JP2000293651A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device such as a non-contact IC card, a non-contact IC tag, a non-contact IC button, or a non-contact IC coin whose costs can be reduced, and whose durability can be made excellent. SOLUTION: The whole outer periphery of a bear IC chip 1 with a built-in antenna coil in which an antenna coil 1a is incorporated is sealed by a first package member 2 made of thermo-setting resin such as epoxy resin. Also, the periphery of the first package member 2 is sealed by a second package member 3 made of thermoplastic resin such as ABS resin, polypropylene resin, vinyl chloride resin, or polyethylene terephthalate resin, and this semiconductor device can be finished in a prescribed shape such as a card shape, a tag shape, a button shape, or a coin shape. The IC chip 1 is protected by the first package member 2, and flexibility is applied to the semiconductor device by the second package member 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type semiconductor device which wirelessly transmits and receives signals from a reader / writer and transmits / receives signals to / from the reader / writer.

[0002]

2. Description of the Related Art A semiconductor device, such as a card type, a tag type, a button type or a coin type, on which an IC is mounted has abundant information amount and high security performance.
It has been widely used in the fields of distribution and information communication. Among them, a non-contact type semiconductor device developed in recent years uses a contact-type semiconductor device because it receives power from a reader / writer and transmits / receives signals to / from the reader / writer wirelessly without providing external terminals on a package member. Unlike other devices, there is essentially no damage to external terminals, and it is easy to handle such as storage and can withstand long-term use. It is expected to spread to a wider field in the future.

Conventionally, as a non-contact type semiconductor device of this type, a semiconductor module having an antenna coil, such as a winding coil or a printed coil, externally attached to an input / output terminal of an IC chip is formed by resin molding or film lamination. Such a casing is generally used.

[0004] However, in the non-contact type semiconductor device having such a configuration, a stress is easily applied to a connection portion between the IC chip and the antenna coil at the time of handling or casing of the semiconductor module. There is a problem that the yield is high, the yield of good products is low, and the product cost is high.

In order to solve such inconvenience, in recent years, instead of a configuration in which an antenna coil is externally attached to an input / output terminal of an IC chip as described in, for example, Japanese Patent Laid-Open No. A method for manufacturing a semiconductor device using an IC chip with a built-in coil has been proposed.

FIG. 14 is a plan view and a cross-sectional view showing a tag-type non-contact type semiconductor device using a conventionally proposed IC chip with a built-in antenna coil, that is, a non-contact type IC tag. Built-in coil type IC chip 101
Is sealed with a mold resin 102 made of a thermoplastic resin such as an ABS resin, a polypropylene resin, a vinyl chloride resin, and a polyethylene terephthalate resin.

[0007] Since the non-contact type IC tag of this configuration uses the IC chip 101 with a built-in antenna coil, stress is applied to the connecting portion between the IC chip and the antenna coil during handling or molding to prevent disconnection or poor contact. The yield of non-defective products can be increased without any occurrence, and the product cost can be reduced. Further, the non-contact type IC tag of this configuration has excellent flexibility and can be applied to applications such as sticking to a curved surface because the periphery of the IC chip 101 is molded into a predetermined shape by molding with a thermoplastic resin. be able to.

FIG. 15 is a plan view and a sectional view showing a button-type non-contact type semiconductor device using a conventionally proposed IC chip with a built-in antenna coil, that is, a non-contact type IC button. IC chip with built-in coil 1
01 is molded with a thermoplastic resin such as an ABS resin, a polypropylene resin, a vinyl chloride resin, or a polyethylene terephthalate resin.
Is formed by sealing the opening of the concave portion 102 a formed by the potting resin 103.

The non-contact type IC button of this configuration also uses the IC chip 101 with a built-in antenna coil, so that stress is applied to the connecting portion between the IC chip and the antenna coil during handling or molding, causing disconnection or poor contact. Therefore, the yield of non-defective products can be increased, and the product cost can be reduced. Also,
The non-contact type IC button of this configuration is an antenna coil built-in type IC housed in the concave portion 102a of the mold resin 102.
Since the chip 101 is sealed with the potting resin 103, the chip 101 is excellent in water resistance.

[0010]

However, since the non-contact type IC tag having the above-described structure is formed by molding the periphery of the IC chip 101 with a thermoplastic resin, the adhesiveness to the IC chip 101, heat resistance, and water resistance. In addition, there is a disadvantage that the impact resistance is poor, and the durability and the reliability of the package are poor.

It is to be noted that such a disadvantage can be solved by molding the mold resin 102 with a highly crosslinkable thermosetting resin such as an epoxy resin, but on the other hand, this type of thermosetting resin is generally hard. As a result, a flexible non-contact IC tag cannot be obtained,
A new inconvenience of weakening to impact force occurs. Furthermore, since this kind of thermosetting resin is generally expensive, there is also a disadvantage that the product cost is increased.

[0012] Further, the non-contact type IC button having the above-mentioned structure includes:
Since the opening of the concave portion 102a formed in the mold resin 102 is sealed with the potting resin 103, not only the manufacturing process becomes complicated and the product cost becomes high, but also the potting resin 103 is basically applied by dropping or coating. Since the bonding density of the resin is low and the strength of the resin itself is weak, a sufficient reinforcing effect or stiffening effect, adhesion to the IC chip 101, heat resistance and impact resistance are imparted to the IC chip 1. As in the case of the non-contact type IC tag, there is a disadvantage that the durability and the reliability of the package are inferior.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a non-contact IC card, a non-contact IC tag, a non-contact IC button or a non-contact IC button which is inexpensive and has excellent durability. It is to provide a semiconductor device such as a contact IC coin.

[0014]

According to the present invention, there is provided a semiconductor device comprising an IC chip, an antenna coil, and a package member for integrally sealing the IC chip and the antenna coil. The periphery of the IC chip is sealed with a first package member made of a thermosetting resin, and the periphery of the first package member is sealed with a second package member of a predetermined shape made of a thermoplastic resin. It was configured to do.

As the thermosetting resin, epoxy resin or the like can be used, and as the thermoplastic resin, ABS resin,
A polypropylene resin, a vinyl chloride resin, a polyethylene terephthalate resin, or the like can be used.

A thermosetting resin such as an epoxy resin has a high adhesiveness to an IC chip, has high strength and is excellent in heat resistance and water resistance. Therefore, an IC is formed by sealing the periphery of the IC chip with the resin. The effect of protecting the chip can be significantly improved, and a semiconductor device having excellent adhesion to the IC chip, heat resistance, water resistance, and impact resistance can be obtained. Also,
A thermosetting resin such as an epoxy resin hardly involves air bubbles at the time of molding, so that a thermal stress hardly acts on an IC chip sealed with the resin, and therefore a disconnection or a contact failure does not easily occur. And the product cost of the semiconductor device can be reduced. The thermosetting resin is generally more expensive than the thermoplastic resin, but only seals the periphery of the IC chip. Since the amount of the thermosetting resin used is small, the cost of using the thermosetting resin is low. The rise can be minimized.

On the other hand, when the periphery of the first package member is sealed with a second package member having a predetermined shape made of a thermoplastic resin, the semiconductor device can be provided with a flexible flexibility and the package member can be made flexible. Almost the whole can be formed of an inexpensive thermoplastic resin, so that a semiconductor device having a predetermined shape can be manufactured at low cost.

As the IC chip, an IC chip having a built-in antenna coil can be used, or an IC chip in which a winding coil or a plane coil is externally attached to an input / output terminal can be used. When an IC chip having an externally wound coil at the input / output terminal is used, the IC chip
A winding coil can be directly connected to the input / output terminal of the chip, or a winding coil can be connected to the input / output terminal of the IC chip via a lead. The direct connection means between the input / output terminals and the winding coil includes thermocompression bonding, solder connection,
Examples include welding, conductive paste connection, and ultrasonic fusion welding. In addition, it is more preferable to form bumps on the input / output terminals of the IC chip in order to more easily and reliably connect the antenna chip or the leads.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a semiconductor device according to the present invention will be described below with reference to FIGS.
FIG. 1 is a sectional view of a semiconductor device according to the first embodiment, and FIG.
FIG. 3 is a sectional view showing an apparatus and method for forming a first package member, and FIG. 3 is a sectional view showing an apparatus and method for forming a second package member.

As is apparent from FIG. 1, in the semiconductor device of this embodiment, the entire outer periphery of the antenna coil built-in type bare IC chip 1 having the antenna coil 1a built therein is made of a first thermosetting resin such as epoxy resin. While sealing with the package member 2, the periphery of the first package member 2 is sealed with a second package member 3 made of a thermoplastic resin such as ABS resin, polypropylene resin, vinyl chloride resin or polyethylene terephthalate resin. Stop, card shape,
It is characterized in that it is finished in a predetermined shape such as a tag shape, a button shape or a coin shape. When the bare IC chip 1 is applied to a thin semiconductor device, the silicon wafer is polished by mechanical or chemical means or a combination thereof to be thinned to a desired thickness. Can also be used.

As shown in FIG. 2, the first package member 2 is formed on the mating surface of the upper mold 11 and the lower mold 12 with dimensions and dimensions corresponding to the first package member 2 to be molded.
A cavity 13 having a shape is formed.
A plurality of pins 1 for supporting the bare IC chip 1 therein
Using a mold having a projecting 4, a bare IC is mounted on the pin 14.
After fixing the chip 1 at a predetermined position in the cavity 13, the thermosetting resin can be filled in the cavity 13 from the gate 15.

The formation of the second package member 3 is as follows.
As shown in FIG. 3, a cavity 23 having a size and shape corresponding to the second package member 3 to be molded is formed on the mating surface of the upper mold 21 and the lower mold 22, and the first cavity is formed in the cavity 23. A bare IC chip in which the first package member 2 is molded with the pins 24 using a mold provided with a plurality of pins 24 for supporting the bare IC chip 1 on which the package member 2 is molded 1 is fixed at a predetermined position in the cavity 23, and then the gate 25 is fixed.
The filling can be performed by filling the cavity 23 with a thermoplastic resin.

In the semiconductor device of the present embodiment, the entire outer periphery of the bare IC chip 1 is made of a thermosetting resin such as an epoxy resin having high adhesion to the IC chip, high strength, and excellent heat resistance and water resistance. Since sealing is performed by the first package member 2, the protection effect of the bare IC chip 1 is high, and
A semiconductor device having excellent adhesion to the chip 1, heat resistance, water resistance, and impact resistance can be obtained. Further, since the semiconductor device of this example uses a bare IC chip with a built-in antenna coil as the bare IC chip 1, the antenna coil 1a will not be disconnected or a contact failure will not occur unless the bare IC chip 1 is broken. Excellent durability in terms of point. Further, in the semiconductor device of this example, only a small portion around the bare IC chip 1 is sealed with the first package member 2 made of a thermosetting resin, so that the amount of the thermosetting resin used is small, and It can be implemented inexpensively. in addition,
In the semiconductor device of the present embodiment, the periphery of the first package member 2 is sealed with the second package member 3 made of a thermoplastic resin and molded into a predetermined shape, so that the semiconductor device has flexibility. be able to.

Next, a second embodiment of the semiconductor device according to the present invention will be described with reference to FIGS. FIG. 4 is a cross-sectional view of a semiconductor device according to the second embodiment, and FIG. 5 is a cross-sectional view showing a first package member forming apparatus and method.

As is apparent from FIG. 4, in the semiconductor device of this embodiment, the outer periphery of the antenna coil built-in type bare IC chip 1 in which the antenna coil 1a is built is made of a first package made of a thermosetting resin such as epoxy resin. While sealing with the member 2, the periphery of the first package member 2 is, for example, A
Sealed with a second package member 3 made of a thermoplastic resin such as a BS resin, a polypropylene resin, a vinyl chloride resin or a polyethylene terephthalate resin, and finished in a predetermined shape such as a card shape, a tag shape, a button shape or a coin shape. However, instead of sealing the entire outer periphery of the bare IC chip 1 with the first package member 2, the first package member is provided only on the circuit forming surface side, the side surface, and a part of the back surface of the bare IC chip 1. 2, and an exposed portion 1b of the bare IC chip 1 is provided at a central portion of the back surface. The other points are the same as those of the semiconductor device according to the first embodiment, and the description is omitted.

The thin resin film 2a formed on the back side of the bare IC chip 1 is, as shown in FIG.
The thickness is formed thickest at a portion corresponding to the edge portion 1c of the bare IC chip 1 and gradually becomes thinner toward the central portion of the bare IC chip 1. The maximum thickness H of the resin film 2a can be arbitrarily adjusted according to the total thickness of the semiconductor device to which the resin film 2a is applied, but is set to 10 μm to 100 μm when applied to a thin semiconductor device. be able to. Of course, the resin layer formed on the circuit forming surface side and the side surface of the bare IC chip 1 can be made thicker.

As shown in FIG. 5, the first package member 2 is formed on the mating surface of the upper mold 11 and the lower mold 12 with dimensions and dimensions corresponding to the first package member 2 to be molded.
A cavity 13 having a shape is formed.
This can be performed using a mold having an air flow path 12c for vacuum-suctioning the chip 1. That is, the center of the flat portion 12a formed on the lower die 12 is aligned with the center of the bare IC chip 1, and the peripheral portion of the bare IC chip 1 is overhanged above the inclined portion 12b formed on the lower die 12. Then, the bare IC chip 1 is vacuum-sucked to the flat portion 12a. In this state, when the upper mold 11 and the lower mold 12 are integrally combined, and the thermosetting resin is filled into the cavity 13 from the gate section 15, the chip exposed section 1b corresponding to the plane section 12a of the cavity 13 is inclined. The first package member 2 having a required shape and a resin film 2a corresponding to the portion 12b can be formed.

The formation of the second package member 3 can be performed by the apparatus and method shown in FIG.

The semiconductor device of this embodiment has the same effects as the semiconductor device according to the first embodiment, and furthermore, since the chip exposed portion 1b is provided on the back surface of the bare IC chip 1, an expensive thermosetting resin is used. The amount used can be reduced, and the manufacturing cost can be further reduced. In addition, bare IC
The destruction of the chip 1 occurs when stress concentrates on a defective portion such as chipping or crack generated on an outer peripheral portion of the back surface of the bare IC chip in a polishing process or a dicing process of the silicon wafer. If the outer peripheral portion is molded with the resin film 2a, the point pressure strength of the bare IC chip 1 can be sufficiently increased even if the chip exposed portion 1b is provided on the back surface of the bare IC chip 1.

Next, a third embodiment of the semiconductor device according to the present invention will be described with reference to FIGS. FIG. 6 is a cross-sectional view of a semiconductor device according to the third embodiment, and FIG. 7 is a cross-sectional view illustrating a first package member forming apparatus and method.

As is apparent from FIG. 6, the semiconductor device of this embodiment has a bare IC chip 4 having no built-in antenna coil and a gold bump or a nickel bump provided on the input / output terminal 4a of the bare IC chip 4. An antenna coil 6 made of a winding coil directly connected to the first package member 5 is sealed with a first package member 2 made of a thermosetting resin such as an epoxy resin, and the periphery of the first package member 2 is sealed. For example, sealing with a second package member 3 made of a thermoplastic resin such as ABS resin, polypropylene resin, vinyl chloride resin or polyethylene terephthalate resin, and finishing into a predetermined shape such as a card shape, a tag shape, a button shape or a coin shape. It is characterized by having. The other points are the same as those of the semiconductor device according to the first embodiment, and the description is omitted.

The antenna coil 6 according to this embodiment is
Is a wire rod made of a good conductive metal material such as copper or aluminum covered with an insulating layer such as resin, or a bonding metal layer such as gold or solder and an insulating layer around the core wire. The wire coated in this order is formed by turning several to several tens of times in accordance with the characteristics of the bare IC chip 4. The diameter of the wire is preferably 20 μm to 100 μm. The antenna coil 6 is connected to the gold bump or the nickel bump 5 provided on the input / output terminal 4a of the bare IC chip 4 by a method such as wedge bonding, solder connection, welding, or conductive paste.

As shown in FIG. 7, the first package member 2 is formed on the mating surface of the upper mold 11 and the lower mold 12 with dimensions and dimensions corresponding to the first package member 2 to be molded.
A cavity 13 having a shape is formed.
A mold having one or more pins 14 for fixing the bare IC chip 4 therein is used to house the bare IC chip 4 to which the antenna coil 6 is connected in the cavity 13, and After fixing the bare IC chip 4 at a predetermined position in the cavity 13 with the pin 14, the cavity 13 can be filled with a thermosetting resin from the gate portion 15.

The formation of the second package member 3 can be performed by the apparatus and method shown in FIG.

The semiconductor device of this embodiment has the same effects as the semiconductor device according to the first embodiment. In addition, a bare IC chip having no built-in antenna coil is used as the bare IC chip 4 and the antenna coil 6 is used as the bare IC chip. Since a wound coil is used, an IC chip 1 with a built-in antenna coil
Since the diameter of the coil can be increased as compared with the case of using, the communication distance can be increased.

In this embodiment, a bare IC
Although the entire chip 4 and the antenna coil 6 are sealed with the first package member 2, as shown in FIG. 8, the antenna coil connected to the bare IC chip 4 and the input / output terminal 4 a of the bare IC chip 4. 6 can be sealed with the first package member 2 only.

In this embodiment, a bare IC
The chip 4 and the antenna coil 6 were housed in the mold cavity 13 as they were to form the first package member 2, but as shown in FIG. 9, the bare IC chip 4 and the bare IC chip 4 The first package member 2 can also be formed by housing the integrated antenna coil 6 with the potting resin 7 in advance in the cavity 13 of the mold.

Next, a fourth embodiment of the semiconductor device according to the present invention will be described with reference to FIGS. FIG.
0 is a sectional view of the semiconductor device according to the fourth embodiment, and FIG.
FIG. 2 is a cross-sectional view showing a forming device and a forming method of a first package member.

As can be seen from FIG. 10, the semiconductor device of this embodiment has a bare IC chip 4 having no built-in antenna coil and a gold bump or a nickel bump provided on the input / output terminal 4a of the bare IC chip 4. 5 and an antenna coil 6 composed of a winding coil connected to the lead 8. The bare IC chip 4 and the lead 8 are made of a thermosetting resin such as an epoxy resin. And the periphery of the antenna coil connected to the first package member 2 and the lead 7, for example, an ABS resin, a polypropylene resin, a vinyl chloride resin or a polyethylene terephthalate resin. And sealed in a second package member 3 made of a thermoplastic resin of a predetermined shape such as a card shape, a tag shape, a button shape or a coin shape. Characterized in that it finished in. The other points are the same as those of the semiconductor device according to the first embodiment, and the description is omitted.

The leads 8 may be formed of a lead frame made of a conductive metal material having relatively high rigidity, or may be formed of a wiring tab provided with a conductive pattern on an insulating resin substrate. Can also be used. The connection between the lead 8 and the gold bump or the nickel bump 5 and the connection between the lead 8 and the antenna coil 6 can be performed by thermocompression bonding, solder connection, welding, conductive paste connection, ultrasonic fusion welding, or the like.

The first package member 2 is formed as shown in FIG.
As shown in FIG. 1, a cavity 1 having a size and shape corresponding to the first package member 2 to be formed with the sandwiching portion 16 of the lead 7 is provided on the mating surface of the upper mold 11 and the lower mold 12.
After the bare IC chip 4 is fixed at a predetermined position in the cavity 13 by sandwiching the lead 7 in the sandwiching portion 16 using a mold in which the mold 3 is formed, a thermosetting resin is injected into the cavity 13 from the gate portion 15. It can be performed by filling a resin. After the formation of the first package member 2, the antenna coil 6
It is connected to the tip of the lead 7 that protrudes more.

The second package member 3 is formed by integrating the bare IC chip 4 sealed with the first package member 2 and the antenna coil 6 with a potting resin as shown in FIG. It can be performed by setting in a mold and filling the cavity 23 with a thermoplastic resin from the gate portion 25.

The semiconductor device of this embodiment has the same effects as those of the semiconductor device according to the third embodiment. In addition, since the input / output terminal 4a of the bare IC chip 4 and the antenna coil are connected via the leads 8, The bare IC chip 4 and the antenna coil can be firmly connected, and the reliability of the semiconductor device can be improved.

Next, a fifth embodiment of the semiconductor device according to the present invention will be described with reference to FIG. FIG. 12 is a sectional view of a semiconductor device according to the fifth embodiment.

As is apparent from FIG. 12, the semiconductor device of this embodiment has a bare IC chip 4 having no built-in antenna coil and an antenna coil 10 composed of a planar coil formed on the surface of a printed circuit board 9. The printed circuit board 9 and the bare IC chip 4 mounted thereon are sealed with a first package member 2 made of a thermosetting resin such as an epoxy resin, and the first package member 2 is sealed. Around, for example, ABS resin, polypropylene resin,
It is sealed with a second package member 3 made of a thermoplastic resin such as a vinyl chloride resin or a polyethylene terephthalate resin, and finished in a predetermined shape such as a card shape, a tag shape, a button shape or a coin shape. The other points are the same as those of the semiconductor device according to the first embodiment, and the description is omitted.

The antenna coil 10 can be formed by printing on the surface of the printed circuit board 9 or by etching a copper foil formed on the surface of the printed circuit board 9. The bare IC chip 4 is mounted face-down on a pad 10a provided on a part of the antenna coil 10. Bare IC chip 4
The electrical connection between the antenna coil 10 and the antenna coil 10 can be made using a conductive paste or a conductive anisotropic body.

The first package member 2 can be formed by the apparatus and method shown in FIG. Also, the second
The package member 3 can be formed by the apparatus and method shown in FIG.

The semiconductor device of this embodiment has the same effects as the semiconductor device according to the third embodiment. In addition, since the planar coil formed on the surface of the printed circuit board 9 is used as the antenna coil 10, the winding coil In this case, the handling of the antenna coil 10 is easier than in the case of using the semiconductor device, and the productivity of the semiconductor device can be increased. The printed circuit board 9
And the bare IC chip 4 are integrally sealed.
The protection effect of the chip 4 is high, and the durability and reliability of the semiconductor device can be improved.

Hereinafter, the effects of the present invention will be clarified with reference to more specific examples and comparative examples.

First Embodiment 2 mm square and 0.65 mm thick
A first package member 2 made of epoxy resin and having a thickness of 0.1 mm was molded over the entire outer periphery of the IC chip 1 with a built-in antenna coil having a thickness of 0.1 mm. The molding of the first package member 2 was performed using the mold shown in FIG. 2, and the resin temperature during molding was set to about 200 ° C. In addition, 17
Heating was performed at 0 ° C. for 2 hours to perform a secondary curing treatment of the mold resin. Next, a second package member 3 made of ABS resin is molded around the outer periphery of the molded product.
A non-contact IC tag A having a thickness of 0 mm and a thickness of 2 mm was obtained. The molding of the second package member 3 was performed using the mold shown in FIG. 3, and the resin temperature during molding was about 130 ° C.

Second Embodiment 2 mm square and 0.65 mm thick
A 0.1 mm thick first package member 2 made of a thermosetting epoxy resin was molded on a part of the circuit forming surface side, the side surface, and the back surface of the IC chip 1 with a built-in antenna coil having a thickness of 0.1 mm. The molding of the first package member 2 was performed using a mold shown in FIG. Other conditions are the same as those in the first embodiment, and the diameter is 20 mm.
To obtain a non-contact IC tag B having a thickness of 2 mm.

<First Comparative Example> 2 mm square and 0.65 mm thick
After the outer periphery of the IC chip 1 with a built-in antenna coil of 1 mm is molded with epoxy resin,
A secondary cure treatment for 2 hours was performed to obtain a non-contact IC tag C having a diameter of 20 mm and a thickness of 2 mm.

<Second comparative example> 2 mm square and 0.65 thickness
mm around the circumference of the IC chip 1 with a built-in antenna coil
Molded with S resin, diameter 20mm and thickness 2mm
Was obtained.

The four types of non-contact IC tags A, B,
For C and D, a thermal shock test and a repeated bending test were performed to compare sealing reliability and flexibility. FIG. 12 shows the test results. In addition, the thermal shock test was -3.
10 cycles were performed between the liquid phases at 0 ° C. and + 70 ° C., the immersion time in each liquid phase was 5 minutes, and the movement was performed within 10 seconds.
On the other hand, the repetitive bending test is for an IC with built-in antenna coil.
A constant load was repeatedly applied to the embedded portion of the chip 1, and the number of times until a crack was generated was observed.

As is clear from FIG. 13, the non-contact IC tags A and B, which are the products of the embodiment of the present invention, operate the IC chip 1 with the built-in antenna coil even after the thermal shock test of 10 cycles. No abnormalities occurred, and no cracks occurred in the antenna chip with built-in antenna coil 1 and the casing members 2 and 3 even after the repeated bending test of 100 cycles. On the other hand, the non-contact IC tag C, which is a comparative example product, did not show any abnormality in the operation of the IC chip 1 with the built-in antenna coil in the 10-cycle thermal shock test, but was subjected to the 7-cycle repetitive bending test. Cracks occurred in the mold resin. In addition, non-contact IC tag D
No cracks occurred in the antenna coil built-in type IC chip 1 and the mold resin in the 100-cycle repetitive bending test, but abnormalities occurred in the operation of the antenna coil built-in type IC chip 1 in the 10-cycle thermal shock test. .

From these test results, it was found that the product of the present invention was superior to the product of the comparative example in both the sealing reliability and the flexibility.

[0057]

According to the first aspect of the present invention, the outer peripheral portion of the IC chip is sealed with a thermosetting resin having high adhesion to the IC chip, high strength, and excellent heat resistance and water resistance. Furthermore, since the periphery of the first package member made of the thermosetting resin is inexpensively sealed with a thermoplastic resin having excellent flexibility, the sealing reliability is high,
Moreover, a semiconductor device having excellent flexibility can be obtained.

According to the second aspect of the present invention, since an IC chip with a built-in antenna coil is used as the IC chip, there is no inconvenience such as disconnection or poor contact as long as the IC chip itself is not destroyed. IC at the time
The handling of the chips is easy, and the yield of non-defective products can be significantly increased.

According to the third aspect of the present invention, since the winding coil is used as the antenna coil, the communication distance of the semiconductor device can be increased as compared with the case where an IC chip with a built-in antenna coil is used.

According to the fourth aspect of the present invention, the IC chip and the lead connected to the input / output terminal of the IC chip are integrally sealed with a thermosetting resin, and the coil is wound around the lead. Since the connection is made, the connection between the IC chip and the winding coil can be further strengthened, the handling of the IC chip at the time of manufacturing can be facilitated, and the reliability of the semiconductor device can be improved.

According to the fifth aspect of the present invention, since a planar coil formed on a printed circuit board is used as the antenna coil, the handling of the antenna coil 9 becomes easier as compared with the case where a winding coil is used, and The productivity of the device can be increased. Also, printed circuit board and bare IC
Since the chip and the chip are integrally sealed, the effect of protecting the bare IC chip is high, and the durability and reliability of the semiconductor device can be improved.

According to the sixth aspect of the present invention, since bumps are formed on the input / output terminals of the IC chip, the connection between the IC chip and the antenna coil or the lead is made easier and more reliable, and non-defective products can be made more efficiently. Can be manufactured.

[Brief description of the drawings]

FIG. 1 is a sectional view of a semiconductor device according to a first embodiment.

FIG. 2 is a cross-sectional view illustrating a forming device and a forming method of a first package member.

FIG. 3 is a cross-sectional view showing a forming device and a forming method of a second package member.

FIG. 4 is a sectional view of a semiconductor device according to a second embodiment;

FIG. 5 is a sectional view showing a forming device and a forming method of a first package member.

FIG. 6 is a sectional view of a semiconductor device according to a third embodiment;

FIG. 7 is a cross-sectional view illustrating a forming device and a forming method of a first package member.

FIG. 8 is a sectional view showing a modification of the semiconductor device according to the third embodiment.

FIG. 9 is a sectional view showing another method of manufacturing the semiconductor device according to the third embodiment.

FIG. 10 is a sectional view of a semiconductor device according to a fourth embodiment.

FIG. 11 is a cross-sectional view illustrating a forming device and a forming method of a first package member.

FIG. 12 is a sectional view of a semiconductor device according to a fifth embodiment;

FIG. 13 is a table showing the effects of the present invention.

14A and 14B are a plan view and a cross-sectional view of a conventionally proposed non-contact type IC tag.

FIG. 15 is a plan view and a cross-sectional view of a conventionally proposed non-contact type IC button.

[Explanation of symbols]

 Reference Signs List 1 bare IC chip with built-in antenna coil 1a antenna coil 1b chip exposed portion 1c edge portion 2 first package member 2a resin film 3 second package member 4 bare IC chip without built-in antenna coil 4a input / output terminal 5 gold bump or Nickel bump 6 Winding coil (antenna coil) 7 Potting resin 8 Lead 9 Printed circuit board 10 Flat coil (antenna coil) 11 Upper die 12 Lower die 12a Flat part 12b Inclined part 12c Air flow path 13 Cavity 14 Support pin 15 Gate part 21 Upper mold 22 Lower mold 23 Cavity 24 Support pin

Claims (6)

[Claims] 1. A semiconductor device comprising an IC chip, an antenna coil, and a package member for integrally sealing the IC chip and the antenna coil, wherein an outer peripheral portion of the IC chip is made of a first thermosetting resin. A semiconductor device, wherein the semiconductor device is sealed with a package member and the periphery of the first package member is sealed with a second package member of a predetermined shape made of a thermoplastic resin. 2. The semiconductor device according to claim 1, wherein
A semiconductor device using an IC chip with a built-in antenna coil as the IC chip. 3. The semiconductor device according to claim 1, wherein
An IC chip having no built-in antenna coil is used as the IC chip, a winding coil is used as the antenna coil, and an input / output terminal of the IC chip is directly connected to the antenna coil. And the semiconductor device is integrally sealed using the first package member. 4. The semiconductor device according to claim 1, wherein
An IC chip having no built-in antenna coil is used as the IC chip, a winding coil is used as the antenna coil, and an input / output terminal of the IC chip is connected to the antenna coil via a lead.
A semiconductor device, wherein a C chip and a lead are integrally sealed using the first package member. 5. The semiconductor device according to claim 1, wherein
An IC chip having no built-in antenna coil is used as the IC chip, a planar coil formed on a printed circuit board is used as the antenna coil, and the IC chip is mounted on a pad portion of the planar coil. And a printed circuit board integrally sealed using the first package member. 6. The semiconductor device according to claim 3, wherein bumps are formed on input / output terminals of said IC chip.