JP2000091380A - Flip-chip mounting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flip-chip mounting structure with which a wiring substrate and a flip chip can be positioned easily, positional deviation is hardly generated until bump junction process is completed, and the replacement and repair of the flip-chip can be performed easily. SOLUTION: Holes 16, which penetrate a conductor pad 15 and an insulating layer on the top surface of a multilayer wiring substrate 12 having the conductor pad 15, are provided on the conductor pad part 15 of the multilayer wiring substrate 12 where a flip chip is mounted, the bump of a flip chip 11 is press fitted into the holes 16, and the flip chip 11 is mounted on the multilayer wiring substrate 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding structure between a semiconductor bare chip and a substrate constituting an electronic circuit or an electronic component.

[0002]

2. Description of the Related Art A semiconductor bare chip is an active element formed by dividing a semiconductor wafer on which a desired circuit is formed. However, since the semiconductor wafer is originally a thin semiconductor plate, the shape of the semiconductor bare chip is a thin rectangular parallelepiped. In many cases, an electrode as an external interface is also formed planarly on one surface of the rectangular parallelepiped. In order for the semiconductor bare chip to function as one electronic component, an electrode formed two-dimensionally on the surface of the semiconductor bare chip must be connected to an external electrode such as a wiring board by some method.
As a method of connecting to the outside, a wire bond method is used in which one end of a fine metal wire is joined to a planar electrode formed on a semiconductor bare chip, and the opposite end is joined to an electrode such as an external wiring board. And a flip chip method in which a bump is attached to a planar electrode of a semiconductor bare chip and the bump is joined to an electrode such as an external wiring board. The bump is a word meaning a protruding shape, and is a connection terminal that protrudes slightly, unlike a connection terminal that is extended like a lead.

The wire bonding method is also called face-up mounting because the semiconductor bare chip is attached to the wiring board in a direction in which the surface of the semiconductor bare chip on which the circuits and electrodes are formed can be viewed. The flip chip method forms the circuit and electrodes. This is called face-down mounting because the surface on which it is mounted faces the wiring board, or bump mounting using bumps. The wire bonding method requires a large occupation area larger than the occupation area of the semiconductor bare chip itself because wires are stretched around the semiconductor bare chip,
On the other hand, in the case of the flip chip method, although the electrodes of the semiconductor bare chip are interposed via the bumps, no special area is required for connection between the semiconductor bare chip and the electrodes of the wiring board, and the area required for mounting is the semiconductor bare chip. Equal to its own footprint. Therefore, the flip-chip method is the most suitable method for minimizing the occupation area required for mounting the semiconductor bare chip to achieve high-density mounting and miniaturization of electronic equipment.

Conventionally, semiconductor bare chips are individually housed in a package, and leads and terminals derived from the package are connected to electrodes of a wiring board. High-density mounting has been promoted by arranging the arranged semiconductor parts at high density and miniaturizing the package,
As the number of pins and the pitch of semiconductors have increased, the number of pins and the pitch of the package leads have reached the limit, and the existence of the package has become an obstacle to high-density mounting.
Therefore, in order to achieve high-density mounting, a method of directly mounting a semiconductor bare chip having no external package on a wiring board has to be adopted, and various flip-chip mountings have been proposed.

A bump-shaped electrode is generally called a bump regardless of its shape or material, and various materials such as gold, solders, and copper are available. There are also many types of bonding methods between the bumps and the external wiring board circuit, but they can be roughly classified into two types, a soldering method and an adhesive method. In the case of the soldering method, the bumps themselves are formed by soldering. These solder bumps are classified into those that are melted and joined, and those that are soldered by adding a solder material using solderable metal bumps.
The bonding method is classified into a method in which an adhesive is used only for the bump portion and a method in which the bump forming surface of the flip chip is collectively bonded using an anisotropic conductive film.

In a packaged semiconductor component, since the semiconductor bare chip is sufficiently protected by the package, it is possible to perform various tests by itself to determine the quality of the component alone and to mount the component on a wiring board. Since the inspection can be performed before, if any cause of defect is found, the whole package may be discarded. However, flip-chips are bare semiconductor bare chips without any protection, so it is extremely difficult to perform a unit test.After mounting a circuit on a wiring board and configuring the circuit, it is only possible to test it as a comprehensive function of the circuit. In many cases, the quality of flip chips is determined. If a defective flip chip is found in this way, it is too wasteful to discard the entire circuit board, so that the defective flip chip must be replaced. However, in the case of the soldering method, it is possible to remove the flip chip by re-melting the solder, but in general, multiple flip chips and many other components are soldered to the wiring board, so the solder is partially removed In addition to the fact that it is difficult to perform repair and replacement by melting the Flip Chip, it is particularly difficult to partially heat the flip chip because the soldered portion is between the semiconductor bare chip, which is the main body of the Flip Chip, and the wiring board. In the case of the bonding method, it is often possible to remove the flip chip, but it is often difficult to completely remove the adhesive from the substrate surface without damaging the substrate itself. Some adhesives cannot be removed depending on the type of adhesive, in which case the entire wiring board must be discarded.

A conventional flip chip mounting structure will be described with reference to the drawings. FIG. 14 shows an example of a conventional flip chip mounting structure, in which a metal bump which does not melt at a temperature around the soldering temperature of a spherical or barrel shape is used as a bump, and the bonding between the wiring board and the flip chip is performed by soldering or bonding. It is sectional drawing at the time of using an agent. FIG. 15 is a top view of the one shown in FIG. In the figure, reference numeral 1 denotes a semiconductor bare chip, 2 denotes an electrode formed on the semiconductor bare chip 1 in a plane, and 3 denotes a spherical or barrel-shaped metal bump attached to the electrode 2 and is indicated by 1 to 3 and is a flip. A chip 4 is configured. The metal bump 3 may be either a case where the constituent metal itself is a conductive material or a case where a coating for enhancing conductivity is applied. The shape of the metal bump 3 varies depending on the method of forming the bump and the mounting process of the flip chip 4, but is generally a shape close to a sphere or a barrel.

Reference numeral 5 denotes a general resin-made multilayer wiring board, which is a two-layer board composed of two insulating layers 6 in the case of the illustrated example. A conductive pad 7 to which the bump 3 is bonded is provided at a surface position corresponding to the spherical bump 3.
Are connected to a wiring pattern 8 formed on the surface or inside of the multilayer wiring board 5. Reference numeral 9 denotes a joining material,
It is a solder or an adhesive and is a material for electrically and mechanically joining and fixing the metal bumps 3 and the conductor pads 7. When the bonding material 9 is solder, a method of applying paste solder to the conductive pad 7 or a method of applying the metal bump 3
A solder material is supplied in advance by a method of applying a solder plating or a solder coating to the substrate, the metal bumps 3 are aligned with the positions of the conductor pads 7, and the flip chip 4 is mounted on the multilayer wiring board 5. 5 is heated to reflow solder the metal bumps 3 and the conductor pads 7.

When the bonding material 9 is a conductive adhesive, a conductive adhesive is applied to the conductive pad 7 in advance, and the conductive pad 7 is
The flip chip 4 is mounted on the multilayer wiring board 5 by aligning the metal bumps 3 at the position of the multilayer wiring board 5, and the entire multilayer wiring board 5 is exposed to the curing environment of the conductive adhesive used to apply the conductive adhesive. Let it cure.

In this embodiment, the wiring board 5 is a multilayer wiring board having a two-layer structure in which two insulating layers 6 are laminated. There is no difference in the mounting structure.

[0011]

As described above, in the conventional flip-chip mounting structure, the metal bumps 3 must be placed on the conductor pads 7 formed on the surface of the multilayer wiring board 5, but FIG. When the conductor pad 7 is hidden in the semiconductor bare chip 1 when viewed in a plan view as shown in FIG. 2, the metal bump 3 is on the back side of the semiconductor bare chip 1 and the alignment target is not visible. The metal bumps 3 are likely to be misaligned with the bumps 3, and are joined at positions where the metal bumps 3 slip down between the adjacent conductor pads 7 as shown in the cross-sectional view of FIG. In some cases, it may occur. When the flip chip 4 is mounted on the wiring board 5, even if the positions of the conductive pads 7 and the metal bumps 3 match, the bonding material 9
However, there is a problem that the vibration may occur during the transfer to the reflow step or the curing step, or the displacement may occur during the joining step.

In addition, if a positional deviation occurs in either the mounting step of the flip chip 4 or the subsequent bonding step, it is located in a hidden part except for an extreme deviation, so that it is located by a visual inspection. There is a problem that it is impossible to see the degree.

As described above, when replacing a defective flip chip, in the case of a soldering method, it is possible to remove the flip chip by re-melting the solder. And many other components are soldered, so it is difficult to partially replace the solder to perform replacement and repair. In the case of the bonding method, it is often possible to remove the flip chip, but it is often difficult to completely remove the adhesive from the substrate surface without damaging the substrate itself. Some types of adhesives cannot be removed, and in that case, there is a problem that the entire wiring board must be discarded.

As a conventional example, a case where a metal bump which does not melt at a temperature around the soldering temperature is used has been described. However, the material itself forming the metal bump is solder, and the metal bump itself is melted. The above problems are all the same even in the case of the solder bump method used as a joining material.

According to the present invention, in the flip chip mounting process, the positioning between the wiring board and the flip chip is easy, the position is hardly shifted by the time the bump bonding process is completed, and the flip chip can be easily replaced and repaired. It is an object of the present invention to provide a flip-chip mounting structure.

[0016]

According to a first aspect of the present invention, there is provided a flip chip mounting structure in which a spherical or barrel-shaped bump is mounted on a conductor pad portion of a multilayer wiring board to which a flip chip bump is mounted. Drill a vertical hole in the shape, push the flip chip bump into this hole to fix the flip chip to the multilayer wiring board, and at this time, the flip chip and the multilayer wiring board are connected by the contact between the bump and the conductive pad of the wiring board. It is designed to be electrically connected.

In the flip chip mounting structure according to the second invention, the bump of the first invention is formed of a hard metal material.

Further, in the flip chip mounting structure according to the third aspect of the present invention, the hole of the conductive pad portion of the multilayer wiring board into which the bump is pushed in the first and second aspects of the present invention is formed into a large cone diverging toward the inside of the multilayer wiring board. It is provided in a shape or a pyramid shape.

In the flip chip mounting structure according to the fourth invention, only the outermost surface layer of the multilayer wiring board on which the conductive pads are formed according to the first, second and third inventions is made of an insulating material having high elasticity. It is formed by using.

Further, in the flip chip mounting structure according to the fifth invention, the bump of the flip chip is formed of a soft metal material that is relatively easily deformed in the first invention.

The flip chip mounting structure according to a sixth aspect of the present invention is the flip chip mounting structure according to the first to fourth aspects, wherein the flip chip bumps are formed using an insulating material having high elasticity, and a conductive coating is applied to the surface. It was done.

In the flip chip mounting structure according to a seventh aspect of the present invention, in the first to fourth aspects, the flip chip bump is formed using a highly elastic insulating material kneaded with a conductive filler. Things.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a cross-sectional view showing a first embodiment of the present invention, and FIG. 2 is an enlarged view of a bump connection portion shown in FIG. 1. In the drawings, 1 and 2 are the same as or equivalent to those shown in the conventional example. Is what you do. 1
Numeral 0 denotes a soft metal bump formed of a soft metal which is not easily deformed and has a spherical or barrel shape as in the case of the conventional example.
1 is configured. Metal materials used as bump materials include gold, solder, copper, and iron-based metals. Gold and solder are soft, and copper and iron-based metals are classified as hard. Reference numeral 12 denotes a multilayer wiring board in which a two-layer structure is used as an example. The material is the same as that used for a general resin multilayer wiring board, such as glass epoxy or polyimide. The multilayer wiring board 12 includes a first insulating layer 13 and a second insulating layer 1.
The conductor pad 15 is provided on the surface of the first insulating layer 13 in accordance with the position of the hard metal bump 10 similarly to the conductor pad of the conventional example.

The conductor pad 15 has an elliptical or rectangular shape as shown in the plan view of the conductor pad portion in FIG. 3 and not only the metal layer constituting the conductor pad 15 as shown in FIG. A vertical bump insertion hole 16 is provided which penetrates vertically to the first insulating layer 13 constituting the substrate 12. As shown in FIG. 3, the dimension of the vertical type bump insertion hole 16 is such that when the hole shape is an elliptical shape, the minor diameter is slightly smaller than the maximum diameter of the hard metal bump 10, and when the hole shape is a rectangular shape. The dimension of each side is slightly smaller than the maximum diameter of the hard metal bump 10. The vertical bump insertion hole 16 and the conductive pad 15 are provided in the first insulating layer 13 in the same number as the number of the hard metal bumps 10 attached to the flip chip 11 in accordance with their positions. The flip chip 11 is placed on the multilayer wiring board 12 in alignment with the position of the hard metal bump 10, and the flip chip 11
When pressing force is applied from the back side of each of the vertical bump insertion holes 1
6, the soft metal bump 3 is pressed into the flip chip 1.
1 is fixed to the multilayer wiring board 12.

The material forming the first insulating layer 13 in which the vertical bump insertion holes 16 are formed is the same as the resin material forming a general multilayer wiring board, and is not necessarily high in elasticity. When the metal bump 10 is pushed, the metal bump 10 is slightly deformed as shown in FIG. 2, and the metal bump 10 can be pressed into the vertical bump insertion hole 16. Since the vertical bump insertion hole 16 is expanded by the hard metal bump 10, a contraction stress that tends to return to the original state is generated, so that the hard metal bump 10 is securely fixed to the vertical bump insertion hole 16. On the other hand, the hard metal bump 10 is in close contact with the side wall of the vertical bump insertion hole 16 so that the vertical bump insertion hole 16
The end face of the conductor pad 15 exposed to the edge and the hard metal bump 1
0 is placed in a pressure contact state, and the flip chip 11 is also electrically connected to the multilayer wiring board 12.

Here, a multi-layer wiring board having a two-layer structure has been described as an example of the wiring board. However, the mounting of the flip chip is not limited to the two-layer structure and may be a multilayer structure as long as the structure of the first insulating layer 13 is the same. There is no difference in structure.

Embodiment 2 FIG. FIG. 4 is a cross-sectional view showing a second embodiment of the present invention, and FIG. 5 is an enlarged view of a bump connection portion shown in FIG. 4, and 1, 2, 10 to 16 are the same as those shown in the first embodiment. They are the same. Reference numeral 17 denotes a cone-shaped bump insertion hole, and the opening shape and the opening size in the conductive pad 15 are the same as those of the vertical bump insertion hole 1 shown in the first embodiment.
6 is equal to the opening shape and the opening size of the multilayer wiring board 12
The dimension of the hole penetrating the first insulating layer 13 is formed so as to widen from the conductive pad 15 toward the second insulating layer 14. Therefore, if the opening shape in the conductor pad 15 is elliptical, the three-dimensional shape of the cone-shaped bump insertion hole 17 is an elliptical cone, and if the opening shape in the conductor pad 15 is rectangular, the cone-shaped bump insertion hole 17 is formed. Since the three-dimensional shape is a pyramid, it is generically called a cone-shaped bump insertion hole.

The position where the cone-shaped bump insertion hole 17 is provided is the same as that of the first embodiment,
The step of attaching the flip chip 11 to the hole is exactly the same as that of the first embodiment. However, since the hole diameter of the cone-shaped bump insertion hole 17 is larger inside, the hard metal bump 10 is inserted into the cone-shaped bump insertion hole 17. When pushed in, only the opening of the cone-shaped bump insertion hole 17 needs to be deformed by the hard metal bump 10, and the flip chip 1
The pressure required for mounting 1 is small. Further, since the opening size of the cone-shaped bump insertion hole 17 is smaller than that of the inside, after the hard metal bump 10 is pushed into the cone-shaped bump insertion hole 17, the hard metal bump 10 is difficult to be removed from the cone-shaped bump insertion hole 17. It is.

Embodiment 3 6 and 7 are sectional views showing a third embodiment of the present invention. The structure shown in FIG. 6 is the same as FIG. 1 shown in the first embodiment, and the structure shown in FIG. It is the same as FIG. 4 shown. Reference numeral 18 denotes a multilayer wiring board, which is replaced with a first elastic insulating layer 19 formed of a material having higher elasticity than the material forming the first insulating layer 13 in FIGS. Substrate 1
8 is the same as that of the first embodiment.
Or, it is completely the same as the case of the second embodiment. Therefore, the first elastic insulating layer 19 has higher elasticity than the second insulating layer 14. The high elasticity means that it is easily deformed, and the pressure required for pushing the soft metal bump into the vertical bump insertion hole 16 or the cone-shaped bump insertion hole 17 can be reduced. Further, the first elastic insulating layer 19 is easily deformed, but the second insulating layer 14 is
, The entire multilayer wiring board 18 is not easily distorted.

Embodiment 4 8 and 9 are cross-sectional views showing a fourth embodiment of the present invention. The structure shown in FIG. 8 is the same as FIG. 1 shown in the first embodiment, and the structure shown in FIG. It is the same as FIG. 4 shown. Reference numeral 20 denotes a soft metal bump made of a relatively soft soft metal such as gold or solder, and has a spherical or barrel shape as in the case of the hard metal bump 10 described in the first to third embodiments. . A flip chip 21 is constituted by the soft metal bump 20, the semiconductor bare chip 1 and the electrode 2. The process of attaching the flip chip 21 to the multilayer wiring board 12 is exactly the same as that of the first to third embodiments, and the flip chip 21 is inserted into the vertical bump insertion hole 16 or the cone-shaped bump insertion hole 17 of the multilayer wiring board 12. The flip chip 21 is fixed to the multilayer wiring board 12 by pushing the soft metal bump 20. However, since the soft metal bump 20 is relatively soft, the flip chip 21 is pushed into the vertical bump insertion hole 16 or the cone-shaped bump insertion hole 17. The deformation stress applied to the opening is reduced, and the soft metal bump 20 itself is slightly deformed, so that the area of the vertical bump insertion hole 16 or the cone-shaped bump insertion hole 17 in contact with the side wall inside the hole is increased.

Here, the case where the multilayer wiring board is the multilayer wiring board 12 of the two-layer structure made of the same insulating material shown in the first and second embodiments has been described.
The use of the multilayer wiring board 18 having the first elastic insulating layer 19 as the surface layer described above does not cause any problem.

Embodiment 5 10 and 11 are sectional views showing a fifth embodiment of the present invention. The structure shown in FIG. 10 is the same as that shown in FIG. 1 shown in the first embodiment.
Is the same as that shown in FIG. 4 shown in the second embodiment, but reference numeral 22 denotes a conductive coating bump, and a flip chip 23 is formed by the semiconductor bare chip 1, the electrode 2, and the conductive coating bump 22. . FIG. 12 shows the conductive coating bump 22.
24 is a cross-sectional view showing the structure of FIG.
An elastic resin 25 serving as a core of 2 and a conductive coating 25 covering the entire periphery of the elastic resin 24. The elastic resin 24 is made of a resin material having a desired elasticity.
As in the case of the hard metal bump 10 described above, the conductive coating 25 is formed in a spherical or barrel shape, and the conductive coating 25 is formed by plating or other methods to form a conductive thin film.

The process of attaching the flip chip 23 to the multilayer wiring board 12 is exactly the same as that of the first to third embodiments, and the vertical bump insertion hole 16 or the cone-shaped bump insertion hole of the multilayer wiring board 12 is used. 17, the flip chip 23 is fixed to the multilayer wiring board 12 by pressing the conductive coating bumps 22. However, the conductive coating bumps 22 are pressed into the vertical bump insertion holes 16 or the cone type bump insertion holes 17 because of their high elasticity. When the conductive coating bump 2
When the vertical bump insertion hole 16 enters the hole of the vertical bump insertion hole 16 or the conical bump 17, the restoring stress acts on the hole 2. The area in contact with the side wall increases. Further, in the case of the cone-shaped bump insertion hole 17, since the hole diameter becomes larger toward the inside, the conductive coating bump 22 is restored to the original shape. Although the elastic resin 24 is a polymer material and thus has no conductivity, a conductive coating 25 is formed, and the contact between the conductive pad 15 and the conductive coating 25 causes the flip chip 23 and the multilayer wiring board 12 to be in contact with each other. It is also electrically connected.

Here, a case has been described where the multilayer wiring board is a multilayer wiring board 12 having a two-layer structure made of the same insulating material shown in the first and second embodiments.
The use of the multilayer wiring board 18 having the first elastic insulating layer 19 as the surface layer described above does not cause any problem.

Embodiment 6 FIG. FIG. 13 is a cross-sectional view showing Embodiment 6 of the present invention, and shows conductive elastic bumps 26. The conductive elastic bump 26 is obtained by mixing a fine metal powder as a conductive filler 27 into an elastic resin 24 having high elasticity. The elastic resin 24 itself has high elasticity, so that it is easily deformed and deformed when a force is applied. If so, a restoring stress is generated to restore the original shape, and the mechanical action when pushed into the vertical bump insertion hole 16 or the conical bump insertion hole 17 is the same as that in the fifth embodiment. At the same time, since the conductive filler 27 imparts conductivity to the entire conductive elastic bump 26, the conductive filler 27 contacts the conductive pad 15 and is electrically connected.

[0036]

According to the first and second aspects of the present invention, the bump insertion hole is provided in the conductor pad portion of the multilayer wiring board for mounting the flip chip bump when mounting the flip chip on the multilayer wiring board. The position where the flip chip is mounted is uniquely determined, and the position where the flip chip is mounted before mounting does not deviate from the mounting completed position.

In the flip chip, the bumps are pushed into the bump insertion holes of the multilayer wiring board, the bumps are fixed by the shrinkage stress of the multilayer wiring board, and the bumps are electrically connected to the conductor pads of the multilayer wiring board. Therefore, a joining material such as a solder or an adhesive for joining the bump and the conductor pad is not required. Therefore, the reliability of the flip chip is improved because it is not exposed to the soldering or the curing environment of the adhesive. Further, since no joining material such as solder or adhesive is used, if a defect is found in the flip chip, it can be easily replaced and repaired. When replacing and repairing the flip chip, there is no need to remove the bonding material and newly supply the same, and there is an effect that the multilayer wiring board is not damaged by removing the bonding material.

According to the third aspect of the present invention, since the bump insertion hole is formed in a conical shape so that the diameter increases as it diverges, the volume of the bump insertion hole that must be deformed when the bump is pushed into the bump insertion hole. Therefore, the pressing force can be reduced, so that an excessive force is not applied to the flip chip, and at the same time, the bump is pulled out from the bump insertion hole with a relatively small pulling force, so that the flip chip can be easily removed. In addition, since the fixing of the bump in the bump insertion hole is fixed by the anchor effect of the cone-shaped bump insertion hole rather than the deformation shrinkage stress of the multilayer wiring board, the residual stress around the bump insertion hole after the bump is pushed into the bump insertion hole. There is an effect that can be suppressed.

According to the fourth aspect of the present invention, the surface layer for forming the bump insertion hole of the insulating material constituting the multilayer wiring board is formed of an elastic material, so that the bump insertion hole also has elasticity. Then, it becomes very easy to push the bump into the bump insertion hole. Also, it is easy to pull out the bumps at the same time, so it is possible to remove the flip chip from the multilayer wiring board without damaging the flip chip and the bump, and the multilayer wiring board and the bump insertion hole constitute a socket that can insert and remove the flip chip There is also an effect that it can be performed.

According to the fifth aspect, since the bumps are formed of a soft metal, when the bumps are pressed into the bump insertion holes in the first and second aspects, the bumps themselves also have the diameter and shape of the bump insertion holes. Therefore, the pressing force applied to the flip chip can be reduced, and at the same time, the contact area between the bump and the bump insertion hole increases, so that the reliability of the fixing and the electrical connection is improved.

When the bump is pressed into the bump insertion hole in the third and fourth aspects of the present invention, the pressing force originally required for the insertion of the bump is small, so that no deformation occurs even with a soft metal bump. There is an effect that it can be used similarly to the soft metal bump used in the first invention.

According to the sixth aspect of the present invention, the bump is formed of a resilient material and is covered with a conductive material. Therefore, when the bump is pushed into the bump insertion hole of the first or second aspect of the invention, the bump is formed. Is deformed according to the shape of the bump insertion hole.After insertion, the elasticity of the bump tries to return to the original shape. Therefore, it is electrically connected to the multilayer wiring board. In addition, since the bumps have elasticity, pulling out is very easy, and there is an effect that an unreasonable force is not applied to the bump insertion hole portion or the flip chip.

When the bump is inserted into or removed from the bump insertion hole according to the fourth aspect of the present invention, since both the bump and the bump insertion hole are deformed by elasticity, the force required for insertion and removal can be extremely reduced. There is.

According to the seventh aspect of the present invention, the bumps are formed of a resilient material, and since the resilient material is mixed with a conductive filler, the entire bump has conductivity. Without losing conductivity even for the amount of deformation,
Even if the surface of the bump is damaged, the conductivity of the entire bump is not affected, so that the bump has the same effect as that of the sixth invention and has the effect of being able to withstand applications where the frequency of insertion and removal is high.

[Brief description of the drawings]

FIG. 1 is a diagram showing Embodiment 1 of a flip chip mounting structure according to the present invention.

FIG. 2 is a view showing a first embodiment of a flip chip mounting structure according to the present invention;

FIG. 3 is a view showing a first embodiment of a flip chip mounting structure according to the present invention;

FIG. 4 is a diagram showing a flip chip mounting structure according to a second embodiment of the present invention;

FIG. 5 is a diagram showing a flip chip mounting structure according to a second embodiment of the present invention;

FIG. 6 is a diagram showing Embodiment 3 of a flip chip mounting structure according to the present invention.

FIG. 7 is a diagram showing a flip chip mounting structure according to a third embodiment of the present invention;

FIG. 8 is a diagram showing a fourth embodiment of a flip chip mounting structure according to the present invention;

FIG. 9 is a diagram showing a fourth embodiment of a flip chip mounting structure according to the present invention;

FIG. 10 is a view showing a fifth embodiment of a flip-chip mounting structure according to the present invention;

FIG. 11 is a view showing a fifth embodiment of a flip chip mounting structure according to the present invention;

FIG. 12 is a view showing a fifth embodiment of a flip chip mounting structure according to the present invention;

FIG. 13 is a view showing a flip-chip mounting structure according to a sixth embodiment of the present invention.

FIG. 14 is a diagram showing a conventional flip chip mounting structure.

FIG. 15 is a diagram showing a conventional flip chip mounting structure.

FIG. 16 is a diagram showing a conventional flip chip mounting structure.

[Explanation of symbols]

1 semiconductor bare chip, 2 electrodes, 3 metal bumps,
4, 11, 21, 23 flip chip, 5, 12, 18
Multilayer wiring board, 6 insulating layers, 7, 15 conductor pads,
Reference Signs List 8 wiring pattern, 9 bonding material, 10 hard metal bump, 13 first insulating layer, 14 second insulating layer, 16 vertical bump insertion hole, 17 cone type bump insertion hole, 19 first elastic insulating layer, 20 soft metal bump , 22 conductive coating bump, 24 elastic resin, 25 conductive coating, 26
Conductive elastic bump, 27 conductive filler.

Claims (7)

[Claims] 1. A flip chip in which a spherical or barrel-shaped bump is attached to an electrode pattern of a semiconductor bare chip, the flip chip is formed by laminating a plurality of resin insulating materials,
A multilayer wiring board having a conductor pad at a surface position corresponding to the position of the flip chip bump, wherein the conductor pad portion is provided with the conductor pad and at least the outermost layer on which the conductor pad is formed. An elliptical or rectangular hole that penetrates vertically through the material layer and has a length at least in the minor axis direction that is slightly smaller than the maximum diameter of the bump, and press-fits the bump into the hole to form the flip chip. Is mounted on the multilayer wiring board. 2. The flip chip mounting structure according to claim 1, wherein said bump is formed of a hard metal material. 3. A hole penetrating through the conductive pad and at least the resin insulating material layer located at the outermost layer on which the conductive pad is formed, has a conical or divergent shape extending from the conductive pad toward the insulating material layer. The flip chip mounting structure according to claim 1, wherein the flip chip mounting structure is provided in a pyramid shape. 4. The multilayer wiring board according to claim 1, wherein the resin insulating material layer located on the outermost layer where the conductive pads are formed is formed using an insulating material having high elasticity. 4. The mounting structure of the flip chip according to any one of 1 to 3. 5. The flip chip mounting structure according to claim 1, wherein said bumps are formed using a soft metal material. 6. The flip chip according to claim 1, wherein the bump is formed using an insulating material having high elasticity, and a conductive coating is applied to a surface of the bump. Mounting structure. 7. The flip chip mounting structure according to claim 1, wherein said bump is formed using a highly elastic insulating material kneaded with a conductive filler.