JP2000286176A - Semiconductor substrate processing unit and display method of its processing status - Google Patents

Abstract

PROBLEM TO BE SOLVED: To recognize status of processing quickly and surely by showing detailed information about a selected portion of a displayed configuration diagram using a drawing or text, and by showing more detailed information about a selected portion of the detailed information. SOLUTION: A semiconductor substrate processing unit which processes wafers is installed in a room RA, containing a transfer machine 116 and processing chambers 101 and 102, which is isolated with a wall 125. The processing status of the semiconductor substrate processing unit, which processes wafers is shown on the display screen of a monitor and control terminal, recognizing the status of processing operation, state of wafer transfer, etc., in real time by using drawings or text. When a fault occurs somewhere in the unit, the faulty portion flashes in red or is indicated in two colors which are alternated. Selecting the faulty portion shows the corrective action with respect to the fault.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of displaying a processing status in a semiconductor substrate processing apparatus and a semiconductor substrate processing apparatus, and more particularly, to a processing status of a substrate to be processed in a semiconductor substrate processing apparatus and various parts of the semiconductor substrate processing apparatus. TECHNICAL FIELD The present invention relates to a method of displaying a processing status in a semiconductor substrate processing apparatus and a semiconductor substrate processing apparatus capable of displaying a situation such as a failure of the semiconductor substrate in a state easily understood by an operator.

[0002]

2. Description of the Related Art Generally, a semiconductor substrate processing apparatus includes an etching apparatus, an ashing apparatus, a sputtering apparatus, a CVD apparatus, and the like as main components, and further includes a semiconductor wafer (hereinafter simply referred to as a wafer) provided by an atmospheric transfer robot. ), And a transfer machine (atmosphere loader) for transferring wafers from the wafer carrier to the transfer chamber. The processing status of the semiconductor substrate processing apparatus is generally displayed on a display screen of a terminal that performs monitoring and control by a system diagram, a substrate state display diagram, an exhaust system diagram, and the like.

[0003]

Since the display of the processing status according to the prior art described above is displayed by a system diagram or the like, it is not possible to directly notify the operator of the actual status inside the apparatus. When a failure occurs in the device, even if the location of the failure is displayed in the system diagram, the location of the failure in the device cannot be known unless it is an operator who is somewhat familiar with the configuration of the device. Have a point.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problem of the display of the processing status according to the prior art, so that the operator can easily and quickly know the status inside the apparatus, and even if a failure occurs, the operator can find out where the failure occurs. Provided is a method of displaying a processing status in a semiconductor substrate processing apparatus and a semiconductor substrate processing apparatus capable of displaying a state inside the apparatus so that a specific position of the apparatus can be known as to whether a failure has occurred in the apparatus. Is to do.

[0005]

According to the present invention, there is provided a method for displaying a processing status in a semiconductor substrate processing apparatus for processing a semiconductor substrate which forms a semiconductor device on a semiconductor substrate. On the display screen of the terminal that monitors and controls the processing status, a configuration diagram of the semiconductor substrate processing apparatus composed of a plurality of rooms is displayed, and when a part of the displayed configuration diagram is selected, it is selected. This is achieved by displaying detailed information on the selected part by drawing or text, and when a part of the detailed information is selected, displaying more detailed information on the selected part.

The object of the present invention is that, when a part of the detailed information on the selected part displayed by the drawing or the character on the selected part is selected, the maintenance on the selected part is performed. This is achieved by sequentially displaying information on the inspection procedure and the necessity of component replacement.

[0007] Further, the object is that the displayed configuration diagram and the orientation of the displayed device are set so that the displayed configuration diagram looks the same as when the actual device is viewed from the position where the display screen is viewed. This is achieved by displaying so that

The object of the present invention is to provide a display device in which, when a failure occurs, a failure occurrence location in the displayed configuration diagram is blinked and a plurality of colors are switched or displayed in a color different from the surroundings. When the fault occurrence location is selected, the details of the fault are displayed, and when a part of the details of the fault is selected, a method for dealing with the fault is displayed.

Further, the object of the present invention is to provide a method for displaying a processing status in a semiconductor substrate processing apparatus for processing a semiconductor substrate on which a semiconductor device is formed on a semiconductor substrate, comprising: inputting a parameter as a processing condition of the semiconductor substrate processing apparatus; By making a determination or displaying an input screen that can be switched between a display format of a table format and a display format for displaying actual parameters, the processing conditions can be set in the display format of the table format or the graph format. Editing is possible and is achieved by having the result of editing in one format be reflected in the other format.

[0010] Further, the above-mentioned object is achieved when an arbitrary parameter is selected from the processing conditions displayed in the table format.
Achieved by displaying the parameter in a graph format and, when an arbitrary parameter is selected from the processing conditions displayed in the graph formula, displaying the parameter in a table format. Is done.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method for displaying a processing status in a semiconductor substrate processing apparatus and a semiconductor substrate processing apparatus according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view illustrating a configuration example of a semiconductor substrate processing apparatus to which a display method according to an embodiment of the present invention is applied. First, a configuration of a semiconductor substrate processing apparatus and a processing operation thereof will be described. In FIG. 1, 101, 102
Are processing chambers A and B, 103 and 104 are doors of processing chambers A and B,
105 is an exhaust port, 106 is a transfer chamber, 107 and 108 are cooling chambers A, B, and 109 are vacuum arms, 110 is a load lock chamber, 111 is an unload lock chamber, and 112-1.
15 is a door, 116 is a transfer machine, 117 is an alignment unit,
118 is an atmospheric arm, 119 is a cleaning substrate, 12
0 is a load port, 121 is a wafer carrier, 122 is a wafer carrier door, 123 is an unprocessed wafer, 124 is a processed wafer, and 125 and 126 are walls.

As shown in FIG. 1, a semiconductor substrate processing apparatus to which the present invention is applied includes processing chambers 101 and 102 which are vacuum chambers during processing, a transfer chamber 106, a load lock chamber 110, and an unload lock chamber. 111, a transfer machine 116 at atmospheric pressure, and a plurality of load ports 120. The processing chambers 101 and 102 are chambers for performing processing using a plasma on a wafer, which is a semiconductor substrate transferred into the processing chamber, and doors 103 and 104 are provided between the processing chamber 101 and the transfer chamber 106 so that the wafer can be set. After that, the process is performed with the doors 103 and 104 closed.

The transfer chamber 106 is evacuated during operation of the apparatus and has cooling chambers 107 and 108. In the transfer chamber 106, the wafer to be processed is received from the transfer device 116 via the load lock chamber 110, transferred into the processing chambers 101 and 102, and the processed wafer is taken out from the processing chambers 101 and 102. After cooling in the cooling chambers 107 and 108, the unload lock chamber 11
An arm (hereinafter, referred to as a vacuum arm) 109 of a transfer robot that operates in a vacuum state and has two arms that return to the transfer device 116 through the transfer arm 1 is provided. The cooling chambers 107 and 108 are cooling locations configured as a part of the transfer chamber 106, and are not independent of the transfer chamber 106 by providing a door or the like between the cooling chambers 107 and 108. Here, it will be referred to as a cooling room.

The load lock chamber 110 and the unload lock chamber 111 function as buffer chambers for transferring wafers between the transfer chamber 106 and the transfer device 116. Each time a wafer is transferred, a vacuum is drawn. Or controlled to atmospheric pressure. For this reason, a door is provided between the transfer chamber 106 and the transfer device 116. When an unprocessed wafer is transferred from the transfer device 116 to the processing chamber 101 or 102, the door 114 on the transfer device 116 side is opened while the door 112 on the transfer chamber 106 side of the load lock chamber 110 is closed. The wafer is transferred from the transfer device 116 to the load lock chamber 110 with the inside thereof at atmospheric pressure, and the door 114 on the transfer device 116 side is set.
Is closed. Thereafter, when the load lock chamber 110 is evacuated to a vacuum state, the door 1 on the transfer chamber 106 side is closed.
12 is opened, and the wafer is taken into the transfer chamber 106 by the vacuum arm 109.

When the processed wafer is transferred from the transfer chamber 106 to the transfer machine 116, the unload lock chamber 11
With the door 115 on the transfer machine 116 side closed, the door 113 on the transfer chamber 106 side is opened (at this time, the unload lock chamber 111 is in a vacuum state), and the processed wafer is transferred to the vacuum arm 109. To the unload lock chamber 111. Thereafter, the door 113 on the transfer chamber 106 side is closed, the atmosphere is introduced into the unload lock chamber 111 to be in an atmospheric pressure state, the door 115 on the transfer device 116 side is opened, and the processed wafer is transferred to the transfer device 116 side. To be transported.

The transfer machine 116 operates at atmospheric pressure,
An unprocessed wafer brought in from the outside is transferred to the processing chamber, and a function as an interface for transferring a processed wafer from the processing chamber to the outside is executed. The transfer machine 116 transfers an unprocessed wafer brought in from the outside to the processing chamber side, and transfers the processed wafer from the processing chamber side to the outside. Arm (hereinafter referred to as atmospheric arm)
118 and an alignment unit 117 for aligning a wafer to be transferred to the processing chamber.

The atmospheric arm 118 in the transfer machine 116 takes out an unprocessed wafer from the wafer carrier 121 mounted on a predetermined one of the plurality of load ports 120 and transports the unprocessed wafer to the alignment unit 117 to perform alignment. The completed unprocessed wafer is transported to the load lock chamber 110, and conversely, the processed wafer is transferred to the unload lock chamber 111.
From the wafer carrier 12 on the predetermined load port 120
Convey to 1

A plurality of load ports 120 are provided for the transfer machine 116 of one substrate processing apparatus, and a wafer carrier 121 accommodating a plurality of unprocessed wafers in the inside carried from the outside is provided. Is placed. When an unprocessed wafer in the wafer carrier 121 is transported to the processing chamber side, the door 122 of the wafer carrier 121 and the transfer machine 11 (not shown) are provided by a mechanism provided in the load port 120.
The door on the sixth side is opened, and the unprocessed wafer is taken out of the wafer carrier 121 by the atmospheric arm 118 in the transfer machine 116 and taken into the transfer machine 116.

In the semiconductor substrate processing apparatus for processing a wafer by the processing operation as described above, the portion from the transfer device 116 to the processing chambers 101 and 102 is divided by a wall 125.
It is installed in one room RA. The room in which the entire processing apparatus is installed is connected to the load port 120 by the wall 126.
RB in which room is installed, and room R surrounding room RA described above.
C. And the above-mentioned rooms RA, R
In B and RC, the air in each room is maintained at a predetermined cleanness or less.

The room RB is a room serving as a transfer line. Since the wafer may be directly exposed to the room air for setting the wafer on the wafer carrier 121 and inspecting the wafer, the room RB has the highest cleanliness. This room needs to be kept high. Further, the room RC is a place where workers and the like frequently enter and leave, and it is a room where it is not necessary to increase the cleanliness so much. Further, in the room RA, the operation panel may be removed or the inside of the device may be opened for maintenance of the device or the like. In order to prevent dust from entering the inside of the device, the room RA is maintained at a clean degree next to the room RB. It is necessary to keep it as clean as possible in the room RB if possible. When a wafer is transported in a sealed container such as a FOUP and combined with a transfer machine, if the cleanness of only the inside of the transfer machine is increased, the cleanness of the room RB is reduced. There is no need to hold that high.

The display of the processing status in the semiconductor substrate processing apparatus according to the embodiment of the present invention has the above-described configuration, and the display of the processing status of the semiconductor substrate processing apparatus for processing a wafer is performed by the display screen of the monitoring control terminal. The configuration diagram of the semiconductor substrate processing apparatus is displayed above, and the status of processing operations inside the apparatus, the state of wafer transfer, the occurrence of a failure, and the like are displayed in real time. The configuration diagram shown is also one of the screen examples displayed on the display screen.

In the example shown in FIG.
3, the processed wafer 124 and the cleaning substrate 119 are shown, but when these are displayed on the display screen,
By changing the display color or the like, these wafers are displayed so that they can be distinguished. For example, the unprocessed wafer 123 is gray, the processed wafer 124 is iridescent, and the cleaning substrate 11 is
9 is displayed in yellow. The cleaning substrate 119
Is used as a cover for protecting the substrate holder when cleaning dirt on the peripheral walls of the processing chambers 101 and 102.

In the example shown in FIG. 1, the processing chamber A1
01 indicates that it is currently being processed, for example,
The display color of the plurality of exhaust ports 105, which are displayed in a light red-purple color, which is the discharge color of argon, and the processing time of the wafer being processed, is displayed in a substantially circular shape around the processing chamber, for example, so as to be brightly displayed. Changed and displayed. In this case, when all of the plurality of exhaust ports 105 arranged in a substantially circular shape have a bright display, it indicates that the processing on the wafer to be processed has been completed.

In the example shown in FIG. 1, the processing chamber B102 is displayed in pink, for example, to indicate that the processing chamber B102 is in a standby state in which a wafer can be processed. In addition, as described above, the load lock chamber 110 and the unload lock chamber 111 are subjected to the atmospheric pressure when transferring the wafer,
Since a vacuum is applied, for example, pink is displayed when the vacuum is applied, and light blue when the atmospheric pressure is applied.

Further, the surrounding rooms RA, RB, and RC including the room where the apparatus described above is installed are the background parts of the displayed apparatus. For example, by changing the density of the room and displaying it, it is displayed so that the cleanliness of each room is different.

FIG. 2 is a diagram for explaining a change in a display example of the device displayed on the display screen due to the arrangement of the semiconductor substrate processing apparatus and the monitoring control terminal, which will be described below.

The display according to the embodiment of the present invention is arranged such that, when an operator views the display screen of the monitor control terminal (not shown), the displayed installation status of the device matches the actual installation status of the device. Display is performed. In other words, as shown in FIG. 2A, the monitoring control terminal may be placed in any of the positions A to D around the device, but the operator views the display screen of the monitoring control terminal. However, it is arranged at a position where it is possible to see the actual device installed behind the monitoring control terminal (assuming that the opposite side is visible even if there is a wall or the like).

Then, when the monitoring control terminal is arranged on the side A so that the display screen can be viewed from the side of the side A, as shown in FIG. The device is displayed in the same arrangement as when viewing the actual device from. Similarly, when the monitoring control terminal is arranged on the side of B, C, and D so that the display screen can be viewed from each of the directions of B, C, and D, FIGS. d), FIG.
As shown in (e), the devices are displayed on the display screen in the same arrangement as when the actual device is viewed from each direction.

Although the display example shown in FIG. 2 shows the processing device in a plan view, the display screen is also displayed in a three-dimensional manner. The device is displayed in the same arrangement as when viewing the device. In addition, according to the present invention, regardless of the installation position of the monitoring control terminal, switching can be performed by a switch or the like provided on the terminal, and a display as viewed from each direction as described above can be performed.
Further, according to the present invention, the same display as described above can be performed even when another monitoring control terminal is installed as a local terminal not in the vicinity of the processing device but in a remote place away from the processing device.

According to the embodiment of the present invention, by performing the above-described display, an operator who is looking at the display screen of the monitoring and control terminal can be used in the event that a failure occurs in a displayed portion. It is possible to immediately understand the correspondence between the failed part and the part of the actual device, and it is possible to quickly deal with the failure.

FIG. 3 is a diagram for explaining a change in a display screen in a state where the semiconductor substrate processing apparatus is started up so as to be capable of performing a processing operation. This will be described next.

FIG. 3A shows an example of a screen immediately after the power switch is turned on. The transfer apparatus 116 used under atmospheric pressure and a plurality of load ports 120 are shown in FIG.
Are displayed brighter than the other parts, and the transfer device 116,
This indicates that a plurality of load ports 120 can be used. In this example, the processing chambers 101 and 102, the transfer chamber 106, the load lock chamber 110, and the unload lock chamber 1 that can be processed only after the vacuum state is reached.
No. 11 has not been prepared yet, and is darkly displayed in a color similar to the background color.

The workers are processing chambers 101 and 102, transfer chamber 106, load lock chamber 110, and unload lock chamber 1.
When the process is to be started by setting the vacuum to 11, a soft button (not shown) displayed on the screen is selected with a mouse cursor, or a finger is touched on the soft button if the display screen has a touch panel function. Thus, the apparatus is controlled so that the processing chambers 101 and 102, the transfer chamber 106, the load lock chamber 110, and the unload lock chamber 111 can be exhausted.

When the evacuation of the apparatus is instructed and the evacuation is possible, as shown in FIG. 3B, the processing room 10 which is a room requiring a plurality of evacuation displayed on the display screen.
1, 102, the transfer chamber 106, the load lock chamber 110, and the unload lock chamber 111, an exhaust button corresponding to each of those rooms is displayed. When the operator selects the displayed exhaust button in the same manner as described above, the exhaust of the corresponding room is started. The example shown in FIG.
In this example, the completion of the exhaust of the load lock chamber 110 is displayed by brightly displaying the load lock chamber 110, and the other rooms are darkly displayed as the exhaust has not been started yet. When the evacuation button is selected and the evacuation of the apparatus is started, a time until the evacuation is completed is displayed near the button as the remaining evacuation time. In the illustrated example, the remaining time is indicated by a numeral, but the remaining time until the end of exhaust may be displayed by a picture such as an hourglass or a clock face.

FIG. 3C shows a state in which the exhaust of each room has been advanced as described above, and the transfer chamber 106, the load lock chamber 110, and the unload lock chamber 111 have been completely exhausted. As in the case described above, the room in which the exhaust is completed is displayed brightly, and the completion of the exhaust is displayed. Processing chamber 101,
102 is also displayed brightly when exhaust is completed.

As described above, according to the embodiment of the present invention, when the apparatus is started up before the start of the work, the preparation status of each part in the apparatus is displayed for each part constituting the apparatus, and the completion of the preparation is indicated. It is possible to reliably inform the worker.

FIGS. 4 to 7 are views for explaining an example in which the status of the processing of the wafer is displayed according to the processing procedure. Next, referring to FIGS. 4 to 7, the processing of the wafer will be described. The status display will be described.

When the apparatus is ready to start processing according to the procedure described with reference to FIG. 3, all of the apparatuses are displayed bright as shown in FIG. When the operator instructs the start of the processing on the wafer by using a soft button or the like, FIG.
As shown in (b), the atmospheric arm 11 in the transfer machine 116
8 moves to the position of the load port 120 where the wafer carrier 121 containing the unprocessed wafer 123 is placed.

Next, as shown in FIG. 4 (c), the wafer carrier door 122 is opened, and the atmospheric arm 118 takes in the unprocessed wafer 123 into the transfer device 116.
As shown in (d), the unprocessed wafer 123 is transported to the alignment unit 117. When the alignment of the unprocessed wafer 123 is completed, the color around the unprocessed wafer 123 placed in the alignment unit 117 changes to green, as shown in FIG. Is displayed. Then, the atmospheric arm 118
As shown in (f), the wafer having undergone the alignment process is transported to the position of the load lock chamber 110. In addition,
At this point, the load lock chamber 110 is controlled to be in an atmospheric pressure state.
For example, it is displayed in light blue to indicate that it is at atmospheric pressure.

Next, the transfer machine 11 in the load lock chamber 110
The door 114 on the sixth side is opened, and the atmosphere arm 118 is moved to the position shown in FIG.
As shown in (a), the unprocessed wafer 123 is carried into the load lock chamber 110. After the atmosphere arm 118 has evacuated,
The door 114 of the load lock chamber 110 on the transfer machine 116 side is closed, and the load lock chamber 110 is evacuated. Thereafter, as shown in FIG. The door 112 is opened.

Next, as shown in FIG.
The vacuum arm in 06 extends into the load lock chamber 110, takes out the unprocessed wafer 123, and carries it into the processing chamber A101 with the door 103 opened as shown in FIG. At this time, the door 112 on the transfer chamber 106 side of the load lock chamber 110 has already been closed. Next, processing chamber A
The door 103 of 101 is closed, and as shown in FIG. 5E, a reaction gas or the like necessary for processing a wafer is injected into the processing chamber A101. The state of the injection of the reaction gas or the like is indicated by, for example, displaying the processing chamber in purple or displaying a gas supply pipe. When the injection of the reaction gas or the like is completed, the processing of the wafer using the plasma is started, and during this processing, the processing chamber A101 is in a state where the processing chamber A101 is discharging with a thin red purple according to the shape of the discharge pattern, for example. It is displayed to simulate. In this case, the elapse of the processing time is displayed by changing the color of the exhaust port as described above. The elapsed time may be displayed on another indicator on the display screen, which indicates the time.

When the processing in the processing chamber A101 is completed, the wafer in the processing chamber A101 is displayed in a rainbow-colored state to indicate that the processed wafer 124 has been processed.
As shown in (a), the door 103 of the processing chamber A101 is opened. The vacuum arm 109 in the transfer chamber 106 is
As shown in FIG. 6B, the processed wafer is taken out of the processing chamber A101, and the processed wafer is transferred to the cooling chamber A107 as shown in FIG. 6C. After the processed wafer is cooled in the cooling chamber A107, as shown in FIG. 6D, it is taken out of the cooling chamber A107 by the vacuum arm 109, and as shown in FIG. Is transported into the unload lock chamber 111 where the door 113 is opened. Thereafter, as shown in FIG. 6F, the door 113 on the transfer chamber 106 side of the unload lock chamber 111 is closed.

Next, the unload lock chamber 111 is brought to the atmospheric pressure state, for example, as shown in FIG. 7A, by displaying the unload lock chamber 111 in light blue. When the unload lock chamber 111 is at atmospheric pressure, the door 115 on the transfer device 116 side of the unload lock chamber 111 is opened, and as shown in FIG.
6 and the unload lock chamber 111
The processed wafer is taken out and transferred into the transfer device 116 as shown in FIG. At this time, the door 115 on the transfer machine 116 side of the unload lock chamber 111 is closed, and as shown in FIG.
11 is exhausted.

The atmosphere arm 118 in the transfer device 116 carries the wafer and moves to a predetermined position of the load port 120, and the door 122 on the load port 120 is opened as shown in FIG. The processed wafer is transferred to a wafer carrier. When the atmospheric arm is retracted, a series of processing operations is completed, and the apparatus is in an initial state as shown in FIG.

The display of the wafer processing described above is 2
Although it has been described that one wafer is processed using one of the two processing chambers, when processing is performed using two processing chambers, the operations of the above-described processing are performed in a combined state. Will be In addition, some semiconductor substrate processing apparatuses further include a large number of processing chambers. In such a case, the processing using a plurality of processing chambers can be performed in an overlapping manner by combining the processing operations described above.

In the above description, the transfer chamber 106
Although it is not described how to use the two arms of the vacuum arm 109 inside, for example, one of the two arms is
It is used to transport a cold wafer, and the other is used to transport a hot wafer that has been processed in a processing chamber.

In the above description, the processing up to the normal end of processing of one wafer has been described.
If a failure occurs in any part of the device, for example, the part is displayed in red, flashing in red, or alternately displayed in different colors, and the worker looking at the display screen has a failure. Notify that it has occurred.

Then, when a failure occurs, the operator
By touching the place where the failure has occurred with a finger or selecting it with a mouse cursor, information on the place can be displayed on the display screen. Also,
Workers should touch the place with their finger if they want to see information about the place even when the operation is normal.
Alternatively, information on the location can be displayed on the display screen by selecting with a mouse cursor or the like.

FIG. 8 is a view for explaining an example of a screen on which information relating to the load lock room is displayed as an example in the case described above.

When the worker, for example, loads the load lock chamber 110,
Is displayed, a system diagram of the exhaust system and the gas supply system connected to the load lock chamber 110 is displayed as in the example shown in FIG. 8, and a reduced general view is displayed. Then, for example, when the display is performed while the load lock chamber 110 indicates a vacuum state, the degree of vacuum, the state of each gate valve, and the like are displayed. In the case where a failure has occurred, the failed portion, in the illustrated example, the failed valve, the exhaust device DRP1, and the like are displayed and shown in a color such as red. In the case of a failure such as insufficient vacuum, the vacuum switch VS, which is a sensor for detecting the degree of vacuum, is used.
The color 11 changes to red or the like to notify the operator of the abnormality.

Further, in the embodiment of the present invention, although not shown in the figure, when a portion displayed in a color such as red indicating a failure is selected, the details of the portion are displayed as described above, and at the same time, the display is performed. By further selecting the failed part, a countermeasure for the failure can be displayed.

Further, according to the embodiment of the present invention, except for an abnormality such as a failure, any part in the apparatus is selected, the details of the part are displayed, and then any part of the detailed display is displayed. By selecting a part, maintenance, inspection procedures, necessity of component replacement, and the like of the part can be sequentially displayed.

In the embodiments of the present invention described above, various situations or changes in situations in the apparatus are displayed by color or by changing colors. If it adversely affects the environment, the lighting of the environment in which the device is installed may be illuminated by a single color such as yellow, and the present invention selects a display color capable of discriminating the above-described colors even under such conditions. Good to keep.

Further, in the embodiment of the present invention, processing conditions such as processing gas injection conditions, microwave input conditions, and magnetic field generation conditions in the processing chamber can be input and set from the display screen of the monitoring control terminal. .

FIG. 9 is a view for explaining an example of a screen for setting processing conditions in the processing chamber, which will be described below.

FIG. 9A shows the processing conditions in the processing chamber in the form of a table. The table shows, for example, the processing step number, the processing time in each step, and the processing gas injection conditions in each step. , Microwave input conditions, magnetic field generation conditions, and other parameters.
In the illustrated table, “/” described in place of the parameter value changes between the parameter value of the previous step and the parameter value of the next step linearly in that step. It is shown that. This meaning may be indicated by a symbol other than “/”.

Prior to the start of the processing, the worker should
The processing conditions in a tabular form as shown in FIG. 3A are displayed on a display screen, and the processing time of each step and the parameters for determining the processing conditions in each step are input to set the processing conditions of the wafer. Such processing conditions may all be input by an operator, but generally, a table in which standard processing conditions stored in advance according to the processing content of the wafer are set is called, and the table is referred to. The middle processing condition may be changed. Also, a table of processing conditions used in the past may be stored, and one of these tables may be called up and used as it is or by changing the processing conditions in the table. The call of the past table can be performed by using keywords such as date and time of use, processing format of the substrate, type of the substrate, and the like.

On the display screen, a soft button "Graph" is displayed together with a table. When the operator selects this button, the contents of the table shown in FIG. As shown in FIG.
Displayed in graph format. The operator can edit the parameter displayed in the graph format on the screen by using a mouse or the like to change a change in the parameter with the passage of time. Then, a soft button "table" is displayed on the graph display screen, and the user can return to the display of the table by using the soft button. In the graph format,
When the above-described editing is performed, the result is reflected in tabular data.

When displaying a graph from a table,
When one parameter in the table is selected and then the button of “Graph” is selected, a graph for only that parameter is displayed. Thereby, the operator can easily confirm the change of the selected parameter with respect to the passage of time, particularly with respect to the parameters that are effective to be displayed in the graph format, without any extra information. Further, when one of the parameters displayed in the graph format is selected and then the button of “table” is selected, data only for the parameter is displayed in the table format. Thus, when there is a parameter whose detailed numerical data is desired to be confirmed on the display in the graph format, the operator can easily confirm the numerical data of the parameter without any extra information.

[0061]

As described above, according to the present invention, the operator can easily and quickly know the situation inside the apparatus, and when a failure occurs, it is possible to determine where the failure has occurred. The situation inside the device can be displayed so that it can be known as a specific position of the device.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a configuration example of a semiconductor substrate processing apparatus to which a display method according to an embodiment of the present invention is applied.

FIG. 2 is a diagram illustrating a change in a display example of a device displayed on a display screen due to an arrangement of a semiconductor substrate processing device and a monitoring control terminal.

FIG. 3 is a diagram illustrating a change in a display screen in a state where the semiconductor substrate processing apparatus is started up so as to be capable of performing a processing operation.

FIG. 4 is a diagram (part 1) for explaining an example in which a situation in which a wafer is being processed is displayed according to a processing procedure;

FIG. 5 is a diagram (part 2) for explaining an example in which a state of processing a wafer is displayed according to a processing procedure.

FIG. 6 is a diagram (part 3) for explaining an example in which a state in which a wafer is being processed is displayed according to a processing procedure;

FIG. 7 is a diagram (part 4) for explaining an example in which the state of processing a wafer is displayed according to the processing procedure.

FIG. 8 is a diagram illustrating an example of a screen on which information regarding a load lock room is displayed.

FIG. 9 is a diagram illustrating an example of a setting screen of processing conditions in a processing chamber.

[Explanation of symbols]

 101, 102 Processing chambers A, B 103, 104 Doors of processing chambers A, B 105 Exhaust port 106 Transfer chamber 107, 108 Cooling chamber A, B 109 Vacuum arm 110 Load lock chamber 111 Unload lock chamber 112-115 Door 116 Transfer Loading machine 117 Alignment unit 118 Atmospheric arm 119 Cleaning substrate 120 Load port 121 Wafer carrier 122 Wafer carrier door 123 Unprocessed wafer 124 Processed wafer 125, 126 Wall

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ryuichi Nemoto 1-280 Higashi-Koikekubo, Kokubunji-shi, Tokyo Inside the Design Laboratory, Hitachi, Ltd. F term in the design laboratory (reference) 5F004 AA00 BB18 BC08 CB20 5F045 AA08 AA19 BB08 BB10 BB20 DP01 DP02 DQ10 GB15

Claims (18)

[Claims] 1. A method for displaying a processing status in a semiconductor substrate processing apparatus for processing a semiconductor substrate on which a semiconductor device is formed on a semiconductor substrate, comprising the steps of: A configuration diagram of the semiconductor substrate processing apparatus including a plurality of rooms is displayed, and when a part of the displayed configuration diagram is selected, detailed information on the selected portion is displayed by drawing or text. A method of displaying a processing status in the semiconductor substrate processing apparatus, wherein, when a part of the detailed information is selected, more detailed information on the selected part is displayed. 2. A method for displaying a processing status in a semiconductor substrate processing apparatus for processing a semiconductor substrate on which a semiconductor device is formed on a semiconductor substrate, the method comprising: displaying a processing status of the semiconductor substrate processing apparatus on a display screen of a terminal; A configuration diagram of the semiconductor substrate processing apparatus including a plurality of rooms is displayed, and when a part of the displayed configuration diagram is selected, detailed information on the selected portion is displayed by drawing or text. Further, when a part of the detailed information is selected, information on maintenance, inspection procedures, and necessity of component replacement for the selected part is sequentially displayed. Display method. 3. A method for displaying a processing status in a semiconductor substrate processing apparatus for processing a semiconductor substrate forming a semiconductor device on a semiconductor substrate, the method comprising: displaying a processing status of the semiconductor substrate processing apparatus on a display screen of a terminal; A configuration diagram of the semiconductor substrate processing apparatus composed of a plurality of rooms is displayed, and the displayed configuration diagram is similar to that of a case where the actual apparatus is viewed from the position where the display screen is viewed. A display method for displaying a processing status in a semiconductor substrate processing apparatus, wherein the display is performed so that the installation direction and the displayed apparatus direction coincide with each other. 4. A method for displaying a processing status in a semiconductor substrate processing apparatus for processing a semiconductor substrate on which a semiconductor device is formed on a semiconductor substrate, the method comprising: displaying on a display screen of a terminal for monitoring and controlling the processing status of the semiconductor substrate processing apparatus; In addition to displaying the configuration diagram of the semiconductor substrate processing apparatus composed of a plurality of rooms, when a failure occurs, a failure occurrence location in the displayed configuration diagram blinks, and a plurality of colors are switched, or
A method for displaying a processing status in a semiconductor substrate processing apparatus, wherein the processing status is displayed in a color different from the surroundings. 5. When the failure occurrence location is selected, details of the failure are displayed, and when a part of the details of the failure is selected, a method for dealing with the failure is displayed. 5. A method for displaying a processing status in the semiconductor substrate processing apparatus according to claim 4. 6. A method for displaying a processing status in a semiconductor substrate processing apparatus for processing a semiconductor substrate on which a semiconductor device is formed on a semiconductor substrate, comprising inputting and determining parameters as processing conditions of the semiconductor substrate processing apparatus; A method for displaying a processing status in a semiconductor substrate processing apparatus, wherein an input screen capable of switching between a display format for displaying actual parameters and a display format for displaying parameters is displayed. 7. The processing condition can be edited in the display format of the table format or the graph format, and the result of editing in one format is reflected in the other format. A method for displaying a processing status in the semiconductor substrate processing apparatus according to the above. 8. The semiconductor substrate processing apparatus according to claim 6, wherein when an arbitrary parameter is selected from the processing conditions displayed in the table format, the parameter is displayed in a graph format. How to display the processing status in. 9. The method according to claim 6, wherein when an arbitrary parameter is selected from among the processing conditions displayed in the graph, the parameter is displayed in a table format.
A method for displaying a processing status in the semiconductor substrate processing apparatus according to the above. 10. A semiconductor substrate processing apparatus for processing a semiconductor substrate that forms a semiconductor device on a semiconductor substrate,
Means for displaying a configuration diagram of a semiconductor substrate processing apparatus composed of a plurality of rooms on a display screen of a terminal that monitors and controls the processing status of the semiconductor substrate processing apparatus, and a part of the displayed configuration diagram is Means for displaying, when selected, detailed information on the selected part by drawing or text, and means for displaying more detailed information on the selected part when a part of the detailed information is selected. A semiconductor substrate processing apparatus, comprising: a processing status display unit according to claim 1. 11. A semiconductor substrate processing apparatus for processing a semiconductor substrate that forms a semiconductor device on a semiconductor substrate,
Means for displaying a configuration diagram of a semiconductor substrate processing apparatus composed of a plurality of rooms on a display screen of a terminal that monitors and controls the processing status of the semiconductor substrate processing apparatus, and a part of the displayed configuration diagram is When selected, means for displaying detailed information on the selected part by drawing or text, and when a part of the detailed information is selected, maintenance, inspection procedures, parts replacement for the selected part A semiconductor substrate processing apparatus for sequentially displaying information on necessity. 12. A semiconductor substrate processing apparatus for processing a semiconductor substrate for forming a semiconductor device on a semiconductor substrate,
Means for displaying a configuration diagram of a semiconductor substrate processing apparatus composed of a plurality of rooms on a display screen of a terminal for monitoring and controlling the processing status of the semiconductor substrate processing apparatus, wherein the means is configured to be displayed. Processing status display means for displaying the actual installation direction and the direction of the displayed device so as to match the actual installation from the position where the display screen is viewed. A semiconductor substrate processing apparatus characterized by the above-mentioned. 13. A semiconductor substrate processing apparatus for processing a semiconductor substrate that forms a semiconductor device on a semiconductor substrate,
Means for displaying a configuration diagram of a semiconductor substrate processing apparatus composed of a plurality of rooms on a display screen of a terminal for monitoring and controlling the processing status of the semiconductor substrate processing apparatus; A semiconductor substrate processing apparatus comprising: processing status display means for blinking a failure occurrence location, switching between a plurality of colors, or displaying a color different from the surroundings. 14. The processing status display means, when the failure occurrence location is selected, displays details of the failure,
14. The semiconductor substrate processing apparatus according to claim 13, further comprising: means for displaying a measure for coping with the failure when a part of the details of the failure is selected. 15. A semiconductor substrate processing apparatus for processing a semiconductor substrate that forms a semiconductor device on a semiconductor substrate,
A semiconductor substrate processing apparatus, comprising: processing status display means for displaying an input screen capable of switching between a table format and a graph format for determining parameters as processing conditions of the semiconductor substrate processing device. 16. The processing condition can be edited in the display format of the table format or the graph format, and the result of editing in one format is reflected in the other format. 13. The semiconductor substrate processing apparatus according to claim 1. 17. The apparatus according to claim 1, wherein the processing status display means includes a means for displaying, when an arbitrary parameter is selected from the processing conditions displayed in the table format, the parameter in a graph format. 16. The semiconductor substrate processing apparatus according to claim 15, wherein 18. The apparatus according to claim 18, wherein the processing status display means includes a means for displaying, when an arbitrary parameter is selected from the processing conditions displayed in the graph format, the parameter in a table format. 16. The semiconductor substrate processing apparatus according to claim 15, wherein