JP2000244095A - Board surface roughening method, board surface roughening equipment, manufacture of printed wiring board and manufacturing equipment of printed wiring board - Google Patents
Board surface roughening method, board surface roughening equipment, manufacture of printed wiring board and manufacturing equipment of printed wiring boardInfo
- Publication number
- JP2000244095A JP2000244095A JP11043874A JP4387499A JP2000244095A JP 2000244095 A JP2000244095 A JP 2000244095A JP 11043874 A JP11043874 A JP 11043874A JP 4387499 A JP4387499 A JP 4387499A JP 2000244095 A JP2000244095 A JP 2000244095A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light beams
- light
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、特にビルドアップ
印刷配線板の製造に用いられる技術に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique used for manufacturing a build-up printed wiring board.
【０００２】[0002]
【従来の技術】従来のビルドアップ印刷配線板の製造
は、図１０に示す様に、以下の手順で行われる。2. Description of the Related Art A conventional build-up printed wiring board is manufactured by the following procedure as shown in FIG.
【０００３】（１）絶縁樹脂基板上に導体回路を形成し
たコア層を作成する（図１０（ａ））。(1) A core layer having a conductor circuit formed on an insulating resin substrate is formed (FIG. 10A).
【０００４】（２）コア層に感光性絶縁樹脂を印刷する
（図１０（ｂ））。(2) A photosensitive insulating resin is printed on the core layer (FIG. 10B).
【０００５】（３）感光性絶縁樹脂にマスクパターンを
露光・現像することで感光性絶縁樹脂にホトビアを形成
した基板を作成する（図１０（ｃ））。(3) By exposing and developing a mask pattern on the photosensitive insulating resin, a substrate having a photovia formed on the photosensitive insulating resin is prepared (FIG. 10C).
【０００６】（４）この基板の感光性絶縁樹脂の表面を
粗化し、後の金属めっきの密着性を良くし、次に絶縁樹
脂表面に無電解めっきし、その無電解めっき層に電解め
っきし銅層を形成する（図１０（ｄ））。(4) The surface of the photosensitive insulating resin of the substrate is roughened to improve the adhesion of the metal plating later, then the surface of the insulating resin is electrolessly plated, and the electroless plating layer is electrolytically plated. A copper layer is formed (FIG. 10D).
【０００７】（５）その銅層上にホトレジストを印刷し
回路パターンを露光・現像し、銅層をエッチングし部品
端子パターンや配線パターンを形成する（図１０
（ｅ））。(5) A photoresist is printed on the copper layer, a circuit pattern is exposed and developed, and the copper layer is etched to form a component terminal pattern and a wiring pattern (FIG. 10).
(E)).
【０００８】この（４）で、銅層の部品端子パターンと
感光性絶縁樹脂の密着性を改善することがビルドアップ
印刷配線板を製造する重要な要素の一つとなっている。In (4), improving the adhesion between the component terminal pattern of the copper layer and the photosensitive insulating resin is one of the important factors for manufacturing a build-up printed wiring board.
【０００９】このために（４）における感光性絶縁樹脂
の表面の粗化処理を行なう方法として、従来、特開平５
−３７１２９号記載の「プリント配線板の製造方法」
で、エキシマレーザで絶縁樹脂の表面とめっき金属との
密着性を良くする方法、また、特開平７−１１６８７０
号記載の「基材表面の処理方法」で、紫外線レーザで絶
縁樹脂の表面を粗化しめっき金属の密着性を良くする方
法が知られている。For this purpose, as a method of performing a roughening treatment on the surface of a photosensitive insulating resin in (4), a method disclosed in
"Method for manufacturing printed wiring board" described in JP-A-37129
A method for improving the adhesion between the surface of the insulating resin and the plated metal by using an excimer laser is disclosed in Japanese Patent Application Laid-Open No. HEI 7-116870.
In Japanese Patent Application Laid-Open No. H10-163, there is known a method of roughening the surface of an insulating resin with an ultraviolet laser to improve the adhesion of a plated metal.
【００１０】しかし、この従来方法では、高価なエキシ
マレーザ、紫外線レーザを用いるため、印刷配線板の製
造コストが高くなる欠点がある。However, this conventional method has a drawback that the production cost of the printed wiring board is increased because expensive excimer laser and ultraviolet laser are used.
【００１１】そのため、ランニングコストがより安価な
炭酸ガスレーザで基板表面を粗化する方法が考えられ、
この技術としては特開平１０−１３９９００号記載の
「樹脂表面の加工方法」が提案されている。この方法で
は、炭酸ガスレーザ光をカライドスコープ（管状干渉光
学系）に通し、ミラー面による多重反射を利用して、点
状の集合干渉パターンを発生させ、この模様により樹脂
表面を加工するものである。For this reason, a method of roughening the substrate surface with a carbon dioxide laser whose running cost is lower is considered.
As this technique, a “method for processing a resin surface” described in JP-A-10-139900 has been proposed. In this method, a carbon dioxide laser beam is passed through a kaleidoscope (tubular interference optical system) to generate a point-like collective interference pattern using multiple reflection by a mirror surface, and the resin surface is processed by the pattern. is there.
【００１２】[0012]
【発明が解決しようとする課題】しかし、炭酸ガスレー
ザを用いる場合には、その波長が長いため、カライドス
コープの点列の周期のきめが荒くなる。特に５０ミクロ
ン程度の寸法の回路パターンを形成する印刷配線板にお
いては、カライドスコープによる点列の周期での食刻模
様は、きめが荒すぎ使えないという問題があった。However, in the case of using a carbon dioxide gas laser, the wavelength of the laser beam is long, so that the period of the point sequence of the kaleidoscope becomes rough. In particular, in a printed wiring board on which a circuit pattern having a size of about 50 microns is formed, there is a problem that the texture of the etching pattern in a dot sequence by a kaleidoscope is too rough and cannot be used.
【００１３】この理由は、炭酸ガスレーザ光のカライド
スコープによる干渉模様のピッチは、炭酸ガスレーザ光
の波長が１０．６μｍと大きいため、カライドスコープ
に通常の光学系で可能な最大広がり角度６０の光束を入
射させた場合でも、光束のカライドスコープの軸から成
す角度の平均は２０度程度以上にはならない。この場合
は、波長の１．５倍の１５ミクロン程度のピッチの干渉
パターンを生じるが、光束の方向のカライドスコープの
軸と成す平均角度がより少ない通常の場合は更に大きい
ピッチの干渉パターンしか生じ得ない。このため、炭酸
ガスレーザ光の波長の１０．６μｍ以下のピッチの干渉
模様はカライドスコープでは得られなかったからであ
る。The reason for this is that the pitch of the interference pattern of the carbon dioxide laser beam by the kaleidoscope is such that the wavelength of the carbon dioxide laser beam is as large as 10.6 μm. Even when a light beam is incident, the average angle of the light beam from the axis of the kaleidoscope does not exceed about 20 degrees. In this case, an interference pattern with a pitch of about 15 microns, which is 1.5 times the wavelength, is generated. However, in the normal case where the average angle formed with the axis of the kaleidoscope in the direction of the light beam is smaller, only an interference pattern with a larger pitch is generated. Cannot occur. For this reason, an interference pattern with a pitch of 10.6 μm or less of the wavelength of the carbon dioxide laser beam could not be obtained with the kaleidoscope.
【００１４】本発明の主な目的はランニングコストがよ
り安価な炭酸ガスレーザを用いても、その波長が長くて
も、その波長（１０μｍ）よりも細かい周期の干渉パタ
ーンを生じさせる光学系統を提供し、この光学系統を用
いる事で、５０μｍ程度の寸法の回路パターンに対応す
るきめの細かい粗化模様を得、それにより印刷配線板の
絶縁樹脂の表面を粗化する事で部品端子と絶縁樹脂層の
密着性を改善した印刷配線板を提供することにある。A main object of the present invention is to provide an optical system which generates an interference pattern having a period finer than the wavelength (10 μm) even if a carbon dioxide laser whose running cost is lower is used or its wavelength is long. By using this optical system, a finely roughened pattern corresponding to a circuit pattern having a size of about 50 μm is obtained, thereby roughening the surface of the insulating resin of the printed wiring board, thereby making the component terminals and the insulating resin layer To provide a printed wiring board with improved adhesion.
【００１５】[0015]
【課題を解決するための手段】本発明は上記課題を解決
すべく、以下に掲げる構成とした。請求項１記載の発明
の要旨は、レーザー装置の光束を用いて基板の表面を粗
化する基板表面粗化方法であって、前記レーザー装置か
らの光束を３本以上に分光し、分光された前記各光束を
鏡により前記基板上の一点に集光して円形に投影し、前
記各光束を干渉させて点模様に前記基板の表面を食刻
し、前記基板を移動させ、前記基板の複数箇所に点配列
模様を食刻することを特徴とする基板表面粗化方法に存
する。請求項２記載の発明の要旨は、前記レーザー装置
からの光束を３本に分光することを特徴とする請求項１
記載の基板表面粗化方法に存する。請求項３記載の発明
の要旨は、前記レーザー装置からの光束を４本に分光す
ることを特徴とする請求項１記載の基板表面粗化方法に
存する。請求項４記載の発明の要旨は、前記点配列模様
における前記点模様間のピッチは、前記光束の波長以下
であることを特徴とする基板表面粗化方法請求項５記載
の発明の要旨は、レーザー装置の光束を用いて基板の表
面を粗化する基板表面粗化装置であって、前記レーザー
装置からの光束を３本以上に分光する分光手段と、分光
された前記各光束を前記基板上の一点に集光して円形に
投影し、前記各光束を干渉させて点模様に前記基板の表
面を食刻する可能にする鏡と、前記基板を移動させ、前
記基板の複数箇所に点配列模様を食刻可能にする送り機
構とを備えたことを特徴とする基板表面粗化装置に存す
る。請求項６記載の発明の要旨は、前記分光手段は、前
記レーザー装置からの光束を２本に分光可能な位置に設
けられ、さらに、これら２本の光束のうちの１本の光束
を２本に分光可能な位置に設けられ、全部で３本の光束
に分光することを特徴とする請求項５記載の基板表面粗
化装置に存する。請求項７記載の発明の要旨は、前記分
光手段は、前記レーザー装置からの光束を２本に分光可
能な位置に設けられ、さらに、これら２本の光束をそれ
ぞれ２本に分光可能な位置に設けられ、全部で４本の光
束に分光することを特徴とする請求項５記載の基板表面
粗化装置に存する。請求項８記載の発明の要旨は、前記
パルスレーザ装置は炭酸ガスパルスレーザであることを
特徴とする請求項５乃至７のいずれかに記載の基板表面
粗化装置に存する。請求項９記載の発明の要旨は、前記
分光手段は、格子鏡であることを特徴とする請求項５乃
至８のいずれかに記載の基板表面粗化装置に存する。請
求項１０記載の発明の要旨は、前記送り機構は、前記基
板を設置する回転テーブルと、該回転テーブルに、前記
基板を回転の半径方向に移動させる一軸送り機構を用い
たことを特徴とする請求項５乃至９のいずれかに記載の
基板表面粗化装置に存する。請求項１１記載の発明の要
旨は、絶縁基板状に導体回路を形成したコア層を作成し
た基板に、レーザー装置を用いて食刻することにより印
刷配線板を製造する印刷配線板の製造方法であって、前
記レーザー装置からの光束を３本以上に分光し、分光さ
れた前記各光束を鏡により前記基板上の一点に集光して
円形に投影し、前記各光束を干渉させて点模様に前記基
板の表面を食刻し、前記基板を移動させ、前記基板の複
数箇所に点配列模様を食刻し、前記基板表面に導体膜を
無電解めっきし、該無電解めっき層に電解めっきで導体
層を形成し、該導体層上にフォトレジストを印刷しフォ
トレジストに回路パターンを露光・現像しエッチングレ
ジスト膜を形成し、該エッチングレジスト膜で保護され
た導体を残すエッチングを行い回路パターンを形成する
ことを特徴とする印刷配線板の製造方法に存する。請求
項１２記載の発明の要旨は、前記光束を３本に分光する
ことを特徴とする請求項１１記載の印刷配線板の製造方
法に存する。請求項１３記載の発明の要旨は、前記光束
を４本に分光することを特徴とする請求項１１記載の印
刷配線板の製造方法に存する。請求項１４記載の発明の
要旨は、前記コア層に感光性の基板を印刷し露光現像し
て該基板にホトビアを形成することを特徴とする、請求
項１１乃至１３のいずれかに記載の印刷配線板の製造方
法に存する。請求項１５記載の発明の要旨は、前記コア
層に前記基板を印刷し、この基板にパルスレーザ光束に
より穴をあけることを特徴とする請求項１１乃至１４の
いずれかに記載の印刷配線板の製造方法に存する。請求
項１６記載の発明の要旨は、前記点配列模様における前
記点模様間のピッチは、前記光束の波長以下であること
を特徴とする請求項１１乃至１５のいずれかに記載の印
刷配線板の製造方法に存する。請求項１７記載の発明の
要旨は、絶縁基板状に導体回路を形成したコア層を作成
した基板に、レーザー装置を用いて食刻することにより
印刷配線板を製造する印刷配線板の製造装置であって、
前記レーザー装置からの光束を３本以上に分光する分光
手段と、分光された前記各光束を前記基板上の一点に集
光して円形に投影し、前記各光束を干渉させて点模様に
前記基板の表面を食刻する可能にする鏡と、前記基板を
移動させ、前記基板の複数箇所に点配列模様を食刻可能
にする送り機構と、前記基板表面に導体膜を無電解めっ
きするメッキ手段と、該無電解めっき層に電解めっきで
導体層を形成し、該導体層上にフォトレジストを印刷し
フォトレジストに回路パターンを露光・現像しエッチン
グレジスト膜を形成するレジスト膜形成手段と、前記エ
ッチングレジスト膜で保護された導体を残すエッチング
を行い回路パターンを形成するエッチング手段とを備え
たことを特徴とする印刷配線板の製造装置に存する。請
求項１８記載の発明の要旨は、前記分光手段は、前記レ
ーザー装置からの光束を２本に分光可能な位置に設けら
れ、さらに、これら２本の光束のうちの１本の光束を２
本に分光可能な位置に設けられ、全部で３本の光束に分
光することを特徴とする請求項１７記載の印刷配線板の
製造装置に存する。請求項１９記載の発明の要旨は、前
記分光手段は、前記レーザー装置からの光束を２本に分
光可能な位置に設けられ、さらに、これら２本の光束を
それぞれ２本に分光可能な位置に設けられ、全部で４本
の光束に分光することを特徴とする請求項５記載の印刷
配線板の製造装置に存する。請求項２０記載の発明の要
旨は、前記パルスレーザ装置は炭酸ガスパルスレーザで
あることを特徴とする請求項５乃至７のいずれかに記載
の印刷配線板の製造装置に存する。請求項２１記載の発
明の要旨は、前記分光手段は、格子鏡であることを特徴
とする請求項５乃至８のいずれかに記載の印刷配線板の
製造装置に存する。請求項２２記載の発明の要旨は、前
記送り機構は、前記基板を設置する回転テーブルと、該
回転テーブルに、前記基板を回転の半径方向に移動させ
る一軸送り機構を用いたことを特徴とする請求項５乃至
９のいずれかに記載の印刷配線板の製造装置に存する。
請求項２３記載の発明の要旨は、前記点配列模様におけ
る前記点模様間のピッチは、前記光束の波長以下である
ことを特徴とする請求項１７乃至２２のいずれかに記載
の印刷配線板の製造方法に存する。Means for Solving the Problems In order to solve the above problems, the present invention has the following constitution. The gist of the invention according to claim 1 is a substrate surface roughening method for roughening the surface of a substrate using a light beam of a laser device, wherein the light beam from the laser device is separated into three or more light beams and separated. Each of the light beams is condensed on a point on the substrate by a mirror and projected in a circle, the surfaces of the substrate are etched in a dot pattern by interfering with each of the light beams, the substrate is moved, and a plurality of the substrates are moved. The present invention resides in a method for roughening the surface of a substrate, characterized in that a point array pattern is etched at a location. The gist of the invention described in claim 2 is that the light beam from the laser device is split into three light beams.
The present invention resides in the substrate surface roughening method described above. The gist of the invention according to claim 3 resides in the method for roughening a substrate surface according to claim 1, wherein the light beam from the laser device is divided into four beams. The gist of the invention according to claim 4 is that the pitch between the dot patterns in the dot array pattern is equal to or less than the wavelength of the light flux. What is claimed is: 1. A substrate surface roughening device for roughening the surface of a substrate using a light beam of a laser device, comprising: a spectroscopic unit for dispersing a light beam from the laser device into three or more light beams; A mirror that converges on one point and projects it in a circle, allowing each light beam to interfere and etch the surface of the substrate in a dot pattern, moving the substrate, and arranging points at a plurality of locations on the substrate A substrate surface roughening device is provided with a feed mechanism capable of etching a pattern. The gist of the invention according to claim 6 is that the spectroscopic means is provided at a position where the light beam from the laser device can be divided into two light beams, and further, one of the two light beams is converted into two light beams. The substrate surface roughening apparatus according to claim 5, wherein the apparatus is provided at a position where the light can be separated into three light beams, and splits the light into three light beams in total. The gist of the invention according to claim 7 is that the spectroscopic means is provided at a position where the light beam from the laser device can be split into two light beams, and further, at a position where each of these two light beams can be split into two light beams. The substrate surface roughening device according to claim 5, wherein the light is split into four light beams in total. The gist of the present invention resides in a substrate surface roughening apparatus according to any one of claims 5 to 7, wherein the pulse laser device is a carbon dioxide pulse laser. According to a ninth aspect of the present invention, there is provided the substrate surface roughening apparatus according to any one of the fifth to eighth aspects, wherein the spectroscopic means is a grating mirror. The gist of the invention according to claim 10 is that the feed mechanism uses a rotary table on which the substrate is placed and a uniaxial feed mechanism that moves the substrate in a radial direction of rotation on the rotary table. A substrate surface roughening apparatus according to any one of claims 5 to 9. The gist of the invention according to claim 11 is a method of manufacturing a printed wiring board, wherein a printed wiring board is manufactured by etching a substrate having a core layer in which a conductor circuit is formed on an insulating substrate by using a laser device. A light beam from the laser device is divided into three or more light beams, and the separated light beams are condensed at one point on the substrate by a mirror and projected in a circular shape. Etching the surface of the substrate, moving the substrate, etching the dot array pattern at a plurality of locations on the substrate, electrolessly plating a conductive film on the substrate surface, and electroplating the electroless plating layer. Forming a conductive layer on the conductive layer, printing a photoresist on the conductive layer, exposing and developing a circuit pattern on the photoresist to form an etching resist film, and performing etching to leave a conductor protected by the etching resist film. To It consists in a method of manufacturing a printed wiring board, which comprises forming. According to a twelfth aspect of the present invention, there is provided a method of manufacturing a printed wiring board according to the eleventh aspect, wherein the light beam is split into three beams. The gist of the invention according to claim 13 resides in the method of manufacturing a printed wiring board according to claim 11, wherein the light flux is split into four beams. The gist of the invention described in claim 14 is that the photosensitive substrate is printed on the core layer, and is exposed and developed to form a photovia on the substrate. A method for manufacturing a wiring board. The gist of the invention according to claim 15 is that the substrate is printed on the core layer, and a hole is formed in the substrate with a pulsed laser beam. Lies in the manufacturing method. The gist of the invention according to claim 16 is that the pitch between the dot patterns in the dot array pattern is equal to or less than the wavelength of the luminous flux. Lies in the manufacturing method. The gist of the invention according to claim 17 is a printed wiring board manufacturing apparatus for manufacturing a printed wiring board by etching a substrate on which a core layer in which a conductor circuit is formed on an insulating substrate by using a laser device. So,
Spectroscopic means for dispersing the light beam from the laser device into three or more light beams, and condensing each of the separated light beams at one point on the substrate and projecting the light beam in a circle, causing the light beams to interfere with each other to form a point pattern; A mirror for etching the surface of the substrate, a feed mechanism for moving the substrate and etching a dot array pattern at a plurality of locations on the substrate, and plating for electrolessly plating a conductive film on the substrate surface Means, a resist film forming means for forming a conductive layer on the electroless plating layer by electrolytic plating, printing a photoresist on the conductive layer, exposing and developing a circuit pattern on the photoresist to form an etching resist film, An etching means for forming a circuit pattern by performing etching for leaving a conductor protected by the etching resist film. The gist of the invention according to claim 18 is that the spectroscopic means is provided at a position where the light beam from the laser device can be divided into two light beams, and further, one of the two light beams is converted into two light beams.
18. The apparatus for manufacturing a printed wiring board according to claim 17, wherein the apparatus is provided at a position where the light can be split into the book, and splits the light into three light beams in total. The gist of the invention according to claim 19 is that the spectroscopic means is provided at a position where the light beam from the laser device can be split into two light beams, and further, at a position where each of these two light beams can be split into two light beams. An apparatus for manufacturing a printed wiring board according to claim 5, wherein the apparatus is provided and splits the light into four light beams in total. The gist of the invention according to claim 20 resides in the apparatus for manufacturing a printed wiring board according to any one of claims 5 to 7, wherein the pulse laser device is a carbon dioxide pulse laser. The gist of the invention according to claim 21 resides in the apparatus for manufacturing a printed wiring board according to any one of claims 5 to 8, wherein the spectroscopic means is a grating mirror. The gist of the invention according to claim 22 is that the feed mechanism uses a rotary table for setting the substrate, and a uniaxial feed mechanism for moving the substrate in a radial direction of rotation on the rotary table. An apparatus for manufacturing a printed wiring board according to any one of claims 5 to 9.
The gist of the invention according to claim 23 is that the pitch between the dot patterns in the dot array pattern is equal to or less than the wavelength of the light flux. Lies in the manufacturing method.
【００１６】本発明の特徴は、部品端子と絶縁樹脂との
密着性を改善する基板表面粗化装置であり、その装置を
用いて基板表面を粗化することにより印刷配線板を製造
することを特徴とする。A feature of the present invention is a substrate surface roughening apparatus for improving the adhesion between component terminals and an insulating resin. The apparatus is used to manufacture a printed wiring board by roughening the substrate surface. Features.
【００１７】図１に、本発明による光学系統の側面を示
すように、コア層に感光性絶縁樹脂を印刷し露光現像し
てホトビアを形成するという構成に対し、本発明に従っ
て、波長１０．６μｍの炭酸ガス・パルスレーザー光を
光学系により３つあるいは４つの光束に分割し、それぞ
れの光束を異なる３あるいは４方向から１つの領域に収
束させ、それらの光の干渉模様を形成することで部品端
子の形成位置の下地の絶縁樹脂の表面をレーザ光の波長
以下の微小ピッチの模様に食刻する。FIG. 1 shows a side view of an optical system according to the present invention. In contrast to a configuration in which a photosensitive insulating resin is printed on a core layer and exposed and developed to form a photovia, a wavelength of 10.6 μm By dividing the carbon dioxide pulsed laser light into three or four light beams by an optical system, converging each light beam into one region from three or four different directions, and forming an interference pattern of those lights. The surface of the underlying insulating resin at the position where the terminal is formed is etched in a pattern with a minute pitch equal to or smaller than the wavelength of the laser beam.
【００１８】次に、こうして食刻した絶縁樹脂表面に無
電解めっきし、その無電解めっき層に電解めっきし銅層
を形成する。その銅層をエッチングし回路パターンと部
品端子パターンを形成する。こうして絶縁樹脂に干渉模
様を食刻した上に銅めっきしエッチングして部品端子を
形成する。Next, the surface of the insulating resin thus etched is electrolessly plated, and the electroless plating layer is electrolytically plated to form a copper layer. The copper layer is etched to form a circuit pattern and a component terminal pattern. In this way, after the interference pattern is etched on the insulating resin, copper plating and etching are performed to form component terminals.
【００１９】この光学系の投影方法は、従来の設計では
レーザ光の干渉性を整えるため偏光方向を半波長板を用
いて回転させていたが、本発明は半波長板を用いずにレ
ーザ光の偏光方向を整えたことを特徴とする。In the projection method of this optical system, the polarization direction is rotated by using a half-wave plate in order to adjust the coherence of the laser light in the conventional design, but the present invention uses the laser light without using the half-wave plate. Is characterized in that the polarization direction is adjusted.
【００２０】また、炭酸ガスレーザの光束を２つに分割
するために従来はハーフミラーを用い、その材質の透過
によるレーザエネルギーの損失があったが、本発明は、
格子鏡を用いて光を２つに分けることでエネルギー損失
を無くしたことを特徴とする。In addition, a half mirror was conventionally used to split the light beam of the carbon dioxide laser into two, and there was a loss of laser energy due to transmission of the material.
It is characterized in that energy loss is eliminated by splitting light into two using a grating mirror.
【００２１】また、本発明は、レーザ光を基板に垂直方
向から６０度近くの角度を成す３方向あるいは４方向か
ら基板面上に投影するレーザ光束を円筒鏡で反射させレ
ーザ光束を楕円形にすることで光束の基板面上への投影
を円形にそろえるという役目を果たす。Further, according to the present invention, a laser beam projected onto a substrate surface from three or four directions forming an angle of approximately 60 degrees from a direction perpendicular to the substrate is reflected by a cylindrical mirror to make the laser beam into an elliptical shape. By doing so, the projection of the luminous flux on the substrate surface can be made circular.
【００２２】従って、絶縁樹脂に干渉模様を食刻した上
に銅めっきしエッチングして形成した部品端子は絶縁樹
脂との密着性が改善されるという効果が得られる。Therefore, the effect of improving the adhesion of the component terminal formed by etching the insulating resin with the interference pattern, copper plating, and etching with the insulating resin is obtained.
【００２３】[0023]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００２４】（第１の実施の形態）本発明の第１の実施
の形態に係る印刷配線板の製造方法について図１を用い
て説明する。図１には、印刷配線板の製造方法に係る光
学系の側面図が示されている。(First Embodiment) A method for manufacturing a printed wiring board according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 shows a side view of an optical system according to a method for manufacturing a printed wiring board.
【００２５】（１）絶縁樹脂基板上に導体回路を形成し
たコア層を作成する。(1) A core layer having a conductive circuit formed on an insulating resin substrate is formed.
【００２６】（２）コア層に感光性絶縁樹脂を印刷し露
光現像して感光性絶縁樹脂にフォトビアを形成した基板
を作成する。(2) A photosensitive insulating resin is printed on the core layer and exposed and developed to form a substrate having a photo-via formed on the photosensitive insulating resin.
【００２７】（３）パルス幅が１０ｎ秒から１００μ秒
以内の炭酸ガスパルスレーザ（波長１０．６μｍ）の一
パルスのエネルギーが４００ｍＪのレーザ光でビーム直
径が１６ｍｍのレーザ光束で図１の紙面に平行な方向に
偏光した光束を焦点距離５００ｍｍのＺｎＳｅ製凸レン
ズあるいは反射鏡（図示略）で５００ｍｍ先で収束させ
る。(3) A pulsed carbon dioxide gas laser (wavelength: 10.6 μm) having a pulse width of 10 ns to 100 μs and having a pulse energy of 400 mJ is a laser beam having a beam diameter of 16 mm. The luminous flux polarized in the parallel direction is converged 500 mm ahead by a convex lens or a reflecting mirror (not shown) made of ZnSe having a focal length of 500 mm.
【００２８】次に、その先の光路１００ｍｍ以内の位置
に、図の紙面に平行に細長い鏡（図示略）を２ｍｍピッ
チで配列した第１格子鏡（分光手段）を設置し反射光束
と透過光束に分割する。その透過光束を第１格子鏡面と
平行な鏡１０３で反射し、その光束（第１の透過光束）
の光路を第１の光路と呼ぶ。更に反射光束を、鏡１０２
で反射した後に、更に、紙面に垂直方向に細長い鏡群
（図示略）の第２格子鏡（分光手段）で、紙面上の光路
の反射光束と透過光束に分け、両光束を鏡１０７あるい
は鏡１０８で反射し、基板面の垂直線に対して６０度の
角度を成す光路により基板面の同一位置（集光点）で交
わる様にする。また、第１の透過光束は鏡１０４で反射
させ、紙面に垂直で第１の光路を含む平面（第２の平
面）内に向け、それを更に、第２の平面に平行方向の第
３格子鏡（分光手段）で第２の平面内に反射する。この
第３格子鏡で透過光束と反射光束に分けた両光束を鏡１
０９あるいは鏡１１０で反射し、集光点で互いに１２０
度の角度で交わらせる。また、この凸レンズから集光点
までの光路はそれぞれ４０６ｍｍにすることで集光点で
光束の直径を３ｍｍにする。Next, a first grating mirror (spectral means) in which elongated mirrors (not shown) are arranged at a pitch of 2 mm in parallel with the plane of FIG. Divided into The transmitted light beam is reflected by a mirror 103 parallel to the first grating mirror surface, and the light beam (first transmitted light beam)
Is referred to as a first optical path. Further, the reflected light beam is transmitted to the mirror 102.
After that, the light is further divided into a reflected light beam and a transmitted light beam in an optical path on the paper surface by a second grating mirror (spectral means) of a group of mirrors (not shown) which are elongated in a direction perpendicular to the paper surface, and the two light beams are reflected by a mirror 107 or a mirror. The light is reflected at 108, and intersects at the same position (condensing point) on the substrate surface by an optical path that forms an angle of 60 degrees with the vertical line of the substrate surface. Further, the first transmitted light beam is reflected by the mirror 104 and directed into a plane (second plane) perpendicular to the plane of the drawing and including the first optical path, and is further directed to a third grating parallel to the second plane. The light is reflected into a second plane by a mirror (spectral means). The two beams split by the third grating mirror into a transmitted beam and a reflected beam are reflected by a mirror 1
09 or mirror 110, and 120
Meet at an angle of degrees. In addition, the optical path from the convex lens to the converging point is 406 mm, so that the diameter of the light beam at the converging point is 3 mm.
【００２９】この集光点に基板の面を紙面に垂直にし、
その面の法線ベクトルの方向をほぼ第１の光路に平行に
向け配置する。図２（ａ）に基板の面の正面に対する光
学系統を示す。また、鏡１０７、鏡１０８、鏡１０９、
鏡１１０は、基板面から１００ｍｍの光路長の位置に置
き、その鏡面の垂直線に４５度を成す光を入射する、曲
率半径が約１６００ｍｍの凹面の円筒鏡１０とし、その
円筒の軸を基板面に平行に向ける。これら円筒鏡（鏡１
０７、鏡１０８、鏡１０９、鏡１１０）により、基板面
でのレーザ光束を楕円形にし、基板面の垂直線に対して
６０度を成すレーザ光束の基板面への投影を円形にす
る。At this focal point, the surface of the substrate is made perpendicular to the paper,
The direction of the normal vector of the surface is arranged substantially parallel to the first optical path. FIG. 2A shows an optical system with respect to the front surface of the substrate. In addition, mirror 107, mirror 108, mirror 109,
The mirror 110 is placed at a position having an optical path length of 100 mm from the surface of the substrate, and a concave cylindrical mirror 10 having a radius of curvature of about 1600 mm, into which light having an angle of 45 degrees is incident on a vertical line of the mirror surface, and the axis of the cylinder is set to Orient parallel to the surface. These cylindrical mirrors (Mirror 1)
07, mirror 108, mirror 109, and mirror 110), the laser beam on the substrate surface is made elliptical, and the projection of the laser beam on the substrate surface at an angle of 60 degrees to the vertical line of the substrate surface is made circular.
【００３０】すると、鏡１０７と鏡１０８の２つの光束
の干渉により、鏡１０７と鏡１０８の間の距離Ｌの位置
に次式で表わされる電界強度の干渉を生じる。Then, the interference between the two light beams of the mirrors 107 and 108 causes interference of the electric field strength expressed by the following equation at the position of the distance L between the mirrors 107 and 108.
【００３１】Ｅ＝Ｅ１＊Ｃｏｓ（６０度）＊Ｓｉｎ（２
＊π＊Ｌ／Ｐ）E = E1 * Cos (60 degrees) * Sin (2
* Π * L / P)
【００３２】Ｐ＝λ／（Ｓｉｎ（６０度））P = λ / (Sin (60 degrees))
【００３３】ここで、第１格子鏡の反射光束の強度をＥ
１とし、λはレーザ光の波長１０．６μｍであり、Ｓｉ
ｎ（６０度）＝√３／２である。そのため、Ｐ＝６．１
３μｍになる。Here, the intensity of the light beam reflected by the first grating mirror is E
1, λ is the wavelength of the laser beam 10.6 μm, and Si
n (60 degrees) = √3 / 2. Therefore, P = 6.1
3 μm.
【００３４】鏡１０９と鏡１１０の２つの光束の干渉に
より、鏡１０９と鏡１１０の間の距離Ｍの位置に次式で
表わされる電界強度の干渉を生じる。The interference between the two light beams of the mirrors 109 and 110 causes interference of the electric field strength represented by the following equation at the position of the distance M between the mirrors 109 and 110.
【００３５】Ｅ＝Ｅ２＊Ｓｉｎ（２＊π＊Ｍ／Ｐ）E = E2 * Sin (2 * π * M / P)
【００３６】ここで、第１格子鏡の透過光束の強度をＥ
２とする。Here, the intensity of the transmitted light beam of the first grating mirror is E
Let it be 2.
【００３７】透過光束の強度Ｅ２と反射光束の強度Ｅ１
とを、Ｅ２＝Ｅ１Ｃｏｓ（６０度）＝（Ｅ１）／２とす
ると、両干渉縞同士の干渉のバランスが取れ、次式で表
わされる電界強度の干渉縞が現れる。The intensity E2 of the transmitted light beam and the intensity E1 of the reflected light beam
When E2 = E1Cos (60 degrees) = (E1) / 2, the interference between the two interference fringes is balanced, and an interference fringe having an electric field intensity represented by the following equation appears.
【００３８】Ｅ＝２＊Ｅ２＊Ｓｉｎ（２＊π＊Ｘ／（Ｐ
＊√２））＊Ｃｏｓ（２＊π＊Ｙ／（Ｐ＊√２））E = 2 * E2 * Sin (2 * π * X / (P
* √2)) * Cos (2 * π * Y / (P * √2))
【００３９】Ｘ＝（Ｍ＋Ｌ）／√２X = (M + L) / √2
【００４０】Ｙ＝（Ｍ−Ｌ）／√２Y = (ML) / √2
【００４１】すなわち、図２（ｂ）に示す様に、鏡１０
７、１１０と鏡１０９、１０８の間の距離Ｘと、鏡１０
７、１０９と鏡１１０、１０８の間の距離Ｙの座標に平
行な格子模様が現われる。この格子模様のピッチは、電
界値が０になる周期が（√２）＊Ｐ／２＝８．７μｍに
なる。そしてこの周期のピッチの点配列模様があらわれ
る。このピッチは、鏡１０７、１０８、１０９、１１０
からの各光束が基板面の垂直線から６０度の角度を成す
場合であり、この角度が４５度以上の場合に点配列のピ
ッチが光束の波長以上になる。That is, as shown in FIG.
7, the distance X between the mirrors 109 and 108 and the mirror 10
A grid pattern appears parallel to the coordinates of the distance Y between 7, 109 and the mirrors 110, 108. The pitch of the lattice pattern is such that the period at which the electric field value becomes 0 is (√2) * P / 2 = 8.7 μm. Then, a dot array pattern of the pitch of this cycle appears. This pitch is determined by mirrors 107, 108, 109, 110
Is an angle of 60 degrees from the vertical line of the substrate surface. When this angle is 45 degrees or more, the pitch of the point array becomes equal to or more than the wavelength of the light beam.
【００４２】この様にレーザ光束の波長以下の微小ピッ
チの点を生じさせることができ、この点格子を３ｍｍの
領域内に生じさせたパルスレーザ光のエネルギーで感光
性絶縁樹脂の表面に窪みを食刻し基板上の感光性絶縁樹
脂表面を粗化する。１パルス当たり４００ｍＪのエネル
ギーの炭酸ガスレーザを感光性絶縁樹脂上の３ｍｍの直
径の領域に投影し干渉模様を生じさせ、１パルスで４μ
ｍの深さの凹形状を形成する。As described above, it is possible to generate a point having a minute pitch equal to or smaller than the wavelength of the laser beam, and a point grid is formed in a region of 3 mm. The surface of the photosensitive insulating resin on the substrate is roughened by etching. A carbon dioxide laser having an energy of 400 mJ per pulse is projected onto a 3 mm diameter area on the photosensitive insulating resin to generate an interference pattern, and 4 μm per pulse.
A concave shape with a depth of m is formed.
【００４３】基板は基板面に平行方向の２軸方向に送る
送りテーブルに設置し、炭酸ガスパルスレーザを１５０
パルス／秒の周期で出射し、送りテーブルを４５０ｍｍ
／秒の速度でＸ方向に往復運動させ、Ｘ方向の走査毎
に、Ｙ方向に３ｍｍ送ることにより、送りテーブル上の
基板全面をレーザの干渉模様により粗化処理する。こう
して、３００ｍｍ＊３００ｍｍの面積を約７０秒で粗化
する。この粗化処理は、基板上に形成する部品端子の形
成部分等、特定の位置をＸＹテーブルでレーザ照射位置
に位置合わせして粗化する様にして、基板毎に処理する
面積を限定することで更にスループットを上げることも
できる。The substrate is set on a feed table for feeding in two axial directions parallel to the substrate surface, and a carbon dioxide gas pulse laser
Emitted at a pulse / second cycle and the feed table is 450 mm
The laser beam is reciprocated in the X direction at a speed of / second and is fed by 3 mm in the Y direction for each scan in the X direction, whereby the entire surface of the substrate on the feed table is roughened by a laser interference pattern. Thus, the area of 300 mm * 300 mm is roughened in about 70 seconds. In this roughening process, a specific position such as a part terminal forming part formed on a substrate is roughened by aligning it with a laser irradiation position on an XY table, thereby limiting an area to be processed for each substrate. Thus, the throughput can be further increased.
【００４４】（４）こうして表面を干渉模様で粗化した
感光性絶縁樹脂表面に無電解めっきし、その無電解めっ
き層に電解めっきし銅層を形成する。(4) Electroless plating is performed on the surface of the photosensitive insulating resin whose surface is roughened with interference patterns, and the electroless plating layer is electrolytically plated to form a copper layer.
【００４５】（５）その銅層上にフォトレジストを印刷
し回路パターンを露光・現像し、銅層をエッチングし回
路パターンを形成する。(5) A photoresist is printed on the copper layer, the circuit pattern is exposed and developed, and the copper layer is etched to form a circuit pattern.
【００４６】以上の製造方法の（２）で感光性絶縁樹脂
を用いてホトビアを形成したが、このビアの形成を感光
性を有さない絶縁樹脂を形成した後に、炭酸ガスレーザ
の照射により穴あけして形成しても良い。感光性を有さ
ない絶縁樹脂に対しても以上の処理と同様にして絶縁樹
脂の表面を炭酸ガスレーザの干渉模様で食刻できる。In the above manufacturing method (2), a photo via was formed using a photosensitive insulating resin. However, after forming the insulating resin having no photosensitivity, the via was formed by irradiating a carbon dioxide gas laser. May be formed. The surface of the insulating resin having no photosensitivity can be etched by the interference pattern of the carbon dioxide gas laser in the same manner as described above.
【００４７】従来技術に係るカライドスコープでは、十
羽一からげのようなものであったため、点配列模様は荒
かったが、第１の実施の形態によれば、点模様のピッチ
を自由に変えることができるので、きめの細かい点配列
模様を形成することができる。In the callide scope according to the prior art, the point arrangement pattern was rough because it was like a ten-piece, but according to the first embodiment, the pitch of the point pattern can be freely adjusted. Since it can be changed, a finely arranged point array pattern can be formed.
【００４８】また、絶縁樹脂上にパルスレーザで干渉模
様を食刻し粗化し、その上に銅めっきを形成したため、
アンカー効果で銅めっきの絶縁樹脂への密着性が改善さ
れる。Also, since the interference pattern was etched and roughened on the insulating resin by a pulse laser, and copper plating was formed thereon,
The adhesion of the copper plating to the insulating resin is improved by the anchor effect.
【００４９】特に、本実施の形態の光学系統を用いたた
めに、炭酸ガスレーザの波長以下の周期の干渉模様を生
じさせる事が出来る効果がある。In particular, the use of the optical system of the present embodiment has an effect that an interference pattern having a period equal to or less than the wavelength of the carbon dioxide laser can be generated.
【００５０】また、炭酸ガスレーザーを用いているの
で、装置を低廉化することができる。Further, since a carbon dioxide laser is used, the cost of the apparatus can be reduced.
【００５１】（第２の実施の形態）第２の実施の形態の
光学系統を図３と図４に示す。また、図５に第２の実施
の形態の干渉模様を示す。(Second Embodiment) FIGS. 3 and 4 show an optical system according to a second embodiment. FIG. 5 shows an interference pattern according to the second embodiment.
【００５２】第２の実施の形態では、鏡２０２及び鏡２
０３、鏡２０４の出射光は基板面上の集光点に収束し、
それぞれの光束は基板面に垂直方向から７０の角度を成
し、また、光路の基板面への投影が集光点を中心に互い
に１２０度の角度をなす様に配置する。また、鏡２０２
からの光束の電界は基板面に垂直な面内に偏光された直
線偏光にする。鏡２０３及び鏡２０４の両光路を含む面
を共通面と呼ぶと、共通面は基板面から３６度の角度を
成し、その光束の電界の振動方向はその共通面に垂直方
向の直線偏光にする。これにより、鏡２０３及び鏡２０
４の出射光の基板面への投影の電界成分は図のＹ方向を
向く。また、共通面内で両光束の成す角は１０９度であ
り、一方、鏡２０２からの光束の光路（第２の光路）が
共通面と成す角度は１２４度である。In the second embodiment, the mirror 202 and the mirror 2
03, the light emitted from the mirror 204 converges on the focal point on the substrate surface,
Each light beam forms an angle of 70 from the direction perpendicular to the substrate surface, and the light paths are arranged such that the projection of the optical path onto the substrate surface makes an angle of 120 degrees with each other about the focal point. Also, the mirror 202
The electric field of the luminous flux is converted into linearly polarized light polarized in a plane perpendicular to the substrate surface. If a plane including both optical paths of the mirror 203 and the mirror 204 is called a common plane, the common plane forms an angle of 36 degrees from the substrate plane, and the oscillating direction of the electric field of the light flux is linearly polarized light perpendicular to the common plane. I do. Thereby, the mirror 203 and the mirror 20
The electric field component of the projected light of No. 4 onto the substrate surface is directed in the Y direction in the figure. The angle formed by the two light beams in the common plane is 109 degrees, while the angle formed by the light path (second optical path) of the light beams from the mirror 202 with the common plane is 124 degrees.
【００５３】第２の実施の形態の光学系は、炭酸ガスパ
ルスレーザを電界を図３の紙面に垂直な方向に偏光した
光束を焦点距離５００ｍｍのＺｎＳｅ製凸レンズあるい
は反射鏡（図示略）で５００ｍｍ先で収束させる。The optical system according to the second embodiment uses a ZnSe convex lens or a reflecting mirror (not shown) having a focal length of 500 mm to convert a light beam obtained by polarizing a carbon dioxide pulse laser into an electric field in a direction perpendicular to the plane of FIG. Let it converge first.
【００５４】次に、その先の光路１００ｍｍ以内の位置
に、図３の紙面に垂直に細長い鏡２０を２ｍｍピッチで
配列した第１格子鏡により、紙面に平行な反射光束と透
過光束に分割する。Next, at a position within 100 mm of the optical path ahead, a first grating mirror in which elongated mirrors 20 perpendicular to the plane of FIG. 3 are arranged at a pitch of 2 mm is split into a reflected light beam and a transmitted light beam parallel to the paper surface. .
【００５５】その透過光束を第１格子鏡（分光手段）に
５０ｍｍ以内の距離にある第２格子鏡（分光手段）によ
り紙面に平行な反射光束と透過光束とに分ける。その反
射光束と透過光束は紙面に垂直に偏光している。これら
の光束を鏡２０３あるいは鏡２０４で図３の紙面に平行
な方向に反射させ両光束を９７度の角度で交わらせ、交
点を集光点とする。結局、紙面は共通面でもある。ま
た、第１格子鏡の反射光束は、鏡２０１で反射させ第２
の光路に垂直に交わる方向に向ける。光束が第２の光路
と交わる位置に鏡２０２を設置し、光束を反射し第２の
光路に向ける。また、この凸レンズから集光点までの光
路はそれぞれ４０６ｍｍにすることで集光点で光束の直
径を３ｍｍにする。The transmitted light beam is divided into a reflected light beam and a transmitted light beam parallel to the paper surface by a second grating mirror (spectral means) within a distance of 50 mm to the first grating mirror (spectral means). The reflected light beam and the transmitted light beam are polarized perpendicular to the paper surface. These light beams are reflected by the mirror 203 or the mirror 204 in a direction parallel to the plane of FIG. 3 so that the two light beams cross at an angle of 97 degrees, and the intersection is defined as a converging point. After all, space is also a common plane. The light beam reflected by the first grating mirror is reflected by the mirror 201 and is reflected by the second grating mirror.
In the direction perpendicular to the optical path of A mirror 202 is installed at a position where the light beam intersects the second light path, reflects the light beam, and directs the light beam to the second light path. In addition, the optical path from the convex lens to the converging point is 406 mm, so that the diameter of the light beam at the converging point is 3 mm.
【００５６】また、鏡２０２、鏡２０３、鏡２０４は、
基板面から１００ｍｍの光路長の位置に置き、その鏡面
の垂直線に４５度を成す光を入射する、曲率半径が約１
１００ｍｍの凹面の円筒鏡とし、その円筒の軸を基板面
に平行に向ける。これら円筒鏡（鏡２０２、鏡２０３、
鏡２０４）により、基板面でのレーザ光束を楕円形に
し、基板面の垂直線に対して７０度を成すレーザ光束の
基板面への投影を円形にする。The mirrors 202, 203 and 204 are
It is placed at a position of an optical path length of 100 mm from the substrate surface, and a light of 45 degrees is incident on a vertical line of the mirror surface.
A cylindrical mirror having a concave surface of 100 mm is formed, and the axis of the cylinder is directed parallel to the substrate surface. These cylindrical mirrors (mirror 202, mirror 203,
The mirror 204) makes the laser beam on the substrate surface elliptical, and makes the projection of the laser beam on the substrate surface at 70 degrees with respect to the perpendicular to the substrate surface circular.
【００５７】すると、鏡２０３と鏡２０４の２つの光束
の干渉により、次式で表わされる電界強度の干渉を生じ
る。Then, the interference between the two light beams of the mirrors 203 and 204 causes interference of the electric field strength represented by the following equation.
【００５８】Ｅｍ＝２＊Ｅ３＊Ｃｏｓ（５４°）＊Ｓｉ
ｎ（２＊π＊Ｙ／Ｒ）＊Ｃｏｓ（２＊π＊Ｘ／Ｑ）Em = 2 * E3 * Cos (54 °) * Si
n (2 * π * Y / R) * Cos (2 * π * X / Q)
【００５９】Ｐ＝λ／Ｓｉｎ（７０°）P = λ / Sin (70 °)
【００６０】Ｒ＝Ｐ／Ｃｏｓ（６０°）R = P / Cos (60 °)
【００６１】Ｑ＝Ｐ／Ｓｉｎ（６０°）Q = P / Sin (60 °)
【００６２】鏡２０２の光は、以下の式の電界を生じ
る。The light from the mirror 202 produces an electric field of the following formula:
【００６３】Ｅｓ＝Ｅ２＊Ｃｏｓ（７０°）＊Ｓｉｎ
（２＊π＊Ｙ／Ｐ）Es = E2 * Cos (70 °) * Sin
(2 * π * Y / P)
【００６４】鏡２０２からの光束の電界強度Ｅ２と、鏡
２０３からの光の強度（＝鏡２０４からの光の強度）＝
Ｅ３とは、以下の関係式の強度比に調整する。The electric field intensity E2 of the light beam from the mirror 202 and the light intensity from the mirror 203 (= the light intensity from the mirror 204) =
E3 is adjusted to the intensity ratio of the following relational expression.
【００６５】 Ｅ２＝Ｅ３＊Ｃｏｓ（５４°）／Ｃｏｓ（７０°）E2 = E3 * Cos (54 °) / Cos (70 °)
【００６６】全光束の干渉による電界強度Ｅは、以下の
式で表わされる。The electric field intensity E due to the interference of all light beams is expressed by the following equation.
【００６７】Ｅ＝Ｅ０＊Ｓｉｎ（２π＊Ｙ／Ｒ）＊Ｃｏ
ｓ（π＊（（Ｙ／Ｒ）＋（Ｘ／Ｑ）））＊Ｃｏｓ（π＊
（（Ｙ／Ｒ）−（Ｘ／Ｑ）））E = E0 * Sin (2π * Y / R) * Co
s (π * ((Y / R) + (X / Q))) * Cos (π *
((Y / R)-(X / Q)))
【００６８】Ｅ０＝４＊Ｅ２＊Ｃｏｓ（７０°）E0 = 4 * E2 * Cos (70 °)
【００６９】ここで、λはレーザ光の波長１０．６μｍ
であり、Ｓｉｎ（７０°）＝０．９４である。そのた
め、Ｐ＝１１．２μｍになる。Here, λ is the wavelength of the laser beam 10.6 μm
And Sin (70 °) = 0.94. Therefore, P = 11.2 μm.
【００７０】この電界強度の絶対値の最大位置の配列を
図５に示す。値が０のＸ座標軸に平行な縞がＹ方向の間
隔を１１．２μｍに出来る。Ｘ方向から右上がり３０度
の方向に同じ間隔で電界強度値Ｅが０の縞が出来、Ｘ方
向から左上がり３０度の方向に同じ間隔で電界強度値が
０の縞ができる。この縞の間の集光点同士の最短ピッチ
はこれらの干渉縞の長手方向に出来、そのピッチは２Ｐ
／３＝７．５μｍでありレーザ光の波長１０．６μｍよ
りも短い。このピッチは、鏡２０２、２０３、２０４か
らの各光束が基板面に垂直な線から７０度の角度を成す
場合であり、この角度が４２度以上の場合に点配列のピ
ッチが光束の波長以上になる。FIG. 5 shows the arrangement of the maximum position of the absolute value of the electric field intensity. A stripe having a value of 0 and parallel to the X coordinate axis can make the interval in the Y direction 11.2 μm. Stripes having an electric field intensity value of 0 are formed at the same interval in the direction of 30 degrees upward to the right from the X direction, and stripes having an electric field intensity value of 0 are formed at the same interval in the direction of 30 degrees upward to the left from the X direction. The shortest pitch between the condensing points between the fringes is formed in the longitudinal direction of these interference fringes, and the pitch is 2P.
/3=7.5 μm, which is shorter than the laser light wavelength of 10.6 μm. This pitch is when the light beams from the mirrors 202, 203, and 204 form an angle of 70 degrees from a line perpendicular to the substrate surface. When this angle is 42 degrees or more, the pitch of the point array is equal to or more than the wavelength of the light beam. become.
【００７１】第１の実施の形態では４つ必要であった光
学系統を１つ減らし３つの光学系統からの３つのレーザ
光束を絞り込む様にしたため、光学系統がより簡単にす
ることができる。In the first embodiment, since four optical systems required in the first embodiment are reduced by one to narrow down three laser beams from the three optical systems, the optical systems can be made simpler.
【００７２】（第３の実施の形態） （１）基板上に絶縁樹脂を印刷し露光現像する。(Third Embodiment) (1) An insulating resin is printed on a substrate and exposed and developed.
【００７３】（２）パルス幅が１０ｎ秒から１００μ秒
以内のＹＡＧパルスレーザ（波長１．０６μｍ）のレー
ザ光でビーム直径が約１．６ｍｍのレーザ光源で図の紙
面に垂直な方向あるいは平行な方向に偏光した光束を焦
点距離５００ｍｍの凸レンズあるいは反射鏡で５００ｍ
ｍ先で収束させる。以上の部分を第１の実施の形態の光
学系統と置き換え、また、格子鏡をハーフミラーに置き
換えた光学系を用い、レーザ光束を４つに分解し４方か
ら集光させる。(2) A laser light source of a YAG pulse laser (wavelength: 1.06 μm) having a pulse width of 10 ns to 100 μs and having a beam diameter of about 1.6 mm. The light beam polarized in the direction is 500m with a convex lens or a reflecting mirror with a focal length of 500mm.
The convergence is performed m points ahead. The above-described portions are replaced with the optical system of the first embodiment, and an optical system in which a grating mirror is replaced with a half mirror is used to decompose a laser beam into four beams and condense them from four directions.
【００７４】すると、４つの光束の干渉によりレーザー
光の波長より短い０．９μｍのピッチの点配列が直径１
ｍｍ弱の領域に形成された干渉模様が基板上に投影さ
れ、その干渉模様のパルスレーザ光のエネルギーで絶縁
樹脂の表面を微細に食刻し粗化する。Then, a point array having a pitch of 0.9 μm, shorter than the wavelength of the laser beam, having a diameter of 1
The interference pattern formed in the area of less than mm is projected on the substrate, and the surface of the insulating resin is finely etched and roughened by the energy of the pulse laser beam of the interference pattern.
【００７５】基板は基板面に平行方向の２軸方向に送る
送りテーブルに設置し、送りテーブルで基板位置を移動
させレーザ光束の干渉模様の生じる位置を部品端子位置
の下地の絶縁樹脂位置に合わせ、第１の実施の形態ある
いは第２の実施の形態の光学系により干渉模様を食刻し
た粗化処理を施す。The substrate is placed on a feed table that feeds in two axial directions parallel to the substrate surface, and the position of the substrate is moved by the feed table so that the position at which the interference pattern of the laser beam is generated coincides with the position of the insulating resin under the component terminal position. Then, a roughening process in which an interference pattern is etched by the optical system of the first embodiment or the second embodiment is performed.
【００７６】（３）こうして表面を干渉模様で粗化した
絶縁樹脂表面に無電解銅めっきし、その無電解銅めっき
層に電解銅めっきし銅層を形成する。(3) Electroless copper plating is applied to the surface of the insulating resin whose surface has been roughened with interference patterns, and electrolytic copper plating is applied to the electroless copper plating layer to form a copper layer.
【００７７】（４）その銅層上にフォトレジストを印刷
し回路パターンを露光・現像し、銅層をエッチングし回
路パターンを形成する。(4) A photoresist is printed on the copper layer, the circuit pattern is exposed and developed, and the copper layer is etched to form a circuit pattern.
【００７８】第１、第２の実施の形態で炭酸ガスレーザ
を用いた表面粗化装置は、第３の実施の形態の様に、Ｙ
ＡＧレーザを用いた表面粗化装置にも適用できる。本発
明の光学系統をＹＡＧレーザによる表面粗化装置に用い
ると、ＹＡＧレーザの光の波長が炭酸ガスレーザの波長
の１０分の１である事に比例して、１０分の１の細かい
表面粗化を行なうことができる。In the first and second embodiments, the surface roughening apparatus using a carbon dioxide gas laser has a Y
The present invention can also be applied to a surface roughening device using an AG laser. When the optical system of the present invention is used for a surface roughening apparatus using a YAG laser, the surface of the YAG laser is finely roughened by a factor of 10 in proportion to the wavelength of the light of the carbon dioxide gas laser. Can be performed.
【００７９】（第４の実施の形態）第４の実施の形態の
光学系統を図６から図８に示す。また、図９に第４の実
施の形態の干渉模様を示す。(Fourth Embodiment) FIGS. 6 to 8 show an optical system according to a fourth embodiment. FIG. 9 shows an interference pattern according to the fourth embodiment.
【００８０】第１の実施の形態と同様に、炭酸ガスパル
スレーザ光でビーム直径が１６ｍｍのレーザ光束で電界
が図６の紙面に平行な方向に直線偏光した光束を焦点距
離５００ｍｍのＺｎＳｅ製凸レンズあるいは反射鏡（図
示略）で５００ｍｍ先で収束させる。As in the first embodiment, a ZnSe convex lens having a focal length of 500 mm is converted from a laser beam having a beam diameter of 16 mm and a linearly polarized electric field in a direction parallel to the plane of FIG. Alternatively, the light is converged 500 mm ahead by a reflecting mirror (not shown).
【００８１】次に、その先の光路１００ｍｍ以内の位置
に、図６の紙面に垂直に細長い鏡（図示略）を２ｍｍピ
ッチで配列した第１格子鏡（分光手段）を設置し反射光
束と透過光束に分割する。両光束をそれぞれ鏡４０２と
鏡４０３で紙面内の方向に反射させ基板面への垂直線に
５１度の角度を成させ、基板面の共通領域と交わる光路
に向ける。その両光束をそれぞれ第１の光学系と第２の
光学系で以下の様に処理する。第１の光学系と第２の光
学系は同じ対称形にする。Next, a first grating mirror (spectral means) in which elongated mirrors (not shown) are arranged at a pitch of 2 mm in a direction perpendicular to the plane of FIG. Split into luminous flux. Both light beams are reflected by mirrors 402 and 403 in the direction of the plane of the paper, respectively, to make a perpendicular to the substrate surface at an angle of 51 degrees, and to be directed to an optical path intersecting the common area of the substrate surface. The two light beams are processed by the first optical system and the second optical system as follows. The first optical system and the second optical system have the same symmetry.
【００８２】第１の光学系を図７で説明する。図７は図
６の光学系の光軸を含む平面で図１の紙面に垂直な平面
から見た第１の光学系統を示すものである。図７では、
鏡４０２で反射された光束の直線偏光の電界の方向は紙
面に垂直な方向になる。その光束を図７の紙面に垂直に
細長い鏡を１ｍｍピッチで配列した第２格子鏡（分光手
段）を設置し図７の紙面方向に向けた反射光と透過光に
分け、透過光も鏡４０４で図７の紙面方向に向ける。そ
れぞれの光束を鏡４０６あるいは鏡４０７で図７の紙面
内方向に反射させ、両光束を基板面上の集光点で交わり
互いに７６度の角度で交差する光路に乗せる。The first optical system will be described with reference to FIG. FIG. 7 shows a first optical system viewed from a plane including the optical axis of the optical system of FIG. 6 and perpendicular to the plane of FIG. In FIG.
The direction of the electric field of the linearly polarized light of the light beam reflected by the mirror 402 is a direction perpendicular to the paper surface. A second grating mirror (spectral means) in which elongated mirrors are arranged at a pitch of 1 mm perpendicular to the paper surface of FIG. 7 is installed to divide the light beam into reflected light and transmitted light directed toward the paper surface of FIG. To face the paper surface direction of FIG. Each light beam is reflected by the mirror 406 or the mirror 407 in the in-plane direction of FIG. 7, and both light beams are put on an optical path that intersects at a converging point on the substrate surface and intersects at an angle of 76 degrees.
【００８３】第２の光学系も同様に、第２格子鏡で光束
を分け、鏡４０５で透過光の向きを変え、それぞれの光
束を鏡４０８あるいは鏡４０９で反射させ７６度の角度
で交差させ基板面上の集光点に投影する。Similarly, in the second optical system, the light beam is divided by the second grating mirror, the direction of the transmitted light is changed by the mirror 405, and each light beam is reflected by the mirror 408 or 409 and crosses at an angle of 76 degrees. The light is projected onto the focal point on the substrate surface.
【００８４】こうすることで、４本の光束が基板面上の
集光点で交わり、それぞれの光束は基板面の垂直線に対
して６０度の角度を成し、基板面に四方から収束する。
また、この凸レンズから集光点までの光路はそれぞれ４
０６ｍｍにすることで集光点で光束の直径を３ｍｍにす
る。In this way, the four light beams intersect at the converging point on the substrate surface, and each light beam forms an angle of 60 degrees with the vertical line of the substrate surface and converges on the substrate surface from all directions. .
The optical path from the convex lens to the focal point is 4
By setting the diameter to 06 mm, the diameter of the light beam at the focal point is set to 3 mm.
【００８５】また、鏡４０６、鏡４０７、鏡４０８、鏡
４０９は、基板面から１００ｍｍの光路長の位置に置
き、その鏡面の垂直線に４０度を成す光を入射する凹面
の円筒鏡で円筒の曲率半径を約１５００ｍｍとし、その
円筒の軸を基板面に平行に向ける。これらの円筒鏡（鏡
４０６、鏡４０７、鏡４０８、鏡４０９）により、基板
面でのレーザ光束を楕円形にし、基板面の垂直線に対し
て６０度を成すレーザ光束の基板面への投影を円形にす
る。The mirror 406, the mirror 407, the mirror 408, and the mirror 409 are placed at a position having an optical path length of 100 mm from the surface of the substrate, and a cylindrical mirror having a concave surface into which light having an angle of 40 degrees is incident on a perpendicular line of the mirror surface. Has a radius of curvature of about 1500 mm, and the axis of the cylinder is oriented parallel to the substrate surface. These cylindrical mirrors (mirror 406, mirror 407, mirror 408, mirror 409) make the laser beam on the substrate surface elliptical, and project the laser beam on the substrate surface at an angle of 60 degrees with respect to the vertical line of the substrate surface. Into a circle.
【００８６】すると、鏡４０６と鏡４０７の２つの光束
の干渉により、鏡４０６と鏡４０７の間の距離Ｌの位置
に次式で表わされる電界強度の干渉を生じる。Then, the interference between the two light beams of the mirrors 406 and 407 causes interference of the electric field strength represented by the following equation at the position of the distance L between the mirrors 406 and 407.
【００８７】Ｅ＝Ｅ０＊Ｓｉｎ（π＊Ｘ／Ｐ）＊Ｓｉｎ
（π＊Ｙ／Ｐ）E = E0 * Sin (π * X / P) * Sin
(Π * Y / P)
【００８８】Ｅ＝Ｅ０＊Ｓｉｎ（２＊π＊Ｌ／Ｐ）E = E0 * Sin (2 * π * L / P)
【００８９】２Ｐ＝λ／Ｓｉｎ（３８度）2P = λ / Sin (38 degrees)
【００９０】ここでλはレーザ光の波長１０．６μｍで
あり、１／Ｓｉｎ（３７．８度）＝２＊√（２／３）で
あり、Ｐ＝８．７μｍになる。Here, λ is 10.6 μm of the wavelength of the laser beam, 1 / Sin (37.8 degrees) = 2 * √ (、), and P = 8.7 μm.
【００９１】この干渉模様を図９に示す。図９で、Ｘ座
標に平行な格子とＹ座標に平行な格子で電界値が０にな
る周期がＰ＝８．７μｍになる。そしてこの格子の間に
この周期のピッチの点模様が出来る。点模様のピッチ
は、鏡４０６、４０７、４０８、４０９からの各光束が
基板面の垂直線から６０度の角度を成す場合であり、こ
の角度が４５度以上の場合に点配列のピッチが光束の波
長以上になる。FIG. 9 shows this interference pattern. In FIG. 9, the period in which the electric field value becomes 0 in the lattice parallel to the X coordinate and the lattice parallel to the Y coordinate is P = 8.7 μm. Then, a dot pattern having a pitch of this period is formed between the lattices. The pitch of the dot pattern is such that the light beams from the mirrors 406, 407, 408, and 409 form an angle of 60 degrees from the vertical line of the substrate surface. Or more wavelengths.
【００９２】この様にレーザ光束の波長以下の微小ピッ
チの点を生じさせることができ、この点格子を３ｍｍの
領域内に生じさせたパルスレーザ光のエネルギーで絶縁
樹脂の表面に窪みを食刻し基板上の絶縁樹脂表面を粗化
する。１パルス当たり４００ｍＪのエネルギーの炭酸ガ
スレーザを絶縁樹脂上の３ｍｍの直径の領域に投影し干
渉模様を生じさせ、１パルスで４μｍの深さの凹形状を
形成する。As described above, it is possible to generate a point having a minute pitch equal to or smaller than the wavelength of the laser beam, and to form a pit on the surface of the insulating resin with the energy of the pulse laser beam generated within the area of 3 mm. Then, the surface of the insulating resin on the substrate is roughened. A carbon dioxide laser having an energy of 400 mJ per pulse is projected onto a region of 3 mm diameter on the insulating resin to form an interference pattern, and a concave shape having a depth of 4 μm is formed by one pulse.
【００９３】基板は図８に示す様に、基板面の垂直線に
平行な回転軸を有する回転テーブル上に、送りテーブル
を回転の直径方向に送る様に構成したテーブルに設置
し、炭酸ガスパルスレーザを１５０パルス／秒の周期で
出射し、回転テーブルの回転中心から約２２０ｍｍの位
置にレーザ光を集光させ、回転テーブルを毎分２０回転
させる。この場合は、レーザ光の照射位置での回転テー
ブルのＹ方向への移動速度が４５０ｍｍ／秒の速度にな
る。また、回転テーブルの１回転毎に、回転テーブルの
直径方向に送りテーブルを３ｍｍ送る。こうして、送り
テーブル上に設置した基板の全面にレーザの点配列模様
を投影して粗化処理する。３００ｍｍ＊３００ｍｍの基
板２枚の表面を約５分で粗化する。As shown in FIG. 8, the substrate is set on a rotary table having a rotation axis parallel to the vertical line of the substrate surface, and the feed table is set on a table configured to feed in the diametric direction of rotation. The laser is emitted at a cycle of 150 pulses / second, the laser beam is focused at a position of about 220 mm from the rotation center of the rotary table, and the rotary table is rotated 20 times per minute. In this case, the moving speed of the rotary table in the Y direction at the laser beam irradiation position is 450 mm / sec. Also, the feed table is fed by 3 mm in the diameter direction of the turn table for each rotation of the turn table. In this way, the point arrangement pattern of the laser is projected onto the entire surface of the substrate placed on the feed table to perform a roughening process. The surface of two 300 mm * 300 mm substrates is roughened in about 5 minutes.
【００９４】こうして表面を干渉模様で粗化した絶縁樹
脂表面に無電解めっきし、その無電解めっき層に電解め
っきし銅層を形成する。The surface of the insulating resin whose surface is roughened with the interference pattern is electrolessly plated, and the electroless plating layer is electrolytically plated to form a copper layer.
【００９５】その銅層上にフォトレジストを印刷し回路
パターンを露光・現像し、銅層をエッチングし回路パタ
ーンを形成する。A photoresist is printed on the copper layer, the circuit pattern is exposed and developed, and the copper layer is etched to form a circuit pattern.
【００９６】第１から第３の実施の形態の光学ヘッドで
集光した干渉模様を、回転テーブル上の基板に投影し、
回転テーブルで基板を移動させる事で、基板の全面に一
様に粗化処理を行なう事が出来る効果がある。The interference patterns collected by the optical heads according to the first to third embodiments are projected on a substrate on a rotary table,
By moving the substrate with the rotary table, there is an effect that the roughening process can be uniformly performed on the entire surface of the substrate.
【００９７】なお、本実施の形態においては、本発明は
それに限定されず、本発明を適用する上で好適な１０μ
ｍの幅のコアを有するポリイミド光導波路を有する光モ
ジュールのポリイミドの表面に銅をめっきするために、
ポリイミド膜上にＹＡＧレーザの波長以下の周期の干渉
模様を形成しレーザでポリイミド膜を食刻する事に適用
する事ができる。また、ＬＳＩの表面に形成したポリイ
ミド等の樹脂膜上に金属めっきするために紫外線レーザ
により波長以下の周期の干渉模様を形成しそれにより樹
脂膜を食刻する事に適用することができる。In the present embodiment, the present invention is not limited to this.
In order to plate copper on the polyimide surface of an optical module having a polyimide optical waveguide having a core of width m,
The present invention can be applied to forming an interference pattern having a period equal to or less than the wavelength of the YAG laser on the polyimide film and etching the polyimide film with the laser. Further, the present invention can be applied to forming an interference pattern having a period equal to or less than a wavelength by using an ultraviolet laser for metal plating on a resin film of polyimide or the like formed on the surface of the LSI, thereby etching the resin film.
【００９８】また、上記構成部材の数、位置、形状等は
上記実施の形態に限定されず、集光するスポットの寸法
あるいは形状を、光学系統中に四角形あるいは六角形等
のアパーチャを挿入し、スポット位置にその形状を投影
する様に光学系統を変える事も可能で、そのために上記
構成部材を本発明を実施する上で好適な数、位置、形状
等にすることができる。The number, position, shape, etc. of the above-mentioned constituent members are not limited to those in the above-described embodiment. The size or shape of the spot to be condensed may be changed by inserting an aperture such as a square or hexagon into the optical system. The optical system can be changed so as to project the shape at the spot position, and therefore, the above-mentioned constituent members can be formed in a suitable number, position, shape, and the like in practicing the present invention.
【００９９】また、レーザ光束を基板面に集光させる位
置においてレーザ光束が成す角を変える、レーザ光束の
方向可変機構を設ける事で干渉模様の周期を可変にした
基板表面粗化装置も可能である。Further, by providing a laser beam direction changing mechanism for changing the angle formed by the laser beam at the position where the laser beam is focused on the substrate surface, a substrate surface roughening apparatus in which the period of the interference pattern is variable is also possible. is there.
【０１００】なお、各図において、同一構成要素には同
一符号を付している。In the respective drawings, the same components are denoted by the same reference numerals.
【０１０１】[0101]
【発明の効果】本発明は以上のように構成されているの
で、銅回路と絶縁樹脂との密着性が改善することができ
る。その理由は、絶縁樹脂上にパルスレーザで干渉模様
を食刻し粗化し、その上に銅めっきを形成したため、ア
ンカー効果で銅めっきの絶縁樹脂への密着性が改善され
るからである。As described above, according to the present invention, the adhesion between the copper circuit and the insulating resin can be improved. The reason is that the interference pattern is etched and roughened on the insulating resin by a pulse laser, and the copper plating is formed thereon, so that the adhesion of the copper plating to the insulating resin is improved by the anchor effect.
【図１】本発明の第１の実施の形態に係る基板表面粗化
装置の概念図である。FIG. 1 is a conceptual diagram of a substrate surface roughening apparatus according to a first embodiment of the present invention.
【図２】図１に示す印刷配線板の正面に対する光学系統
図である。FIG. 2 is an optical system diagram with respect to the front of the printed wiring board shown in FIG.
【図３】本発明の第２の実施の形態に係る基板表面粗化
装置の概念図である。FIG. 3 is a conceptual diagram of a substrate surface roughening device according to a second embodiment of the present invention.
【図４】図３に示す印刷配線板の正面に対する光学系統
図である。FIG. 4 is an optical system diagram with respect to the front of the printed wiring board shown in FIG.
【図５】図３に示す印刷配線板の干渉模様を示す図であ
る。5 is a diagram showing an interference pattern of the printed wiring board shown in FIG.
【図６】本発明の第４の実施の形態に係る基板表面粗化
装置の概念図である。FIG. 6 is a conceptual diagram of a substrate surface roughening apparatus according to a fourth embodiment of the present invention.
【図７】図６に示す第１の光学系の詳細図である。FIG. 7 is a detailed view of the first optical system shown in FIG.
【図８】図６に示す印刷配線板の構造を示す概念図であ
る。8 is a conceptual diagram showing the structure of the printed wiring board shown in FIG.
【図９】図６に示す印刷配線板の干渉模様を示す図であ
る。9 is a diagram showing an interference pattern of the printed wiring board shown in FIG.
【図１０】従来技術に示すビルドアップ印刷配線板の製
造工程を示す図である。FIG. 10 is a view showing a manufacturing process of a build-up printed wiring board shown in a conventional technique.
１０２，１０３，１０４，１０７，１０８，１０９，１
１０ 鏡 ２０１，２０２，２０３，２０４ 鏡 ４０２，４０３，４０４，４０６，４０７，４０８ 鏡102, 103, 104, 107, 108, 109, 1
10 mirror 201, 202, 203, 204 mirror 402, 403, 404, 406, 407, 408 mirror
【手続補正書】[Procedure amendment]
【提出日】平成１２年３月１３日（２０００．３．１
３）[Submission date] March 13, 2000 (200.3.1)
3)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の名称[Correction target item name] Name of invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【発明の名称】 基板表面粗化方法および基板表面粗化
装置ならびに印刷配線板の製造方法および印刷配線板の
製造装置Patent application title: Substrate Surface Roughening Method, Substrate Surface Roughening Apparatus, Printed Wiring Board Manufacturing Method, and Printed Wiring Board Manufacturing Apparatus
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１５[Correction target item name] 0015
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１５】[0015]
【課題を解決する手段】本発明は、上記課題を解決すべ
く、以下に掲げる構成とした。請求項１記載の発明の要
旨は、レーザー装置の光束を用いて基板の表面を粗化す
る基板表面粗化方法であって、前記レーザー装置からの
光束を３本以上に分光し、分光された前記各光束を鏡に
より前記基板上の一点に集光して円形に投影し、前記各
光束を干渉させて前記基板の表面に光束の波長以下のピ
ッチの点配列模様を食刻し、前記基板を移動させ、前記
基板の複数箇所に点配列模様を食刻することを特徴とす
る基板表面粗化方法に存する。請求項２に記載の発明の
要旨は、レーザー装置の光束を用いて基板の表面を粗化
する基板表面粗化装置であって、前記レーザー装置から
の光束を３本以上に分光する分光手段と、分光された前
記各光束を前記基板上の一点に集光して円形に投影し、
前記各光束を干渉させて点模様に前記基板の表面を食刻
可能にする鏡と、前記基板を移動させ、前記基板の複数
箇所に点配列模様を食刻可能にする送り機構とを備えた
ことを特徴とする基板表面粗化装置に存する。請求項３
に記載の発明の要旨は、前記分光手段は、前記レーザー
装置からの光束を２本に分光可能な位置に設けられ、さ
らに、これら２本の光束のうちの１本の光束を２本に分
光可能な位置に設けられ、全部で３本の光束に分光する
ことを特徴とする請求項２記載の基板表面粗化装置に存
する。請求項４に記載の発明の要旨は、前記分光手段
は、前記レーザー装置からの光束を２本に分光可能な位
置に設けられ、さらに、これら２本の光束をそれぞれ２
本に分光可能な位置に設けられ、全部で４本の光束に分
光することを特徴とする請求項２記載の基板表面粗化装
置に存する。請求項５に記載の発明の要旨は、前記パル
スレーザ装置は炭酸ガスパルスレーザであることを特徴
とする請求項２乃至４のいずれかに記載の基板表面粗化
装置に存する。請求項６に記載の発明の要旨は、前記分
光手段は、格子鏡であることを特徴とする請求項２乃至
５のいずれかに記載の基板表面粗化装置に存する。請求
項７に記載の発明の要旨は、前記送り機構は、前記基板
を設置する回転テーブルと、該回転テーブルに、前記基
板を回転の半径方向に移動させる一軸送り機構を用いた
ことを特徴とする請求項２乃至６のいずれかに記載の基
板表面粗化装置に存する。請求項８に記載の発明の要旨
は、絶縁基板状に導体回路を形成したコア層を作成した
基板に、レーザー装置を用いて食刻することにより印刷
配線板を製造する印刷配線板の製造方法であって、前記
レーザー装置からの光束を３本以上に分光し、分光され
た前記各光束を鏡により前記基板上の一点に集光して円
形に投影し、前記基板の表面で前記各光束を干渉させて
光束の波長以下のピッチの点配列模様を前記基板の表面
に食刻し、前記基板を移動させ、前記基板の複数箇所に
点配列模様を食刻し、前記基板表面に導体膜を無電解め
っきし、該無電解めっき層に電解めっきで導体層を形成
し、該導体層上にフォトレジストを印刷しフォトレジス
トに回路パターンを露光・現像しエッチングレジスト膜
を形成し、該エッチングレジスト膜で保護された導体を
残すエッチングを行い回路パターンを形成することを特
徴とする印刷配線板の製造方法に存する。請求項９に記
載の発明の要旨は、前記コア層に感光性の基板を印刷し
露光現像して該基板にホトビアを形成することを特徴と
する、請求項８に記載の印刷配線板の製造方法に存す
る。請求項１０に記載の発明の要旨は、前記コア層に前
記基板を印刷し、この基板にパルスレーザ光束により穴
をあけることを特徴とする請求項８に記載の印刷配線板
の製造方法に存する。請求項１１に記載の発明の要旨
は、絶縁基板状に導体回路を形成したコア層を作成した
基板に、レーザー装置を用いて食刻することにより印刷
配線板を製造する印刷配線板の製造装置であって、前記
レーザー装置からの光束を３本以上に分光する分光手段
と、分光された前記各光束を前記基板上の一点に集光し
て円形に投影し、前記各光束を干渉させて前記基板の表
面に光束の波長以下のピッチの点配列模様を食刻するこ
とを可能にする鏡と、前記基板を移動させ、前記基板の
複数箇所に点配列模様を食刻可能にする送り機構と、前
記基板表面に導体膜を無電解めっきするメッキ手段と、
該無電解めっき層に電解めっきで導体層を形成し、該導
体層上にフォトレジストを印刷しフォトレジストに回路
パターンを露光・現像しエッチングレジスト膜を形成す
るレジスト膜形成手段と、前記エッチングレジスト膜で
保護された導体を残すエッチングを行い回路パターンを
形成するエッチング手段とを備えたことを特徴とする印
刷配線板の製造装置に存する。請求項１２に記載の発明
の要旨は、前記分光手段は、前記レーザー装置からの光
束を２本に分光可能な位置に設けられ、さらに、これら
２本の光束のうちの１本の光束を２本に分光可能な位置
に設けられ、全部で３本の光束に分光することを特徴と
する請求項１１記載の印刷配線板の製造装置に存する。
請求項１３に記載の発明の要旨は、前記分光手段は、前
記レーザー装置からの光束を２本に分光可能な位置に設
けられ、さらに、これら２本の光束をそれぞれ２本に分
光可能な位置に設けられ、全部で４本の光束に分光する
ことを特徴とする請求項１１記載の印刷配線板の製造装
置に存する。請求項１４に記載の発明の要旨は、前記レ
ーザ装置は炭酸ガスパルスレーザであることを特徴とす
る請求項１１乃至１３のいずれかに記載の印刷配線板の
製造装置に存する。請求項１５に記載の発明の要旨は、
前記分光手段は、格子鏡であることを特徴とする請求項
１１乃至１４のいずれかに記載の印刷配線板の製造装置
に存する。請求項１６に記載の発明の要旨は、前記送り
機構は、前記基板を設置する回転テーブルと、該回転テ
ーブルに、前記基板を回転の半径方向に移動させる一軸
送り機構を用いたことを特徴とする請求項１１乃至１５
のいずれかに記載の印刷配線板の製造装置に存する。Means for Solving the Problems The present invention has the following constitution in order to solve the above-mentioned problems. The gist of the invention according to claim 1 is a substrate surface roughening method for roughening the surface of a substrate using a light beam of a laser device, wherein the light beam from the laser device is separated into three or more light beams and separated. each by the light beam a mirror is focused at one point on the substrate projected on circular, the wavelength following peak of the light beam on the surface of the substrate causes interference of each light beam
And etching the point array pattern of the switch, moving the substrate , and etching the point array pattern at a plurality of locations on the substrate. The gist of the invention according to claim 2 is that the surface of the substrate is roughened by using a light beam of a laser device.
Substrate surface roughening device, wherein the laser device
Splitting means for splitting the luminous flux into three or more beams, and before splitting
Each light beam is converged on one point on the substrate and projected in a circle,
The surface of the substrate is etched into a dot pattern by interfering with each of the light beams.
Mirrors that allow and move the substrate, multiple of the substrate
With a feed mechanism that enables point array patterns to be etched
The present invention resides in a substrate surface roughening apparatus. Claim 3
The gist of the invention described in the above , wherein the spectroscopic means is the laser
It is provided at a position where the light beam from the device can be split into two beams.
Furthermore, one of these two light beams is split into two light beams.
It is provided at a position where light can be emitted and splits the light into three light beams in total
3. The substrate surface roughening apparatus according to claim 2,
I do. The gist of the invention according to claim 4 is that the spectroscopic means
Is a position at which the light beam from the laser device can be split into two beams.
And the two light beams are respectively
It is provided at a position where the light can be split into books, and is divided into four light beams in total.
The substrate surface roughening device according to claim 2, wherein the substrate surface is illuminated.
Exist. The gist of the invention described in claim 5 is that the pallet
The laser device is a pulsed carbon dioxide laser.
The substrate surface roughening according to any one of claims 2 to 4,
Exists in the device. SUMMARY OF THE INVENTION according to claim 6, wherein the component
The light means is a grating mirror.
5. The substrate surface roughening apparatus according to any one of 5. The gist of the invention according to claim 7 is that the feed mechanism includes the substrate.
A rotary table for installing the
Using a uniaxial feed mechanism that moves the plate in the radial direction of rotation
The group according to any one of claims 2 to 6, wherein
Present in plate surface roughening equipment. The gist of the invention according to claim 8 is that a core layer in which a conductive circuit is formed on an insulating substrate is formed.
Printed on a substrate by etching using a laser device
A method for manufacturing a printed wiring board for manufacturing a wiring board, wherein the method
The light beam from the laser device is split into three or more beams and separated.
Each light beam is focused on a point on the substrate by a mirror and
And project each light beam on the surface of the substrate.
A point array pattern having a pitch equal to or less than the wavelength of the light beam is formed on the surface of the substrate.
The substrate is moved to a plurality of locations on the substrate.
Etching the dot array pattern and electrolessly applying a conductive film on the substrate surface
To form a conductor layer on the electroless plating layer by electrolytic plating
And printing a photoresist on the conductor layer to form a photoresist.
Exposure and development of the circuit pattern on the substrate and etching resist film
To form a conductor protected by the etching resist film.
Special feature is to form a circuit pattern by etching
The present invention relates to a method of manufacturing a printed wiring board. The gist of the invention according to claim 9 is that a photosensitive substrate is printed on the core layer.
Forming photovias on the substrate by exposure and development.
The method for manufacturing a printed wiring board according to claim 8, wherein
You. The gist of the invention according to claim 10 is that the core layer has
The substrate is printed, and holes are formed on this substrate with a pulsed laser beam.
9. The printed wiring board according to claim 8, wherein
In the manufacturing method. The gist of the invention according to claim 11 is to form a core layer in which a conductor circuit is formed on an insulating substrate.
Printed on a substrate by etching using a laser device
A printed wiring board manufacturing apparatus for manufacturing a wiring board,
Spectral means for splitting a light beam from a laser device into three or more beams
And condensing each of the split light beams at one point on the substrate.
And project the light into a circle, and make the light beams interfere with each other,
Engraving a point array pattern with a pitch less than the wavelength of the light beam on the surface
And a mirror that enables the movement of the substrate,
A feed mechanism that enables the dot array pattern to be etched in multiple places,
Plating means for electrolessly plating a conductive film on the substrate surface,
A conductor layer is formed on the electroless plating layer by electrolytic plating.
Print photoresist on body layer and circuit on photoresist
Exposure and development of pattern to form etching resist film
Resist film forming means, and the etching resist film
Etching to leave protected conductors
Characterized by comprising etching means for forming
Present in printed wiring board manufacturing equipment. The gist of the invention according to claim 12 is that the spectroscopic means is configured to detect light from the laser device.
The bundle is provided at a position where the bundle can be separated into two,
A position where one of the two light beams can be split into two light beams
And is characterized by splitting into a total of three light beams.
An apparatus for manufacturing a printed wiring board according to claim 11 .
The gist of the invention according to claim 13 is that the spectroscopic means is
The beam from the laser device is set at a position where it can be split into two beams.
In addition, these two luminous fluxes are split into two beams, respectively.
It is provided at a position where light can be emitted and splits into four light beams in total
The apparatus for manufacturing a printed wiring board according to claim 11, wherein
Exist. SUMMARY OF THE INVENTION according to claim 14, wherein Le
The laser device is a pulsed carbon dioxide laser.
The printed wiring board according to any one of claims 11 to 13,
Exist in manufacturing equipment. The gist of the invention described in claim 15 is:
The said dispersing means is a grating mirror, The said mirror is characterized by the above-mentioned.
An apparatus for manufacturing a printed wiring board according to any one of claims 11 to 14.
Exists. The gist of the invention according to claim 16 is that the feed mechanism uses a rotary table on which the substrate is installed, and a uniaxial feed mechanism that moves the substrate in a radial direction of rotation on the rotary table. Claims 11 to 15
Any one of the printed wiring board manufacturing apparatuses.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 3/38 Ｈ０５Ｋ 3/38 Ａ 3/46 3/46 Ｂ (72)発明者 保田 龍夫 東京都港区芝五丁目７番１号 日本電気株 式会社内 (72)発明者 手塚 雅之 東京都港区芝五丁目７番１号 日本電気株 式会社内 (72)発明者 荒木 俊明 東京都港区芝五丁目７番１号 日本電気株 式会社内 Ｆターム(参考） 4E068 AA04 AA05 AF00 AH00 CB08 CD02 CD03 CD12 CE04 DA11 5E343 AA12 BB24 DD33 DD76 EE32 ER18 GG01 5E346 AA02 CC08 CC32 DD23 EE33 GG27 HH11 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme court ゛ (Reference) H05K 3/38 H05K 3/38 A 3/46 3/46 B (72) Inventor Tatsuo Hota Minato-ku, Tokyo 5-7-1, Shiba, NEC Corporation (72) Inventor Masayuki Tezuka 5-7-1, Shiba, Minato-ku, Tokyo Inside (72) Inventor Toshiaki Araki Shibago, Minato-ku, Tokyo 7-1-1 F-term in NEC Corporation (Reference) 4E068 AA04 AA05 AF00 AH00 CB08 CD02 CD03 CD12 CE04 DA11 5E343 AA12 BB24 DD33 DD76 EE32 ER18 GG01 5E346 AA02 CC08 CC32 DD23 EE33 GG27 HH11
Claims (23)
を粗化する基板表面粗化方法であって、 前記レーザー装置からの光束を３本以上に分光し、 分光された前記各光束を鏡により前記基板上の一点に集
光して円形に投影し、 前記各光束を干渉させて点模様に前記基板の表面を食刻
し、 前記基板を移動させ、 前記基板の複数箇所に点配列模様を食刻することを特徴
とする基板表面粗化方法。1. A substrate surface roughening method for roughening the surface of a substrate using a light beam of a laser device, wherein the light beam from the laser device is split into three or more beams, and each of the split light beams is mirrored. By condensing the light on one point on the substrate and projecting it in a circle, causing the light beams to interfere with each other, etching the surface of the substrate into a point pattern, moving the substrate, and forming a point array pattern on a plurality of locations on the substrate. Substrate roughening method characterized by etching.
光することを特徴とする請求項１記載の基板表面粗化方
法。2. The substrate surface roughening method according to claim 1, wherein the light beam from the laser device is split into three beams.
光することを特徴とする請求項１記載の基板表面粗化方
法。3. The substrate surface roughening method according to claim 1, wherein the light beam from the laser device is split into four beams.
ピッチは、前記光束の波長以下であることを特徴とする
基板表面粗化方法4. The substrate surface roughening method according to claim 1, wherein a pitch between the dot patterns in the dot array pattern is equal to or less than a wavelength of the light flux.
を粗化する基板表面粗化装置であって、 前記レーザー装置からの光束を３本以上に分光する分光
手段と、 分光された前記各光束を前記基板上の一点に集光して円
形に投影し、前記各光束を干渉させて点模様に前記基板
の表面を食刻する可能にする鏡と、 前記基板を移動させ、前記基板の複数箇所に点配列模様
を食刻可能にする送り機構とを備えたことを特徴とする
基板表面粗化装置。5. A substrate surface roughening device for roughening the surface of a substrate using a light beam of a laser device, wherein the light beam from the laser device is split into three or more light beams. A mirror that focuses the light beam on one point on the substrate and projects it in a circle, interferes with each of the light beams and enables the surface of the substrate to be etched in a point pattern, and moving the substrate, A substrate surface roughening device comprising: a feed mechanism capable of etching a point array pattern at a plurality of locations.
の光束を２本に分光可能な位置に設けられ、さらに、こ
れら２本の光束のうちの１本の光束を２本に分光可能な
位置に設けられ、全部で３本の光束に分光することを特
徴とする請求項５記載の基板表面粗化装置。6. The dispersing means is provided at a position where the light beam from the laser device can be split into two light beams, and further, a position where one of the two light beams can be split into two light beams. 6. The substrate surface roughening apparatus according to claim 5, wherein the light is split into three light beams in total.
の光束を２本に分光可能な位置に設けられ、さらに、こ
れら２本の光束をそれぞれ２本に分光可能な位置に設け
られ、全部で４本の光束に分光することを特徴とする請
求項５記載の基板表面粗化装置。7. The dispersing means is provided at a position where the light beam from the laser device can be separated into two light beams, and further, provided at a position where each of these two light beams can be separated into two light beams. 6. The substrate surface roughening apparatus according to claim 5, wherein the light is split into four light beams.
レーザであることを特徴とする請求項５乃至７のいずれ
かに記載の基板表面粗化装置。8. The substrate surface roughening apparatus according to claim 5, wherein said pulse laser device is a carbon dioxide gas pulse laser.
徴とする請求項５乃至８のいずれかに記載の基板表面粗
化装置。9. The substrate surface roughening apparatus according to claim 5, wherein said spectral unit is a grating mirror.
回転テーブルと、該回転テーブルに、前記基板を回転の
半径方向に移動させる一軸送り機構を用いたことを特徴
とする請求項５乃至９のいずれかに記載の基板表面粗化
装置。10. The apparatus according to claim 5, wherein the feed mechanism includes a rotary table on which the substrate is placed, and a uniaxial feed mechanism for moving the substrate in a radial direction of rotation on the rotary table. The substrate surface roughening device according to any one of the above.
層を作成した基板に、レーザー装置を用いて食刻するこ
とにより印刷配線板を製造する印刷配線板の製造方法で
あって、 前記レーザー装置からの光束を３本以上に分光し、 分光された前記各光束を鏡により前記基板上の一点に集
光して円形に投影し、 前記各光束を干渉させて点模様に前記基板の表面を食刻
し、 前記基板を移動させ、 前記基板の複数箇所に点配列模様を食刻し、 前記基板表面に導体膜を無電解めっきし、 該無電解めっき層に電解めっきで導体層を形成し、該導
体層上にフォトレジストを印刷しフォトレジストに回路
パターンを露光・現像しエッチングレジスト膜を形成
し、 該エッチングレジスト膜で保護された導体を残すエッチ
ングを行い回路パターンを形成することを特徴とする印
刷配線板の製造方法。11. A method for manufacturing a printed wiring board, wherein a printed circuit board is manufactured by etching a substrate having a core layer in which a conductor circuit is formed on an insulating substrate using a laser device. The light beam from the apparatus is divided into three or more light beams, and the separated light beams are condensed on a point on the substrate by a mirror and projected into a circle, and the light beams interfere with each other to form a dot pattern on the surface of the substrate. The substrate is moved, the dot array pattern is etched at a plurality of locations on the substrate, a conductive film is electrolessly plated on the surface of the substrate, and a conductive layer is formed on the electroless plated layer by electrolytic plating. Then, a photoresist is printed on the conductor layer, a circuit pattern is exposed and developed on the photoresist to form an etching resist film, and etching is performed to leave a conductor protected by the etching resist film to form a circuit pattern. Method of manufacturing a printed wiring board according to claim.
とする請求項１１記載の印刷配線板の製造方法。12. The method for manufacturing a printed wiring board according to claim 11, wherein the light beam is split into three light beams.
とする請求項１１記載の印刷配線板の製造方法。13. The method for manufacturing a printed wiring board according to claim 11, wherein the light beam is split into four light beams.
光現像して該基板にホトビアを形成することを特徴とす
る、請求項１１乃至１３のいずれかに記載の印刷配線板
の製造方法。14. The method for manufacturing a printed wiring board according to claim 11, wherein a photosensitive substrate is printed on the core layer, and is exposed and developed to form a photovia on the substrate. .
基板にパルスレーザ光束により穴をあけることを特徴と
する請求項１１乃至１４のいずれかに記載の印刷配線板
の製造方法。15. The method for manufacturing a printed wiring board according to claim 11, wherein the substrate is printed on the core layer, and a hole is formed in the substrate with a pulsed laser beam.
のピッチは、前記光束の波長以下であることを特徴とす
る請求項１１乃至１５のいずれかに記載の印刷配線板の
製造方法。16. The method according to claim 11, wherein a pitch between the dot patterns in the dot array pattern is equal to or less than a wavelength of the light flux.
層を作成した基板に、レーザー装置を用いて食刻するこ
とにより印刷配線板を製造する印刷配線板の製造装置で
あって、 前記レーザー装置からの光束を３本以上に分光する分光
手段と、 分光された前記各光束を前記基板上の一点に集光して円
形に投影し、前記各光束を干渉させて点模様に前記基板
の表面を食刻する可能にする鏡と、 前記基板を移動させ、前記基板の複数箇所に点配列模様
を食刻可能にする送り機構と、 前記基板表面に導体膜を無電解めっきするメッキ手段
と、 該無電解めっき層に電解めっきで導体層を形成し、該導
体層上にフォトレジストを印刷しフォトレジストに回路
パターンを露光・現像しエッチングレジスト膜を形成す
るレジスト膜形成手段と、 前記エッチングレジスト膜で保護された導体を残すエッ
チングを行い回路パターンを形成するエッチング手段と
を備えたことを特徴とする印刷配線板の製造装置。17. A printed wiring board manufacturing apparatus for manufacturing a printed wiring board by etching a substrate on which a core layer in which a conductor circuit is formed on an insulating substrate by using a laser device. Dispersing means for dispersing the light beam from the apparatus into three or more light beams; condensing each of the separated light beams at one point on the substrate and projecting the light beam in a circular shape; A mirror that allows the surface to be etched, a feed mechanism that moves the substrate and allows the point array pattern to be etched at a plurality of locations on the substrate, and a plating unit that performs electroless plating of a conductive film on the substrate surface. A resist film forming means for forming a conductor layer on the electroless plating layer by electrolytic plating, printing a photoresist on the conductor layer, exposing and developing a circuit pattern on the photoresist to form an etching resist film; An etching means for etching to leave a conductor protected by the resist film to form a circuit pattern.
らの光束を２本に分光可能な位置に設けられ、さらに、
これら２本の光束のうちの１本の光束を２本に分光可能
な位置に設けられ、全部で３本の光束に分光することを
特徴とする請求項１７記載の印刷配線板の製造装置。18. The spectroscopic means is provided at a position where the light beam from the laser device can be divided into two light beams.
18. The apparatus for manufacturing a printed wiring board according to claim 17, wherein one of the two light beams is provided at a position where the light beam can be split into two light beams, and the light beam is split into three light beams in total.
らの光束を２本に分光可能な位置に設けられ、さらに、
これら２本の光束をそれぞれ２本に分光可能な位置に設
けられ、全部で４本の光束に分光することを特徴とする
請求項５記載の印刷配線板の製造装置。19. The spectroscopic means is provided at a position where the light beam from the laser device can be divided into two light beams.
6. The apparatus for manufacturing a printed wiring board according to claim 5, wherein each of the two light beams is provided at a position where it can be split into two light beams, and splits into a total of four light beams.
スレーザであることを特徴とする請求項５乃至７のいず
れかに記載の印刷配線板の製造装置。20. The printed wiring board manufacturing apparatus according to claim 5, wherein said pulse laser device is a carbon dioxide pulse laser.
特徴とする請求項５乃至８のいずれかに記載の印刷配線
板の製造装置。21. The apparatus for manufacturing a printed wiring board according to claim 5, wherein said spectral unit is a grating mirror.
回転テーブルと、該回転テーブルに、前記基板を回転の
半径方向に移動させる一軸送り機構を用いたことを特徴
とする請求項５乃至９のいずれかに記載の印刷配線板の
製造装置。22. The apparatus according to claim 5, wherein the feed mechanism includes a rotary table on which the substrate is installed, and a uniaxial feed mechanism for moving the substrate in a radial direction of rotation on the rotary table. The printed wiring board manufacturing apparatus according to any one of the above.
のピッチは、前記光束の波長以下であることを特徴とす
る請求項１７乃至２２のいずれかに記載の印刷配線板の
製造方法。23. The method according to claim 17, wherein a pitch between the dot patterns in the dot array pattern is equal to or less than a wavelength of the light flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04387499A JP3201375B2 (en) | 1999-02-22 | 1999-02-22 | Substrate surface roughening method, substrate surface roughening device, printed wiring board manufacturing method, and printed wiring board manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04387499A JP3201375B2 (en) | 1999-02-22 | 1999-02-22 | Substrate surface roughening method, substrate surface roughening device, printed wiring board manufacturing method, and printed wiring board manufacturing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000244095A true JP2000244095A (en) | 2000-09-08 |
| JP3201375B2 JP3201375B2 (en) | 2001-08-20 |
Family
ID=12675858
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|---|---|---|---|
| JP04387499A Expired - Fee Related JP3201375B2 (en) | 1999-02-22 | 1999-02-22 | Substrate surface roughening method, substrate surface roughening device, printed wiring board manufacturing method, and printed wiring board manufacturing device |
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| Country | Link |
|---|---|
| JP (1) | JP3201375B2 (en) |
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| JP2021509864A (en) * | 2018-01-03 | 2021-04-08 | フラウンホーファー−ゲゼルシャフト ツゥア フェアデルング デア アンゲヴァンドテン フォァシュング エー．ファウ． | Optical equipment for direct laser interference structuring |
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-
1999
- 1999-02-22 JP JP04387499A patent/JP3201375B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1935552A3 (en) * | 2006-12-20 | 2011-07-13 | Erlas Erlanger Lasertechnik GmbH | Multi-beam laser processing head |
| JP2014012290A (en) * | 2012-07-04 | 2014-01-23 | Hamamatsu Photonics Kk | Laser processing method, and laser processing apparatus |
| CN106918920A (en) * | 2017-04-20 | 2017-07-04 | 长春理工大学 | Using polarizing CO2The apparatus and method of laser interference machining lens antifog structure |
| CN106918920B (en) * | 2017-04-20 | 2023-02-07 | 长春理工大学 | Using polarized CO 2 Device and method for processing antifogging structure of lens by laser interference |
| JP2021509864A (en) * | 2018-01-03 | 2021-04-08 | フラウンホーファー−ゲゼルシャフト ツゥア フェアデルング デア アンゲヴァンドテン フォァシュング エー．ファウ． | Optical equipment for direct laser interference structuring |
| JP7116174B2 (en) | 2018-01-03 | 2022-08-09 | フラウンホーファー－ゲゼルシャフト ツゥア フェアデルング デア アンゲヴァンドテン フォァシュング エー．ファウ． | Optical device for direct laser interference structuring |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3201375B2 (en) | 2001-08-20 |
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