JP2000284873A - Memory circuit board - Google Patents

Memory circuit board

Info

Publication number
JP2000284873A
JP2000284873A JP11091527A JP9152799A JP2000284873A JP 2000284873 A JP2000284873 A JP 2000284873A JP 11091527 A JP11091527 A JP 11091527A JP 9152799 A JP9152799 A JP 9152799A JP 2000284873 A JP2000284873 A JP 2000284873A
Authority
JP
Japan
Prior art keywords
circuit board
memory
memory circuit
resistor
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11091527A
Other languages
Japanese (ja)
Inventor
Hajime Konno
肇 今野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adtec Corp
Original Assignee
Adtec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adtec Corp filed Critical Adtec Corp
Priority to JP11091527A priority Critical patent/JP2000284873A/en
Publication of JP2000284873A publication Critical patent/JP2000284873A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Memory System (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a memory circuit board which operates fast and stably and does not cause increase in power consumption. SOLUTION: This memory circuit board on which plural memory elements 11 to 14 are mounted connects a termination circuit 20 consisting of serial circuits of resistances 21 and capacitors 22 at the ends of connection lines 16 which start at prescribed terminals of a connector 10 and connect prescribed terminals of the elements 11 to 14 in turn. It is possible to suppress waveform disturbance, e.g. of overshoot and undershoot within an allowable value without increasing delay and also to prevent power consumption from being increased by adopting a termination circuit for wiring in the board as well in the same manner with a transmission line.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はメモリ回路基板に関
し、特に高速動作が可能なメモリ回路基板に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory circuit board, and more particularly to a memory circuit board capable of operating at high speed.

【0002】[0002]

【従来の技術】従来、パーソナルコンピュータ等におい
ては、メインボード上にCPUが装着され、CPUから
はメモリバス制御用LSIを介してメモリバスが出てお
り、複数のメモリ回路基板用コネクタに並列に接続され
ていた。そして、該メモリ回路基板用コネクタに所望の
数および容量のメモリ回路基板を装着することによって
メモリが実装されていた。メモリバスの動作速度は50
MHzあるいは66MHz程度であり、既存の回路技術
を使用してこの程度の速度で動作するメモリ回路基板を
作成することはそれほど困難ではなかった。
2. Description of the Related Art Conventionally, in a personal computer or the like, a CPU is mounted on a main board, and a memory bus exits from the CPU via a memory bus control LSI, and is connected in parallel to a plurality of memory circuit board connectors. Was connected. The memory is mounted by attaching a desired number and capacity of memory circuit boards to the memory circuit board connector. The operating speed of the memory bus is 50
MHz or 66 MHz, and it has not been so difficult to create a memory circuit board that operates at such a speed using existing circuit technology.

【0003】図2は、従来のメモリ回路基板内の配線構
造を説明する説明図である。コネクタ10から出発した
接続線16は抵抗15を介して、複数のメモリ素子11
〜14に順次接続されていた。抵抗15は、波形の乱
れ、例えばオーバーシュートやアンダーシュートを許容
値以内に抑えるために挿入されている抵抗であり、例え
ば10Ω程度が使用されていた。
FIG. 2 is an explanatory diagram for explaining a wiring structure in a conventional memory circuit board. A connection line 16 starting from the connector 10 is connected via a resistor 15 to a plurality of memory elements 11.
To 14 were sequentially connected. The resistor 15 is a resistor inserted to suppress the disturbance of the waveform, for example, overshoot or undershoot, within an allowable value. For example, about 10Ω is used.

【0004】[0004]

【発明が解決しようとする課題】近年CPUの高速化が
著しく、これに伴ってメモリバスの速度も100MHz
あるいは133MHzに高速化されつつある。また、メ
モリ回路基板の大容量化や小型化の要求もあり、素子数
の増加や配線幅の減少を図る必要がある。ところが、前
記したような、従来のメモリ回路基板の回路構成を採用
した場合には、基板内のキャパシタンスやインダクタン
スの増加に伴い、抵抗15の値を大きくしないと波形の
乱れが許容値内に収まらず、かといって抵抗値を大きく
すると、RAS(ローアト゛レスセレクト)やCAS(コラムアト゛レスセレク
ト)の信号波形の遅延量が許容値をオーバーして高速動
作できなくなってしまうという問題点があった。本発明
の目的は、前記のような従来技術の問題点を解決し、高
速で安定に動作し、消費電力も増加しないメモリ回路基
板を提供することにある。
In recent years, the speed of the CPU has been remarkably increased, and accordingly, the speed of the memory bus has been increased to 100 MHz.
Alternatively, the speed is being increased to 133 MHz. In addition, there is a demand for increasing the capacity and miniaturization of the memory circuit board, and it is necessary to increase the number of elements and reduce the wiring width. However, in the case where the circuit configuration of the conventional memory circuit board as described above is adopted, the disturbance of the waveform falls within an allowable value unless the value of the resistor 15 is increased due to an increase in the capacitance and inductance in the board. On the other hand, if the resistance value is increased, the delay amount of the signal waveform of RAS (low address select) or CAS (column address select) exceeds the allowable value, and high-speed operation cannot be performed. SUMMARY OF THE INVENTION It is an object of the present invention to provide a memory circuit board which solves the above-mentioned problems of the prior art, operates stably at high speed, and does not increase power consumption.

【0005】[0005]

【課題を解決するための手段】本発明は、複数のメモリ
素子を搭載したメモリ回路基板において、コネクタ手段
の所定の端子から出発して、前記複数のメモリ素子の所
定の端子を順に接続した接続線の終端に終端回路を接続
したことを特徴とし、終端回路として抵抗とコンデンサ
の直列回路を採用した点にも特徴がある。本発明によれ
ば、基板内の配線にも伝送路と同様に終端回路を採用す
ることにより、遅延を増加させることなく、例えばオー
バーシュートやアンダーシュート等の波形の乱れを許容
値以内に抑えることができ、消費電力も増加しない。
SUMMARY OF THE INVENTION The present invention relates to a memory circuit board on which a plurality of memory elements are mounted, starting from predetermined terminals of a connector means and connecting predetermined terminals of the plurality of memory elements in order. It is characterized in that a terminating circuit is connected to the end of the line, and that a series circuit of a resistor and a capacitor is adopted as the terminating circuit. Advantageous Effects of Invention According to the present invention, by adopting a termination circuit in the same manner as a transmission line for wiring in a substrate, it is possible to suppress waveform disturbance such as overshoot or undershoot to within an allowable value without increasing delay. And power consumption does not increase.

【0006】[0006]

【発明の実施の形態】以下、本発明の実施の形態を詳細
に説明する。図1は、本発明を適用したメモリ回路基板
の配線構造を示す説明図である。コネクタ10から出発
した接続線16は抵抗15を介して、複数のメモリ素子
11〜14に順次接続されている。抵抗15は、波形の
乱れ、例えばオーバーシュートやアンダーシュートを許
容値以内に抑えるために挿入されている抵抗である。
Embodiments of the present invention will be described below in detail. FIG. 1 is an explanatory diagram showing a wiring structure of a memory circuit board to which the present invention is applied. A connection line 16 starting from the connector 10 is sequentially connected to a plurality of memory elements 11 to 14 via a resistor 15. The resistor 15 is a resistor inserted to suppress the disturbance of the waveform, for example, overshoot or undershoot, within an allowable value.

【0007】接続線16の終端部には、終端回路20が
接続されている。各終端回路は、抵抗21とコンデンサ
22の直列回路からなっている。抵抗値は、接続線16
の特性インピーダンスに等しくなるように選択され、例
えば65Ω程度が選択される。コンデンサとしては、終
端部の信号波形の乱れ、即ちオーバーシュートやアンダ
ーシュートが最も小さくなり、かつ信号遅延が許容値以
下となるように、実験的に決定されるが、例えば数十ピ
コファラッド程度のコンデンサが選択される。
[0007] A terminal circuit 20 is connected to the terminal of the connection line 16. Each termination circuit is composed of a series circuit of a resistor 21 and a capacitor 22. The resistance value is determined by the connection line 16
Is selected to be equal to the characteristic impedance of, for example, about 65Ω. The capacitor is determined experimentally so that the signal waveform disturbance at the terminal end, that is, overshoot or undershoot is minimized and the signal delay is equal to or less than an allowable value, for example, about several tens picofarads. A capacitor is selected.

【0008】この終端回路は、安価な部品で簡単に構成
でき、高周波的には終端抵抗と同様の機能を果たすが、
直流あるいは低周波的には開放と等価となる。従って、
終端部の過渡的な信号波形の乱れであるオーバーシュー
トやアンダーシュートに対して効果的に終端機能を果た
すが定常時には全く電力は消費しない。
This terminating circuit can be easily constructed with inexpensive components and performs the same function as a terminating resistor in terms of high frequency.
DC or low frequency is equivalent to open. Therefore,
The terminal effectively functions as an overshoot or undershoot, which is a transient signal waveform disturbance at the end, but consumes no power in a steady state.

【0009】終端回路を付加する信号線としては、例え
ば全ての信号線に付加してもよいが、最もタイミングが
クリチカルなRAS、CAS、WE(ライトイネーフ゛ル)信号
線などの制御信号のみ、あるいは制御信号線とアドレス
信号線に付加するのみでもよい。なお、終端回路20を
付加した場合には、コネクタ近傍の抵抗15は必要なく
なるが、規格上必要であれば残しておいてもよい。
As a signal line to which a termination circuit is added, for example, it may be added to all signal lines. However, only control signals such as RAS, CAS, and WE (write enable) signal lines having the most critical timing, or control signals Only the signal line and the address signal line may be added. When the terminating circuit 20 is added, the resistor 15 near the connector is not required, but may be left as required by the standard.

【0010】図4は、本発明を適用したメモリ回路基板
の一例を示す回路図である。このメモリ回路基板におい
ては、8個のDRAMメモリ素子41〜48を使用し、
クロック信号はPLL回路を内蔵した周知のクロックド
ライバIC49を介して駆動されている。コネクタ40
のアドレス信号端子には前記した歪み防止用抵抗50の
一端が接続され、他端はアドレス信号線52として8個
のメモリ素子41〜48のアドレス端子に接続されてい
る。コネクタ40のデータ入出力信号端子には前記した
歪み防止用抵抗は接続されておらず、直接データ信号線
53として8個のメモリ素子41〜48のデータ端子に
接続されている。
FIG. 4 is a circuit diagram showing an example of a memory circuit board to which the present invention is applied. In this memory circuit board, eight DRAM memory elements 41 to 48 are used,
The clock signal is driven via a known clock driver IC 49 having a built-in PLL circuit. Connector 40
Is connected to one end of the above-described distortion preventing resistor 50, and the other end is connected as an address signal line 52 to the address terminals of the eight memory elements 41 to 48. The data input / output signal terminal of the connector 40 is not connected to the above-described distortion prevention resistor, but is directly connected to the data terminals of the eight memory elements 41 to 48 as the data signal line 53.

【0011】コネクタ40のRAS、CAS、WE、C
S(チッフ゜セレクト)等の制御信号端子にはやはり歪み防止用
抵抗50の一端が接続され、他端は制御信号線54とし
て8個のメモリ素子41〜48の制御信号端子に接続さ
れている。制御信号線54のそれぞれは2つのメモリ素
子群41〜44および45〜48に対応して途中て2本
に分岐している。更に分岐したそれぞれの信号線の終端
であるメモリ素子44および48においては、各信号線
に抵抗およびコンデンサの直列回路からなる終端回路6
0が接続されている。
RAS, CAS, WE, C of connector 40
One end of a distortion prevention resistor 50 is also connected to a control signal terminal such as S (chip select), and the other end is connected as a control signal line 54 to control signal terminals of eight memory elements 41 to 48. Each of the control signal lines 54 is branched into two on the way corresponding to the two memory element groups 41 to 44 and 45 to 48. Further, in the memory elements 44 and 48 at the ends of the respective branched signal lines, a terminating circuit 6 comprising a series circuit of a resistor and a capacitor is provided for each signal line.
0 is connected.

【0012】コネクタ40のクロック信号端子には歪み
防止用抵抗50の一端が接続され、他端はクロックドラ
イバIC49に接続されている。ドライバ49の4個の
出力端子にはそれぞれ歪み防止用抵抗51の一端が接続
され、他端はクロック信号線55として、それぞれ2個
のメモリ素子のクロック端子に並列に接続されている。
8個のメモリ素子のそれぞれのクロック端子には、抵抗
およびコンデンサの直列回路からなる終端回路61が接
続されている。
One end of a distortion preventing resistor 50 is connected to the clock signal terminal of the connector 40, and the other end is connected to a clock driver IC 49. One end of a distortion prevention resistor 51 is connected to each of the four output terminals of the driver 49, and the other end is connected as a clock signal line 55 to clock terminals of two memory elements in parallel.
A terminal circuit 61 composed of a series circuit of a resistor and a capacitor is connected to each clock terminal of the eight memory elements.

【0013】この実施例においては、アドレス信号線5
2およびデータ信号線53には終端回路は装着されてい
ないが、必要に応じてこれらの信号線にも終端回路を装
着してもよい。
In this embodiment, the address signal line 5
2 and the data signal line 53 are not provided with a terminating circuit, but these signal lines may be provided with a terminating circuit if necessary.

【0014】図3は、各種の終端回路例を示す回路図で
ある。図3(a)はプルアップ抵抗30とプルダウン抵
抗31とを使用した例である。この終端回路は常に電力
を消費しているので、基板の消費電力や発熱が増加す
る。図3(b)は終端回路として2個のダイオード3
2、33を使用したものである。この終端回路はオーバ
ーシュートやアンダーシュート時にのみ電流が流れ、定
常時には電力を消費しない。図3(c)は、図1に示し
た抵抗とコンデンサの直列回路からなる終端回路の抵抗
を省略したものであり、終端に小容量のコンデンサ34
が接続されている。この他、本発明の終端回路20とし
ては、プルダウン抵抗のみなども使用可能である。
FIG. 3 is a circuit diagram showing examples of various termination circuits. FIG. 3A shows an example in which a pull-up resistor 30 and a pull-down resistor 31 are used. Since this termination circuit always consumes power, power consumption and heat generation of the substrate increase. FIG. 3B shows two diodes 3 as a termination circuit.
2, 33 are used. In this termination circuit, a current flows only at the time of overshoot or undershoot, and does not consume power in a steady state. FIG. 3 (c) omits the resistance of the terminal circuit composed of the series circuit of the resistor and the capacitor shown in FIG.
Is connected. In addition, as the termination circuit 20 of the present invention, only a pull-down resistor or the like can be used.

【0015】以上、本発明の実施例を開示したが、本発
明には下記のような変形例も考えられる。実施例におい
ては、コネクタ10(40)を介してメモリバスと接続
する例を開示したが、メインボード上に実装されるメモ
リ素子に対する配線にも本発明を適用可能である。
Although the embodiment of the present invention has been disclosed above, the present invention may have the following modifications. In the embodiment, the example in which the memory bus is connected via the connector 10 (40) is disclosed. However, the present invention can be applied to wiring to a memory element mounted on a main board.

【0016】[0016]

【発明の効果】以上述べたように、本発明においては、
複数のメモリ素子を搭載したメモリ回路基板において、
コネクタ手段の所定の端子から出発して、前記複数のメ
モリ素子の所定の端子を順に接続した接続線の終端に終
端回路を接続したので、簡単な構成で、遅延を増加させ
ることなく、例えばオーバーシュートやアンダーシュー
ト等の波形の乱れを許容値以内に抑えることができ、消
費電力も殆ど増加しないという効果がある。
As described above, in the present invention,
In a memory circuit board on which a plurality of memory elements are mounted,
Starting from a predetermined terminal of the connector means, a terminating circuit is connected to an end of a connection line connecting the predetermined terminals of the plurality of memory elements in order. Waveform disturbances such as shoot and undershoot can be suppressed to within an allowable value, and there is an effect that power consumption hardly increases.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を適用したメモリ回路基板の配線構造を
示す説明図である。
FIG. 1 is an explanatory diagram showing a wiring structure of a memory circuit board to which the present invention is applied.

【図2】従来のメモリ回路基板内の配線構造を説明する
説明図である。
FIG. 2 is an explanatory diagram illustrating a wiring structure in a conventional memory circuit board.

【図3】各種の終端回路例を示す回路図である。FIG. 3 is a circuit diagram showing examples of various termination circuits.

【図4】本発明を適用したメモリ回路基板の一例を示す
回路図である。
FIG. 4 is a circuit diagram showing an example of a memory circuit board to which the present invention is applied.

【符号の説明】[Explanation of symbols]

10…コネクタ、11〜14…メモリ素子、15…抵
抗、16…接続線、20…終端回路、21…抵抗、22
…コンデンサ、30…プルアップ抵抗、31…プルダウ
ン抵抗、32、33…ダイオード、34…コンデンサ、
40…コネクタ、41〜48…メモリ素子、49…クロ
ックドライバIC、50、51…抵抗、52…アドレス
信号線、53…データ信号線、54…制御信号線、55
…クロック信号線、60、61…終端回路
DESCRIPTION OF SYMBOLS 10 ... Connector, 11-14 ... Memory element, 15 ... Resistance, 16 ... Connection line, 20 ... Terminal circuit, 21 ... Resistance, 22
... capacitor, 30 ... pull-up resistor, 31 ... pull-down resistor, 32, 33 ... diode, 34 ... capacitor,
40 connector, 41 to 48 memory element, 49 clock driver IC, 50, 51 resistor, 52 address signal line, 53 data signal line, 54 control signal line, 55
... Clock signal line, 60, 61 ... Terminal circuit

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】複数のメモリ素子を搭載したメモリ回路基
板において、 コネクタ手段の所定の端子から出発して、前記複数のメ
モリ素子の所定の端子を順に接続した接続線の終端に終
端回路を接続したことを特徴とするメモリ回路基板。
In a memory circuit board having a plurality of memory elements mounted thereon, starting from a predetermined terminal of a connector means, a terminating circuit is connected to an end of a connection line connecting the predetermined terminals of the plurality of memory elements in order. A memory circuit board, comprising:
【請求項2】前記接続線はメモリ回路基板上で分岐して
おり、分岐したそれぞれの接続線の終端に全て前記終端
回路が接続されていることを特徴とする請求項1に記載
のメモリ回路基板。
2. The memory circuit according to claim 1, wherein the connection lines are branched on the memory circuit board, and the terminal circuits are all connected to the ends of the respective branched connection lines. substrate.
【請求項3】前記終端回路は、基板上の前記接続線の特
性インピーダンスにほぼ等しい値の抵抗とコンデンサの
直列回路からなることを特徴とする請求項1に記載のメ
モリ回路基板。
3. The memory circuit board according to claim 1, wherein said termination circuit comprises a series circuit of a resistor and a capacitor having a value substantially equal to a characteristic impedance of said connection line on said board.
JP11091527A 1999-03-31 1999-03-31 Memory circuit board Pending JP2000284873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11091527A JP2000284873A (en) 1999-03-31 1999-03-31 Memory circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11091527A JP2000284873A (en) 1999-03-31 1999-03-31 Memory circuit board

Publications (1)

Publication Number Publication Date
JP2000284873A true JP2000284873A (en) 2000-10-13

Family

ID=14028917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11091527A Pending JP2000284873A (en) 1999-03-31 1999-03-31 Memory circuit board

Country Status (1)

Country Link
JP (1) JP2000284873A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6362997B1 (en) * 2000-10-16 2002-03-26 Nvidia Memory system for use on a circuit board in which the number of loads are minimized
JP2008135063A (en) * 2001-04-24 2008-06-12 Rambus Inc Method and apparatus for coordinating memory operation among diversely-located memory components
KR100913711B1 (en) * 2006-07-03 2009-08-24 닛본 덴끼 가부시끼가이샤 Printed circuit board
KR100923825B1 (en) * 2002-07-29 2009-10-27 엘피다 메모리, 아이엔씨. Memory module and memory system suitable for high speed operation
US8320202B2 (en) 2001-04-24 2012-11-27 Rambus Inc. Clocked memory system with termination component
US9229470B2 (en) 2004-09-15 2016-01-05 Rambus Inc. Memory controller with clock-to-strobe skew compensation
WO2021076721A1 (en) 2019-10-16 2021-04-22 Hewlett-Packard Development Company, L.P. Efficient placement of memory

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6362997B1 (en) * 2000-10-16 2002-03-26 Nvidia Memory system for use on a circuit board in which the number of loads are minimized
US6496404B1 (en) * 2000-10-16 2002-12-17 Nvidia Corporation Memory system for use on a circuit board in which the number of loads is minimized
US8717837B2 (en) 2001-04-24 2014-05-06 Rambus Inc. Memory module
US8214616B2 (en) 2001-04-24 2012-07-03 Rambus Inc. Memory controller device having timing offset capability
US9053778B2 (en) 2001-04-24 2015-06-09 Rambus Inc. Memory controller that enforces strobe-to-strobe timing offset
JP4489817B2 (en) * 2001-04-24 2010-06-23 ラムバス・インコーポレーテッド Method and apparatus for coordinating memory operations from variously arranged memory components
US10706910B2 (en) 2001-04-24 2020-07-07 Rambus Inc. Memory controller
US8320202B2 (en) 2001-04-24 2012-11-27 Rambus Inc. Clocked memory system with termination component
US8359445B2 (en) 2001-04-24 2013-01-22 Rambus Inc. Method and apparatus for signaling between devices of a memory system
US8391039B2 (en) 2001-04-24 2013-03-05 Rambus Inc. Memory module with termination component
US8395951B2 (en) 2001-04-24 2013-03-12 Rambus Inc. Memory controller
US8462566B2 (en) 2001-04-24 2013-06-11 Rambus Inc. Memory module with termination component
US8537601B2 (en) 2001-04-24 2013-09-17 Rambus Inc. Memory controller with selective data transmission delay
US9311976B2 (en) 2001-04-24 2016-04-12 Rambus Inc. Memory module
JP2008135063A (en) * 2001-04-24 2008-06-12 Rambus Inc Method and apparatus for coordinating memory operation among diversely-located memory components
US8760944B2 (en) 2001-04-24 2014-06-24 Rambus Inc. Memory component that samples command/address signals in response to both edges of a clock signal
US10236051B2 (en) 2001-04-24 2019-03-19 Rambus Inc. Memory controller
US9741424B2 (en) 2001-04-24 2017-08-22 Rambus Inc. Memory controller
US8625371B2 (en) 2001-04-24 2014-01-07 Rambus Inc. Memory component with terminated and unterminated signaling inputs
US9472262B2 (en) 2001-04-24 2016-10-18 Rambus Inc. Memory controller
KR100923825B1 (en) * 2002-07-29 2009-10-27 엘피다 메모리, 아이엔씨. Memory module and memory system suitable for high speed operation
US9437279B2 (en) 2004-09-15 2016-09-06 Rambus Inc. Memory controller with clock-to-strobe skew compensation
US9830971B2 (en) 2004-09-15 2017-11-28 Rambus Inc. Memory controller with clock-to-strobe skew compensation
US10325645B2 (en) 2004-09-15 2019-06-18 Rambus Inc. Memory controller with clock-to-strobe skew compensation
US9229470B2 (en) 2004-09-15 2016-01-05 Rambus Inc. Memory controller with clock-to-strobe skew compensation
US10755764B2 (en) 2004-09-15 2020-08-25 Rambus Inc. Memory component that enables calibrated command- and data-timing signal arrival
US11100976B2 (en) 2004-09-15 2021-08-24 Rambus Inc. Memory controller with clock-to-strobe skew compensation
US11664067B2 (en) 2004-09-15 2023-05-30 Rambus Inc. Memory system component that enables clock-to-strobe skew compensation
KR100913711B1 (en) * 2006-07-03 2009-08-24 닛본 덴끼 가부시끼가이샤 Printed circuit board
WO2021076721A1 (en) 2019-10-16 2021-04-22 Hewlett-Packard Development Company, L.P. Efficient placement of memory
EP4046028A4 (en) * 2019-10-16 2023-10-18 Hewlett-Packard Development Company, L.P. Efficient placement of memory

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