JP2000138274A - Processing unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing unit, capable of correctly recognizing the state of particles, in a processing box in real time by using laser light. SOLUTION: A processing device for receiving in a processing box 20 a plurality of bodies W stacked on a boat 30 and for subjecting the bodies W to a predetermined processing has a laser-emitting unit 54 for emitting a laser light L, a light guide unit 56 for guiding the laser light L into the processing box 20 and for causing the light to radiate in the direction between the bodies W, a light guide unit 58 for receiving the laser light L transmitted between the bodies W and for introducing to the outside of the processing box 20, a light-receiving unit 60 for detecting the light introduced by the light-guide unit 58, and a particle evaluating unit 62 for evaluating the existing state of particles in the processing box 20, based on the detection value of the light-receiving unit 60. The state of the particles in the processing box can be recognized correctly in real time by using the laser light.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus capable of monitoring the presence of particles in a processing container for processing a semiconductor wafer or the like.

[0002]

2. Description of the Related Art Generally, in order to manufacture a semiconductor device, various processes such as film formation, etching, oxidation and diffusion are performed on a semiconductor wafer. For example, in a CVD apparatus in which a film is formed on a large number of wafers at once, semiconductor wafers are placed on a wafer boat in, for example, multiple stages at an equal pitch.
A film forming gas is supplied to the surface of the wafer while heating the film to a predetermined temperature, and a decomposition product or a reaction product of the gas is deposited on the wafer to form a film. In order to improve the yield of semiconductor wafers to be manufactured, it is necessary to sufficiently manage particles that mainly cause a decrease in yield. For example, if an unnecessary film of a certain amount or more adheres to the inner wall of the processing container or the wafer boat, the unnecessary film is peeled off to generate particles, and the particles adhere to the wafer surface to cause defects. Therefore, when an unnecessary film of a certain degree or more adheres to the inner wall of the processing container or the surface of the wafer boat, a cleaning operation is performed to remove the unnecessary film by cleaning them. As a method, the number of particles generated in a processing container is monitored and evaluated.

[0003] In this method of evaluating particles, a bare wafer which is very clean and has few particles adhered thereto is used as a monitor wafer, and a film is formed on the bare wafer at the same time as a product wafer, and the number of particles attached to the surface is counted. There is a method and a method of providing a counter for counting the number of particles contained in exhaust gas in an exhaust system of a processing container as disclosed in, for example, JP-A-6-13325. For example, a method of providing this counter will be described with reference to FIG. 13. In FIG. 13, reference numeral 2 denotes, for example, a vertical processing container having a double-tube structure. A large number of semiconductor wafers W supported in multiple stages at equal pitches are accommodated. An exhaust system 8 provided with a vacuum pump 6 on the way to evacuate the internal atmosphere is connected to the processing vessel 2, and a counter 10 is provided on the way of the exhaust system 8 so that particles in the exhaust gas are provided. It is designed to count the number.

[0004]

Among the above-mentioned particle evaluation methods, the method using a monitor wafer increases the running cost because the clean monitor wafer is quite expensive. In particular, it is considered that 6 inch and 8 inch wafers will become mainstream in the future.
An inch wafer has a problem that the price of one monitor wafer (bare wafer) is extremely high, and the running cost is greatly increased. Furthermore, when this monitor wafer is used, it takes a certain amount of time before an evaluation result is obtained, so that a product wafer processed simultaneously with the monitor wafer has already flowed to a product process in a later process, and in some cases, Despite the need to clean the processing container due to waste or bad particle evaluation results, the product wafer of the next lot is formed in the same processing container without performing this, but the yield is further increased. Was also causing the decline.

On the other hand, the method of providing the exhaust system 8 with the counter 10 to count particles is excellent in that the presence state of the particles in the processing vessel 2 can be grasped in real time. However, the correlation between the actual state of the particles in the processing container and the number of particles counted by the counter is not so strong, and the reliability is not sufficient. For example, before the particles generated in the processing container 2 flow into the counter 10, the particles are trapped in some gas flow path, and the number of particles is reduced by the counter, or conversely, accumulated in the past. In some cases, the counter counts a larger number of particles than the actual state of the particles in the processing container due to the particles peeling off from the inner wall of the processing container at a stretch, and the reliability of the particle evaluation is not so high.

[0006] The present invention focuses on the above problems,
It was created to solve this effectively. An object of the present invention is to provide a processing apparatus capable of accurately recognizing the presence state of particles in a processing container in real time by using laser light.

[0007]

According to a first aspect of the present invention, a plurality of workpieces mounted in multiple stages on a boat to be processed are accommodated in a processing vessel to perform predetermined processing. In the processing apparatus, a laser emitting unit that outputs laser light, a light introducing unit that introduces the laser light into the processing container and emits the laser light in a direction passing between the processing objects, and passes between the processing objects. Light deriving means for receiving the extracted laser light and guiding the light out of the processing container, light receiving means for detecting light guided by the light deriving means, and particles in the processing container based on a detection value of the light receiving means. And a particle evaluation means for determining the state of existence of the object.

Thus, the laser light output from the laser emitting means is introduced into the processing vessel by the light introducing means and emitted so as to pass between the objects to be processed. When the emitted laser light has particles floating on the way, the emitted laser light is temporarily interrupted for a short time, or the amount of light is temporarily reduced. This laser light is received by the light deriving means, guided to the outside of the processing container, and detected by the light receiving means. Then, based on the detection result of the light receiving means, the particle evaluation means determines the presence state of the particles in the processing container in real time. in this case,
As defined in claim 2, for example, the light introducing means comprises:
A hollow light introduction tube vertically erected in the processing container,
A first reflecting mirror is provided at the tip of the light introducing tube to reflect the laser light in the horizontal direction, and the light guide means reflects the laser light reflected by the first reflecting mirror in the vertical direction. It can be formed by a second reflection mirror and a hollow light extraction tube provided vertically upright in the processing container to extract the light reflected by the second reflection mirror. Further, the light introduction tube and the light extraction tube may be formed of an opaque material, as defined in claim 3, and the opaque material may be formed of SiC, as defined in claim 4. it can.

As described above, by forming the light introducing tube and the light guiding tube with an opaque material, it is possible to prevent the intrusion of disturbance light and prevent noise from being mixed. Further, as defined in claim 5, the light introducing tube and the light guiding tube are made of a transparent material, and an opaque coating film can be formed on the inner wall surface. . In this case as well, the intrusion of disturbance light can be cut off by the coating film, so that it is possible to prevent noise from being mixed. In this case, for example, the transparent material is made of SiO ₂ and the coating film is made of SiC.
Can be formed. Further, as set forth in claim 7, the tips of the light introducing tube and the light guiding tube are hermetically sealed, and a transparent window for transmitting light is formed in the sealed portion. You may. As described above, by sealing the inside of the light introducing tube and the inside of the light guiding tube, it is possible to prevent the processing gas or the like from being introduced into the inside, and to prevent an unnecessary film or the like from adhering to the inside of the tube.

Further, the laser beam may be composed of two laser beams having a very small beam diameter and running in parallel at a fine interval. According to this, an adverse effect due to disturbance noise can be almost certainly cut off. According to a ninth aspect of the present invention, there is provided a processing apparatus in which a plurality of processing objects mounted in multiple stages on a processing object boat are accommodated in a processing container to perform predetermined processing. A laser emitting means for outputting, a light introducing means for introducing the laser light into the processing container and emitting the laser light in a direction passing between the processing objects, and scattering of the laser light passing between the processing objects by particles. A light deriving unit that receives light and guides the light out of the processing container; a light receiving unit that detects light guided by the light deriving unit; and the presence of particles in the processing container based on a detection value of the light receiving unit. Particle evaluation means for determining a state may be provided. According to this,
The particle state can be determined based on the scattered light of the laser light.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the processing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a configuration diagram showing a processing apparatus according to the present invention, FIG. 2 is an enlarged view showing a characteristic portion of the present invention in the processing apparatus, FIG. 3 is a cross-sectional view showing a light introducing tube, and FIG. FIG. Here, a vertical film forming apparatus by CVD will be described as an example of the processing apparatus. As shown in the drawing, the film forming apparatus 12 includes a cylindrical inner cylinder 14 made of quartz and an outer cylinder 16 made of quartz concentrically arranged outside the inner cylinder 14 with a predetermined gap 18 interposed therebetween.
, And the outside thereof is covered by a heating furnace 26 provided with a heating means 22 such as a heater and a heat insulating material 24. The heating means 2
2 is provided on the entire inner surface of the heat insulating material 24.

The lower end of the processing vessel 20 is supported by a cylindrical manifold 28 made of, for example, stainless steel, and the lower end of the inner cylinder 14 has a ring-shaped support plate 28A projecting inward from the inner wall of the manifold 28. , And a quartz wafer boat (object boat) 30 on which a number of semiconductor wafers W as objects to be processed are mounted from below the manifold 28, and can be vertically inserted and removed. In the case of the present embodiment, the wafer boat 30 can support, for example, 180 wafers at substantially equal pitches in multiple stages.

The wafer boat 30 is mounted on a rotary table 34 via a heat insulating tube 32 made of quartz. The rotary table 34 passes through a lid 36 that opens and closes a lower end opening of the manifold 28. It is supported on a rotating shaft 38. For example, a magnetic fluid seal 40 is interposed in the penetrating portion of the rotating shaft 38, and rotatably supports the rotating shaft 38 while hermetically sealing it. Further, a seal member 42 made of, for example, an O-ring is provided between the periphery of the lid 36 and the lower end of the manifold 28 to maintain the sealing property in the container.

The rotating shaft 38 is attached to the tip of an arm 46 supported by an elevating mechanism 44 such as a boat elevator.
Etc. can be moved up and down integrally. A gas introduction nozzle 48 for introducing a film formation gas or an inert gas, for example, N ₂ gas, whose flow rate is controlled into the inner cylinder 14 is provided on a side portion of the manifold 28. Also, the manifold 28
An exhaust port 50 for exhausting the atmosphere in the container from the bottom of the gap 18 between the inner cylinder 14 and the outer cylinder 16 is provided on the side of the container. The exhaust port 50 is connected to a vacuum pump or the like (not shown). The installed evacuation system is connected. The lid 36 has a particle detection mechanism 5 that is a feature of the present invention.
2 are provided. As shown in FIG. 2, specifically, the particle detection mechanism 52 includes a laser light emitting unit 54 that outputs a laser beam L, and the laser beam L that is introduced into the processing container 20 and the length direction thereof, that is, Here, a light introducing means 56 for guiding upward and emitting the light between the wafers W, and a light guiding means for receiving the emitted laser light in the longitudinal direction of the processing container 20, that is, guiding the light downward and leading it outward. 5
8, light receiving means 60 for detecting the derived light, and particle evaluation means 62 for determining the state of particles in the processing container 20 based on the detected value.

In FIG. 1, reference numeral 30A denotes a column of a wafer boat 30, and each wafer W is mounted on and supported by a support groove 31 formed at a constant pitch on the column 30A. The laser emitting means 54 is composed of a semiconductor laser element, and for example, an Ar laser element or a YAG laser element can be used. The light introducing means 56 has a pipe-shaped light introducing tube 64 having a hollow section (see FIG. 3) made of, for example, an opaque material.
The light introducing tube 64 is inserted into a through hole formed in the peripheral portion of the lid 36 and is set upright in the inner cylinder 14 of the processing container 20. Airtightness is maintained at a mounting portion of the light introducing tube 64 by interposing a sealing member 66 such as an O-ring. The lower end of the light introducing tube 64 is hermetically sealed.
The laser light L is output upward while the laser light 4 is attached and fixed, and travels through the hollow light introducing tube 64.

A first reflecting mirror 68 inclined at approximately 45 degrees is attached to the upper end of the light introducing tube 64, and reflects the laser light L traveling in the light introducing tube 64 in the horizontal direction. Then, the reflected laser light L is passed between the wafers at a predetermined position. As the first reflection mirror 68, a simple reflection mirror, a right-angle prism, or the like can be used. The light deriving means 58 is installed on the substantially opposite side of the wafer introducing boat 30 with respect to the light introducing means 56 thus configured. The light guiding means 58 is configured in exactly the same manner as the light guiding means 56, and has a hollow pipe-shaped light guiding pipe 70 made of, for example, an opaque material (see FIG. 3). 7
0 is inserted into a through-hole formed in the peripheral portion of the lid 36, and is set upright in the inner cylinder 14 of the processing container 20. An airtightness is maintained at a mounting portion of the light guide tube 70 by interposing a seal member 72 such as an O-ring. The lower end of the light guide tube 70 is hermetically sealed. The light receiving means 60 is attached and fixed to the light guide tube 70 to detect the laser beam L traveling downward in the hollow light guide tube 70. It is supposed to.

At the upper end of the light guide tube 70, approximately 4
A second reflecting mirror 74, which is inclined at 5 degrees, is mounted so as to face the first reflecting mirror 68, and the laser light L traveling horizontally between the wafers is directed downward by the second reflecting mirror 74. And travels inside the light guide tube 70. This second reflection mirror 74
Also, a simple reflecting mirror or a right-angle prism or the like can be used. Further, as the light receiving means 60, an optical sensor,
For example, a photodiode or the like can be used. The light receiving signal from the light receiving means 60 is transmitted to a particle evaluation means 62 such as a microcomputer.
To detect the presence / absence or size of particles.

In this embodiment, as shown in FIG. 3, the inner diameter D1 of the light introducing tube 64 and the light guiding tube 70 is set to about 5 mm, and the outer diameter D2 is set to about 7 mm. As shown in FIG. 4, the laser beam L output from the laser emitting means 54 has two laser beams L1 and L2 having a very small beam diameter and running in parallel at a fine interval. Is made up of The diameter d1 of each laser beam L1, L2,
d2 is 1 mm or less, respectively, and the interval H between the two laser beams L1 and L2 is about 1 to 2 mm. In this case, when the laser light L passes between the wafers, the two laser beams L1 and L2 are set to be vertically parallel in the height direction. This makes it possible to confirm the presence or absence of particles having a diameter of about 0.3 μm as the lower limit.

Next, the operation of the apparatus configured as described above will be described. First, when the film forming apparatus is in the standby state with the wafers unloaded, the processing container 20 is maintained at the process temperature, for example, 620 ° C. or lower, and a large number of wafers at normal temperature, for example, 180 wafers W
Is loaded into the processing container 20 by lifting the wafer boat 30 from below, and the lid 36 closes the lower end opening of the manifold 28 to seal the inside of the container. Then, while maintaining the inside of the processing container 20 at a predetermined process pressure, the process waits until the wafer temperature rises and stabilizes at the predetermined process temperature.
For example, silane or the like is introduced into the processing container 20 while controlling the flow rate from the gas introduction nozzle 48, and a diluted N ₂ gas is also introduced at a predetermined amount. The deposition gas is supplied from the nozzle 48 to the inner cylinder 14.
And then rises by contacting with the wafer W being rotated therethrough to form a film-forming reaction and flow down from the ceiling through the gap 18 between the inner cylinder 14 and the outer cylinder 16, Exhaust port 5
It is discharged out of the container from 0.

While the film forming process is being performed as described above, the particle detecting mechanism 52 causes the processing container 2 to be processed.
The state of the particles within 0 is detected in real time. That is, as shown in FIG. 1 and FIG. 2, the laser light L output upward from the laser light emitting means 54 travels straight upward in the hollow light introducing pipe 64 of the light introducing means 56, and The light is reflected in the horizontal direction by the first reflection mirror 68. At this time, if particles are floating between the wafers, the presence of the particles can be confirmed by blocking the laser beam L. The reflected laser light L passes through the wafers, for example, in the diametric direction, and is located on the opposite side.
, Thereby being reflected downward. The reflected laser light L travels downward in the hollow light guide tube 70, and is detected by the light receiving means 60 provided at the lower end thereof. The detection result is input to the particle evaluation means 62 for evaluation. It is.

FIG. 4 schematically shows a state in which a particle P passes through the middle of the optical path of a laser beam composed of laser beams L1 and L2 running in the horizontal direction in a state where the particles P are arranged substantially vertically in the vertical direction. The particles P show a state of flowing along the flow of the gas flow, for example, from below to above. Of course, even if the particle P flows in the reverse direction, it can be detected. The rising particle P first temporarily blocks the lower laser beam L2, and then temporarily blocks the laser beam L1 when it rises by the interval H. The detection results of the two laser beams L1 and L2 at this time are output, for example, as shown in FIG. 5. Here, a pulse is set up for the length in which the laser beam is blocked. That is, a pulse first rises in the detection result of the laser beam L2, and then a pulse rises in the detection result of the laser beam L1 when a short time T has elapsed. The time T is a time required for the particles P to rise during the interval H. As described above, the presence of one particle is recognized when two pulses rise with a certain time delay in the detection results of both laser beams L1 and L2.

Further, the rising particle P does not always cross both the laser beams L1 and L2. For example, it may be considered that only one of the laser beams is interrupted and the rising particle P rises. Therefore, both laser beams L1,
Even when a pulse rises in only one of the detection results of L2, the presence of one particle is recognized. On the other hand, in general, it is inevitable that disturbance, that is, noise enters this kind of signal system, but such noise enters, for example, only one of the detection results of both laser beams L1 and L2. It is very unlikely that noise will penetrate into the detection results of both laser beams L1 and L2 at the same time. Therefore, both laser beams L1,
In the detection result of L2, if there is a situation in which a pulse rises at the same time as shown in FIG. 6, this does not indicate the presence of the particle, and the particle is not counted because it is noise.

Therefore, particles P having a diameter of about 0.3 μm or more can be counted almost accurately without being affected by noise, so that the state of the particles in the processing container can be accurately monitored and recognized in real time. And the reliability of the particle evaluation can be improved. Therefore, it is possible to accurately recognize an appropriate cleaning time for the processing container 20 and the wafer boat 30. Further, the processing container 20 and the members therein are
For example, when a film forming process is performed, a high temperature state of about 1000 ° C. occurs, so that the radiant light tends to act as disturbance. For example, since it is made of SiC, it is possible to prevent noise from invading the detection result, and it is possible to further improve the reliability of particle evaluation.

Furthermore, if the pulse height and pulse width in FIG. 5 are made to be proportional to the intensity of the laser beam L and the length of the cut-off time, the particle size of the particles P can be recognized. It becomes possible. In the above embodiment,
An opaque material for the material of the light introducing tube 64 and the light guiding tube 70;
For example, the case of forming with SiC has been described as an example, but the present invention is not limited to this. For example, quartz (Si
O ₂ ). In this case, since quartz is a transparent material, an opaque coating film is applied to the inner wall surface. FIG. 7 is a partial side view showing a modified example of such a light introduction tube (light extraction tube), and FIG. 8 is a sectional view taken along line BB in FIG.
FIG. In this case, the light introduction tube 64 and the light extraction tube 70 are formed of quartz which is easy to mold, and a coating film 76 made of an opaque material, for example, SiC is uniformly formed on the inner surface thereof. As a result, the SiC
The same operation and effect as the pipe made of steel, that is, the intrusion of noise is prevented.

In each of the above embodiments, the light introducing tube 64 is used.
The upper end of the light guide tube 70 is open to the inside of the processing container 20, but a film forming gas enters the light guide tube 64 and the light guide tube 70, and an unnecessary film adheres to the inner wall surface. Might be. Therefore, as shown in FIG.
A sealing portion 78 that hermetically seals with a transparent material through which light passes, for example, quartz, at the upper end of each of the light guide tubes 70;
80 may be provided. According to this, since an unnecessary film can be prevented from adhering to the inside of each light introducing tube 64 and the inner wall of the light guiding tube 70, noise can be prevented from entering the laser beam L, and the reliability of particle evaluation can be improved. It can be further improved.

When a transparent material, for example, quartz is used for the light introducing tube 64, the light guiding tube 70, and the sealing portions 78 and 80 for sealing the ends thereof, as shown in FIGS. The coating films 82 and 84 are formed not only on the inner wall surfaces of the light introducing tube 64 and the light guiding tube 70 but also on the inner wall surfaces of the sealing portions 78 and 80 except for the central portions thereof. The central portion is a transmission window 8 through which the laser light L passes.
6, 88. FIG. 11 is a view taken along line CC in FIG. According to this, not only the same operation and effect as the light introduction tube 64 and the light extraction tube 70 shown in FIG.
Since disturbance light entering from the upper ends of the tubes 64 and 70 can be further reduced, the influence of noise can be further suppressed. In each of the above embodiments, the light deriving unit 58
Reflects the laser light passing between the wafers and guides the reflected light to the outside of the processing chamber 20, but is not limited to this. For example, scattered light generated when the laser light L impinges on the particles P It may be received and detected by the means 58. FIG. 12 is a plan view of the upper end portions of the light introducing means and the light deriving means in this modification. In this case, the light deriving means 58 is arranged in a direction substantially orthogonal to the traveling direction of the laser light L from the light introducing means 56 in the same plane, that is, in a direction perpendicular to the same plane. A stop member 92 for absorbing the laser light L is provided in the traveling direction of the laser light L.
Should be provided. As a result, when the laser light L collides with the particles P, scattered light LS is generated, for example, in a substantially radial manner, and the scattered light LS can be reflected and taken in by the second reflection mirror 74 of the light guide means 58.

The light introducing means 56 and the light deriving means 58
The height position is not particularly limited. For example, the height position is preferably set to a position where the generation of particles is expected to be most increased, for example, a position near the bottom of the wafer boat 30, or a plurality of sets of light introduction with different height positions. Means and light deriving means may be provided. Here, the case where the film forming process is performed using the processing apparatus having the double tube structure has been described as an example, but the present invention is not limited to this type of structure, and can be applied to, for example, a processing apparatus having a single tube structure. Also, without the film forming process,
Of course, the present invention can be applied to other etching, oxidation diffusion, annealing, and the like.

[0028]

As described above, according to the processing apparatus of the present invention, the following excellent functions and effects can be exhibited. According to the invention defined in claim 1 or 2, the laser light is irradiated between the objects to be processed, and the presence or absence of the particles is determined based on the detection result of the irradiated laser light. Can be recognized and evaluated in real time. Therefore, it is possible to accurately recognize an appropriate cleaning time for the processing container and the boat to be processed. Further, according to the inventions defined in claims 3 to 7, since disturbance light can be prevented from entering the irradiated laser light, the reliability of particle evaluation can be improved. Further, according to the invention defined in claim 8, since the laser light is formed by two laser beams, it is possible to further suppress the intrusion of disturbance and to further improve the reliability of particle evaluation. Further, according to the invention defined in claim 9, since the presence or absence of particles is determined based on the scattered light by irradiating a laser beam between the objects to be processed, the presence state of the particles in the processing container is determined. It can be recognized and evaluated in real time.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a processing apparatus according to the present invention.

FIG. 2 is an enlarged view showing a characteristic portion of the present invention in the processing apparatus.

FIG. 3 is a sectional view showing a light introducing tube.

FIG. 4 is an enlarged schematic view showing a laser beam.

FIG. 5 is a diagram illustrating an output waveform of a light receiving unit when a particle is detected.

FIG. 6 is a diagram illustrating an output waveform of a light receiving unit when noise enters.

FIG. 7 is a partial side view showing a modified example of the light introduction tube (light extraction tube).

8 is a sectional view taken along line BB in FIG. 7;

FIG. 9 is a cross-sectional view showing a state in which the tip of a light introduction tube (light extraction tube) is sealed.

FIG. 10 is a cross-sectional view illustrating another modified example of a state in which the tip of a light introduction tube (light extraction tube) is sealed.

11 is a view taken along line CC in FIG. 10;

FIG. 12 is a plan view of an upper end portion of a light introduction unit and a light extraction unit in a modification of the present invention.

FIG. 13 is a schematic configuration diagram showing a general vertical processing apparatus.

[Explanation of symbols]

 Reference Signs List 12 film forming apparatus (processing apparatus) 14 inner cylinder 16 outer cylinder 20 processing container 28 manifold 30 wafer boat (object boat) 52 particle detection mechanism 54 laser emission means 56 light introduction means 58 light derivation means 60 light reception means 62 particle evaluation Means 64 Light introduction tube 68 First reflection mirror 70 Light extraction tube 74 Second reflection mirror 76 Coating film 78,80 Sealing portion 82,84 Coating film 86,88 Transmission window L Laser light LS Scattered light W Semiconductor wafer (to be processed) body)

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G06M 1/272 G06M 1/272 H01L 21/02 H01L 21/02 DF term (Reference) 2G043 AA03 CA06 DA08 EA14 FA03 FA05 GA02 GA04 GB03 GB17 HA02 HA05 KA09 LA01 MA01 2G059 AA05 BB09 DD15 EE02 FF04 FF06 GG01 JJ13 JJ17 KK01 LL04 NN01 4G057 AA00 4M106 AA20 BA05 CA41 DH01 DH12 DH32 DH37 DH60

Claims (9)

[Claims]] 1. A processing apparatus in which a plurality of processing objects mounted in multiple stages on a processing object boat are accommodated in a processing container to perform a predetermined processing, and a laser emitting means for outputting a laser beam. A light introducing means for introducing the laser light into the processing container and emitting the laser light in a direction passing between the processing objects, and receiving the laser light passing between the processing objects and guiding the laser light out of the processing container Light deriving means for detecting light guided by the light deriving means, and particle evaluation means for determining the presence state of the particles in the processing container based on a detection value of the light receiving means. A processing device characterized by the above-mentioned. 2. The light introducing means includes: a hollow light introducing tube vertically erected in the processing container; and a first light introducing tube provided at a tip of the light introducing tube and reflecting the laser light in a horizontal direction.
A light reflecting means for reflecting the laser light reflected by the first reflecting mirror in a vertical direction; and a light reflecting means for guiding the light reflected by the second reflecting mirror. 2. The processing apparatus according to claim 1, further comprising a hollow light guide tube provided upright in the processing container. 3. The processing apparatus according to claim 2, wherein said light introducing tube and said light guiding tube are made of an opaque material. 4. The processing apparatus according to claim 3, wherein said opaque material is made of SiC. 5. The processing apparatus according to claim 2, wherein the light introducing tube and the light guiding tube are made of a transparent material, and an opaque coating film is formed on an inner wall surface. 6. The transparent material is made of SiO ₂ ,
The processing apparatus according to claim 5, wherein the coating film is made of SiC. 7. The light-introducing tube and the light-outgoing tube are hermetically sealed at their ends, and a transparent window through which light passes is formed in the sealed portion. 7. The processing apparatus according to any one of 2 to 6. 8. The process according to claim 1, wherein the laser beam is composed of two laser beams having a very small beam diameter and running in parallel at a fine interval. apparatus. 9. A processing apparatus in which a plurality of processing objects mounted in multiple stages on a processing object boat are accommodated in a processing container to perform a predetermined processing, and a laser emitting means for outputting laser light. A light introducing unit that introduces the laser light into the processing container and emits the laser light in a direction passing between the processing objects, and receives the laser light scattered by particles of the laser light passing between the processing objects to perform the processing. Light deriving means for guiding light out of the container, light receiving means for detecting light guided by the light deriving means, and particle evaluation for determining the presence state of particles in the processing container based on a detection value of the light receiving means And a processing unit.