JP2000336314A - Composition for forming film and material for forming insulating film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a composition for forming a film having excellent dielectric constant and water absorption ratio as interlayer dielectrics, capable of forming a opacified coating film having a proper uniform thickness. SOLUTION: This composition for a film comprises (A) a hydrolyzate and a condensate or either one of the hydrolyzate and condensate of at least one compound selected from (A-1) a compound of general formula (1) R1aSi(OR2)4-a (R1 is a hydrogen atom, a fluorine atom, a monofunctional organic group; R2 is a monofunctional organic group; (a) is an integer of 0-2) and (A-2) a compound of general formula (2) R3b(R4O)3-bSi-(R7)d-Si(OR5)3-cR6c (R3, R4, R5 and R6 are each the same or different and a monofunctional organic group; b and c are the same or different and a number of 0-2; R7 is an oxygen atom or (CH2)n; d is 0 or 1; n is an integert of 1-6) and (B) a fluorine-based surfactant.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for forming a film, and more particularly, to a method for forming a film having an appropriate uniform thickness as a material for an interlayer insulating film in a semiconductor device. The present invention relates to a film-forming composition having excellent resistance and moisture absorption properties.

[0002]

2. Description of the Related Art Conventionally, a silica (SiO ₂ ) film formed by a vacuum process such as a CVD method is often used as an interlayer insulating film in a semiconductor device or the like. In recent years, for the purpose of forming a more uniform interlayer insulating film, a coating-type insulating film mainly composed of a hydrolysis product of tetraalkoxylan, which is called an SOG (Spin on Glass) film, may be used. It has become. Also, with the high integration of semiconductor elements and the like, an interlayer insulating film having a low dielectric constant and mainly containing polyorganosiloxane called organic SOG has been developed. However, with higher integration and multilayering of semiconductor devices and the like, more excellent electrical insulation between conductors is required, and therefore,
There has been a demand for an interlayer insulating film material having a lower dielectric constant, good CMP resistance, and excellent moisture absorption properties.

[0003] Japanese Patent Application Laid-Open No. 6-181201 discloses a coating composition for forming an insulating film having a lower dielectric constant as an interlayer insulating film material. The coating type composition has a low water absorption and is intended to provide an insulating film of a semiconductor device having excellent crack resistance.
Titanium, zirconium, niobium and tantalum; an organometallic compound containing at least one element selected from the group consisting of polycondensation of an organosilicon compound having at least one alkoxy group in the molecule; This is a coating composition for forming an insulating film, which is mainly composed of an oligomer.

[0004] WO96 / 00758 also discloses that
A silica-based coating-type insulating film that is used for forming an interlayer insulating film of a multilayer wiring board and that is made of an alkoxysilane, a metal alkoxide other than silane, and an organic solvent, and that can be applied in a thick film and has excellent oxygen plasma resistance. A forming material is disclosed.

Further, Japanese Patent Application Laid-Open No. Hei 3-20377 discloses a coating liquid for forming an oxide film, which is useful for flattening the surface of electronic parts and the like and for interlayer insulation. The coating solution for forming an oxide film provides a uniform coating solution without generation of a gel-like substance. Further, by using this coating solution, curing at a high temperature and treatment by oxygen plasma are performed. Even so, the purpose is to obtain a good oxide film without cracks. The composition is a coating solution for forming an oxide film obtained by hydrolyzing and polymerizing a predetermined silane compound and a predetermined chelate compound in the presence of an organic solvent.

However, when a metal chelate compound such as titanium or zirconium is combined with a silane compound as described above, the uniformity of the coating film is not excellent, and furthermore, it does not have good balance of CMP resistance, low moisture absorption and the like.

[0007]

The present invention relates to a film-forming composition for solving the above-mentioned problems, and more particularly, to an interlayer insulating film in a semiconductor device or the like, which has excellent coating uniformity and CMP resistance. It is another object of the present invention to provide a material for an interlayer insulating film which is excellent in balance of moisture absorption characteristics and the like.

The present invention relates to (A) (A-1) a compound represented by the following general formula (1) (hereinafter also referred to as “component (A-1) component”): R ¹ _a Si (OR ² ) _{4- a} (1) (R ¹ and R ² may be the same or different and each represents a monovalent organic group, and a represents an integer of 0 to 2.)
And (A-2) a compound represented by the following general formula (2) (hereinafter also referred to as “component (A-2) component”): R ³ _b (R ⁴ O) _3-b Si— (R ⁷ ) _d − Si (OR ⁵ ) _3-c R ⁶ _c (2) (R ³ , R ⁴ , R ⁵ and R ⁶ may be the same or different and each represents a monovalent organic group; b and c may be the same or different and each represents a number of 0 to 2, R ⁷ represents an oxygen atom or — (CH ₂ ) _n —, and d represents 0 or 1.
And n represents an integer of 1 to 6. A) a hydrolyzate and / or a condensate of at least one compound selected from the group consisting of (B) and a fluorine-containing surfactant (hereinafter also referred to as “component (B)”). It provides a forming composition.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION

In the present invention, the hydrolyzate refers to R ² O contained in the above-mentioned components (A-1) and (A-2).
-, R ⁴ O-, what is not necessary for all R ⁵ O-group is hydrolyzed, for example, only one is hydrolyzed,
Two or more of them may be hydrolyzed, or a mixture thereof. In the present invention, the condensate is a product in which the silanol groups of the hydrolyzate of the component (A-1) and the component (A-2) are condensed to form a Si—O—Si bond. It is not necessary that all of the silanol groups be condensed, and the concept includes a mixture of a small amount of silanol groups condensed and a mixture of those having different degrees of condensation.

Hereinafter, the components (A-1) and (A-2) used in the present invention will be described, and then the method for preparing the composition of the present invention will be described in detail.

Component (A) Component (A-1) In the general formula (1), examples of the monovalent organic group include an alkyl group, an aryl group, an allyl group, and a glycidyl group. Here, examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group and the like, preferably having 1 to 5 carbon atoms, and these alkyl groups may be chain-like or branched, Further, a hydrogen atom may be substituted with a fluorine atom or the like. General formula (1)
In the above, examples of the aryl group include a phenyl group, a naphthyl group, a methylphenyl group, an ethylphenyl group, a chlorophenyl group, a bromophenyl group, and a fluorophenyl group.

Specific examples of the compound represented by the general formula (1) include trimethoxysilane, triethoxysilane, tri-n-propoxysilane, tri-iso-propoxysilane, tri-n-butoxysilane, and tri-silane. sec-butoxysilane, tri-tert-butoxysilane, triphenoxysilane, fluorotrimethoxysilane, fluorotriethoxysilane, fluorotri-n-propoxysilane, fluorotri-iso-propoxysilane,
Fluorotri-n-butoxysilane, fluorotri-s
ec-butoxysilane, fluorotri-tert-butoxysilane, fluorotriphenoxysilane, tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-iso-propoxysilane,
Tetra-n-butoxysilane, tetra-sec-butoxysilane, tetra-tert-butoxysilane, tetraphenoxysilane, etc .; methyltrimethoxysilane, methyltriethoxysilane, methyltri-n-propoxysilane, methyltri-iso-propoxysilane, methyltrimethylsilane -N-butoxysilane, methyltri-sec-butoxysilane, methyltri-tert-butoxysilane,
Methyltriphenoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltri-n-propoxysilane, ethyltri-iso-propoxysilane, ethyltri-n-butoxysilane, ethyltri-s
ec-butoxysilane, ethyltri-tert-butoxysilane, ethyltriphenoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri-n-propoxysilane, vinyltri-iso-propoxysilane, vinyltri-n-butoxysilane, vinyltri- sec-butoxysilane, vinyl tri-tert
-Butoxysilane, vinyltriphenoxysilane, n-
Propyltrimethoxysilane, n-propyltriethoxysilane, n-propyltri-n-propoxysilane,
n-propyltri-iso-propoxysilane, n-propyltri-n-butoxysilane, n-propyltri-
sec-butoxysilane, n-propyltri-tert
-Butoxysilane, n-propyltriphenoxysilane, i-propyltrimethoxysilane, i-propyltriethoxysilane, i-propyltri-n-propoxysilane, i-propyltri-iso-propoxysilane, i-propyltri- n-butoxysilane, i-propyltri-sec-butoxysilane, i-propyltri-tert-butoxysilane, i-propyltriphenoxysilane, n-butyltrimethoxysilane, n-butyltriethoxysilane, n-butyltri- n-propoxysilane, n-butyltri-iso-propoxysilane, n-butyltri-n-butoxysilane, n-butyltri-sec-butoxysilane, n-butyltri-te
rt-butoxysilane, n-butyltriphenoxysilane, sec-butyltrimethoxysilane, sec-butyl-i-triethoxysilane, sec-butyl-tri-
n-propoxysilane, sec-butyl-tri-iso
-Propoxysilane, sec-butyl-tri-n-butoxysilane, sec-butyl-tri-sec-butoxysilane, sec-butyl-tri-tert-butoxysilane, sec-butyl-triphenoxysilane, t-butyltrimethoxy Silane, t-butyltriethoxysilane, t-butyltri-n-propoxysilane, t-butyltri-iso-propoxysilane, t-butyltri-
n-butoxysilane, t-butyltri-sec-butoxysilane, t-butyltri-tert-butoxysilane, t-butyltriphenoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltri-n-propoxysilane, phenyltrisilane -Iso-
Propoxysilane, phenyltri-n-butoxysilane, phenyltri-sec-butoxysilane, phenyltri-tert-butoxysilane, phenyltriphenoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-trifluoropropyltrimethoxysilane, γ-trifluoropropyltriethoxysilane, etc .; dimethyldimethoxysilane , Dimethyldiethoxysilane, dimethyl-di-n-propoxysilane, dimethyl-di-iso-propoxysilane, dimethyl-di-n-butoxysilane, dimethyl-di-sec
-Butoxysilane, dimethyl-di-tert-butoxysilane, dimethyldiphenoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyl-di-n-propoxysilane, diethyl-di-iso-propoxysilane, diethyl-di-n -Butoxysilane, diethyl-di-sec-butoxysilane, diethyl-di-
tert-butoxysilane, diethyldiphenoxysilane, di-n-propyldimethoxysilane, di-n-propyldiethoxysilane, di-n-propyl-di-n-propoxysilane, di-n-propyl-di-iso- Propoxysilane, di-n-propyl-di-n-butoxysilane, di-n-propyl-di-sec-butoxysilane, di-n-propyl-di-tert-butoxysilane, di-n-propyl-di- Phenoxysilane, di-i
so-propyldimethoxysilane, di-iso-propyldiethoxysilane, di-iso-propyl-di-n-
Propoxysilane, di-iso-propyl-di-iso
-Propoxysilane, di-iso-propyl-di-n-
Butoxysilane, di-iso-propyl-di-sec-
Butoxysilane, di-iso-propyl-di-tert
-Butoxysilane, di-iso-propyl-di-phenoxysilane, di-n-butyldimethoxysilane, di-n
-Butyldiethoxysilane, di-n-butyl-di-n-
Propoxysilane, di-n-butyl-di-iso-propoxysilane, di-n-butyl-di-n-butoxysilane, di-n-butyl-di-sec-butoxysilane, di-n-butyl-di- tert-butoxysilane, di-n
-Butyl-di-phenoxysilane, di-sec-butyldimethoxysilane, di-sec-butyldiethoxysilane, di-sec-butyl-di-n-propoxysilane,
Di-sec-butyl-di-iso-propoxysilane,
Di-sec-butyl-di-n-butoxysilane, di-s
ec-butyl-di-sec-butoxysilane, di-se
c-butyl-di-tert-butoxysilane, di-se
c-butyl-di-phenoxysilane, di-tert-butyldimethoxysilane, di-tert-butyldiethoxysilane, di-tert-butyl-di-n-propoxysilane, di-tert-butyl-di-iso-propoxy Silane, di-tert-butyl-di-n-butoxysilane, di-tert-butyl-di-sec-butoxysilane, di-tert-butyl-di-tert-butoxysilane, di-tert-butyl-di-phenoxy Silane, diphenyldimethoxysilane, diphenyl-di-ethoxysilane, diphenyl-di-n-propoxysilane, diphenyl-di-iso-propoxysilane, diphenyl-di-n-butoxysilane, diphenyl-di-s
ec-butoxysilane, diphenyl-di-tert-butoxysilane, diphenyldiphenoxysilane, divinyltrimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ
-Glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-trifluoropropyltrimethoxysilane, γ-trifluoropropyltriethoxysilane, and the like. Preferably, tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-iso-
Propoxysilane, tetraphenoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltri-n-propoxysilane, methyltri-iso-propoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane , Phenyltrimethoxysilane, phenyltriethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, trimethylmonomethoxysilane, trimethylmonoethoxysilane, triethylmono Methoxysilane, triethylmonoethoxysilane, triphenylmonomethoxysilane, triphenylmonoethoxysila It is. These may be used alone or in combination of two or more.

(A-2) Component In the above general formula (2), examples of the monovalent organic group include the same organic groups as those in the above general formula (1).
In the general formula (2), as the compound in which R ⁷ is an oxygen atom, hexamethoxydisiloxane, hexaethoxydisiloxane, hexaphenoxydisiloxane, 1,1,1
1,3,3-pentamethoxy-3-methyldisiloxane, 1,1,1,3,3-pentaethoxy-3-methyldisiloxane, 1,1,1,3,3-pentamethoxy-
3-phenyldisiloxane, 1,1,1,3,3-pentaethoxy-3-phenyldisiloxane, 1,1,3,
3-tetramethoxy-1,3-dimethyldisiloxane,
1,1,3,3-tetraethoxy-1,3-dimethyldisiloxane, 1,1,3,3-tetramethoxy-1,3
-Diphenyldisiloxane, 1,1,3,3-tetraethoxy-1,3-diphenyldisiloxane, 1,1,3
-Trimethoxy-1,3,3-trimethyldisiloxane, 1,1,3-triethoxy-1,3,3-trimethyldisiloxane, 1,1,3-trimethoxy-1,3,3
3-triphenyldisiloxane, 1,1,3-triethoxy-1,3,3-triphenyldisiloxane, 1,3
Dimethoxy-1,1,3,3-tetramethyldisiloxane, 1,3-diethoxy-1,1,3,3-tetramethyldisiloxane, 1,3-dimethoxy-1,1,3,3
Examples thereof include 3-tetraphenyldisiloxane and 1,3-diethoxy-1,1,3,3-tetraphenyldisiloxane. Of these, hexamethoxydisiloxane, hexaethoxydisiloxane, 1,1,
3,3-tetramethoxy-1,3-dimethyldisiloxane, 1,1,3,3-tetraethoxy-1,3-dimethyldisiloxane, 1,1,3,3-tetramethoxy-
1,3-diphenyldisiloxane, 1,3-dimethoxy-1,1,3,3-tetramethyldisiloxane, 1,3
-Diethoxy-1,1,3,3-tetramethyldisiloxane, 1,3-dimethoxy-1,1,3,3-tetraphenyldisiloxane, 1,3-diethoxy-1,1,
Preferred examples include 3,3-tetraphenyldisiloxane. In the general formula (2), d
As compounds having 0, hexamethoxydisilane, hexaethoxydisilane, hexaphenixidisilane, 1,
1,1,2,2-pentamethoxy-2-methyldisilane, 1,1,1,2,2-pentaethoxy-2-methyldisilane, 1,1,1,2,2-pentamethoxy-2-
Phenyldisilane, 1,1,1,2,2-pentaethoxy-2-phenyldisilane, 1,1,2,2-tetramethoxy-1,2-dimethyldisilane, 1,1,2,2-
Tetraethoxy-1,2-dimethyldisilane, 1,1,
2,2-tetramethoxy-1,2-diphenyldisilane, 1,1,2,2-tetraethoxy-1,2-diphenyldisilane, 1,1,2-trimethoxy-1,2,2
-Trimethyldisilane, 1,1,2-triethoxy-
1,2,2-trimethyldisilane, 1,1,2-trimethoxy-1,2,2-triphenyldisilane, 1,1,
2-triethoxy-1,2,2-triphenyldisilane, 1,2-dimethoxy-1,1,2,2-tetramethyldisilane, 1,2-diethoxy-1,1,2,2-tetramethyldisilane, 1,2-dimethoxy-1,1,1
Examples of compounds in which R ⁷ is — (CH ₂ ) — in the general formula (2) include 2,2-tetraphenyldisilane and 1,2-diethoxy-1,1,2,2-tetraphenyldisilane. (Hexamethoxysilyl) methane, bis (hexaethoxysilyl) methane, bis (hexaphenoxysilyl) methane, bis (dimethoxymethylsilyl)
Methane, bis (diethoxymethylsilyl) methane, bis (dimethoxyphenylsilyl) methane, bis (diethoxyphenylsilyl) methane, bis (methoxydimethylsilyl) methane, bis (ethoxydimethylsilyl) methane, bis (methoxydiphenylsilyl) Methane, bis (ethoxydiphenylsilyl) methane, bis (hexamethoxysilyl) ethane, bis (hexaethoxysilyl)
Ethane, bis (hexaphenoxysilyl) ethane, bis (dimethoxymethylsilyl) ethane, bis (diethoxymethylsilyl) ethane, bis (dimethoxyphenylsilyl) ethane, bis (diethoxyphenylsilyl) ethane, bis (methoxydimethylsilyl) Ethane, bis (ethoxydimethylsilyl) ethane, bis (methoxydiphenylsilyl) ethane, bis (ethoxydiphenylsilyl) ethane, 1,3-bis (hexamethoxysilyl) propane, 1,3-bis (hexaethoxysilyl) propane, 1,3-bis (hexaphenoxysilyl) propane, 1,3-bis (dimethoxymethylsilyl) propane, 1,3-bis (diethoxymethylsilyl) propane, 1,3-bis (dimethoxyphenylsilyl) propane, , 3-bis (dietoki) Phenylsilyl) propane, 1,3-bis (methoxydimethylsilyl) propane, 1,3-bis (ethoxydimethylsilyl) propane, 1,3-bis (methoxydiphenylsilyl) propane, 1,3-bis (ethoxydiphenylsilyl) ) Propane and the like. Of these, hexamethoxydisilane, hexaethoxydisilane, hexaphenixidisilane, 1,1,2,2-tetramethoxy-
1,2-dimethyldisilane, 1,1,2,2-tetraethoxy-1,2-dimethyldisilane, 1,1,2,2-
Tetramethoxy-1,2-diphenyldisilane, 1,
1,2,2-tetraethoxy-1,2-diphenyldisilane, 1,2-dimethoxy-1,1,2,2-tetramethyldisilane, 1,2-diethoxy-1,1,2,2-
Tetramethyldisilane, 1,2-dimethoxy-1,1,1
2,2-tetraphenyldisilane, 1,2-diethoxy-1,1,2,2-tetraphenyldisilane, bis (hexamethoxysilyl) methane, bis (hexaethoxysilyl) methane, bis (dimethoxymethylsilyl) methane, Bis (diethoxymethylsilyl) methane, bis (dimethoxyphenylsilyl) methane, bis (diethoxyphenylsilyl) methane, bis (methoxydimethylsilyl) methane, bis (ethoxydimethylsilyl) methane,
Bis (methoxydiphenylsilyl) methane and bis (ethoxydiphenylsilyl) methane can be mentioned as preferred examples. In the present invention, as the component (A), either the component (A-1) or the component (A-2) or any one of the components (A-1) and (A-
2) Two or more components can be used respectively.

The component (A-1) and / or (A-
2) When the components are hydrolyzed and condensed, R ² O— and R ⁴ O
- per 1 mole of the group represented by R ⁵ O-, 0.25 to 3
Preferably, moles of water are used, particularly preferably 0.3 to 2.5 moles of water. When the amount of water to be added falls within the range of 0.25 to 3 mol, there is no possibility that the uniformity of the coating film is reduced, and the storage stability of the film-forming composition is less likely to be reduced. That's why.

The component (A-1) and / or (A-2)
When the components are hydrolyzed and condensed, a catalyst may be used. Examples of the catalyst used at this time include a metal chelate compound, an organic acid, an inorganic acid, an organic base, and an inorganic base. Examples of the metal chelate compound include triethoxy mono (acetylacetonate) titanium, tri-n-propoxy mono (acetylacetonate) titanium, tri-i-propoxy mono (acetylacetonate) titanium, and tri-n- Butoxy mono (acetylacetonate) titanium, tri-sec-butoxy mono (acetylacetonate) titanium, tri-t-butoxy mono (acetylacetonate) titanium, diethoxy.
Bis (acetylacetonato) titanium, di-n-propoxybis (acetylacetonato) titanium, di-i-
Propoxy bis (acetylacetonate) titanium, di-n-butoxybis (acetylacetonate) titanium, di-sec-butoxybis (acetylacetonato) titanium, di-t-butoxybis (acetylacetonate) Titanium, monoethoxy-tris (acetylacetonato) titanium, mono-n-propoxy-tris (acetylacetonato) titanium, mono-i-propoxy.
Tris (acetylacetonate) titanium, mono-n-butoxytris (acetylacetonate) titanium, mono-sec-butoxytris (acetylacetonate)
Titanium, mono-t-butoxy tris (acetylacetonate) titanium, tetrakis (acetylacetonate)
Titanium, triethoxy mono (ethyl acetoacetate) titanium, tri-n-propoxy mono (ethyl acetoacetate) titanium, tri-i-propoxy mono (ethyl acetoacetate) titanium, tri-n-butoxy mono (ethyl acetoacetate) Acetate) titanium, tri-s
ec-butoxy mono (ethyl acetoacetate) titanium, tri-t-butoxy mono (ethyl acetoacetate) titanium, diethoxy bis (ethyl acetoacetate) titanium, di-n-propoxy bis (ethyl acetoacetate) titanium, Di-i-propoxy bis (ethyl acetoacetate) titanium, di-n-butoxy bis (ethyl acetoacetate) titanium, di-sec-butoxy bis (ethyl acetoacetate) titanium, di-t
-Butoxy bis (ethyl acetoacetate) titanium,
Monoethoxy tris (ethyl acetoacetate) titanium, mono-n-propoxy tris (ethyl acetoacetate) titanium, mono-i-propoxy tris (ethyl acetoacetate) titanium, mono-n-butoxy tris (ethyl acetoacetate) ) Titanium, mono-sec
-Butoxy-tris (ethylacetoacetate) titanium, mono-t-butoxytris (ethylacetoacetate) titanium, tetrakis (ethylacetoacetate)
Titanium chelating compounds such as titanium, mono (acetylacetonate) tris (ethylacetoacetate) titanium, bis (acetylacetonate) bis (ethylacetoacetate) titanium, tris (acetylacetonate) mono (ethylacetoacetate) titanium; triethoxy・ Mono (acetylacetonate) zirconium, tri-
n-propoxy mono (acetylacetonato) zirconium, tri-i-propoxy mono (acetylacetonato) zirconium, tri-n-butoxy mono (acetylacetonato) zirconium, tri-sec-butoxy mono (acetylacetonate) Nart) zirconium,
Tri-t-butoxy mono (acetylacetonate) zirconium, diethoxybis (acetylacetonato) zirconium, di-n-propoxybis (acetylacetonato) zirconium, di-i-propoxy.
Bis (acetylacetonate) zirconium, di-n-
Butoxy bis (acetylacetonate) zirconium, di-sec-butoxy bis (acetylacetonate) zirconium, di-t-butoxybis (acetylacetonate) zirconium, monoethoxy tris (acetylacetonate) zirconium, mono -N-propoxy tris (acetylacetonate) zirconium, mono-i-propoxy tris (acetylacetonate) zirconium, mono-n-butoxy tris (acetylacetonate) zirconium, mono-sec-butoxy tris (acetyl) (Acetonate) zirconium, mono-t-butoxy tris (acetylacetonate) zirconium, tetrakis (acetylacetonate) zirconium, triethoxy mono (ethylacetoacetate) zirconium Tri -n- propoxy mono (ethylacetoacetate) zirconium, tri -i
-Propoxy mono (ethyl acetoacetate) zirconium, tri-n-butoxy mono (ethyl acetoacetate) zirconium, tri-sec-butoxy mono (ethyl acetoacetate) zirconium, tri-t-
Butoxy mono (ethylacetoacetate) zirconium, diethoxybis (ethylacetoacetate) zirconium, di-n-propoxybis (ethylacetoacetate) zirconium, di-i-propoxybis (ethylacetoacetate) zirconium, di- n-butoxybis (ethylacetoacetate) zirconium, di-sec-butoxybis (ethylacetoacetate) zirconium, di-t-butoxybis (ethylacetoacetate) zirconium, monoethoxytris (ethylacetoacetate) zirconium , Mono-n
-Propoxy tris (ethyl acetoacetate) zirconium, mono-i-propoxy tris (ethyl acetoacetate) zirconium, mono-n-butoxy tris (ethyl acetoacetate) zirconium, mono-
sec-butoxy tris (ethyl acetoacetate)
Zirconium, mono-t-butoxy tris (ethylacetoacetate) zirconium, tetrakis (ethylacetoacetate) zirconium, mono (acetylacetonate) tris (ethylacetoacetate) zirconium, bis (acetylacetonate) bis (ethylacetoacetate) Zirconium chelate compounds such as zirconium and tris (acetylacetonate) mono (ethylacetoacetate) zirconium; aluminum chelate compounds such as tris (acetylacetonate) aluminum and tris (ethylacetoacetate) aluminum; and the like.

The organic acids include, for example, acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid, sebacin Acid, gallic acid, butyric acid, melitic acid, arachidonic acid, shikimic acid,
2-ethylhexanoic acid, oleic acid, stearic acid, linoleic acid, linoleic acid, salicylic acid, benzoic acid, p-
Aminobenzoic acid, p-toluenesulfonic acid, benzenesulfonic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoroacetic acid, formic acid, malonic acid, sulfonic acid, phthalic acid, fumaric acid, citric acid, tartaric acid, and the like. it can. Examples of the inorganic acid include hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid and the like.

Examples of the organic base include pyridine, pyrrole, piperazine, pyrrolidine, piperidine, picoline, trimethylamine, triethylamine, monoethanolamine, diethanolamine, dimethylmonoethanolamine, monomethyldiethanolamine, triethanolamine, diazabicyclooctane, Examples thereof include diazabicyclononane, diazabicycloundecene, and tetramethylammonium hydroxide. Examples of the inorganic base include ammonia, sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide and the like.

Among these catalysts, metal chelate compounds,
Organic acids and inorganic acids are preferred, and more preferred are titanium chelate compounds and organic acids. These may be used alone or in combination of two or more.

The amount of the catalyst used is usually 0.001 to 10 parts by weight, preferably 0.01 to 1 part by weight, based on 100 parts by weight of the total amount of the component (A) (in terms of complete hydrolysis condensate).
The range is 0 parts by weight. Note that the complete hydrolysis-condensation product in the present invention, (A-1) a group represented by OR ² in component and (A-2) a group represented by OR ⁴ and OR ⁵ in component 100% Hydrolyzed to an OH group and completely condensed.

Component (B) As the fluorine-based surfactant which can be used in the present invention, 1,1,2,2-tetrafluorooctyl (1,1)
1,2,2-tetrafluoropropyl) ether, 1,
1,2,2-tetrafluorooctylhexyl ether,
Octaethylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1, 2,
2-tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8, 9,9,10,1
0-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane, N- [3- (perfluorooctanesulfonamido) propyl] -N, N'-dimethyl-N
-Carboxymethylene ammonium betaine, perfluoroalkylsulfonamidopropyltrimethylammonium salt, perfluoroalkyl-N-ethylsulfonylglycine salt, bis (N-perfluorooctylsulfonyl-N-ethylaminoethyl) phosphate, monoperfluoroalkylethyl Fluorinated surfactants comprising a compound having a fluoroalkyl or fluoroalkylene group at at least one of the terminal, main chain and side chain sites such as phosphate esters. Commercially available products are Megafac F142D, F172, F17
3. F183 (above, Dainippon Ink and Chemicals, Inc.)
EF301, 303, 352 (manufactured by Shin-Akita Chemical Co., Ltd.), Florard FC-430, FC
-431 (manufactured by Sumitomo 3M Limited), Asahi Guard A
G710, Surflon S-382, SC-101, SC-102, SC-103, SC-104, S
C-105, SC-106 (manufactured by Asahi Glass Co., Ltd.), and the like, and commercially available fluorinated surfactants can be mentioned. The amount of the fluorosurfactant to be used is usually 0.1 to 100 parts by weight of the component (A) (completely hydrolyzed condensate).
0001 to 10 parts by weight.

The film-forming composition of the present invention is obtained by dissolving or dispersing the components (A) and (B) in an organic solvent.
Examples of the organic solvent used in the present invention include n-pentane, i-pentane, n-hexane, i-hexane, and n-pentane.
Aliphatic hydrocarbon solvents such as heptane, i-heptane, 2,2,4-trimethylpentane, n-octane, i-octane, cyclohexane and methylcyclohexane; benzene, toluene, xylene, ethylbenzene,
Trimethylbenzene, methylethylbenzene, n-propylbenzene, i-propylbenzene, diethylbenzene, i-butylbenzene, triethylbenzene, di-i
Aromatic hydrocarbon solvents such as -propylbenzene, n-amylnaphthalene and trimethylbenzene; methanol,
Ethanol, n-propanol, i-propanol, n
-Butanol, i-butanol, sec-butanol,
t-butanol, n-pentanol, i-pentanol, 2-methylbutanol, sec-pentanol, t
-Pentanol, 3-methoxybutanol, n-hexanol, 2-methylpentanol, sec-hexanol, 2-ethylbutanol, sec-heptanol, heptanol-3, n-octanol, 2-ethylhexanol, sec-octanol, n -Nonyl alcohol, 2,6-dimethylheptanol-4, n-decanol, sec-undecyl alcohol, trimethylnonyl alcohol, sec-tetradecyl alcohol, sec
-Monoalcohol solvents such as heptadecyl alcohol, phenol, cyclohexanol, methylcyclohexanol, 3,3,5-trimethylcyclohexanol, benzyl alcohol, phenylmethylcarbinol, diacetone alcohol, cresol; ethylene glycol, 1,2 Propylene glycol, 1,3-butylene glycol, pentanediol-2,4, 2-methylpentanediol-2,4, hexanediol-2,5,
Polyhydric alcohol solvents such as heptanediol-2,4,2-ethylhexanediol-1,3, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, glycerin; acetone, methyl ethyl ketone, methyl-n-propyl ketone , Methyl-n-butyl ketone, diethyl ketone, methyl-i-butyl ketone, methyl-n-pentyl ketone,
Ethyl-n-butyl ketone, methyl-n-hexyl ketone, di-i-butyl ketone, trimethylnonanone, cyclohexanone, 2-hexanone, methylcyclohexanone, 2,4-pentanedione, acetonylacetone, diacetone alcohol, acetophenone, phen Ketone solvents such as Chong; ethyl ether, i-propyl ether, n-butyl ether, n-hexyl ether;
-Ethylhexyl ether, ethylene oxide, 1,2
-Propylene oxide, dioxolan, 4-methyldioxolan, dioxane, dimethyldioxane, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol diethyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol mono-n-hexyl ether, ethylene Glycol monophenyl ether, ethylene glycol mono-2-ethyl butyl ether, ethylene glycol dibutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether,
Diethylene glycol diethyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol di-n-butyl ether, diethylene glycol mono-n-hexyl ether, ethoxytriglycol,
Tetraethylene glycol di-n-butyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, tripropylene glycol monomethyl ether, Ether solvents such as tetrahydrofuran and 2-methyltetrahydrofuran; diethyl carbonate, methyl acetate, ethyl acetate, γ-butyrolactone, γ-valerolactone, n-propyl acetate, i-propyl acetate, n-butyl acetate, i-butyl acetate; Sec-butyl acetate, n-pentyl acetate, sec-pentyl acetate, 3-methoxybutyl acetate,
Methylpentyl acetate, 2-ethylbutyl acetate, 2-acetic acid
Ethylhexyl, benzyl acetate, cyclohexyl acetate,
Methyl cyclohexyl acetate, n-nonyl acetate, methyl acetoacetate, ethyl acetoacetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl acetate,
Diethylene glycol mono-n-butyl ether acetate,
Propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, glycol diacetate, methoxytriglycol acetate, Ethyl propionate, propionate n
-Butyl, i-amyl propionate, diethyl oxalate, di-n-butyl oxalate, methyl lactate, ethyl lactate, n-butyl lactate, n-amyl lactate, diethyl malonate, dimethyl phthalate, diethyl phthalate and the like Ester solvents such as N-methylformamide, N, N-dimethylformamide, N, N-diethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpropionamide, N-methylpyrrolidone, etc. Nitrogen-based solvents; examples thereof include sulfur-containing solvents such as dimethyl sulfide, diethyl sulfide, thiophene, tetrahydrothiophene, dimethyl sulfoxide, sulfolane, and 1,3-propane sultone. These can be used alone or in combination of two or more.

The composition for forming a film of the present invention can be produced as follows. Specifically, water is intermittently or continuously added to an organic solvent in which the component (A-1) and / or the component (A-2) is dissolved. At this time, the catalyst may be added in advance to the organic solvent, or may be dissolved or dispersed in water at the time of adding water. The reaction temperature at this time is usually 0 to 100 ° C, preferably 15 to 80 ° C.

In constituting the film-forming composition, the content of alcohol having a boiling point of 100 ° C. or less in the composition is preferably 20% by weight or less, particularly preferably 5% by weight or less. Alcohols having a boiling point of 100 ° C. or less can be obtained from the above (A-
It may occur during hydrolysis and / or condensation of the component (A) and the component (A-2).
It is preferable to remove it by distillation or the like so as to be at most 5% by weight, preferably at most 5% by weight.

In the present invention, the fluorinated surfactant may be added at the time of hydrolysis of the component (A-1) and / or the component (A-2), or may be obtained after the completion of the hydrolysis or by the alcohol generated by the hydrolysis. May be added after removal.

The film forming composition of the present invention may further contain the following components. β-diketones β-diketones include acetylacetone, 2,4-hexanedione, 2,4-heptanedione, 3,5-heptanedione, 2,4-octanedione, 3,5-octanedione, 2,4- Nonanedione, 3,5-nonanedione, 5-methyl-2,4-hexanedione, 2,2
6,6-tetramethyl-3,5-heptanedione, 1,
One or more kinds such as 1,1,5,5,5-hexafluoro-2,4-heptanedione. In the present invention, the β-diketone content in the film-forming composition,
Total amount of component (A) (in terms of complete hydrolysis condensate) 100
It is usually in the range of 0.1 to 100 parts by weight, preferably 0.2 to 80 parts by weight based on parts by weight. Β in such a range
Addition of a diketone can provide a certain storage stability and reduce the risk of deterioration of properties such as coating uniformity of the film-forming composition. This β-diketone is preferably added after the hydrolysis and condensation reaction of the component (A).

Other Additives Components such as colloidal silica, colloidal alumina, organic polymers, and surfactants other than fluorine-based surfactants may be added to the film-forming composition obtained in the present invention. Good. Colloidal silica is, for example, a dispersion in which high-purity silicic anhydride is dispersed in the hydrophilic organic solvent, and usually has an average particle size of 5 to 30 μm, preferably 10 to 20 m.
μ, the solid content of which is about 10 to 40% by weight.
Examples of such colloidal silica include methanol silica sol and isopropanol silica sol manufactured by Nissan Chemical Industry Co., Ltd .; and Oscar manufactured by Catalyst Chemicals Co., Ltd. Examples of the colloidal alumina include alumina sols 520 and 100 manufactured by Nissan Chemical Industries, Ltd.
No. 200; alumina clear sol, alumina sol 10, and 132, available from Kawaken Fine Chemicals Co., Ltd. Examples of the organic polymer include a compound having a polyalkylene oxide structure, a compound having a sugar chain structure, a vinylamide polymer, a (meth) acrylate compound, an aromatic vinyl compound, a dendrimer, a polyimide,
Examples thereof include polyamic acid, polyarylene, polyamide, polyquinoxaline, polyoxadiazole, and fluoropolymer. As a surfactant other than the fluorine-based surfactant, for example, a silicone-based surfactant,
Examples thereof include polyalkylene oxide surfactants and acrylic surfactants.

The total solid content of the composition of the present invention thus obtained is preferably 2 to 30% by weight,
It is appropriately adjusted according to the purpose of use. When the total solid content of the composition is 2 to 30% by weight, the thickness of the coating film is in an appropriate range, and the storage stability is more excellent. The weight average molecular weight of all the polyorganosiloxane components [the hydrolyzed condensate of the component (A)] in the composition thus obtained is usually 1,000 to 120,000, preferably 1,200 to 1,200. It is about 100,000.

The composition of the present invention is applied to a silicon wafer, Si
When applying to a substrate such as an O ₂ wafer or a SiN wafer, a coating method such as spin coating, dipping, roll coating, or spraying is used.

In this case, the film thickness may be about 0.05 to 1.5 μm in a single coating, and about 0.1 to 3 μm in a double coating. it can. Thereafter, by drying at room temperature or by heating at a temperature of about 80 to 600 ° C., usually for about 5 to 240 minutes, a glassy or macromolecular insulating film can be formed. As a heating method at this time, a hot plate, an oven, a furnace, or the like can be used. As a heating atmosphere, the heating is performed in the atmosphere, a nitrogen atmosphere, an argon atmosphere, a vacuum, a reduced pressure in which the oxygen concentration is controlled, or the like. Can be.

The interlayer insulating film thus obtained is excellent in insulation, uniformity of coating film, dielectric constant, crack resistance of coating film, and surface hardness of coating film.
System L, DRAM, SDRAM, RDRAM, D
-It is useful for applications such as interlayer insulating films for semiconductor devices such as RDRAMs, protective films such as surface coat films for semiconductor devices, interlayer insulating films for multilayer wiring boards, protective films for liquid crystal display devices, and insulating films.

[0032]

The present invention will now be described more specifically with reference to examples. Parts and% in Examples and Comparative Examples are parts by weight and% by weight, respectively, unless otherwise specified. Further, the evaluation of the film-forming composition in the examples was measured as follows.

The weight average molecular weight (Mw) was measured by gel permeation chromatography (GPC) under the following conditions. Sample: Prepared by dissolving 1 g of a hydrolyzed condensate in 100 cc of tetrahydrofuran using tetrahydrofuran as a solvent. Standard polystyrene: Standard polystyrene manufactured by Pressure Chemical Co., USA was used. Apparatus: High-temperature, high-speed gel permeation chromatogram (model 150-C ALC / GPC) manufactured by Waters, Inc. Column: SHOdex A-80M manufactured by Showa Denko KK
(Length 50cm) Measurement temperature: 40 ° C Flow rate: 1cc / min

The composition for forming a uniform film thickness was applied on an 8-inch silicon wafer by using a spin coater under the conditions of 900 rpm for 20 seconds. Thereafter, using a hot plate maintained at a temperature of 80 ° C., the silicon wafer coated with the film-forming composition was heated for 5 minutes to disperse the organic solvent. Next, using a hot plate maintained at a temperature of 200 ° C., the silicon wafer coated with the film-forming composition was heated for 5 minutes to form a coating film on the silicon wafer. The film thickness of the coating film thus obtained is measured by an optical film thickness meter (Rud).
Olph Technologies, Spect
The measurement was performed at 50 points in the plane of the coating film using Ra Laser 200). 3σ of the obtained film thickness was calculated and evaluated according to the following criteria. ；: 3σ of coating film is less than 15 nm ×: 3σ of coating film is 15 nm or more

A composition sample is applied on a CMP-resistant 8-inch silicon wafer by a spin coating method, and the substrate is dried on a hot plate at 80 ° C. for 5 minutes and at 200 ° C. for 5 minutes. The substrate was baked for 60 minutes in an oven in an atmosphere. The obtained film was polished under the following conditions. Slurry: silica-hydrogen peroxide polishing pressure: 300 g / cm ² polishing time: 60 seconds The evaluation was performed according to the following criteria. ：: No change in the appearance of the coating film △: Part of the appearance of the coating film has peeling or scratches ×: All of the coating film has peeled off The polishing rate was calculated as follows. Polishing rate (nm / min) = (initial film thickness) − (film thickness after polishing for 60 seconds)

A composition sample was applied to a water-absorbing 8-inch silicon wafer by spin coating, and the substrate was dried on a hot plate at 90 ° C. for 5 minutes and at 200 ° C. for 5 minutes. The substrate was baked for 90 minutes in an atmosphere oven. The obtained substrate was heated with a gas analyzer E (manufactured by Electronic Science Co., Ltd.).
The amount of water desorbed by heating to 450 ° C. was measured using MD-WA1000S. The amount of desorbed water was compared with the SiO ₂ film formed by CVD, and evaluated based on the following criteria. ；: The amount of desorbed water is equal to or less than the SiO ₂ film formed by CVD. ×: The amount of desorbed water exceeds the SiO ₂ film formed by CVD.

Example 1 In a quartz separable flask, 101.8 g of methyltrimethoxysilane and 70.4 g of 1,1,3,3-tetraethoxy-1,3-dimethylsiloxane were dissolved in 159 g of 2-hexanone. Thereafter, the solution was stirred with a three-one motor, and the solution temperature was stabilized at 60 ° C. Next, 70 g of ion-exchanged water in which 4.4 g of maleic acid was dissolved was added to 1
Added to the solution over time. Then, after reacting at 60 ° C. for 2 hours, the reaction solution was cooled to room temperature. 234 g of 2-hexanone was added to the reaction solution, and a solution containing methanol and ethanol was removed from the reaction solution at 50 ° C. by evaporation of 234 g to obtain a reaction solution. The weight-average molecular weight of the hydrolyzed condensate thus obtained is 4,
600. (2) 100 g of the obtained reaction solution was added to a fluorine-based surfactant Megafac F172 (Dainippon Ink Chemical Industry Co., Ltd.)
Was added, and the mixture was filtered through a Teflon filter having a pore diameter of 0.2 μm to obtain a film-forming composition of the present invention. The obtained composition was applied on a silicon wafer by a spin coating method. The thickness of the obtained coating film was 930.2.
nm, and 3σ was as good as 9.7 nm. Also,
When the CMP resistance of the coating film was evaluated, no change was observed in the appearance of the coating film, and the polishing rate was 6 nm / min, which was very good. Further, when the hygroscopicity was evaluated, the value was lower than that of the SiO ₂ film formed by CVD.

Example 2 100 g of the fluorinated surfactant Surflon S-382 (manufactured by Asahi Glass Co., Ltd.) was added to 100 g of the reaction solution obtained in Example 1.
The coating film was evaluated in the same manner as in Example 1 except that g was added. The film thickness of the obtained coating film is 935.2 nm.
And 3σ was as good as 9.8 nm. Further, when the CMP resistance of the coating film was evaluated, no change was observed in the appearance of the coating film, and the polishing rate was 4 nm / min, which was very good.
Further, when the hygroscopicity was evaluated, the value was lower than that of the SiO ₂ film formed by CVD. Mega Fuck F1
42D, the same F172, the same F173, the same F183 (the above,
Dainippon Ink and Chemicals, Inc.), F-Top EF30
1, 303, 352 (manufactured by Shin-Akita Kasei Co., Ltd.), Florard FC-430, FC-431 (manufactured by Sumitomo 3M Limited), Asahi Guard AG710, Surflon S-
382, SC-101, SC-102, SC-1
03, SC-104, SC-105, SC-10
6 (made by Asahi Glass Co., Ltd.)

Comparative Example The coating film was evaluated in the same manner as in Example 1 except that no fluorine-based surfactant was added. The thickness of the obtained coating film was 992.1 nm, and 3σ was inferior to 35 nm. In addition, when the CMP resistance of the coating film was evaluated, some scratches were observed in the coating film appearance, and the polishing rate was 9 nm / min, which was inferior to the resistance. Further, when the hygroscopicity was evaluated, the value was higher than that of the SiO ₂ film formed by CVD.

[0040]

According to the present invention, by containing a hydrolyzate of a specific alkoxysilane and / or a condensate thereof, the coating uniformity of the coating film, the CMP resistance characteristic, the moisture absorption characteristic and the like are excellent. It is possible to provide a film-forming composition (material for an interlayer insulating film).

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Takahiko Kurosawa 2-11-24 Tsukiji, Chuo-ku, Tokyo Inside JAE Suare Co., Ltd. F term in reference (reference) 4J038 DL021 DL031 GA12 JC32 KA09 PB09 5F058 AA03 AA04 AC03 AC06 AF04 AG01 AH01 AH02

Claims (3)

[Claims] (A) (A-1) a compound represented by the following general formula (1): R ¹ _a Si (OR ² ) _4-a (1) (R ¹ is a hydrogen atom, A fluorine atom, a monovalent organic group,
R ² represents a monovalent organic group, and a represents an integer of 0 to 2. ) And (A-2) a compound represented by the following general formula (2): R ³ _b (R ⁴ O) _3-b Si— (R ⁷ ) _d —Si (OR ⁵ ) _3-c R ⁶ _c. (2) (R ³ , R ⁴ , R ⁵ and R ⁶ may be the same or different and each represents a monovalent organic group, and b and c may be the same or different; R ⁷ represents an oxygen atom or — (CH ₂ ) _n —, and d represents 0 or 1.
And n represents an integer of 1 to 6. A) a film-forming composition comprising a hydrolyzate and / or a condensate of at least one compound selected from the group consisting of) and (B) a fluorine-containing surfactant. 2. Component (A) (completely hydrolyzed condensate) 1
0.0001-10.00 parts by weight of the component (B).
2. The film forming composition according to claim 1, wherein the amount is 0 parts by weight. 3. A material for forming an insulating film, comprising the composition according to claim 1.