JP2000144437A - Electroless plating method, electroless plating device, production of wiring board and device for producing wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily form a thick plated film in a narrow region with high positional precision at a low cost by irradiating the surface of the object to be plated dipped into an electroless plating soln. contg. metallic ions, a complexing agent, a reducing agent, a pH regulator or the like with light beam and leaving standing it in the plating soln. for a prescribed time. SOLUTION: An object 1 to be plated whose surface has preferably been subjected to degreasing and cleaning is dipped into an electroless plating soln. contg. the metallic ions of copper, nickel, gold, palladium or the like, a complexing agent, a reducing agent and a pH regulator for the metallic ions. In this state, only the desired place of the surface of the object to be plated is irradiated with strong light beam, e.g. laser beam 2 of about 100 mW to 2,000 W for about 10 sec. In this way, the plating soln. is decomposed only in the microregion in the vicinity of the surface of the irradiated place by flash photolysis to deposit metallic oxide fine particles, which are reduced with the plating soln. to form metallic fine particles 3. This active metallic fine particles 3 act as a self-catalyst to form a thick plating film 4 on the irradiated place of the object 1 to be plated left standing in the plating soln.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for selectively forming a chemical plating film, and more particularly, to a printed wiring board, a ceramic wiring board, a semiconductor substrate, and a high definition display such as a TFT (thin film transistor) or PDP (plasma display panel). The present invention relates to an electroless plating method and apparatus suitable for wiring conductors used in electronic components such as wiring boards for automobiles or automobile parts, and a method and apparatus for manufacturing wiring boards.

[0002]

2. Description of the Related Art When plating a non-conductive substance such as plastic, ceramics, and glass by an electroless plating method, it is necessary to activate the surface of an object to be plated prior to plating. This activation treatment is also referred to as catalysis treatment. Usually, the object to be plated is immersed in a liquid containing a compound of a noble metal having plating catalytic activity such as palladium or silver, and a plating catalytically active species or This is performed by adsorbing the precursor.

The conventional processing method has an advantage that the entire surface of the object to be plated can be activated at one time, but has a disadvantage that only a desired narrow area cannot be activated. In order to selectively activate only a desired portion by this method, it is necessary to perform a complicated process of forming a mask in advance, activating the entire surface including the mask, and then removing the mask.

[0004] For the purpose of selectively activating only a desired narrow region, an organic solvent containing an organic palladium complex is applied and then irradiated with laser light or ultraviolet light through a photomask. There is known a technique of depositing metallic palladium on the surface. However, according to this technique, a large amount of an organic solvent is used, which not only deteriorates the working environment, but also causes deformation of the product due to dissolution or swelling of the resin when the object to be plated is a resin product. However, there is a disadvantage that a desired plating film cannot be selected.

As a technique for remedying such a drawback, Japanese Patent Application Laid-Open No. Hei 9-111463 proposes a method using an activating liquid containing copper oxalate, palladium salts and alkali. In this technique, the use of an organic solvent is avoided by using a water-soluble salt such as palladium chloride as the palladium salt.

[0006]

In this conventional activation method, a compound synthesized from a noble metal called palladium is used as an active catalyst. Further, in each of the techniques, after a photosensitive film containing a palladium compound is once formed on the entire surface to be plated, an unnecessary portion of the palladium compound is washed away by exposure and development. Therefore, when the object to be plated is large, a large amount of noble metal is consumed to activate the entire surface even if the area to be actually plated is small, so that the activation cost per plating area is very high. There is a problem that it becomes expensive.

Further, the metal palladium at a desired location may be dropped off together during the development process for removing unnecessary palladium compounds attached to the surface, or may be deactivated by adsorbing a catalyst poison. A part of the surface may be oxidized by drying in the air.

On the other hand, if the developing conditions are moderated to prevent the metal palladium from falling off, an unnecessary portion of the palladium compound remains without being completely removed. In some cases, a palladium compound is reductively decomposed by the action of a reducing agent present in the metal, and a palladium metal is deposited, which may cause abnormal deposition or significantly accelerate the consumption of the plating solution. Furthermore, according to this activation method, the number of steps is longer than that of the conventional non-selective activation treatment, so that there is a problem that the overall yield is reduced.

On the other hand, a technique for promoting the formation of a gold plating film by using a thermoelectromotive force generated by laser irradiation (hereinafter referred to as “laser-induced plating”) has been proposed (the 12th “Circuit Mounting”). Academic Lecture Meeting, "Proceedings, 215 pages (March 1998), and JP-A-6-280031.

[0010] The laser-induced plating is performed by irradiating an object to be plated immersed in a plating solution with laser light.
Since partial plating can be performed locally and at high speed, it is not necessary to use a mask as in the above-described related art.

However, in this laser-induced plating, the driving force of the plating reaction is mainly the thermo-electromotive force generated by laser irradiation, so that the reaction speed greatly changes depending on the thermal conductivity and heat capacity of the object to be plated. Becomes coarse or voids occur, and the characteristics of the plating film change due to the influence. In addition, when plating on a substance having low thermal conductivity, the apparent heat capacity changes between the end and the center, so that the in-plane distribution of the film properties on the surface of the object to be plated tends to be large. Therefore, in order to form a plating film with stable quality, laser irradiation conditions must be adjusted according to the material, size and shape of the object to be plated.

When a desired shape such as a line is formed on the surface of an object to be plated by sweeping a laser beam, even if the material, the size and the shape are fixed, the relationship between the laser irradiation output and the laser sweep speed is not affected. Since the cross-sectional shape of the plating film becomes rectangular, nodular, or extremely broken due to a complicated relationship with each other, it is difficult to obtain a plating film having a desired cross-sectional shape.

In addition, since the formed plating film functions as a heat sink, the thermoelectromotive force decreases in inverse proportion to the increase in the plating area. Therefore, it is not possible to form a large area or a long wire by using the laser induced plating. Not easy.
Even if the laser irradiation output is made larger than a certain value in order to compensate for the decrease in the thermoelectromotive force, the plating reaction will not be accelerated because the plating solution will boil, and the plating reaction may be stopped. Conversely, even if laser irradiation is performed for a long time to form a large-area plating film, heat conduction occurs to the irradiated part of the object to be plated, and the temperature difference between the irradiated part and the irradiated part is reduced, or The whole liquid is heated, and the thermoelectromotive force decreases. Another problem is that running the laser for a long time increases the running cost.

Further, in the laser-induced plating, since plating is performed while irradiating a laser, it is inevitable that vapor and mist of a plating solution obstruct the laser light path, and a complicated and precise optical laser oscillation system and a high-speed Even if a large-scale laser irradiation apparatus having a controllable system is used, it is difficult to finely adjust the laser irradiation output which is indispensable for stabilizing the quality of the plating film. In addition, the adjustment function is likely to deteriorate due to the influence of corrosion or the like by the plating solution component.

For various reasons as described above, laser-induced plating is not a practically versatile technique in the plating industry, which has a wide variety of product items. Thus, the present invention provides an electroless plating method which can form a thick plating film easily and at low cost with good positional accuracy in a narrow area without requiring fine adjustment of laser irradiation output, and is suitable for automation by a plating apparatus. And a method and apparatus for manufacturing a wiring board using the method.

[0016]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies focusing on the fact that the electroless plating reaction has self-catalytic properties. By irradiating a so-called flash photolysis by irradiating an intense light beam only to the spot, the plating solution is decomposed only in the micro area near the surface of the spot, and metal oxide (or metal hydroxide) fine particles are deposited and deposited. However, the present inventors have found a phenomenon in which the activation treatment can be performed by the electroless plating solution itself by being reduced by a reducing agent in the plating solution and acting as an autocatalyst, leading to the present invention.

In the present invention, the object to be plated is immersed in an electroless plating solution containing a metal ion, a complexing agent for the metal ion, a reducing agent and a pH adjuster, so that the surface of the object to be plated is An electroless plating method for forming a plating film, comprising: a light irradiation step of irradiating a surface of a plating object with light in a state of being immersed in a first electroless plating solution;
And a plating film forming step of forming a plating film on a light-irradiated portion by leaving the substrate in the electroless plating solution for a predetermined time in this order. After the plating film forming step, a plating film growing step of immersing the object to be plated in the second electroless plating solution and leaving it to stand for a predetermined time may be further provided. Similarly, it may be soaked sequentially in three or more types of plating solutions.

Further, according to the present invention, there is provided a method of manufacturing a wiring board having a step of forming a metal wiring comprising the above-mentioned plating film on a surface of an insulating substrate or an insulating layer by the electroless plating method of the present invention. Since the plating film forming method of the present invention can easily and accurately form a plating film even in a fine region, it is particularly suitable for repairing a broken wire portion. When used for this purpose, image data of wiring and design data of the wiring (for example, CAD (computer-aided design)
In the light irradiation step, light can be applied to the disconnection portion by comparing the data with the data) to repair the wiring automatically and accurately. Yes, it is.

Further, according to the present invention, a plating tank for holding an electroless plating solution and an image data of a surface of a substrate to be processed immersed in the electroless plating solution held in the plating bath are obtained. An electroless plating apparatus including an imaging section, a laser irradiation section for irradiating light to the surface of the substrate to be processed, a control device for controlling the operation of the laser irradiation section, and a wiring including the electroless plating apparatus An apparatus for manufacturing a substrate is provided. The control device of the electroless plating apparatus recognizes the broken portion by comparing the image data of the wiring with the design data of the wiring, controls the laser irradiation unit, and irradiates the broken portion with the laser. Means for performing

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, it is desirable to first perform a degreasing cleaning process to remove stains and the like on the surface of the object to be plated and adjust the zeta potential on the surface to be plated so that the catalyst species can be easily adsorbed. . The object to be plated to which the present invention is applied is not particularly limited, but is not limited to a conductive material such as a metal plate, and may be AlN, SiO ₂ , Al ₂ O ₃ , SiC.
Such as inorganic insulators, phenolic resin, epoxy resin,
An organic insulator such as a printed wiring board may be used.

Since the catalyst species (or its precursor) used in the present invention is generated in situ from a plating solution, it has a large surface potential and excellent adsorption characteristics. Thereby, adsorption to the surface to be plated can be reliably achieved. In the invention of the present application, an activation pretreatment agent commonly used and known as an activation pretreatment for electroless plating can be used. For example, a cleaner conditioner 231 manufactured by Shipley is suitable.

The object to be plated that has been subjected to the degreasing and washing treatment is sufficiently washed with water and then immersed in a chemical plating solution. In the present invention, a known and commonly used chemical plating solution can be used without any particular problem as long as the composition can precipitate a catalyst such as a metal oxide or a metal hydroxide or a precursor thereof by flash photolysis. Nickel, palladium,
Particularly suitable for chemical plating of gold. At this stage, that is, simply by immersion in the plating solution, there is no activated region on the surface of the object to be plated, and no plating reaction is observed.

Specific examples of the plating solution suitable for the present invention include the following. That is, as the copper plating solution, CC4 manufactured by PCK and A4 manufactured by Hitachi, Ltd.
P2, SELECT, CUST- manufactured by Hitachi Chemical Co., Ltd.
201, CUST3000, Novigant HC manufactured by Atotech, Print Gant 820, Ultra Gantt, Okuno Pharmaceutical Co., Ltd. OPC700, OPC750, OPC77
0, Cupposit Copper Mix 328, Cupposit 250, Cupposit 25 manufactured by Shipley Co., Ltd.
1, MC-U and MCU-H manufactured by World Metal Co., Ltd., and the like. Also, as the nickel plating solution,
Linden Series, Nibolon-MO manufactured by World Metal Co., Ltd., Emplate NI-86 manufactured by Meltex Co., Ltd.
5, NI-419, NI-426, NI-870, NI
875, Kaniboron manufactured by Nippon Kanigen Co., Ltd., Top Nicolon series manufactured by Okuno Pharmaceutical Co., Ltd., and the like.
As the gold plating solution, CAT manufactured by World Metal Co., Ltd.
90, CAT99, CAT92 process, Mn-Au,
gold-8, IM-GOLD manufactured by Japan High Purity Chemical Co., Ltd.
And the like. Examples of the palladium plating solution include those having the following composition 1 or composition 2.

Composition 1: (1) 0.01 m of palladium chloride
ol / L, (2) 0.08 mol of ethylenediamine /
L, (3) sodium phosphinate 0.03 mol /
L, (4) thioglycolic acid 30 mg / L.

Composition 2: (1) 0.01 m of palladium chloride
ol / L, (2) 0.08 mol of ethylenediamine /
L, (3) 50 mg / L of thioglycolic acid, and (4) 0.06 mol / L of trimethylamine borane.

The concentration of the plating solution suitable for the present invention, when irradiating light, is in the range of 0.5 to 2 times the building bath concentration recommended by each processing solution maker, and the irradiation of light is not performed. The plating solution for the second and subsequent plating baths is preferably 0.8 to 1.2 times the concentration of the building bath recommended by the manufacturer.

After the object to be plated is immersed in such a plating solution, in the present invention, only a desired area on the surface of the object to be plated is irradiated with a strong light beam. As the irradiation method at this time, a known method can be applied without any particular problem. In order to selectively irradiate a desired area, the irradiation may be performed, for example, via a photomask. However, if the beam diameter is narrowed down using a highly directional radiation source such as a laser beam, It is particularly advantageous for the selective activation of fine regions. When a laser beam is used, a CO ₂ laser, YAG (Yttrium Aluminum Gar)
net) A laser, an argon ion laser, an excimer laser, and the like are suitable, but are not particularly limited thereto, and these may be appropriately combined with a well-known irradiation method, or these lasers may be used in combination with each other. Or use these harmonics.

The range of laser light output suitable for the present invention is 1
00 mW to 2000 W, but more preferably 0.
5 to 100W. When the laser output is less than 100 mW, flash photolysis is less likely to occur, and as a result, a plating catalyst or a metal salt oxide serving as a precursor thereof may be less likely to be generated. Conversely, 2000
If W is exceeded, the plating solution will be boiled, making it difficult to produce a plating catalyst or its precursor, or even if it is produced, the catalyst or its precursor will adhere to the substrate, and the turbulent flow accompanying the boiling will occur. In some cases, it may be difficult to obtain a desired pattern.

On the other hand, the irradiation time is preferably within 10 seconds, more preferably within 3 seconds. When the irradiation time exceeds 10 seconds, the plating solution may be boiled to make it difficult to generate a plating catalyst or a precursor thereof, or the above-described laser-induced plating may occur to easily change plating film characteristics. .

The oscillation mode of the irradiation light may be any of continuous oscillation, chopper oscillation, and pulse oscillation.
By using pulse oscillation, the output wave peak value can be adjusted.

In the present invention, flash photolysis of metal salts (hereinafter, including a complex) dissolved in the plating solution occurs very near the surface of the object to be irradiated with light. The reason why photolysis occurs only in the vicinity of the surface and does not occur in the bulk of the plating solution is unknown at this time, but (1) the temperature rise of the surface to be plated due to irradiation light,
(2) a cooling action by the plating solution, (3) a micro stirring action of the plating solution caused by the above (1) and (2),
It is thought that (4) the molecular absorption of metal salts and (5) the interference phenomenon between the irradiation light and the reflected light from the surface are complicatedly affected.

When the metal salts dissolved in the plating solution cause flash photolysis, fine particles of metal oxide or metal hydroxide are precipitated. For example, copper oxide (Cu ₂ O and / or CuO) from a copper plating solution, and nickel hydroxide (NiOH and / or Ni) from a nickel plating solution.
(OH) ₂ ) precipitates and deposits on the substrate.

The metal oxide or metal hydroxide deposited only in the desired region in this way has the activity of catalyzing the plating reaction as it is, but is gradually reduced by the action of the reducing agent in the plating solution. It becomes a pure metal having higher activity. For example, a reduction reaction of nickel hydroxide in a plating solution is exemplified as follows.

[0034]

Embedded image

Since the chemical plating reaction has autocatalytic properties, once the reaction starts, no further catalyst is required. Therefore, the substance that becomes the nucleus of the plating reaction may be very small, and the amount deposited and deposited by the flash photolysis is sufficient, and there is no need to repeat light irradiation. However, irradiation may be repeated a plurality of times in order to secure the initial throwing power of plating. In addition,
In the present invention, unlike the conventional laser-induced plating, it is not necessary to directly apply energy by laser irradiation to grow the plating film, and therefore, it is not necessary to continuously irradiate the laser during the film formation.

As described above, according to the present invention, the object to be plated, in which only the desired portions are selectively activated, is successively immersed in the chemical copper plating solution, so that only the desired portions can be selectively chemically treated. A plating film can be formed. At this time, two or more types of electroless plating solutions are prepared, and after selective activation is performed in the first electroless plating solution,
To form an electroless plating film. For example, after activating a plating solution containing a metal complex having a high extinction coefficient as a first electroless plating solution, high-speed plating is performed by immersion in an electroless plating solution having a high plating rate. There is an effect that the plating rate can be increased and the film properties (electrical conductivity, elongation at break, etc.) can be improved by combining the characteristics of the plating solution. In addition, the type of metal is changed between the first electroless plating solution and the second electroless plating solution. For example, the first electroless plating solution is an electroless palladium plating solution, and the second electroless plating solution is an electroless plating solution. A copper plating solution may be used.

The selective plating film forming method provided by the present invention can be applied to a method of manufacturing a wiring board. By using the selective plating film forming method of the present invention to sweep light on the substrate on the basis of CAD data, a desired wiring can be formed without using a photomask. When a wiring board is made by this method,
An excellent process can be constructed that is not affected by mask expansion and contraction and can reduce man-hours and time required for mask making. In addition, this method can be easily applied to the repair of a broken portion.

The plating film forming method of the present invention comprises:
The present invention can also be applied to the case where wiring is formed on the surface of an insulating substrate or an insulating film formed by a usual method. That is, the method of manufacturing a wiring board according to the present invention may include (1) a step of repairing a broken portion of the wiring board formed by a normal method using the plating film forming method of the present invention; A) a first wiring forming step of forming a first wiring on the substrate surface, an insulating film forming step of forming an insulating film of a predetermined pattern on the substrate surface so as to cover the first wiring, and A second wiring forming step of forming a second wiring in the wiring board, wherein the first wiring and / or the second wiring are formed by the plating film forming method of the present invention. There may be. Further, a multilayer wiring board may be formed by repeating the insulating film forming step and the second wiring forming step a desired number of times.

[0039]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings. Here, for the sake of simplicity, an example of creating a single-sided board is shown, but a double-sided board can be created by the same operation.

<Embodiment 1> The plating process in this embodiment is schematically shown in FIGS. 1 (a) and 1 (b). A glass epoxy substrate 1 (length and width: 10 cm, thickness: 1.6 mm, which is obtained by etching and removing copper foil of “MCL-E-67” manufactured by Hitachi Chemical Co., Ltd.) was used as an object to be plated.
The sample was immersed in a 6% aqueous solution of "Conditioner 231" manufactured by Shipley Co. for 3 minutes, and then thoroughly washed with water.

As shown in FIG. 1A, a pad filled with an electroless nickel plating solution 5 "Nibolon-MO" manufactured by World Metal Co., Ltd., wherein the substrate 1 was maintained at a solution temperature of 60 ° C. and a pH of 7.0. Then, a desired portion of the glass epoxy substrate was irradiated with an argon ion laser 2 (maximum output 2 W) for 0.5 seconds to adsorb the nickel oxide fine particles 3. After the laser irradiation, the substrate was further immersed in the plating solution 5 and taken out about 1 hour later. As shown in FIG. 1 (b), the formation of the nickel film 4 was confirmed only at the desired locations. In FIG. 1A, hatching of the metal fine particles 3 is omitted for easy viewing.

<Embodiment 2> In this embodiment, an object to be plated
The same cleaning degreasing agent and laser device as in Example 1 were used, but an electroless palladium plating solution maintained at a liquid temperature of 50 ° C. and pH 9.0 was used instead of the electroless nickel plating solution in Example 1. . The composition of the electroless palladium plating solution is as follows: (1) 0.01 ml / L palladium chloride;
(2) ethylene diamine 0.08 mol / L, (3) sodium phosphinate 0.03 mol / L, and
(4) Thioglycolic acid was 30 mg / L.

In the same manner as in Example 1, a desired portion of the substrate surface is irradiated with a laser beam for 0.5 seconds to adsorb fine palladium particles on the substrate surface, and then immersed in a plating solution for about 1 minute after stopping the laser irradiation. Thus, fine palladium particles were grown.
Thereafter, the substrate was taken out of the palladium plating solution, and after sufficiently washing with water, the chemical copper plating solution for thick film AP2 was removed.
(Manufactured by Hitachi, Ltd., pH 12.2, liquid temperature 68-72)
C.) to grow a copper plating film. After one hour, the copper plating film was taken out and observed for the cross-sectional shape of the region to be plated. As a result, a plating film having a thickness of about 3 μm had grown only at the portion irradiated with the argon laser.

<Embodiment 3> In this embodiment, an object to be plated
The same cleaning degreasing agent and laser device as in Example 1 were used, but instead of the electroless nickel plating solution in Example 1, a chemical copper plating solution manufactured by Shipley Co., Ltd. "Cuposit Copper Mix 328 (Cuposit Copper Mix 328A)" (125 ml / L), a mixture of Cupposit Copper Mix 328L (125 ml / L) and Cupposit Copper Mix 328C (25 ml / L) at room temperature.

In the same manner as in Example 1, a desired portion of the surface of the object to be plated was irradiated with an argon ion
The irradiation site was swept at a speed of seconds. After performing a laser irradiation sweep of a desired pattern, it was immersed in a plating solution for about 30 minutes and then taken out. As a result, a copper plating film had grown only at the laser sweep portion.

<Embodiment 4> In this embodiment, the substrate prepared in Embodiment 3 is treated with 0.2N diluted sulfuric acid and then immersed in a second copper plating solution to reduce the thickness of the plating film. Increased. The second copper plating solution used in this example is a chemical copper plating solution for thick film AP2 (manufactured by Hitachi, Ltd., pH 12.2, solution temperature 68-72 ° C.), and the plating solution is added to the plating solution for 12 hours. By immersion, the plating film was grown to a thickness of 30 μm.

<Embodiment 5> In this embodiment, "MCL-E-67" (size is the same as that of Embodiment 1) manufactured by Hitachi Chemical Co., Ltd. was used as an object to be plated, but the copper foil was removed. In this case, the entire surface was not etched as in Example 1,
The desired copper pattern was left. By cutting off a part of the copper pattern of the glass epoxy substrate with the copper pattern thus produced with a knife, a broken wire portion was formed.

The above substrate is immersed in a chemical copper plating solution in the same manner as in Example 3, and laser irradiation is performed on the above-mentioned broken wire, so that copper fine particles having plating catalytic activity adhere to the broken wire. Was. Thereafter, the copper plating film was grown by immersion in a chemical copper plating solution for thick film for 1 hour as in Example 4, and the plating film grew at the above-mentioned wire breakage, and grew on the wiring on both sides thereof. No problem was observed in the electrical connection.

<Embodiment 6> In this embodiment, the same plating treatment as that of Embodiment 5 for the disconnection portion was performed using the plating system 200 shown in FIG.

The plating system 200 of this embodiment includes a cleaning tank 201 for holding a cleaning solution for degreasing cleaning, a water washing mechanism 202 for washing and drying a substrate, and a plating tank 203 for holding a plating solution. And a growth tank 209 for growing a plating film, an XY stage 204 for positioning a substrate to be processed fixed inside the plating solution tank, and a transport mechanism 205 for transporting the substrate therebetween. A driving unit 206 for an XY stage, an imaging unit 207 including a CCD (Charge Coupled Device) camera for photographing the substrate surface, a laser irradiation unit 208 for irradiating the substrate surface with a laser, and a control device 210. Is provided.

The control device 210 includes a water washing mechanism 202, a transport mechanism 205, an XY stage driving section 206, and an imaging section 207.
And an information processing device for controlling the operation of the laser irradiation unit 208. The main storage device 211, a CPU (Central Processing Unit) 212, an input / output device 213, and an external storage device 2
14 is provided. The external storage device 214 holds a CAD (computer-aided design) database 220 (shown in FIG. 3). In the present invention, any known and commonly used CAD database may be used as long as it holds the position information of the wiring of the substrate to be processed.

The functions of the control device 210 described below are stored in the external storage device 214 in advance, and the programs read into the main storage device 211 are executed by the CPU 2.
12, the present invention is not limited to such software and means for realizing by a general-purpose processor. For example, a hardware device including hard-wired logic for realizing each of these functions,
It may be realized by a combination of the hardware device and a general-purpose processor.

Next, the flow of processing in the control device 210 will be described with reference to FIG. As in the fifth embodiment, a 6% aqueous solution of “conditioner 231” manufactured by Shipley at 60 ° C. is held in the cleaning tank 201 in advance. The plating tank 203 holds the same cupposit copper mix 328 solution (room temperature) as in Example 3, and the growth tank 209 has a solution temperature of about 70 ° C. manufactured by Hitachi, Ltd. The chemical copper plating solution for thick film AP2 is held in advance.

When a plating process is instructed through the input / output device 212, the control device 210 firstly controls the transport mechanism 205.
The substrate to be processed is put into the cleaning tank 201, taken out after 3 minutes, and transported to the water washing mechanism 202 (Step 30).
1). Next, the control device 210 opens the water injection valve of the water washing mechanism 202 to wash the surface of the substrate to be processed with water (step 302), and thereafter, the plating mechanism 2 is transferred by the transport mechanism 205.
03 (Step 303), and the plating tank 203 is moved to the XY stage 2 while the substrate to be processed is inserted.
04 (step 304).

Subsequently, the control device 210 controls the imaging unit 207
, The image data of the substrate to be processed is sampled, and the broken point is detected by comparing with the wiring information registered in the CAD database held in the external storage device 214 to determine the laser irradiation position (step 305).

Next, the control unit 210 controls the XY stage driving unit 206 to operate the XY stage 204 to align the substrate in the plating tank 203 on which it is mounted (step 306). Then, the substrate to be processed is photographed again, the position of the disconnection point (that is, the laser irradiation point) is recognized, and the position is more precisely aligned (step 307).

When the laser irradiation position is at a predetermined position (ie,
When the control unit 210 is disposed at the optical axis position of the laser irradiation unit 208, the control unit 210 operates the laser irradiation unit 208 to sweep (100 μm / sec) the laser light to the broken position.

Next, the controller 210 controls the transport mechanism 205
The plating bath 203 is lowered from the XY stage (step 309), left for a predetermined time (30 minutes in this embodiment), and then the substrate to be processed is taken out of the plating bath 203 and transferred to the growth bath 209 (311).

Finally, after a predetermined time (one hour in this embodiment) has elapsed, the control device 210 takes out the substrate to be processed from the growth tank 209 by the transport mechanism 205 (step 312), and cleans the substrate by the water washing mechanism 202. Then, it is dried (step 313).

Using this plating system, a process of repairing a broken portion was performed using a substrate with broken wires in the same manner as in Example 5, and a good connection was automatically obtained in the same manner as in Example 5. I was able to.

In this embodiment, after the treatment in the plating tank 203, the plating tank is further treated to increase the thickness of the plating film. However, in the case of treating with only one type of plating solution, the growth tank is used. 209 and steps 311, 31
Step 2 may be omitted. In addition, pre-processing may be performed before charging into the growth tank 209.

In this embodiment, after the substrate to be processed is placed on the XY stage, the irradiation position determination processing (step 30)
Although 5) is performed, the irradiation position may be determined in advance before step 304. In this case, the plating tank 20 on the XY stage 204
After the mounting of No. 3, the alignment of Step 306 is performed using alignment marks on the substrate surface or the like.
, The image data of the substrate may be obtained, and the precise alignment (step 307) may be performed based on the image data.

[0063]

According to the present invention, fine positioning of laser irradiation output is not required, and positioning accuracy is small in a narrow area.
A thick plating film can be formed easily and at low cost.

The technology provided by the present invention has solved the following problems of the prior art. (1) According to the present invention, there is no need to form a catalyst precursor film on the entire surface of the object to be plated. In electroless nickel plating or electroless copper plating, selective activation is possible without using a noble metal or a compound thereof. Therefore, the processing cost can be reduced. (2) Conventionally, after forming a catalyst precursor on the entire surface to be plated, it was necessary to go through a process of removing only unnecessary portions, but according to the technology of the present invention, selective activation of only necessary portions is required. As a result, the catalyst does not remain in unnecessary places. (3) Since a catalyst is not attached to a portion where activation is unnecessary, occurrence of abnormal plating can be suppressed. (4) There is no danger of catalyst poisoning or deactivation because the catalyst is activated in the plating solution used directly for electroless plating. (5) Selective activation can be performed in steps as short as non-selective activation processing. (6) Since plating film formation can be achieved only in a fine region, it can be easily applied to pattern correction and the like. (7) Since processes such as mask production and resist film formation can be minimized, resource-saving and environmentally friendly processes can be constructed.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating a method for manufacturing a wiring board according to a first embodiment.

FIG. 2 is a schematic diagram illustrating a configuration of a plating system according to a sixth embodiment.

FIG. 3 is a flowchart showing a flow of processing of a control device in a plating system according to a sixth embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate to be processed (object to be plated), 2 ... Irradiation light (laser), 3 ... Metal fine particles, 4 ... Plating film, 5 ... Plating solution, 200 ... Plating system, 201 ... Cleaning tank, 202
, A washing mechanism, 203, a plating tank, 204, an XY stage, 205, a transport mechanism, 206, an XY stage driving unit,
207: imaging unit, 208: laser irradiation unit, 209: growth tank, 210: control unit, 211: main storage unit, 212:
CPU, 213: input / output device, 214: external storage device,
220 CAD database.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4K022 AA03 AA18 AA42 BA03 BA08 BA14 BA18 CA03 CA08 DA01 DB30 5E343 BB23 BB24 BB44 BB48 DD34 EE02 ER51 GG11 GG20

Claims (12)

[Claims] 1. A metal ion, a complexing agent for the metal ion,
In the electroless plating method of forming a plating film on the surface of the object to be plated by immersing the object to be plated in an electroless plating solution containing a reducing agent and a pH adjusting agent, the immersion in the first electroless plating solution A light irradiating step of irradiating the surface of the object to be illuminated with light in a state in which the object has been plated, and leaving the object to be plated in the first electroless plating solution for a predetermined time to form a plating film on the irradiated portion. And a film forming step in this order. 2. The electroless electroless electroless machine according to claim 1, further comprising a degreasing cleaning step of degreasing and cleaning the surface of the object to be plated before immersion in the first electroless plating solution. Plating method. 3. The electroless plating method according to claim 1, wherein the metal ion is any one of copper, nickel, gold, and palladium. 4. The electroless plating method according to claim 1, wherein the light irradiation is performed in a predetermined pattern through a photomask. 5. The electroless plating method according to claim 1, wherein the irradiation of the light is performed in a predetermined pattern by sweeping a laser beam. 6. The light source is a CO ₂ laser, a YAG laser,
The electroless plating method according to claim 1, wherein the method is one of an argon ion laser and an excimer laser. 7. The method according to claim 1, further comprising, after said plating film forming step, a plating film growing step of immersing said object to be plated in a second electroless plating solution for a predetermined time. Electroplating method. 8. An electroless plating method according to claim 1,
A method for manufacturing a wiring board, comprising a step of forming a metal wiring made of the plating film on a surface of an insulating substrate or an insulating layer. 9. The method according to claim 8, wherein the formation of the metal wiring is performed at a location where the wiring is broken. 10. The method according to claim 10, further comprising the step of comparing the image data of the wiring having the disconnection location with the design data of the wiring to recognize the disconnection location. 9. The method according to claim 8, wherein the step of irradiating light is performed. 11. A plating tank for holding an electroless plating solution, and an imaging unit for obtaining image data of a surface of a substrate to be processed immersed in the electroless plating solution held in the plating tank. A laser irradiation unit for irradiating a laser on the surface of the processing target substrate immersed in the electroless plating solution held in the plating tank, and a control device for controlling the operation of the laser irradiation unit The control device, the image data of the wiring having the disconnection location, by recognizing the disconnection location by comparing the design data of the wiring, controlling the laser irradiation unit, the laser at the disconnection location An electroless plating apparatus, comprising: means for irradiating the substrate. 12. An apparatus for manufacturing a wiring board, comprising the above electroless plating apparatus.