of recent MPUs has been increased and the amount of heat generated by the MPU body has been increased, a conventional notebook personal computer or the like which simply cools a heat sink attached to the upper surface of the MPU is used. The cooling mechanism of
A sufficient cooling effect on the MPU cannot be obtained, which is a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide an electronic device having an excellent cooling function for integrated circuit components and having a structure suitable for thinning. Things.

[0008]

According to a first aspect of the present invention, there is provided an electronic apparatus comprising: a wiring board on which an integrated circuit component is mounted; And a fan that is fixed and cools the integrated circuit component.

In the electronic device of the present invention, for example, a personal computer, a cooling fan is fixed to a wiring board on which an integrated circuit component such as an MPU is mounted. Therefore, it becomes possible to mount electric components such as a rotor and a stator for rotating the fan on the wiring board, etc., so that a space in the thickness direction for disposing the cooling mechanism including the fan can be reduced. Thus, the electronic device such as a personal computer can have a thin structure as a whole.

According to a second aspect of the present invention, there is provided an electronic apparatus, comprising: a wiring board on which an integrated circuit component is mounted; and a wiring board facing the wiring board with the integrated circuit component interposed therebetween. A first heat sink provided at a position in contact with a circuit component directly or via a conductor, and a first heat sink opposed to the first heat sink with the integrated circuit component and the wiring board interposed therebetween, and And a pair of fans mounted on both sides of the wiring board so as to sandwich the wiring board and cooling the first and second heat sinks, respectively. It is characterized by.

According to a third aspect of the present invention, there is provided an electronic apparatus according to the second aspect, wherein a rotation axis for rotating the pair of fans is common. Is provided on the wiring board.

In the electronic device according to the second or third aspect, a pair of fans is provided on both surfaces of the wiring board, and the pair of fans is supported by one bearing provided on the wiring board. Further, in this electronic apparatus, heat sinks are provided at positions substantially opposed to each other with the integrated circuit component interposed therebetween. Therefore, according to the electronic device according to the second or third aspect, since heat can be removed from both sides of the integrated circuit component through each heat sink, an excellent cooling effect can be exhibited for the integrated circuit component. Can be. According to the electronic device of the present invention, although the fans are provided on both sides of the wiring board, these fans are fixed to the wiring board and one bearing provided on the wiring board. Therefore, as described above, not only an excellent cooling effect for the integrated circuit component can be obtained, but also the electronic device can be configured to be thin as a whole.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a personal computer according to an embodiment of the present invention. As shown in FIG. 1, the personal computer 1 is a notebook type useful when being carried, for example, and has a personal computer body 2 on which a hard disk, a main board, a keyboard and the like are mounted.
And a liquid crystal display panel 3 for visually displaying information and the like input through a keyboard or the like on the upper surface of the personal computer body 2 to the user.

In the personal computer 1, one end of the liquid crystal display panel 3 is rotatably supported by the personal computer body 2, and the display surface of the liquid crystal display panel 3 and the keyboard are opposed to each other as shown in FIG. It is possible to create a portable state in which the liquid crystal display panel 3 is compactly assembled and an operation state in which the display surface of the liquid crystal display panel 3 is separated from the keyboard as shown in FIG.

Further, as shown in FIG.
A main board 4 on which various electronic components including a RAM, a ROM and the like are mounted is incorporated. Further, as shown in FIG. For controlling input and output of signals and signals
U (central processing unit) 5 is mounted.

Here, a cooling mechanism for cooling the CPU 5 provided in the personal computer 1 of the present embodiment will be described in detail.

In the vicinity of the CPU 5 as this cooling mechanism,
A silicone rubber sheet 6 provided so as to be in close contact with the upper surface of the CPU 5 and a plurality of radiating fins 7a are formed entirely of a material such as aluminum or zinc die cast. An upper heat sink 7 that is disposed so as to be in close contact and radiates heat of the CPU 5 generated during operation from above through the rubber sheet 6;
Upper heat sink 7 sandwiching CPU 5 and main substrate 4
And a plurality of heat dissipating fins 8 like the upper heat sink 7.
and a bottom heat sink 8 which is entirely formed by aluminum die casting or the like. Further, since the CPU 5 of this embodiment is mounted on the substrate 4 through, for example, a thermal via provided on the main substrate 4, the heat of the CPU 5 generated during operation is transferred to the bottom heat sink through the copper foil layer constituting the thermal via. 8 is transmitted.

Further, a cooling fan 9 is fixed to the main board 4 for cooling the CPU 5 via the upper heat sink 7 and the bottom heat sink 8. The cooling fan 9 is, for example, a bearing 1 caulked to an iron main board 4.
0, a rotor shaft 11 supported by a bearing 10, and an upper rotor 12 incorporated at each end of the rotor shaft 11.
And a bottom rotor 13, a stator coil 14 fixed to the surface of the main board 4, a magnet 15 provided at the bottom of the upper rotor 12 at a position facing the stator coil 14, Plural pieces are incorporated in the peripheral portion, and by the rotation of the upper rotor 12 and the bottom rotor 13, the air flow is generated in the direction along the substrate surface of the main substrate 4, so that the air flows through the upper heat sink 7 and the bottom heat sink 8. The front and rear wings 16 and 17 for cooling the CPU 5 and the cooling fan 9
And a drive IC 18 for driving and controlling the main body.

Therefore, heat generated from above the CPU 5 when the personal computer 1 is used is radiated to the upper heat sink 7 via the rubber sheet 6. On the other hand, C
Heat generated from below the PU 5 is radiated to the bottom heat sink 8 via, for example, a thermal via formed on the main substrate 4. Then, the upper heat sink 7 whose temperature has risen by removing the heat of the CPU 5 is removed by the main board 4 created by the surface blade 16 of the rotating cooling fan 9.
The lower heat sink 8 is cooled by air flowing in the direction along the back surface of the main substrate 4 created by the back surface wing portion 17.

As described above, in the personal computer 1 of the present embodiment, the cooling fan 9 is fixed to the main board 4 on which the CPU 5 is mounted. Therefore, since the stator necessary for rotating the cooling fan 9, that is, the bearing 10, the stator coil 14, and the like are directly mounted on the main board 4, the space in the thickness direction for disposing the cooling fan 9 is reduced. And the housing can be made thin.

The personal computer 1 of this embodiment is provided with a rotor having wings on the back and front surfaces of the main board 4, respectively.
The bottom rotor 13 is supported by one bearing caulked to the main board 4 via one rotor shaft 11. Furthermore, the personal computer 1 is substantially C
Heat sinks 7 and 8 are provided at positions facing each other across the PU 5. Therefore, C through each heat sink
Since heat can be removed from both sides of PU5, CPU
5 can exhibit an excellent cooling effect.

Further, according to the personal computer 1, although rotors having wings are provided on both surfaces of the main board 4, these stator parts are fixed to the main board 4 and furthermore are caulked to the main board 4. Since the rotor portion is supported by the single bearing, not only an excellent cooling effect for the CPU 5 can be obtained as described above, but also the personal computer 1 can be configured to be thin overall.

In this embodiment, the rotor having a plurality of blades and the heat sink are provided on both sides of the main board 4. However, when a CPU having a relatively small heat generation is mounted on the main board 4, A cooling mechanism is constituted by removing one set of a rotor and a heat sink having wings on the front side of the main board 4 or a rotor and a heat sink having wings on the back side of the main board 4 to form a cooling mechanism. May be further thinned.

[0025]

As described above, in the electronic device according to the first aspect, such as a personal computer, a cooling fan is fixed to a wiring board on which an integrated circuit component such as an MPU is mounted. Therefore, it becomes possible to mount electric components such as a rotor and a stator for rotating the fan on the wiring board, etc., so that a space in the thickness direction for disposing the cooling mechanism including the fan can be reduced. Becomes
An electronic device such as a personal computer can have a thin structure as a whole.

In the electronic device according to the present invention, a pair of fans are provided on both sides of the wiring board, and the pair of fans are supported by one bearing provided on the wiring board. . Further, in this electronic apparatus, heat sinks are provided at positions substantially opposed to each other with the integrated circuit component interposed therebetween. Therefore, according to the electronic device of the second or third aspect, since heat can be removed from both sides of the integrated circuit component through each heat sink, an excellent cooling effect can be exhibited for the integrated circuit component. Can be.

According to the electronic device of the present invention, although the fans are provided on both sides of the wiring board, these fans are fixed to the wiring board.
In addition, since it is supported by one bearing provided on the wiring board, not only an excellent cooling effect for the integrated circuit component can be obtained as described above, but also the electronic device can be made thin overall. be able to.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing a personal computer according to an embodiment of the present invention;

FIG. 2 is an exemplary perspective view when the personal computer of FIG. 1 is transformed into a portable state;

FIG. 3 is an exemplary sectional view showing the internal structure of the personal computer shown in FIG. 1;

FIG. 4 is a diagram illustrating a C provided in the personal computer of FIG.
Sectional drawing which shows the cooling mechanism of PU.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Personal computer 4 ... Main board 5 ... CPU (Central processing unit) 5 6 ... Silicone rubber sheet 7 ... Top heat sink 7a, 8a ... Heat radiation fin 8 ... Bottom heat sink 9 ... Cooling Fan 10 Bearing 11 Rotor shaft 12 Top rotor 13 Bottom rotor 16 Front wing 17 Back wing

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Katsuhiko Yamamoto 2570-1 Gosuda, Kamo-shi, Niigata F-term in Toshiba Home Techno Co., Ltd. 5E322 AA01 AB11 BB03 FA05

Claims (3)

[Claims] 1. An electronic apparatus, comprising: a wiring board on which an integrated circuit component is mounted; and a fan fixed to the wiring board and cooling the integrated circuit component. 2. A wiring board on which an integrated circuit component is mounted, and a first board provided at a position facing the wiring board with the integrated circuit component interposed therebetween and in contact with the integrated circuit component directly or via a conductor. A second heat sink provided at a position facing the first heat sink with the integrated circuit component and the wiring substrate interposed therebetween and in contact with the wiring substrate directly or via a conductor; And a pair of fans mounted on both sides of the substrate so as to sandwich the substrate and cooling the first and second heat sinks, respectively. 3. The electronic device according to claim 2, wherein a rotation axis for rotating the pair of fans is common,
An electronic device, wherein a bearing for supporting the rotating shaft is provided on the wiring board.