JP2000339436A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a card member and a semiconductor device which are reliable with respect to prevention of forgery and alteration by generating a desired signal value through the use of capacitance between a semiconductor chip and a conductor layer and separately constituted inductance. SOLUTION: A reference voltage generator 14, an arithmetic amplifier 16 and an A/D converter 18 are mounted in a semiconductor chip 13 in a card member 19. A token device 19 constitutes a so-called integration circuit and inductance 11 by printing is constituted by combining a resistor 12, capacitance 20 between a chip and a conductor and the amplifier 16. In this integration circuit, when integration is started by a reference voltage 14 and a switch 15, analog/digital conversion is executed a fixed time later and a digital value appears at a digital terminal 17. The surface of the chip is covered with a metallic layer and capacitance between the metallic layer and the chip is essential in the integration circuit. For example, at the time of effectively using a digital output value as a key code, it can be used as a key code which cannot be reproduced by decomposing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card member represented by an IC card. Furthermore, the present application relates to forgery prevention of a card member having high security.

[0002]

2. Description of the Related Art Regarding forgery and falsification technology of a conventional IC card or token device, a document "Proceedin" is known.
gs of the 2nd Workshop On
Electronic Commercial, Oakla
nd California, November 18-
20, 1996 "and" Tamper Resistan "
ce-aCautionary Note ".

In a chip of an IC card, a key is called
The code is stored so that handling is limited. This code is stored in the memory area, but if read by a third party, a similar card is forged and altered. There is a risk that this code can be read by analyzing the IC chip electrically, physically and chemically. Further, the following difficulties have been observed in a method of realizing high security by using a storage element (memory). That is, for example, when a battery is always provided and some electrical, physical, or chemical operation is attacked and applied to the IC chip, the memory is lost due to a function of the battery and a power down.

As a conventional technique for forming a code for preventing forgery, there is a technique disclosed in Japanese Patent Application Laid-Open No. 59-10937. The purpose of this is to increase the security against counterfeiting by storing the measured values of the various electrical properties based on the variations of the transmitting / receiving antenna, the semiconductor integrated circuit and the rectifier circuit in the form of a code number in accordance with an algorithm that should be kept secret. A receiving antenna is provided on a dielectric (aluminum oxide, polytetrafluoroethylene, etc.) suitable for high frequency above the backside metallization layer, a microwave transmitting antenna is provided at an output portion of the semiconductor circuit, and two A diode is connected to the metal surface and the measurements of the electrical properties specific to this card are tied together according to an algorithm to be kept secret to form a code number, which is then integrated into the integrated circuit. There is a technology for storing data permanently.

[0005]

As described above, a typical method for securing high security with a card member, for example, an IC card, requires a battery as described above. Therefore, this method causes obstacles such as an increase in the cost of the card member, a long life, reliability, and a reduction in thickness, and hinders the spread of the card member.

As a measure for preventing forgery or alteration, there is known a method of coding various electrical properties. However, this measure is considered inadequate against counterfeiting and alteration. In other words, it is assumed that the code object based on various electrical properties is the variation of the electric circuit, the range of the variation is narrow, it is easy to forge, the measured value is easily obtained by external search, the decoding by decomposing the integrated circuit Lack of consideration is one of the factors of imperfection of the technology for preventing forgery or falsification.

An object of the present invention is to provide a card member and a semiconductor device which are highly reliable in preventing forgery and alteration.

A further object of the present invention is to provide a highly reliable card member and a semiconductor device by a simple method for preventing forgery and alteration.

[0009]

The main aspects of the present invention will be described, and then a more detailed technical description will be given. The main modes of the present invention are as follows.

According to a first aspect of the present invention, there is provided at least a semiconductor chip and a conductor layer provided to face the semiconductor chip, wherein a capacitance between the semiconductor chip and the conductor layer and A semiconductor device capable of generating a desired signal value by using an inductance formed separately from a semiconductor chip.

When a card member represented by an IC card is configured according to the first embodiment of the present invention, the following configuration is a typical embodiment. That is, this embodiment includes a substrate having a wiring, a semiconductor chip mounted on the substrate having the wiring, a conductor layer provided to face the semiconductor chip, a substrate having the wiring, and the conductor layer. And at least an adhesive layer between the semiconductor chip and the semiconductor chip and the conductor layer, and the semiconductor chip can generate a desired signal value by using an inductance formed separately from the semiconductor chip. It is a featured card member. It goes without saying that various forms of the invention according to the present invention described below can also be put to practical use as card members or IC cards. Further, the semiconductor device, the card member itself, and the IC card itself can be used as bills.

That is, a first means of the present invention is a semiconductor device having a conductor layer as a member for reinforcing a card member represented by an IC chip, wherein the semiconductor chip in the card member and the reinforcing conductor are provided. An IC card is characterized in that a random numerical value is generated for each card member using a capacitance value generated between layers. In the present embodiment, for example, a key code or the like is created using this random numerical value. Since the present invention sets the storage information of the card based on the capacitance value generated between the semiconductor chip and the reinforcing conductive layer, it is impossible to externally read the information by a random numerical value, Depending on the destruction of the card, the information constitutes a form that can be destroyed.

According to a second aspect of the present invention, there is provided a substrate having a wiring, a semiconductor chip mounted on the substrate having the wiring, a first conductor layer provided to face the semiconductor chip, and An adhesive layer between the substrate having the wiring and the first conductive layer, and at least a second conductive layer on a surface of the substrate having the wiring opposite to a surface on which the semiconductor chip is mounted; A semiconductor device capable of generating a desired signal value by using a capacitance between the semiconductor chip and the conductor layer and an inductance formed separately from the semiconductor chip.

In the first embodiment, the conductor layer for reinforcing the semiconductor chip is provided on one side of the semiconductor chip. In the second embodiment, the conductor layer for reinforcement is provided on both sides of the semiconductor chip. This is an example in which a layer is provided. In this example, in addition to the effect of the first embodiment, the upper and lower two reinforcing conductor layers are more effectively protected against stress from the outside of the card.

According to a third aspect of the present invention, there is provided a substrate having a wiring, a semiconductor chip mounted on the substrate having the wiring, and a conductor layer on a surface of the substrate having the wiring facing the semiconductor chip. A semiconductor device having at least an adhesive layer between the substrate having the wiring and the semiconductor chip, and using a capacitance between the semiconductor chip and the conductor layer and an inductance formed separately from the semiconductor chip; A semiconductor device capable of generating a signal value.

That is, this embodiment of the present invention utilizes a capacitance value generated between the IC chip and the substrate pattern in a structure having a conductor layer serving as a so-called substrate pattern connected to the IC chip. And generating a random numerical value.

The third example is an example in which a substrate pattern is formed of a conductor layer on a substrate on which a semiconductor chip is mounted. This substrate pattern is configured to be in contact with the semiconductor chip. Therefore, the object of the present invention can be achieved by forming a conductor layer on a substrate as compared with the above-described various embodiments, which is a simple method.

According to a fourth aspect of the present invention, a desired signal value is generated at least using a capacitance between the semiconductor chip and the conductive layer, an operational amplifier, and an inductance formed separately from the semiconductor chip. The card member according to the first, second, or third aspect, wherein the card member includes an integrating circuit having the same and an analog-to-digital converter.

In this embodiment, the integrating circuit operates based on the capacitance value generated between the semiconductor chip and the reinforcing conductive layer. Therefore, the stored information stored in the card makes it impossible to read from outside, and the information is destroyed when the card is destroyed.

According to a fifth aspect of the present invention, there is provided a structure having a conductor layer for covering an IC chip, wherein a capacitance value generated between the IC chip and the conductor layer is:
A semiconductor device that combines an inductance formed outside the IC chip to generate a random numerical value for each card member, and the IC chip performs energy reception and data communication with a separately provided coil; It is to be.

According to a sixth aspect of the present invention, there is provided a structure having a conductor layer covering an IC chip, wherein a capacitance value generated between the IC chip and the conductor layer is determined by:
A random numerical value is generated by coupling an inductance formed outside the IC chip, and the random numerical value is generated by using an analog-to-digital converter and an integrating circuit combining the capacitance and the inductance. The semiconductor device is a feature.

According to a seventh mode for solving the above-mentioned problems, in a structure having a conductor layer covering an IC chip, a capacitance value generated between the IC chip and the conductor layer,
The inductance formed outside the IC chip is combined to generate a random numerical value, and there is a portion where the inductance is formed and the IC chip overlap in a plane, and the conductive layer or the inductance is formed. Is partially or completely removed, the corresponding capacitance value or inductance is lost, so that all or some of the components that operate in conjunction with other capacitors formed on the IC chip do not operate. That is, a semiconductor device.

According to an eighth aspect of the present invention, there is provided a structure having a conductor layer covering an IC chip, wherein a capacitance value generated between the IC chip and the conductor is determined by:
A random numerical value is generated by coupling the inductance formed outside the IC chip, and a part or the whole of the space between the conductive layer and the chip is filled with an adhesive resin containing conductive particles and dielectric particles. A semiconductor device characterized by the following.

According to a ninth aspect of the present invention, there is provided a structure having a conductor for covering an IC chip, wherein a capacitance value generated between the IC chip and the conductor, and a capacitance outside the IC chip. Wherein the semiconductor device generates a random numerical value by coupling the inductance formed in the contact type or non-contact type IC.
A semiconductor device characterized by being a card or a bill.

A tenth mode for solving the above-mentioned problem is an IC
In a structure having a conductor covering a chip, a random value is generated by coupling a capacitance value generated between the IC chip and the conductor and an inductance formed outside the IC chip. A semiconductor device is characterized in that there is a material which reinforces the IC chip on both sides or one side in the semiconductor device, and the thickness of the material for reinforcement is larger than that of the IC chip.

[0026]

FIG. 1 shows a circuit configuration of a semiconductor chip portion according to an embodiment of the present invention. Sign 1
Reference numeral 3 denotes a semiconductor chip in the card member 19, in which a reference voltage generator 14, an operational amplifier 16, an A / D converter 18 and the like are mounted. As the semiconductor chip, an ordinary semiconductor chip in which various necessary elements such as an amplifier and a resistor are formed on a silicon substrate as described above may be used.
Further, as a substrate arranged to face the semiconductor chip, for example, a PE having a thickness of about 0.1 mm to 1.0 mm is used.
Various organic plastic films such as Z, PVC and polycarbonate can be used.

Here, reference numeral 19 specifically shows an example of a token device. This token device (19)
Constitutes a so-called integrating circuit. That is, this integration circuit is configured by combining the printed inductance 11 with the resistor 12, the capacitor 20 between the chip and the conductor, and the operational amplifier 16.

This integrating circuit comprises a reference voltage 14 and a switch 1
When the integration is started by 5, analog-to-digital conversion is performed after a certain time, and a digital value appears at the digital output terminal 17. These circuits are formed in a chip 13 by semiconductor technology. The surface of the chip is covered with a metal layer.

Such a structure has the following advantages in order to secure the security of the card member. In the present invention, it is particularly important that a metal layer is formed on the surface of the semiconductor chip, and that an integration circuit is formed by using a capacitance between the metal layer and the chip. By utilizing this fact, for example, the key code cannot be reproduced.

Since the capacitance between the metal layer and the chip is essential in the integration circuit, if the metal cover is removed, the capacitance disappears and the integration circuit does not operate. In addition, there is a unidirectional circuit between the metal and the chip, for example, a short circuit. Even if it is known, it cannot be reproduced. If the digital output value is effectively used as a key code, it can be used as a non-reproducible key code by decomposition. Reinforcing metal is originally used effectively for preventing chip breakage of an IC card, and therefore, a simple and highly secure IC card can be realized.

FIG. 2 shows a plan view of another embodiment of the present invention.

In the IC card 21, a thin chip 2
2, and the chip is connected to the antenna coil 23 by a connection line. FIG. 2 schematically shows only the arrangement of the main components. FIG. 2 shows the reinforcing metal 24 provided below the chip 22. The chip 22 is connected to an antenna or a contact terminal 23 by a connection line 25. A so-called contact type or non-contact type IC card or card member is obtained depending on whether the antenna or the contact terminal 23 is selected.

There are cases where the mechanical strength of an IC card determines its application range. In other words, in a financial card handling a large amount of money, an IC card for an ordinary use is more IC
There is a strong demand for card reliability. For this reason, the present inventor has found that the mechanical strength is increased by reinforcing or backing a thin chip with a thick metal. Therefore, high security is required in the application range of such a strong IC card.

Although the range of security varies, the electrically writable memory (EEP
ROM) can read out the contents of the memory by using various analyzers. Since this memory contains a key code necessary for encryption, this means that the key code is read. In general, it is believed that the reliability of the system is ensured by the cryptographic technology. Therefore, once the cryptographic key code is broken and abused, it is expected that the scale of the damage will be catastrophic, and the range of influence is extremely large. The present invention proposes a method for avoiding such a situation.

FIG. 3 shows an arrangement of inductances by printing according to the present invention. FIG. 3 shows that the inductance 72 formed by printing is printed on the IC chip 71. FIG. 3 shows only this relationship in the card member. In addition, the inductance formed by printing is simply referred to as printing inductance hereinafter.

FIG. 4 is a sectional view showing another embodiment of the present invention. This example is an example of a form in which the upper and lower sides of a semiconductor chip are sandwiched between two reinforcing members.

FIG. 5 shows a sectional view of another embodiment of the present invention. In this example, a semiconductor chip is reinforced by one reinforcing material. In the following, a detailed description will be given with reference to the example of FIG. 4. Therefore, the detailed description is omitted.

A semiconductor chip 32 is mounted on a substrate 38 via an electrode 31. Generally, the chip 32 is adhered to a substrate 38 by an adhesive 34. The members thus prepared are reinforced by a reinforcing member 42 and another reinforcing member 43. Specific examples of the reinforcing material include tungsten and stainless steel. Reference numeral 33 denotes a printing inductance according to the present invention, which is formed on the reinforcing member 42 by printing. Conventional techniques are sufficient for the printing inductance itself. The laminate thus prepared is packaged with a resin, for example, an organic resin 45. As a typical example of the organic resin, PET (polyethylene laleftate) can be given.

It is preferable that the semiconductor chip 32 is disposed on a neutral surface 44 between the upper and lower surfaces of the card member. This configuration can be said to be a low-stress arrangement that is more stable against stress from the outside of the card.
The position of the neutral plane is preferably within a range of about ± 5%. The position of the semiconductor chip in the card member is not limited to this example, but can be said for the general various forms of the card member according to the present invention.

The electrode 31 on the substrate 38 is connected to the electrode 35 on the thin IC chip 32 by conductive particles 37. The conductive particles are dispersed in the adhesive 34. The printed inductance 33 is connected on the thin chip. In addition, below the interface 39, it is in contact with the substrate 38 and is connected to another reinforcing member 43. There is also a reinforcement 42 on the upper side. The reinforcing metal can be connected with various adhesive layers, for example, an adhesive in which ferroelectric particles 41 are dispersed, an adhesive or a sheet whose thickness can be freely set, an adhesive having a different dielectric constant, and the like. Can be used.

In the present invention, as described above, it is important to form a metal layer as a reinforcing material formed on the surface of the semiconductor chip and use the capacitance between the metal layer and the chip. The capacitance value of each card member can be set to significantly various values by selecting the distance between the metal layer and the chip, the dielectric constant of the adhesive layer inserted therebetween, and the like. The dielectric constant of the adhesive layer depends on the material of the base material, the thickness of the adhesive layer, the additive to be added to the base material, the state of the surface of the additive, for example, as described above, the ferroelectric particles 4
There are various factors for generating a random capacitance value by dispersing 1s. Therefore, this capacitance value can be set to an arbitrary random value.

Thus, the capacitance value between the semiconductor chip and the metal layer can be set to various variations.
This makes it difficult to grasp the capacitance between the chip and the metal in advance. Therefore, it is impossible to non-destructively grasp information contained in the card member. Furthermore, if the reinforcing metal layer is removed for analysis on the semiconductor chip, the capacity will be lost. Therefore, if the card member is destroyed, it becomes impossible to analyze information contained in the card member, for example, a key code or the like.

Incidentally, as a practical form of the IC card, the thickness and the like of each member are as follows.

The thickness of the semiconductor chip 32 is often 110 μm or less. Furthermore, its thickness is usually more than 50μ
m to 110 μm is used. The thickness of the electrode layer 31 is typically 20 μm to 30 μm, and the thickness of the substrate 39 is typically 10 μm to
100 μm, the thickness of the reinforcing metal layers 33 and 36 is typically 10 μm to 250 μm, respectively, and the thickness of the adhesive layer 34 is typically 5
μm to 50 μm. In other forms of the present invention, the thickness of each member is adopted.

From a practical viewpoint, the thickness of the card or the semiconductor chip is more frequently used than the following range. That is, a range where the IC chip is not broken or the stress thereof does not substantially affect the operation of the semiconductor chip is naturally selected. For example, when the card is 0.76 mm, the LSI thickness is 110
It is desirable that the diameter be less than micron. The card thickness is
In the case of 0.5 mm, it is more desirable to be 19 microns or less. When the card is 0.25 mm, the thickness of the LSI is more preferably 4 μm or less. Of course, the reliability is greatly improved when the LSI is made as thin as possible.

FIG. 6 shows a plan view of another embodiment of the present invention. In this figure, the packaging resin is omitted. In this example, a conductor pattern 65 is formed on a substrate facing the chip 62, and the capacitance between the chip 62 and the conductor pattern 65 is used as the capacitance according to the present invention. As in the previous examples, it is possible to prevent external reading of information. FIG. 7 shows FIG.
FIG. 3 is a diagram showing a cross section at AA of FIG. 62 is a substrate, 64 is an electrode on the substrate, 65 is a metal pattern according to the present example, 62 is a semiconductor chip, 68 is an electrode of the semiconductor chip, and 67 is a conductive particle.

The ground terminal 61 is on the surface of the chip 62 and is connected to the pattern 65 on the substrate. Also,
Similarly, there is a coil terminal 63 on the chip, which is connected to a coil line 64. With such a configuration, the pattern on the substrate can be provided with a ground pattern over almost the entire chip. Therefore, it is possible to set a capacitance between the chip and this pattern. Although this pattern has been treated as ground, it can be a free potential or impedance terminal depending on the design. Since the pattern and the chip can face each other in parallel via an adhesive or the like, if the ferroelectric particles are dispersed between them, the capacitance value can be dispersed. In this example, an example of a non-contact IC card is shown, but a contact-type IC card can be realized by a similar example. Also, the pattern 6 on the substrate
5 is combined with the pattern on the chip,
It is possible to vary the capacity. A random form can also be formed by laser technology.

FIG. 8 is a conceptual diagram showing an example of an embodiment of a system according to the present invention. An example is shown in which an IC card 52 includes a chip 51 and exchanges data with a reader / writer 53. The reader / writer includes a control processor 54 and a magnetic disk 55 serving as a database.

First, the reader / writer 53 sends the IC card 5
2 is queried for an ID.

First, from the reader / writer 53 to the IC card 5
2 for ID (IDENTIFICATION),
For example, an inquiry about a name code or an identification code for specifying a person in charge of management of the card is performed. FIG. 5 shows this state as (1). This name code or recognition code is stored in a predetermined area in the IC chip. The IC card returns the name code to the reader / writer. The reader / writer retrieves the name code in the database 53 and acquires the key code on the database.

The reader / writer sends a random number to the IC card.
This random number is generated in a circuit by, for example, the MPU in the reader / writer. A random number can be supplied from the server side via a LAN or the like.

When the IC card receives the random number,
An instruction is received from the reader / writer by a command, and a random number is created by encrypting the random number with a key code generated according to a key code generation unit.

On the other hand, the reader / writer encrypts the same random number sent to the IC card using the key code obtained from the database as in the case of the IC card. The result of the encrypted random number thus obtained is compared with the encrypted random number from the preceding IC card, and if a match is obtained, mutual recognition between the IC card and the reader / writer is completed, and the IC card is read. Legitimacy is recognized.

In this way, in this system, when this key code is transmitted to the reader / writer, the reader / writer searches the ID in the magnetic disk and recognizes that the ID is based on the correctly registered key code.

The key code (ID code) of the generated IC card is stored in the database together with the name code or the recognition code.

The generated key code is used as electronic money as I
Authentication, counterfeiting check, and I when C card is used
It can be used for mutual authentication between C card and reader / writer.

The above system can be applied to many fields such as payment at a general store, purchase of a ticket, ticketing with a commuter pass, checking of a license, telephone by telephone card, and the like.

This ID in the present invention utilizes the capacitance between the semiconductor chip and the metal implemented in the present invention of the IC card, converts the resistance value in the chip and the operational amplifier using an integrating circuit, and then converts the numerical value. It is characterized in that a key code is used.

The IC card returns a name code to the reader / writer. That is, when this key code is transmitted to the reader / writer, the reader / writer searches the ID in the magnetic disk and recognizes that the ID is based on the correctly registered key code.

When the inquiry from the reader / writer 53 is likely to be eavesdropped on an intermediate route, it is generally performed using an encryption technique.
At the same time, for example, the name, address, telephone number, etc., which are written to the EEPROM in the chip of the IC card, are simultaneously transferred to the reader / writer. If combined with the key code, the same kind of combination secures the number of bits of the key code. if,
Will not appear. Thus, security can be ensured. Practically, the number of bits is more than 64 bits.

For example, a method of converting to various codes using the capacitance according to the present invention using the circuit configuration of FIG. 1 will be described. A voltage is generated by a power supply 14, amplified by an integration circuit including an amplifier 16, an inductance 11, and a capacitor 20, converted to digital by an A / D (analog-digital) converter 18, and generated at an output terminal 17. In this case, the output value of the integration circuit is a function of capacitance, inductance, and resistance (V (t) = f (C, L, R))
It is. Accordingly, as is apparent from the above description, if the capacitance value is set to a random value individually for each semiconductor device, the output value can also be set to a random value individually for each semiconductor device.

The electric signal from the output terminal 17 is input to a random number generation circuit to generate a random number.

This random number is used as a code. For example, suppose you code a name. Assuming that the A / D converter has 9 bits, the binary number is 111111111 (1023).

The A / D converted code is provided to a reader / writer (RWU = Reader-Writer Uni).
According to t), the data is read out of the card and subjected to encryption processing, and becomes, for example, 101010101. Thereafter, the encrypted code 101010101 meets the requirements of the system. For example, this digital signal is transmitted to the reader / writer.

However, in the present invention, when a desired signal is amplified by an integrating circuit and converted into a digital signal by an A / D (analog-digital) converter 18, the desired signal is placed between the semiconductor chip and a predetermined conductor layer. Since an integrating circuit using the generated capacitance and an inductance set outside the semiconductor chip is used, integration based on the capacitance value and the inductance unique to the IC card is performed.
In this way, the signal of the original name is subjected to the encryption processing unique to the IC card by the encryption processing. Therefore, the signal of the original name cannot be decrypted from the outside by the digital signal after the encryption processing.

Various communication methods between the IC card and the reader / writer are conceivable, and there are methods such as a contact type and a non-contact type. Therefore, even if there is a difference between these methods, the method of using the capacitance generated between the chip and the metal of the present invention can be commonly used. It is sufficient to use a conventional method such as a contact type or a non-contact type.

Here, the application of the card member or the semiconductor device according to the present invention will be described.

The IC card is put to practical use for various purposes with the support of various systems. However, if the key code or the like mounted on the IC card is registered in the system database, it can be operated safely and used for the authentication system. You can do it. The registration code can be applied as an ID number, name, password, personal attribute data, service history data, secret number, account information, credit level, and the like.

Since the key codes according to the present invention are realized with extremely large variations, the probability that they will be the same code is extremely small. Therefore, it is extremely difficult to create the same card.

Also, the key code of the IC card of the present invention can be used for personal authentication by linking it with a personal identification code or a biological feature code. This is a more effective use of the present invention.

For example, as a code, a biological feature code (a palm print code in which a palm is patterned, a fingerprint code in which a fingerprint is converted into a data, an odor code based on an odor generated from the human body, a face code in which the shape of a face is patterned, a voice Information, a digitized or voice code based on an analysis value, a vein code in which vein pulses are patterned, a pupil code in which the color and shape of the eyes are patterned, a DNA code in which DNA is patterned), and the like. . That is, by using the personal code of the person considered in the biometrics, personal authentication can be realized more safely.

The above system can be applied to many fields such as transportation, transportation, and finance. These examples can be applied to many fields such as payment at a general store, purchase of a ticket, ticketing with a commuter pass, checking of a license, telephone by telephone card, and the like. As a result, a store can purchase a product simply by holding the card over it.
Also, when you go to a movie theater, you can enter without having to buy a ticket every time. Ryokan reservations and payments can be made. You can copy the necessary parts of the magazine on the Internet and pay the fee. A desired broadcast can be watched on a pay TV.
You can pay for one-on-one English conversation. It can be used in place of a credit card, and can also be used for small payments. It can also be used to access computer systems and locations.

An IC card or a large bill handling a large amount of money needs an effective form for preventing forgery and falsification. ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to economically provide the method which can protect effectively against forgery and alteration of an IC card. The capacitance value is A / D converted by changing the dielectric material, thickness shape, etc. between the electrode of the semiconductor and the electrode of the substrate facing each other, and when the key code is used, the capacitance value becomes a random value. Because it is used with a key code, it cannot be forged or altered. Further, if the IC card is disassembled or measured electrically, it cannot be reproduced, and forgery and falsification cannot be performed.

As described above in detail, according to the present invention, it is possible to provide a highly reliable technology for preventing forgery and alteration of a card member. In addition, since a capacity is used to obtain a desired signal for securing high security, it can be manufactured at low cost, and does not require complicated devices and components, and is extremely economical. In addition, the technology has a long service life in view of the technology.
As described above, IC cards are extremely useful as advanced anti-counterfeiting techniques when IC cards are used as devices having current money functions such as electronic money.

[0075]

According to the present invention, a card member having higher security can be provided.

[Brief description of the drawings]

FIG. 1 is a circuit configuration diagram showing an example of the present invention.

FIG. 2 is a plan view showing an example of an arrangement of main constituent members of the present invention.

FIG. 3 is a plan view showing an example of a printed antenna according to the present invention.

FIG. 4 is a sectional view showing an embodiment of the present invention.

FIG. 5 is a sectional view showing an embodiment of the present invention.

FIG. 6 is a plan view showing another embodiment of the present invention.

FIG. 7 is a sectional view of the embodiment of FIG. 6;

FIG. 8 is a system schematic diagram showing an example of application of the card member of the present invention.

[Explanation of symbols]

11: inductance by printing, 12: resistance, 13:
Chip, 14: Reference voltage, 15: Switch, 16: Operational amplifier, 17: Digital output terminal, 18: A / D converter, 19: Token device, 20: Capacitance between chip and conductor, 21: IC card 2, chip, 23 antenna coil, 71 closet, 31 electrode on substrate, 32 ...
IC chip, 33: printing inductance, 34: adhesive, 35: electrode on chip, 37: conductive particles, 38: substrate, 39: interface, 41: dielectric particles, 42: reinforcing material, 43
... other reinforcing materials, 51 ... chips, 52 ... IC cards, 53
... Reader / writer, 54 ... Control processor, 55 ...
Magnetic disk, 61: ground terminal, 62: chip, 6
3: coil terminal, 64: coil line, 65: pattern on the substrate.

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2C005 MA01 MA10 MB02 MB05 MB07 MB08 MB10 NA09 PA18 PA25 PA27 SA02 SA15 TA21 TA22 5B035 AA14 BA05 BB09 BC01 CA01 CA23 CA38

Claims (10)

[Claims] 1. A semiconductor device comprising: a semiconductor chip; and a conductor layer provided to face the semiconductor chip, wherein a capacitance between the semiconductor chip and the conductor layer and the semiconductor chip are separated. A semiconductor device capable of generating a desired signal value using a configured inductance. 2. A substrate having a wiring, a semiconductor chip mounted on the substrate having the wiring, a first conductor layer provided to face the semiconductor chip, a substrate having the wiring, An adhesive layer between the semiconductor chip and the first conductive layer, and a second conductive layer on a surface of the substrate having the wiring opposite to a surface on which the semiconductor chip is mounted; A semiconductor device capable of generating a desired signal value by using a capacitance between a body layer and an inductance formed separately from the semiconductor chip. 3. A substrate having a wiring, a semiconductor chip mounted on the substrate having the wiring, a conductor layer on a surface of the substrate having the wiring facing the semiconductor chip, a substrate having the wiring, At least an adhesive layer between semiconductor chips, capable of generating a desired signal value by using a capacitance between the semiconductor chip and the conductor layer and an inductance formed separately from the semiconductor chip A semiconductor device characterized by the above-mentioned. 4. An analog-to-digital converter for generating a desired signal value, comprising: an integration circuit having at least a capacitance between the semiconductor chip and the conductive layer, an inductance formed separately from the semiconductor chip, and an operational amplifier. 4. The semiconductor device according to claim 1, wherein the semiconductor device comprises: 5. A circuit having at least a conductor layer covering a semiconductor chip, wherein a capacitance value generated between the semiconductor chip and the conductor layer is coupled to an inductance formed outside the semiconductor chip. , A random desired signal value is generated, and the semiconductor chip receives energy by a coil provided separately from the desired signal value and performs data communication of a predetermined signal. 6. An integrated circuit having at least a conductor layer covering a semiconductor chip, wherein an integral is formed by coupling a capacitance value generated between the semiconductor chip and the conductor layer and an inductance formed outside the semiconductor chip. A semiconductor device that generates a random desired signal value using a circuit and an analog-to-digital converter, and the semiconductor chip receives energy by a coil provided separately from the semiconductor chip and performs data communication of the desired signal. apparatus. 7. A semiconductor device having at least a conductor layer covering a semiconductor chip, wherein a capacitance generated between the semiconductor chip and the conductor layer is coupled to an inductance formed outside the semiconductor chip. A circuit that generates a desired signal value using a circuit, the portion that forms the inductance, and the semiconductor chip have a portion that planarly overlaps in a direction that intersects a maximum plane of the semiconductor device; Alternatively, when part or all of the inductance is removed, the capacitance value or the inductance is lost, and all or part of the operation that operates in conjunction with another capacitance formed on the semiconductor chip does not operate. Semiconductor device. 8. A semiconductor device having at least a conductor layer covering a semiconductor chip, wherein a capacitance generated between the semiconductor chip and the conductor layer is coupled to an inductance formed outside the semiconductor chip. A semiconductor device, wherein a desired signal value is generated using a circuit, and a part or an entire surface between the conductor layer and the semiconductor chip is filled with an adhesive resin containing conductive particles and dielectric particles. 9. A semiconductor device having at least a conductor layer covering a semiconductor chip, wherein a capacitance generated between the semiconductor chip and the conductor layer is coupled to an inductance formed outside the semiconductor chip. A semiconductor device which generates a desired signal value using a circuit and is a contact-type card member or a non-contact-type card member. 10. A semiconductor device having at least a conductor layer covering a semiconductor chip, wherein a capacitance generated between the semiconductor chip and the conductor layer is coupled to an inductance formed outside the semiconductor chip. A circuit is used to generate a desired signal value, and there is a material for reinforcing the semiconductor chip on both sides or one side thereof, and the thickness of the reinforcing material is larger than the thickness of the semiconductor chip. Semiconductor device.