JP2000100901A - Semiconductor manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent damages to substrates, defects of films, and water marks, and so on, by improving the positioning accuracy of substrates by eliminating the fluctuation in a substrate holding section caused by the variation of the outside diameter of the substrates. SOLUTION: A semiconductor manufacturing device is provided with a plurality of substrate support columns 42 which can hold the peripheral of a substrate by rotation, a column support section 36 which is provided rotatably and holds the columns 42, an energizing means 50 provided between the column supporting section 36 and columns 42 to energize the columns 42 in the holding direction, and a rotating means 30 which rotates the support section 36. When the support section 36 and columns 42 are rotated, the columns 42 hold the peripheral of the substrate and, at the same time, are energized in the holding direction and the substrate is supported by the columns 42 in a state where the substrate is fixed to the columns 42.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus having a substrate supporting and fixing mechanism for supporting and fixing a substrate to be processed such as a wafer in a horizontal posture.

[0002]

2. Description of the Related Art Single-wafer CVD (Chemical Vapor Depositi)
on) In a semiconductor manufacturing apparatus such as an apparatus, a spin coater, and a single-wafer cleaning apparatus, a substrate to be processed such as a wafer is usually subjected to various processes while being kept in a horizontal posture. Therefore, the semiconductor manufacturing apparatus includes a substrate supporting and fixing mechanism for supporting and fixing the substrate to be processed in a horizontal posture.

Referring to FIGS. 12 to 16, a single-wafer CVD apparatus having a conventional substrate supporting and fixing mechanism will be described.

In FIG. 12, reference numeral 1 denotes a transfer chamber, and a first load lock chamber 2, a first cooling chamber 3,
Gate valves 8, 9, 1 are provided between the first processing chamber 4, the second processing chamber 5, the second cooling chamber 6, and the second load lock chamber 7, respectively.
0, 11 are provided, the first load lock chamber 2, the second
Gate valves 13 and 14 for loading and unloading the wafer cassette 12 from the outside are provided in the load lock chamber 7, and the chambers 1, 2, 3, 4, 5, 6, and 7 have an airtight structure. .

[0005] As shown in FIG. 13, a cassette elevator 15 is provided in the first load lock chamber 2, and the wafer cassette 12 is mounted on an elevator 16 of the cassette elevator 15. The transfer chamber 1 is provided with a wafer transfer robot 17, which has a transfer arm 18.
A bifurcated tweezer 19 is provided at the tip of 8. Although not shown, a mounting table on which the wafer 20 is mounted is provided in the first cooling chamber 3 and the second cooling chamber 6.

The first processing chamber 4 has a required number (4 in the figure).
The wafer support pins 21 are vertically provided at positions equally dividing the circumference of the wafer 20 (see FIG. 14), and each of the wafer support pins 21 is centered on a predetermined angle axis by a driving device (not shown). It is rotatable.

The wafer support pins 21 are cut away leaving a wafer holding portion 22 having a fan-shaped upper end, and a horizontal wafer mounting surface 23 is formed at the cut portion. A substrate holding groove 24 is formed at the lower end of the wafer holding portion 22 in an arc shape around the axis of the wafer support pin 21, and the upper surface of the substrate holding groove 24 has a tapered surface inclined upward and outward. The lower surface of the substrate holding groove 24 is flush with the wafer mounting surface 23.

The wafer cassette 12 is carried into the first load lock chamber 2 through the gate valve 13 and is placed on the lift 16. The tweezers 19 of the wafer transfer robot 17 are inserted into the first load lock chamber 2 via the gate valve 8, and the wafers 20 are transferred from the wafer cassette 12 to the tweezers 19. After returning the tweezers 19 on which the wafers 20 are placed into the transfer chamber 1, the tweezers 19 are inserted into the first processing chamber 4 via the gate valve 9. After the peripheral portion of the wafer 20 is mounted on the wafer mounting surface 23 of each of the wafer support pins 21, the wafer support pins 21 are moved clockwise in FIG. 15 by the driving device (not shown). Is rotated about the axis by the angle set in. As shown in FIG. 16, the twill of the peripheral portion of the wafer 20 abuts on the upper surface of each of the substrate holding grooves 24, and the peripheral portion of the wafer 20 is held between the upper surface and the lower surface of each of the substrate holding grooves 24. The wafer 20 is supported and fixed by the wafer support pins 21.

The tweezers 19 are retracted from the first processing chamber 4 to the transfer chamber 1. When the processing of the wafer 20 in the processing chamber 4 is completed, the tweezer 19 is moved by the wafer transfer robot 17 to the gate valve 9.
, And the processed wafer 20 is loaded on the tweezer 9. The wafer 20 is unloaded from the first processing chamber 4 and returned to the wafer cassette 12 in the first load lock chamber 2 via the gate valve 8, and the wafer cassette 12 is unloaded.

When the temperature of the wafer 20 becomes high during the processing of the wafer 20, the wafer 20 is once cooled in the first cooling chamber 3 before returning to the first load lock chamber 2, and after cooling, the first cooling chamber 3 is cooled.
Return to load lock chamber 2.

The wafers 20 in the wafer cassette 12 carried into the second load lock chamber 7 are also subjected to required processing in the same procedure as described above, and then carried out.

[0012]

In the above-described conventional semiconductor manufacturing apparatus, when the wafer 20 is supported and fixed on the wafer support pins 21, the wafer support pins 2
1 is always rotated by a fixed angle. In addition, the shape of the wafer 20 has a tolerance within a predetermined range, and the outer diameter of the wafer 20 varies within the tolerance. Therefore, when the outer diameter of the wafer 20 is reduced, the margin of engagement between the wafer holding portion 22 and the peripheral portion of the wafer 20 is reduced as shown in FIG. 17, and the holding becomes unstable. In the case where play occurs in the wafer 20 and the positioning accuracy of the wafer 20 cannot be improved, or when a device for rotating the wafer 20 during processing such as a spin coater is used, the wafer 20
Slip occurs between the peripheral portion of the wafer and the wafer mounting surface 23 of the wafer support pin 21, and the wafer 20
There is a possibility that the peripheral portion of the substrate may be scraped and particles may be generated.

When the outer diameter of the wafer 20 is increased, the peripheral edge of the wafer 20 is too deep into the lateral groove 24 of the wafer support pins 21 as shown in FIG. There is a risk that the wafer 20 may be warped due to too strong a force for clamping the peripheral portion of the wafer.
For this reason, unnecessary stress acts on the film of the formed wafer 20 and causes a film defect, and when the wafer 20 is warped downward when used in a cleaning apparatus, the cleaning liquid is removed from the wafer 20. There is a possibility that the ink may stay on the upper surface and cause a watermark.

In view of such circumstances, the present invention eliminates variations in the substrate clamping force of the substrate clamping portion caused by variations in the outer diameter of the substrate, improves the positioning accuracy of the substrate, prevents damage to the substrate, reduces particles, The purpose is to prevent film defects and prevent the occurrence of watermarks.

[0015]

According to the present invention, there are provided a plurality of substrate support columns capable of holding a peripheral portion of a substrate by rotation, a column support portion rotatably provided and rotatably holding the substrate support column. The present invention relates to a semiconductor manufacturing apparatus comprising: urging means provided between the support column and the substrate support column to urge the substrate support column in a clamping direction; and rotating means for rotating the column support. Further, the substrate support column and the column support portion are connected by a stopper pin, and the stopper pin is fixed to one of the substrate support column and the column support portion and provided so as to be displaceable with respect to the other. The present invention relates to a semiconductor manufacturing apparatus, wherein the column support is provided along the outer periphery of a rotatable rotary driver, and the semiconductor manufacturing apparatus includes the rotary driver and the column support connected. Said times The present invention relates to a semiconductor manufacturing apparatus in which a driving body is a rotating plate, and an engaging pin is provided on one of the rotating plate and the column support portion, and a cutout portion is provided on the other side of the engaging pin. The present invention relates to a semiconductor manufacturing apparatus in which the rotary driver is a rotary plate, and the rotary plate and the column support are connected via a link, and the rotary driver is an internal gear, and the column support is The present invention relates to a semiconductor manufacturing device that meshes with the internal gear, further relates to a semiconductor manufacturing device in which the biasing means is a torsion spring, and further includes an elastically deformable support piece in which the support column is radially provided. According to a semiconductor manufacturing apparatus in which the substrate support column is provided on the column support section via the support piece, the rotation of the rotary driver rotates the column support member and the substrate support column, and The support pinches the periphery of the board Together is biased clamping direction, the substrate is in a state of being supported and fixed to each substrate support posts.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 5
The same reference numerals are given to the same components in FIGS.
Description is omitted.

A disk-shaped rotary plate 30 is provided rotatably and vertically movable by a driving device (not shown). A step portion 31 is formed on the entire periphery of the peripheral portion of the rotary plate 30, and a peripheral wall is formed. A groove 32 is engraved from the side, and upper and lower two-stage flange portions 3 are formed.
3, 34 are formed. An engaging pin 35 is vertically implanted in the lower flange portion 34, and the engaging pin 35 penetrates through the upper flange portion 33 and an upper end protrudes from the step portion 31. Further, the upper portion of the peripheral portion of the rotary plate 30 and the portion of the groove 32 facing the engaging pin 35 are cut off, and the escape portion 4 is formed.
0 is formed.

On the outer side of the rotary plate 30, a required number of column support portions 36 are provided vertically at equal intervals along the outer periphery of the rotary plate 30, and the column support portions 36 are rotatable about an axis. In addition, the driving device (not shown) can move up and down together with the rotating plate 30. The support column 36
Has a shape in which flange portions 37 are formed at upper and lower ends of a cylinder, respectively.
The 0 side forms an arc centered on the axis of the support 36. The rotating plate 3 of each of the flange portions 37, 37
On the 0 side, a claw portion 29 is formed, and the claw portion 29 is loosely fitted in the step portion 31 and the groove 32, and the claw portion 29 is formed with a radially long engagement groove 38. The engaging pin 35 is engaged with the groove 38. A concave curved surface portion 39 is formed on the outer peripheral wall continuous with the claw portion 29, and the concave curved surface portion 39 is formed.
Is equal to the radius of curvature of the peripheral wall of the step portion 31 and the groove 32, and the concave curved portion 39, the step portion 31, the groove 3
The surrounding wall of No. 2 is available for agreement.

A stopper pin 41 is implanted in the lower flange portion 37 in parallel with the axis of the flange portion 37. The stopper pin 41 passes through the upper flange portion 37. I have.

A wafer support column 42 is rotatably fitted to the column support section 36 from above. The wafer support column 42 has a shaft 43 fitted to the column support 36.
A support 44 having the same axis as the shaft 43 and a larger diameter than the shaft 43; and a disk-shaped flange 45 formed on the support 44.
It is composed of

The column portion 44 is cut away leaving a wafer holding portion 46 having a fan-shaped upper end, and a horizontal wafer mounting surface 47 is formed at the cut portion. At the lower end of the wafer holding portion 46, a substrate holding groove 48 is formed in a fan shape around the axis of the column portion 44, and the upper surface of the substrate holding groove 48 has a tapered surface inclined upward and outward. The lower surface of the substrate holding groove 48 is flush with the wafer mounting surface 47. An arc-shaped long hole 49 is formed in the flange 45 along the outer peripheral edge, and the stopper pin 41 is loosely fitted in the long hole 50.

A torsion spring 50 is fitted to the support 44 between the lower surface of the flange 45 and the upper surface of the flange 37 on the upper end. The upper end of the torsion spring 50 is fixed to the lower surface of the flange 45, and the lower end of the torsion spring 50 is fixed to the upper surface of the flange 37 on the upper end side. Biased clockwise. The torsion spring 50
The repulsive force is maintained at a predetermined initial value by the stopper pin 41 abutting on one end of the long hole 49.

The rotation angle of the support 36 (FIGS. 5 and 6)
(A degree in the middle) means that even if the outer diameter of the wafer 20 is the minimum dimension within the tolerance (r in FIG. 6), the distance between the shaft portion 43 of the wafer support column 42 and the column support section 36 can be reduced. It is set such that a predetermined rotational displacement (b in FIG. 6) is generated in the support column 36 in the counterclockwise direction in FIG. Further, when the outer diameter of the wafer 20 is the maximum dimension within the tolerance (R in FIG. 6), the length of the elongated hole 49 is different between the shaft 43 of the wafer support column 42 and the column support 36. The stopper pin 41 can be slightly moved further than the rotational displacement (c in FIG. 6) generated between them. Further, the torsion spring 5 associated with the rotational displacement of the wafer support column 42 is provided.
The increase of the repulsion force of 0 is set to a value that does not affect the substrate holding groove 48.

A cylindrical outer ring 51 is provided concentrically with the rotary plate 30 so as to circumscribe the column support portion 36.

The operation will be described below.

The driving device (not shown) raises the support columns 36 together with the rotating plate 30 and moves the wafer 20 from the tweezers 19 to the wafer support columns 42.
After the transfer to the wafer mounting surface 47, the rotating plate 30 is rotated in the counterclockwise direction in FIGS. As shown in FIG. 4, since the engaging pin 35 is engaged with the notch 38, the support column 36 and the wafer support column 42 are provided.
Rotates in the opposite direction to the rotating plate 30, that is, in the clockwise direction in FIG. The support column 36 rotates without interfering with the rotating plate 30 because the escape portion 40 is provided.
During rotation, the support column 36 is in circumscribed contact with the outer ring 51, so that the rotation axes of the support column 36 and the wafer support column 42 do not tilt.

When the support post 36 is rotated by a predetermined angle, for example, a degrees in FIG. 5, the engaging pin 35 is pulled out of the engaging groove 38, and the concave curved surface 39 of the flange 37 is moved to the stepped portion. The abutment on the peripheral wall of the column 31 stops the rotation of the column supporting portion 36 in the same direction, and the stopped state is maintained by the engagement between the concave curved surface portion 39 and the peripheral wall of the step portion 31 and the groove 32.

Before the wafer support column 42 rotates by a required angle (a degree in FIG. 5), the peripheral portion of the wafer 20 comes into contact with the upper surface of the substrate holding groove 47, and the rotation of the wafer support column 42 stops. I do. Rotational displacement occurs between the shaft portion 43 of the wafer support column 42 and the column support member 36 against the torsion spring 50, and the wafer support column 42 moves relative to the column support portion 36 in FIG. Rotates counterclockwise relative to. Due to the repulsive force of the torsion spring 50, the peripheral portion of the wafer 20 is clamped by the substrate clamping groove 48 with a required clamping force, and the wafer 20 is supported and fixed to the wafer support columns 42.

Even when the outer diameter of the wafer 20 is the minimum dimension within the tolerance (r in FIG. 6), the rotational displacement between the shaft 43 of the wafer support column 42 and the column support 36 (FIG. 6). B) occurs, a sufficient clamping force is generated, and the increase in the repulsive force of the torsion spring 50 due to the rotational displacement of the wafer support column 42 has a value that does not affect the substrate clamping groove 48. , No excessive clamping force acts on the peripheral portion of the wafer 20.

After the required processing is performed on the wafer 20, the rotating plate 30 is rotated clockwise in FIG. The notch 38 engages with the engagement pin 35, and the support column 36 rotates in the opposite direction to the rotary plate 30, that is, in the counterclockwise direction in FIG. The wafer support column 4
Rotational displacement occurs between the second shaft portion 43 and the column support portion 36, and the wafer support column 42 is attached to the column support portion 3.
6 relative to the clockwise direction in FIG. The upper end of the stopper pin 41 is in contact with one end of the long hole 49, the wafer support column 42 rotates together with the column support section 36, and the substrate holding groove 48 holds the peripheral portion of the wafer 20 in a state where it is held. It is released.

The processed wafer 20 is mounted on the tweezers 19, and after the wafer supporting columns 42 have been lowered together with the rotary plate 30, the wafers 20 are carried out in the same manner as in the prior art.

In the above embodiment, the engaging pins 35 are provided on the rotating plate 30 side. However, the engaging pins 35 are provided on the support column 36 side, and the rotating plate 30 is provided. A cutout portion on which the engagement pin 35 can be disengaged may be provided on the 30 side.

Next, a second embodiment of the present invention will be described with reference to FIGS. 7 and 8, the same components as those in FIGS. 1 to 6 are denoted by the same reference numerals, and description thereof is omitted.

A disk-shaped rotating plate 52 is provided rotatably and vertically movable by a driving device (not shown).
One end of a link 53 is pivotally attached to the upper surface of the peripheral edge of the link 53.

On the outside of the rotary plate 52, a required number of column support portions 54 are provided vertically at equal intervals along the outer periphery of the rotary plate 52, and the column support portions 54 are rotatable about an axis. Also, it can be moved up and down together with the rotary plate 52 by the driving device (not shown). The support column 54
Has a shape in which a flange 55 is formed at the upper end of a cylinder, and the other end of the link 53 is pivotally mounted on the upper surface of the flange 55. A stopper pin 41 is implanted in the flange 55 in parallel with the axis of the flange 55, and the stopper pin 41 is loosely fitted in the long hole 49 of the wafer support column 42.

The operation will be described below. The operations of the torsion spring 50 and the stopper pin 41 are the same as those of the first embodiment, and the description is omitted.

After the wafer 20 is transferred from the tweezers 19 to the wafer mounting surface 47 of each wafer support column 42, the rotating plate 52 is rotated clockwise in FIG. The rotation of the rotary plate 52 is transmitted to the support column 54 via the link 53, and the support column 54 and the wafer support column 42 are in the same direction as the rotary plate 52, that is, clockwise in FIG. Rotate. The periphery of the wafer 20 is clamped by the substrate clamping groove 48, and the wafer 20 is supported and fixed by the wafer support columns 42.

After the required processing is performed on the wafer 20, the operation opposite to the above-described operation is performed, and the state in which the substrate holding groove 48 holds the peripheral portion of the wafer 20 is released, and the processed state is completed. The wafer 20 is unloaded to the outside in the same procedure as in the prior art.

Next, a third embodiment of the present invention will be described with reference to FIGS. In FIGS. 7 and 9, FIG.
The same components as those in the middle are denoted by the same reference numerals, and description thereof is omitted.

An annular internal gear 56 is provided rotatably and vertically movable by a driving device (not shown).

The internal gear 56 has a required number of support members 5.
7 are meshed at equal intervals, and the column supporting portion 57 is rotatable about an axis and can be moved up and down together with the internal gear 56 by the driving device (not shown). The column support portion 57 has a shape in which a flange portion 58 is formed at the upper end of a cylinder, and external teeth are formed on a peripheral wall of the flange portion 58. The flange 58 is provided with a stopper pin 4.
The stopper pin 41 is loosely fitted in the long hole 49 of the wafer support column 42.

Hereinafter, the operation will be described. The operations of the torsion spring 50 and the stopper pin 41 are the same as those of the first embodiment, and the description is omitted.

After the wafer 20 has been transferred from the tweezers 19 to the wafer mounting surface 47 of each wafer support column 42, the internal gear 56 is rotated clockwise in FIG.
The support column 57 and the support column 42 rotate in the same direction as the internal gear 56, that is, clockwise in FIG. The periphery of the wafer 20 is clamped by the substrate clamping groove 48, and the wafer 20 is supported and fixed by the wafer support columns 42.

After the required processing is performed on the wafer 20, the operation opposite to the above-described operation is performed, and the state in which the substrate holding groove 48 holds the peripheral portion of the wafer 20 is released, and the processed state is completed. The wafer 20 is unloaded to the outside in the same procedure as in the prior art.

In the first, second, and third embodiments, the support columns 36, 54, 57 and the wafer support column 42 are connected to each other via the torsion spring 50. However, the column supporting portion and the wafer supporting column may be formed as follows without providing the torsion spring 50.

Hereinafter, description will be made with reference to FIGS. It should be noted that the claw portions 29 and the engagement grooves 38 are not shown in the column support portion.

The column supporting portion 59 made of an elastic material has a flange portion 60, and a plurality of (eight in the drawing) supporting pieces 61 are formed radially on the inner peripheral wall side of the flange portion 60. The wafer support column 62 has an elongated cylindrical shape, and has a wafer holding portion 46 and a wafer mounting surface 47 at its upper end.
And a slit groove 63 is formed at the lower end of the support piece 61 so that the distal end of the support piece 61 is slidably fitted. The slit groove 63 is used to hold the wafer supporting column 62 when the peripheral portion of the wafer 20 is clamped by the wafer clamping portion 46.
Even when the rotational displacement generated between the support piece 59 and the support member 59 is maximized, the support piece 61 has such a depth that the support piece 61 does not come off.

The support piece 61 and the slit groove 63 are fitted to integrate the wafer support column 62 and the column support section 59, and the wafer support column 62 is rotated relative to the column support member 59. . The support column 59
When the rotational force from the rotary plate 30 acts on the wafer 20, the support pieces 61 bend, and the bending of the support pieces 61 generates a repulsive force.
Is held in the board holding groove 48 with a required force,
The wafer 20 is supported and fixed to each of the wafer support columns 62.

Incidentally, as shown in FIG. 12, the wafer support column 62 and the column support section 59 may be formed integrally.

In the first, second, and third embodiments, the upper end of the stopper pin 41 is connected to the flange 45.
, And the elongated holes 49 into which the stopper pins 41 can be loosely fitted may be formed in the flange portions 37, 55, 58.

Further, the elongated hole 49 may be another missing portion such as a groove.

Further, the column support portions 36, 54, 57
May be rotatably fitted to the wafer support column 42.

[0053]

As described above, according to the present invention, even when the outer diameter of the substrate varies within the tolerance, the substrate can be securely clamped by the required clamping force at the substrate clamping portion. Therefore, the transfer of the substrate inside the apparatus can be reliably performed, and the reliability of the entire apparatus can be improved. Further, the clamping force of the substrate is weak, a slip occurs between the substrate and the substrate support column, and particles are generated. On the contrary, the substrate is warped due to too strong clamping force of the substrate, and extra stress is applied to the film. Does not cause a film defect, and does not cause a watermark at the time of cleaning, thereby exhibiting various excellent effects such as improvement in yield and reduction in manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2 is a view taken along the line AA of FIG. 1;

FIG. 3 is a perspective view showing the embodiment.

FIG. 4 is a view taken in the direction of arrows BB in FIG. 2;

FIG. 5 is a cross-sectional view showing an operation in the embodiment.

FIG. 6 is a plan view showing a difference in a rotation angle of a wafer support column with respect to a variation in an outer diameter dimension of a wafer.

FIG. 7 is a perspective view showing a wafer transfer operation.

FIG. 8 is a perspective view showing a second embodiment of the present invention.

FIG. 9 is a perspective view showing a third embodiment of the present invention.

FIG. 10 is an assembly diagram in a case where support pieces are radially provided on a column support portion.

FIG. 11 is a plan view of the same.

FIG. 12 is a perspective view showing a case where a wafer supporting column and a column supporting section are integrally formed.

FIG. 13 is a plan view showing a conventional single-wafer CVD apparatus.

FIG. 14 is a plan view of the same.

FIG. 15 is a plan view showing an operation of supporting and fixing a wafer to wafer support pins.

FIG. 16 is an enlarged view of a main part of the same.

FIG. 17 is a side view showing a state where the wafer is supported and fixed on the wafer support pins.

FIG. 18 is a side view showing a state where a wafer having a small outer diameter is supported and fixed on a wafer support pin.

FIG. 19 is a side view showing a state where a wafer having a large outer diameter is supported and fixed to wafer support pins.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 20 Wafer 30 Rotating plate 35 Engagement pin 36 Post support part 38 Engagement groove 41 Stopper pin 42 Wafer support post 50 Torsion spring 52 Rotating plate 53 Link 54 Post support part 56 Internal gear 57 Post support part 59 Post support part 61 Support piece 62 Wafer support column

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masataka Fujishiro 3-14-20 Higashinakano, Nakano-ku, Tokyo Kokusai Electric Co., Ltd. (72) Inventor Akiyoshi Yamaoka 3-14-20 Higashinakano, Nakano-ku, Tokyo Kokusai Electric Inside (72) Inventor Hitoshi Oka 3-14-20 Higashinakano, Nakano-ku, Tokyo International Electric Co., Ltd. (72) Inventor Noriyuki 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside Hitachi, Ltd. (72) Inventor Yuichiro Tanaka 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa F-term in Hitachi, Ltd. F-term (reference) 5F031 CA02 GA02 GA43 HA23 HA80 MA04 MA28

Claims (1)

[Claims] 1. A plurality of substrate support columns capable of clamping a peripheral portion of a substrate by rotation, a column support portion rotatably provided to rotatably clamp the substrate support column, the column support portion and the substrate support. A semiconductor manufacturing apparatus comprising: a biasing means provided between a support and a biasing means for biasing the substrate support support in a clamping direction; and a rotating means for rotating the support support.