JP2000278168A - High frequency composite component and radio communication unit using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain miniaturization and light weight for a high frequency composite component. SOLUTION: This composite component 10 is used for a personal digital cellular PDC system mobile phone and consists of a GaAs switch SW 1, low pass filters LPF1, LPF2 being high frequency filters and a directional coupler COU, and 1st-6th ports P11-P16. The GaAs switch SW1 is provided with 6 terminals S11-S16, the low pass filter LPF1 is connected to the terminal S14 and the low pass filter LPF2 is connected to the terminal S16 respectively. Furthermore, the terminals S11-S13, S15 are used for 1st-3rd and 5th ports P11-P13, P15 of the high frequency composite component 10. The directional coupler COU consists of a main line SL1 and a sub line SL2, and the low pass filter LPF1 consists of the main line SL1 of the directional coupler COU and a capacitor C1 connected in parallel with the main line SL1. Moreover, the low pass filter LPF2 consists of an inductor L and a capacitor C2 connected in parallel with the inductor L.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency composite component and a radio communication device using the same, and more particularly, to a radio frequency component used for communication by selectively switching between transmission and reception.
The present invention relates to a high-frequency composite component provided with an As switch and a wireless communication device using the same.

[0002]

2. Description of the Related Art In recent years, a portable telephone or the like as a radio communication device has adopted a diversity system to reduce fading and improve an effective gain (7 to 8 dB).

FIG. 9 is an RF block diagram of a general portable telephone. The mobile phone 50 includes a transmitting / receiving antenna AN.
It has a T1, a receiving antenna ANT2, and a GaAs switch SW for switching between a transmitting unit Tx and a receiving unit Rx.

The GaAs switch SW has four terminals S51.
To S54, and a transmitting / receiving antenna AN is provided at a terminal S51.
T1 and terminal S52 have a receiving antenna ANT2 and terminal S
A receiving unit Rx is connected to 53, and a transmitting unit Tx is connected to the terminal S54. The transmitting unit Tx includes a low-pass filter LPF, a directional coupler COU, a high-output amplifier PA, and a mixer MIX1, and the receiving unit Rx includes a surface acoustic wave filter SAW, which is a band-pass filter, and a low-noise amplifier LN.
A and a mixer MIX2. Further, the transmission unit Tx
One input of the mixer MIX1 of the receiver Rx and the mixer MIX2 of the receiver Rx is connected to a synthesizer SYN for generating a local signal.

[0005]

However, in the above-mentioned conventional portable telephone, a GaAs switch composed of discrete parts, a filter constituting a transmitting unit or a receiving unit, an amplifier, and the like are mounted on a printed wiring board. There is a problem that it is difficult to further reduce the size and weight. In particular, in the case of a low-pass filter, generally, the performance is inversely proportional to the shape and size, and the shape and size increase as the performance of the low-pass filter increases, This hinders miniaturization and weight reduction. Conversely, miniaturization of the low-pass filter due to the size restrictions of the mobile phone imposes a compromise on device performance due to insufficient filter characteristics.

The present invention has been made to solve such problems, and an object of the present invention is to provide a high-frequency composite component which can be reduced in size and weight, and a radio communication device using the same. I do.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a high-frequency composite component according to the present invention comprises a laminate comprising dielectric layers, a directional coupler incorporated in the laminate, and a high-frequency component. At least one of the filters and a GaAs switch mounted on the laminate are provided.

[0008] The present invention is characterized in that a surface acoustic wave filter mounted on the laminate is provided.

[0009] The directional coupler is characterized by comprising a strip electrode provided inside the laminate.

Further, the high frequency filter comprises an inductor electrode provided inside the multilayer body and a capacitor electrode provided inside the multilayer body so as to face each other with the dielectric layer interposed therebetween. And

[0011] A wireless communication apparatus according to the present invention uses the above-described high-frequency composite component.

According to the high frequency composite component of the present invention, GaAs
By integrating the s-switch, the directional coupler, and the high-frequency filter into a laminate formed by laminating dielectric layers, conventional discrete components such as GaAs switches, isolators, low-pass filters, and directional couplers can be used. The overall dimensions can be made smaller than those mounted and connected on a printed wiring board.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a circuit diagram of a first embodiment of the high-frequency composite component according to the present invention. High frequency composite component 10
Is used for a PDC (Personal Digital Cellular) type mobile phone, and a GaAs switch SW
1 and a low-pass filter LPF which is a high-frequency filter
1, LPF2, and directional coupler COU, and includes first to sixth ports P11 to P16.

The GaAs switch SW1 has six terminals S1
1 to S16, and a low-pass filter L at a terminal S14.
The PF1 and the directional coupler COU are connected to the terminal S16, and the low-pass filter LPF2 is connected to the terminal S16. The terminals S11 to S13 and S15 are the first terminals of the high-frequency composite component 10.
To the third and fifth ports P11 to P13, P15.

The directional coupler COU is formed by a main line SL1 and a sub-line SL2. The low-pass filter LPF1 is composed of the main line SL1 of the directional coupler COU and the main line SL1.
And a capacitor C1 connected in parallel with the capacitor C1. The low-pass filter LPF2 is formed by an inductor L and a capacitor C2 connected in parallel to the inductor L.

FIG. 2 is a perspective view of a high-frequency composite component provided with the circuit of FIG. The high-frequency composite component 10 includes a laminated body 11 in which a directional coupler and a low-pass filter (not shown) are built.

The laminated body 11 has bare chip-shaped G
An aAs switch SW1 is mounted, and a metal cap 12 is attached so as to cover the GaAs switch SW1. Further, external terminals T1 to T6 serving as first to sixth ports P1 to P6 are formed on the side and lower surfaces of the stacked body 11, and a ground terminal TG serving as ground is formed on the lower surface.

FIG. 3 is a sectional view of another high-frequency composite component provided with the circuit of FIG. The high-frequency composite component 10a is shown in FIG.
Compared to the high-frequency composite component 10 of the first embodiment, the laminated body 11a in which the directional coupler and the low-pass filter (not shown) are provided includes a cavity 13 in which the GaAs switch SW1 is mounted. The cavity 13 is filled with the resin 14 after the GaAs switch SW1 is mounted.

FIGS. 4 (a) to 4 (f) and FIGS. 5 (a) to 5 (c) are a top view and a bottom view of each dielectric layer constituting the laminate of the high frequency composite component of FIG. It is.

The laminated body 11 is formed by sequentially laminating first to eighth dielectric layers a to h made of a dielectric ceramic mainly composed of barium oxide, aluminum oxide and silica having a dielectric constant of 6 from the top. It is formed.

A land La and a wiring pattern Lp for mounting a GaAs switch are formed on the upper surface of the first dielectric layer a. Ground electrodes Gp1 and Gp2 are formed on the upper surfaces of the second and eighth dielectric layers b and h, respectively.

Further, a wiring pattern Lp is formed on the upper surface of the third dielectric layer c. Strip electrodes Sp1 to Sp4 are formed on the upper surfaces of the fourth and fifth dielectric layers d and e, respectively.

Further, capacitor electrodes Cp1 to Cp6 are formed on the upper surfaces of the sixth and seventh dielectric layers f and g, respectively. Also, on the lower surface of the eighth dielectric layer h (the reference numeral hu in FIG. 4C), external terminals T1 to T6 serving as the first to sixth ports P1 to P6 of the high-frequency composite component 10, A ground terminal TG serving as a ground is formed.

The strip electrodes Sp1 to Sp4, the capacitor electrodes Cp1 to Cp6, the ground electrodes Gp1 and Gp
p2, land La, external terminals T1 to T6, and ground terminal TG are connected to via hole electrodes Vh formed in each dielectric layer.
And a wiring pattern Lp as appropriate.

The main line SL1 of the directional coupler COU
Is a strip electrode Sp3, and the sub-line SL2 is a strip electrode Sp1. Also, a low-pass filter LPF
1 is connected to the capacitor electrodes Cp1, Cp3,
Cp4. Further, a low-pass filter LPF
2 are strip electrodes Sp2 and Sp4.
Capacitor C2 has capacitor electrodes Cp2, Cp5, Cp
6 respectively.

With the above configuration, the laminated body 11 including the directional coupler COU and the low-pass filters LPF1 and LPF2 constituting the high-frequency composite component 10 of FIG. 1 is formed. Then, the GaAs switch SW1 is
Is mounted and the metal cap 12 is attached to complete the high-frequency composite component 10 as shown in FIG.

FIG. 6 is a circuit diagram of a high-frequency composite component according to a second embodiment of the present invention. The high-frequency composite component 20 has a P
The GaAs switch SW2 is used for an HS (Personal Handy-phone System) type mobile phone.
And a low-pass filter LPF1 which is a high-frequency filter
And a directional coupler COU, and four ports P
21 to P24.

The GaAs switch SW2 has four terminals S2
1 to S24, and a low-pass filter L at a terminal S24.
The PF1 and the directional coupler COU are connected. The terminals S21 to S23 are the first to third ports P21 to P23 of the high-frequency composite component 20.

The directional coupler COU and the low-pass filter LPF1 are identical to the high-frequency composite component 10 of the first embodiment.
It has the same configuration as (FIG. 1).

According to the high-frequency composite component of the first and second embodiments, the GaAs switch, the directional coupler on the transmitting side, and the low-pass filter are integrated into a laminate formed by laminating dielectric layers. The conventional discrete GaAs switch, isolator, low-pass filter,
A directional coupler or the like can be mounted on a printed wiring board and the overall dimensions can be reduced as compared with those connected, and the high-frequency composite component can be reduced in size and weight.

Further, since the directional coupler is constituted by the strip electrodes provided inside the laminate, the high-frequency composite component can be further miniaturized, and the GaAs switch and the directional coupler are designed to have impedance matching. And high performance of the high frequency composite component can be realized.

Further, since the low-pass filter is composed of the strip electrode and the capacitor electrode provided inside the laminate, the high-frequency composite component can be further miniaturized, and the impedance matching between the GaAs switch and the low-pass filter can be achieved. And high performance of the high-frequency composite component can be realized.

FIG. 7 is a circuit diagram of a third embodiment of the high-frequency composite component according to the present invention. The high-frequency composite component 30 is different from the high-frequency composite component 10 of the first embodiment (FIG. 1) in G
The difference is that the surface acoustic wave filter SAW connected to the terminal S13 of the aAs switch SW1 is integrated.

At this time, the surface acoustic wave filter SAW
It will be mounted on the laminate together with the aAs switch SW1.

The high-frequency composite component 20 of the second embodiment
(FIG. 6), a surface acoustic wave filter SAW may be integrated. At this time, the surface acoustic wave filter SAW is connected to the terminal S23 of the GaAs switch SW2.

According to the high-frequency composite component of the third embodiment, since the surface acoustic wave filter SAW on the receiving side is also integrated, the function of the high-frequency composite component can be further improved while realizing miniaturization. Can be.

FIG. 8 shows a PC which is a general wireless communication device.
FIG. 3 is an RF block diagram of a D-type mobile phone. The mobile phone 40 includes a transmitting / receiving antenna ANT1, a receiving antenna ANT2, a transmitting unit Tx connected to the transmitting / receiving antenna ANT1 via the switch SW1, and a switch SW1.
Transmitting and receiving antenna ANT1, receiving antenna A
And a receiving unit Rx connected to NT2.

The transmitting unit Tx is provided with a low-pass filter L
PF1, a directional coupler COU, a high-power amplifier PA, and a mixer MIX1. The receiving unit Rx includes a surface acoustic wave filter SAW, which is a band-pass filter, and a low-noise amplifier L.
NA and a mixer MIX2. Also, the transmitting unit Tx
One input of the mixer MIX1 of the receiver Rx and the mixer MIX2 of the receiver Rx is connected to a synthesizer SYN for generating a local signal.

Then, as shown in FIG. 8A, a switch SW1, which is a part of the RF unit of the portable telephone set 40, a directional coupler COU of the transmitting unit Tx, and a low-pass filter LPF.
1, GaAs switch SW1 and sixth port P16
1 to the low-pass filter LPF2 disposed between
The high frequency composite component 10 shown in FIG.

As shown in FIG. 8B, a switch SW1 which is a part of the RF unit of the portable telephone 40 and a transmitting unit T
x directional coupler COU and low-pass filter LPF
1. Surface acoustic wave filter SAW of transmitting unit Rx and G
The high-frequency composite component 30 shown in FIG. 7 is used for the low-pass filter LPF2 disposed between the aAs switch SW1 and the sixth port P16.

When a PDC type portable telephone having the high-frequency composite parts 10, 30 mounted thereon is used as an automobile telephone, the high-frequency composite parts 10, 3, which are free terminals, are used.
The in-vehicle antenna for transmission / reception is connected to the fifth port P5 of 0, and the in-vehicle antenna for reception is connected to the sixth port P6, and transmission / reception is performed by these in-vehicle antennas.

According to the portable telephone of the above-described embodiment, the compact and lightweight high-frequency composite component is used for a part of the RF section of the portable telephone, so that the portable telephone can be reduced in size and weight. Can be.

In the high frequency composite parts of the first to third embodiments described above, the case where the low pass filter is used as the high frequency filter has been described. However, the same effect can be obtained with the high pass filter or the band pass filter. Can be

Further, in the mobile communication device of the above-described embodiment, the PDC type portable telephone has been described as an example.
The same effect can be obtained by using a mobile phone of another system, for example, a PHS system.

[0045]

According to the high frequency composite part of the first aspect, G
By integrating the aAs switch, the directional coupler on the transmission side, and the low-pass filter into a laminate formed by laminating dielectric layers, a conventional discrete component GaAs switch, isolator, low-pass filter, The overall dimensions can be reduced as compared with a case where a sex coupler or the like is mounted on a printed wiring board and connected, and the high-frequency composite component can be reduced in size and weight.

According to the high frequency composite component of the second aspect, since the surface acoustic wave filter SAW on the receiving side is also integrated, it is possible to further improve the function of the high frequency composite component while realizing miniaturization.

According to the high frequency composite component of the third aspect, since the directional coupler is constituted by the strip electrodes provided inside the laminated body, the high frequency composite component can be further miniaturized, and the GaAs switch and the directional switch can be used. A design with impedance matching of the coupler can be performed, and high performance of the high frequency composite component can be realized.

According to the high-frequency composite component of the fourth aspect, the low-pass filter is constituted by the strip electrode and the capacitor electrode provided inside the laminate, so that the high-frequency composite component can be further reduced in size and GaAs can be obtained. The switch and the low-pass filter can be designed with impedance matching, and the high-frequency composite component can be improved in performance.

According to the fifth aspect of the present invention, since the downsized and lightened high-frequency composite component is used for a part of the RF section of the mobile phone, the mobile phone can be reduced in size and weight. it can.

[Brief description of the drawings]

FIG. 1 is a circuit diagram of a first embodiment according to a high-frequency composite component of the present invention.

FIG. 2 is a perspective view of a high-frequency composite component provided with the circuit of FIG. 1;

FIG. 3 is a sectional view of another high-frequency composite component provided with the circuit of FIG. 1;

FIG. 4 is a top view of (a) a first dielectric layer to (f) a sixth dielectric layer which constitute a laminate of the high-frequency composite component of FIG. 1;

5 (a) is a top view of a seventh dielectric layer, FIG. 5 (b) is a top view of an eighth dielectric layer, and FIG. 5 (c) is a bottom view of the eighth dielectric layer. FIG.

FIG. 6 is a circuit diagram of a high-frequency composite component according to a second embodiment of the present invention.

FIG. 7 is a circuit diagram of a third embodiment according to the high frequency composite component of the present invention.

FIG. 8 is an RF block diagram of a PCD type mobile phone as a general wireless communication device.

FIG. 10 is a block diagram showing a conventional high frequency composite component.

[Explanation of symbols]

10, 10a, 20, 30 High-frequency composite parts 11, 11a Electric conductor 40 Wireless communication device (mobile phone) ah Dielectric layer COU Directional coupler Cp1-Cp6 Capacitor electrodes LPF1, LPF2 High-frequency filters (low-pass) Filter) SAW surface acoustic wave filter Sp1 to Sp4 Strip electrode SW1, SW2 GaAs switch

[Procedure amendment]

[Submission date] June 16, 1999 (1999.6.1
6)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 is a circuit diagram of a first embodiment according to a high-frequency composite component of the present invention.

FIG. 2 is a perspective view of a high-frequency composite component provided with the circuit of FIG. 1;

FIG. 3 is a sectional view of another high-frequency composite component provided with the circuit of FIG. 1;

FIG. 4 is a top view of (a) a first dielectric layer to (f) a sixth dielectric layer which constitute a laminate of the high-frequency composite component of FIG. 1;

5 (a) is a top view of a seventh dielectric layer, FIG. 5 (b) is a top view of an eighth dielectric layer, and FIG. 5 (c) is a bottom view of the eighth dielectric layer. FIG.

FIG. 6 is a circuit diagram of a high-frequency composite component according to a second embodiment of the present invention.

FIG. 7 is a circuit diagram of a third embodiment according to the high frequency composite component of the present invention.

FIG. 8 is an RF block diagram of a PCD type mobile phone as a general wireless communication device.

FIG. 9 is a block diagram showing a conventional high frequency composite component.

[Description of Signs] 10, 10a, 20, 30 High-frequency composite parts 11, 11a Electric conductor 40 Wireless communication device (mobile phone) ah Dielectric layer COU Directional coupler Cp1-Cp6 Capacitor electrodes LPF1, LPF2 High frequency Filter (low-pass filter) SAW surface acoustic wave filter Sp1 to Sp4 Strip electrode SW1, SW2 GaAs switch

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5J024 AA01 CA00 CA11 DA04 DA29 DA35 EA01 EA03 FA03 5K011 DA00 DA03 DA21 DA23 DA27 JA01 KA00

Claims (5)

[Claims] 1. A semiconductor device comprising: a laminate formed by laminating dielectric layers; at least one of a directional coupler and a high-frequency filter built in the laminate; and a GaAs switch mounted on the laminate. High-frequency composite parts. 2. The high-frequency composite component according to claim 1, further comprising a surface acoustic wave filter mounted on the laminate. 3. The high-frequency composite component according to claim 1, wherein the directional coupler includes a strip electrode provided inside the multilayer body. 4. The high-frequency filter includes an inductor electrode provided inside the multilayer body and a capacitor electrode provided inside the multilayer body so as to face each other with the dielectric layer interposed therebetween. The high-frequency composite component according to claim 1 or 2, wherein 5. A wireless communication device using the high-frequency composite component according to claim 1.