JP2000094296A - Heat exchanging device for wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat exchanging device for a wire saw in which the heat exchanging device can be miniaturized, and the occurrence of non-conformity is prevented wherein solid matters contained in working fluid clog together in the inside of a pipe for a working fluid cooling route. SOLUTION: In this heat exchanging device for a wire saw, a temperature detecting means 110 is provided in the inside of a working fluid tank 34, a temperature adjusting unit 10b is controlled in accordance with measured temperature obtained by the temperature detecting means 110, and a cooling pipe 102 through which heat medium is circulated between the temperature adjusting unit 106 and the working fluid tank 34, and a heating means 112, are set up in the inside of the working fluid tank 34. By this constitution, the occurrence of non-conformity can be prevented wherein solid matters contained in working fluid precipitate or stick in the inside of a pipe for a working fluid cooling route, and concurrently, the heat exchanging device for a wire saw can be made simple in structure. Even if solid matters contained in working fluid are of physical properties liable to precipitate or stick therein, however if it is the kind of working fluid suitable for working, it can be used for cutting and processing, and even if solid matters precipitate or stick therein, when precipitation and sticking take place in the inside of the working fluid tank, they can be cleaned with ease.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw heat exchanging apparatus, and more particularly to a wire saw heat exchanging apparatus for cutting a workpiece into a plurality of wafers by pressing the workpiece against a running row of wires.

[0002]

2. Description of the Related Art In a wire saw, a working fluid (slurry) used for cutting is collected and circulated and supplied. However, the working fluid absorbs heat during cutting and becomes high in temperature. After supplying to the apparatus and cooling the temperature of the working fluid to a predetermined temperature by the heat exchange device, the working fluid is circulated and supplied to the cutting section.

FIG. 5 shows a conventional working fluid circulation supply device and a conventional heat exchange device. The working fluid circulating supply device shown in FIG. 3 sends a working fluid 36 stored in a working fluid tank 34 to a nozzle 38 by a pump 44 under pressure, and is jetted through the nozzle 38. The injected working fluid is applied to the wire row 20 and the ingot 3
2 to the cutting section. Thereafter, the working fluid 36 used for cutting is collected in the working fluid tank 34 via an oil pan 40 installed below the wire row 20. At this time, the working fluid 36 absorbs heat generated during working and rises in temperature, so the working fluid 36 is supplied from the working fluid tank 34 to the heat exchange device 42 and cooled. After the working fluid 36 is cooled by the heat exchange device 42, the working fluid 36 is returned to the working fluid tank 34, the working fluid temperature in the tank is set to a predetermined temperature, and the working fluid is circulated.

[0004]

However, in the conventional wire-saw heat exchanging device 42, the flow paths of the pipes 6, 6,... There was a problem that solids such as abrasive grains and cutting powder contained in the working fluid settled or stuck and clogged. Therefore, conventionally, there was a restriction that only a type of machining fluid that hardly clogs the piping flow path with a solid material can be used for cutting.

The present invention has been made in view of such circumstances, and it is possible to prevent solids in a working fluid from settling or sticking to a pipe and to be clogged, and to provide a type of working suitable for working. It is an object of the present invention to provide a wire saw heat exchange device that can reduce the installation area of the heat exchange device in addition to being able to use liquid.

[0006]

According to one aspect of the present invention, there is provided a wire saw for cutting a workpiece into a plurality of wafers by pressing the workpiece against a row of wires running the workpiece. Provided, in a wire-saw heat exchange device for controlling the processing fluid supplied to the cutting portion of the workpiece to be collected and recovered at a predetermined temperature, the heat exchange device includes a cooling coil provided in a tank for the processing fluid. A temperature control unit configured to cool a heat medium flowing in the cooling coil outside the processing fluid tank; and a temperature detection unit provided in the processing fluid tank or the temperature control unit, and a measurement obtained from the temperature detection unit. A control means for controlling the temperature control unit according to a temperature value is provided.

According to the present invention, since the cooling coil through which the heat medium flows is provided inside the machining fluid tank, a device or a pipe for pumping the machining fluid to the heat exchange device is not required, and is included in the machining fluid. The problem that solid matter settles or sticks to the inside of the pipe and does not occur, and the structure of the heat exchange device for the wire saw is simplified, and the installation area of the heat exchange device for the wire saw can be reduced. In addition, it is possible to use a type of processing liquid which has been conventionally unusable, and in which solids tend to settle or stick, for cutting. In addition, a cooling coil, which is a means for cooling the machining fluid, is provided inside the machining fluid tank, so that a heat exchanger can be configured at low cost and the length of the cooling coil can be adjusted according to the specific heat and thermal conductivity of the machining fluid. Thus, an appropriate heat exchange area can be set.

According to another aspect of the present invention, there is provided a semiconductor device comprising:
The present invention is characterized in that a heating device (heater) is provided in a path of a heat medium connecting the cooling coil and a temperature control unit. According to the present invention, since the heating device is provided in the path of the heat medium connecting the cooling coil and the temperature control unit, the heating device is not required in the working fluid tank. This makes it possible to eliminate the seizure of the substance contained in the working fluid accumulated on the surface of the heating device.

According to another aspect of the present invention, the above object is achieved.
In the invention described in (1), the temperature of the heat medium is controlled to a constant temperature, and the temperature of the working fluid is controlled by changing the flow rate of the heat medium. According to the present invention, since the temperature of the working fluid is controlled by changing the flow rate of the heat medium controlled to a constant temperature, a heating device is not required in the working fluid tank, and the heating device surface It is possible to eliminate burn-in of the substance contained in the accumulated working fluid.

According to another aspect of the present invention, the above object is achieved.
The invention described in (1) is characterized in that a heating means is provided in the processing liquid tank. According to the present invention, since the heating means is provided in the processing liquid tank, it is possible to improve the responsiveness of temperature control of the processing liquid. In order to achieve the above object, an invention according to claim 5 is provided on a wire saw for cutting a workpiece into a large number of wafers by pressing the workpiece against a row of wires that travels, and a cutting section of the workpiece. In a heat exchange device of a wire saw for controlling a processing fluid supplied and recovered to a predetermined temperature, a Peltier element which is a heat absorber and a heat absorber is provided in a tank of the processing fluid.

According to the present invention, since the Peltier element is provided in the working fluid tank, a device or a pipe for pumping the working fluid to the heat exchanger is not required, and the solids contained in the working fluid settle or adhere. As a result, the problem of clogging the inside of the pipeline does not occur, and the structure of the heat exchange device for the wire saw is simplified, and the installation area of the heat exchange device for the wire saw can be reduced. In addition, even if the solids contained in the working fluid have properties that tend to settle or stick, they can be used as long as the working fluid is of a type suitable for machining. If it is, cleaning becomes easy.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a wire saw heat exchanger according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an overall configuration diagram of a wire saw 10 to which a heat exchange device for a wire saw according to the present invention is applied.

As shown in FIG. 1, a wire 14 wound around a wire reel 12 passes through a wire running path formed by guide rollers 16, 16,.
It is wound around 8A, 18B, 18C. A large number of grooves are formed at a constant pitch on the outer circumference of the three groove rollers 18A to 18C, and the wire 14 is sequentially wound around the grooves to form a horizontal wire row 20 on the upper surface. It is formed.

The wire 14 wound around the groove rollers 18A to 18C is connected to the groove rollers 18A to 18C.
The wire is wound on a wire reel on the other side (not shown) through a wire running path on the other side formed symmetrically with respect to C. Here, a motor (not shown) is connected to each of the pair of wire reels 12 and the groove roller 18C, and by driving these motors, the wire 14 travels between the pair of wire reels 12 at high speed. I do.

A wire guide device 22, a dancer roller 24, and a wire cleaning device 26 are provided on the wire running paths formed on both sides of the wire row 20 (only one side is shown). The wire guide device 22 is installed near both the wire reels 12, and on the payout side, the wire 14
Is guided so as to be unwound from the wire reel 12 at a constant pitch, and on the winding side, the wire 14 is guided to be wound around the wire reel 12 at a constant pitch. Further, the dancer roller 24 applies a certain tension to the traveling wire 14, and the wire cleaning device 26 removes the processing liquid attached during the processing from the wire 14.

Above the wire row 20, a wire row 2
A work feed table 28 that moves vertically with respect to 0 is installed. This work feed table 2
8, a tilting device 30 is provided, and an ingot 32, which is a workpiece, is held at a lower portion of the tilting device 30, and its tilt angle is adjusted. In the wire saw 10 configured as described above, the ingot 3
The cutting of No. 2 is performed as follows.

First, the ingot 32 is connected to the tilting device 3.
0, and the crystal orientation of the ingot 32 is
The ingot 32 is tilted so as to be parallel to the surface of. Then, the work feed table 28 is driven to lower the ingot 32, and the ingot 32 is pressed against the wire row 20 that runs at high speed. At this time, as shown in FIG. 2, the processing liquid 36 supplied from the processing liquid tank 34 is jetted through the nozzles 38, 38 to the wire row 20, and is supplied to the cutting portion of the ingot 32. The ingot 32 is cut into wafers by a lapping action of abrasive grains contained in the working fluid 36.

The supplied working fluid 36 is collected in the working fluid tank 34 via an oil pan 40 provided below the wire array 20. The collected working fluid 36 is recycled while replenishing the shortage. At this time, machining fluid 3
6 is heated by absorbing heat generated at the time of cutting processing, and the temperature is raised. Therefore, the cooling coil 102 as a heat exchange device is cooled in the working fluid tank 34 to a constant temperature in a range of, for example, 20 ° C. to 28 ° C. . The working fluid 36 cooled to a certain temperature is circulated again. In FIG. 2, reference numeral 44 denotes a pump for pumping the working liquid 36 to the nozzle 38.

FIG. 2 shows an embodiment of the first invention according to the present invention. FIG. 2 is a configuration diagram of a working fluid circulation supply device and a heat exchange device of the wire saw 10 to which the wire saw heat exchange device according to the present invention is applied, and is an example of a heat exchange device using a cooling coil. The heat medium in the cooling coil 102 is supplied to the cooling coil 102 and the temperature control unit 10 by the heat medium pump 100.
Circulating between six. The heat medium whose temperature has risen by absorbing heat in the cooling coil 102 is sent to the cooling coil 102 again after cooling and temperature adjustment in the temperature control unit 106. 108 is a wire saw control device. The wire saw controller 108 controls the cutting of the wire saw and also manages the temperature of the working fluid 36. The wire saw controller 108 reads the temperature of the working fluid 36 measured by the temperature sensor 110, and calculates a difference from a preset temperature stored and input in advance by a setting device such as a keyboard (not shown). If the temperature is higher than the set temperature, the wire saw controller 108 issues a command to the temperature control unit 106 to promote cooling, and outputs a command to the heat medium pump 100 to increase the flow rate. If the temperature is lower than the set temperature, the wire saw control device 108 issues a command to the cooling unit 106 to suppress the cooling and outputs a command to the heat medium pump 100 to reduce the flow rate. The heating liquid 112 is heated by the heating device 112 to enhance the responsiveness of temperature control of the processing liquid 36. Here, it is possible to control the temperature of the working fluid 36 by controlling the temperature of the heat medium. However, according to the present invention, the temperature of the heat medium is controlled to be constant, and the flow rate of the heat medium is controlled by a wire saw. It is also possible to control the temperature of the working fluid 36 by increasing or decreasing the heat medium pump 100 according to a command from the device 108. There is no problem when the temperature of the working fluid 36 measured by the temperature sensor 110 is controlled within a predetermined range, but when the temperature of the working fluid 36 deviates from a preset range due to some trouble, An abnormal state of the working fluid temperature is output as a warning to a display device (not shown) according to the temperature of the working fluid 36 to notify an operator. The working fluid 36 in the working fluid tank 34 has a stirring blade 1 in order to prevent the temperature and the solids in the working fluid 36 from becoming uneven depending on the location in the tank.
16 is constantly stirred. Reference numeral 114 denotes a motor for rotating the stirring blade.

As described above, in controlling the temperature of the working fluid 36, the temperature can be controlled without sending the working fluid 36 from the working fluid tank 34 to the heat exchange device as in the prior art. Since the solid matter in the processing liquid 36 does not settle or stick to the inside of the pipe inside the heat exchange device 42 or inside the pipe of the piping route to the heat exchange device 42, the cleaning becomes unnecessary. It is possible to use a working fluid of a type in which unusable solids are likely to settle or stick to the cutting process.

Further, by providing the cooling coil 102 as a means for cooling the working fluid 36 inside the working fluid tank 34 as described above, a heat exchanger can be constructed at a low cost, and the heat exchanger can be adapted to the specific heat and the thermal conductivity of the working fluid. Therefore, there is an advantage that an appropriate heat exchange area can be set by adjusting the length of the cooling coil. Further, by providing the heating device 112 inside the processing liquid tank 34 as described above, the response of the temperature control of the processing liquid 36 can be improved, and the accuracy of the temperature control can be further improved.

FIG. 3 shows a second embodiment of the present invention. FIG. 3 is a configuration diagram of a working fluid circulation supply device and a heat exchange device of the wire saw 10 to which the wire saw heat exchange device according to the present invention is applied, and a heating device is provided in a path of a heat medium used in the heat exchange device. It is an example. The present invention is configured in the same manner as the working fluid circulating supply device according to the first embodiment of the present invention, except for the heat exchange device, which is different from the cooling coil 102 inside the working fluid tank 34 provided in the first invention. In this example, a cooling jacket 104 is provided instead of the cooling jacket 104. Further, in this embodiment, the internal structure of the temperature control circulating device 107 is shown as an example different from that of the temperature control unit 106 according to the first embodiment of the present invention.

In the cooling jacket 104, the working fluid 36
The heat medium 130 that has absorbed the heat returns to the cooling tank 118 through the flow switch 132 for determining the flow rate. The cooling tank 118 includes a heating device 112 and a heat exchanger 124.
, A float switch 126 and a water level gauge 138. The heating device 112 is a device for increasing the temperature of the heat medium 130 when it is determined that the temperature of the heat medium 130 has dropped too much. In the example shown in FIG.
Although 2 is provided in the cooling tank 118, the object can be achieved even if it is provided in the working fluid tank 34. The heat exchanger 124 is a device for absorbing heat from the working fluid 36 to cool the heat medium 130 whose temperature has risen and to lower the temperature. The float switch 126 is a sensor for confirming that the water level of the heat medium in the cooling tank has not dropped. The water level gauge 138 is a gauge for confirming the water level of the heat medium. The heat medium cooled by the cooling unit 118 is a strainer 1 for removing foreign matter.
The fluid is pumped by a heat medium pump 100 to a cooling jacket 104 provided in the working fluid tank 34.
In order to protect the device by releasing the pressure when the internal pressure of the pipe of the heat medium flowing out of the temperature control circulating device 107 configured as described above abnormally rises due to some troubles such as clogging or breakage in the pipe. The relief valve 136 is provided in the temperature control circulation device 107. Cooling jacket 1
The working fluid 36 is cooled by the heat medium pumped to 04. The temperature of the working fluid is measured by the temperature sensor 110, and the measurement result is sent to the temperature controller 144, which is used to control the temperature of the working fluid 36.

The heat medium whose temperature has risen in the heat exchanger 124 is cooled in the cooling unit 120. Cooling unit 1
A pipe 150 connected to the cooling water passage 20 is a flow path for the cooling water, and includes a strainer 134 for removing foreign substances, a water control valve 140 for supplying and shutting off the cooling water when the cooling unit 120 is used and not used, and A flow switch 132 for determining the flow rate of the cooling water is connected. The temperature controller 144 is connected to the temperature sensor 110, the solid state relay 146, the heating device disconnection detector 148, and the temperature control circulating device control device 142 as a higher-level control device. Temperature controller 144
Outputs a signal for controlling the heating device 112 from the information of the temperature sensor 110 to the solid state relay 146 to prevent excessive cooling of the working fluid 36 and improve the responsiveness of the working fluid 36 to a set temperature. Working. The heating device disconnection detector 148 detects a current signal indicating whether a current is flowing through the heating device 112 and
In 44, the heating device is turned on for the solid state relay 146
Is output when the heating device disconnection detector 148 is output.
The current signal from the heater is constantly monitored, and the heater disconnection detector 1
If the current signal from 48 is interrupted, it is determined that the heating device is disconnected or a malfunction of the heating device circuit including the solid state relay 146 has occurred, and the heating device circuit malfunction signal is sent to the upper processing device. Output to the temperature control circulating device control device 142. The temperature control and circulating device control device 142 that has received the failure signal of the heating device circuit outputs the heating device circuit failure signal to the wire saw control device 109, which is a higher-order control device. Upon receiving the heating device circuit failure signal, the wire saw control device 109 stops the synchronization of the wire saw, displays a message corresponding to the heating device circuit failure on a display (not shown), and notifies the worker of the failure by displaying a warning. The flow rates of the cooling water and the heat medium are monitored by flow switches 132 provided in the respective pipelines. Flow switch 132
If the flow signal is interrupted, it is determined that the heat medium pump has failed or a problem such as clogging of the pipeline has occurred, and the cooling water flow problem signal or the heat medium flow problem signal is sent to the upper processing unit. A certain wire saw controller 109
Output to Wire saw control device 109 which receives the cooling water flow rate failure signal or the heat medium flow rate failure signal
Causes the wire saw to stop synchronously and displays a message corresponding to the cooling water flow rate defect or the heat medium flow rate defect on a display (not shown), and notifies the worker of the defect by indicating a warning. The temperature control circulation device control device 142 includes a water control valve 140, a temperature controller 144, and a cooling unit 12
0, a heat medium pump 100, a flow switch 132 for each of the heat medium and the cooling water, a cooling water control valve 140, and a float switch 126 provided in the cooling tank 118.
And a wire saw control device 109 as a higher-level control device.

Next, the operation of the temperature control circulation device 107 will be described. The temperature of the working fluid 36 is measured by a temperature sensor 110, and when the measured temperature is higher than a preset temperature of the working fluid, the cooling unit 120 is activated and the cooling unit 120 is supplied with necessary cooling water. A signal for opening the water control valve 140 is output to the water control valve 140, and the cooling water is supplied to the cooling unit 120. At the same time, the heat medium pump 100 is started to pump the heat medium to the cooling jacket 104. The heat of the working fluid 36 whose temperature has risen is transmitted to the heat medium in the cooling jacket 104 via the wall of the working fluid tank 34, and the temperature of the working fluid decreases. Conversely, when the temperature of the working fluid 36 is lower than a preset temperature of the working fluid, the cooling unit 120 is stopped, or the temperature controller 144 operates the heating device 112 or stops the heat medium pump 100. By stopping the pumping of the heat medium to the cooling jacket 104 or by combining these operations, the temperature of the working fluid 36 in the working fluid tank 34 rises and is kept near the set temperature. If the temperature of the working fluid 36 is significantly higher or lower than the set temperature due to a malfunction of the apparatus, the temperature controller 144 determines that the apparatus is abnormal and sends an apparatus abnormality signal to the higher-level processing apparatus. Output to the circulation device control device 142. The temperature control and circulation device control device 142 that has received the device abnormality signal outputs the device abnormality signal to the wire saw control device 109, which is a higher-level control device. Upon receiving the device abnormality signal, the wire saw control device 109 stops the synchronization of the wire saw, displays a message corresponding to the device abnormality on a display (not shown), and notifies the operator of the abnormality by displaying a warning.

As described above, according to the present invention, since the heating device 112 does not need to be installed in the working fluid tank 34, it is possible to prevent substances contained in the working fluid from adhering to the heating device 112 as solids. it can. If solid matter adheres to the periphery of the heating device 112, the heating characteristics of the heating device 112 may be deteriorated. However, as shown in the example of FIG.
Is not provided in the processing liquid tank 34, there is an advantage that solid matter does not adhere to the heating device 112, stable temperature control is always possible, and cleaning around the heating device 112 is unnecessary.

As described above, according to the present invention, the working fluid 36 does not need to be pumped to the temperature control unit 106 outside the working fluid tank 34, so that the piping inside the cooling unit 106 and the temperature control unit 106 can be controlled. Since the solids of the processing liquid 34 do not settle or stick in the middle of the pipe, the cleaning for removing the solids settled or fixed in the pipe part, which has been conventionally performed, becomes unnecessary. Further, compared with the method shown in the first embodiment of the present invention, the cooling coil 102 does not need to be installed in the machining fluid tank 34, so that the cooling coil 10
There is an advantage that the cleaning of 2 is unnecessary.

In the example shown in FIG.
Although the inside of 4 is formed as a cylindrical surface, the heat conduction area may be insufficient depending on the specific heat and thermal conductivity of the working fluid 36. In such a case, it is conceivable to provide a pleated projection like a heat sink in order to increase the contact area of the processing liquid tank 34 with the processing liquid 36. In general, the cooling unit 120 often causes a failure in a refrigerant compression pump when cooling is performed intermittently. According to the above-described example, the cooling capacity of the cooling unit 120 is kept almost constant, and the delicate temperature control is performed by controlling the temperature by the heating device 112 provided in the cooling tank 118 so that the working fluid is not burdened on the cooling unit. 36 temperature controls are possible.

FIG. 4 shows a third embodiment of the present invention. FIG. 4 is a configuration diagram of a working fluid circulating supply device and a heat exchange device of the wire saw 10 to which the wire saw heat exchange device according to the present invention is applied, and illustrates a heat exchange device using a Peltier element that is a heat generating and heat absorber. An example is shown. The present invention is configured in the same manner as the working fluid circulating supply device of the first embodiment of the present invention, except that the heat exchange device is different from that of the temperature control unit 106 and the cooling coil 102 provided in the first invention. In this example, the Peltier element 122 is provided instead. FIG. 4 shows an example in which the Peltier element 122 is provided outside the processing liquid tank 34, but the Peltier element 122 may be installed inside the processing liquid tank 34. A temperature sensor 110 installed in the working fluid tank 34 is connected to the wire saw controller 111 and measures the temperature of the working fluid 36. The Peltier device 122 is also connected to the wire saw control device 111, and controls heat generation and heat absorption according to the measured temperature of the working fluid.

Next, an operation example of the third invention will be described. When the wire saw control device 111 determines that the temperature measured by the temperature sensor 110 is higher than the preset temperature of the working fluid 36, it outputs a command to cool the inside of the working fluid tank 34 to the Peltier element 122. . The heat of the working fluid 36 determined to have risen in temperature is transmitted to the Peltier element 122 via the wall of the working fluid tank 34, and the temperature of the working fluid decreases. If the wire saw controller 111 determines that the temperature measured by the temperature sensor 110 is lower than the preset temperature of the working fluid, the working fluid tank 3
4 is output to the Peltier device 122. Heat from the Peltier element 122 is transmitted to the working fluid 36 via the wall of the working fluid tank 34, and the temperature of the working fluid rises.

As described in the second embodiment of the present invention, it is conceivable to provide a pleat-like projection such as a heat sink in the working fluid tank 34 in order to increase the heat conduction area.

[0032]

As described above, according to the wire saw heat exchanging apparatus according to the present invention, since the cooling coil through which the heat medium flows is provided inside the working fluid tank, the working fluid is pumped to the heat exchanging apparatus. This eliminates the need for equipment and pipes, prevents solids contained in the working fluid from settling or sticking, and prevents the pipes from becoming clogged inside the pipes. It is possible to reduce the installation area of the device. In addition,
It is possible to use a type of processing liquid which has been conventionally unusable, and in which solids tend to settle or stick, for cutting. In addition, a cooling coil, which is a means for cooling the machining fluid, is provided inside the machining fluid tank, so that a heat exchanger can be configured at low cost and the length of the cooling coil can be adjusted according to the specific heat and thermal conductivity of the machining fluid. Thus, an appropriate heat exchange area can be set.

According to another embodiment of the present invention, the heating device is provided in the path of the heat medium connecting the cooling coil and the temperature control unit, so that the cooling capacity of the cooling unit can be maintained substantially constant while the cooling capacity of the cooling unit is kept substantially constant. Subtle temperature control is possible, and the burden of the cooling unit performing intermittent control is not required. According to another aspect of the invention, in the cooling heat exchange device, the temperature of the working fluid is controlled by changing the flow rate of the heat medium controlled to a constant temperature.
Since a heating device is not required in the processing liquid tank, a processing liquid containing a component that is easily seized and accumulated on the surface of the heating device can be used.

According to another embodiment of the present invention, the provision of the heating means in the working fluid tank improves the response of the working fluid temperature control, thereby further improving the accuracy of the temperature control. According to another aspect of the present invention, since a Peltier element is provided in the tank for the working fluid, a device or a pipe for pumping the working fluid to the heat exchange device is not required, and solids contained in the working fluid may be settled or removed. The problem that the wire saw does not stick to the inside of the pipeline does not occur, and the structure of the heat exchange device for the wire saw is simplified, and the installation area of the heat exchange device for the wire saw can be reduced. In addition, even if the solids contained in the working fluid have properties that tend to settle or stick, they can be used as long as the working fluid is of a type suitable for machining. If it is, cleaning becomes easy.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of a wire saw.

FIG. 2 is a view showing a heat exchange device provided with a cooling coil in a working fluid tank according to the present invention.

FIG. 3 is a diagram showing an example in which a heating device is provided in a path of a heat medium used in the heat exchange device according to the present invention.

FIG. 4 is a view showing a heat exchange device provided with a Peltier element in a working fluid tank according to the present invention.

FIG. 5 is a diagram showing a conventional wire saw heat exchange device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Wire saw 14 ... Wire 18 ... Groove roller 20 ... Wire row 32 ... Ingot 34 ... Working fluid tank 36 ... Working fluid 102 ... Cooling coil 106 ... Temperature control unit 107 ... Temperature control circulation device 108 ... Wire saw control device 112 ... Heating device 120: Cooling unit 122: Peltier element 142: Temperature control and circulation device control device

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 3C047 FF09 FF11 GG13 GG18 3C058 AA05 AA07 AA14 AB03 AB04 AC01 AC04 BA08 BC03 CA01 CB05 DA03 3C069 AA01 BA06 BB01 CA04 CB02 DA06 EA03

Claims (5)

[Claims] An object of the present invention is provided on a wire saw for cutting a workpiece into a plurality of wafers by pressing the workpiece against a traveling wire row, and supplying a processing fluid supplied to a cutting portion of the workpiece and collected. In a wire-saw heat exchange device that controls the temperature, the heat exchange device includes a cooling coil provided in the machining liquid tank and a temperature control unit that cools a heat medium flowing in the cooling coil outside the machining liquid tank. A wire saw, wherein a temperature detecting means is provided in the working fluid tank or the temperature control unit, and control means for controlling the temperature control unit in accordance with a measured temperature value obtained from the temperature detecting means is provided. Heat exchange equipment. 2. The wire saw heat exchange device according to claim 1, wherein a heating device is provided in a path of a heat medium connecting the cooling coil and the temperature control unit. 3. The heat exchange device for a wire saw according to claim 1, wherein the temperature of the heat medium is controlled to be constant, and the temperature of the working fluid is controlled by changing the flow rate of the heat medium. 4. The wire saw heat exchanging apparatus according to claim 1, wherein a heating means is provided in the processing liquid tank. 5. A processing apparatus provided on a wire saw for cutting a workpiece into a large number of wafers by pressing the workpiece against a traveling wire row and supplying a processing fluid supplied to a cutting portion of the workpiece and collected. A wire-saw heat exchange device for controlling the temperature of a wire-saw, wherein a Peltier element is provided in a processing liquid tank.