JP2000085283A - Noncontact ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noncontact IC card of a novel material constitution easy to provide an additional function such as printing a face photograph, embossing, forming magnetic stripes or the like by providing high heat resistance of a card base material and satisfactory retransferability. SOLUTION: The noncontact IC card comprises an IC chip 12 connecting an antenna coil 14 and embedded in a card base, a polycarbonate sheet 111 laminated on one surfaces of the chip 12 and the coil 14 via a mesh sheet 16 and an adhesive layer 18, a PET sheet 112 laminated on the other surface via a mesh sheet 15 and an adhesive layer 17, and integrated with a card base by heat fusion bonding. The method for manufacturing the noncontact IC card comprises the steps of laminating the card constituting materials, then introducing it into a hot press, and integrating them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card, and more particularly, to a method of printing a pattern on a card surface by thermal transfer printing.
Non-contact I that can easily provide various additional functions to the card
The present invention relates to a C card and a method for manufacturing the C card.

[0002]

2. Description of the Related Art At present, a non-contact IC card uses Mifa
There are many cards with "micron registered trademark" specifications on the market. The card has a structure in which a non-contact IC chip is embedded in a card base material, and is divided into a structure using a vinyl chloride base material and a structure using a nonwoven fabric and a PET (polyethylene terephthalate) base material.
FIG. 5 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a vinyl chloride base material. This card comprises a vinyl chloride sheet 211 serving as a center sheet and oversheets 212 and 2 made of vinyl chloride laminated on both sides thereof.
13. The IC chip 22 is embedded in the embedding hole of the center sheet. At this time, the connection terminal of the antenna coil or the winding antenna coil 24 formed on the center sheet by the printed wiring technique is
The connection is made such that the positions of the bumps 221 and 222 of the C chip 22 match. When laminating the center sheet and the oversheet, as shown in FIG. 5, hot pressing is performed using a heat-curable epoxy-based adhesive (or an adhesive sheet) 23 or the like.

FIG. 6 is a diagram showing a cross-sectional structure of a conventional non-contact IC card using a nonwoven fabric and a PET substrate.
In the case of this card, after connecting the IC chip 22 to the coiled antenna coil 24, non-woven fabrics 25 and 26 are applied to both surfaces thereof, and the outer surfaces of the non-woven fabrics 25 and 26 are further heat-cured epoxy adhesive (adhesive sheet). May be used.)
The laminated body sandwiching the PET sheets 271 and 272 through 23 is hot-pressed to be integrated into a card base. During hot pressing, the adhesive penetrates into the nonwoven fabric,
After cooling, an integrated card substrate is formed by the thermosetting adhesive.

The card base thus formed is provided with common information and pictures by a normal printing method.
A thermal transfer printer that transfers information and face photos of each card user,
In particular, it is individually provided by a sublimation type thermal transfer printer. FIG. 4 is a diagram illustrating a method of painting a card by a thermal transfer printer. FIG. 4A shows a direct printing method, in which a card 4 passing over a platen roller 45 is used.
When the thermal sublimation transfer ribbon 42 is brought into contact with 1 and the image corresponding portion is heated by the thermal head 43, the sublimable dye on the ribbon moves to the card base material to form an image.
If this operation is repeated for each color of cyan, magenta, yellow, and black, a color image is formed on the card.

FIG. 4B shows a retransfer printing method, in which a required image is temporarily transferred to an intermediate transfer medium 44 on a substrate wider than a card substrate and on which a releasable dye-receiving layer is formed.
The dye is transferred by the heat-sensitive sublimation transfer ribbon 42 to form an image. Thereafter, the intermediate transfer medium 44 having the image
The heating roller 46 and the pressure roller 4
7, the image of the dye receiving layer formed on the intermediate transfer medium 44 is retransferred to the card side.

In the case of the direct printing method, since it is difficult to transfer the image to the edge of the card, it is not possible to form a picture over the entire width of the card, and a margin is formed around the card. on the other hand,
In the retransfer printing method, a picture can be transferred to the full width of the card if the image on the intermediate transfer medium is made wide. In the case of the direct method, high card flatness is required, and the printable area is limited in the case of a non-contact IC card in which unevenness of the IC chip is likely to occur. In the case of the retransfer printing method, however, the card has some unevenness. However, since the pressure roller has a cushioning property, there is an advantage that a defect-free image can be formed on the entire surface of the card. However, the card substrate is required to have sufficient heat resistance since a temperature of 170 to 180 ° C. is applied during retransfer.

However, in the case of the above-mentioned vinyl chloride-based non-contact IC card, the vinyl chloride base material is thermally deformed by this heating, so that a sublimation type retransfer printer (for example, "CPX10000" manufactured by Dai Nippon Printing Co., Ltd.) Etc.),
When an image is printed, curling occurs. In addition, in a normal direct sublimation transfer printer (for example, “CP510” manufactured by Dai Nippon Printing Co., Ltd.), there is a problem that it is difficult to form an image in a wide area because inevitable irregularities occur in an IC chip portion. Further, when an additional function such as a thermal rewriting display section (thermal rewriting section) is provided, writing is similarly difficult if there are irregularities. Also, it is difficult to re-transfer characters and images on a conventional PET non-contact IC card surface using a sublimation re-transfer printer. It is difficult to form an image with a normal direct sublimation transfer printer due to the molecular orientation characteristics of the film. There are problems such as difficulty in providing an emboss, magnetic stripe, and hologram additional function.

[0008]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an excellent surface smoothness capable of accurately performing post-processing such as printing of individual information and a face photograph on a card surface by a thermal sublimation transfer printer, and retransfer of sublimation transfer. This is to realize a non-contact IC card capable of printing. In particular, the present invention is characterized in that a polycarbonate sheet having high heat resistance and capable of favorably performing retransfer printing is used for a card base material.

[0009]

SUMMARY OF THE INVENTION The first aspect of the present invention for solving the above-mentioned problems is that an antenna coil connected to an antenna is connected.
In a non-contact IC card having a C chip embedded in a card base, a mesh sheet and a polycarbonate sheet are laminated via an adhesive layer on one surface of the IC chip and the antenna coil, and a mesh sheet is laminated on the other surface. A non-contact IC card, wherein a PET sheet is laminated via an adhesive layer and is formed into an integrated card base by heat fusion. Since such a non-contact IC card is used, it is easy to provide a pattern by thermal sublimation transfer printing with high heat resistance, and it is easy to provide other additional functions.

A second aspect of the present invention for solving the above-mentioned problem is that an IC chip to which an antenna coil is connected, a first mesh sheet and an adhesive layer on a first surface of the antenna coil as a central layer. Laminating a polycarbonate sheet through the interposer, laminating a PET sheet on the second surface of the IC chip via a second mesh sheet and an adhesive layer, and introducing these laminates into a hot press to heat the laminate. A method of manufacturing a non-contact IC card, wherein the card base is integrated by the step of fusing. With this method of manufacturing a non-contact IC card, it is easy to provide a pattern by thermal sublimation transfer printing, and it is also possible to easily manufacture a non-contact IC card that easily provides additional functions.

A third aspect of the present invention to solve the above-mentioned problem is that an IC chip to which an antenna coil is connected, a step of mounting the antenna coil between a first mesh sheet and a second mesh sheet, Laminating a polycarbonate sheet on the first surface of the mesh sheet on which the chip and the antenna coil are mounted via an adhesive layer, and laminating a PET sheet on the second surface via the adhesive layer, a polycarbonate sheet or a PET sheet And a step of temporarily adhering the mesh sheet and a mesh sheet, a step of introducing these laminates into a hot press machine and performing heat fusion, and a method of manufacturing a non-contact IC card, wherein the card base is integrated. is there. With this method of manufacturing a non-contact IC card, it is easy to provide a pattern by thermal sublimation transfer printing, and it is also possible to easily manufacture a non-contact IC card that easily provides additional functions.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a novel non-contact IC card and a method for manufacturing the same, and more particularly, it is characterized in that a polycarbonate sheet is used on one side of an IC card base and a PET sheet is used on the other side. Hereinafter, embodiments of the present invention will be specifically described, but the present invention is not limited to the following embodiments.

FIG. 1 is a view showing a step of laminating a non-contact IC card according to the present invention. As shown in FIG. 1, the mesh sheet 1
An IC chip 12 having an antenna coil 14 connected thereto is interposed between the adhesive sheets 17 and 1 and adhesive sheets 17 and 1 are attached to both sides thereof.
After a polycarbonate sheet 111 is laminated on one side of the card and a PET sheet 112 is laminated on the other side of the card via the vial 8, the card is heated and fused. The antenna coil 14 is formed by winding a thin conductive wire of copper, aluminum, or the like several times around a card size, and is connected between the bumps 121 and 122 of the IC chip 12. It is preferable that the total thickness of the above-mentioned sheets before pressing is adjusted so as to be in the range of 0.68 to 0.84 mm so that the thickness after pressing becomes the reference thickness of 0.76 mm. On the outer surface of the polycarbonate sheet, as described later, to enhance the concealment of the thermal transfer image,
It is preferable to perform white concealment printing, and it is preferable to provide a metal deposition layer on the outer surface of the PET sheet in order to enhance the visibility of the thermal rewrite layer.

In this case, prior to the hot pressing, a step of lightly hot pressing the IC chip 12 connected to the antenna coil 14 between the first mesh sheet and the second mesh sheet and mounting the IC chip 12 is performed. Is also good. This is because when the mesh sheet is heat-meltable, heat is applied to dissolve it slightly to fix the IC chip between the sheets and stabilize it. Alternatively, a step of laminating a polycarbonate sheet or a PET sheet on one surface of the mesh sheet on which the IC chip and the antenna coil are mounted via an adhesive layer and temporarily attaching the polycarbonate sheet or the PET sheet may be performed.
In this method, an ultrasonic sealer or the like is pressed to apply heat in a spot manner and similarly fixed to any one of the sheets.
Since the IC chip 12 has a thickness of about 50 to 150 μm, it is absorbed in the thickness of the mesh sheet, which is an elastic body, before solidification, so that the unevenness of the card surface is reduced. In other words, the mesh sheet gives the card strength and also allows the adhesive to penetrate, so that the mesh sheet, polycarbonate, and PET sheet on both sides of the IC chip are integrated, and the surface of the IC sheet is absorbed by absorbing the irregularities of the IC chip and antenna coil. It has the effect of smoothing the shape.

FIG. 2 is a diagram showing a state of the non-contact IC card of the present invention after hot pressing. When the card base material laminated in the state shown in FIG. 1 is sandwiched between mirror plates and introduced into a press and heated and pressed under the same conditions as ordinary PVC cards, the adhesive sheets 17 and 18 are melted (partly). The polycarbonate substrate 111 and the PET sheet 112 on both sides sandwiching the IC chip 12 by penetrating into the mesh sheets 15 and 16 (in a state where they remain) are bonded via the mesh sheet to form a completely integrated card base. In addition, the PET sheet referred to in the present application refers to a sheet formed from a resin obtained by polymerizing ordinary terephthalic acid and ethylene glycol, and generally refers to a sheet which is stretched and has semi-crystalline characteristics.

FIG. 3 is a diagram showing a state in which an additional function is added to the non-contact IC card. The non-contact IC card of the present invention having the above-described base structure is suitable for providing various additional functions. For example, the non-contact IC card of the present invention comprising a PET sheet and a polycarbonate sheet has higher heat resistance than a vinyl chloride substrate card and does not deform even by retransfer printing. In particular, a polycarbonate sheet is suitable as a surface on which the dye receiving layer is retransferred by sublimation transfer, and a sublimation transfer image layer on the entire surface of the card can be provided by retransfer. When a retransferred image is provided in the case of using a transparent polycarbonate sheet, it is preferable to previously print a white ink in order to conceal the base as described above.

A technique has been established in which a reversibly rewritable display layer (thermal rewrite layer) 30 is provided on the PET sheet 112. Usually, the display layer variably displays a transparent or cloudy state based on the heat history, and therefore, in many cases, a printed or metal-deposited layer 31 is provided on the background for easy viewing of the display. Therefore, when the deposition layer is provided, P
After vapor deposition on the ET sheet surface, printing of the frame printing unit 32 forming the window of the display unit is performed, and then the thermal display layer is applied. This vapor deposition layer is provided in advance before hot pressing as described above. Alternatively, a material in which such a thermal rewrite portion is formed may be purchased and laminated on the card surface. As the rewrite method, a transparent / opaque type or a leuco type can be used. Usually, a protective layer for the display layer is further provided on the display layer for rewriting with a thermal head or the like.

Hereinafter, each of the materials used will be described. [Mesh sheet] The mesh sheet to be laid is made of a material having high shear strength and resilient flexibility and cushioning property when bent, or a card base and a rigid body when bent under predetermined conditions. It is preferable to be made of a material having sufficient elasticity to absorb the shearing stress concentrated at the boundary with the chip and diffuse the force. Particularly, a material having high shear strength, flexibility, and elasticity is preferably used. In addition, it is necessary to have an appropriate gap through which the molten resin penetrates. For example, it can be constituted by a mesh sheet made of a mesh sheet as described below, a nonwoven fabric, or the like.

(The material is nylon (nylon 6
6, nylon 6, nylon 11, nylon 610, nylon 4, nylon 7, nylon 9, nylon 12, etc.), polyester, acrylic, vinylon, rayon,
Polypropylene, polyvinylidene chloride, polyethylene,
Polyurethane, polystyrene, polyfluoroethylene (Teflon) synthetic fibers, acetate, triacetate, cellulose such as ethyl cellulose, chloride rubber,
Semi-synthetic fiber of hydrochloric acid rubber, natural fiber such as yarn, face, silk, etc., glass fiber or various plastic films with perforated sheets can be used.

(There are various production methods for sheets formed into a cloth without using a loom. For example, a wet nonwoven fabric in which fibers and paper are made by papermaking technology, and a chemical bond in which a fibrous web is bonded with an adhesive. Also, there are thermal bond dry non-woven fabric which is self-bonded by heat, spun bond which is self-bonded by direct spinning, etc. Fibers used for these are various natural or synthetic fibers like the above-mentioned mesh sheet. can do.

[Adhesive] Epoxy, urethane, acrylic, vinyl, amide and other known adhesives can be used. A coating type liquid adhesive may be used, but it is preferable to use an adhesive sheet which can omit the steps of viscosity adjustment and solvent drying, from the viewpoint of good workability and obtaining a uniform adhesive layer. The adhesive sheet preferably has a strong adhesive force easily obtained by hot pressing and does not protrude from the adhesive. Polyurethane-based or polyester-based hot-melt type adhesives can be used to obtain adhesiveness to polycarbonate or PET sheets.

[0022]

(Embodiment 1) An embodiment of the present invention will be described with reference to FIGS. IC chip 12 has a thickness of 120 μm
Use a copper wire of 45x for the antenna coil 14.
It was wound four times in a size of 75 mm and formed into a planar shape for use. The mesh sheets 15 and 16 were applied to both sides of the IC chip with the antenna coil connected thereto, and mounted by applying heat and pressure. PE / PE as mesh sheet
A 0.10 mm-thick nonwoven fabric made of a T-based material was used.

On one side of the nonwoven fabric 16 on which the IC chip is mounted, a hot-melt adhesive sheet 18 having a thickness of 0.05 mm is laminated, and a polycarbonate sheet (manufactured by Teijin Chemicals Limited) 111 having a thickness of 0.35 mm is formed. Were temporarily pasted. In the temporary bonding, the ultrasonic sealer was pressed from the nonwoven fabric surface to the polycarbonate sheet surface and heated to partially melt the base material and fix several places. Similarly, a PET sheet (“Lumirror”, manufactured by Toray Industries, Inc.) 112 having a thickness of 0.188 mm was laminated on the outer surface side of the nonwoven fabric 15 via an adhesive sheet 17 having a thickness of 0.05 mm. At this time, the total thickness of the laminated sheet was 0.838 mm. The surface of the polycarbonate sheet that is to be the outer surface of the card was previously subjected to white concealment printing.

Next, mirror plates were applied to both sides of the laminate, and the laminate was introduced into a press machine and heated at 140 ° C. and 25 kgf /
(cm ² , 15 minutes). After pressing,
The card has a smooth surface and the total thickness of the card base is 760.
μm. The number of card impositions on the card substrate is
The four-sided, four-row, 16-cutter was used, and thereafter punching was performed to separate the individual cards. The surface of the PET sheet was coated with a recording material ("TCF-BC650-ML" manufactured by Ricoh Co., Ltd.) comprising a vapor deposition layer, a rewritable display layer, and a protective layer to form a thermal rewritable display layer 30.
Sublimation type retransfer printer (“CPX1000” manufactured by Dai Nippon Printing Co., Ltd.)
0 "), a good sublimation transfer image layer could be provided due to the high heat resistance of the card.

The following test was performed on the non-contact IC card after the hot pressing. (1) Bending in the long side direction of the card Bending is performed 250 times at a rate of 30 cm per minute in the front and back directions at a deflection of 2 cm. (2) Bending in the short side direction of the card Bending is performed 250 times in the front and back directions at a rate of 30 cm per minute each with a deflection of 1 cm. As a result, the non-contact IC of this embodiment
In the card, the card base was not broken or cracked in the IC chip embedded portion or other portions, and there was no change in appearance.
In addition, communication with the external device was successfully performed without contact.

[0026]

As described above, the non-contact IC card of the present invention has high heat resistance, so that a face photograph can be printed by retransfer printing, and various functions such as a rewriting display section can be easily added. be able to. Since the non-contact IC card of the present invention having such characteristics can be provided with the additional functions described above, it can be used in various fields as a gate card and a point card such as a mileage card, or as a dedicated gate management card. It becomes possible. In the case of a point card, the record is displayed on the rewriting display section,
When used as a gate management card, an ID function can be provided by printing a face photograph for personal identification.

[Brief description of the drawings]

FIG. 1 is a view showing a lamination process of a non-contact IC card of the present invention.

FIG. 2 is a view showing a state after hot pressing of the non-contact IC card of the present invention.

FIG. 3 is a diagram showing a state in which an additional function is added to a non-contact IC card.

FIG. 4 is a diagram illustrating a method of painting a card by a thermal transfer printer.

FIG. 5: Conventional non-contact IC using a vinyl chloride substrate
FIG. 3 is a diagram illustrating a cross-sectional configuration of a card.

FIG. 6 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a nonwoven fabric and a PET substrate.

[Explanation of symbols]

 12 IC chip 14 Antenna coil 15, 16 Mesh sheet 17, 18 Adhesive sheet 22 IC chip 23 Adhesive 24 Antenna coil 25, 26 Nonwoven fabric 30 Display layer 31 Evaporation layer 32 Printing unit 41 Card 42 Sublimation transfer ribbon 43 Thermal head 44 Intermediate Transfer medium 45 Platen roller 46 Heating roller 47 Pressure roller 111 Polycarbonate sheet 112 PET sheet 121, 122 Bump of IC chip 221, 222 Bump of IC chip 271, 272 PET sheet

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) C08L 67/02 C08L 69/00 5B035 69/00 B41M 5/26 101 G06K 19/07 G06K 19/00 H 19 / 077 K F term (reference) 2C005 MA14 MA19 MB01 MB10 NA08 NA09 PA15 PA18 PA21 QB03 RA02 RA04 RA06 RA09 2H111 AA01 AA27 AA33 AB05 CA05 CA11 CA12 CA13 CA24 CA25 CA30 CA42 DA00 4F100 AB01A AK42E AK45C AR00A AT00BA00 AT00BA00 AT00BA00 AT00 BA00 AT00 AT00 AT00 AT00 AT00 DC16D DG07A EC03 EC032 EC18 EC181 EH66E EJ25 EJ251 GB41 HB00C JG00A JJ03 JK15 4J002 CF061 CG001 GF00 GQ00 4J029 AA03 AA09 AB07 AC01 AE03 AE18 BA03 CB06A JA303 5B035 AA09 BA03 CA03 BB08

Claims (5)

[Claims] In a non-contact IC card in which an IC chip connected to an antenna coil is embedded in a card base, a polycarbonate sheet is provided on one surface of the IC chip and the antenna coil via a mesh sheet and an adhesive layer. A non-contact IC card, wherein a non-contact IC card is laminated, and a PET sheet is laminated on the other surface via a mesh sheet and an adhesive layer. 2. The non-contact IC card according to claim 1, wherein a picture is provided on the outer surface of the polycarbonate sheet by a sublimation retransfer printer. 3. The non-contact IC card according to claim 1, wherein a thermal rewrite rewriting display section is provided on an outer surface of the PET sheet. 4. An IC chip to which an antenna coil is connected,
A step of laminating a polycarbonate sheet on a first surface of the antenna chip with an antenna coil as a central layer via a first mesh sheet and an adhesive layer;
A step of laminating a PET sheet via a mesh sheet and an adhesive layer, and a step of introducing these laminates into a hot press machine and heat-sealing them, thereby integrating a card base. A method for manufacturing an IC card. 5. An IC chip to which an antenna coil is connected,
Mounting the antenna coil between the first mesh sheet and the second mesh sheet; laminating a polycarbonate sheet via an adhesive layer on the first surface of the mesh sheet on which the IC chip and the antenna coil are mounted; A step of laminating a PET sheet on the second surface via an adhesive layer, a step of temporarily adhering a polycarbonate sheet or a PET sheet and a mesh sheet, and a step of introducing these laminates into a hot press and thermally fusing them. And a method for manufacturing a non-contact IC card, wherein the card base is integrated.