JP2000277963A - Cooling device for personal computer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device, where the a heat sink layout in a personal computer main body is not restricted. SOLUTION: Each end of two heat pipes are arranged in CPU 5, and heat can be transferred. The other end of the second heat pipe is arranged in a hinge mechanism 16 installed near a connection between a personal computer main body and a display, and heat can be transferred. The other end of the first heat pipe is arranged in a heat sink 8 installed by detaching it from the hinge mechanism, and heat can be transferred.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device using a heat pipe for preventing overheating of electronic devices or devices used in personal computers and the like.

[0002]

2. Description of the Related Art In the field of personal computers, electronic devices such as a central processing unit (hereinafter abbreviated as a CPU) or devices such as a hard disk drive (hereinafter abbreviated as an HDD) have been developed with increasing functions and processing speed. The output has been increased, and on the other hand, miniaturization and weight reduction have been strongly desired. Therefore, the space that can be occupied by the device for cooling the electronic element or the device in the internal space of the personal computer case is also limited.

Therefore, conventionally, various cooling devices have been proposed in which heat generated from an electronic element or a device is connected to a heat sink by using a heat pipe having excellent heat transport ability, and the heat is radiated from the heat sink. As an example, a micro fan that connects one end of a heat pipe to a CPU provided inside a personal computer case, connects the other end of the heat pipe to a heat sink, and further sends air toward the heat sink. There is a cooling device having a configuration provided. According to this cooling device, the heat of the CPU is transferred to the heat sink by the working fluid of the heat pipe, and the heat is discharged to the outside of the PC case together with the airflow generated by the microfan, so that the CPU is reliably prevented from overheating. In addition to being able to do so, there is the advantage that heat does not stay inside the PC case.

On the other hand, FIG. 4 shows that the heat generated by the CPU 100 is transported to the heat sink 102 by the heat pipe 101, and the heat sink 102 is cooled by the air flow generated by driving the micro fan 107. This drawing shows a notebook personal computer cooling device that transports heat to a display 106 to dissipate heat and cool it by a heat pipe 104 provided in a hinge mechanism 103 provided near a connection point. This cooling device is configured such that a heat sink 102 is joined to or integrally provided with a hinge mechanism 103 so that heat can be transferred. As described above, the cooling device transfers the heat generated by the CPU 100 to the heat sink 1.
02 and the display 106 to radiate heat,
It is configured to prevent overheating of U100.

[0005]

However, in the cooling device having the above configuration, the heat sink 102 is joined to or integrally provided with the hinge mechanism 103, so that the heat sink 102 inside the personal computer case 105 is provided. There was a problem that the arrangement place of was restricted.

Accordingly, it is an object of the present invention to provide a cooling device in which the location of a heat sink inside a personal computer is not restricted.

[0007]

Means for Solving the Problems and Action Therefor To achieve the above object, the invention according to claim 1 is provided with an operating member that generates heat inside a personal computer main body and can be opened and closed about a rotation axis. In a cooling device for a personal computer having a simple display connected to the personal computer main body, one end of at least two heat pipes is disposed on the operating member so as to be able to exchange heat, and one of the heat pipes is one of the heat pipes. The other end of the heat pipe is provided so as to be able to exchange heat with a hinge mechanism provided near a connection point between the personal computer main body and the display, and the other end of the other heat pipe is provided separately from the hinge mechanism. The heat sink is provided so as to be able to exchange heat.

Therefore, according to the first aspect of the present invention, the heat sink is disposed inside the personal computer case by using the heat pipes provided so as to be able to transfer heat from the operating member that generates heat to the hinge mechanism and the heat sink. The degree of freedom can be improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a notebook computer will be described below with reference to FIG.
A personal computer case 1 shown in FIG. 1 is a relatively thin rectangular hollow container formed of plastic or metal, and has a size of about A5 to A4 in JIS (Japanese Industrial Standard). I have.

A keyboard (not shown) is attached to the upper surface of the personal computer case 1 by means such as fitting. On one edge on the upper end side of the personal computer case 1, there is provided a display 3, which is an image device that can be opened and closed with respect to the personal computer case 1 by rotating around the rotating shaft 2. This display 3
It is a flat hollow container having a screen (not shown) on one surface, and an electromagnetic shielding plate 4 made of a thin aluminum plate is provided inside the hollow container.

Further, a CPU 5 as an operating member is installed inside the personal computer case 1. This CPU5
Is installed on the bottom face near the side face to which the display 3 is connected inside the personal computer case 1. further,
The CPU 5 is provided with a heat receiving member 6 made of a metal block to be described later so as to be able to exchange heat. This heat receiving member 6
Is a member for promoting the transmission of heat generated from the CPU 5 to the first heat pipe 30 and the second heat pipe 40 described below.

As shown in FIG. 2, a CPU 5 is provided on the upper surface of the heat receiving member 6. Further, two mounting grooves 7 for mounting one end of the first heat pipe 30 and one end of the second heat pipe 40 are provided on the lower surface, and the first mounting groove 7 extends along the two mounting grooves 7. One ends of the heat pipe 30 and the second heat pipe 40 are respectively attached. That is, the first heat pipe 30, the second heat pipe 40, and the CPU 5 can exchange heat with each other.

The heat pipe used in the present invention is, for example, one in which pure water is sealed in a copper container having a circular cross section whose outer surface is hard chromium plated.

On the other hand, the other end of the first heat pipe 30 is connected to the personal computer case 1 in the vicinity of a side surface of the personal computer case 1 on the display 3 side which is connected to the personal computer case 1 so as to be openable and closable about the rotating shaft 2. CPU5 arranged on the bottom
The heat sink 8 is disposed so as to be able to exchange heat with the heat sink 8 disposed on the opposite side, that is, on the bottom face near the side face to which the display 3 is not connected. The heat sink 8 includes a base plate 9 and a large number of flat fins 10 provided so as to protrude (stand) from the base plate 9. As shown in FIG. 3, the heat sink 8 is provided in a state where the flat plate fins 10 are orthogonal to the axial direction of the first heat pipe 30.
Further, a groove 11 is provided below the base plate 9. The groove 11 is provided in the first heat pipe 30
The first heat pipe 30 is fitted in the groove 11 or is attached to the groove 11 so as to be able to exchange heat with a certain attachment member.

In the present invention, the position of the heat sink 8 is determined by changing the position of the CPU 5 provided on the bottom surface near the side of the personal computer case 1 to which the display 3 is connected.
, That is, the bottom portion near the side portion where the display 3 is not connected.
There is no particular restriction, and it can be freely arranged inside the personal computer case 1. Although an intermediate portion of the first heat pipe 30 is provided in a straight line in FIG. 1, it passes through a gap between parts (not shown) provided inside the personal computer case 1, so-called dead space. It may be bent.

A small blower 12 (hereinafter referred to as a micro fan 12) is integrally attached to the heat sink 8. As the micro fan 12, a rotating blade is used as a main body 13 of the micro fan 12.
, A fan of the upper suction side blowout type (radial flow type) provided therein, and the blowout portion 14 is attached in parallel with the flat fin 10 of the heat sink 8. The micro fan 12 is configured to be driven by the power of a battery (not shown) provided as a standard inside the personal computer case 1.

On the other hand, the heat sink 8 is arranged near the exhaust hole 15 provided on the side wall surface of the personal computer case 1. That is, when the micro fan 12 is operated, the air inside the personal computer case 1 enters the inside of the main body 13 through the opening of the micro fan 12 and flows toward the blowout portion 14 of the micro fan 12 as shown by the arrow. After that, it passes through the heat sink 8 and is further sent out through the exhaust hole 15.

A hinge mechanism 16 is fitted to the connection portion between the personal computer case 1 and the display 3 by means such as fitting or screwing. In particular,
The hinge mechanism 16 includes a holding member 17 made of a member having a high thermal conductivity and the covering member 1 for coating the outer peripheral portion of the holding member 17.
8, and the holder 17 is provided with the second heat pipe 4
0 and the end of the third heat pipe 50 are hinge mechanism 1
6 are held in close contact with each other along the axis 6.

That is, the holder 17 of the hinge mechanism 16
In addition, one end of the second heat pipe 40 is attached so as to be able to exchange heat, and the other end of the second heat pipe 40 is attached to the above-described heat receiving member 6 so as to be able to exchange heat. Further, the third holder 17 of the hinge mechanism 16 has a third
One end of the heat pipe 50 is inserted from the right side in FIG. 1, and the third heat pipe 50 is configured to be freely rotatable inside the holding body 17 around its central axis. Specifically, the hinge mechanism 16 includes the rotating shaft 2
Have a linear circular hole along the same axis. One end of a circular third heat pipe 50 corresponding to the circular hole is inserted. In other words, the inserted one end is not fixed at all and is rotatable. Further, one end of the third heat pipe 50 held by the holder 17 of the hinge mechanism 16 is disposed on the same axis as the rotation shaft 2 provided in the personal computer case 1.

As described above, the third heat pipe 50 and the second heat pipe 50
The heat pipe 40 is in close contact with each other via the hinge mechanism 16 and connected so as to be able to exchange heat, and the second heat pipe 40 is provided so as to be able to exchange heat with the heat receiving member 6. And the heat sink 8 are connected by a first heat pipe 30.

That is, in this embodiment, one end of at least two heat pipes is connected to an electronic element or the like which is an operating member that generates heat so that heat can be exchanged, and the other end of one heat pipe is connected to a hinge mechanism. The other end of the other heat pipe is connected to a hinge mechanism 16.
The heat sink 8 is provided so as to be able to exchange heat with the heat sink 8 provided at a distance from the heat sink 8. 8 can be arranged so as to be able to exchange heat. Specifically, CPU
When it is necessary to install the CPU 5 and the heat sink 8 in the most distant state, for example, even if the CPU 5 and the heat sink 8 are arranged at opposite corners inside the personal computer case 1, heat can be exchanged between each other using the heat pipe. Can be arranged. That is, the degree of freedom in the position of the heat sink 8 inside the personal computer case 1 can be improved regardless of the position where the CPU 5 is installed.

On the other hand, the other end of the third heat pipe 50 is bent substantially at a right angle, and is attached in a posture along the electromagnetic shielding plate 4 corresponding to a heat radiating portion provided in the display 3. . In other words, the other end of the third heat pipe 50 is disposed so as to be able to exchange heat with the electromagnetic shielding plate 4, and one end of the third heat pipe 50 is hinged with the erecting / tilting operation of the display 3. The mechanism 11 is configured to rotate along the central axis while being in close contact with the holding body 12.

Next, the operation of the cooling device configured as described above will be described. Also in the above notebook personal computer, heat is generated from the CPU 5 with use. This CP
When the heat of U5 is transmitted to one end of the first heat pipe 30 via the heat receiving member 6, a temperature difference occurs at both ends of the first heat pipe 30, so that the heat pipe operation is automatically started.

More specifically, the liquid-phase working fluid sealed in the container of the first heat pipe 30 is heated by the CPU 5 to evaporate, and the vapor is evaporated at the other end of the container having a low internal pressure, ie, It flows toward the end connected to the heat sink 8, where it radiates heat to the heat sink 8 and condenses. The working fluid that has returned to the liquid phase is
It flows on the inner surface of the container toward one end of the first heat pipe 30, where it is heated by the heat of the CPU 5 and evaporates again.

The heat of the CPU 5 is transmitted from the second heat pipe 40 to the third heat pipe 50. Specifically, one end of the second heat pipe 40 provided in the CPU 5 receives heat generated from the CPU 5, and the liquid-phase working fluid sealed in the container of the second heat pipe evaporates. The vapor flows toward the other end of the container having a low internal pressure, that is, the end connected to the holder 17 of the hinge mechanism 16. The third heat pipe 50 starts operating by receiving the heat of the second heat pipe 40 and heating one end of the third heat pipe 50.

When the personal computer is used, the display 3 is usually in an upright state.
The heat pipe 50 operates in a bottom heat mode in which one end disposed on the hinge mechanism 16 is positioned below. Specifically, the working fluid vapor is generated on the inner surface of the end portion of the hinge mechanism 16 held by the holder 17, and the vapor flows toward the end portion provided on the display 3 and the electromagnetic shielding plate Heat is released to 4 and condenses. further,
The heat is transmitted from the electromagnetic shielding plate 4 to the display 3,
Dissipated from its surface to the outside. As a result, the CPU 5 is cooled.

Here, when the amount of heat generated by the CPU 5 is increased due to continuous use of the personal computer for a long time, cooling using the micro fan 12 is started. Specifically, by driving the micro fan 12, the air inside the personal computer case 1 flows from the opening of the micro fan 12 to the main body 13 as indicated by an arrow in FIG.
And moves toward the outlet 14 of the micro fan 12 as it is. As described above, since the heat of the CPU 5 is supplied to the heat sink 8 from the first heat pipe 30 at this point in time, the heat of the heat sink 8 is taken away by the air flow of the micro fan 12 and the heat sink 8 is cooled. Is done. The heated airflow is discharged from the exhaust hole 15 to the outside of the personal computer case 1. That is, a part of the heat of the heat sink 8 is transferred to the outside of the personal computer case 1 together with the air flow.

On the other hand, the third heat pipe 5
The cooling with 0 is also performed continuously. That is, the heat of the CPU 5 installed inside the personal computer case 1 is discharged to the outside from each of the display 3 and the exhaust hole 15. As a result, overheating of the CPU 5 can be prevented.

As described above, according to the above specific example, the CP
It is possible to appropriately select two types of cooling means according to the heat generation state of U5, and it is not necessary to drive the microfan 12 constantly, so that the power consumption of the microfan 12 can be suppressed low. Further, there is an advantage that the driving sound of the micro fan 12 is not generated when the heat generation amount of the CPU 5 is small. A heat pipe for transporting heat from the CPU 5 to the hinge mechanism 16;
And a heat pipe for transporting heat from the heat sink 5 to the heat sink 8.
The degree of freedom of the arrangement position inside can be improved.

In the above specific example, the electromagnetic shielding plate is exemplified as the heat radiating portion of the display. However, the present invention is not limited to the above specific example. For example, the end of the third heat pipe may be connected to the outer wall surface of the display. It is good also as a structure exposed along and along. Further, in the above specific example, the heat pipe mechanism is configured by the single pipe type heat pipe, but the present invention is not limited to the specific example, and for example, a loop type heat pipe can be adopted as the heat pipe mechanism.

[0031]

As described above, according to the present invention,
At least one end of at least two heat pipes is disposed so as to be capable of exchanging heat with an operating member that generates heat, such as a CPU.
The other end of one of the heat pipes is arranged to be able to exchange heat with the hinge mechanism, and the other end of the other heat pipe is arranged to be able to exchange heat with the heat sink. In other words, since there is a heat pipe that transports heat from the operating member to the hinge mechanism and a heat pipe that transports heat from the operating member to the heat sink separately, the position of the heat sink inside the PC case is restricted. And the degree of freedom of arrangement can be improved. Furthermore, since the micro fan needs to be driven only when the amount of heat generated by the operation member is large, the power consumption can be reduced as compared with the conventional case.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a specific example in which the present invention is applied to a notebook computer.

FIG. 2 is an overall view showing a heat receiving member.

FIG. 3 is a diagram showing an arrangement state of a CPU, a heat receiving member, and a heat sink.

FIG. 4 is a diagram showing a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Personal computer case, 2 ... Rotation axis, 3 ... Display, 4 ... Electromagnetic shielding plate, 5 ... CPU, 6 ... Heat receiving member, 8 ... Heat sink, 30 ... 1st heat pipe, 40 ... 2nd heat pipe, 50 ... Third heat pipe.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Koichi Mashiko 1-5-1, Kiba, Koto-ku, Tokyo F-term in Fujikura Co., Ltd. (Reference) 5E322 AA01 AA03 AA11 AB11 BA01 BB03 DB10 FA01 5F036 AA01 BB01 BB60

Claims (1)

[Claims] 1. A cooling device for a personal computer, wherein the personal computer has an operating member that generates heat and a display that can be opened and closed about a rotation axis connected to the personal computer body. One end of one of the heat pipes is disposed so as to be capable of exchanging heat, and the other end of one of the heat pipes is disposed near a connection point between the personal computer body and the display. A cooling device for a personal computer, wherein the cooling device is provided so as to be capable of exchanging heat with the mechanism and the other end of the other heat pipe is arranged so as to be able to exchange heat with a heat sink provided separately from the hinge mechanism.