JP2000311727A - Insulation seal structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform sealing at a low temperature and eliminate requirement of oxidizing treatment before sealing and removing of an oxide film after the sealing, by using an insulation seal agent composed of a thermoplastic resin and glass ceramic for sealing between a metal member and a lead. SOLUTION: A portion between the upper surface of a metal member 1 and the lower surface of a collar part 5 of a lead 4 is sealed by welding of an insulation sealing material (thermoplastic resin) 3. The metal member 1 is made of one material selected from a group of, for example, carbon steel, copper alloy, stainless steel, and iron-nickel alloy, and preferably, its outer diameter is 5.9 mm, and an inner diameter of a through hole 2 is 1.1 mm. The insulation sealing material 3 is made liquid crystal polymer for example, preferably, its outer diameter is 2.0 mm, and its thickness is 0.05 mm. The lead 4 is selected from a group of carbon steel, copper alloy, stainless steel, and iron- nickel alloy, and iron-nickel-cobalt alloy, preferably, its outer diameter is 0.45 mm, its length is 18 mm, and outer diameter of the collar portion 5 is 1.5 mm. As the insulation seal agent 3, glass ceramic can be used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating sealing structure in which a metal member and a lead are sealed with an insulating sealing material, and more particularly, a thermoplastic resin or glass ceramic is used as the insulating sealing material. The present invention relates to an insulating sealing structure.

[0002]

2. Description of the Related Art Hermetic terminals are widely used in various fields. Conventional airtight terminals, for example, as shown in FIG.
A lead 43 is hermetically sealed in a metal outer ring 41 via a glass 42. In this type of hermetic terminal,
Broadly speaking, there are a compression sealing type and a matching sealing type. The former compression-sealed type hermetic terminal uses a carbon steel or an iron-nickel alloy for the metal outer ring 41, a soda lime glass or a soda barium glass for the glass 42, and a lead 43.
Using an iron-nickel alloy or an iron-chromium alloy, the thermal expansion coefficients α1 and α2 of the metal outer ring 41 and the glass 42 are set to α1
> Α2 so that a compressive stress is applied to the glass 42 and the lead 43, and can be manufactured at low cost.
It is used in relatively inexpensive electronic devices. In addition, the latter matching sealing type airtight terminal comprises a metal outer ring 41 and a lead 4.
3, an iron-nickel-cobalt alloy called Kovar or Kovar is used, and a borate glass is used as the glass 42. The respective thermal expansion coefficients α1, α2, α3 are α1 =
The coefficient of thermal expansion of the metal outer ring 41, the glass 42, and the lead 43 is matched over a wide temperature range by setting α2 = α3, and is relatively expensive because the former is more expensive than the former. Has been adopted.

[0003]

Regardless of the type of hermetic terminal, a metal outer ring 41 and a lead 43 are connected to a glass 42.
In order to hermetically seal the outer ring 41 and / or the lead 43 with the glass 42, it is necessary to perform an oxidation process on the outer ring 41 and / or the lead 43. Was. For the oxide film formed by this oxidation treatment, the wettability of the molten glass is excellent,
In addition, since the glass component is made of a metal oxide, it easily dissolves in the molten glass, and an airtight terminal having excellent airtightness can be obtained.

[0004] However, an oxide film for sealing with glass is originally required only for a sealing portion with glass, and is not necessary for other portions. Forming results in significant cost increases and is not practical. Therefore, generally, an oxide film is formed on the entire surface of the metal outer ring 1 and / or the lead 3 and sealed with the glass 2, and thereafter, an unnecessary oxide film is removed. However, depending on the type of the oxide film, there is an oxide film which is excellent in the sealing property with glass but is difficult to remove after sealing the glass, and the type of oxide film that can be used, that is, the type of the metal material is limited. Was inconvenient.

In addition, when glass is melted and sealed, a heat treatment at 900 ° C. or higher is required, and a high-temperature sealing furnace is required, resulting in an increase in equipment costs. For this reason, the hermetic terminal was inevitably expensive. However, depending on the application, there may be a case where the hermetic terminal does not require high airtightness as much as the hermetic terminal. In such a case, the hermetic terminal has excessive performance and lowers cost performance. there were.

Furthermore, there is no metal sealing glass having a thermal expansion coefficient exceeding 10 ppm / ° C., and it is necessary to use an expensive metal such as an iron-nickel-cobalt alloy in a matched sealing type airtight terminal. Furthermore, in sealing with molten glass, it was difficult to control the thickness of the insulator. Then, an object of the present invention is to provide a cheaper insulating sealing structure.

[0006]

According to the present invention, there is provided an insulating sealing structure in which a metal member and a lead are sealed with an insulating sealing material. It is characterized by using resin or glass ceramic.

Since the thermoplastic resin can be directly sealed at a low temperature of about 300 ° C. to 350 ° C., it is possible to use a sealing furnace which is significantly cheaper than a sealing furnace for sealing glass. In addition, since a thermoplastic resin or glass ceramic can be sealed at a low temperature using solder, a silver-based brazing material, a low-melting glass, or the like, a sealing furnace that is significantly cheaper than a sealing furnace for sealing glass is adopted. And maintenance costs are significantly reduced. Further, an oxide film is not required for the outer metal ring and / or the lead, so that it is not necessary to form an oxide film before sealing and to remove an oxide film after sealing. Further, thermoplastic resins, especially liquid crystal polymers and glass ceramics, use an expensive iron-nickel-cobalt alloy because their thermal expansion coefficients are close to those of carbon steel, copper alloy, stainless steel, and iron-nickel alloy. It is not necessary. For this reason, the insulating sealing structure of the present invention is significantly less expensive than the conventional hermetic terminals.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION
An insulating sealing structure in which a metal member and a lead are sealed with an insulating sealing material, wherein a thermoplastic resin is used as the insulating sealing material. Here, the reason why a thermoplastic resin is used as the insulating sealing material is to enable sealing at a low temperature and to eliminate the need to form and remove an oxide film.

The invention according to claim 2 of the present invention is the insulating sealing structure according to claim 1, wherein the thermoplastic resin is a liquid crystal polymer. Here, the reason why the liquid crystal polymer is used as the thermoplastic resin is that the liquid crystal polymer has a low water permeability and moisture permeability as a resin, a high coefficient of thermal expansion, and heat resistance. This is because they have water resistance and moisture permeability, have a small difference in thermal expansion coefficient from the metal member, do not have airtight leakage from the sealing portion, and can widen the operating temperature range.

According to a third aspect of the present invention, the metal member is made of any one material selected from the group consisting of carbon steel, copper alloy, stainless steel, and iron-nickel alloy. An insulating sealing structure according to claim 1 or 2. Here, the reason for limiting the material of the metal member to those selected from the above group is to allow the use of commonly used materials and to guarantee the alternative use of the hermetic terminals conventionally used. It is.

According to a fourth aspect of the present invention, the lead is made of any one material selected from the group consisting of carbon steel, copper alloy, stainless steel, iron-nickel alloy, and iron-nickel-cobalt alloy. The insulating sealing structure according to claim 1, wherein: Here, the reason why the material of the lead is limited as described above is to make it possible to adopt a commonly used material and to guarantee the alternative use of the conventionally used airtight terminal.

According to a fifth aspect of the present invention, there is provided the insulating sealing structure according to any one of the first to fourth aspects, wherein the lead has a flange portion which swells in a lateral direction. here,
The reason why the laterally bulging flange portion is formed on the lead is to secure a sealing interface dimension with the insulating sealing material to improve sealing performance.

The invention according to claim 6 of the present invention is characterized in that the metal member and the lead are sealed by thermocompression bonding the thermoplastic resin. It is. Here, the reason for sealing the thermoplastic resin by thermocompression bonding is to improve the sealing performance between the metal member and / or the lead and the thermoplastic resin.

According to a seventh aspect of the present invention, there is provided an insulating sealing structure having a metal member, a lead, and an insulating sealing material for insulating and sealing the two members. An insulating sealing structure characterized by being a glass ceramic. Here, the reason why the metal member and the lead are sealed using the glass ceramic is that the coefficient of thermal expansion of the glass ceramic can be adjusted by adjusting the ratio of the glass and the ceramic. Alternatively, by approximating the thermal expansion coefficient of the lead, it is possible to secure a good sealing portion with the metal member and / or the lead.

According to an eighth aspect of the present invention, the metal member and the lead wire are sealed with one material selected from the group consisting of a silver brazing material, glass and solder by using the insulating sealing material. 8. The insulating sealing structure according to claim 1, wherein said insulating sealing structure is stopped. Here, the reason why the metal member and the lead are bonded and fixed with one material selected from the group consisting of silver brazing material, low melting point glass, and solder using the insulating sealing material is that the insulating sealing material itself is used. This is for sealing without melting.

The invention according to claim 9 of the present invention is the insulating sealing structure according to any one of claims 1 to 7, wherein the metal member is a metal case. Here, the reason why the metal case is used as the metal member is to simplify the structure and reduce the cost by directly sealing the lead to the metal case via an insulating sealing material. .

According to a tenth aspect of the present invention, the insulating sealing material is integrated with one of the metal member and the lead by thermal spraying and pressure welding. 10. An insulating sealing structure according to claim 9. The reason why the insulating sealing material is integrated with one of the metal member and the lead by thermal spraying and pressure welding is that an insulating sealing structure can be obtained without using an expensive sealing furnace. is there.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of an insulating terminal A which is an insulating sealing structure according to a first embodiment of the present invention. In FIG. 1, 1
Is a metal outer ring as an example of a metal member, and has a through hole 2 at the center thereof. Reference numeral 3 denotes a thermoplastic resin as an example of an insulating sealing material, for example, a liquid crystal polymer. Reference numeral 4 denotes a lead having a flange portion 5 bulging in the radial direction near the upper end. The upper surface of the metal outer ring 1 and the lower surface of the flange 5 of the lead 4 are sealed by welding the thermoplastic resin 3. The metal outer ring 1
Is made of, for example, any one material selected from the group consisting of carbon steel, copper alloy, stainless steel, and iron-nickel alloy,
The outer diameter is 5.9 mm and the inner diameter of the through hole 2 is 1.1 m
m. The thermoplastic resin 3 is made of, for example, a liquid crystal polymer and has an outer diameter of 2.0 mm and a thickness of 0.1 mm.
05 mm. The lead 4 is made of carbon steel, copper alloy, stainless steel, iron-nickel alloy, iron-nickel-
It is made of any one material selected from the group of cobalt alloys, and has an outer diameter of 0.45 mm, a length of 18 mm,
The outer diameter of the flange 5 is 1.5 mm.

According to the insulated terminal A of the first embodiment, the upper surface of the metal outer ring 1, the lower surface of the flange 5 of the lead 4 and the portion of the lead 4 adjacent to the flange 5 are made of thermoplastic resin. Since it is sealed with the resin 3, an insulating terminal with high airtightness can be obtained even if it is not as good as a hermetic terminal by conventional glass sealing. The melting point of the liquid crystal polymer 3 is 280-325.
° C, the sealing temperature is about 300 ° C to 350 ° C. Compared with a conventional hermetic terminal by glass sealing, not only can a remarkably low temperature sealing furnace be adopted, but also an oxide film is unnecessary,
An inexpensive insulated terminal A can be provided. Further, the liquid crystal polymer 3 has a coefficient of thermal expansion of 10 to 20 ppm / ° C. and can be directly sealed with the metal member 1 and the lead 4, and has a volume resistivity of 7.7 × 10 ¹⁵ Ωcm and a water absorption rate. 0.04
%, The water vapor transmission coefficient is almost zero, the volume resistivity is about 1.5 times that of the polyimide resin, and the water absorption is about 10%.
Since the water vapor transmission coefficient is infinitely small, it is possible to provide an insulating sealing structure having extremely excellent insulation resistance, water resistance and moisture resistance.

FIG. 2 is a sectional view of an insulated terminal B according to a second embodiment of the present invention. The difference between the insulating terminal B of this embodiment and the insulating terminal A of FIG. 1 lies in the shape of the thermoplastic resin 6.
That is, the thermoplastic resin 3 of FIG. 1 has a plate-like donut shape, while the thermoplastic resin 6 of the second embodiment
Has a bottom plate portion 61 and a cylindrical portion 62 that rises around the bottom plate portion 61, and the bottom plate portion 61 and the cylindrical portion 62 that rises around the bottom plate portion 61 have a concave portion 63.
Further, the flange 5 of the lead 4 is embedded in the recess 63.

According to such a configuration, while the shape of the lead 4 remains the same, the size of the sealing interface with the thermoplastic resin 6 is increased, so that not only the airtightness is improved but also the metal outer ring 1 is formed. The creepage distance of the thermoplastic resin 6 between the lead 4 and the lead 4 increases,
The withstand voltage increases and / or the leakage current decreases. The shape of the thermoplastic resin 6 described above is such that the flange 5 is embedded in the thermoplastic resin 6 by applying a pressing force from above in the figure to the flange 5 of the lead 4 when the thermoplastic resin 6 is heated and sealed. Alternatively, a thermoplastic resin 6 molded into such a shape from the beginning may be used. Even if it is molded into such a shape, the resin molding processing cost itself does not increase.

FIG. 3 shows an insulated terminal C according to a third embodiment of the present invention.
FIG. In FIG. 3, reference numeral 11 denotes a metal outer ring having a through hole 12 at the center and a large diameter portion 13 around a lower end of the through hole 12. Reference numeral 7 denotes a thermoplastic resin, which is a bottom plate 71 similar to that of the second embodiment shown in FIG.
2, a concave portion 73 formed by them, and a falling portion 74 that falls along the through hole 12 of the metal outer ring 11.

According to the above embodiment, the falling portion 74 not only stabilizes the positional relationship between the outer metal ring 11 and the lead 4 but also increases the withstand voltage between the outer metal ring 11 and the lead 4. And / or the leakage current is reduced. Such a falling part 74 is formed by the thermoplastic resin 7 as described above.
The lead 4 may be formed by applying a larger downward pressing force to the lead 4 at the time of the heat sealing of the lead 4.
May be integrally formed at the time of molding. According to the above embodiment, since the large-diameter portion 13 is formed around the lower end of the through hole 12, the lower end of the falling portion 74 of the thermoplastic resin 7 projects from the lower surface of the metal outer ring 11. For example, when the insulating terminal C is mounted on a flat surface of another member, the lower end of the falling portion 74 does not interfere.

FIG. 4 is a sectional view of a case D for an electronic device according to a fourth embodiment of the present invention. In FIG. 4, 21 is carbon steel,
Height of 2.0 m made of one metal material selected from the group consisting of copper alloy, stainless steel alloy and iron-nickel alloy
m case body, bottom plate portion 22 and rising portion 23
And a flange 24, and an opening 25 in the bottom plate 22. An inverted "T-shaped" lead 27 is hermetically sealed in the opening 25 via an insulating sealing material 26 such as a liquid crystal polymer or a glass ceramic. For example, glass-ceramics include forsterite in glass of 30 to 70%.
Those having a thermal expansion coefficient of 10 to 15 ppm / ° C dispersed in wt% are used. The insulating sealing material 26 is, for example, 25
It has a thickness of about 50 μm, and has copper layers 28 and 29 each having a thickness of about 12 μm on both surfaces as shown in FIG. And
The space between the copper layer 28 and the bottom plate portion 22 of the case body 21 and the space between the copper layer 29 and the flange 27a of the lead 27 are hermetically fixed and sealed by solders 30 and 31, respectively.
Reference numeral 32 denotes a cover plate made of the same metal material as the case body 21, and its peripheral portion is fixedly sealed to the flange portion 24 of the case body 21. Although FIG. 4 is a cross-sectional view, only one opening 25 and one lead 27 of the bottom plate 22 of the case 21 are shown. However, in the case of a two-terminal electronic component,
Two each are provided.

According to the electronic device case D, even if the height of the case body 21 or the lead 27 is small, the gap between the bottom plate 22 of the case body 21 and the upper surface of the insulating sealing material 26 is small. In addition, since the space between the lower surface of the insulating sealing material 26 and the flange 27a of the lead 27 is hermetically sealed by the solders 30 and 31, a highly airtight case can be obtained even if it is not as large as an airtight terminal. Such an airtight case is effectively used, for example, as a case for a surface mount type crystal unit for sealing a rectangular plate-shaped crystal unit in a horizontal position.

Although each of the above embodiments of the present invention has been described with respect to an insulated terminal or a case having a specific structure, the present invention is not limited to the above embodiments, and is not deviated from the spirit of the present invention. Needless to say, various modifications are possible.

For example, in the above-described first to third embodiments, the case where one lead 4 is sealed in the cylindrical metal outer ring 1 to 11 has been described. Oval, elliptical or the like, or two or more leads.

In the fourth embodiment, the case for the surface-mount type crystal unit has been described. However, the present invention can be similarly applied to other electronic parts.

Further, the leads 4 and 4 in each of the above embodiments are used.
27 can be similarly implemented not only in a columnar shape but also in a quadrangular prism, a hexagonal prism, or the like.

Further, in the fourth embodiment, the case where the insulating sealing material 26 and the case body 21 and the lead 27 are sealed with the solders 30 and 31 has been described.
The sealing may be performed with a sealing material such as a silver brazing material or a low melting glass in which the insulating sealing material 26 does not melt at a sealing temperature.

Also, in the insulating terminals of the first to third embodiments, copper layers (foil) are formed on both surfaces of the insulating sealing materials 3 and 6 and solder, silver-based brazing material, low-melting glass or the like is used. You may make it seal.

Further, when glass ceramic is used as the insulating sealing material and sealing is performed with low melting point glass, the copper layer (foil) can be omitted.

[0034]

According to the present invention, there is provided an insulating sealing structure having a metal member, a lead, and an insulating sealing material for insulating and sealing the both, wherein the insulating sealing material is a thermoplastic resin or glass ceramic. Since it is an insulated sealing structure, it can be sealed at a lower temperature than conventional hermetic terminals using molten glass, and can be oxidized before sealing or oxide film removed after sealing. Is unnecessary, so that an inexpensive insulating sealing structure can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view of an insulated terminal A according to a first embodiment of the present invention.

FIG. 2 is a sectional view of an insulating terminal B according to a second embodiment of the present invention.

FIG. 3 is a sectional view of an insulating terminal C according to a third embodiment of the present invention.

FIG. 4 is a sectional view of a case D according to a fourth embodiment of the present invention.

FIG. 5 is an enlarged sectional view of a main part of a case D according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view of a conventional hermetic terminal.

[Explanation of symbols]

 A, B, C Insulating sealing structure (insulating terminal) 1 Metal member (outer ring outer ring) 2 Through hole 3 Insulating sealing material (thermoplastic resin) 4 Lead 5 Flange 6, 7 Insulating sealing material (thermoplastic 61, 71 Bottom plate part 62, 72 Cylindrical part 63, 73 Concave part 74 Falling part 11 Metal member (metal outer ring) 12 Through hole 13 Large diameter part D Electronic device case 21 Case body 22 Bottom plate part 23 Standing part 24 Flange 25 Opening 26 Insulation sealing material 27 Lead 28, 29 Copper layer (foil) 30, 31 Solder 32 Lid

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E086 PP03 PP07 PP14 PP16 PP24 PP25 PP36 PP37 PP48 QQ14 QQ15

Claims (10)

[Claims] 1. An insulating sealing structure comprising a metal member, a lead, and an insulating sealing material for insulating and sealing the both, wherein the insulating sealing material is a thermoplastic resin. Insulation sealing structure. 2. The insulating sealing structure according to claim 1, wherein said thermoplastic resin is a liquid crystal polymer. 3. The insulating seal according to claim 1, wherein said metal member is made of any one material selected from the group consisting of carbon steel, copper alloy, stainless steel, and iron-nickel alloy. Stop structure. 4. The lead according to claim 1, wherein the lead is made of any one material selected from the group consisting of carbon steel, copper alloy, stainless steel, iron-nickel alloy, and iron-nickel-cobalt alloy. 4. The insulating sealing structure according to any one of items 3 to 3. 5. The insulating sealing structure according to claim 1, wherein said lead has a flange portion which swells in a lateral direction. 6. The insulating sealing structure according to claim 1, wherein said metal member and said lead are sealed by thermocompression bonding of said thermoplastic resin. 7. An insulating sealing structure having a metal member, a lead, and an insulating sealing material for insulating and sealing the both, wherein the insulating sealing material is glass ceramic. Insulation sealing structure. 8. The metal member and the lead wire are sealed with one material selected from the group consisting of silver brazing material, glass and solder using the insulating sealing material. 8. The insulating sealing structure according to any one of 1 to 7. 9. The insulation sealing structure according to claim 1, wherein said metal member is a metal case. 10. The insulating sealing structure according to claim 1, wherein the insulating sealing material is integrated with one of the metal member and the lead by thermal spraying and pressure welding.